JP4238814B2 - Substrate holding apparatus, bonding material printing apparatus and printing method - Google Patents

Description

  The present invention supports a substrate on a component mounting side surface on which a plurality of components are mounted, and enables the work to be performed on a work side surface that is a surface facing the component mounting side surface of the substrate. The present invention relates to a substrate holding device for holding a supporting posture, and a bonding material printing apparatus and a printing method for printing a bonding material as the above-described operation.

  An electronic circuit formed by mounting electronic components, which are a plurality of components, on a substrate is required to be highly integrated in accordance with the high performance and miniaturization of electronic devices incorporating such electronic circuits. In order to effectively use the surface area of the substrate, so-called double-sided mounting, in which the respective electronic components are mounted on both sides of the substrate, has been performed in recent years.

  In mounting such electronic components, a solder paste, which is a bonding material, is printed on a component mounting position of a substrate (printed wiring board), and then the electronic component is placed at the component mounting position. A hot air reflow method is generally used in which the mounting is performed by melting and soldering the solder paste by blowing hot air or the like.

  In addition, in the case where the double-side mounting is performed, a solder paste is printed on one surface of the substrate by means of screen printing or the like, and each electronic device is connected via the solder paste. After mounting the respective electronic components on the one surface by arranging the components and performing reflow, the respective electronic components are mounted on the other surface by the same procedure. Will be.

  Here, in the case of performing such double-sided mounting, a schematic explanatory diagram of the conventional solder paste supply method for the other surface, that is, the procedure of the conventional screen printing method is shown in FIGS. The above procedure will be described with reference to FIG.

  First, in FIG. 7A, a board 502 on which an electronic component 501 is mounted on one surface is opposed to the other surface by the conveyor rails 503a and 503b of the belt conveyor with the one surface facing downward. The state which the edge part to support is supported and is conveyed to the printing position is shown.

  Thereafter, as shown in FIG. 7B, at the printing position A, the support block 504 for supporting the substrate 502 is on standby by supporting the lower surface of the substrate 502, and further above the support block 504. The screen 506 whose periphery is supported by the screen frame 505 is waiting. In the printing position A in such a state, the substrate 502 supported by the respective transport rails 503a and 503b is transported between the screen 506 and the support block 504.

  When this conveyance is performed, as shown in FIG. 7C, the support block 504 is raised, and the lower surface of the substrate 502 is supported by the support block 504, and the supported substrate 502 is raised. The raised substrate 2 is brought into a state in which the upper surface thereof is in contact with the plate surface portion of the screen 506, and thereafter, the rising of the support block 504 is stopped and the contact state is maintained. Note that a plurality of electronic components 501 are mounted on the lower surface of the substrate 502, but a recess 550 is formed on the upper surface of the support block 504 according to the mounting position and shape of each electronic component 501. Thus, the substrate 502 can be reliably supported by the support block 504.

  After that, as shown in FIG. 7C, the screen 506 in contact with the upper surface of the substrate 502 is rubbed with the squeegee device 507, and the solder paste 508 is supplied to the substrate 502 through the screen 506. By doing so, the solder paste is printed.

  Here, a schematic plan view of the one surface (that is, the lower surface) of the substrate 502 is shown in FIG. As shown in FIG. 8, the substrate 502 has a substantially rectangular shape, and a long hole portion 509 is formed along the inside of the substantially rectangular outline. The elongated hole portion 509 is formed so that the product portion 510 and the contour portion 511 (generally, in order to easily break the product portion 510 (electronic circuit) inside from the contour portion 511 after the mounting of the electronic component 501 is completed. , Which is referred to as a “mimi part”) to form a plurality of thin coupling parts 512. A region surrounded by each of the long hole portions 509 is a component mounting region (product portion 510), and a plurality of electronic components 501 are mounted in the component mounting region 510.

Further, as shown in FIG. 8, the end regions 513a and 513b in the vertical direction shown in the figure are regions supported by the conveyor rails 503a and 503b of the belt conveyor shown in FIG. 7A.
JP-A-4-97587 JP 2003-258419 A

  In recent years, high-density mounting of electronic components 501 on the substrate 502 has been progressing, and the number of electronic components 501 mounted on the substrate 502 has increased, and various shapes and sizes of the respective electronic components 501 mounted have increased. Diversified. Further, in the support block 504 having the above-described structure, it is necessary to form the recesses 550 in accordance with the shape and size of each electronic component 501, and accordingly, the non-mounting regions 514a and 514b in the substrate 502 are formed. The location where the support surface 551 that supports 514c is formed also increases. However, when the operation such as the screen printing is to be performed reliably, the substrate 502 is required to be held substantially horizontally, but the support block 504 has such various sizes and shapes. The formation of the concave portions 550 and the large number of support surfaces 551 and the like has a problem that it becomes more difficult to support the substrate 502 substantially horizontally due to the processing accuracy and the like (see, for example, Patent Document 2). ).

  Further, in order to securely hold the substrate 502, a suction hole is formed in each (or any) support surface 551 of the support block 504, and the supported substrate 502 is sucked through the suction hole. There is also a support block that attempts to suck and hold the substrate 502 on each support surface 551. In addition, due to the demand for high-density mounting that has been increasingly advanced in recent years, the number of mounted electronic components 501 and the mounting density of the board 502 have increased, and the board 502 is brought into contact with and supports the board 502. The areas of the non-mounting regions 514a, 514b, and 514c, which are the regions, tend to be remarkably reduced. In such a case, it is difficult to form the suction holes on the respective support surfaces 551, and it is difficult to reliably suck and hold the supported substrate 502. is there.

Further, in order to support the holding of the substrate 502 on which such diversified electronic components 501 are mounted, a soft layer is formed on the upper surface (support surface) of the support block, and the abutted electronic components 501 are attached. It has also been devised that the substrate 502 is supported by the support block by deforming the soft layer (see, for example, Patent Document 1). However, such a technique is effective for a case where only the electronic component 501 having a relatively small thickness that can sufficiently deform the soft layer is mounted.
When the thickness of each electronic component 501 varies, for example, when some of the electronic components 501 protrude more than the other electronic components 501, the softness described above. There is also a problem that the layer cannot be sufficiently deformed and the substrate 502 cannot be reliably supported.

  In addition, there is a type in which the substrate 502 is held by sandwiching the opposite ends of the substrate 502 in the horizontal direction without using such a support block. By holding the substrate 502 that has been bent by mounting the respective electronic components 501 on the surface, the substrate 502 is further warped, and the substrate 502 is kept in a substantially horizontal state. There is also a problem that it is difficult to hold.

