JP4081606B2 - Pattern drawing apparatus and pattern drawing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a pattern drawing apparatus for forming a drawing pattern such as a circuit pattern on a drawing object such as a photomask (rectile) or a direct silicon wafer or printed board as an original plate.
[0002]
[Prior art]
Conventionally, drawing apparatuses that form circuit patterns on the surface of an object to be drawn, such as silicon wafers, LCDs (Liquid Crystal Displays), and PWBs (Printed Wiring Boards), are known. Electron beams and lasers are based on pre-created pattern data. The exposure surface is scanned by the beam, and a photosensitive material such as a photographic material or a photoresist applied to the surface of the photomask as an original plate reacts with light to form a circuit pattern. In addition, a drawing apparatus that directly forms a circuit pattern on a drawing object such as a printed circuit board or a silicon wafer without using a photomask has been realized.
[0003]
In a drawing apparatus, instead of providing a light source side member such as an AOM (Acousto-Optic Modulator) on the light source side, an LCD (Liquid Crystal Display) or DMD (Digital Micro-mirror Device) is used. A circuit pattern can be formed, and a circuit pattern is formed on an object to be drawn by ON / OFF control of a liquid crystal display element of an LCD or a micro micromirror of a DMD (see, for example, Patent Document 1). By using the LCD and DMD, it becomes possible to form a circuit pattern with accuracy.
[0004]
[Patent Document 1]
JP 2001-168003 A (pages 27 to 30, FIG. 27)
[0005]
[Problems to be solved by the invention]
However, when an optical modulation unit such as an LCD or DMD is used, the accuracy of the circuit pattern is affected by the resolution of the LCD or the arrangement configuration of the DMD and the projection magnification. That is, the pattern accuracy changes according to the element size on the non-exposed surface of the LCD or DMD. In this case, in order to form a high-precision pattern, it is necessary to project light in a reduced size, which inevitably reduces the exposure area. As a result, the tact (pattern formation time) becomes longer.
[0006]
Accordingly, an object of the present invention is to provide a pattern drawing apparatus and a pattern drawing method capable of efficiently and finely adjusting a pattern width when a pattern is formed using a light modulation unit.
[0007]
[Means for Solving the Problems]
A pattern drawing apparatus according to the present invention is a drawing apparatus that forms a pattern on an exposure surface of a pattern forming body such as a photomask, a printed substrate, or a silicon wafer as an original plate, and a light source that emits light to form a pattern; A plurality of regularly arranged light modulation elements, each of which is determined in one of a first state for guiding light from the light source to the exposure surface and a second state for guiding light to other than the exposure surface. A light modulating unit having the light modulating element, a stage relative movement means for two-dimensionally moving the stage on which the pattern forming body is mounted in the scanning direction and the sub-scanning direction with respect to the light modulating element, and an exposure surface Pattern forming control means for independently controlling each of the plurality of light modulation elements according to the pattern data in order to form a predetermined pattern. For example, the light modulation unit is a DMD (digital micromirror device) configured by a micromirror as a light modulation element, and the micromirrors are arranged one-dimensionally or two-dimensionally in a matrix. In this case, each micromirror is selectively positioned in either the first position for guiding light to the exposure surface or the second position for guiding light to the outside of the exposure surface. Alternatively, an LCD (liquid crystal display device) is applied instead of the DMD, and light is transmitted or shielded by selectively switching the arrangement direction of the liquid crystal display elements.
[0008]
The pattern drawing apparatus of the present invention is a drawing apparatus that moves the stage by a continuous movement method, and the stage relative movement means continuously moves the stage along the scanning direction at a constant speed. That is, raster scanning is executed. The drawing apparatus is provided with position detecting means for detecting the relative position of the stage with respect to the exposure area of the light modulation unit. The light modulation unit may be fixed and the stage may be moved two-dimensionally, or the stage may be moved only in the sub-scanning direction and the light modulation unit may be moved along the scanning direction. .
[0009]
In the present invention, the distance along the scanning direction for the projection spot corresponding to one light modulation element (hereinafter referred to as the element width distance) is shorter than the time for the stage to move relatively, and a plurality of light beams are emitted at shorter time intervals. The state of each modulation element can be switched. Therefore, the exposed portion and the non-exposed portion can be mixed in the region of the projection spot of the light modulation element. The pattern formation control unit controls each of the plurality of light modulation elements according to the pattern formation exposure time determined in accordance with the movement of the stage and the detected relative position. Therefore, after forming a fine pattern whose line width in the scanning direction is equal to or less than the element width distance on a predetermined line on the exposure surface, a pattern with the same line width can be formed on the next line by adjusting the exposure timing. .
