JP4178855B2 - COOLING DEVICE, ELECTRIC DEVICE, AND COOLING DEVICE MANUFACTURING METHOD - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cooling device for cooling a heat generating device and a method for manufacturing the same, and further to an electronic apparatus equipped with a heat generating device such as a computer or a digital camera.
[0002]
[Prior art]
In recent years, the speed of LSIs (Large Scale Integration) such as CPUs (Central Processing Units) and video accelerators installed in personal computers has been increased, the area of flat panel displays has increased, and not only personal computers. Large-capacity storage media that use flash memory as storage elements, such as memory sticks, smart media, and compact flash (registered trademark), which have been rapidly expanding the scope of their use in recent years, such as digital cameras and digital audio equipment As a result, the overall heat generation amount of the electronic device is significantly increased.
[0003]
Therefore, the importance of cooling devices for cooling these heat generating devices is increasing. As the cooling device, there are generally a cooling fan, a Peltier element, a heat pipe, and the like. Here, the heat pipe will be described in particular.
[0004]
Usually, a heat pipe is made of a metallic tube having a capillary structure on the inner wall, and a working fluid such as water or alternative chlorofluorocarbon is sealed inside the sealed tube. In this heat pipe, heat transport is performed as follows.
[0005]
When one end of the heat pipe is brought into contact with a device serving as a heat source, the working fluid inside the tube is evaporated and vaporized by this heat. The vaporized working fluid moves at high speed to the condensing part, where it is condensed and returned to a liquid, at which time heat is released. The working fluid that has returned to liquid then returns to its original location through the capillary structure. In this way, heat is transported continuously and efficiently.
[0006]
[Problems to be solved by the invention]
However, since the conventional heat pipe is tubular and becomes a large-scale device, it is not suitable for use in electronic devices such as personal computers and digital cameras that are required to be small and thin. is there.
[0007]
Therefore, a method of making a heat pipe structure in a substrate material such as a silicon substrate or a glass substrate has been proposed.
[0008]
However, when a heat pipe is configured using a silicon substrate, the heat conductivity of the silicon itself is good. Therefore, heat from the object to be cooled diffuses on the surface of the silicon substrate, and the internal working fluid is not sufficiently vaporized. There was a problem that the function of the was not fully demonstrated.
[0009]
In addition, when a glass substrate is used, there is a problem that the device to be cooled cannot be cooled to a required temperature due to poor coupling efficiency in heat conduction with the device to be cooled.
[0010]
In view of such circumstances, the present invention is a cooling device that is easy to reduce in size and thickness, has a high degree of freedom in heat radiation design, and has excellent heat transport capability, a manufacturing method thereof, and a circuit for heat generation of an internal heating device. It is an object of the present invention to provide an electronic apparatus device that can ensure stable operation with high reliability.
[0011]
[Means for Solving the Problems]
  The cooling device according to the main aspect of the present invention is a means for solving the above problems,A two-layered substrate; a working fluid flow path which is provided between the two-layered substrates and constitutes a heat pipe; an opening provided in at least one of the two-layered substrates; and the two-layered substrate A channel portion that sucks and holds a liquid-phase working fluid by capillary force in the flow path, and an exposed portion that is fitted into the opening and the tip is exposed.And a liquid suction holding member made of a material having a higher thermal conductivity than the substrate.
[0012]
  In the cooling device according to the present invention, since the flow path of the working fluid constituting the heat pipe is formed between the two layers of the substrates, it is easy to reduce the size and thickness. Further, the heat pipe can be designed with a high degree of freedom by forming the flow path pattern on the substrate. Also, a liquid suction holding member made of a material having higher thermal conductivity than the substrateAs part of the exposed partSince it is exposed on at least one side of the board,By taking thermal contact between the heat generating device to be cooled and the liquid suction holding member through this exposed portion,Efficient heat transport can be realized. Furthermore, this makes it possible to use a material having low thermal conductivity as the material of the substrate, and it is possible to suppress a reduction in heat transport efficiency due to thermal diffusion in the substrate.
