JP4325329B2 - Heat dissipation package - Google Patents

Description

The present invention relates to a heat radiating package that radiates heat from a substrate on which circuit components are mounted.

  In recent years, according to the demand for higher performance and smaller size of electronic devices, circuit components have been miniaturized, densified, and highly functionalized, and are mounted on a circuit board at high density. Along with this, the temperature of circuit components has risen, and heat dissipation has become very important. As a technique for improving the heat dissipation of circuit components, there is known a method in which a conventional machined aluminum plate is attached to a circuit board on which components are mounted, and heat is diffused from the top surface of the components. However, in this method, in order to make the aluminum plate come into contact with the top surfaces of a plurality of components, it is necessary to perform complicated processing on the aluminum plate, and there remains a problem that the cost becomes high. In addition, the aluminum plate is an electrical conductor, so that it does not come into contact with the conductive parts of the circuit components and is electrically insulated, the aluminum surface must be insulated or structurally restricted. There are problems in terms of design and cost.

  Furthermore, it demonstrates using drawing. FIG. 22 is a schematic side view showing a conventional circuit board. Generally, a heat radiating plate 301 from which an aluminum plate is cut and removed is attached to the circuit board 104 using a heat conductive adhesive, and the top of the circuit component 105 is shown. A method of diffusing heat from the surface is known. However, in this method, in order to bring the aluminum plate into contact with the top surfaces of a plurality of parts, it is necessary to perform complicated cutting on the aluminum plate, which has a problem that the cost is high and the productivity is low.

As prior art document information related to the invention of this application, there is the following.
JP 11-46049 A

  In the conventional method of attaching a metal plate as described above, it is difficult to achieve both performance and cost. In a circuit component-mounted board, the higher the circuit component mounting density, the more it is necessary to dissipate the heat generated from the component, but the conventional method of attaching a metal plate contacts the top surface of multiple components. The heat sink that can be made is cut by the processing method, which results in poor productivity and high cost.

  For this reason, there are many compromises due to some parts or partial contact, and as a result, sufficient heat dissipation cannot be performed, and the reliability of the circuit component mounted substrate is lowered.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a low-cost and heat-radiating circuit board .

In order to solve the above-mentioned problems, a heat dissipation package of the present invention comprises a circuit board and an insulating sheet having a recess formed on at least one surface, and an adhesive is used to improve the thermal conductivity from the circuit board. The insulation sheet is fixed to

Thereby, a circuit board with good heat dissipation can be provided.

According to a first aspect of the present invention, there is provided a circuit board on which circuit components are mounted, a metal plate provided substantially parallel to the circuit board, and an insulating sheet provided between the circuit board and the metal plate. The insulating sheet is formed by curing the inorganic filler and the thermosetting resin composition after providing a recess corresponding to the outer shape of the circuit component in advance on at least one surface thereof, The circuit board and the insulating sheet are heat dissipating mounting bodies in which the circuit component is abutted with the recess while the shape at the time of forming the insulating sheet is maintained while being fixed with an adhesive, In addition to being able to efficiently transfer the heat generated in the circuit board to the substrate, the temperature rise of the circuit components can be efficiently suppressed.

According to a second aspect of the present invention, there is provided a first circuit board on which circuit components are mounted, a second circuit board provided substantially parallel to the first circuit board, and the first circuit board. A heat dissipation mounting body comprising a circuit board and an insulating sheet provided between the second circuit board, and the insulating sheet is provided with a recess corresponding to the outer shape of the first circuit component in advance on at least one surface thereof. In addition, an inorganic filler and a thermosetting resin composition are formed by curing, and the first circuit board and the insulating sheet are fixed with an adhesive and the shape at the time of forming the insulating sheet is maintained. It is a heat dissipation mounting body in which the circuit component is brought into contact with the concave portion, so that even when there is a difference in the thermal expansion coefficient between the insulating sheet and the circuit board, due to the difference in the thermal expansion coefficient during the manufacturing of the heat dissipation mounting body Generated heat Ri can be suppressed. For this reason, the circuit component mounted on the circuit board and the heat radiating board can be brought into contact with each other accurately and easily, and the heat generated in the circuit component can be efficiently transmitted to the heat radiating plate.