  Accordingly, an object of the present invention is to solve the above-described problem, in supporting the substrate on the component mounting side surface on which a plurality of components are mounted, and holding the supporting posture of the substrate. A substrate holding device that can securely hold the substrate even when the diversified parts are mounted on the substrate at a high density, and the held substrate. It is an object of the present invention to provide a bonding material printing apparatus and printing method for supplying printing material for bonding material.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the substrate is supported by the component mounting side surface on which a plurality of components are mounted, and the work is performed on the work side surface that is the surface facing the component mounting side surface of the substrate. In the substrate holding device that holds the support posture of the substrate,
A support surface for supporting the peripheral portion by contacting the peripheral portion on the component mounting side surface; and an adsorption hole formed on the support surface and for adsorbing the peripheral portion in the contact state. In addition, by supporting and adsorbing the peripheral portion, a substrate peripheral portion holding portion for holding the substrate is provided, and contact with the component mounting side surface and each component mounted on the component mounting side surface can be avoided. And a substrate holding block that forms a contact avoidance space substantially surrounded by the substrate peripheral portion support portion,
A board holding device comprising a board holding part installed in the abutting avoidance space having a board support part for supporting the non-mounting area by contacting the non-mounting area of the component on the component mounting surface. Use.

  Furthermore, a substrate holding device is used in which a component supporting portion that supports the surface of the component mounted on the component mounting side surface is provided in the substrate holding portion.

  Furthermore, a board holding device provided with a mechanism for adsorbing the surface of the component mounted on the component mounting side surface is used for the component support portion.

Furthermore, the substrate support portion is a support auxiliary dedicated portion that supplements the support function of the substrate by the substrate peripheral portion holding portion by supporting the non-mounting region,
The component support unit uses a substrate holding device which is a support unit that supplements the adsorption function of the substrate by the substrate peripheral unit holding unit by sucking the component.

  Furthermore, the component support part uses a substrate holding device whose height can be adjusted.

Further, the support surface of the substrate peripheral part holding part is provided with a first buffer part,
A substrate holding device provided with a second buffer part having a lower hardness than the first buffer part is used at the tip of the component support part.

A plurality of the component support portions for individually supporting the plurality of components mounted on the component mounting side surface;
The substrate holding device according to any one of claims 2 to 6, wherein, in each of the component support portions, the height position of the support tip is determined according to the height position of the suction target surface of the component to be sucked. Use the device.

  Further, the suction hole provided in the substrate peripheral part holding part uses a substrate holding apparatus having a groove-shaped opening formed along the peripheral part.

  Further, the component support portion is the second buffer portion, and the suction formed of a rubber material that is elastically deformable by contact with the component according to a mounting position shift of the surface to be sucked of the component. A substrate holding device which is a suction pad portion having a tip is used.

Further, the substrate holding device according to any one of the above,
A bonding material supply unit comprising a bonding material supply unit that prints and supplies the bonding material of each of the components as the work to the work side surface of the substrate held by the board holding device. Use a printing device.

While supporting the substrate on the component mounting side surface on which a plurality of components are mounted and holding the support posture of the substrate, the work side surface of the substrate facing the component mounting side surface In the bonding material printing method for printing and supplying the bonding material,
While supporting the peripheral portion on the surface of the component mounting side and adsorbing the peripheral portion while avoiding contact with the respective components mounted on the surface of the component mounting side,
At the same time, the non-mounting area of each of the components near the center of the component mounting surface is supported to supplement the support of the substrate, and the surface of the component mounted on the component mounting surface is adsorbed. While maintaining the adsorption of the substrate, hold the support posture of the substrate,
In the holding state, a printing method for the bonding material is used, in which the printing material is supplied to the working surface of the substrate.

  According to the first aspect of the present invention, in the substrate holding device, in addition to the substrate peripheral portion holding portion that holds the substrate by supporting and adsorbing the peripheral portion of the component mounting side surface of the substrate, By supporting a non-mounting region disposed near the center of the component mounting side surface of the substrate, the substrate support portion supplementing the support of the substrate by the substrate periphery holding portion, and the above by the substrate periphery holding portion By providing a component suction part that supplements the suction of the substrate, the component mounting side surface of the substrate on which each of the components is mounted with high density is reliably supported and the supporting posture is maintained. Thus, the substrate can be securely held.

  In particular, when the respective components are mounted with high density in this way, the area of the peripheral portion itself, which is a region where the respective components are not mounted on the component mounting side surface of the substrate. Thus, the substrate cannot be reliably and sufficiently held only by the support and suction of the peripheral portion by the substrate peripheral portion holding portion. Therefore, the substrate support portion and the component suction portion perform the support and suction in the inner region surrounded by the peripheral portion, thereby supplementing the support and suction by the substrate peripheral portion holding portion and ensuring the substrate. Retention can be realized.

  Specifically, particularly when each of the components is mounted with high density as described above, the region surrounded by the peripheral portion on the component mounting side surface of the substrate is in contact with Therefore, the area where the support can be performed (that is, the non-mounting area) is remarkably reduced. However, even in such a case, the surface area of the support surface of the substrate support portion is reduced by providing only the support function by contact without providing the substrate support portion with an adsorption function, and Support is feasible.

  In addition, since the substrate holding block that supports the periphery of the substrate and the substrate holding portion that supports the inside of the substrate are divided, when the type of the substrate is changed, it can be replaced separately.

According to the second aspect of the present invention, since the position of the substrate support portion can be changed,
Even if the type of the substrate changes, it is not necessary to re-create the substrate holding block. It can be handled on site. There is no need to have extra blocks.
The effect of the first aspect can be clearly realized.

  According to the third aspect of the present invention, since the substrate holding device provided with the component supporting portion for supporting the surface of the component mounted on the component mounting side surface is used for the substrate holding portion. The effect according to the first aspect can be clearly realized.

According to the fourth aspect of the present invention, the position of the component support portion can be changed.
Even if the type of the substrate changes, it is not necessary to re-create the substrate holding block. It can be handled on site. There is no need to have extra blocks.

  According to the fifth aspect of the present invention, since the substrate holding device provided with a mechanism for adsorbing the surface of the component mounted on the component mounting side surface is used for the component support portion, Therefore, it is possible to suppress the bending of the substrate in the vicinity of the substantially center and to hold the substrate while maintaining a substantially horizontal state, and it is possible to clearly realize the effect of the first aspect.

  According to the 2nd and 3rd aspect, it replaces with the said board | substrate support part, and the said component support part is supplemented by adsorb | sucking and supporting a board | substrate. That is, by sucking the surface of the component by the component support portion, the substrate can be sucked and held via the component.

  Therefore, in the substrate, the peripheral portion on which the respective components are not mounted is sucked and held by supporting and sucking the substrate peripheral portion holding portion, and supported and sucked by the substrate peripheral portion holding portion. Then, it is possible to realize the reliable holding of the substrate by supplementing each of the deficiencies into a support function and a suction function by the substrate support part and the component support part. .

  Accordingly, it is possible to reliably suck and hold the component mounting side surface as the support side surface with respect to the board on which the components are mounted on both sides with high density. It is possible to reliably perform a predetermined operation on the side surface.

According to the fourth aspect of the present invention, the substrate support portion is a support auxiliary dedicated portion that supplements the support function of the substrate by the substrate peripheral portion holding portion by supporting the non-mounting region. And
Since the component support unit uses a substrate holding device that is a support unit that supplements the adsorption function of the substrate by the substrate peripheral unit holding unit by sucking the component, the component support unit is brought into contact with the surface of the substrate or the component. As a result, the adsorption function can be further enhanced.

