JP4131330B2 - Optical semiconductor device - Google Patents
Optical semiconductor device Download PDFInfo
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- JP4131330B2 JP4131330B2 JP2004218147A JP2004218147A JP4131330B2 JP 4131330 B2 JP4131330 B2 JP 4131330B2 JP 2004218147 A JP2004218147 A JP 2004218147A JP 2004218147 A JP2004218147 A JP 2004218147A JP 4131330 B2 JP4131330 B2 JP 4131330B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Sealing Material Composition (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
本発明はＣＣＤ（固体撮像素子）やエリアセンサ等の光半導体素子封止用樹脂組成物を用いて封止した光半導体装置に関するものである。 The present invention relates to an optical semiconductor device encapsulated with a resin composition for encapsulating an optical semiconductor element such as a CCD (solid-state imaging device) or an area sensor.
従来、例えば図１に示すような光半導体装置が提案されている。この光半導体装置は中空パッケージタイプのものであって、封止材１に凹部２を形成すると共に凹部２に光半導体素子３を取り付けて収納し、封止材１の片面に開口した凹部２の開口を覆うようにして蓋体４を設けることによって形成されるものである。封止材１と蓋体４は接着剤層５により結合され凹部２は密閉される。また、蓋体４はガラス板やレンズなどの透光性のある部材で形成され、蓋体４を通して外部の光を光半導体素子３で受光したり、蓋体４を通して光半導体素子３で発した光を外部に放射したりすることができる。
Conventionally, for example, an optical semiconductor device as shown in FIG. 1 has been proposed. This optical semiconductor device is of a hollow package type, and has a
このような光半導体装置において、封止材１はエポキシ樹脂を含有する樹脂組成物で形成するようにしている。エポキシ樹脂は優れた接着性や低吸湿性の特徴を有し、この特徴を利用して、エポキシ樹脂で半導体や電子部品を封止する方法が主流を占めてきている。これは、ガラス、金属、セラミックを用いたハーメチックシール法に比べて大量生産性やコストメリットが優れるためである。 In such an optical semiconductor device, the sealing material 1 is formed of a resin composition containing an epoxy resin. Epoxy resins have excellent adhesiveness and low moisture absorption characteristics, and methods using these characteristics to seal semiconductors and electronic components have become mainstream. This is because mass productivity and cost merit are superior to the hermetic sealing method using glass, metal, and ceramic.
このようなエポキシ樹脂を含有する樹脂組成物を用いる封止法においては、例えば、ｏ−クレゾールノボラック型エポキシ樹脂、硬化剤としてフェノールノボラック樹脂、無機充填材として溶融シリカ、硬化促進剤として有機リン化合物を主成分とする樹脂組成物からなる成形材料が一般的に使用されている。 In a sealing method using a resin composition containing such an epoxy resin, for example, an o-cresol novolak type epoxy resin, a phenol novolac resin as a curing agent, fused silica as an inorganic filler, and an organic phosphorus compound as a curing accelerator In general, a molding material made of a resin composition containing as a main component is used.
しかし、従来から用いられている樹脂組成物は金属やセラミックに比べて透湿性が高く、図１に示すような中空パッケージタイプの封止材１を形成した場合は、封止材１を通じて凹部２に湿気が侵入し、蓋体４の内面に結露や曇りが発生し易いという問題があった。 However, conventionally used resin compositions have higher moisture permeability than metals and ceramics, and when the hollow package type sealing material 1 as shown in FIG. There is a problem that moisture penetrates into the lid body 4 and condensation or fogging easily occurs on the inner surface of the lid body 4.
また、封止材１の透湿性を低下させるために封止材１の吸湿性を向上させると、吸湿によって封止材１自体が伸長して寸法変化が大きくなり、その結果、蓋体４が外れやすくなるという問題があった。 Moreover, when the hygroscopic property of the sealing material 1 is improved in order to reduce the moisture permeability of the sealing material 1, the sealing material 1 itself expands due to moisture absorption, resulting in a large dimensional change. There was a problem that it was easy to come off.
