JP4343573B2 - Coating device and head cleaning method - Google Patents

Coating device and head cleaning method Download PDF

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JP4343573B2
JP4343573B2 JP2003106561A JP2003106561A JP4343573B2 JP 4343573 B2 JP4343573 B2 JP 4343573B2 JP 2003106561 A JP2003106561 A JP 2003106561A JP 2003106561 A JP2003106561 A JP 2003106561A JP 4343573 B2 JP4343573 B2 JP 4343573B2
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solution
nozzle
head
coating apparatus
substrate
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JP2004305988A (en
JP2004305988A5 (en
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昭宏 重山
雅彦 黒澤
慎二 梶原
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to KR1020040023401A priority patent/KR100658109B1/en
Priority to TW093109932A priority patent/TW200502049A/en
Priority to CNB2004100334850A priority patent/CN100421941C/en
Publication of JP2004305988A publication Critical patent/JP2004305988A/en
Publication of JP2004305988A5 publication Critical patent/JP2004305988A5/ja
Priority to KR1020060098073A priority patent/KR100925765B1/en
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
    • G02F1/133784—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by rubbing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133738—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers for homogeneous alignment

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Coating Apparatus (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Ink Jet (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、基板の表面に溶液を噴射塗布するインクジェット方式の塗布装置に係り、特にヘッドのノズル面に付着した溶液をクリーニングするヘッドのクリーニング方法に関する。
【０００２】
【従来の技術】
一般に、液晶表示装置の製造工程では、ガラス基板の表面に配向膜等の機能性薄膜が成膜される。従来、基板の表面に機能性薄膜を成膜する場合、その材料となる溶液（機能性薄膜を形成する溶液）をゴム製のロールを用いて基板の表面に塗布するロールコータ方式の塗布装置を用いていた。
【０００３】
しかしながら、ロールコータ方式の塗布装置は、溶液の使用効率が低く、高価な溶液を扱う場合に製造コストの点で大きな問題となっていた。
【０００４】
そこで、近年では、機能性薄膜を形成する溶液を基板の表面に噴射して塗布するインクジェット方式の塗布装置を用いることがある。
【０００５】
この塗布装置は、基板を搬送するテーブルを有しており、テーブルの上側には、複数のヘッドが基板の搬送方向に対して交差するように並設されている。各ヘッドの下面には、多数のノズルが並設されており、これらノズルからヘッドの下側を搬送される基板に向けて溶液が噴射される。
【０００６】
【発明が解決しようとする課題】
ところで、配向膜の材料として使用されるポリイミド溶液は、有機溶剤によって希釈されている。通常、この有機溶剤は揮発性を有しているため、溶液の塗布を行わない時間が一定時間続くと、溶液中のポリイミドの濃度が高まり、ノズル内、又はノズル面で固形化して下記▲１▼と▲２▼に示すような吐出不良を引き起こすことがある。
【０００７】
▲１▼各ノズルから吐出する溶液の吐出量に差が生じ、基板の表面全体に均一に溶液を塗布することができない。
【０００８】
▲２▼ノズルが完全に閉塞され、ノズルから溶液を吐出させることができない。
【０００９】
そこで、溶液の塗布が終了した後、ヘッドのノズル面に付着残留した溶液をシリコンゴム製のワイピング部材によりかき取る方法が用いられることがある。
【００１０】
しかしながら、ワイピング部材によって溶液をかき取った場合、ワイピング部材に付着した溶液が時間の経過によって固形化し、ノズル面に付着した溶液をうまくかき取れなくなることがある。