As is apparent from the above description, according to the present invention, the heat generated from the circuit component is obtained by bonding and fixing the insulating sheet having the concave portion in contact with the top surface shape of the circuit component of the circuit substrate to the circuit substrate. Can be efficiently transmitted to the heat dissipation substrate to dissipate heat, and the temperature rise of the circuit components can be efficiently suppressed.

(Embodiment 1)
Hereinafter, with reference to the first embodiment will be described the invention described onset bright.

FIG. 1 is a cross-sectional view showing a state in which a heat dissipation substrate 101A according to the first embodiment related to the present invention is mounted on a circuit board, and FIG. 2 shows a method for manufacturing the heat dissipation substrate 101A according to the first embodiment. It is sectional drawing shown.

  In FIG. 1, the heat dissipation substrate 101 </ b> A includes a high thermal conductive resin 102 and a metal plate 103. The high thermal conductive resin 102 is a resin obtained by adding high thermal conductivity to a thermosetting resin by adding a thermal conductive filler made of an inorganic material at a high concentration. The surface of the high thermal conductive resin 102 opposite to the metal plate 103 has a concavo-convex shape corresponding to the structural shape based on the plurality of circuit components 105 mounted on the circuit board 104.

  Here, 107 indicates a wiring pattern made of copper. Then, the heat dissipation substrate 101A is mounted on the circuit board 104 using a heat conductive adhesive so that at least the top surface of the circuit component 105 is in contact with the top surface in the recess of the heat dissipation substrate 101A. In this way, by combining the top surface of the recess of the heat dissipation substrate 101A with the top surface of the circuit component 105 on the circuit board 104 in contact, the amount of heat generated by the heat generation of the circuit component 105 mounted on the circuit board 104 is Since it is quickly and efficiently transmitted to the entire heat dissipating board 101A, it is possible to prevent the heat generated circuit component 105 from becoming high temperature and to improve the reliability of the circuit board.

  In FIG. 1, there is a gap between the high thermal conductive resin 102 of the heat dissipation board 101A and the circuit board 104. However, the variation in the height of each circuit component 105 is reduced, and the high thermal conductive adhesive with high electrical insulation is provided. If the gap between the high thermal conductive resin 102 and the circuit board 104 of the heat radiating board 101A is eliminated by using the agent, the heat generated in the circuit component 105 can be radiated more efficiently.

  Next, a method for manufacturing the heat dissipation substrate 101A of the first embodiment will be described with reference to FIG.

In FIG. 2A, a sheet-like material 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition is formed on a PET film 121. The sheet 110 is a soft thermosetting resin sheet containing an inorganic filler, and is a heat conductive filler and a thermosetting resin composition made of 70 to 95 parts by weight of an inorganic material. The thermally conductive inorganic filler is at least one inorganic filler selected from Al ₂ O ₃ , MgO, SiO ₂ , BN, or AlN. In this embodiment, Al ₂ O ₃ is used.

  Here, the particle size of the inorganic filler is desirably 0.1 to 100 μm, and in this embodiment, two types of mixtures having an average particle size of 3 μm and 12 μm are used. By using inorganic fillers having two kinds of large and small particle diameters, the inorganic fillers having small particle diameters are filled in the gaps between the inorganic fillers having large particle diameters, so that the inorganic fillers can be filled with high density. The filling amount of the inorganic filler is 87% by weight.

  The thermosetting resin composition contains a liquid thermosetting resin and a thermoplastic resin powder as components, and the thermoplastic resin powder absorbs the liquid component of the liquid thermosetting resin and swells. Can be made solid. The thermosetting resin contains at least one of an epoxy resin, a phenol resin, or a cyanate resin. In this embodiment, a bisphenol A liquid epoxy resin is used.