このような問題を解決するために、エポキシ当量が１７０以下のエポキシ樹脂と、水酸基当量が１３０以下の硬化剤とを含有して成る樹脂組成物を用いて封止材を形成して成る光半導体装置を本出願人は提案した（例えば、特許文献１参照）。 In order to solve such problems, an optical semiconductor formed by forming a sealing material using a resin composition containing an epoxy resin having an epoxy equivalent of 170 or less and a curing agent having a hydroxyl equivalent of 130 or less. The present applicant has proposed a device (see, for example, Patent Document 1).
しかしながら、特許文献１の封止材に用いられているエポキシ樹脂はフェニルグリシジルエーテルタイプ、ナフタレングリシジルエーテルタイプのエポキシ樹脂を必須の樹脂成分とするものであり、このようなエポキシ樹脂からなる封止剤を用いて、ガラスなどの蓋体部分との接着をエポキシ樹脂からなる接着剤により行うと、封止材と接着剤との界面で剥離が生じ、十分な接着が得られないことが明らかとなった。
この発明の課題は、従来の光半導体装置の欠点を改善するもので、封止材に用いられるエポキシ樹脂の種類を特定し且つその硬化物の物性値をコントロールすることにより、接着剤層を介した封止材とガラス等の蓋体との優れた高密着性を達成した光半導体装置を提供することにある。 An object of the present invention is to improve the disadvantages of the conventional optical semiconductor device. By specifying the type of epoxy resin used for the sealing material and controlling the physical property value of the cured product, the adhesive layer is interposed. An object of the present invention is to provide an optical semiconductor device that achieves excellent high adhesion between the sealing material and a lid such as glass.
本発明は、光半導体素子を収納した封止材と、封止材と接着剤を介して接合される透明蓋体からなる光半導体装置において、封止材と透明蓋体とを接合するために用いられる接着剤がエポキシ系接着剤であり、前記封止材はエポキシ樹脂組成物の硬化物からなり、前記樹脂組成物は少なくともビフェニル骨格を有するエポキシ樹脂を含有し、この硬化物の５０℃における線膨張係数が８〜１３ｐｐｍ、５０℃における弾性率が１６〜２８ＧＰａである光半導体装置とすることにより、封止材と接着剤の間での接着性を高め、密閉性の高い光半導体装置を得ることができるものである。 The present invention relates to an optical semiconductor device comprising a sealing material containing an optical semiconductor element, and a transparent lid bonded to the sealing material via an adhesive, in order to bond the sealing material and the transparent lid. The adhesive used is an epoxy adhesive, and the sealing material is a cured product of an epoxy resin composition, and the resin composition contains at least an epoxy resin having a biphenyl skeleton, and the cured product at 50 ° C. By forming an optical semiconductor device having a linear expansion coefficient of 8 to 13 ppm and an elastic modulus of 16 to 28 GPa at 50 ° C., an optical semiconductor device with high sealing properties can be obtained by improving the adhesion between the sealing material and the adhesive. It can be obtained.
また、本発明は、上記硬化物のガラス転移温度が、１１０℃以上であることや、硬化物の成形収縮率が０.１５〜０.３５％であることを好ましい態様としている。このようなガラス転移温度あるいは成形収縮率の硬化物とすることより、封止材の寸法安定性を高めることができ、さらに密着性を改善することができる。 Moreover, this invention makes it a preferable aspect that the glass transition temperature of the said hardened | cured material is 110 degreeC or more, and that the mold shrinkage rate of hardened | cured material is 0.15-0.35%. By using a cured product having such a glass transition temperature or molding shrinkage rate, the dimensional stability of the sealing material can be increased, and the adhesion can be further improved.
本発明は、上記のような封止材を用いることにより、封止材とガラス等の蓋体との優れた高密着性を達成した光半導体装置を提供することができる。 The present invention can provide an optical semiconductor device that achieves excellent high adhesion between a sealing material and a lid such as glass by using the sealing material as described above.
以下、本発明を具体的に説明する。 Hereinafter, the present invention will be specifically described.