【００１１】
本発明は、上記事情を鑑みてなされたものであって、その第１の目的とするところは、基板の表面に均一な厚さの機能性薄膜を形成できるインクジェット方式の塗布装置を提供すること、第２の目的とするところは、ワイピング部材のかき取り作用が低下するのを防止できるヘッドのクリーニング方法を提供することにある。
【００１２】
【課題を解決するための手段】
上記課題を解決し目的を達成するために、本発明の塗布装置およびヘッドのクリーニング方法は次のように構成されている。
【００１３】
（１）ノズルを用いて基板の表面に溶液を噴射塗布する塗布装置において、上記ノズルが形成されたノズル面を有するヘッドと、上記溶液の非塗布時に、上記ヘッドのノズル面に対向して配置され、上記ノズルから流下する溶液を受けて上記ノズル面との間に上記溶液を満たす上面を有する対向板とを具備することを特徴とする。
【００１４】
（２）（１）に記載された塗布装置であって、上記ノズル面と対向板の間に溜められた溶液に向けて不活性ガスを噴射するためのガス噴射ノズルを備えたことを特徴とする。
【００１５】
（３）（１）または（２）に記載された塗布装置であって、上記対向板の上面には、上記ノズルから流下した溶液を案内するための案内溝が形成されていることを特徴とする。
【００１８】
【発明の実施の形態】
以下、図１〜図６を参照しながら本発明の第１の実施の形態を説明する。
【００１９】
図１は本発明の第１の実施の形態に係る塗布装置の配管を示す配管系統図、図２は同実施の形態に係る塗布装置の構成を配管を省略して示す正面図である。
【００２０】
図１と図２に示すように、本発明の塗布装置はベース１を有する。ベース１の上面には所定間隔で離間した一対のレール２がベース１の長手方向に沿って設けられている。レール２にはテーブル３が移動可能に設けられ、駆動源（不図示）により走行駆動されるようになっている。テーブル３の上面には多数の支持ピン４が設けられ、これら支持ピン４には液晶表示装置等に用いられるガラス製の基板Ｗが供給支持される。
【００２１】
上記テーブル３によって搬送される基板Ｗの上側には、カラーレジストや配向膜等の機能性薄膜を形成するための溶液を基板Ｗに噴射塗布する複数、この実施の形態では３つのヘッド７が基板Ｗの搬送方向とほぼ直交する方向に沿って千鳥状に配設されている。
【００２２】
図３は同実施の形態に係るヘッド７の構成を示す断面図、図４は同実施の形態に係るヘッド７の構成を示す下面図である。
【００２３】
図３と図４に示すように、ヘッド７はヘッド本体８を有する。ヘッド本体８は筒状体からなり、その下面開口は可撓板９によって閉塞されている。この可撓板９は、さらにノズルプレート１１で覆われており、ノズルプレート１１と可撓板９との間には液室１２が形成されている。
【００２４】
ヘッド本体８の一端部には、液室１２に連通する供液孔１３が形成されている。この供液孔１３からは、配向膜やカラーレジスト等の機能性薄膜を形成する溶液が、液室１２内が充満するまで供給される。
【００２５】
ノズルプレート１１の幅方向の中心部には、多数のノズル１４が基板Ｗの搬送方向とほぼ直交する方向に沿って千鳥状に穿設されている。可撓板９の上面には、各ノズル１４と対向するように多数の圧電振動子１５がそれぞれ固定されている。
【００２６】
これら圧電振動子１５は、ヘッド本体８内の駆動部１６に接続されており、この駆動部１６から駆動電圧が印加されることによって、可撓板９を振動させてノズル１４から溶液を噴射させる。
【００２７】
ヘッド本体８の他端部には、液室１２に連通する回収孔１７が形成されている。供液孔１３から液室１２に供給された溶液は、この回収孔１７から回収される。
【００２８】
図１に示すように、各ヘッド７の供液孔１３（図３にのみ図示）には、溶液供給管２１の先端部から分岐した供給分岐管２２がそれぞれ接続されている。また、各ヘッド７の回収孔１７には、溶液回収管２３の先端部から分岐した回収分岐管２４が接続されている。そして、供給分岐管２２には供給開閉弁２５が設けられ、回収分岐管２４には回収開閉弁２６が設けられている。
【００２９】
溶液供給管２１の先端と溶液回収管２３の先端は、連通弁２７を介して接続されている。また、溶液回収管２３は、回収分岐管２４の基端側に主回収弁２８を備えている。
【００３０】
溶液供給管２１の基端は、溶液が貯えられた溶液タンク３１の底部に接続されている。また、溶液回収管２３の基端は、溶液タンク３１に供給する溶液を貯蔵した貯蔵タンク３２に接続されている。
【００３１】
溶液回収管２３の基端部から分岐した分岐溶液供給管３４は、供給弁３３を介して溶液タンク３１の底部に接続されている。溶液タンク３１の上部には、第１の開閉制御弁３６を備えた大気開放管３５が接続されている。
【００３２】
第１の開閉制御弁３６を開放すると、溶液タンク３１内が大気に連通される。なお、大気開放管３５は、この大気開放管３５から大気に放散される気体に含まれる気化溶媒を処理するための処理装置（不図示）が接続されている。
【００３３】
溶液タンク３１の上部には、第２の開閉制御弁３７を備えたガス供給管３８が接続されている。そして、このガス供給管３８を介して、ガス供給源（不図示）から溶液タンク３１内に窒素等の不活性ガスが供給される。
【００３４】
ガス供給管３８には、第２の開閉制御弁３７の上流側にフィルタ３９と第３の開閉制御弁４０とが順に接続されている。第３の開閉制御弁４０には溶液タンク３１内に微量の不活性ガスを供給するための流量絞り弁４１が並列に設けられている。
【００３５】