  Further, according to the fifth aspect of the present invention, since the component support portion is a substrate holding device whose height is adjusted, the suction and retention of the respective components can be reliably and satisfactorily performed. The effect by the aspect can be clearly realized.

  According to the sixth aspect of the present invention, since the second buffer portion having a lower hardness than the first buffer portion is provided at the tip of the component support portion, the substrate is further flattened. The effect by the said 1st aspect can be implement | achieved clearly. Further, by providing the second buffer portion as described above, it is possible to prevent the occurrence of damage to the component that is sucked and held, and the displacement of the suction holding position due to the mounting position shift of the component. Can be absorbed flexibly, and the effect of the first aspect can be clearly realized.

  According to the seventh aspect of the present invention, since the substrate holding device that restricts the holding height position of the component by the component support portion is used, the suction function of the component suction portion is more reliably exhibited. And the effects of the first aspect can be clearly realized.

  According to the eighth aspect of the present invention, since the suction hole provided in the substrate peripheral part holding part uses a substrate holding apparatus having a groove-shaped opening formed along the peripheral part, It is possible to reliably hold the substrate while keeping the substrate in a substantially horizontal state, and the effect of the first aspect can be clearly realized.

  According to the ninth aspect of the present invention, the component support portion can be elastically deformed by contact with the component as the second buffer portion, depending on the mounting position deviation of the surface to be sucked of the component. Since the suction pad portion is formed of a rubber material and has the suction tip, the component can be reliably held and the effect of the first aspect can be clearly realized.

  According to the tenth aspect of the present invention, the work performed on the work-side surface of the substrate is printing supply of a bonding material, so that the substrate can be reliably held by the substrate holding device. It becomes effective. In particular, in a substrate on which such high-density mounting is performed, printing of the bonding material is required to be performed with higher accuracy. However, such a substrate is placed in a substantially horizontal state by the substrate holding device. The above-mentioned printing supply with high accuracy can be performed by securely holding it while maintaining it.

  According to the eleventh aspect of the present invention, in the printing method in which the bonding material is printed and supplied while maintaining the support posture of the substrate, the contact with each component mounted on the component mounting side surface is avoided. While supporting the peripheral portion on the surface of the component mounting side and adsorbing the peripheral portion, and supporting the non-mounting area of each component in the vicinity of the approximate center of the surface of the component mounting side, While supplementing the support of the substrate and adsorbing the surface of the component mounted on the surface of the component mounting side to compensate for the adsorption of the substrate, the support posture of the substrate is maintained, thereby high density By reliably supporting the component mounting side surface of the substrate on which the respective components are mounted and holding the supporting posture, the substrate can be reliably held.

  In particular, when the respective components are mounted with high density in this way, the area of the peripheral portion itself, which is a region where the respective components are not mounted on the component mounting side surface of the substrate. Thus, the substrate cannot be reliably and sufficiently held only by the support and suction of the peripheral portion. Therefore, by performing the support and suction in the inner region surrounded by the peripheral portion, it is possible to supplement the holding of the substrate by the support and suction of the peripheral portion, and to realize reliable substrate holding.

  Accordingly, it is possible to reliably suck and hold the component mounting side surface as the support side surface with respect to the board on which the components are mounted on both sides with high density. It becomes possible to reliably supply the printing supply of the bonding material to the side surface.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a schematic perspective view showing an external appearance of a screen printing apparatus 101 which is an example of a bonding material printing apparatus including a substrate holding apparatus according to the first embodiment of the present invention.

  As shown in FIG. 1, the screen printing apparatus 101 supports a substrate 2 on a component mounting side surface on which electronic components that are a plurality of components are mounted, and a surface of the substrate 2 that faces the component mounting side surface. The substrate holding device 50 that holds the support position of the substrate with respect to the work side surface, and the work side surface (that is, the upper surface) of the substrate 2 held by the substrate holding device 50 As a work, a configuration for providing cream solder (solder material), which is an example of a bonding material, by screen printing (an example of a bonding material supply unit) is provided. As a configuration for performing the screen printing, a screen 52 for performing screen printing, a screen 52 disposed on the work side surface of the substrate 2, and a squeegee for supplying cream solder via the screen 52 (illustrated). And a head moving device 53 that moves the squeegee along the screen 52 by moving the print head 51 in a substantially horizontal direction. It has been.

  Since the screen printing apparatus 101 has such a configuration, the print head 51 or the like has a shape and arrangement that matches the plate surface of the screen 52 with respect to the upper surface of the substrate 2 held by the substrate holding apparatus 50. It is possible to supply cream solder.

  Next, FIG. 2 shows a plan view of the component mounting side surface of the substrate 2 handled by the screen printing apparatus 101. FIG.

  Here, the substrate 2 is a substrate on which an electronic circuit is formed by mounting a plurality of electronic components on both surfaces thereof, that is, a so-called double-side mounting substrate. A substrate 2 shown in FIG. 2 has a component mounting side surface S as one of the two surfaces of the double-side mounting substrate, and a plurality of electronic components 1 are mounted on the component mounting side surface S. The electronic component 1 is not yet mounted on the other surface. FIG. 2 shows a schematic plane with the component mounting side surface S on which each electronic component 1 is mounted as an upper surface. Although not shown in FIG. 2, each electronic component 1 is finally mounted on the surface of the substrate 2 facing the component mounting side surface S (that is, the back surface of the component mounting side surface S). However, for this mounting, the surface of the working side to which cream solder is supplied by the screen printing apparatus 101 is provided.

  As shown in FIG. 2, the substrate 2 has a substantially square shape, and a plurality of long hole portions 9 are formed so as to penetrate the substrate 2 along the outer peripheral contour thereof. These elongated holes 9 are formed as described above, with the inner region surrounded by each elongated hole 9 as a product part after the electronic circuit 1 is formed and the electronic circuit is formed on the substrate 2. It is provided for breaking and separating from the outer peripheral contour portion. On the component mounting side surface S, the inner region surrounded by each long hole portion 9 is a component mounting region R1, and the outer region of each long hole portion 9 is an outer peripheral region R2. Further, in order to facilitate the above-mentioned breakage, a plurality of thin holes connecting the portion of the substrate 2 corresponding to the component mounting region R1 and the portion corresponding to the outer peripheral region R2 are provided between the respective long hole portions 9. A connecting portion 12 is formed. Therefore, the product parts can be separated by breaking these connecting parts 12.

  In addition, as shown in FIG. 2, electronic components 1 of various shapes are densely mounted on the component mounting side surface S of the substrate 2. Such an electronic component 1 can be roughly divided into two types. For example, a chip component 1A which is a small electronic component 1 such as a resistor or a capacitor, and a larger size than such a chip component 1A. The electronic component 1 can be divided into an IC component 1B that requires a relatively large mounting area in the component mounting region R1.

  Further, as shown in FIG. 2, a positioning hole 3 for positioning the supplied substrate 2 in the screen printing apparatus 101 is formed in the outer peripheral region R <b> 2 of the substrate 2 so as to penetrate the substrate 2. For example, the positioning holes 3 are formed in the vicinity of the left and right ends of the outer peripheral region R2 on the lower side in the figure.