本発明は封止体と蓋体を接着する接着剤がエポキシ系接着剤であり、封止材の樹脂組成物に、エポキシ樹脂として少なくともビフェニル骨格を有するエポキシ樹脂を用いると共に、この硬化物の５０℃における線膨張係数が８〜１３ｐｐｍ、５０℃における弾性率が１６〜２８ＧＰａであることを特徴とする。 In the present invention, the adhesive for bonding the sealing body and the lid is an epoxy adhesive, and an epoxy resin having at least a biphenyl skeleton is used as the epoxy resin for the resin composition of the sealing material. A linear expansion coefficient at 8 ° C. is 8 to 13 ppm, and an elastic modulus at 50 ° C. is 16 to 28 GPa.
本発明の封止材の樹脂組成物は、ビフェニル骨格を有するエポキシ樹脂、硬化剤、無機充填材を少なくとも含有する。 The encapsulant resin composition of the present invention contains at least an epoxy resin having a biphenyl skeleton, a curing agent, and an inorganic filler.
本発明のビフェニル骨格を有するエポキシ樹脂としては、例えば以下の式（１）あるいは（２）で例示されるビフェニル骨格を有するエポキシ樹脂もしくはこれらの誘導体が挙げられ、特に式（１）の構造を有するエポキシ樹脂もしくはその誘導体が好ましい。 Examples of the epoxy resin having a biphenyl skeleton of the present invention include an epoxy resin having a biphenyl skeleton exemplified by the following formula (1) or (2) or a derivative thereof, and particularly has a structure of the formula (1). Epoxy resins or derivatives thereof are preferred.
また、本発明は、例えばフェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂などを併用することもできる。これらは単独で用いても、２種以上を併用してもよい。 The present invention also includes, for example, phenol novolac type epoxy resins, cresol novolac type epoxy resins, bisphenol type epoxy resins, stilbene type epoxy resins, triphenolmethane type epoxy resins, phenol aralkyl type epoxy resins, naphthol type epoxy resins, and naphthalene type epoxy resins. Resin, dicyclopentadiene type epoxy resin and the like can be used in combination. These may be used alone or in combination of two or more.
上記のようなビフェニル骨格を有するエポキシ樹脂はエポキシ系接着剤に高い密着性を有しているため、封止体と蓋体との間の高密着性を達成することができる。 Since the epoxy resin having a biphenyl skeleton as described above has high adhesion to the epoxy adhesive, high adhesion between the sealing body and the lid can be achieved.
上記ビフェニル骨格を有するエポキシ樹脂は、エポキシ樹脂組成物の全エポキシ成分中、１０〜１００重量％含有することが好ましく、５０〜１００重量％含有することがより好ましい。 The epoxy resin having a biphenyl skeleton is preferably contained in an amount of 10 to 100% by weight, more preferably 50 to 100% by weight, based on all epoxy components of the epoxy resin composition.
本発明において、硬化剤としては特に限定されないが、例えばフェノールノボラック樹脂、クレゾールノボラック樹脂、フェノールアラルキル樹脂、ナフトールアラルキル樹脂等、各種多価フェノール化合物あるいは、ナフトール化合物を用いることができる。 In the present invention, the curing agent is not particularly limited, and various polyphenol compounds or naphthol compounds such as phenol novolak resin, cresol novolak resin, phenol aralkyl resin, naphthol aralkyl resin, and the like can be used.
エポキシ樹脂と硬化剤との当量比は適宜決定できるが、エポキシ樹脂の全量／硬化剤の全量＝約０.５〜１.５（当量比）、好ましくは、０.８〜１.２の範囲が良い。この配合割合が０.５よりも小さいと、硬化剤の配合量が多すぎて経済的に不利となる恐れがあり、また上記の配合割合が１.５を超えると、硬化剤の配合量が少なすぎて硬化不足になる恐れがある。 The equivalent ratio of the epoxy resin and the curing agent can be appropriately determined, but the total amount of the epoxy resin / the total amount of the curing agent = about 0.5 to 1.5 (equivalent ratio), preferably in the range of 0.8 to 1.2. Is good. If this blending ratio is less than 0.5, the blending amount of the curing agent may be too large, which may be economically disadvantageous. If the blending ratio exceeds 1.5, the blending amount of the curing agent is too high. There is a risk of insufficient curing due to too little.