[0013]
  In addition, the present inventionThe cooling device according to another aspect of the present invention is provided between the two-layer substrate, the interlayer of the two-layer substrate, the working fluid flow path constituting the heat pipe, and the both surfaces of the two-layer substrate. A plurality of openings, and a channel portion that is disposed between the two layers of the substrate and sucks and holds a liquid-phase working fluid by capillary force in the flow path, and is fitted into the openings. And a liquid suction holding member made of a material having a thermal conductivity higher than that of the substrate.
[0014]
As a result, it is possible to adopt a form in which heat generating devices such as CPUs, graphic chips, and driver ICs are mounted on the front and back surfaces of the two-layer substrate, and the degree of freedom of heat dissipation design of the electronic device is improved.
[0015]
  Furthermore, the present inventionA cooling device according to another aspect of the present invention is provided on at least one of a two-layer substrate, a flow path of a working fluid constituting a heat pipe, and a layer of the two-layer substrate. A channel portion that is disposed between the first and second openings and the two-layered substrate and sucks and holds a liquid-phase working fluid by capillary force in the flow path; and the first Between the liquid suction holding member made of a material having a higher thermal conductivity than the substrate and the two-layer substrate. A latent heat release member that has a second exposed portion that is fitted into the second opening and has a tip exposed, and that releases the latent heat of the gas-phase working fluid in the flow path;It comprises.
[0016]
Thereby, a latent heat discharge | release member can be made to contact the heat radiating member outside a cooling device, the cooling capability in the condensation part in a heat pipe can improve, and the heat transport efficiency of a cooling device can further be improved.
[0017]
  In the cooling device of the present invention, the liquid suction holding memberThe channel part ofIsOf the two-layer substrateA first channel portion for generating capillary force corresponding to the flow path of the working fluid provided on one of the substrates, and a capillary force generating position corresponding to the flow path of the working fluid provided on the other substrate. The second channel portion may be included.
[0018]
By forming the channel portions for generating capillary force on both surfaces of the liquid suction holding member in this way, it is possible to secure a wider contact area with the liquid-phase working fluid as the whole liquid suction holding member, and heat transport efficiency Is further improved.
[0019]
Further, in the cooling device of the present invention, the two-layer substrates are formed by joining the substrates each having the working fluid flow path pattern formed on one surface, and each substrate has a different form from each other. In addition, a working fluid flow path pattern may be formed.
[0020]
Thereby, the freedom degree of selection of the heat transport characteristic of a cooling device improves further.
[0021]
Furthermore, in the cooling device of the present invention, the two layers of substrates are bonded to each other via the adhesive layer, and the thickness of the adhesive layer is in the range of 1.5 nm or more and less than 1 μm, so that the material having high thermal conductivity. Is used for the adhesive layer, the reduction in efficiency of the cooling device due to heat conduction in the adhesive layer can be reduced, and the adhesive strength required for substrate bonding can be obtained.
[0022]
  An electronic apparatus device according to another aspect of the present invention includes a device that is a heat source and a cooling device that cools the device, and the cooling device includes:A two-layered substrate; a working fluid flow path which is provided between the two-layered substrates and constitutes a heat pipe; an opening provided in at least one of the two-layered substrates; and the two-layered substrate And a channel portion that sucks and holds a liquid-phase working fluid by capillary force in the flow path, and an exposed portion that is fitted into the opening and has a tip exposed. A liquid suction holding member made of a material having a higher thermal conductivity thanThe exposed portion of the liquid suction holding member and the device are configured to contact each other.
[0023]
  This inventionElectronic equipmentAccording to the liquid suction holding member made of a material having a higher thermal conductivity than the substrateDue to the thermal contact between the exposed part and the heat generating device to be cooled,By performing efficient heat transport in the cooling device, the device is efficiently cooled, and malfunction due to heat generation of the device can be prevented.
[0024]
  Furthermore, an electronic apparatus device according to another aspect of the present invention provides:A device that is a heat source and a cooling device that cools the device, the cooling device being provided between the two layers of the substrate and the layer of the two layers of the substrate, and the flow path of the working fluid constituting the heat pipe A plurality of openings provided on both front and back surfaces of the two-layer substrate, and a channel that is disposed between the two-layer substrates and sucks and holds the liquid-phase working fluid by capillary force in the flow path A liquid suction holding member made of a material having a higher thermal conductivity than the substrate, and a plurality of exposed portions that are respectively fitted into the plurality of openings and exposed at the tips, At least one of the exposed portion of the liquid suction holding member and the device are in contact with each other.