貯蔵タンク３２の上部には、第４の開閉制御弁４３を備えた大気開放管４４と、第５の開放制御弁４５を備えたガス供給管４６が接続されている。このガス供給管４６にはフィルタ４７及び第６の開閉制御弁４８が順に接続されている。第６の開閉制御弁４８には流量絞り弁４９が並列に設けられている。
【００３６】
上記供給開閉弁２５、回収開閉弁２６、主回収弁２８、供給弁３３、第１〜第６の開閉制御弁３６、３７、４０、４３、４５、４８は、制御装置（不図示）によって開閉制御されるようになっている。
【００３７】
さらに、溶液タンク３１内の溶液の液面は、レベルセンサ５０によって検出される。溶液の液面が所定の液面レベル以下になったことがレベルセンサ５０によって検出されると、その検出に基づいて貯蔵タンク３２から溶液タンク３１に溶液が補給される。つまり、貯蔵タンク３２内の溶液が第５の開閉制御弁４５を通じて供給される不活性ガスによって加圧されることで、溶液タンク３１に溶液が補給される。
【００３８】
図２に示すように、テーブル３の一端面には側面形状がＬ字状の取付部材５１が垂直な一辺を上記テーブル３の端面に固定して設けられている。取付部材５１の水平な他辺には、上下シリンダ５２が軸線を垂直にして設けられている。
【００３９】
上下シリンダ５２のロッドには載置板５４が取り付けられている。この載置板５４の上面には、３つの対向板５５が部材５６を介して固定されている。各対向板５５は、ヘッド７のノズル面５７とほぼ同じ寸法の板材からなり、その上面には、図５に示すように、ノズル１４から流下する溶液を案内するための案内溝５８が形成されている。
【００４０】
上記載置板５４は回収槽６１の内底部に設けられている。この回収槽６１の一側にはガイド板６２が設けられ、このガイド板６２にはガイド部材６３が設けられている。このガイド部材６３はテーブル３の端面に上下方向に沿って設けられたガイドレール６４にガイドされて上下動する。
【００４１】
それによって、上下シリンダ５２が駆動されれば、載置板５４が駆動されるとともに、ガイド板６２がガイドレール６４に沿って上下動するから、載置板５４が前後方向に振れるのが規制されて上下動する。
【００４２】
上記回収槽６１には図１に示す回収タンク６５が接続されている。この回収タンク６５は、ノズル１４から回収槽６１に流下した溶液を回収する。
【００４３】
対向板５５の近傍には、載置板５４と共に上下駆動される複数のガス噴射ノズル５９が配置されている。このガス噴射ノズル５９は、対向板５５が上昇したときに、ヘッド７と対向板５５の間の部分にＮ２等の不活性ガスを噴射する。
【００４４】
次に、上記構成の塗布装置の作用について説明する。
【００４５】
テーブル３の上面に載置された基板Ｗは、テーブル３と共に所定の方向に搬送される。そして、搬送される基板Ｗがヘッド７の下側に到達すると、圧電振動子１５に駆動電圧が印加され、圧電振動子１５の伸縮によって可撓板９を振動させる。
【００４６】
それによって、液室１２内の溶液が加圧されて、ノズル１４から基板Ｗに向けて溶液が噴射される。そして、基板Ｗがヘッド７の下側を通過し、基板Ｗの表面全体に溶液を噴射塗布したら、圧電振動子１５およびテーブル３の駆動を停止する。
【００４７】
次に、上下シリンダ５２によって対向板５５を上昇させ、対向板５５の上面とヘッド７のノズル面５７との間の距離を予め設定された値に設定する。そして、溶液タンク３１内を大気圧に対して０．０１［ＭＰａ］程度陽圧に保つことで、ノズル１４から溶液を吐出させる。
【００４８】
ノズル１４から吐出した溶液は、対向板５５の上面に流下し、いずれノズル面５７と対向板５５の間を満たす。ノズル面５７と対向板５５の間を満たす溶液は、対向板５５の上面に形成された案内溝５８によって案内され、対向板５５の周辺部から回収槽６１内に流下する。
【００４９】
これによって、ヘッド１４のノズル面５７は、ノズル面５７と対向板５５の間を満たす溶液によって濡れた状態が維持される。
【００５０】
すなわち、溶液の塗布を行っていない時においても、ノズル面５７の表面を常に濡れた状態に維持することができるから、溶液が固形化してノズル１４の内部やノズル面５７にこびり付くのを防止することができる。
【００５１】
したがって、各ノズル１４が常に等量の溶液を噴射するから、基板Ｗの表面に均一な厚さの機能性薄膜を形成することができる。
【００５２】
また、溶液の塗布を行っていない時には、ノズル面５７と対向板５５の間を満たす溶液に向けて、ガス噴射ノズル５９からＮ２等の不活性ガスが噴射される。
【００５３】
これによって、ノズル面５７と対向板５５の間の溶液が空気に接触するのが防止され、溶液の酸化や空気中の水分の吸収が抑制されるから、溶液が固形化するのを抑制できる。
【００５４】
なお、本実施の形態では、対向板５５をヘッド７のノズル面５７に対向して配置し、ノズル１４から流下する溶液をこのノズル面５７と対向板５５の間に溜めることで、ノズル面５７の表面を常に濡れた状態に維持している。
【００５５】
しかしながら、本発明はこれに限定されることはない。すなわち、対向板５５を用いなくても、溶液タンク３１内の圧力を調整することで、供給分岐管２２から液室１２に溶液を供給しながら、液室１２内の溶液を回収分岐管２４から回収するようにしてもよい。
【００５６】
このように液室１２内に溶液を循環させると、液室１２内の溶液がノズル面５７の表面側に僅かに流れ出し、図６に示すように、表面張力によってノズル面５７の表面で停留する。
【００５７】
そのため、溶液の塗布を行っていないときにおいても、ノズル面５７を常に濡れた状態に維持することができるから、溶液が固形化してノズル１４の内部、或いはノズル面５７にこびり付くのを防止することができる。
【００５８】