本発明において、無機充填材としては例えば結晶シリカ、溶融シリカ、アルミナ、窒化珪素等を使用することができる。無機充填材の配合量は、７５〜９５重量％の範囲で使用することができるが、８５〜９０重量％の範囲とすることがより好ましい。 In the present invention, for example, crystalline silica, fused silica, alumina, silicon nitride or the like can be used as the inorganic filler. The compounding amount of the inorganic filler can be used in the range of 75 to 95% by weight, but more preferably in the range of 85 to 90% by weight.
本発明では、任意成分として例えば硬化促進剤、離型剤、シランカップリング剤、難燃剤、着色剤、シリコーン可撓剤等を配合することができる。 In this invention, a hardening accelerator, a mold release agent, a silane coupling agent, a flame retardant, a coloring agent, a silicone flexible agent etc. can be mix | blended as arbitrary components, for example.
硬化促進剤としては、エポキシ基とフェノール性水酸基の反応を促進するものであれば特に限定しないが、例えばテトラフェニルホスホニウム・テトラフェニルボレートや２−メチルイミダゾール、２−フェニルイミダゾール等のイミダゾール類の他、トリフェニルホスフィン、トリブチルホスフィン、トリメチルホスフィン等の有機ホスフィン類、１,８−ジアザビシクロ（５,４,０）ウンデセン−７（ＤＢＵ）、トリエタノールアミン、ベンジルジメチルアミン等の３級アミン等の１種以上を用いることができる。 The curing accelerator is not particularly limited as long as it accelerates the reaction between an epoxy group and a phenolic hydroxyl group. For example, other imidazoles such as tetraphenylphosphonium, tetraphenylborate, 2-methylimidazole, and 2-phenylimidazole can be used. , Organic phosphines such as triphenylphosphine, tributylphosphine, and trimethylphosphine, 1,8-diazabicyclo (5,4,0) undecene-7 (DBU), tertiary amines such as triethanolamine, benzyldimethylamine, etc. More than seeds can be used.
離型剤としては、例えば天然カルナバ、脂肪酸アミド、カルナバワックス、ステアリン酸、モンタン酸アミド、脂肪酸エステル、カルボキシル基含有ポリオレフィン等を用いることができる。 As the mold release agent, for example, natural carnauba, fatty acid amide, carnauba wax, stearic acid, montanic acid amide, fatty acid ester, carboxyl group-containing polyolefin and the like can be used.
さらに、シランカップリング剤としては、例えばγ−メルカプトプロピルトリメトキシシラン等のメルカプトシランの他、γ−グリシドキシプロピルトリメトキシシラン等のグリシドキシシラン、またアミノシラン等の１種以上を用いることができる。 Furthermore, as the silane coupling agent, for example, one or more of glycidoxysilane such as γ-glycidoxypropyltrimethoxysilane, aminosilane, etc., in addition to mercaptosilane such as γ-mercaptopropyltrimethoxysilane, etc. Can do.
難燃剤としては、例えば三酸化アンチモン、ハロゲン化合物、リン化合物、各種の金属水和物などを用いることができ、着色剤としては、例えばカーボンブラック、酸化チタンなどを用いることができる。シリコーン可撓剤としては、例えばシリコーンゲル、シリコーンオイル、シリコーンゴムなどを挙げることができる。これらの任意成分の配合量は制限されるものでなく、適宜選定すればよい。 Examples of flame retardants that can be used include antimony trioxide, halogen compounds, phosphorus compounds, and various metal hydrates. Examples of colorants that can be used include carbon black and titanium oxide. Examples of the silicone flexible agent include silicone gel, silicone oil, and silicone rubber. The blending amount of these optional components is not limited and may be appropriately selected.