[0025]
This allows freedom of heat dissipation design of electronic equipment, such as a configuration in which heat-generating devices such as CPUs, graphic chips, and driver ICs are mounted on the front and back surfaces of a two-layer board, and a heat sink can be attached to one surface. The degree is improved.
[0026]
  A cooling device manufacturing method according to another aspect of the present invention provides an opening in at least one of two substrates.PartFormingShiForming the pattern of the working fluid flow path that constitutes the heat pipe on one surface of each of the two substratesShi,A channel portion for sucking and holding a liquid-phase working fluid by capillary force in the flow path;in frontAnd an exposed portion fitted in the opening provided in the substrate, and made of a material having a higher thermal conductivity than the substrate.Create liquid suction holding memberShiAnd the flow path pattern forming surfaces of the two substrates are joined with the liquid suction holding member interposed therebetween.It is characterized by that.
[0027]
According to this manufacturing method, a cooling device that can be easily reduced in size and thickness, has a high degree of freedom in heat radiation design, and has excellent heat transport capability can be easily manufactured.
[0028]
  Furthermore, in the method for manufacturing a cooling device according to another aspect of the present invention, a first opening and a second opening are formed in at least one of the two substrates, respectively, and one surface of each of the two substrates. Forming a flow path pattern of the working fluid constituting the heat pipe, and a channel portion for sucking and holding the liquid phase working fluid by capillary force in the flow path;in frontA liquid suction holding member made of a material having a first exposed portion fitted in the first opening provided in the substrate and having a higher thermal conductivity than the substrate is manufactured.,A second exposed portion fitted into the second opening provided in the substrate, and producing a latent heat release member that releases the latent heat of the gas-phase working fluid in the flow path, The flow path pattern forming surfaces of two substrates are joined to each other with the liquid suction holding member and the latent heat release member interposed therebetween.
[0029]
According to the present invention, by bringing the latent heat releasing member into contact with the heat radiating member outside the cooling device, it is possible to manufacture a cooling device having high cooling capacity at the condensing portion in the heat pipe and high heat transport efficiency.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0031]
FIG. 1 is an exploded perspective view of a cooling device according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the cooling device assembled.
[0032]
As shown in these drawings, the cooling device 1 includes an upper substrate 2 and a lower substrate 3 that constitute a two-layer substrate, a wick 4 that is a liquid suction holding member, and a capacitor 5 that is a latent heat release member. Composed.
[0033]
On one surface of each of the upper substrate 2 and the lower substrate 3, a channel pattern groove 6 constituting a heat pipe is provided.
[0034]
The upper substrate 2 and the lower substrate 3 are bonded to each other with their flow path pattern forming surfaces facing each other and a wick 4 and a capacitor 5 disposed therebetween.
[0035]
FIG. 3 shows a planar layout of the flow path pattern, and FIG. 4 shows a planar layout of the flow path pattern in which the wick 4 and the capacitor 5 are further arranged.
[0036]
By joining the upper and lower substrates 2, 3, the grooves 6 in the flow path pattern of each substrate 2, 3 have an evaporator 11, a gas phase line 12, a condenser 13, and a liquid phase that evaporate the refrigerant that is the working fluid. A line 14, a reservoir area 15, a refrigerant sealing port 16, a gas-liquid phase separation groove 19, a wick outer frame port 17, and a capacitor outer frame port 18 are configured.
[0037]
A refrigerant is enclosed in the evaporator 11, the gas phase line 12, the condenser 13, the liquid phase line 14, and the reservoir area 15, thereby forming a heat pipe.
[0038]
The evaporator 11 takes the heat from the wick 4 having a capillary structure with the liquid phase refrigerant filled therein, evaporates the liquid phase refrigerant, and moves the gas phase refrigerant to the gas phase line 12. Part.
[0039]
The gas phase line 12 is a flow path for transmitting the gas phase refrigerant evaporated in the evaporator 11 to the condenser 13.
[0040]
The condenser 13 is a part that causes the condenser 5 to absorb the latent heat of the vapor and condenses and liquefies the gas-phase refrigerant.