次に、図７と図８を参照しながら本発明の第２の実施の形態を説明する。なお、ここでは、第１の実施の形態と同じ構成に対しては同じ符号を付し、その説明を省略する。
【００５９】
図７は本発明の第２の実施の形態に係る塗布装置の構成を配管を省略して示す正面図である。
【００６０】
図７に示すように、本実施の形態では、載置板５４の上面に対向板５５の代わりにシリコンゴム等の弾性材製の３つのワイピング部材７１が設けられている。各ワイピング部材７１は、ヘッド７に対応する長さのブレード状をしており、その下端部は保持部材７４によって保持されている。
【００６１】
そのため、図８に示すように、基板Ｗに溶液を塗布する際に、ワイピング部材７１をヘッド７のノズル面５７に接触する高さに設定しておくことで、基板Ｗがヘッド７の下側を往復するときにノズル面５７に付着残留する溶液をかき取ることができる。
【００６２】
ワイピング部材７１によってかき取られた溶液は、ワイピング部材７１の表面をつたって回収槽６１内に流下し、回収タンク６５によって回収される。
【００６３】
ワイピング部材７１の両側には、複数の洗浄ノズル７２が配設されている。各洗浄ノズル７２は、ワイピング部材７１に向けてＮＭＰやγブチロラクトン等の溶剤を噴射し、ワイピング部材７１の表面に付着した溶液を洗い流す。そして、洗い流された溶液の一部は、上記回収槽６１内に流下し、排出管（不図示）から廃棄される。
【００６４】
このようにワイピング部材７１に付着した溶液に溶剤を噴射することで、この溶液がワイピング部材７１の表面で固形化する前に除去することができるから、ワイピング部材７１の表面を常にクリーンに保つことができる。
【００６５】
そのため、次にヘッド７のノズル面５７に付着残留する溶液をかき取る際に、ノズル面５７に付着残留した溶液を確実に除去することができる。
【００６６】
なお、本実施の形態では、ワイピング部材７１に付着した溶液を洗浄ノズル７２から噴射される溶剤によって洗い流しているが、本発明はこれに限定されるものではない。
【００６７】
すなわち、本実施の形態の変形例として、ワイピング部材７１の下側に上記溶剤を貯えた洗浄槽７３を配置し、溶液が付着したワイピング部材７１を上記洗浄槽７３内の溶剤に浸漬するようにしてもよい。この場合の塗布装置の構成を図９と図１０に示す。
【００６８】
図９と図１０に示すように、取付部材５１の上面には、上記溶剤を貯えた上述の洗浄槽７３が設けられている。洗浄槽７３の両側には、それぞれ案内レール７５がほぼ垂直に立設されており、ワイピング部材７１が固定されたアーム７６を上下方向に移動可能、かつ軸心線周りに回転可能に支持している。
【００６９】
アーム７６は、上下シリンダ（不図示）と駆動モータ（不図示）を有しており、上下シリンダを駆動すると、各ワイピング部材７１が上下に移動し、駆動モータを駆動すると、ワイピング部材７１がアーム７６の軸心線周りに回転するようになっている。
【００７０】
ヘッド７のノズル面５７に付着残留した溶液をかき取ることにより、ワイピング部材７１に溶液が付着したら、上記駆動モータによって上を向いていたワイピング部材７１を下に向け、上記上下シリンダによってワイピング部材７１を保持部材７４ごと下側に配置された洗浄槽７３内の溶剤に浸漬する。
【００７１】
これによって、ワイピング部材７１に付着した溶液が固形化する前に洗い流すことができるから、ワイピング部材７１の表面を常にクリーンに保つことができる。そのため、次にヘッド７のノズル面５７に付着残留する溶液をかき取る際に、ノズル面５７に付着残留した溶液を確実に除去することができる。
【００７２】
なお、本発明は、上記実施の形態そのままに限定されるものではなく、実施の段階ではその要旨を逸脱しない範囲で構成要素を変形して具体化できる。また、上記実施の形態に開示されている複数の構成要素の適宜な組み合わせにより種々の発明を形成できる。例えば、実施形態に示される全構成要素から幾つかの構成要素を削除してもよい。
【００７３】
【発明の効果】
本発明によれば、基板の表面に均一な厚さの機能性薄膜を形成することができる。また、ワイピング部材のかき取り作用が低下するのを防止することができる。
【図面の簡単な説明】
【図１】 本発明の第１の実施の形態に係る塗布装置の配管を示す配管系統図。
【図２】 同実施の形態に係る塗布装置の構成を配管を省略して示す正面図。
【図３】 同実施の形態に係るヘッドの構成を示す断面図。
【図４】 同実施の形態に係るヘッドの構成を示す下面図。
【図５】 同実施の形態に係る対向板の上面に形成された案内溝の形状を示す概略図。
【図６】 同実施の形態に係るヘッドのノズル面で停留する溶液を示す概略図。
【図７】 本発明の第２の実施の形態に係る塗布装置の構成を配管を省略して示す正面図。
【図８】 同実施の形態に係るヘッドのノズル面に付着残留する溶液をかき取る様子を示す概略図。
【図９】 同実施の形態の変形例に係る塗布装置の構成を配管を省略して示す正面図。
【図１０】 同実施の形態の変形例に係る塗布装置の構成を配管を省略して示す側面図。
【符号の説明】
７…ヘッド、１４…ノズル、５５…対向板、５９…ガス噴射ノズル、７１…ワイピング部材、７３…洗浄槽、Ｗ…基板。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an ink jet type coating apparatus that sprays and coats a solution onto a surface of a substrate, and more particularly to a head cleaning method for cleaning a solution adhering to a nozzle surface of a head.