[0010]
In this way, the optical modulation unit that can switch the light modulation element at high speed with respect to the moving speed of the stage is provided, and by applying the continuous movement method, the line along the scanning direction is independent of the size of the light modulation element. The circuit pattern can be formed on the exposure surface by setting the width to be fine. In addition, since a member having a shutter function such as a diaphragm is not provided on the light source side, or the light source itself is not controlled to perform light ON / OFF control, the illumination light stably reaches the exposure surface, and a high-precision pattern Can be formed.
[0011]
In the continuous movement method, a time zone for exposure and a time zone for non-exposure come alternately. For this reason, the pattern formation control means has a pattern data memory for storing circuit pattern data corresponding to the circuit pattern and an OFF data memory for storing OFF data for controlling the light modulation element so as to guide the light to the outside of the exposure surface. In the non-exposure time zone, when it is desirable to control the light modulation unit based on the OFF data memory stored in the OFF data memory while moving the exposure area corresponding to the light modulation unit to the next projection spot, it is always the same. It is only necessary to use OFF data stored in the memory.
[0012]
For example, the pattern formation control means has an exposure / non-exposure selection switch that is selectively connected to either the pattern data memory or the OFF data memory. The pattern formation control means switches the exposure / non-exposure selection switch from the pattern data memory to the OFF data memory when the pattern formation exposure time elapses, while the exposure / non-exposure selection switch when the stage moves to the next projection spot. Is switched from the OFF data memory to the pattern data memory.
[0013]
The pattern formation exposure time is preferably set according to the position of the exposure area with respect to the exposure surface so that a pattern with a narrow line width can be formed along the sub-scanning direction. In this case, the formation pattern exposure time varies depending on the position of the exposure area on the exposure surface.
[0014]
The pattern drawing method of the present invention is a plurality of regularly arranged light modulation elements that emit light to form a pattern on an exposure surface of a pattern forming body, and each of the light modulation elements is regularly arranged on the exposure surface. Irradiated light is irradiated to the light modulation unit having a plurality of light modulation elements defined in either the first state for guiding or the second state for guiding to other than the exposure surface, and the pattern forming body is placed thereon. The stage thus moved is two-dimensionally moved relative to the light modulation element in the scanning direction and the sub-scanning direction, the relative position of the stage with respect to the exposure area by the light modulation unit is detected, and a predetermined pattern is formed on the exposure surface. Therefore, there is provided a pattern drawing method for independently controlling each of a plurality of light modulation elements according to pattern data, wherein the stage is moved continuously along the scanning direction at a constant speed. Switch the state of each of the light modulation elements according to the movement of the stage by a time interval shorter than the time the stage moves relative to the distance along the scanning direction for the projection spot corresponding to the light modulation element. Each of the plurality of light modulation elements is controlled according to a predetermined pattern formation exposure time and the detected relative position.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a pattern drawing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
[0016]
FIG. 1 is a perspective view schematically showing a pattern drawing apparatus according to this embodiment, and FIG. 2 is a view schematically showing an exposure unit provided in the pattern drawing apparatus. FIG. 3 shows the movement of the exposure area accompanying the movement of the stage. The pattern drawing apparatus of this embodiment is a drawing apparatus that can form a circuit pattern by directly irradiating light onto a substrate such as a printed board or a silicon wafer coated with a photoresist.
[0017]
The pattern drawing apparatus 10 includes a gate-like structure 12 and a base 14, and an XY stage driving mechanism 19 that supports an XY stage 18 is mounted on the base 14. A substrate SW is installed on the top. The gate-like structure 12 is provided with an exposure unit 20 for forming a circuit pattern on the surface of the substrate SW, and the exposure unit 20 operates in accordance with the movement of the XY stage 18. Further, the drawing apparatus 10 includes a drawing control unit (not shown here) that controls the movement of the XY stage 18 and the operation of the exposure unit 20.
[0018]
As shown in FIG. 2, the exposure unit 20 includes a DMD (Digital Micro-mirror Device) 22, an illumination optical system 24, and an imaging optical system 26, and is arranged between an argon laser 21 used as a light source and the DMD 22. The illumination optical system 24 is disposed, and the imaging optical system 26 is disposed between the DMD 22 and the substrate SW. Light (laser beam) continuously emitted from the argon laser 21 at a constant intensity is guided to the illumination optical system 24 through an optical fiber bundle (not shown).
[0019]
The illumination optical system 24 includes a convex lens 24 </ b> A and a collimator lens 24 </ b> B. When the laser beam LB passes through the illumination optical system 24, light composed of a light beam that totally illuminates the DMD 22 is formed. The DMD 22 is a light modulation unit in which minute micromirrors having an order of μm are arranged in a matrix, and each micromirror rotates and moves by an electrostatic field effect. In the present embodiment, the DMD 22 is configured by arranging M × N square micromirrors in a matrix, and micromirrors corresponding to the positions of the array (i, j) are “X _ij ” (1 ≦ 1). i ≦ M, 1 ≦ j ≦ N).