[0041]
The liquid phase line 14 is a flow path for moving the refrigerant liquefied by the condenser 13 to the evaporator 11.
[0042]
The reservoir area 15 is an area in which liquid-phase refrigerant is stored, and the refrigerant can be replenished from the reservoir area 15 to the evaporator 11 so as to keep the amount of liquid in the evaporator 11 constant.
[0043]
Further, each substrate 2 and 3 is separated from the refrigerant filling port 16, the gas phase line 12 and the liquid phase line 14, which are inlets for injecting the refrigerant after joining the substrates, thereby suppressing thermal interference between them. A gas / liquid phase separation groove 19 to be opened, an outer frame portion of the wick 4 to be described later, and a wick outer frame port 17 that exposes front and back end surfaces of the outer frame portion of the wick 4 on the substrate surface, and an outer frame of the capacitor 5 A capacitor outer frame opening 18 and the like are provided on the surface of the substrate so that the front and rear end surfaces of the outer frame portion of the capacitor 5 are exposed.
[0044]
As the material of the substrates 2 and 3, if the thermal conductivity is too high, the heat transport efficiency of the heat pipe may be adversely affected by the thermal diffusion in the substrate. For example, glass, polyimide, Teflon (registered trademark), PDMS Organic plastics such as (polydimethylsiloxane) are used.
[0045]
For example, water, ethanol, methanol, propanol (including isomers), ethyl ether, ethylene glycol, fluorinate, and other refrigerants that have a boiling point, thermal conductivity, and antibacterial resistance that satisfy the design of cooling and heat transport devices. The fluid which has is utilized.
[0046]
As the material of the wick 4 and the capacitor 5, a material having high thermal conductivity, for example, a material having a thermal conductivity of 0.17 W / mK or more is used. Specifically, it includes materials including at least one of Si, Cu, Al, Ni, Ti, Au, Ag, Pt, etc., conductive polymers, ceramics, etc., and has a thermal conductivity equivalent to that of metal. The material it has is used. More preferably, it is desirable to use a material having a thermal conductivity twice or more that of the substrate material.
[0047]
FIG. 5 shows details of the structure of the wick 4. In the figure, (a) is a side view and (b) is a plan view.
[0048]
As shown in the figure, the wick 4 includes a channel portion 21 and outer frame portions 22 provided at both ends thereof. Microchannels 23 and 23 for generating a capillary force are respectively provided on the upper and lower surfaces of the channel portion 21.
[0049]
As shown in FIG. 2, in the state where the wick 4 is combined with each of the substrates 2 and 3, the upper end surface 22a and the lower end surface 22b of the outer frame portion 22 of the wick 4 are the front and back surfaces of the two layers of the substrates 2 and 3, respectively. Each surface 2a, 2b is exposed. In other words, the upper end surface 22a and the lower end surface 22b of the outer frame portion 22 of the wick 4 have the same height as the front and back surfaces 2a and 2b of the two-layer substrates 2 and 3, or the two-layer substrates 2 and 2 The respective heights are set so as to slightly protrude from the surfaces 2a and 2b of the front and back surfaces of the three. The upper end surface 22a and / or the lower end surface 22b of the outer frame portion 22 of the wick 4 exposed from the two-layer substrates 2 and 3 are contacted / joined with, for example, a heat generating device to be cooled. It has become.
[0050]
Similarly, the capacitor 5 includes a channel portion 31 and an outer frame portion 32. The channel portion 31 of the capacitor 5 is provided with microchannels 33 functioning as fins on both upper and lower surfaces in order to improve heat dissipation. The capacitor 5 is provided with an outer frame portion 32 similar to the wick 4, and the upper end surface 32 a and the lower end surface 32 b of the outer frame portion 32 are surfaces 2 a on the front and back sides of the two layers of substrates 2 and 3, respectively. , 2b. That is, the upper end surface 32a and the lower end surface 32b of the outer frame portion 32 of the capacitor 5 have the same height as the front and back surfaces 2a and 2b of the two-layer substrates 2 and 3, or the two-layer substrate 2 and The respective heights are set so as to slightly protrude from the front and back surfaces 2a and 2b. A member having high heat dissipation or heat conductivity outside the cooling device 1 is brought into contact with and joined to the upper end surface 32 a and / or the lower end surface 32 b of the outer frame portion 32 of the capacitor 5.
