JP4288604B2 - Optical coupling device - Google Patents

Description

  The present invention is useful in an optical wiring system, and aligns an optical waveguide and another optical component (such as a light-emitting element, a light-receiving element, an optical fiber, or an optical waveguide), fixes the position on a support, and connects the optical path. The present invention relates to an optical coupling device and a manufacturing method thereof.

  Until now, information transmission over a relatively short distance, such as between boards in electronic equipment or between chips in a board, has been performed mainly by electrical signals, but in order to further improve the performance of integrated circuits. Therefore, it is necessary to increase the signal speed and the signal wiring density. However, in the electric signal wiring, it is difficult to increase the speed of the electric signal and increase the density of the electric signal wiring due to problems such as signal delay due to the time constant of the wiring and generation of noise.

  Optical wiring (optical interconnection) that solves these problems is drawing attention. Optical wiring can be applied to various places such as between electronic devices, between boards in electronic devices, or between chips in a board. For example, chips are mounted for short-distance signal transmission between chips. An optical waveguide can be formed on a substrate, and an optical transmission / communication system can be constructed using the optical waveguide as a transmission path for signal-modulated laser light or the like.

  In such an optical wiring system, an optical coupling device that aligns an optical waveguide and connects an optical path by aligning the optical waveguide with another optical component (such as a light emitting element, a light receiving element, an optical fiber, or an optical waveguide) is indispensable. At this time, it is necessary to maintain a good relative positional accuracy so that the connection loss of light input / output between the optical waveguide and other optical components falls within an allowable range. Hereinafter, in the present specification, when the light emitting element and the light receiving element are not distinguished, they may be referred to as optical elements.

  Conventionally, as an alignment method, there are an active alignment method in which alignment is performed while actually observing the intensity of signal light, and a method in which alignment markers provided on a substrate are observed with a microscope, etc. These methods are time-consuming and are one of the causes of increasing the cost of the optical wiring system. Accordingly, there is a demand for a method of aligning with good productivity and low cost by self-arrangement based on the outer shape such as fitting and butting.

  As such an example, as disclosed in Patent Document 1 described later, a concave or convex portion for fitting is provided in an optical waveguide formed on the substrate, and the optical substrate is mounted on another substrate. There is a method of performing alignment by fitting with a provided convex portion or concave portion.

  FIG. 5 is an explanatory diagram showing a configuration example of an optical module device using a substrate with an optical waveguide disclosed in Patent Document 1. In FIG. In this apparatus, the optical element 103 is mounted on the substrate 101 on which the optical waveguide 102 is formed, and the optical fiber 105 is fitted in the optical fiber fitting groove 108 and fixed to the other substrate 104. Then, a projection 106 made of a low melting point metal or the like provided on the optical waveguide 102 is fitted into a fitting hole 107 provided on another substrate 104, so that the optical waveguide 102 and the optical fiber 105 Are aligned and an optical coupling is formed.

  Patent Document 2 discloses a method for performing alignment in the optical axis direction by bringing the end face of the semiconductor optical device into contact with the end face of the optical waveguide material by contact (butting).

  FIG. 6 is a plan view showing an example of the optical coupling structure disclosed in Patent Document 2. As shown in FIG. In this apparatus, an optical waveguide 114 including a clad 111 and a core 112 is formed on a substrate (not shown) using a quartz-based material. At the end of the optical waveguide 114, there are two end surfaces, an optical waveguide end surface 118 formed on the core 112 and the cladding in the vicinity thereof, and an optical waveguide material end surface 119 formed around the core 112, and reactive ion etching (RIE). ) Formed by the method. Both the optical waveguide end surface 118 and the optical waveguide material end surface 119 are provided at positions shifted by a predetermined distance 120 in the optical axis direction perpendicular to the optical axis.

  The semiconductor optical device 115 is fixed on the substrate by adjusting the direction so that the optical axis of the emitted light coincides with the axial direction of the core 112 of the optical waveguide 114, aligning with the optical waveguide 114. FIG. 6 shows a process of performing alignment in the optical axis direction. First, as shown in FIG. 6A, the semiconductor optical device 115 located away from the optical waveguide 114 is moved toward the optical waveguide 114, and as shown in FIG. When the end face 116 is brought into contact with the end face 119 of the optical waveguide material, the light emitting end face 117 of the semiconductor optical element 115 is automatically positioned at a position separated from the optical waveguide end face 118 by a predetermined distance 120.

