JP4330702B2 - Cooling device and electronic device with built-in cooling device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic device such as a portable personal computer (PC), and more particularly to a cooling device therefor.
[0002]
[Prior art]
Recently, in the field of this type of electronic equipment, the processing speed of electronic parts that process various information such as characters, sounds, and images, for example, MPU (Micro Processing Unit) has been increased, and multi-function has been promoted. It has been. In such an electronic device, the power consumption of the MPU increases as the integration and performance of the MPU increase, and the amount of heat generated increases due to the increase in the power consumption. The amount of heat generated during operation of the entire device is increased.
[0003]
On the other hand, electronic devices are required to be small and thin so as to be suitable for carrying, and it is difficult to secure a desired gap in which a printed wiring board on which electronic components are mounted is mounted on the device casing. .
[0004]
In view of this, in the electronic device, a cooling device for heat-controlling the electronic components such as the MPU of the printed wiring board housed in the device casing is assembled, and a cooling configuration for heat-controlling the electronic components is adopted.
[0005]
In such a conventional cooling device, an electronic component is thermally coupled to one end of a heat radiating member called a heat sink, and a blower fan is attached to the other end of the heat radiating member.
[0006]
With the above configuration, when the electronic component is driven to generate heat, the amount of heat is transferred to the other end of the heat radiating member, and the amount of heat transferred to the other end of the heat radiating member is cooled by the blower fan to obtain the desired electronic component. Thermal control to the temperature of.
[0007]
However, in the above cooling device, it is difficult to effectively dissipate the heat generated by other electronic components including the power supply system mounted on the printed wiring board as the electronic components increase in speed and function. For this reason, there is a possibility that the temperature of the device rises, and as a result, the performance of other parts is impaired.
[0008]
Therefore, a method of improving the cooling capacity of the cooling device and performing highly efficient thermal control in the equipment housing (not shown) can be considered.
[0009]
However, in order to improve the cooling capacity of the cooling device, it is necessary to improve the capacity of the blower fan. Therefore, the equipment casing (not shown) is increased in size and thickness, and is thus portable. There is a problem that it becomes difficult to satisfy the miniaturization and thinning until suitable.
[0010]
[Problems to be solved by the invention]
As described above, the conventional cooling device has a problem that it becomes large in response to an increase in the heat generation amount of the electronic component.
[0011]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a cooling device capable of realizing highly efficient thermal control while ensuring miniaturization.
[0012]
In addition, the present invention provides an electronic device capable of achieving high efficiency thermal control and improving processing capacity after ensuring miniaturization and thinning until suitable for carrying. Objective.
[0013]
[Means for Solving the Problems]
The present invention is a cooling system having a pair of intake ports provided in a fan axial direction of a double-sided intake type blower fan so as to sandwich the blower fan, and a blower port formed facing the radial direction from the fan shaft. The fan unit, a heat receiving portion thermally connected to the electronic component, and a protrusion, are provided to face the air blowing port of the cooling fan unit, and the electronic component is accommodated by the protrusion. It was to constitute a cooling device and a heat radiating member that is provided with a gap between the inner wall of the apparatus housing.
[0014]
According to the above configuration, when the blower fan is driven, the cooling fan unit sucks air from both of the pair of intake ports and blows the intake air from the blower ports toward the heat receiving portion of the heat dissipation member. Then, the heat receiving part of the heat radiating member is directly cooled to cool the electronic component.
[0015]
As a result, it is possible to supply a sufficient amount of air to the heat receiving part of the heat radiating member, and it is possible to improve the cooling capacity, and highly efficient cooling of the electronic components is realized, and the miniaturization is ensured. Thus, it is possible to promote the processing capacity of the electronic component.