  Further, a brominated epoxy resin is added to the thermosetting resin as a curing agent, a curing accelerator and a flame retardant. The liquid epoxy resin, curing agent, curing accelerator and brominated epoxy resin are about 11% by weight. Further, in order to give flexibility in a semi-cured state of the sheet below the curing temperature of the epoxy resin, the sheet contains about 2% thermoplastic powder. This resin is formed into a sheet by an extrusion molding method. In addition, it is possible to form a sheet using a doctor blade method, a coater method, or a rolling method.

  As shown in FIG. 2B, a metal plate 103 is attached to the surface of the resin sheet 110 where the PET film 121 is not present. Since the resin surface of the resin sheet 110 is sticky, it is affixed with care so that air does not get caught in the interface between the metal plate 103 and the resin sheet 110. In this embodiment, the sheet 110 is attached to the metal plate 103 while applying a roller from the end face of the sheet from the PET film side. As the metal plate 103, a metal plate or a metal foil mainly composed of aluminum or copper having good thermal conductivity is preferable. In this embodiment, an aluminum plate having a low specific gravity is used.

Next, as shown in FIG. 2C, the PET film 121 is peeled from the resin sheet 110. Next, as shown in FIG. 2D, the resin sheet 110 attached to the metal plate 103 is set in a mold. Here, the mold A201 has a concavo-convex shape corresponding to the structural shape based on the circuit board 104 on which the circuit component 105 is mounted, and the resin sheet 110 is pressed against the surface having the concavo-convex shape and overlapped. A metal mold B202 is provided around the metal plate 103 and performs positioning and thickness control. The mold C203 enters the mold B202, and the resin is molded into a desired shape by pressing the mold C203 in the next step (E).

  The steps up to FIG. 2C are usually performed at room temperature. In FIG. 2D, the mold A201, the mold B202, and the mold C203 are heated to about 60 to 80 ° C. using a hot plate or the like. This is to shorten the time required for raising the mold A201, the mold B202, and the mold C203 to the temperature required for molding to 100 to 140 ° C. by the hot press in the next step (E), thereby increasing the productivity. is there. The temperature of 60 to 80 ° C. is a temperature at which the viscosity of the resin is lowered. In this state, the resin is sufficiently fluidized by the hot press (E) in the next step to easily obtain a desired shape. In this embodiment, three types of molds were heated to 70 ° C.

  The mold set as shown in FIG. 2 (D) is set between two heating plates 204 heated to a constant temperature as shown in FIG. 2 (E) and heated and pressed to form a thermosetting resin composition. Semi-cured. The temperature of the hot platen is preferably 100 to 140 ° C. In this embodiment, the heating plate is heated at 120 ° C. for 2 minutes. At this temperature, the thermosetting resin (epoxy resin in this embodiment) is not cured, but due to the effect of the thermoplastic resin powder, the thermosetting resin composition can be increased in hardness to a state where the shape can be maintained (half Cured resin 111). After molding, the mold was removed from the hot platen 204, cooled (70 ° C. in this embodiment), and then removed from the mold.

  Next, it was placed in a drying furnace and heated to fully cure the epoxy resin (FIG. 2F). The temperature is preferably 150 to 230 ° C., and in this embodiment, the temperature was 170 ° C. for 3 hours (the cured resin 112).

  The heat dissipating board 101A thus manufactured is attached so as to be in contact with the circuit component 105 mounted on the circuit board 104 as shown in FIG. At this time, in order to effectively transfer the heat generated in the circuit component 105 to the heat dissipation substrate 101A, the circuit component 105 and the heat dissipation substrate 101A are fixed using a high thermal conductive adhesive. Thereby, the heat generated in the circuit component 105 can be efficiently transferred to the heat dissipation substrate 101A, the temperature rise of the circuit component 105 can be suppressed, and a highly reliable circuit component mounting substrate can be obtained.

  FIG. 3 shows another manufacturing method of the heat dissipation substrate of the present embodiment.