[0002]
[Prior art]
In general, in a manufacturing process of a liquid crystal display device, a functional thin film such as an alignment film is formed on the surface of a glass substrate. Conventionally, when a functional thin film is formed on the surface of a substrate, a roll coater type coating apparatus that applies a solution (solution for forming a functional thin film) as a material to the surface of the substrate using a rubber roll. I used it.
[0003]
However, the roll coater type coating apparatus has a low use efficiency of the solution, and has been a big problem in terms of manufacturing cost when handling an expensive solution.
[0004]
Therefore, in recent years, an ink jet type coating apparatus that sprays and applies a solution for forming a functional thin film onto the surface of a substrate may be used.
[0005]
This coating apparatus has a table for transporting a substrate, and a plurality of heads are arranged in parallel on the upper side of the table so as to intersect the transport direction of the substrate. A large number of nozzles are arranged in parallel on the lower surface of each head, and a solution is ejected from these nozzles toward a substrate conveyed under the head.
[0006]
[Problems to be solved by the invention]
By the way, the polyimide solution used as the material of the alignment film is diluted with an organic solvent. Since this organic solvent is usually volatile, if the time during which the solution is not applied continues for a certain period of time, the concentration of the polyimide in the solution increases and solidifies in the nozzle or on the nozzle surface, and the following (1) There is a possibility of causing a discharge failure as shown in (2) and (2).
[0007]
(1) A difference occurs in the discharge amount of the solution discharged from each nozzle, and the solution cannot be uniformly applied to the entire surface of the substrate.
[0008]
(2) The nozzle is completely blocked and the solution cannot be discharged from the nozzle.
[0009]
Therefore, after the application of the solution is completed, a method of scraping the solution remaining on the nozzle surface of the head with a silicon rubber wiping member may be used.
[0010]
However, when the solution is scraped off by the wiping member, the solution adhering to the wiping member may solidify over time, and the solution adhering to the nozzle surface may not be scraped off successfully.
[0011]
The present invention has been made in view of the above circumstances, and a first object of the present invention is to provide an ink jet type coating apparatus capable of forming a functional thin film having a uniform thickness on the surface of a substrate. The second object is to provide a head cleaning method that can prevent the scraping action of the wiping member from being lowered.
[0012]
[Means for Solving the Problems]
In order to solve the above problems and achieve the object, the coating apparatus and the head cleaning method of the present invention are configured as follows.
[0013]
(1) In a coating apparatus for spraying and applying a solution to the surface of a substrate using a nozzle, a head having a nozzle surface on which the nozzle is formed and a nozzle surface of the head that is disposed when the solution is not applied And a counter plate having an upper surface that receives the solution flowing down from the nozzle and fills the solution with the nozzle surface.
[0014]
(2) The coating apparatus according to (1), further comprising a gas injection nozzle for injecting an inert gas toward the solution stored between the nozzle surface and the opposing plate.
[0015]
(3) The coating apparatus according to (1) or (2), wherein a guide groove for guiding the solution flowing down from the nozzle is formed on the upper surface of the counter plate. To do.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
[0019]
FIG. 1 is a piping system diagram showing piping of a coating apparatus according to the first embodiment of the present invention, and FIG. 2 is a front view showing the configuration of the coating apparatus according to the embodiment with piping omitted.
[0020]
As shown in FIGS. 1 and 2, the coating apparatus of the present invention has a base 1. A pair of rails 2 spaced apart from each other at a predetermined interval are provided on the upper surface of the base 1 along the longitudinal direction of the base 1. A table 3 is movably provided on the rail 2 and is driven to travel by a drive source (not shown). A large number of support pins 4 are provided on the upper surface of the table 3, and a glass substrate W used for a liquid crystal display device or the like is supplied and supported on these support pins 4.
[0021]
On the upper side of the substrate W transported by the table 3, a plurality of solutions for forming a functional thin film such as a color resist or an alignment film are spray-coated on the substrate W. In this embodiment, three heads 7 are substrates. It is arranged in a zigzag pattern along a direction substantially perpendicular to the conveyance direction of W.
[0022]
3 is a cross-sectional view showing the configuration of the head 7 according to the embodiment, and FIG. 4 is a bottom view showing the configuration of the head 7 according to the embodiment.
[0023]
As shown in FIGS. 3 and 4, the head 7 has a head body 8. The head body 8 is formed of a cylindrical body, and the lower surface opening is closed by a flexible plate 9. The flexible plate 9 is further covered with a nozzle plate 11, and a liquid chamber 12 is formed between the nozzle plate 11 and the flexible plate 9.
[0024]
A liquid supply hole 13 communicating with the liquid chamber 12 is formed at one end of the head body 8. From the liquid supply hole 13, a solution for forming a functional thin film such as an alignment film or a color resist is supplied until the liquid chamber 12 is filled.
[0025]
At the center in the width direction of the nozzle plate 11, a large number of nozzles 14 are formed in a staggered pattern along a direction substantially perpendicular to the transport direction of the substrate W. A large number of piezoelectric vibrators 15 are fixed on the upper surface of the flexible plate 9 so as to face each nozzle 14.
[0026]
These piezoelectric vibrators 15 are connected to a drive unit 16 in the head body 8, and when a drive voltage is applied from the drive unit 16, the flexible plate 9 is vibrated to inject a solution from the nozzle 14. .