[0051]
As described above, the cooling device 1 of this embodiment is configured so that the upper and lower substrates 2 and 3 provided with the flow path pattern grooves 6 for the heat pipes on the one surface are connected to the respective flow path pattern grooves 6. The wick 4 and the capacitor 5 are arranged between each other, and the surfaces provided with are arranged so as to be joined to each other, and the inside of the cooling device 1 is in a predetermined reduced pressure state.
[0052]
Heat transport in the cooling device 1 is performed as follows.
[0053]
The liquid-phase refrigerant filled in the evaporator 11 absorbs the heat of the heat-generating device that is in contact with the wick 4 outside the two-layer substrates 2 and 3, and evaporates with this heat. Then, the vapor (vapor phase refrigerant) moves to the gas phase line 12 due to the vapor pressure difference. The gas-phase refrigerant moves to the condenser 13 through the gas-phase line 12, and the gas-phase refrigerant is deprived of latent heat by the condenser 5 and returns to the liquid. The liquefied refrigerant moves to the evaporator 11 through the liquid phase line 14. Heat transport is performed by such a cycle.
[0054]
Next, a method for manufacturing the cooling device 1 will be described.
[0055]
First, as shown in FIG. 6, openings such as a refrigerant sealing port 16, a wick outer frame port 17, and a capacitor outer frame port 18 are formed in the upper and lower substrates 2 and 3.
[0056]
Subsequently, as shown in FIG. 7, a groove 6 having a flow path pattern constituting a heat pipe is formed on one surface of each of the substrates 2 and 3. Methods for forming these openings and grooves 6 include sand blasting, RIE (dry etching), wet etching, UV light etching, laser etching, proton light etching, electron beam drawing etching, and micro molding.
[0057]
Next, in order to secure an area in which the wick 4 fits in each of the substrates 2 and 3, as shown in FIG. As shown in FIG. 9, a wick fitting recess 43 having a flow path pattern is formed on the removed surface by etching or the like using a metal mask 42 having an opening 41 corresponding to.
[0058]
Next, as shown in FIG. 1, the flow path pattern forming surfaces of the substrates 2 and 3 are faced to each other, the wick 4 and the capacitor 5, and the outer frame portions 22 and 32 are connected to the wick outer frame port 17 and The board is inserted into the capacitor outer frame port 18 and sandwiched between the boards 2 and 3 to join the boards 2 and 3 together. Thereby, the cooling device 1 having an appearance as shown in FIG. 10 is completed.
[0059]
Examples of methods for bonding the substrates 2 and 3 include anodic bonding, pressurization / thermal fusion, ultrasonic bonding, bonding by chemical bonding (such as when the substrate material is polyimide), bonding of self-adhesive materials ( For example, the substrate material is Si rubber.
[0060]
At this time, an adhesive layer (reference numeral 34 in FIGS. 2 and 10) may be formed and bonded to the flow path pattern forming surface of one or both substrates. In this case, for example, metal is implanted into the material of each substrate by using ion implantation, a thin film such as copper is formed by a vapor deposition apparatus, or the surface activity is increased by plasma irradiation and then bonded. Is preferred.
[0061]
Here, the thickness of the adhesive layer 34 is preferably thinner when a material having high thermal conductivity is used for the adhesive layer 34. This is because the heat conduction caused by the adhesive layer 34 is reduced and the efficiency of the cooling device 1 is prevented from decreasing. On the other hand, if the thickness of the adhesive layer 34 is too thin, a sufficient function as the adhesive layer cannot be expected.
[0062]
For example, the thickness of the adhesive layer 34 may be at least 1.5 nm or more and less than 1 μm, preferably 3 nm or more and less than 1 μm, more preferably 10 nm or more and less than 200 nm.
[0063]
Subsequently, a manufacturing method of the wick 4 and the capacitor 5 will be described with reference to FIGS.