  In the component mounting region R1 of the board 2, there is a large region R3 where the electronic component 1 is not mounted. In this region R3, the IC component 1B (or the chip component 1A in addition to the IC component 1B) is provided. ) Is an area to be selectively mounted, and the IC component 1B can be mounted according to the type and specification of the substrate 2. The substrate 2 shown in FIG. 2 shows that the IC component 1B is not selectively mounted in this region R3.

  In addition, as the board | substrate 2 used in this embodiment, for example, it is a board | substrate mounted in a video camera or a digital camera, and since it is incorporated in the electronic device reduced in size, maintaining a high function, many The electronic component is mounted on the both surfaces with high integration.

  Next, the configuration of the substrate holding device 50 provided in the screen printing apparatus 101 will be described in detail. First, a schematic cross-sectional view schematically showing a state in which the substrate holding device 50 holds the substrate 2 is shown in FIGS. 3 (a) and 3 (b). 3A shows a cross-sectional view, and FIG. 3B shows a top view. As shown in FIG. 3A, the substrate holding device 50 supports the substrate 2 and sucks the supported substrate 2 to suck and hold the support position, and the substrate holding block 21. A vacuum suction device 22 (which is an example of a suction device) that performs the above suction by the holding block 21 is provided. The substrate holding block 21 is configured such that the component mounting side surface S of the substrate 2 arranged with the component mounting side surface S facing downward in the drawing and the work side surface T facing upward in the drawing, and the upper surface thereof partially abut, The substrate 2 is held.

  As shown in FIG. 3A, the substrate holding block 21 has a substantially rectangular parallelepiped shape, and a concave portion 24 is formed on the upper surface of the substrate holding block 21 on the inner side surrounded by a peripheral portion. Further, as shown in FIG. 3B, the substrate holding block 21 is a portion that forms the outer peripheral end portion of the concave portion on the peripheral portion on the upper surface thereof, and holds the substrate 2 by contacting the substrate 2. A plurality of substrate peripheral portion holding portions 23 which are examples of the substrate peripheral portion holding portion for performing the above are provided. Each board peripheral part holding part 23 is formed so that the upper surface thereof as a support surface 23 a matches the arrangement of the outer peripheral region R <b> 2 on the component mounting side surface S of the board 2. By disposing the substrate 2 with the component mounting side surface S facing downward, the respective support surfaces 23a can be surely brought into contact with the outer peripheral region R2.

For example, as in the present embodiment, in the substrate 2, when the outer peripheral region R2 is formed so as to have substantially the same height position, the respective support surfaces 23a are also formed at the same height position. By arranging the respective substrate peripheral portion holding portions 23 in this way, even when the substrate holding block 21 supports the substrate 2, the respective substrate peripheral portion holding portions 23 and the respective substrates mounted on the substrate 2 are supported. The electronic component 1 is not brought into contact with each other. The substrate holding block 21 has a size of about 100 mm × 70 mm × 30 mm, for example.

  In addition, the substrate peripheral portion holding portion 23 is not formed in a portion where each positioning hole 3 of the substrate 2 is disposed. This is because the positioning of the substrate 2 and the substrate holding device 50 is performed by inserting a positioning pin or the like (not shown) into each positioning hole 3, so that the positioning pin and each substrate peripheral portion holding portion 23 are aligned. This is to prevent interference. In the substrate holding block 21 shown in FIGS. 3B and 4B, the portions where this interference is prevented are the lower left and lower right portions in the figure.

  In the present embodiment, a case where a plurality of substrate peripheral portion holding portions 23 are formed in the substrate holding block 21 will be described. However, the present invention is not limited to such a case. Instead of such a case, for example, it may be a case where one substrate support portion formed so as to be integrally continuous along the upper surface peripheral portion of the substrate holding block 21 may be provided. This is because if the portion corresponding to the outer peripheral region R2 of the substrate 2 can be reliably supported, it can have a function as a substrate support portion.

  Further, as shown in FIG. 3B, suction holes 23b for sucking the outer peripheral region R2 of the substrate 2 in the abutting state are formed on each support surface 23a. An opening portion on the support surface 23a in each suction hole 23b is formed so as to have a substantially groove-shaped opening so as to extend along the longitudinal direction of each support surface 23a in order to secure the suction area. Has been. Although the substrate peripheral portion holding portion 23 arranged at the left end shown in FIG. 3 supports the right end portion of the substrate 2 shown in FIG. 2, the outer peripheral region R2 is hardly arranged at the right end portion. Therefore, the support surface 23a of the substrate peripheral portion holding portion 23 at the left end is formed narrower than the other support surface 23a. In such a case, it may be difficult to form the suction hole 23b in the support surface 23a. However, as shown in FIG. 3B, the suction in the vicinity of the lower end of the support surface 23a in the figure. This can be dealt with by forming the suction hole 23b only in the region where the hole 23b can be formed.

(Explanation of Sasae 25)
In the substrate holding block 21, a substrate holding portion 251 is disposed on the inner side. The substrate holding portion 251 is fixed inside the recess 24, and the holding portion 251 is an example of a substrate supporting portion that supports the substrate 2 in a state of being supported by the respective substrate peripheral portion holding portions 23 in an auxiliary manner. An auxiliary support portion 25 (or an example of a support auxiliary dedicated portion) is provided. Specifically, this non-mounting is performed by contacting the non-mounting region R4 of each electronic component 1 (ie, the region where the electronic component 1 is not mounted) in the vicinity of the approximate center of the component mounting side surface S of the substrate 2. An auxiliary support portion 25 that supports the region R4 is provided. In the board 2 shown in FIG. 2, for example, four non-mounting regions R4 (hatched regions in FIG. 2) are arranged in the vicinity of the periphery of the IC component 1B mounted in the vicinity of the center of the component mounting region R1. As shown in FIG. 4, four auxiliary support portions 25 are provided so as to match each non-mounting region R4. The number of the auxiliary support portions 25 to be installed is determined according to the arrangement of the respective electronic components 1 on the component mounting side surface S of the substrate 2, and a plurality of auxiliary support portions 25 are provided. Instead of such a case, only one auxiliary support portion 25 may be provided. In addition, when providing the some auxiliary | assistant support part 25, it is preferable to arrange | position each auxiliary | assistant support part 25 at a substantially equal space | interval. This is because the auxiliary support state in the component mounting region R1 can be made substantially uniform by arranging in this way. In addition, each auxiliary support portion 25 is formed so as not to come into contact with each mounted electronic component 1. Each auxiliary support portion 25 is positioned so that the end portion is positioned at a predetermined distance, for example, about 0.5 mm, from the end portion of the electronic component 1 disposed in the vicinity of each auxiliary support portion 25. The arrangement of has been determined. In this way, the predetermined distances are separated from each other in consideration of misalignment when the substrate 2 is held on the substrate holding device 50, misalignment of the mounting positions of the respective electronic components 1, and the like. Each auxiliary support portion 25 is prevented from coming into contact with the electronic component 1 even when a deviation occurs.