[0016]
The present invention also includes an equipment housing in which a printed wiring board on which electronic components are mounted is housed and disposed in the equipment housing, and is disposed in the fan axial direction of a double-sided intake type blower fan. A cooling fan unit having a pair of air inlets provided across a blower fan, and a blower port formed in a radial direction from the fan shaft, and an electronic component mounted on the printed wiring board Yes a heat receiving portion which is thermally connected, has a projecting portion, with provided opposite to the air blowing port of the cooling fan unit, the gap between the inner wall of the apparatus housing by said projections And the electronic device was comprised including the thermal radiation member accommodated in this apparatus housing | casing.
[0017]
According to the above configuration, when the blower fan is driven, the cooling fan unit sucks air from both of the pair of intake ports and blows the intake air from the blower ports toward the heat receiving portion of the heat dissipation member. Then, the heat receiving portion of the heat radiating member is directly cooled to cool the electronic component, and air is blown into the device housing to cool the inside of the device housing.
[0018]
As a result, a sufficient amount of air can be supplied to the heat receiving portion of the heat radiating member and the device casing, and it becomes possible to improve the cooling capacity. As a result, the processing capacity of the electronic component can be promoted after the device casing is miniaturized to the optimum size.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0020]
FIG. 1 shows an electronic apparatus according to an embodiment of the present invention. An apparatus housing 10 is formed in a substantially box shape by a case 101 and a cover 102 made of a metal material such as a magnesium alloy, for example. On the keyboard 102, the keyboard 11 is assembled so that the keys can be freely operated. A liquid crystal display (LCD) 13 corresponding to the keyboard 11 is assembled to the device housing 10 via a hinge mechanism 14 so as to be opened and closed in the direction of the arrow.
[0021]
In addition, a printed wiring board 20 is accommodated in the device housing 10 as shown in FIG. 2, and the keyboard 11 and the liquid crystal display 13 are electrically connected to the printed wiring board 20. The printed wiring board 20 is driven in conjunction with the key operation, and desired information corresponding to the key operation is displayed on the liquid crystal display 13.
[0022]
A plurality of electronic components, for example, an electronic component 21 such as an MPU, is mounted on one surface of the printed wiring board 20. The electronic component 21 of the printed wiring board 20 is attached by being thermally coupled to a heat receiving portion 221 of a heat radiating member 22 called a heat sink constituting a cooling device via a heat conducting member called a cool sheet (not shown).
[0023]
As shown in FIG. 3, the heat radiating member 22 is integrally formed with a fan mounting portion 222 at one end of the heat receiving portion 221, and an intermediate portion between the fan mounting portion 222 and the heat receiving portion 221 is, for example, an external fan. A plurality of ventilation windows 223 are formed at predetermined intervals.
[0024]
Further, the heat radiating member 22 is attached to the heat receiving portion 221 with an end portion of a heat pipe 25 constituting a heat transfer path by caulking or the like. Here, the heat pipe 25 transfers the heat transmitted to the heat receiving unit 221 to a gap (not shown) of the device housing 10 to dissipate the heat, and cools the heat receiving unit 221.
[0025]
The fan mounting portion 222 of the heat radiating member 22 is provided with an opening, and the fan casing 23 constituting the cooling fan unit is mounted using a screw or the like corresponding to the opening. The fan casing 23 is formed, for example, in a bottomed cylindrical shape, and houses a double-sided intake type blower fan 24 having a so-called turbofan structure in which a plurality of flat blades are radially arranged on a rotation shaft. The fan casing 23 is rotatably mounted with a rotating shaft of the blower fan 24, and an air inlet 231 is provided around the rotating shaft so as to face the opening of the fan mounting portion 222.
[0026]
In the fan casing 23, a blower opening 232 (see FIG. 2) is formed in a direction substantially orthogonal to the rotation axis of the blower fan 24 and corresponding to the heat receiving portion 221 of the heat radiating member 22. Thus, when the blower fan 24 is driven, air is sucked from the open side of the fan casing 23 corresponding to both surfaces of the blower fan 24 and the intake port 231 and is blown from the blower port 232 of the fan casing 23. The blown air is blown into the heat receiving portion 221 of the heat radiating member 22 and is blown into the device casing 10 through the ventilation window 231.