[0027]
A recovery hole 17 communicating with the liquid chamber 12 is formed at the other end of the head body 8. The solution supplied from the liquid supply hole 13 to the liquid chamber 12 is recovered from the recovery hole 17.
[0028]
As shown in FIG. 1, a supply branch pipe 22 branched from the tip of the solution supply pipe 21 is connected to the liquid supply hole 13 (shown only in FIG. 3) of each head 7. Further, a recovery branch pipe 24 branched from the tip of the solution recovery pipe 23 is connected to the recovery hole 17 of each head 7. The supply branch pipe 22 is provided with a supply on / off valve 25, and the recovery branch pipe 24 is provided with a recovery on / off valve 26.
[0029]
The tip of the solution supply pipe 21 and the tip of the solution recovery pipe 23 are connected via a communication valve 27. The solution recovery pipe 23 includes a main recovery valve 28 on the proximal end side of the recovery branch pipe 24.
[0030]
The base end of the solution supply pipe 21 is connected to the bottom of the solution tank 31 in which the solution is stored. The proximal end of the solution recovery pipe 23 is connected to a storage tank 32 that stores a solution to be supplied to the solution tank 31.
[0031]
A branched solution supply pipe 34 branched from the base end of the solution recovery pipe 23 is connected to the bottom of the solution tank 31 through a supply valve 33. Connected to the upper part of the solution tank 31 is an air release pipe 35 having a first opening / closing control valve 36.
[0032]
When the first opening / closing control valve 36 is opened, the inside of the solution tank 31 is communicated with the atmosphere. The atmosphere opening pipe 35 is connected to a processing device (not shown) for processing the vaporized solvent contained in the gas released from the atmosphere opening pipe 35 to the atmosphere.
[0033]
A gas supply pipe 38 having a second opening / closing control valve 37 is connected to the upper part of the solution tank 31. Then, an inert gas such as nitrogen is supplied into the solution tank 31 from a gas supply source (not shown) via the gas supply pipe 38.
[0034]
A filter 39 and a third opening / closing control valve 40 are sequentially connected to the gas supply pipe 38 upstream of the second opening / closing control valve 37. The third open / close control valve 40 is provided in parallel with a flow restrictor 41 for supplying a small amount of inert gas into the solution tank 31.
[0035]
Connected to the upper part of the storage tank 32 are an air release pipe 44 having a fourth open / close control valve 43 and a gas supply pipe 46 having a fifth open control valve 45. A filter 47 and a sixth open / close control valve 48 are sequentially connected to the gas supply pipe 46. The sixth open / close control valve 48 is provided with a flow restrictor 49 in parallel.
[0036]
The supply on / off valve 25, the recovery on / off valve 26, the main recovery valve 28, the supply valve 33, and the first to sixth on / off control valves 36, 37, 40, 43, 45 and 48 are opened and closed by a control device (not shown). To be controlled.
[0037]
Further, the level of the solution in the solution tank 31 is detected by the level sensor 50. When the level sensor 50 detects that the liquid level of the solution has become equal to or lower than a predetermined liquid level, the solution is supplied from the storage tank 32 to the solution tank 31 based on the detection. That is, the solution is supplied to the solution tank 31 by pressurizing the solution in the storage tank 32 with the inert gas supplied through the fifth open / close control valve 45.
[0038]
As shown in FIG. 2, one end surface of the table 3 is provided with an attachment member 51 having an L-shaped side surface with a vertical side fixed to the end surface of the table 3. On the other horizontal side of the mounting member 51, an upper and lower cylinder 52 is provided with the axis line vertical.
[0039]
A mounting plate 54 is attached to the rod of the upper and lower cylinders 52. Three opposing plates 55 are fixed to the upper surface of the mounting plate 54 via members 56. Each counter plate 55 is made of a plate material having substantially the same dimensions as the nozzle surface 57 of the head 7, and a guide groove 58 for guiding the solution flowing down from the nozzle 14 is formed on the upper surface thereof as shown in FIG. 5. ing.
[0040]
The placement plate 54 is provided on the inner bottom of the collection tank 61. A guide plate 62 is provided on one side of the collection tank 61, and a guide member 63 is provided on the guide plate 62. The guide member 63 moves up and down while being guided by a guide rail 64 provided on the end surface of the table 3 along the vertical direction.
[0041]
Accordingly, when the upper and lower cylinders 52 are driven, the mounting plate 54 is driven and the guide plate 62 moves up and down along the guide rails 64, so that the mounting plate 54 is prevented from swinging in the front-rear direction. Move up and down.
[0042]
A collection tank 65 shown in FIG. 1 is connected to the collection tank 61. The collection tank 65 collects the solution that has flowed down from the nozzle 14 to the collection tank 61.
[0043]
In the vicinity of the counter plate 55, a plurality of gas injection nozzles 59 that are driven up and down together with the mounting plate 54 are arranged. The gas injection nozzle 59 injects an inert gas such as N 2 into the portion between the head 7 and the counter plate 55 when the counter plate 55 rises.
[0044]
Next, the operation of the coating apparatus having the above configuration will be described.