  As shown in FIG. 3 (A ′), a sheet-like material 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition is formed on a PET film 121. Next, it is set in the mold so that the resin sheet 110 side is in contact with the mold A201 as shown in FIG. The manufacturing conditions of this process up to FIG. 3 (F ′) including this process are the same as those in FIG. Next, after being molded by heating and pressing as shown in FIG. 3 (E ′), the PET film 121 is peeled off, and then the resin is completely cured by heating in a drying furnace as shown in FIG. 3 (F ′).

  Next, as shown in FIG. 3H, a heat-dissipating metal plate 103 is attached to a flat surface without an uneven shape using a heat conductive adhesive so that no bubbles remain. Depending on the type of the adhesive, the step of curing the adhesive can be omitted by attaching the metal plate 103 before the main curing shown in FIG.

  In this embodiment, molding is performed with the PET film 121 attached, but the PET film 121 may be peeled off at the stage where the sheet is set in the mold A201 in FIG.

  In the step of FIG. 3H, the metal plate 103 and the high thermal conductive resin 102 may be bonded using a high thermal conductive film 122 instead of the thermal conductive adhesive. A heat dissipation substrate 101B by this method is shown in FIG.

(Embodiment 2)
Hereinafter, with reference to the second embodiment will be described with the present onset bright.

  FIG. 5 is a cross-sectional view showing a state where the heat dissipation substrate 101C according to the second embodiment of the present invention is mounted on a circuit board on which components are mounted, and FIG. 6 is a method for manufacturing the heat dissipation substrate 101C according to the second embodiment. FIG.

  In FIG. 5, the heat dissipation substrate 101 </ b> C includes a high thermal conductive resin 102 and a second circuit substrate 115. Reference numeral 102 denotes a high thermal conductive resin, which is a resin imparted with high thermal conductivity by adding a thermal conductive filler made of an inorganic material at a high concentration to the thermosetting resin. A second circuit board 115 is integrally formed on one surface of the high thermal conductive resin 102, and a circuit component 116 is mounted thereon. The heat dissipation substrate 101C is attached so as to be in contact with the circuit component 105 of the circuit substrate 104. As a result, not only the heat generated in the circuit component 105 can be efficiently radiated, but also a higher density design can be achieved, thereby contributing to downsizing of the device.

  In this embodiment, an example in which a double-sided printed wiring board is used as the second circuit board 115 is shown, but a single-sided printed wiring board, a multilayer printed wiring board, or The same effect can be obtained even when a metal base substrate or the like is used.

  Next, a method for manufacturing the heat dissipation substrate 101C of the second embodiment will be described with reference to FIG.

  As shown in FIG. 6A, a second circuit in which a resin sheet 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition formed on a PET film 121 and a wiring pattern 107 is formed. A substrate 115 is prepared. These are stacked as shown in FIG. The processes after FIG. 6B are the same as the manufacturing method according to the first embodiment shown in FIG. Finally, as shown in FIG. 6G, the heat dissipation substrate 101C on which the circuit component 116 is mounted on the second circuit board 115 is attached so as to come into contact with the circuit component 105 of the circuit board 104.

  There is another manufacturing method for manufacturing the heat dissipation substrate 101C of the second embodiment. The manufacturing method is the same as the second manufacturing method of the first embodiment (see FIG. 3). In FIG. 3H, the second circuit board 115 is replaced with a high thermal conductive adhesive instead of the metal plate 103. Affixed to the high thermal conductive resin 102. At this time, when the circuit component 116 is mounted on the second circuit board 115 and attached to the high thermal conductive resin 102, the circuit component 116 is attached to the high thermal conductive resin 102 rather than the second circuit board 115 and then mounted. 116 is easy to mount. However, since the curing temperature is high depending on the type of the adhesive, and some components may be thermally damaged, the circuit component may be mounted after bonding the second circuit board 115 and the high thermal conductive resin 102.