[0064]
A plate material 51 made of the above-described material that satisfies the width, length, and height of the wick 4 and the capacitor 5 is prepared (a). The outer frame portion 52 and the channel portion 53 on either the upper or lower side are formed from the plate material 51 by, for example, machining or the like (b). Next, a microchannel 54 having a shape and size suitable for the wick 4 and the capacitor 5 is formed on one surface of the channel portion 53 by, for example, machining (c). Similarly, on the other side of the plate material 51, the outer frame portion 52, the channel portion 53, and the microchannel 54 are formed by machining or the like.
[0065]
Other manufacturing methods for the wick 4 and the capacitor 5 include RIE (dry etching), wet etching, UV-LIGA, and electroforming.
[0066]
In the cooling device 1 configured as described above, the outer frame portion 22 of the wick 4 is exposed on the front and back surfaces 2a and 3a of the two-layer substrates 2 and 3 as shown in FIG. It can be incorporated in various forms in the device.
[0067]
For example, as shown in FIG. 12, the wick 4 in which the heat generating devices 61 and 62 such as a CPU, graphic chip, and driver IC in the electronic device 60 are exposed on the front and back surfaces 2a and 3a of the cooling device 1, for example. It is possible to take a form in which the outer frame 22 is mounted in contact with the outer frame 22.
[0068]
Further, as shown in FIG. 13, by mounting a heat sink 63 so as to be in contact with the outer frame 22 of the wick 4 on either the front or back surface side of the cooling device 1, the upper limit of the heat transport amount of the cooling device 1. The degree of freedom of heat dissipation design of the electronic device 60 is improved.
[0069]
Further, as shown in FIG. 14, a plurality of cooling devices 1 are combined in an array to form a flat panel display 71 such as an LCD (Liquid Crystal Display), FED (Field Emission Display), or PDP (Plasma Display Panel), and the rear surface. It is also possible to adopt a form interposed between the chassis 73.
[0070]
Further, as shown in FIGS. 12 and 13, by exposing the outer frame portion 32 of the capacitor 5 to the front and back surfaces 2a and 3a of the two-layer substrates 2 and 3, the exposed portion of the capacitor 5 is The cooling capacity of the condenser 13 can be increased by contacting the member 64 having high heat dissipation or heat conductivity outside the cooling device 1, for example, the chassis 64 of the electronic device 60.
[0071]
Therefore, the cooling device 1 of the present embodiment can be incorporated with high degree of freedom into various electronic device devices 60 equipped with heat generating devices such as personal computers and digital cameras, and the heat generating devices in the electronic device device 60 can be efficiently used. Can be cooled to.
[0072]
Next, another embodiment of the cooling device 1 according to the present invention will be described.
[0073]
In the above embodiment, in order to secure a region where the wick 4 fits in each substrate, as shown in FIGS. 8 and 9, the wick fitting region 40 on the flow path pattern forming surface of each substrate 2, 3 is etched. The wick fitting recessed part 43 in which the flow path pattern exists on the removed surface was formed. According to this method, the thickness of the channel portion 21 of the wick 4 can be increased, the processing of the wick 4 can be facilitated, and the amount of heat absorbed by the wick 4 can be increased.
[0074]
However, the present invention is not limited to this, and the formation of the wick fitting recess is omitted, and the channel portion 21A of the wick 4 is accommodated within the range of the height H of the flow path 6A as shown in FIG. You may take a simple structure.
[0075]
In the above-described embodiment, as shown in FIG. 2, the heights of the upper and lower end surfaces 22a, 22b, 32a, and 32b of the outer frame portions 22 and 32 of the wick 4 and the capacitor 5 are set to the two-layer substrate 2. , 3 is set to be equal to or greater than the height of each of the front and back surfaces 2a, 2b, but as shown in FIG. 16, both the upper and lower outer frame portions 22, 32 of the wick 4 and the capacitor 5 are provided. Only the height of the end surfaces 22a and 32a may be set to be equal to or higher than the height of the surface 2a of the substrates 2 and 3.
[0076]
In the above embodiment, a common flow path pattern is formed on each of the upper and lower substrates 2 and 3, and the flow path pattern forming surfaces are faced to each other. As shown in FIG. By arranging the flow path portions such as the line 12 and the liquid phase line 14 that may change the heat transport characteristics so as not to overlap each other, the degree of freedom in selecting the heat transport characteristics is improved and the efficiency is high. Can be achieved.