本発明の封止材用のエポキシ樹脂組成物は、例えば上記エポキシ樹脂、硬化剤、無機充填材、及び、その他の任意成分を配合し、ミキサー・ブレンダー等で均一に混合した後、ニーダーやロールで加熱・混練する。また、上記の混練後に必要に応じて冷却固化したものを粉砕することにより得ることができる。 The epoxy resin composition for a sealing material of the present invention contains, for example, the above epoxy resin, a curing agent, an inorganic filler, and other optional components, and after mixing uniformly with a mixer / blender, etc., a kneader or roll Heat and knead. Moreover, it can obtain by grind | pulverizing what was cooled and solidified as needed after said kneading | mixing.
本発明の封止材用のエポキシ樹脂組成物は封止材１を形成するための成形材料として用いるものであり、例えば、トランスファー成形などで凹部２を有する封止材１に成形することができる。また、封止材１を成形する際にリード６を同時にインサート成形することができる。
The epoxy resin composition for a sealing material of the present invention is used as a molding material for forming the sealing material 1 and can be molded into the sealing material 1 having the
上記成形条件の好適な範囲としては、金型温度が１７０〜１８０℃であり、キュア時間（成形時間）が、６０〜１２０秒、好ましくは、８０〜１２０秒である。 As a preferable range of the molding conditions, the mold temperature is 170 to 180 ° C., and the curing time (molding time) is 60 to 120 seconds, preferably 80 to 120 seconds.
さらに、本発明の封止材は、上記成形後に後硬化を行うことが好ましい。この後硬化としては、１６０〜１８０℃、２〜６時間行うことがより好ましい。 Furthermore, the encapsulant of the present invention is preferably post-cured after the molding. This post-curing is more preferably performed at 160 to 180 ° C. for 2 to 6 hours.
本発明の封止材として用いられる樹脂組成物の硬化物は、上記のようにして得られる封止材の中でも、５０℃における線膨張係数が８〜１３ｐｐｍ、好ましくは９〜１２ｐｐｍ、５０℃における弾性率が１６〜２８ＧＰａ、好ましくは１８〜２５ＧＰａであることを特徴とする。 The cured product of the resin composition used as the sealing material of the present invention has a linear expansion coefficient at 50 ° C. of 8 to 13 ppm, preferably 9 to 12 ppm at 50 ° C., among the sealing materials obtained as described above. The elastic modulus is 16 to 28 GPa, preferably 18 to 25 GPa.
硬化物の５０℃における線膨張係数が、８ｐｐｍ未満だと接着剤層を介したガラス等の蓋体との寸法変化の差が大きくなり、十分な密着性が得られない。また１３ｐｐｍを越えると同様に十分な密着性が得られない。 If the linear expansion coefficient at 50 ° C. of the cured product is less than 8 ppm, the difference in dimensional change from a lid such as glass via the adhesive layer becomes large, and sufficient adhesion cannot be obtained. On the other hand, if it exceeds 13 ppm, sufficient adhesion cannot be obtained.
硬化物の５０℃における弾性率が１６ＧＰａ未満の場合、硬化物の強度が十分に得られず硬化物が破壊してしまう恐れがある。また２８ＧＰａを越えると、光半導体装置に発生する応力を緩和することができず、接着剤層を介したガラス等の蓋体との密着性が十分に得られない。 When the elastic modulus at 50 ° C. of the cured product is less than 16 GPa, the strength of the cured product cannot be obtained sufficiently and the cured product may be destroyed. On the other hand, if it exceeds 28 GPa, the stress generated in the optical semiconductor device cannot be relaxed, and sufficient adhesion to a lid such as glass through the adhesive layer cannot be obtained.
また本発明の封止材の樹脂組成物の硬化物は、硬化物のガラス転移温度が１１０℃以上、好ましくは１１５℃以上のものが好ましい。１１０℃未満でも、線膨張、弾性率の値により密着性を得られるが、１１０℃以上の方がより寸法安定性が増し、密着性がより良くなる。また、高温特性も良くなる。 Further, the cured product of the resin composition of the sealing material of the present invention preferably has a glass transition temperature of 110 ° C. or higher, preferably 115 ° C. or higher. Even if it is less than 110 degreeC, adhesiveness can be acquired with the value of linear expansion and an elasticity modulus, However, 110 degreeC or more increases dimensional stability more, and adhesiveness becomes better. Also, the high temperature characteristics are improved.