  Although the external shape of the board is not changed, the arrangement of components is often changed. In this case, the substrate holding block 21 can be changed without changing the substrate holding unit 251 alone. Further, if the auxiliary support portion 25 can be installed at a free position of the substrate holding portion 251, it is possible to cope with a change in the type of the substrate.

  Further, the substrate holding block 251 is formed in a mesh shape and is provided inside the substrate holding portion 25, and the auxiliary support portion 25 and the support pad portion 26 described later can be inserted, so that it is possible to immediately respond to the component arrangement of the substrate. If it is, it is even better. There is no need to process each block, and production is not delayed due to design and processing errors. At the site, the positions of the auxiliary support portions 25 and 26 can be adjusted.

(Pad 26)
Further, the substrate holding block 251 is provided with a support pad portion 26 that is an example of a component support portion that supports the substrate 2 in the above-described supporting state in an auxiliary manner (or an example of a suction assisting dedicated portion). The support pad portion 26 is made of rubber or the like, and supports the components of the board in an adsorbed state. Specifically, in the substrate 2 of FIG. 2, the surfaces of the IC components 1B arranged so as to be surrounded by the respective non-mounting regions R4 and the plurality of IC components 1B arranged around the IC components 1B are individually supported. Thus, the three support pad portions 26 that support the substrate 2 through these IC components 1B and supplement the suction holding by the suction holes 23b of the respective substrate peripheral portion holding portions 23 are provided. The number of the support pad portions 26 to be installed is determined in accordance with the arrangement, the number of mounted electronic components 1 on the component mounting side surface S of the substrate 2, and the like. Instead of such a case, it may be a case where only one support pad portion 26 is provided. In the case where a plurality of support pad portions 26 are provided, it is preferable that the support pad portions 26 are arranged at substantially equal intervals. That is, it is preferable to select the electronic component 1 to be picked up so that the electronic components 1 can be arranged at substantially equal intervals. By doing in this way, in component mounting area | region R1, the force which arises by auxiliary adsorption | suction can be disperse | distributed substantially uniformly, and it becomes possible to make an adsorption holding state favorable.

  Here, the arrangement of the auxiliary support portions 25 and the support pad portions 26 in the substrate holding block 21 will be described. As shown in FIG. 3 (a), it is desirable that the respective support pad portions 26 are arranged in a substantially uniform manner in order to transmit the support pads 26 to the substrate 2 in a state where the suction force is made more uniform. For example, in the case where three or more support pad portions 26 are arranged, the respective support pad portions 26 are not arranged on a substantially straight line, but the centers of the three support pad portions 26 are arranged. It is preferable to arrange them so that a virtual triangular plane is formed by tying. With such an arrangement, the adsorption force can be made more uniform. In addition, the shape of the support surface of each auxiliary support portion 25 is determined by the shape of the non-mounting region R4, but for more stable support, the support surface extends only in one direction. It is preferable not to have a shape but to have a shape that extends in directions substantially orthogonal to each other. Specifically, a substantially L-shaped shape as shown in FIG. Furthermore, it is more desirable that at least two or more auxiliary support portions 25 having a support surface having such a shape are arranged at positions substantially opposite to each other via the support pad portion 26. This is because more stable support can be realized by adopting such an arrangement.

(Description of support pad 26)
As shown in FIG. 4, each suction pad portion 26 is provided with a tip 26 c formed of a rubber material, for example, silicon rubber, which is an example of a buffer portion, at an upper tip of the suction pad portion 26 that is in contact with the IC component 1. I have. As described above, each of the support pad portions 26 is provided with the tip 26c formed so as to be flexible and elastically deformable at a portion in contact with the surface of the IC component 1, so that the surface of the IC component 1 can be securely connected. It can be made to abut against and reliably support. For example, the surface of the IC component 1 may be mounted in a state where the surface of the IC component 1 is slightly inclined with respect to the surface of the substrate 2 due to misalignment during mounting on the substrate 2 or the like. Further, there may be a case where a positional deviation occurs in the mounting height position of the attracted surface. In such a case, since the tip 26c is provided, the positional deviation can be absorbed by elastic deformation of the tip 26c, and reliable suction holding can be performed. Also, it plays a role of preventing the IC component 1 having a precise structure from being damaged by the above-mentioned suction holding. In addition, as for the magnitude | size of the suction tip 26c of each suction pad part, it is preferable that the diameter shall be 6 mm or more, for example. It is because it becomes possible to ensure sufficient adsorption power by setting it as such a magnitude | size.

(Description of FIG. 5)
Further, the mounting height position of the surface to be attracted of each IC component 1 </ b> B mounted on the substrate 2 is different for each IC component 1. Therefore, as shown in FIG. 5, in each support pad portion 26, the installation height position (suction tip height position) of the suction tip 26c matches the mounting height position of each IC component 1B. The thickness is adjusted individually. As described above, the installation height position of each suction tip 26c is adjusted according to the IC component 1B to be suction-held, so that reliable suction-holding can be realized by making contact with each other. . However, when the difference in height position of the surface to be attracted in each IC component 1B is slight, that is, when the difference in height position is within the range of elastic deformation of the suction tip 26c. In this case, as described above, it is possible to realize the reliable suction holding by installing at the same height position without changing the respective installation height positions.

(25 support groups)
In addition, by supporting and holding each IC component 1 by each support pad portion 26, a portion corresponding to the component mounting region R1 in the substrate 2 is drawn to each support pad portion 26. Since the substrate 2 is supported by the respective auxiliary support portions 25 in the vicinity of the portion 23, the holding height position of the substrate 2 in the vicinity of each support pad portion 26 can be regulated.

(Neighborhood rubber 27)
Further, as shown in FIG. 5, a buffer layer 27 formed of a rubber material, which is an example of a first buffer portion, is provided on the support surface 23 a of each substrate peripheral portion holding portion 23. For example, these buffer layers 27 can be formed with a thickness of about 0.5 mm using silicon rubber. Thus, by providing the buffer layer 27 on each support surface 23a, when each support surface 23a and the outer peripheral area | region R2 of the board | substrate 2 contact | abut, the buffer layer 27 is elastically deformed. The adhesion between the two can be improved, and more reliable contact and suction holding can be realized.

(Buffer layer 27)
In addition, the first buffer portion that forms the buffer layer 27 has a hardness higher than that of the buffer portion (the second buffer portion) that forms the support tip 26c of each support pad portion 26. It is high. This is due to the difference in the main functional purpose between the two, and the support pad tip 26c is required to be deformed more flexibly and securely contact the surface of the IC component 1B, whereas the buffer layer 27 is required. This is because it is required not only to securely adhere to the substrate 2 by deformation but also to support the adhered substrate 2. A buffer layer 27 is also provided on the support surface 25 a of each auxiliary support portion 25.

(Explanation of 9 and 23)
In addition, as shown in FIG. 2, in the board 2, each elongated hole portion 9 is provided between the component mounting region R <b> 1 and the outer peripheral region R <b> 2 for the purpose of facilitating separation between the two due to fracture. Is formed. Due to this structural feature, the substrate 2 has a characteristic of being easily bent at the respective long hole portions 9. Therefore, in order to cope with such characteristics and realize support in a state where the bending of the substrate 2 is reduced as much as possible, the component support portion 23 has a direction substantially orthogonal to the direction along the outer peripheral region R2 of the substrate 2. A projecting support surface 23c is formed so as to partially project along the outer periphery region R2 toward the component mounting region R1.