[0045]
The substrate W placed on the upper surface of the table 3 is transported in a predetermined direction together with the table 3. When the substrate W to be conveyed reaches the lower side of the head 7, a driving voltage is applied to the piezoelectric vibrator 15, and the flexible plate 9 is vibrated by expansion and contraction of the piezoelectric vibrator 15.
[0046]
Thereby, the solution in the liquid chamber 12 is pressurized, and the solution is ejected from the nozzle 14 toward the substrate W. When the substrate W passes under the head 7 and the solution is sprayed and applied to the entire surface of the substrate W, the driving of the piezoelectric vibrator 15 and the table 3 is stopped.
[0047]
Next, the counter plate 55 is raised by the upper and lower cylinders 52, and the distance between the upper surface of the counter plate 55 and the nozzle surface 57 of the head 7 is set to a preset value. The solution is discharged from the nozzle 14 by keeping the inside of the solution tank 31 at a positive pressure of about 0.01 [MPa] with respect to the atmospheric pressure.
[0048]
The solution discharged from the nozzle 14 flows down to the upper surface of the counter plate 55 and eventually fills the space between the nozzle surface 57 and the counter plate 55. The solution filling the space between the nozzle surface 57 and the counter plate 55 is guided by the guide groove 58 formed on the upper surface of the counter plate 55 and flows down into the collection tank 61 from the peripheral portion of the counter plate 55.
[0049]
As a result, the nozzle surface 57 of the head 14 is kept wet by the solution filling the space between the nozzle surface 57 and the counter plate 55.
[0050]
That is, even when the solution is not applied, the surface of the nozzle surface 57 can always be kept wet, so that the solution is solidified and sticks to the inside of the nozzle 14 or the nozzle surface 57. Can be prevented.
[0051]
Therefore, since each nozzle 14 always ejects an equal amount of solution, a functional thin film having a uniform thickness can be formed on the surface of the substrate W.
[0052]
Further, when the solution is not applied, an inert gas such as N 2 is injected from the gas injection nozzle 59 toward the solution filling the space between the nozzle surface 57 and the counter plate 55.
[0053]
Accordingly, the solution between the nozzle surface 57 and the counter plate 55 is prevented from coming into contact with air, and oxidation of the solution and absorption of moisture in the air are suppressed, so that the solution can be prevented from solidifying.
[0054]
In the present embodiment, the counter plate 55 is disposed so as to face the nozzle surface 57 of the head 7, and the solution flowing down from the nozzle 14 is accumulated between the nozzle surface 57 and the counter plate 55, whereby the nozzle surface 57. Always keep the surface of the product wet.
[0055]
However, the present invention is not limited to this. In other words, the solution in the liquid chamber 12 can be supplied from the recovery branch pipe 24 while the solution is supplied from the supply branch pipe 22 to the liquid chamber 12 by adjusting the pressure in the solution tank 31 without using the counter plate 55. You may make it collect | recover.
[0056]
When the solution is circulated in the liquid chamber 12 as described above, the solution in the liquid chamber 12 slightly flows out to the surface side of the nozzle surface 57 and is retained on the surface of the nozzle surface 57 by the surface tension as shown in FIG. .
[0057]
Therefore, even when the solution is not applied, the nozzle surface 57 can always be kept wet, so that the solution is prevented from solidifying and sticking to the inside of the nozzle 14 or the nozzle surface 57. can do.
[0058]
Next, a second embodiment of the present invention will be described with reference to FIGS. Here, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0059]
FIG. 7 is a front view showing the configuration of the coating apparatus according to the second embodiment of the present invention with piping omitted.
[0060]
As shown in FIG. 7, in this embodiment, three wiping members 71 made of an elastic material such as silicon rubber are provided on the upper surface of the mounting plate 54 instead of the counter plate 55. Each wiping member 71 has a blade shape corresponding to the length of the head 7, and a lower end portion thereof is held by a holding member 74.
[0061]
Therefore, as shown in FIG. 8, when the solution is applied to the substrate W, the substrate W is placed on the lower side of the head 7 by setting the wiping member 71 to a height that contacts the nozzle surface 57 of the head 7. The solution remaining on the nozzle surface 57 can be scraped off when reciprocating.
[0062]
The solution scraped off by the wiping member 71 flows down into the collection tank 61 through the surface of the wiping member 71 and is collected by the collection tank 65.
[0063]
A plurality of cleaning nozzles 72 are disposed on both sides of the wiping member 71. Each cleaning nozzle 72 sprays a solvent such as NMP or γ-butyrolactone toward the wiping member 71 to wash away the solution adhering to the surface of the wiping member 71. A part of the washed solution flows down into the recovery tank 61 and is discarded from a discharge pipe (not shown).
[0064]
By spraying the solvent onto the solution adhering to the wiping member 71 in this way, this solution can be removed before solidifying on the surface of the wiping member 71, so that the surface of the wiping member 71 is always kept clean. Can do.
[0065]
Therefore, when the solution remaining on the nozzle surface 57 of the head 7 is scraped off, the solution remaining on the nozzle surface 57 can be reliably removed.
[0066]
In the present embodiment, the solution adhering to the wiping member 71 is washed away by the solvent sprayed from the washing nozzle 72, but the present invention is not limited to this.