[0027]
Further, as shown in FIG. 4, an air guide portion 233 is formed in the fan casing 23 so as to correspond to the air inlet 103 of the device housing 10, which will be described in detail later. The air guide 233 efficiently guides the outside air taken in from the air inlet 103 of the device housing 10 to the inlet 231 and the open side of the fan casing 23 on one side of the blower fan 24.
[0028]
The heat dissipating member 22 has a plurality of positioning projections 224 at predetermined intervals facing the case 101 of the device housing 10 on the fan mounting portion 222 (see FIG. 3). Is placed on the inner wall of the case 101 to position the heat dissipation member 22 at a predetermined position. In this state, the heat radiating member is attached onto the case 101 using screws or the like. As a result, the fan casing 23 assembled to the fan mounting portion 222 of the heat radiating member 22 can effectively prevent the blower fan 24 from coming into contact with the case 101 of the device housing 20. Can be made thinner.
[0029]
Here, when the blower fan 24 is rotationally driven, the cooling fan unit sucks air from the air inlet 231 of the fan casing 23 and the opening of the fan mounting portion 222 from its open side, and the heat radiating member from the air outlet 232. It blows toward 22 heat receiving parts 221. Thereby, the heat receiving part 221 of the heat radiating member 22 is cooled by the air blown from the exhaust port 232 of the fan casing 23, and efficiently cools the electronic component 21 of the printed wiring board 20.
[0030]
At the same time, the air blown from the exhaust port 232 of the fan casing 23 is blown into the device casing 10 through the ventilation window 223 of the heat radiating member 22 and is used for cooling other heat generating portions in the device casing 10. . Thereby, the temperature rise in the device housing 10 is prevented.
[0031]
In the above description, an opening is formed in the fan mounting portion 222 of the heat radiating member 22 using the bottomed cylindrical fan casing 23 in which the air inlet 231 is formed on the bottom surface, and air is supplied from the upper and lower ends of the fan casing 23. However, the present invention is not limited to this, and a box-shaped fan casing may be used so that the intake ports are formed above and below the both ends of the rotating shaft of the fan casing.
[0032]
In addition, as shown in FIG. 5, the device housing 10 is provided with a resin wall portion 30 on one side wall thereof that is thermally insulated from the case 101 and the cover 102 made of a metal material. In addition, the air inlet 103, the air outlet 104, the power switch 105, and the switch lock operator 106 are arranged in parallel on the resin wall 30. The air inlet 103 sucks air outside the device housing 10 into the device housing 10 by driving the blower fan 24 of the cooling fan unit. The air exhaust port 104 exhausts the exhaust air exhausted from the exhaust port 232 of the fan casing 23 into the device housing 10 to the outside of the device housing 10 by driving the blower fan 24 of the cooling fan unit.
[0033]
The power switch 105 is connected to the electronic component 21 on the printed wiring board 20, and selectively turns on and off the power by the switching operation. The switch lock operator 106 locks and unlocks the power switch 105 at the operation position by the switching operation.
[0034]
In FIG. 5, reference numeral 107 denotes a mounting hole, which is called a Kensington lock hole, to which an anti-theft mechanism (not shown) is mounted. This mounting hole 107 is not attached to the anti-theft mechanism and is inserted into the device casing 10. It serves as an air inlet / outlet and contributes to an improvement in cooling efficiency.
[0035]
In FIG. 5, reference numeral 108 denotes an expansion card slot such as a PC card according to the PCMCIA standard.
[0036]
Furthermore, a plurality of air exhaust holes 109 (see FIG. 2) are formed in the case 101 of the device casing 10. In the plurality of air exhaust holes 109, the air that has been blown from the blower fan 24 of the cooling fan unit and circulated in the device housing 10 is discharged out of the device housing 10.