また本発明の封止材の樹脂組成物の硬化物は、成形収縮率が０.１５〜０.３５％、好ましくは０．１８〜０．３０％のものが好ましい。０.１５％未満でも、線膨張、弾性率の値により密着性を得られるが０.１５％以上の方が、より寸法安定性が増し、より密着性が良くなる。また０.３５％を越えても、線膨張、弾性率の値により密着性も得られるが、０.３５％以下の方が、より寸法安定性が増し、より密着性が良くなる。また低反り性も良くなる。 The cured product of the resin composition of the sealing material of the present invention preferably has a molding shrinkage of 0.15 to 0.35%, preferably 0.18 to 0.30%. Even if it is less than 0.15%, adhesion can be obtained by the values of linear expansion and elastic modulus, but 0.15% or more improves dimensional stability and improves adhesion. Further, even if it exceeds 0.35%, adhesion can also be obtained depending on the values of linear expansion and elastic modulus. However, when it is 0.35% or less, dimensional stability is further increased and adhesion is improved. Also, low warpage is improved.
本発明の封止材用エポキシ樹脂組成物からなる硬化物は、上記のように所定の線膨張係数、弾性率、ガラス転移温度、成形収縮率を有するものが好適であるが、このような硬化物を得るための組成としては、樹脂組成物中に全エポキシ樹脂を、４〜８重量％、無機充填材を８０〜８９重量％で使用することが好ましい。なお、硬化剤は前述したエポキシ樹脂との当量比で適宜選定されるが、４〜８重量％とすることが好ましい。 The cured product composed of the epoxy resin composition for a sealing material of the present invention preferably has a predetermined linear expansion coefficient, elastic modulus, glass transition temperature, and molding shrinkage as described above. As a composition for obtaining a product, it is preferable to use 4 to 8% by weight of the total epoxy resin and 80 to 89% by weight of the inorganic filler in the resin composition. In addition, although a hardening | curing agent is suitably selected by the equivalent ratio with the epoxy resin mentioned above, it is preferable to set it as 4 to 8 weight%.
本発明において、封止材と蓋体を接着するエポキシ系接着剤としては、例えば二液性エポキシ系接着剤や、一液性エポキシ系接着剤、常温硬化型、加熱硬化型のエポキシ系接着剤を好適に用いることができる。 In the present invention, as the epoxy adhesive for bonding the sealing material and the lid, for example, a two-part epoxy adhesive, a one-part epoxy adhesive, a room temperature curing type, a heat curing type epoxy adhesive Can be suitably used.
封止材と蓋体を接着するには、上記のようなエポキシ系接着剤を用い、ディスペンサーで所定位置に塗布することにより、封止材と蓋体との接合が行われる。上記接合時の温度は接着剤の種類に応じて適宜選定することができる。 In order to bond the sealing material and the lid, the sealing material and the lid are joined by applying the epoxy adhesive as described above to a predetermined position with a dispenser. The temperature at the time of joining can be appropriately selected according to the type of adhesive.
以下に実施例、比較例を挙げて説明するが、本発明は何らこれら実施例に限定されるものではない。 Examples and comparative examples will be described below, but the present invention is not limited to these examples.