  Note that the alignment in the horizontal direction perpendicular to the optical axis is performed by visual alignment while observing the optical element side marker 121 and the substrate side marker 122.

JP 2000-275472 A (page 6-15, FIGS. 1-26 and 32) Japanese Patent Laid-Open No. 11-337779 (page 4-6, FIG. 1-6)

  The apparatus disclosed in Patent Document 1 requires a processing step of providing concave and convex fitting means on the optical waveguide, which increases the optical waveguide manufacturing step and decreases the productivity. Moreover, since all the three-dimensional alignment is performed by one concave / convex fitting means, it is necessary to align the dots so that the joint between the concave and convex portions of the fitting means is in a narrow area. Limited. This error in the joint is directly related to an alignment error in optical coupling, so that high processing accuracy is required, productivity and yield are deteriorated, and the cost of the optical waveguide is increased.

  Furthermore, even in the mounting operation, if all the alignment in the three-dimensional direction is performed at once, even if some kind of guide mechanism is used, the fine alignment is performed before the concave portion and the convex portion of the fitting means are fitted. The efficiency of the mounting work is reduced.

  On the other hand, according to the apparatus disclosed in Patent Document 2, since alignment is achieved only by abutting, optical coupling between the optical waveguide and the semiconductor optical element can be formed with high productivity. However, since the contact surface is formed on the optical waveguide, there are mainly the following problems (1) to (3).

(1) Since the structure of the optical waveguide becomes complicated and the number of manufacturing processes increases, the productivity and yield of the optical waveguide deteriorate and the cost increases.

(2) In order not to adversely affect the optical waveguide characteristics of the optical waveguide due to a mechanical load or impact applied to the contact surface, for example, it is necessary to make the optical waveguide firmly with a hard material, The material and shape of the optical waveguide are limited.

(3) The size and shape of the contact surface, or the position, orientation, and formation method of the contact surface are limited by the size, shape, and material of the optical waveguide.

  The present invention has been made in view of such a situation, and the object of the present invention is to easily perform optical coupling between an optical waveguide and an optical fiber, an optical element, etc., at low cost, with high productivity and yield. An object of the present invention is to provide an optical coupling device that can be formed with high accuracy.

That is, the present invention includes a joined body of a core and a clad, and one end face of a planar optical waveguide having the core as a light guide and the other optical component are optically coupled to the optical waveguide. A composite body in which the first support body positioned above the optical waveguide is joined and integrated, and a second support body on which the other optical component is mounted are disposed, and the first support body and the second support body are disposed. An optical coupling device in which a support is abutted and the optical waveguide and the other optical component are aligned by the abutment,
The optical waveguide is held in surface contact on the second support,
The first support and the second support are brought into contact with each other at a position higher than the holding surface,
A contact surface of the first support with respect to the second support is formed at a position advanced by a predetermined distance from the one end surface of the optical waveguide in the length direction of the optical waveguide,
The other optical component is mounted such that the front end is located at a position retracted by a predetermined distance from the contact surface of the second support with respect to the first support in the length direction of the optical waveguide. Yes,
This relates to an optical coupling device.
In the optical coupling device of the present invention, as shown in examples described later, abutment surface and said first support and said second support member abuts also in the direction perpendicular to the length direction of the optical waveguide thereof It is good to form in each of these support bodies .

The manufacturing method of the optical coupling device of the present invention includes the steps of forming an optical waveguide on a substrate, a step of bonding the optical waveguide to the substrate for the first substrate is peeled from the substrate, wherein Cutting the base material at a position away from the one end face of the optical waveguide by a predetermined distance to process the first support body having a contact surface with the second support body; An optical coupling comprising: a step of forming a contact surface in contact with the support on the second support; and a step of bringing the first support holding the optical waveguide into contact with the second support. It is good that it is a manufacturing method of an apparatus.

According to the present invention, the first support body integrated with the optical waveguide and the second support body on which the other optical component is mounted are brought into contact with each other. Since the other optical components are aligned, the alignment is performed with the same accuracy as the accuracy of manufacturing the contacted area. And in performing such alignment, the first support and the second support are brought into contact with each other at a position higher than the holding surface of the optical waveguide on the second support, and the optical waveguide A contact surface of the first support with respect to the second support is formed at a position advanced by a predetermined distance from the one end surface of the optical waveguide in the length direction, and the first support is supported with respect to the first support. It is important that the other optical component is mounted such that the front end is located at a position retracted by a predetermined distance from the contact surface of the second support.