[0020]
The micromirror X _ij is positioned in one of a first posture for reflecting the light LB from the argon laser 21 in the direction of the exposure surface SU of the substrate SW and a second posture for reflecting the light LB in the direction outside the exposure surface SU. Then, the posture is switched according to the control signal from the drawing control unit. When the micromirror X _ij is positioned in the first posture, the light reflected on the micromirror X _ij is guided toward the imaging optical system 26. The imaging optical system 26 includes two convex lenses 26A and 26C and a reflector lens 26B, and light passing through the imaging optical system 26 irradiates a predetermined spot on the exposure surface SU. On the other hand, when the micromirror X _ij is positioned in the second attitude, the light reflected by the micromirror X _ij is guided toward the light absorbing plate 29 and deviates from the imaging optical system 26 to the exposure surface SU. Is not illuminated. Hereinafter, the state in which the micromirror X _ij is supported in the first posture is defined as the ON state, and the state in which the micromirror X _ij is supported in the second posture is defined as the OFF state. In the present embodiment, the magnification of the imaging optical system 26 is set to 1. The size (width, height) of the projection spot Y _{ij on} the exposure surface SU irradiated with light by one micromirror X _ij . ) Matches the size of the micromirror X _ij .
[0021]
When all the micromirrors are in the ON state with the XY stage 18 stopped, the entire exposure area EA having a size of (M × W) × (N × H) is irradiated on the exposure surface SU. Is done. However, the width and height of the micromirror X _ij are represented by W and H, respectively, where W = H. In the DMD 22, the micromirrors X _ij are independently turned on / off, so that the light irradiated on the entire DMD 22 is divided into light composed of light beams selectively reflected by the micromirrors. The As a result, light corresponding to the circuit pattern to be formed at that place is irradiated onto a predetermined region of the exposure surface SU on which the photosensitive photoresist layer is formed. As the XY stage 18 moves, the exposure area EA relatively moves on the exposure surface SU along the scanning direction, whereby a circuit pattern is formed along the scanning direction. For example, the size of the exposure surface SU is set to 500 × 600 mm, and the size of the exposure area EA is set to 20 × 15 mm.
[0022]
In the present embodiment, the XY stage 18 moves at a constant speed along the scanning direction according to raster scanning (see FIG. 3). The micro mirrors X _{ij of the} DMD 22 are independently controlled based on raster data corresponding to the circuit patterns, and the micro mirrors X _ij are the first so that a predetermined circuit pattern is formed in the exposure area EA. Positioning is performed in the posture or the second posture. Then, according to the relative movement of the exposure area EA accompanying the movement of the XY stage 18, the micromirrors _Xij are sequentially turned ON / OFF. When the scanning for one line is completed, the XY stage 18 moves in the sub-scanning direction (Y direction) so that the next line can be exposed, and the folded XY stage 18 moves along the scanning direction. By exposing all the lines, a circuit pattern is formed on the substrate SW.
[0023]
FIG. 4 is a block diagram of a drawing control unit in the drawing apparatus.
[0024]
The drawing control unit 30 includes a system control circuit 32, a DMD control unit 34, a stage control unit 38, a stage position detection unit 40, a raster conversion unit 42, and a light source control unit 44, and includes a CPU (Central Processing Unit). The control circuit 32 controls the entire drawing apparatus 10.
[0025]
When circuit pattern data corresponding to the drawing apparatus 10 is sent as CAM data to the raster conversion unit 42 of the drawing control unit 30, the circuit pattern data is converted into raster data corresponding to raster scanning and sent to the DMD control unit 34. The DMD control unit 34 performs ON / OFF control of each of the micromirrors X _ij in the DMD 22 based on the raster data and the relative position information from the stage position detection unit 40. The stage control unit 38 controls an XY stage driving mechanism 19 having a motor (not shown), and thereby the moving speed of the XY stage 18 is controlled. The stage position detector 40 detects the relative position of the XY stage 18 with respect to the exposure area EA of the XY stage 18. The system control circuit 32 sends a control signal to the light source control unit 44 in order to emit light from the argon laser 21 and outputs a control signal for controlling the exposure timing to the DMD control unit 34.
[0026]
FIG. 5 is a block diagram illustrating the DMD control unit 34 in detail, and FIG. 6 is a timing chart illustrating the operation of the DMD control unit 34. 7 to 11 are diagrams relating to the exposure operation. The exposure operation in this embodiment will be described with reference to FIGS. 3 and 5 to 11.