  Specifically, referring to FIG. 3, for example, the support surface 23 a of the component support portion 23 disposed in the upper center portion in the drawing is formed with a protruding support surface 23 c that protrudes downward in the drawing. The protruding support surface 23c crosses the long hole portion 9 from the outer peripheral region R2 of the substrate 2 and comes into contact with a partial region of the component mounting region R1 in the vicinity of the long hole portion 9, so that the component mounting region R1. We are supporting. Note that the electronic component 1 is not mounted in the partial region in the component mounting region R1, and is a non-mounting region. In the substrate holding block 21 of FIG. 4, similarly, the support surface 23 a of the component support portion 23 arranged on the right side of the figure is formed with a projecting support surface 23 c that projects toward the left side of the figure. A protruding support surface 23c is formed on the support surface 23a of the component support portion 23 arranged in the lower part of the figure so as to protrude upward in the figure. Thus, even if each elongated hole 9 is formed in the substrate 2 by forming the protruding support surface 23c on the support surface 23a of each component support portion 23, Reliable support of the substrate 2 can be realized while suppressing the bending of the portion corresponding to the component mounting region R1.

  Further, each suction hole 23b having a substantially groove-like opening formed in the support surface 23a of the substrate peripheral part holding part 23 is formed so that the opening width is about 1 mm, for example. A buffer layer 27 having a width of at least about 1 mm is preferably formed on the periphery. By forming the opening in this manner, the width of the support surface 23a can be reduced to a necessary minimum width, and the buffer layer 27 is reliably disposed around the opening, respectively. It is possible to reliably transmit the suction force by the suction holes 23b to the substrate 2. The opening width of each suction hole 23b can be determined so as to ensure an opening area that can obtain a required suction force based on the suction pressure. The suction pressure is, for example, a vacuum pressure of −30 kPa or more, more preferably a vacuum pressure of −40 kPa or more.

  Next, another modification will be described. As shown in FIG. 4, the substrate holding device 50 supports the substrate 2 and sucks the supported substrate 2 to suck and hold the support position, and the substrate holding block 21. And a vacuum suction device 22 (which is an example of a suction device) that performs the above suction. The substrate holding block 21 is configured such that the component mounting side surface S of the substrate 2 arranged with the component mounting side surface S facing downward in the drawing and the work side surface T facing upward in the drawing, and the upper surface thereof partially abut, The substrate 2 is held.

  Here, the top view of this board | substrate holding block 21 is shown to Fig.4 (a), and the sectional view on the AA line in FIG.4 (b) is shown in FIG. 4B shows a state in which the substrate 2 is transmitted, and FIG. 5 shows a state in which the substrate 2 is supported by the substrate holding block 21, so that the substrate 2 is not transmitted. It is shown. The difference from the example of FIG. 3 is that the support pad portion 26 is provided with a hole 26a and a vacuum path 26b.

  As shown in FIG. 5, the substrate holding block 21 includes a bottom block 30 formed as a separate part, and the substrate holding block 21 is configured by connecting the bottom block 30 to the upper block. Yes. Instead of such a case, the bottom block 30 may be formed as one integral part, but by configuring as such two parts, the adsorption passage described below The formation can be facilitated.

  A bottom block 30 exists in the substrate holding block 21, and a suction path that supports the substrate 2 and the component 1 is formed. The suction path of the bottom block 30 is shown in FIG.

  As shown in FIG. 6, in the bottom block 30, support portion suction communication holes 33 are formed so as to communicate from the support portion connection hole portions 31 to the respective suction holes 23 b, and pad connection holes are formed. Pad adsorbing communication holes 34 are formed so as to communicate from the portion 32 to the respective adsorbing holes 23b. In FIG. 6, only the horizontal hole portions in the support-portion suction communication holes 33 and the pad suction communication holes 34 are shown. Depending on the arrangement of the suction holes 23 b and 26 b from the respective horizontal hole portions. By forming the vertical holes 35 and 36 in communication with each other, the respective connection holes 31 or 32 are connected to the respective suction holes 23b or 26b to transmit vacuum pressure, thereby performing vacuum suction. It is possible.

  Next, a procedure for printing and supplying cream solder to the substrate 2 in the screen printing apparatus 101 having the above-described configuration will be described. Note that the control of the printing supply operation described below is performed in an integrated manner while the operations are associated with each other by a control device (not shown) included in the screen printing apparatus 101.

  First, in the screen printing apparatus 101 of FIG. 1, the substrate 2 on which each electronic component 1 is mounted on the component mounting side surface S is supplied with the work side surface T, which is the back side, as the upper surface, and the upper surface of the substrate holding device 50. Placed in. In this arrangement state, the substrate 2 is not attracted by the substrate holding device 50.

  Thereafter, positioning pins (not shown) of the substrate holding device 50 are raised and inserted into the respective positioning holes 3 of the substrate 2 arranged on the upper surface of the substrate holding block 21. By the insertion of the positioning pins, the substrate 2 in the arrangement state and the substrate holding block 21 are aligned.

  The substrate holding block 21 is arranged below the screen 52, and the arrangement position of the substrate 2 arranged in the substrate holding block 21 is recognized. Based on the recognition result, the screen 52, the substrate 2, Are aligned. Thereafter, the substrate holding block 21 is raised so as to be close to the screen 52 positioned above and aligned (or the whole stage supporting the substrate holding block 21 is raised). Is done. Thereby, the screen 52 is arrange | positioned on the said work side surface T so that the whole work side surface T of the board | substrate 2 may be pressed. With the arrangement of the screen 52, for example, when the substrate 2 is gently bent in a convex shape, this bending can be corrected. Alternatively, instead of the case where the screen 52 is used to correct the warpage or deflection of the substrate 2, by arranging a rod-like or plate-like correction portion on the upper surface of the substrate 2, It may be a case where correction is performed. After the correction is performed as described above, the flatness of the substrate 2 can be maintained by holding the substrate 2 by suction.

  Further, along with the arrangement of the screen 52, the substrate holding device 50 performs suction holding of the arranged substrate 2. Specifically, the outer peripheral region R2 on the component mounting side surface S of the substrate 2 shown in FIG. 2 is arranged so as to come into contact with the support surfaces 23a of the respective component support portions 23 of the substrate holding block 21 shown in FIG. It is assumed that it was done. At this time, the projecting support surfaces 23c included in the respective support surfaces 23a are brought into contact with the component mounting region R1 in the vicinity thereof across the long hole portion 9 of the substrate 2.