  For this reason, it is possible to always perform the contact at an accurate position only by producing the regions where the first support and the second support are in contact with each other with the required accuracy. There is no need to newly provide a fitting means. Further, since alignment is achieved only by abutting, a fine alignment operation and the like that are troublesome are unnecessary. Therefore, the optical coupling between the optical waveguide and the other optical components can be performed easily, at low cost, with good productivity and yield, and with high accuracy.

  In addition, since the contact is not performed on the optical waveguide but on the first support, problems (1) to (3) of the method of Patent Document 2 described above occur. There is nothing. That is, the present invention has the following advantages (1) to (3) as compared with the structure in which the contact portion is provided in the optical waveguide.

(1) Since the structure of the optical waveguide itself does not change, the optical waveguide can be manufactured with the same productivity, yield, and cost as the conventional optical waveguide.

(2) Since the mechanical load and impact applied to the contact portion are absorbed by the first support and do not reach the optical waveguide, the material and shape of the optical waveguide are not limited, and the long-term Excellent reliability.

(3) The size and shape of the contact portion provided on the first support, or the position, orientation, and formation method of the contact portion can be selected regardless of the size, shape, and material of the optical waveguide. Accordingly, the degree of freedom in designing the optical coupling device is increased. Even when the structure or material of the optical waveguide is changed, the same structure can be used.

The optical coupling device of the present invention includes a step of forming an optical waveguide on a substrate, a step of peeling the optical waveguide from the substrate and bonding the optical waveguide to a base material for the first support, and the one of the optical waveguides Cutting the base material at a position away from the end face by a predetermined distance to process the first support body having a contact surface with the second support body, and contacting the first support body A semiconductor ripened by a manufacturing method comprising a step of forming a contact surface on the second support, and a step of bringing the first support and the second support into contact with the optical waveguide. Since it can be manufactured by applying the manufacturing technique, it can be manufactured accurately, with good efficiency and yield, and at low cost.

  Further, it is preferable that a recess is formed in the second support, and the light emitting or light receiving element which is the other optical component is fixed at a predetermined position in the recess. At this time, the one end surface of the optical waveguide is formed as an inclined reflection end surface, and is configured to guide light to the inside or outside of the optical waveguide through reflection by the inclined reflection surface. It is preferable that optical coupling with the optical component is performed. Thus, there is an advantage that a surface light emitting element or a surface light receiving element can be used. For example, VCSELs (Vertical Cavity Surface-Emitting Lasers) and surface-emitting LEDs are easy to manufacture, inexpensive, abundant on the market, and have excellent high-frequency characteristics. Easy to implement and easy to implement. In addition, light receiving elements such as photodiodes are mainly surface light receiving elements, and are easy to mount.

  Further, the other end face of the optical waveguide is formed on an inclined reflecting surface, and is configured to guide light to the outside or the inside of the optical waveguide through reflection by the inclined reflecting surface. An optical coupling with the optical component is preferably formed. If reflection by the inclined end face is utilized, optical coupling with other optical components can be formed while changing the direction of the optical path.

  The composite may be configured to be detachable from the second support. In this way, a so-called connector-shaped optical coupling device that can separate and combine the part of the complex and the part held by the second support as necessary is realized. Can do.

The optical waveguide is composed of a joined body of a core and a clad, and the core serves as a light guide . At this time, at least a part of the joined body is preferably made of a polymer material. By using an organic polymer material as the material of the optical waveguide, the manufacturing process of the optical waveguide can be simplified. For example, when a UV (ultraviolet) curable organic material is used, film formation by spin coating or the like and core processing by photolithography are possible, and an optical waveguide can be manufactured with inexpensive manufacturing equipment and low manufacturing cost.

The other optical component may be a light emitting element, a light receiving element, an optical fiber, or a planar optical waveguide.

  Next, a preferred embodiment of the present invention will be described specifically and in detail with reference to the drawings.

  In the present embodiment, the optical waveguide and the first support are joined to form the composite, the optical waveguide and the second support are in surface contact, and the first support relative to the second support is formed. An example of an optical coupling device in which the contact surface is formed at a position away from one end face of the optical waveguide by a predetermined distance and the manufacturing process thereof will be described with reference to FIGS.