[0037]
With the above configuration, the power switch 105 and the switch lock operation element 106 are disposed on the resin side wall portion 30 formed of a resin material having a small specific heat, so that the device switch 10 made of a metal material can be thermally Insulation and the air intake port 103 and the air exhaust port 104 have a small specific heat in the same manner, so that they are thermally insulated from each other. Therefore, the power switch 105 and the switch lock operation element 106 can effectively reduce the temperature of the sensation during the operation of the computer main body and obtain a good operability.
[0038]
In the above configuration, when the electronic component 21 of the printed wiring board 20 is driven and generates heat, the amount of heat of the electronic component 21 is transmitted to the heat receiving portion 221 of the heat radiating member 22, and the temperature of the heat receiving portion 221 increases.
[0039]
Here, when a temperature sensor (not shown) detects a temperature rise, a control unit (not shown) drives and controls the blower fan 24 of the cooling fan unit in response to this. Then, the blower fan 24 forcibly sucks the external air of the device housing 10 from the air intake port 103 of the device housing 10 in conjunction with the drive, and the heat radiating member through the air inlet 231 and the open side of the fan casing 23. Air is taken in through the openings of the 22 fan mounting portions 222. The air sucked into the fan casing 23 is blown from the air blowing port 232 to the heat receiving portion 221 of the heat radiating member 22 to cool the heat receiving portion 221 and cool the electronic component 21 of the printed wiring board 20.
[0040]
At the same time, the air blown from the blower opening 232 of the fan casing 23 is blown into the device casing 10 from the ventilation window 223 of the heat radiating member 22 to cool the internal devices including the printed wiring board 20 in the device casing 10. To do. Then, the air blown from the air outlet 232 of the fan casing 23 is discharged out of the equipment housing 10 from the air exhaust port 204 of the equipment housing 10.
[0041]
As described above, the cooling device accommodates the double-sided intake type blower fan 24 in the fan casing 23 so that the double-sided intake is possible, attaches the fan casing 23 to the heat radiating member 22 provided with the heat receiving portion 221, and drives the blower fan 23. In conjunction with this, the air is sucked from both ends of the fan casing 23 and is blown to the heat receiving portion 221 of the heat radiating member 22 from the air blowing port 231 provided in the fan casing 23 to cool the electronic component 21. .
[0042]
According to this, when the blower fan 24 is driven, air is sucked in from the open side of the fan casing 23 attached to the heat radiating member 22 and both surfaces of the air inlet 231, and the heat radiating member 22 from the air outlet 232 of the fan casing 23. By blowing air toward the heat receiving portion 221 and cooling the electronic component 21 by directly cooling the heat receiving portion 221 of the heat radiating member 22, it is sufficient without increasing the capacity of the blower fan 24. It is possible to ensure the amount of blast. As a result, the cooling capacity can be improved, and the electronic component 21 can be efficiently cooled, and the processing capacity of the electronic component 21 can be promoted while ensuring miniaturization.
[0043]
Further, the electronic device includes a double-sided intake type blower fan 24 accommodated in a fan casing 23 in a device casing 10 in which a printed wiring board 22 on which an electronic component 21 is mounted is accommodated. The casing 23 is attached to the heat radiating member 22 provided with the heat receiving portion 221, and the electronic component 21 of the printed wiring board 20 is thermally coupled to the heat receiving portion 221 of the heat radiating member 22, in conjunction with the driving of the blower fan 24. The air was sucked from both end portions of the fan casing 23 and was blown to the heat receiving portion 221 from the air blowing port 232 provided in the fan casing 23 to cool the electronic component 21 of the printed wiring board 20.
[0044]
According to this, when the blower fan 24 is driven, the cooling fan unit sucks air from both the open side of the fan casing 23 and the both sides of the intake port 231, and the heat dissipation member 22 is discharged from the blower port 232 of the fan casing 23. Air is blown toward the heat receiving portion 221 to directly cool the heat receiving portion 221 of the heat radiating member 22 to cool the electronic component 221, and air is blown into the device housing 10 to within the device housing 10 Cool down.