  Further, each non-mounting region R4 disposed near the center of the component mounting region R1 on the substrate 2 is supported by each auxiliary support portion 25 fixed near the center of the recess 24 of the substrate holding block 21. It is brought into contact with the surface and is supported by the respective auxiliary support portions 25. Further, the suction target surfaces of the three IC components 1B mounted in the component mounting region R1 are in contact with the suction tips 26c of the three support pad portions 26 provided inside the recess 24 of the component holding block 21. It will be in contact. In each of these contact states, each buffer layer 27 and suction tip 26c are elastically deformed by the force generated by the contact, and a reliable contact state is ensured.

In such a contact state, the air suction pressures 23b and 26a are transmitted by the vacuum suction device 22 of the substrate holding device 50 through the connection hole portions 31 and 32 and the suction communication holes 33 and 34, respectively. Thus, the substrate 2 is sucked by the respective suction holes 23b and 26a. As a result, the outer peripheral region R2 of the substrate 2 is sucked and held on the support surface 23a of each substrate peripheral portion holding portion 23, and the surfaces of the three IC components 1B are sucked and held by the respective support pad portions 26. The Further, the suction and holding of each IC component 1B by each support pad portion 26 causes the board 2 in the vicinity of the IC component 1B to receive an external force directed downward, but in the vicinity of the approximate center of the component mounting region R1. However, since the support height position of the substrate 2 is regulated even when the external force is applied, the substrate 2 is prevented from being bent downwards because it is supported by the respective auxiliary support portions 25. ing.

  In this state where the substrate 2 is securely sucked and held, the squeegee (not shown) provided in the print head 51 is placed on the screen 52 and the squeegee is horizontally moved along the surface of the screen 52 by the head moving device 53. By moving, the cream solder printing through the screen 52 is performed. In the substrate holding block 21 shown in FIG. 4, the vertical direction in the drawing is the moving direction of the squeegee for supplying cream solder.

  When the squeegee is moved, the screen 52 is raised and detached from the work side surface of the substrate 2. By this separation, a cream solder printing pattern is formed on the work side surface T of the substrate 2. Thereafter, the suction holding of the substrate 2 by the substrate holding device 50 is released. Thereafter, the substrate 2 is discharged from the substrate holding device 50.

  In the present embodiment, the case where the substrate holding block 21 is provided with both the auxiliary support portion 25 and the support pad portion 26 in addition to the respective substrate peripheral portion holding portions 23 has been described. The embodiment is not limited to such a case. Instead of such a case, for example, only one of the auxiliary support portion 25 and the support pad portion 26 may be provided in addition to the respective substrate peripheral portion holding portions 23.

  For example, in the case where the IC component 1B is not mounted on the component mounting side surface S of the substrate 2, the support pad portion 26 for sucking and holding the IC component 1B is not provided, and only the auxiliary support portion 25 is provided. It is because it is preferable to equip. However, in such a case, it is desirable to form a suction hole in the auxiliary support portion 25 to provide a suction function. This is because even if only the auxiliary support portion 25 is provided in addition to the respective substrate peripheral portion holding portions 23, not only the support of the substrate 2 but also the adsorption can be supplemented.

  In the above description, the substrate 2 has been described in which the outer peripheral region R2 supported by each substrate peripheral portion holding portion 23 is sufficiently formed. However, the substrate 2 has various structures. In some cases, the area of the outer peripheral region R2 is not sufficiently secured. In such a case, there may be a case where the substrate 2 cannot be reliably supported by the respective substrate peripheral portion holding portions 23.

  Therefore, when the area of the outer peripheral region R2 is not sufficiently ensured as described above, for example, as shown in FIG. 4, the support is provided adjacent to the substrate peripheral portion holding portion 23 arranged in the upper part of the drawing. A stepped portion support portion 41 formed by lowering the surface is formed, and a part of the component mounting region R1 of the substrate 2 is supported by the support surface of the stepped portion support portion 41, thereby supporting the substrate 2. Can be supplemented. Specifically, the thickness of the electronic component 1 mounted in the component mounting region R1 that is in contact with the stepped portion support portion 41 is more than the support surface 23a of the board peripheral portion holding portion 23 by the amount taken into consideration. The support surface is formed by lowering one step, and further, the component mounting region R1 can be supported without damaging the electronic component 1 by providing a buffer portion such as a rubber material on the support surface.

Similarly, in the case where the area of each non-mounting region R4 cannot be sufficiently secured on the component mounting side surface S of the substrate 2, the component mounting region R1 is formed by the respective auxiliary support portions 25. The electronic component 1 mounted on the substrate may be supported (the substrate 2 is supported via the electronic component 1). However, in the case where a plurality of auxiliary support portions 25 are provided, the auxiliary support portions 25 do not support the electronic component 1 in all of them, but some of the auxiliary support portions 25 are electronic components. It is preferable to support 1 and to support the non-mounting region R4 as much as possible. This is to reduce the possibility of damaging the electronic component 1 due to the support. Moreover, when supporting such an electronic component 1, it is desirable to select and support the electronic component 1 that is more resistant to external force application.

  Further, in the present embodiment, a case has been described in which such a substrate holding device 50 is provided in the screen printing device 101 that performs printing supply of cream solder on the working side surface T of the substrate 2. The use of 50 is not limited to such a case. Instead of such a case, for example, an electronic component that mounts (or mounts) the electronic component 1 through the cream solder after the cream solder is supplied to the working surface T of the substrate 2 by printing. The case where it is provided in a mounting apparatus may be sufficient. This is because such an electronic component mounting apparatus is also required to hold the substrate 2 securely.

  According to the above embodiment, the following various effects can be obtained.

  First, in the substrate holding device 50 provided in the screen printing apparatus 101, the outer peripheral region R4 of the substrate 2 is supported and adsorbed so that the substrate 2 is held in addition to the respective substrate peripheral portion holding portions 23 that hold the substrate 2. Each auxiliary support part which supplements the support of the board | substrate 2 by each board | substrate periphery holding | maintenance part 23 by supporting each non-mounting area | region R4 arrange | positioned in the component mounting area | region surface S near the approximate center of component mounting area | region R1. 25, and the surface of the electronic component 1 mounted in the vicinity of each auxiliary support portion 25 is sucked and held, whereby the substrate 2 is sucked and held via the electronic component 1, and each substrate peripheral portion holding portion 23 is held. Is provided with a support pad portion 26 that compensates for the adsorption of the substrate by the substrate, so that the component mounting side surface S of the substrate 2 on which the electronic component 1 is mounted with high density can be reliably supported and the support position can be maintained. Line It is possible.

  In particular, when the high-density mounting of each electronic component 1 is performed as described above, the component mounting region R1 surrounded by the outer peripheral region R2 of the substrate 2 is supported by contacting the surface of the substrate 2. However, even in such a case, the support by contact is provided without providing each auxiliary support portion 25 with a suction function. By providing only the function, the area of each support surface is reduced and the support can be realized.

  On the other hand, each support pad portion 26 is provided with a suction function that is not provided in the auxiliary support portion 25, and each support pad portion 26 is mounted on the IC component 1B mounted in the component mounting region R1. By adsorbing the surface, it is possible to realize adsorption of the substrate 2 via each IC component 1B.