  FIG. 2 is a plan view (a) and a cross-sectional view (b) of a composite 10 of the support 1 and the optical waveguide 2 as the first support. The support 1 is a substrate made of, for example, silicon, the optical waveguide 2 is a joined body of the clad 3 and the core 4, and the core 4 serving as a light guide is sandwiched between the lower clad and the upper clad. Yes. Although FIG. 2 shows an example in which four cores 4 are juxtaposed, the present invention is not limited to this, and the number of cores 4 included in the optical waveguide 2 may be single or plural.

  The material of the support 1 may be a glass substrate or a ceramic substrate other than a silicon substrate, but a semiconductor substrate, particularly a silicon substrate, is preferable because it can be processed by a semiconductor processing technique.

  Each layer of the lower clad, the core and the upper clad of the optical waveguide 2 is formed, for example, by sequentially laminating known polymer materials having different refractive indexes and patterning the core material. The refractive index of the core 4 is larger than the refractive index of the cladding 3, and the relative refractive index difference Δn is, for example, 0.8%. The cross section of the core 4 is a square of 40 μm × 40 μm, for example.

  One end face 5 of the optical waveguide 2 is formed on a reflection surface inclined at approximately 45 degrees with respect to the main surface of the optical waveguide 2, and light is transmitted through the reflection of the inclined reflection surface 5. An optical coupling is formed with the optical element 14 which is guided to the inside or the outside and is arranged so as to face the outside as described below.

  FIG. 1 shows the alignment of the optical waveguide 2 and the mounting substrate 11 by contact between the support 1 and the mounting substrate 11 as the second support, and the light emitting or receiving portion of the optical element 14 and the optical waveguide. A mechanism for realizing accurate optical coupling with the core 4 will be described. 1A is a cross-sectional view showing a state of the optical coupling device before contact, and FIGS. 1B and 1C are cross-sectional views showing a state where optical coupling is formed by contact. It is a top view (c). In addition, sectional drawing is sectional drawing in the position of the 1A-1A line | wire of a top view (c).

  As shown in FIG. 1A, the mounting substrate 11 has an optical waveguide support surface 12 that holds the optical waveguide 2, a recess 13 for fixing the optical element 14, and a contact surface 15 with the support 1. Is provided. As shown in FIG. 1B, in a state where optical coupling is formed, the optical waveguide 2 is held with the main surface on the mounting substrate 11 side in contact with the optical waveguide support surface 12, and the optical element 14 is recessed. The distance between the optical waveguide 2 and the optical element 14 in the height direction in FIG. 1B is controlled by the depth of the recess 13.

  At this time, if the optical element 14 is a light emitting element, the light incident on the inclined reflecting surface 5 from the light emitting portion of the light emitting element is reflected by the inclined reflecting surface 5 and guided into the core 4. When the optical element 14 is a light receiving element, the light propagating through the core 4 is reflected by the inclined reflecting surface 5 and guided to the light receiving portion of the light receiving element 14. This has the advantage that a surface-emitting light-emitting element having a light-emitting portion on the upper surface or a surface-receiving light-receiving element having a light-receiving portion on the upper surface can be used. For example, VCSEL (light emitting area size is 10 μm, for example) and surface-emitting LEDs are easy to manufacture, inexpensive, abundant in a variety of commercially available products, excellent in high frequency characteristics, easy to modulate, and easy to mount Easy. In addition, light receiving elements such as photodiodes are mainly surface light receiving elements, and are easy to mount.

  Further, as shown in FIG. 1B, the contact surface 6 of the support 1 is formed at a position separated from the one end surface 5 of the optical waveguide 2 by a predetermined distance 21. The optical element 14 is fixed at a position away from the contact surface 15 of the mounting substrate 11 by a predetermined distance 22. Therefore, accurate alignment between the optical waveguide 2 and the optical element 14 in the left-right direction in FIG. 1 is achieved by contact (butting) between the contact surface 6 of the support 1 and the contact surface 15 of the mounting substrate 11. Is done.

  Further, if the contact portion 23 between the contact surface 6 and the contact surface 15 is sufficiently widened, the angle deviation between the support 1 and the mounting substrate 11 is corrected by the contact.

  FIG. 3 is a flowchart showing a process of manufacturing the composite 10 of the support 1 and the optical waveguide 2. In addition, this figure is sectional drawing in the same position as sectional drawing of FIG.