  Next, a heat dissipation substrate 101D similar to that in Embodiment 2 is shown in FIG. This is a heat dissipation board in which a high thermal conductive film 122 is inserted between the second circuit board 115 and the high thermal conductive resin 102. When the second circuit board 115 and the high thermal conductive resin 102 are bonded with an adhesive, the second circuit board 115 has a wiring pattern 107 and has an unevenness of several tens of μm. For this reason, there is a possibility that the adhesiveness is lowered, and heat generated by the circuit component 116 on the second circuit board 115 may not be effectively transmitted to the heat sink. For this reason, the high thermal conductive film 122 is inserted between the second circuit board 115 and the high thermal conductive resin 102 in order to improve adhesion.

  FIG. 8 shows a manufacturing method of the heat dissipation substrate 101D. The manufacturing method is almost the same as the second manufacturing method of the second embodiment, and when the second circuit board 115 is bonded to the high thermal conductive resin 102 as shown in FIG. The film 122 is inserted, and the high thermal conductive resin 102 and the second circuit board 115 are bonded and integrated.

  Next, a heat dissipation substrate 101E of another application example of Embodiment 2 is shown in FIG. The heat dissipation board 101E is made of the second circuit board 115 and the high thermal conductive resin 102, but the circuit component 117 is mounted on the high thermal conductive resin 102 side of the second circuit board 115, and the circuit component 117 has a high thermal conductivity. It is embedded in the resin 102. By doing so, not only can the mounting density of the components be increased, but also the heat generated in the circuit components 117 can be efficiently conducted by the high thermal conductive resin 102, so that the temperature rise of the circuit components 117 can be suppressed.

  Cross-sectional views of the method for manufacturing the heat dissipation substrate 101E are shown in FIGS. As shown in FIG. 10A, a resin sheet 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition formed on a PET film 121, a wiring pattern 107, and a high thermal conductive resin 102 are formed. A second circuit board 115 on which the circuit component 117 is mounted on the surface in contact with is prepared. As shown in FIG. 10B, the resin sheet 110 is attached to the surface side of the second circuit board 115 on which the circuit components 117 are mounted. Subsequent steps are fabricated in the same manner as in FIG. 6 to fabricate the heat dissipation substrate 101E.

  Next, FIG. 12 shows a heat dissipation board 101F of another application example of the second embodiment. A difference from the heat dissipation substrate 101 </ b> E (see FIG. 9) is that a high thermal conductive film 122 is inserted between the second circuit substrate 115 and the high thermal conductive resin 102. This is because, in the process of manufacturing the heat dissipation substrate 101E, in the sheet bonding shown in FIG. 10B, the circuit component 117 is thick, so that it cannot be bonded well and may peel off or become wrinkles. For this purpose, the high thermal conductive film 122 is sandwiched between the second circuit board 115 and the high thermal conductive resin 102.

  Cross-sectional views of the method for manufacturing the heat dissipation substrate 101F are shown in FIGS. As shown in FIG. 13A, a resin sheet 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition formed on a PET film 121, a wiring pattern 107, and a high thermal conductive resin 102 are formed. The second circuit board 115 on which the circuit component 117 is mounted on the surface in contact with the substrate and the high thermal conductive film 122 from which the resin at the position corresponding to the circuit component 117 is removed are prepared.

  Next, as shown in FIG. 13B, the circuit component 117 mounted on the second circuit board 115 is put into the opening of the high thermal conductive film 122, and the second circuit board 115 and the high thermal conductive film 122 are attached. Affixing is applied to the resin sheet 110. The processes after FIG. 13C are the same as those after FIG.

(Embodiment 3)
Hereinafter, with reference to the third embodiment will be described with the present onset bright.

  FIG. 15 is a cross-sectional view illustrating a state where the heat dissipation board 101G according to the third embodiment of the present invention is mounted on a circuit board on which components are mounted, and FIG. 16 is a method for manufacturing the heat dissipation board 101G according to the third embodiment. FIG.

  Both sides of the main plane of the heat dissipation board 101G are for heat dissipation so that at least the top surfaces of the circuit components 105, 117 mounted on the circuit boards 104, 115 are brought into contact with the top surfaces in the recesses of the heat dissipation board 101G. The board 101G is mounted on the circuit boards 104 and 115 using a heat conductive adhesive. In general, the circuit board 104 is a main board and the circuit board 115 is a sub board. The sub board 115 is attached to the heat radiating board 101G and then attached to the main board 104.