  That is, in the substrate 2, the outer peripheral region R <b> 2 where the electronic component 1 is not mounted is securely supported by the substrate peripheral portion holding portions 23 to be sucked and held, and supported by the respective substrate peripheral portion holding portions 23. In addition, it is possible to realize the reliable holding of the substrate 2 by supplementing the lack of suction by the auxiliary support portion 25 and the support pad portion 26 separately for the support function and the suction function. ing.

  The support pad 26 may be sucked, but there is an effect of supporting it without it.

  Therefore, it is possible to reliably support and hold the component mounting side surface S as a support side surface on the substrate 2 on which the electronic components 1 are mounted on both sides with high density. Reliable and precise screen printing can be performed on the working side surface T of the substrate 2.

  Further, the support height position of the support surface of each auxiliary support portion 25 is set to be substantially the same height position as the support height position of each substrate peripheral portion holding portion 23, so that the substrate 2 is bent. And can be supported while maintaining a substantially horizontal posture.

  Moreover, the suction holding height of the electronic component 1 by each support pad portion 26 is such that the substrate 2 is supported by each auxiliary support portion 25 disposed in the vicinity thereof, so that the substrate 2 is in a substantially horizontal posture. It is possible to restrict the height to such a level that can be maintained.

  Further, since the buffer layer 27 is provided on the support surface 23a of each substrate peripheral portion holding portion 23, each support surface 23a and the outer peripheral region R2 can be brought into close contact with each other through each buffer layer 27. The adsorption effect by the respective adsorption holes 23b can be further enhanced.

  Further, in the support pad portion 26, the support pad tip 26c that is in direct contact with the surface of the IC component 1B is formed of a soft buffer portion that can be elastically deformed, for example, a rubber material, so that the contact is made. Further, the surface of the IC component 1B can be more securely attracted and held. In particular, for the support pad portion 26, by using a buffer portion having a lower hardness than the buffer portion forming the above-described buffer layer 27 by requiring a reliable suction function rather than a support function, The function can be realized effectively.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

1 is a schematic external perspective view of a screen printing apparatus according to an embodiment of the present invention. Plan view of a component mounting side surface of a board handled in the screen printing apparatus 1 is a schematic cross-sectional view of a substrate holding device provided in the screen printing apparatus of FIG. The top view of the upper surface of the board | substrate holding block with which the board | substrate holding apparatus of FIG. 3 is provided. AA line sectional view in the substrate holding block of FIG. 4 is a plan view of the bottom block in the substrate holding block of FIG. Schematic explanatory diagram showing a conventional method for supplying solder paste to a substrate (A) A diagram showing a state in which the substrate is conveyed to a printing position (B) The substrate is positioned between the screen and the support block at the printing position. The figure which shows the state performed (C) The figure which shows the state currently printed by the squeegee device Schematic plan view of a conventional substrate

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 1A Chip component 1B IC component 2 Board | substrate 3 Positioning hole 9 Long hole part 12 Connection part 21 Board | substrate holding block 22 Vacuum suction device 23 Board | substrate periphery holding | maintenance part 23a Support surface 23b Adsorption hole 24 Recessed part 25 Auxiliary support part 26 Support pad Part 26a hole 26b vacuum path 26c tip 27 buffer layer 31 support part connection hole 32 pad connection hole part 33 support part suction communication hole 34 pad suction communication hole 35, 36 vertical hole 50 substrate holding apparatus 101 screen printing apparatus S Component mounting side surface T Work side surface R1 Component mounting region R2 Outer peripheral region R3 region R4 Non-mounting region

Claims (11)

Supporting the substrate on the component mounting side surface on which a plurality of components are mounted, and maintaining the support posture of the substrate so that the substrate can work on the work side surface that is the surface facing the component mounting side surface of the substrate In the substrate holding apparatus for performing
A support surface for supporting the peripheral portion by contacting the peripheral portion on the component mounting side surface; and an adsorption hole formed on the support surface and for adsorbing the peripheral portion in the contact state. In addition, by supporting and adsorbing the peripheral portion, a substrate peripheral portion holding portion for holding the substrate is provided, and contact with the component mounting side surface and each component mounted on the component mounting side surface can be avoided. And a substrate holding block that forms a contact avoidance space substantially surrounded by the substrate peripheral portion support portion,
By contacting the non-mounting region of the component on the component mounting side surface, it has a substrate support portion that supports the non-mounting region, and includes a substrate holding portion installed in the contact avoidance space,
The support surface of the substrate peripheral part holding part is provided with a first buffer part,
The board holding portion is further provided with a component support portion that supports the surface of the component mounted on the component mounting side surface, and the hardness of the tip of the component support portion is higher than that of the first buffer portion. A substrate holding apparatus comprising a second buffer portion having a low height. 2. The substrate holding apparatus according to claim 1, wherein the position of the substrate support portion can be changed on the substrate holding portion. 3. The substrate holding apparatus according to claim 1, wherein the position of the component support portion can be changed on the substrate holding portion. These component supporting part, further, a substrate holding apparatus according to any one of 3 claims 1, characterized in that a mechanism for adsorbing the component mounting-side surface implemented above the surface of the component. The substrate support portion is a support auxiliary dedicated portion that supports the non-mounting region to supplement the support function of the substrate by the substrate peripheral portion holding portion,
The component support portion, by adsorbing the component, the substrate holding apparatus according to any one of 4 to claims 1, which is a support portion to compensate for the adsorption function of the substrate by the substrate peripheral portion holding portion. 6. The substrate holding apparatus according to claim 1, wherein the height of the component support portion can be adjusted, and the holding height position of the component is regulated. A plurality of the component support portions for individually supporting the plurality of components mounted on the component mounting side surface are provided in the substrate holding portion,
In the component support part of said respective, the substrate holding apparatus according to any one of the support tip height position claims 1 and is determined in accordance with the height position of the suction surface of the part to be the suction 6. The suction hole which the substrate peripheral portion holding part is provided, the substrate holding apparatus according to any one of claims 1 to 7 having a groove-shaped opening formed along the periphery. The component support portion has, as the second buffer portion, the suction tip formed of a rubber material that can be elastically deformed by contact with the component according to a mounting position shift of the surface to be sucked of the component. substrate holding apparatus according to any one of claims 1 to 8 is the suction pad portion having. A substrate holding device according to any one of claims 1 to 9,
A bonding material supply unit comprising a bonding material supply unit that prints and supplies the bonding material of each of the components as the work to the work side surface of the substrate held by the board holding device. Printing device. While supporting the substrate on the component mounting side surface on which a plurality of components are mounted and holding the support posture of the substrate, the work side surface of the substrate facing the component mounting side surface In the bonding material printing method,
The first buffer member provided on the support surface of the peripheral portion while supporting the peripheral portion on the component mounting side surface while avoiding contact with the respective components mounted on the component mounting side surface Adsorption through
At the same time, the non-mounting area of each component near the center of the component mounting surface is supported to supplement the support of the substrate, and the surface of the component mounted on the component mounting surface is the first surface. While holding the second buffer member whose hardness is lower than that of the buffer member and supplementing the suction of the substrate, holding the support posture of the substrate,
In the holding state, the bonding material is printed and supplied to the work-side surface of the substrate.

Images