[0077]
Here, the upper substrate 2 is provided with a groove for forming the gas phase line 12a, and the lower substrate 3 is provided with a groove for forming the gas phase line 12b, so that the gas phase lines 12a and 12b do not overlap each other. Is set. Similarly, the upper substrate 2 is provided with a groove for forming the liquid phase line 14a, and the lower substrate 3 is provided with a groove for forming the liquid phase line 14b, so that the liquid phase lines 14a and 14b do not overlap each other. Is set.
[0078]
【The invention's effect】
As described above, according to the present invention, a small and thin cooling device can be provided, and a heat pipe can be designed with a high degree of freedom by forming a flow path pattern on the substrate. Also, a liquid suction holding member made of a material having higher thermal conductivity than the substrateAs part of the exposed partSince it is exposed on at least one side of the board,By taking thermal contact between the heat generating device to be cooled and the liquid suction holding member through this exposed portion,Efficient heat transport can be realized. Furthermore, this makes it possible to use a material having low thermal conductivity as the material of the substrate, and it is possible to suppress a reduction in heat transport efficiency due to thermal diffusion in the substrate.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a cooling device according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view of the cooling device of FIG.
FIG. 3 is a diagram showing a planar layout of a flow path pattern of the cooling device.
4 is a diagram showing a planar layout of the flow path pattern, wick and capacitor of FIG. 3;
FIG. 5 is a side view and a plan view showing details of the structure of the wick.
FIG. 6 is a perspective view showing a process of forming openings such as a refrigerant sealing port, a wick outer frame port, and a capacitor outer frame port on a substrate.
FIG. 7 is a perspective view showing a step of forming a flow path pattern groove constituting a heat pipe on a substrate.
FIG. 8 is a perspective view showing an etching process of a wick fitting region of a substrate.
FIG. 9 is a perspective view showing a state after etching of a wick fitting region of a substrate.
FIG. 10 is a perspective view showing the external appearance of the completed cooling device.
FIG. 11 is a diagram showing a method for manufacturing a wick and a capacitor.
FIG. 12 is a side view showing an example of a built-in form of the cooling device in the electronic device.
FIG. 13 is a side view showing an example of another form of incorporation of the cooling device into the electronic device.
FIG. 14 is a perspective view showing a form in which a large number of cooling devices are arrayed and used for cooling a flat panel display.
FIG. 15 is a cross-sectional view showing another embodiment of the cooling device.
FIG. 16 is a cross-sectional view showing a modified example of the wick and the capacitor in the cooling device.
FIG. 17 is a plan view showing a cooling device when different flow path patterns are formed on upper and lower substrates.
[Explanation of symbols]
1 Cooling device
2 Upper substrate
3 Lower board
4 Wick
5 capacitors
6 Channel pattern groove
11 Evaporator
12 Gas phase line
13 Condenser
14 Liquid phase line
15 Reservoir area
17 Wick outer frame
18 Capacitor outer frame port
21,31 Channel part
22, 32 Outer frame
23,33 microchannels
34 Adhesive layer
60 Electronic equipment
61,62 Heating device

Claims (11)

A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
An opening provided in at least one of the two-layer substrates;
A channel portion that is disposed between the two layers of the substrate and sucks and holds a liquid-phase working fluid by capillary force in the flow path; and an exposed portion that is fitted into the opening and the tip is exposed. A liquid suction holding member made of a material having higher thermal conductivity than the substrate;
A cooling device comprising: A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
A plurality of openings provided on both front and back surfaces of the two-layer substrate;
A plurality of channels disposed between the two layers of substrates, each of which is fitted into each of the plurality of openings and a channel portion that sucks and holds a liquid-phase working fluid by capillary force in the flow path; A liquid suction holding member made of a material having a exposed portion and a higher thermal conductivity than the substrate;
A cooling device comprising: A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
A first opening and a second opening provided in at least one of the two-layer substrates;
A first portion that is disposed between the two layers of substrates and that is fitted into the first opening and a channel portion that sucks and holds the liquid-phase working fluid by capillary force in the flow path and the first opening. And a liquid suction holding member made of a material having a higher thermal conductivity than the substrate,
It has a second exposed portion that is disposed between the two layers of substrates and is fitted in the second opening and has a tip exposed, and the latent heat of the vapor-phase working fluid in the flow path. A latent heat release member to be released and