  Next, the manufacturing method of this heat dissipation board | substrate is demonstrated using FIG. A resin sheet 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition formed on the PET film 121 shown in FIG. After setting so that the surface without the PET film 121 is on the mold A201 side, the PET film 121 is peeled off. After peeling, a mold C203A having a structure corresponding to the uneven shape in a state where the circuit component 117 is mounted on the circuit board 115 is set on the resin sheet.

  The steps from the molding (FIG. 16C) to the main curing (FIG. 16D) are performed in the same manner as other heat dissipation substrates. After the main curing, the circuit board 115 on which the circuit components 116 and 117 are mounted is mounted using a high thermal conductive adhesive so that the top surface of the circuit component 117 is in contact with the inner surface of the recess of the heat dissipation substrate 101G. This is mounted so as to be in contact with the circuit component 105 of the circuit board 104 which is the main board.

(Embodiment 4)
Hereinafter, with reference to the fourth embodiment will be described with the present onset bright.

  FIG. 17 is a cross-sectional view showing a state where the heat dissipation board 101H according to the fourth embodiment of the present invention is mounted on a circuit board on which components are mounted, and FIGS. 18 and 19 show the heat dissipation board 101H according to the fourth embodiment. It is sectional drawing which shows this manufacturing method.

  In the second and third embodiments, the circuit board 115 is attached to the surface of the high thermal conductive resin 102 opposite to the circuit board 104. However, the circuit board 115 and the circuit board 104 are not electrically connected. In the fourth embodiment of the present invention, the circuit board 115 and the circuit board 104 are electrically connected to further increase the density and size of the device. In the present embodiment, electrical connection is made using conductive metal pins 131. The circuit boards 104 and 115 and the metal pins 131 are joined by solder 132.

In Figure 17, shows the case of a heat radiating substrate 101 H of the fourth embodiment, the circuit board 115 in the usual manner on the 101G from other radiating substrate 101D shown in the second and third embodiments and the circuit board 104 May be connected with a metal pin.

  Next, a manufacturing method of the heat dissipation substrate 101H will be described with reference to FIG.

  As shown in FIG. 18A, a second circuit in which a resin sheet 110 made of a mixture (uncured) of an inorganic filler and a thermosetting resin composition formed on a PET film 121 and a wiring pattern 107 is formed. A substrate 115 is prepared. Here, in order to insert the metal pin 131 for connecting the circuit board 104 and the circuit board 115, a through hole 134 is formed at a position where the metal pin 131 is inserted into the resin sheet 110. The size of the through hole 134 is preferably larger so that the resin sheets 110 can be easily stacked when the molds are stacked (FIG. 18D).

  In the present embodiment, through holes are also formed in the PET film 121 at the same time. A through hole 135 is also formed in the circuit board at a position where the metal pin 131 is inserted in advance. If the size of the through-hole 135 at this time is too large than the pin 205, the resin overflows to the surface of the circuit board 115 through the through-hole 135 during molding (FIG. 18E) and cannot be made too large.

  In the present embodiment, it is 0.05 mm larger than the diameter of the pin 205. In this figure, there is no copper plating in the through hole and it is in a non-conductive state. However, the through hole may be plated with copper to form a conductive through hole without etching the through hole during pattern etching. In this way, the wiring pattern 107 on the surface in contact with the high thermal conductive resin 102 of the circuit board 115 and the metal pin 131 can be easily electrically connected.

  Next, the circuit board 115 and the resin sheet 110 were bonded together as shown in FIG. The PET film 121 was peeled off (FIG. 18C) and set in a mold (FIG. 18D). A pin 205 for forming a through hole is attached to the mold A201. The mold C203B is provided with a relief so that the pin 205 does not hit. Although the relief does not penetrate in the figure, it may be penetrated in consideration of cleaning in the relief. In this embodiment, the pin 205 is attached to the mold A201. However, the attachment mold A201 may be provided with a relief on the mold C203B.