  First, as shown in FIG. 3A, the lower clad, the core 4 and the upper clad of the optical waveguide 2 are coated on the substrate 31, for example, by applying known polymer materials having different refractive indexes by spin coating or the like. Then, it is cured by ultraviolet irradiation or heating, and sequentially laminated, and the core material is patterned.

  Next, as shown in FIG. 3 (b), a 45 ° oblique process is performed by dicing with a V-shaped blade, and one end face 5 of the optical waveguide 2 is formed on an inclined reflective surface. Further, the other end face is cut with a normal blade.

  Next, as shown in FIG. 3C, the optical waveguide 2 is peeled off from the substrate 31 and bonded to the base material 32 of the support 1. The adhesive used at this time may be either thermosetting or ultraviolet curable.

  Next, as shown in FIGS. 3C and 3D, the base material is cut at a predetermined distance 21 from one end surface 5 of the optical waveguide 2, and the contact surface 6 with the mounting substrate 11 is obtained. The composite body 10 is formed by processing the support body 1 having the following. At this time, it is possible to form the contact surface 6 with an accuracy of ± several μm by cutting while detecting the edge 5a of one end surface 5 by image observation using a CCD (Charge Coupled Device) camera and a microscope. it can.

  The contact surface 6 can be formed by cutting and then subjected to an etching process to improve dimensional accuracy or to be processed into a stepped shape.

  On the other hand, although not shown in the figure, the mounting substrate 11 is manufactured by forming the optical waveguide support surface 12, the concave portion 13, and the contact surface 15 in contact with the support 1 by etching on a semiconductor substrate such as a silicon substrate.

  Next, as shown in FIG. 1B, the optical element 14 is fixed at a position away from the contact surface 15 by a predetermined distance 22 in the recess 13 of the mounting substrate 11. Thereafter, the support 1 and the mounting substrate 11 are brought into contact with each other at the contact surfaces 6 and 15 to complete the production of the optical coupling device.

  FIG. 4 is a cross-sectional view (a) and a plan view (b) showing another example of the optical coupling device based on the present embodiment. In this optical coupling device, the contact portion 23 and the contact portion are provided on the support 1 and the mounting substrate 16 by providing two contact surfaces 6 and 7 and contact surfaces 15 and 17 that intersect each other. This is an example in which the alignment in the depth direction of FIG. 4 can be performed in addition to the left-right direction by the contact in the two regions of 24.

  In actual alignment, for example, first, the support 1 is moved in the left-right direction, the contact surface 6 is brought into contact with the contact surface 15, the alignment in the left-right direction in FIG. Is moved in the depth direction along the contact surface 15 to bring the contact surface 7 into contact with the contact surface 17 to perform alignment in the depth direction. As described above, the alignment in the two-dimensional direction is performed only by repeating the contact twice, and when the alignment in the height direction by adjusting the depth of the concave portion 13 described above is performed, the complete alignment in the three-dimensional direction is performed. Thus, optical coupling between the optical waveguide core 4 and the light emitting or receiving portion of the optical element 14 is realized.

  Similarly, a contact surface can be provided also in the height direction, and alignment in the height direction can also be performed by contact.

  As described above, according to the present embodiment, due to the contact between the support 1 and the mounting substrate, the displacement in the surface direction parallel to the mounting substrate surface, the displacement in the height direction perpendicular to the mounting substrate surface. Alternatively, at least one alignment of angular misalignments can be performed. In addition, complete alignment in the three-dimensional direction can be easily performed by repeating the alignment.

  According to this method, the alignment operation is simple because only the contact portions are brought into contact with each other. In addition, if the contact is performed over a sufficiently wide area, high-accuracy alignment can be realized regardless of the precision of manufacturing the details as long as the position accuracy of the entire contact portion is maintained. . Therefore, the optical coupling between the optical waveguide and the optical element can be easily formed with good productivity and yield, at low cost, and with high accuracy.

  Since the mechanical strength of the inclined end face of the optical waveguide is generally weak, it is difficult to align the optical waveguide by directly contacting the inclined end face portion. Since this embodiment can be positioned without applying a mechanical load to the optical waveguide, it can also be applied to an optical waveguide having an inclined end face, and is excellent in long-term reliability. Further, for example, even when the configuration of the optical waveguide is changed, for example, the number of channels configuring the optical waveguide is increased, the same structure can be used.