実施例、比較例で用いた各成分は次の通りである。
［樹脂組成物の各成分］
・エポキシ樹脂１：ビフェニル型エポキシ樹脂〔ジャパンエポキシレジン（株）製 ＹＸ４０００Ｈ〕、エポキシ当量１９６
・エポキシ樹脂２：Ｏ−クレゾールノボラック型エポキシ樹脂〔住友化学工業（株）製 ＥＳＣＮ １９５ＸＬ〕、エポキシ当量１９５
・エポキシ樹脂３：フェノールグリシジル型エポキシ樹脂〔日本化薬（株）製 ＥＰＰＮ５０１Ｈ〕、エポキシ当量１６４
・硬化剤１：フェノールアラルキル樹脂〔三井化学（株）製 ＸＬ−２２５〕、水酸基当量１７６〕
・硬化剤２：フェノールノボラック〔荒川化学工業 （株）製 タマノール７５２〕、水酸基当量１０４
・硬化剤３：テルペンフェノール〔ヤスハラケミカル製 ＹＰ９０〕、水酸基当量１９２
・無機充填材：シリカ〔電気化学工業株式会社製 ＦＢ８２０〕
・カップリング剤：γ−グリシドキシプロピルトリメトキシシラン〔信越化学工業（株）製 ＫＢＭ４０３〕
・カーボンブラック：〔三菱化学（株）製 ４０Ｂ〕
・硬化促進剤：〔北興化学工業（株）製 ＴＰＰ〕
・金型離型用ＷＡＸ：〔大日化学（株）製 Ｆ１−１００〕
＜実施例１〜７及び比較例１〜６＞
表１及び表２に記載の配合割合（重量％）で各材料を、ブレンダーで３０分間混合し均一化した後、８０℃に加熱した２本ロールで混練溶融させて押し出し、冷却後、粉砕機で所定粒度に粉砕して、粒状材料を得、以下の成形条件で封止材を成形した。
Each component used in Examples and Comparative Examples is as follows.
[Each component of the resin composition]
Epoxy resin 1: biphenyl type epoxy resin [YX4000H manufactured by Japan Epoxy Resin Co., Ltd.], epoxy equivalent 196
Epoxy resin 2: O-cresol novolac type epoxy resin [ESCN 195XL manufactured by Sumitomo Chemical Co., Ltd.], epoxy equivalent 195
Epoxy resin 3: phenol glycidyl type epoxy resin [EPPN501H manufactured by Nippon Kayaku Co., Ltd.], epoxy equivalent 164
Curing agent 1: phenol aralkyl resin [XL-225, manufactured by Mitsui Chemicals, Ltd., hydroxyl equivalent 176]
Curing agent 2: phenol novolac [Arakawa Chemical Industries, Ltd. Tamanol 752], hydroxyl group equivalent 104
Curing agent 3: Terpene phenol [YP90 manufactured by Yasuhara Chemical], hydroxyl equivalent 192
・ Inorganic filler: Silica [Electrochemical Industry Co., Ltd. FB820]
Coupling agent: γ-glycidoxypropyltrimethoxysilane [KBM403 manufactured by Shin-Etsu Chemical Co., Ltd.]
・ Carbon black: [Mitsubishi Chemical Corporation 40B]
・ Curing accelerator: [TPP manufactured by Hokuko Chemical Co., Ltd.]
・ Wax for mold release: [F1-100, manufactured by Dainichi Chemical Co., Ltd.]
<Examples 1-7 and Comparative Examples 1-6>
After mixing and homogenizing each material with a blender for 30 minutes in a blending ratio (% by weight) shown in Table 1 and Table 2, the mixture was kneaded and melted with two rolls heated to 80 ° C, cooled, and then pulverized. To obtain a granular material, and a sealing material was molded under the following molding conditions.
［トランスファー成形条件］
金型温度：１７５℃
注入圧力：７０ｋｇｆ／ｃｍ2
成形時間：９０秒
後硬化 ：１７５℃、６時間
上記のようにして作製した各封止材について、以下の評価を行った。
[Transfer molding conditions]
Mold temperature: 175 ° C
Injection pressure: 70 kgf / cm 2
Molding time: 90 seconds Post-curing: 175 ° C., 6 hours The following evaluation was performed on each sealing material produced as described above.
［線膨張係数、ガラス転移温度の測定］
直径５ｍｍ、長さ２０ｍｍの円柱型評価用サンプルを上記条件にて成形し、熱機械測定装置（ＴＭＡ）により５０℃における線膨張係数、およびガラス転移温度を求めた。
[Measurement of linear expansion coefficient and glass transition temperature]
A cylindrical evaluation sample having a diameter of 5 mm and a length of 20 mm was molded under the above conditions, and a linear expansion coefficient at 50 ° C. and a glass transition temperature were determined by a thermomechanical measurement apparatus (TMA).