  Thereafter, as shown in FIG. 18 (E), it is molded by heating and pressurization, and then taken out from the mold and subjected to main curing (FIG. 19 (F)). Finally, the heat dissipation board 101H is attached to the circuit board 104 on which the circuit board 105 is mounted, and after inserting the metal pins 131 into the through holes 133, the circuit boards 104 and 115 and the metal pins 131 are electrically connected by the solder 132. Alternatively, after the metal pins 131 are first attached to the circuit board 104 and soldered, the heat dissipation board 101H is attached and soldered. Alternatively, the metal pins 131 may be first attached to the circuit board 115 of the heat dissipation board H and soldered, and then attached to the circuit board 104 and soldered.

  Further, in the drawing, the through hole 133 of the circuit board 104 is non-conductive without copper plating, but may be conductive by copper plating. In this way, the wiring pattern 107 on the heat dissipation board 101H side of the circuit board 104 and the metal pin 131 can be easily electrically connected.

  In the first to fourth embodiments of the present invention, the resin sheet 110 is drawn with the same size as the metal plate 103 and the circuit board 115 in the figure, but the resin flows and spreads in the mold due to pressure during molding. In the preparation stage of the resin sheet 110, the size of the resin sheet 110 may be smaller than that of the metal plate 103 or the circuit board 115.

  Further, in the first to fourth embodiments of the present invention, as the heat dissipation substrate, the high thermal conductive resin 102 is drawn in the figure with the same size as the metal plate 103 and the circuit board 115. The plate 103 and the circuit board 115 may be made small. It may also be reversed.

(Embodiment 5)
Hereinafter, with reference to the fifth embodiment will be described with the present onset bright.

  20 is a cross-sectional view showing a state where the heat dissipation board 101I according to the fifth embodiment of the present invention is mounted on a circuit board on which components are mounted, and FIG. 21 is a manufacturing method of the heat dissipation board 101I according to the fifth embodiment. FIG.

  As shown in FIG. 20, the heat dissipation substrate 101I has a conductive metal film 141 formed on a surface other than the surface of the high thermal conductive resin 102 on the circuit substrate 104 side. By doing so, not only heat dissipation but also radiation noise generated from circuit components can be suppressed. In FIG. 20, the high thermal conductive resin 102 is used. However, if the heat dissipation substrate 101 </ b> A or 101 </ b> B of the first embodiment is used instead of the high thermal conductive resin 102, noise countermeasures with better heat dissipation can be performed.

  Next, a method for manufacturing the heat dissipation substrate 101I will be described with reference to FIG. Up to the formation of the main cured resin 112 in FIG. 21D is the same as that up to (F ′) in FIG. 3 showing the second manufacturing method of the first embodiment. A conductive metal film 141 is formed on a surface other than the surface of the main cured resin 112 on the circuit board 104 side by plating, vapor deposition, chemical or physical deposition, or the like.

  In the first to fifth embodiments of the present invention, the uneven shape of the surface of the high thermal conductive resin 102 on the circuit board 104 side is a circuit component mounted on the circuit board 104 applied to the mold A201 when the resin sheet 110 is molded. A structure corresponding to the uneven shape 105 is formed. Instead of the mold A201, the circuit board 104 on which the circuit component 105 is mounted may be used, and the resin sheet 110 may be set on the circuit board 104 and molded by heating and pressing to be integrated.

  In this case, it is not necessary to prepare the mold A201 corresponding to the uneven shape of the circuit component 105, and there is no influence of the height variation of the circuit component 105, and the positional deviation and height variation of the circuit component 105 during mounting. In addition, since the high thermal conductive resin is filled in the circuit component 105 and the circuit board 104 without gaps, the heat generated in the circuit component 105 can be efficiently transferred to the heat dissipation board 101I. In addition, a high thermal conductive adhesive is not required when bonding the heat dissipation substrate 101I and the circuit board.