  As mentioned above, although this invention was demonstrated based on embodiment, this invention is not limited to these examples at all, and can be suitably changed in the range which does not deviate from the main point of invention.

  The optical coupling device of the present invention is suitably used in optical wiring applicable to various places such as between electronic devices, between boards in electronic devices or between chips in a board, and is small, low cost, and high in cost. It can contribute to the construction of high performance optical transmission / communication systems.

Sectional drawing before contact | abutting of an optical coupling device explaining the mechanism which aligns with the optical waveguide 2 and the mounting substrate 11 by contact | abutting with the support body 1 and the mounting board | substrate 11 based on embodiment of this invention ( It is sectional drawing (b) and a top view (c) after contact | abutting. Similarly, the AA line sectional view (a) of the optical coupling device, which is a plan view (a) and a sectional view (b), of the composite 10 of the support 1 and the optical waveguide 2 as the first support, and It is a BB sectional view (b). FIG. 6 is a flowchart showing a manufacturing process of the composite 10 of the support 1 and the optical waveguide 2. It is sectional drawing (a) and a top view (b) which show the other example of an optical coupling device same as the above. An optical module device using a substrate with an optical waveguide disclosed in Patent Document 1 It is a top view which shows the example of the optical coupling structure currently disclosed by patent document 2 by which position alignment is performed by contact | abutting (abutment).

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Support body, 2 ... Optical waveguide, 3 ... Cladding, 4 ... Core, 5 ... One end surface,
5a ... edge of one end face, 6, 7 ... abutting surface, 10 ... composite, 11 ... mounting substrate,
12 ... Optical waveguide support surface, 13 ... Recess, 14 ... Optical element, 15, 17 ... Contact surface,
16 ... Mounting board, 21, 22 ... Predetermined distance, 23, 24 ... Contact part, 31 ... Board,
32 ... Base material of support 1, 101 ... Substrate, 102 ... Optical waveguide, 103 ... Optical element,
104 ... Other substrate, 105 ... Optical fiber, 106 ... Projection, 107 ... Fitting hole,
108: optical fiber fitting groove, 111: clad, 112: core, 114: optical waveguide,
115: Semiconductor optical device, 116: End face of semiconductor optical device,
117: Light incident or exit end face of semiconductor optical device, 118 ... Optical waveguide end face,
119 ... Optical waveguide material end face, 120 ... Predetermined distance, 121 ... Optical element side marker,
122 ... Substrate side marker

Claims (8)

The optical waveguide and the upper part of the optical waveguide are coupled to each other so that one end surface of the planar optical waveguide having the core as a light guide and the other optical component is optically coupled. A composite body in which the first support body positioned is integrated and a second support body on which the other optical component is mounted are disposed, and the first support body and the second support body are brought into contact with each other. The optical waveguide and the other optical component are aligned by this contact, an optical coupling device,
The optical waveguide is held in surface contact on the second support,
The first support and the second support are brought into contact with each other at a position higher than the holding surface,
A contact surface of the first support with respect to the second support is formed at a position advanced by a predetermined distance from the one end surface of the optical waveguide in the length direction of the optical waveguide,
The other optical component is mounted such that the front end is located at a position retracted by a predetermined distance from the contact surface of the second support with respect to the first support in the length direction of the optical waveguide. Yes,
Optical coupling device. 2. The contact surfaces on which the first support body and the second support body contact each other in a direction orthogonal to the length direction of the optical waveguide are formed on both of the support bodies, respectively. Optical coupling device. Said second recess is formed in the support member, the light emitting or receiving element is said other optical component to a predetermined position in this recess is fixed, the optical coupling device according to claim 1 or 2.   The one end face of the optical waveguide is formed on an inclined reflection end face, and is configured to guide light to the inside or the outside of the optical waveguide through reflection by the inclined end face, and the other optical component The optical coupling device according to claim 3, wherein the optical coupling is performed. The other end face of the optical waveguide is formed on an inclined reflection end face, and is configured to guide light to the outside or the inside of the optical waveguide through reflection by the inclined end face, and further with another optical component. The optical coupling device according to claim 1 , 2 or 4, wherein optical coupling is performed. Said complex is detachably attached to the second support member, the optical coupling device according to claim 1 or 2. At least partially made of polymer material, the optical coupling device according to claim 1 or 2 of the joint body. The optical coupling device according to claim 1, wherein the other optical component is a light emitting element, a light receiving element, an optical fiber, or a planar optical waveguide.

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