[0067]
That is, as a modification of the present embodiment, a cleaning tank 73 storing the solvent is disposed below the wiping member 71, and the wiping member 71 to which the solution is attached is immersed in the solvent in the cleaning tank 73. May be. The configuration of the coating apparatus in this case is shown in FIGS.
[0068]
As shown in FIGS. 9 and 10, the above-described cleaning tank 73 storing the solvent is provided on the upper surface of the attachment member 51. On both sides of the cleaning tank 73, guide rails 75 are erected almost vertically, and an arm 76 to which the wiping member 71 is fixed is supported so as to be movable in the vertical direction and to be rotatable around the axis. Yes.
[0069]
The arm 76 includes an upper and lower cylinder (not shown) and a drive motor (not shown). When the upper and lower cylinders are driven, each wiping member 71 moves up and down, and when the drive motor is driven, the wiping member 71 is armed. It rotates around the axis line 76.
[0070]
When the solution adheres to the wiping member 71 by scraping off the solution remaining on the nozzle surface 57 of the head 7, the wiping member 71 facing upward by the drive motor is directed downward and the wiping member 71 is moved by the upper and lower cylinders. Is immersed in the solvent in the cleaning tank 73 disposed on the lower side together with the holding member 74.
[0071]
Thereby, since the solution adhering to the wiping member 71 can be washed away before solidifying, the surface of the wiping member 71 can be always kept clean. Therefore, when the solution remaining on the nozzle surface 57 of the head 7 is scraped off, the solution remaining on the nozzle surface 57 can be reliably removed.
[0072]
Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the spirit of the invention at the stage of implementation. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments. For example, some components may be deleted from all the components shown in the embodiment.
[0073]
【The invention's effect】
According to the present invention, a functional thin film having a uniform thickness can be formed on the surface of a substrate. Moreover, it can prevent that the scraping action of the wiping member falls.
[Brief description of the drawings]
FIG. 1 is a piping system diagram showing piping of a coating apparatus according to a first embodiment of the present invention.
FIG. 2 is a front view showing the configuration of the coating apparatus according to the embodiment with piping omitted.
FIG. 3 is a sectional view showing a configuration of a head according to the embodiment.
4 is a bottom view showing the configuration of the head according to the embodiment. FIG.
FIG. 5 is a schematic view showing the shape of a guide groove formed on the upper surface of the counter plate according to the same embodiment.
FIG. 6 is a schematic view showing a solution remaining on the nozzle surface of the head according to the embodiment.
FIG. 7 is a front view showing a configuration of a coating apparatus according to a second embodiment of the present invention with piping omitted.
FIG. 8 is a schematic diagram showing how the solution remaining on the nozzle surface of the head according to the embodiment is scraped off.
FIG. 9 is a front view showing a configuration of a coating apparatus according to a modification of the embodiment with piping omitted.
FIG. 10 is a side view showing a configuration of a coating apparatus according to a modification of the embodiment with piping omitted.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 7 ... Head, 14 ... Nozzle, 55 ... Opposing plate, 59 ... Gas injection nozzle, 71 ... Wiping member, 73 ... Cleaning tank, W ... Substrate.

Claims (3)

ノズルを用いて基板の表面に溶液を噴射塗布する塗布装置において、
上記ノズルが形成されたノズル面を有するヘッドと、
上記溶液の非塗布時に、上記ヘッドのノズル面に対向して配置され、上記ノズルから流下する溶液を受けて上記ノズル面との間に上記溶液を満たす上面を有する対向板と、
を具備することを特徴とする塗布装置。In a coating apparatus that sprays and applies a solution to the surface of a substrate using a nozzle,
A head having a nozzle surface on which the nozzle is formed;
An opposing plate having an upper surface that is disposed opposite to the nozzle surface of the head when the solution is not applied, receives the solution flowing down from the nozzle, and fills the solution between the nozzle surface;
A coating apparatus comprising: 上記ノズル面と対向板の間に溜められた溶液に向けて不活性ガスを噴射するためのガス噴射ノズルを備えたことを特徴とする請求項１記載の塗布装置。  The coating apparatus according to claim 1, further comprising a gas injection nozzle for injecting an inert gas toward the solution stored between the nozzle surface and the counter plate. 上記対向板の上面には、上記ノズルから流下した溶液を案内するための案内溝が形成されていることを特徴とする請求項１または請求項２に記載の塗布装置。  The coating apparatus according to claim 1 or 2, wherein a guide groove for guiding the solution flowing down from the nozzle is formed on an upper surface of the counter plate.
JP2003106561A 2003-04-10 2003-04-10 Coating device and head cleaning method Expired - Fee Related JP4343573B2 (en)

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JP2003106561A JP4343573B2 (en) 2003-04-10 2003-04-10 Coating device and head cleaning method
KR1020040023401A KR100658109B1 (en) 2003-04-10 2004-04-06 Liquid-applying apparatus and method of cleaning a head
TW093109932A TW200502049A (en) 2003-04-10 2004-04-09 Liquid-applying device and method of cleaning a head
CNB2004100334850A CN100421941C (en) 2003-04-10 2004-04-09 Coating device and blow head cleaning method
KR1020060098073A KR100925765B1 (en) 2003-04-10 2006-10-09 Method of cleaning a head of liquid-applying apparatus

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KR100658109B1 (en) 2006-12-14
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