The heat dissipating mounting body and the manufacturing method thereof according to the present invention can manufacture a heat dissipating mounting body having an insulating sheet corresponding to the top surface shape of a circuit component mounted on a circuit board at low cost and with high productivity. Can be brought into contact with the top surface of each circuit component accurately and reliably, heat generated from the circuit component can be efficiently transferred to the heat dissipation board to dissipate it, and the temperature rise of the circuit component can be suppressed efficiently. This is useful for an electric circuit such as a power supply circuit in which a large current flows and the temperature of the circuit component rises.

Sectional drawing which shows the state mounted in the circuit board which mounted the component in the heat dissipation board in Embodiment 1 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation in Embodiment 1 of this invention Process sectional drawing which shows another manufacturing method of the board | substrate for thermal radiation in Embodiment 1 of this invention Sectional drawing which shows the state mounted in the circuit board which mounted the heat dissipation board | substrate which applied Embodiment 1 of this invention as components Sectional drawing which shows the state mounted in the circuit board which mounted the component in the heat dissipation board in Embodiment 2 of this invention Sectional views illustrating a method of manufacturing the radiating substrate in a second embodiment of the present invention Sectional drawing which shows the state mounted in the circuit board which carried the components mounting board | substrate similar to Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation of Embodiment 2 of this invention Sectional drawing which shows the state mounted in the circuit board which mounted the component for the board | substrate for heat radiation which applied Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation which applied Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation which applied Embodiment 2 of this invention Sectional drawing which shows the state mounted in the circuit board which mounted the component for the board | substrate for heat radiation which applied Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation which applied Embodiment 2 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation which applied Embodiment 2 of this invention Sectional drawing which shows the state mounted in the circuit board which mounted the component in the heat dissipation board in Embodiment 3 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation in Embodiment 3 of this invention Sectional drawing which shows the state mounted in the circuit board which mounted the component in the heat dissipation board in Embodiment 4 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation in Embodiment 4 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation in Embodiment 4 of this invention Sectional drawing which shows the state mounted in the circuit board which carried the components the heat dissipation board in Embodiment 5 of this invention Process sectional drawing which shows the manufacturing method of the board | substrate for thermal radiation in Embodiment 5 of this invention Sectional drawing which shows the state mounted in the circuit board which carried the component mounting of the conventional heat dissipation board

101A, 101B, 101C, 101D, 101E, 101F, 101G Heat dissipation substrate 102 High thermal conductive resin 103 Metal plate 104 Circuit board 105 Circuit component 106 Circuit component 107 Wiring pattern 110 Mixture of inorganic filler and thermosetting resin composition (uncured) ) 111 semi-cured resin 112 main cured resin 115 second circuit board 116 circuit component 117 circuit component 121 PET film 122 high thermal conductive film 131 metal pin 132 solder 133 through hole 134 through hole 135 through hole 141 conductive Membrane 201 Mold A
202 Mold B
203, 203A, 203B Mold C
204 Heating plate 205 Pin 301 Aluminum heat sink

Claims (2)

A circuit board on which circuit components are mounted;
A metal plate provided substantially parallel to the circuit board;
A heat dissipating mounting body composed of an insulating sheet provided between the circuit board and the metal plate,
The insulating sheet is formed by curing the inorganic filler and the thermosetting resin composition on at least one surface thereof after providing a recess corresponding to the outer shape of the circuit component in advance.
The circuit board and the insulating sheet are fixed by an adhesive and maintain the shape when the insulating sheet is formed, and the circuit component is brought into contact with the concave portion. A first circuit board on which circuit components are mounted;
A second circuit board provided substantially parallel to the first circuit board;
A heat dissipating mounting body comprising an insulating sheet provided between the first circuit board and the second circuit board;
The insulating sheet is formed by curing the inorganic filler and the thermosetting resin composition after providing a recess corresponding to the outer shape of the first circuit component in advance on at least one surface thereof,
The first circuit board and the insulating sheet are fixed by an adhesive and maintain the shape at the time of forming the insulating sheet, and the heat-dissipating package has the circuit component in contact with the recess.

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