［弾性率の測定］
ＪＩＳ Ｋ ６９１１に準拠して、試験片を成形すると共に、オートグラフにより雰囲気温度５０℃±２℃での弾性率を求めた。
[Measurement of elastic modulus]
In accordance with JIS K 6911, a test piece was molded, and the elastic modulus at an ambient temperature of 50 ° C. ± 2 ° C. was determined by an autograph.
［成形収縮率の測定］
ＪＩＳ Ｋ ６９１５，ＪＩＳ Ｋ ６９１１に準拠して、試験片を成形すると共に、マイクロメータを用いて寸法を測定し、成形収縮率を求めた。
[Measurement of molding shrinkage]
In accordance with JIS K 6915 and JIS K 6911, a test piece was molded, and dimensions were measured using a micrometer to obtain a molding shrinkage.
［パッケージ密着性の測定］
Ｃｕリードフレームに中空モールド品を上記条件で成形し、接着剤を用いてガラスを搭載した。温度サイクル試験（−５０〜１５０℃、５０ｃｙｃｌｅ）後、超音波探査装置にてガラス面との剥離の有無を観察し、試験パッケージ数に対する剥離発生パッケージ数で評価した。
[Measurement of package adhesion]
A hollow mold product was formed on a Cu lead frame under the above conditions, and glass was mounted using an adhesive. After the temperature cycle test (−50 to 150 ° C., 50 cycles), the presence or absence of peeling from the glass surface was observed with an ultrasonic exploration device, and the number of peeled packages relative to the number of test packages was evaluated.
なお、接着剤としては、エポキシ系接着剤［チバガイギー社製のアラルダイト・ラピッド］を用い、２５℃で１２時間硬化を行って、接着した。 As an adhesive, an epoxy adhesive [Araldite Rapid manufactured by Ciba-Geigy Co., Ltd.] was used and cured at 25 ° C. for 12 hours for adhesion.
表１及び表２に示すように、本発明のビフェニル骨格を有するエポキシ樹脂を含有するエポキシ樹脂組成物で、その硬化物の熱膨張係数及び弾性率が特定範囲にあるものを光半導体用の封止材に用いることにより、蓋体との間を接着するエポキシ系接着剤と優れた密着性が得られることが分かる。 As shown in Tables 1 and 2, an epoxy resin composition containing an epoxy resin having a biphenyl skeleton of the present invention, which has a thermal expansion coefficient and an elastic modulus of the cured product in a specific range, is sealed for optical semiconductors. It turns out that the adhesiveness excellent with the epoxy-type adhesive agent which adhere | attaches between lid bodies is obtained by using for a stop material.
１ 封止材
２ 凹部
３ 光半導体素子
４ 蓋体
５ 接着剤層
６ リード
DESCRIPTION OF SYMBOLS 1
Claims (2)
前記接着剤がエポキシ系接着剤であり、
前記封止材はエポキシ樹脂組成物の硬化物からなり、
前記樹脂組成物は少なくともビフェニル骨格を有するエポキシ樹脂を含有し、
この硬化物の５０℃における線膨張係数が８〜１０ｐｐｍ、５０℃における弾性率が１６〜２３ＧＰａ、ガラス転移温度が１１０〜１３５℃であることを特徴とする光半導体装置。 In an optical semiconductor device comprising a sealing material containing an optical semiconductor element, and a transparent lid bonded through an adhesive and the sealing material,
The adhesive is an epoxy adhesive,
The sealing material is a cured product of an epoxy resin composition,
The resin composition contains an epoxy resin having at least a biphenyl skeleton,
An optical semiconductor device, wherein the cured product has a linear expansion coefficient at 50 ° C. of 8 to 10 ppm, an elastic modulus at 50 ° C. of 16 to 23 GPa, and a glass transition temperature of 110 to 135 ° C.
The optical semiconductor device according to claim 1, wherein a molding shrinkage ratio of the cured product is 0.15 to 0.35%.
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