[0045]
As a result, a sufficient amount of air can be supplied into the heat receiving part 221 of the heat radiating member 22 and the device housing 10, and it becomes possible to improve the cooling capacity, along with highly efficient cooling of the electronic component 21, The cooling inside the device housing 10 is realized, and the processing capacity of the electronic component 21 can be promoted after the device housing 10 is downsized to be optimal for carrying.
[0046]
In the above embodiment, a case has been described in which a double-sided intake type blower fan 24 is provided using a bottomed cylindrical fan casing 23 and air is sucked from both sides of the blower fan 24. However, the present invention is not limited to this, and various configurations are possible.
[0047]
Moreover, although the said embodiment demonstrated the case where it comprised so that one of the electronic components 21 mounted in the printed wiring board 20 might be thermally couple | bonded with the heat receiving part 221 of the thermal radiation member 22, it is restricted to this. Alternatively, a plurality of electronic components can be configured to be thermally coupled.
[0048]
Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention.
[0049]
【The invention's effect】
As described above in detail, according to the present invention, it is possible to provide a cooling device capable of realizing highly efficient thermal control while ensuring miniaturization.
[0050]
In addition, according to the present invention, it is possible to provide an electronic device capable of improving the processing capacity by realizing high-efficiency thermal control while ensuring miniaturization and thinning until suitable for carrying can do.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an external appearance of an electronic apparatus according to an embodiment of the invention.
FIG. 2 is an exploded perspective view showing a main part of a cooling device according to an embodiment of the present invention.
3 is a perspective view showing the cooling fan unit of FIG. 2 taken out. FIG.
4 is a cross-sectional view showing a part of FIG.
FIG. 5 is a side view showing a main part of FIG.
[Explanation of symbols]
10: Equipment housing.
101 ... Case.
102 ... Cover.
103 ... Air inlet.
104: Air exhaust port.
105 ... Power switch.
106: Switch lock operator.
107: Mounting hole.
108 ... Expansion card slot.
109 ... Air exhaust hole.
11 ... Keyboard.
13 ... Liquid crystal display.
14: Hinge mechanism.
20: Printed wiring board.
21 ... Electronic component.
22 ... Heat dissipation member.
221 ... Heat receiving part.
222: Fan mounting part.
223 ... Ventilation window.
224 ... Projection.
23: Fan casing.
231: Intake port.
232: Air blower.
233 ... Air guide part.
24 ... A blower fan.
25 ... Heat pipe.

Claims (4)

A cooling fan unit having a pair of air inlets provided across the air fan in the fan axial direction of the double-sided air intake type air fan and an air outlet formed facing the radial direction from the fan shaft;
A device housing having a heat receiving portion thermally connected to the electronic component, and a projection, provided opposite to the air blowing port of the cooling fan unit, and in which the electronic component is accommodated by the projection a heat dissipation member that is provided with a gap between the inner wall,
A cooling device comprising: The cooling device according to claim 1 , wherein the cooling fan unit includes a plurality of flat blades arranged radially . An equipment housing in which a printed wiring board on which electronic components are mounted is accommodated and disposed;
  A pair of air inlets provided in the apparatus housing, sandwiching the blower fan in the fan axial direction of the double-sided intake type blower fan, and facing the radial direction from the fan shaft A cooling fan unit having a formed air outlet;
  A heat receiving portion thermally connected to an electronic component mounted on the printed wiring board; and a protrusion, and is provided to face the air blowing port of the cooling fan unit. A heat dissipation member housed in the device housing with a gap between the inner wall of the housing,
  An electronic apparatus comprising: 4. The electronic apparatus according to claim 3, wherein the cooling fan unit includes a plurality of flat blades arranged radially .

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