A cooling device comprising: The channel portion of the liquid suction holding member includes a first channel portion for generating a capillary force corresponding to a flow path of the working fluid provided on one of the two layers of substrates, and the other of the two layers. The cooling device according to claim 1, further comprising a second channel portion for generating a capillary force corresponding to a flow path of the working fluid provided on the substrate.   Each of the two layers of substrates is formed by joining substrates having a pattern of the working fluid flow path formed on one surface, and the pattern of the flow path of the working fluid provided on each of the substrates is The cooling device according to claim 1, wherein the cooling devices are different from each other.   2. The cooling device according to claim 1, wherein the two layers of substrates are bonded to each other through an adhesive layer, and the thickness of the adhesive layer is in a range of 1.5 nm or more and less than 1 μm. A device that is a heat source;
A cooling device for cooling the device,
The cooling device is
A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
An opening provided in at least one of the two-layer substrates;
A channel portion that is disposed between the two layers of the substrate and sucks and holds a liquid-phase working fluid by capillary force in the flow path; and an exposed portion that is fitted into the opening and the tip is exposed. A liquid suction holding member made of a material having higher thermal conductivity than the substrate;
Comprising
The electronic device apparatus, wherein the exposed portion of the liquid suction holding member and the device are in contact with each other. A device that is a heat source;
A cooling device for cooling the device,
The cooling device is
A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
A plurality of openings provided on both front and back surfaces of the two-layer substrate;
A plurality of channels disposed between the two layers of substrates, each of which is fitted into each of the plurality of openings and a channel portion that sucks and holds a liquid-phase working fluid by capillary force in the flow path; A liquid suction holding member made of a material having a exposed portion and a higher thermal conductivity than the substrate;
Comprising
An electronic device apparatus , wherein the device is in contact with at least one exposed portion of the liquid suction holding member . A device that is a heat source;
A cooling device for cooling the device,
The cooling device is
A two-layer substrate,
Provided between the two layers of the substrate, the flow path of the working fluid constituting the heat pipe,
A first opening and a second opening provided in at least one of the two-layer substrates;
A first portion that is disposed between the two layers of substrates and that is fitted into the first opening and a channel portion that sucks and holds the liquid-phase working fluid by capillary force in the flow path and the first opening. And a liquid suction holding member made of a material having a higher thermal conductivity than the substrate,
It has a second exposed portion that is disposed between the two layers of substrates and is fitted in the second opening and has a tip exposed, and the latent heat of the vapor-phase working fluid in the flow path. A latent heat release member to be released and
Comprising
An electronic device apparatus , wherein the device is in contact with at least one of the first exposed portion or the second exposed portion of the liquid suction holding member . On at least one opening of the two substrates to form,
Forming a pattern of the flow path of the working fluid constituting a heat pipe to one side of the two substrates, respectively,
It includes a channel portion for holding by suction the liquid-phase working fluid by capillary forces, and exposed portions to be fitted into the opening provided in the prior SL substrate in said flow path, the thermal conductivity than the substrate to prepare a liquid suction holding member made of a high material
Method for manufacturing a cooling device according to the forming surface each other of the flow path pattern of said two substrates, wherein the benzalkonium be bonded across said liquid suction holding member. Forming a first opening and a second opening in at least one of the two substrates,
Forming a pattern of the flow path of the working fluid constituting the heat pipe on one surface of each of the two substrates;
And a first exposed portion to be fitted with a channel portion for holding by suction the liquid-phase working fluid by capillary forces in the flow path, the first opening provided in the front Stories substrate, wherein A liquid suction holding member made of a material having a higher thermal conductivity than the substrate is produced ,
A second exposed portion fitted in the second opening provided in the substrate, and producing a latent heat release member that releases the latent heat of the gas-phase working fluid in the flow path,
A method for manufacturing a cooling device, wherein the flow path pattern forming surfaces of the two substrates are joined to each other with the liquid suction holding member and the latent heat release member interposed therebetween .

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