[0027]
The DMD control unit 34 includes a first memory 34A, a second memory 34B, and a third memory 34C, and also includes two switches 36A and 36B. Raster data corresponding to the circuit pattern sent from the raster conversion unit 42 is sequentially written in the first memory 34A and the second memory 34B. On the other hand, in the third memory 34C, data for positioning all the micromirrors X _{ij of the} DMD 22 in the OFF state, that is, in the second posture for guiding the light out of the exposure surface SU (hereinafter referred to as OFF data) is written. . The switches 36A and 36B are switched based on signals from the system control circuit 32 and the stage position detection unit 40. Further, the DMD control unit 34 is provided with a bitmap memory (not shown) for storing bitmap data in order to convert raster data into data according to the arrangement of each micromirror of the DMD 22.
[0028]
In the present embodiment, as shown in FIG. 6, predetermined raster data is alternately written in the first memory 34A and the second memory 34B in accordance with the exposure timing signal sent from the stage position detection unit 40. For example, in the process in which the XY stage 18 is relatively moved along the scanning direction, the exposure timing signal is adjacent to the projection area EA that is currently performing the exposure and has an area PA (the same size as the exposure area EA size). It is a signal output when moving to (see FIG. 3). That is, the exposure timing signal is output when the exposure area EA moves by one area on the exposure surface SU. While raster data is being written to one memory via the switch 36A / 36B, one area of raster data written to the other memory is read via the switch 36B / 36A. In the DMD control unit 34, the read raster data is stored in the bitmap memory as two-dimensional bitmap data corresponding to the ON / OFF control of the two-dimensionally arranged micromirrors. The bitmap data is sent to the DMD 22 as a drive signal for each micromirror of the DMD 22. In the present embodiment, the exposure timing signal may be output at an interval of relative movement amount L = EA / n (n: natural number) smaller than the exposure area EA.
[0029]
Next, the exposure operation in the present embodiment will be described with reference to FIGS.
[0030]
7 is a diagram showing a projection spot Y _ij corresponding to one micromirror X _ij of the DMD 22, and FIG. 8 is a diagram showing a relative movement of the projection spot Y _ij accompanying a relative movement of the micromirror X _ij . It is. As described above, when the XY stage 18 is stationary and one micromirror _Xij is in the first posture (ON state), the size of the projection spot _{Yij on} the exposure surface SU is in the X and Y directions. And W × H (W = H).
[0031]
When the XY stage 18 is relatively moved along the X direction by a distance d (<W) that is equal to or smaller than the width W, the projection spot Y _ij on the exposure surface SU is also relatively moved by the distance d. When the micromirror X _ij is maintained in the ON state during that time, the exposure amount distribution along the scanning direction (X direction) is as shown in FIG. In the following, the exposure time T is the time for the relative movement by the distance d.
[0032]
FIG. 9 shows an exposure amount distribution for the entire exposure section TE according to the distance d of one micromirror _Xij . Since the intensity of the light from the argon laser 21 is constant and the exposure amount increases in proportion to the exposure time, the maximum is obtained in the region where light is always irradiated during the exposure time T in the entire exposure section TE. An exposure amount p is obtained. Therefore, the distribution of the exposure amount over the entire exposure section TE gradually increases from 0 toward the maximum exposure amount p, maintains the maximum exposure amount p over the maximum section ME, and then decreases toward 0. The maximum exposure amount p follows the light amount of the spot Y _ij and the distance d (exposure time T).
[0033]
In the present embodiment, an exposure section having an exposure amount of p / 2 or more in such an exposure distribution is defined as W ′, and an area of W ′ × H is defined as a one-pixel exposure area NP (shaded portion in FIG. 10). Then, the predetermined micromirror X _ij is set to the ON state for the exposure time T corresponding to the distance d. Since the exposure section W ′ matches the width W of the projection spot Y _ij , the size (W ′ × H) of the one-pixel exposure region NP matches the size (W × H) of the projection spot Y _ij . Accordingly, X-Y stage 18 is a circuit pattern to be formed while moving at a constant speed, one pixel exposure region NP in accordance with the size of the micro-mirror X _ij is a pixel unit (exposure unit). The exposure time T (distance d) is determined by the required exposure amount of the photosensitive material and the light amount of the spot _Yij . Further, when it is desired to slightly change the line width depending on the position on the exposure surface SU by etching correction or the like, it is set according to the relative position between the exposure area EA and the exposure surface SU.
[0034]
FIG. 11 is a view showing an exposure operation in the present embodiment.
[0035]
In the present embodiment, one exposure operation is performed during a period in which the exposure area EA relatively moves by a predetermined distance, and the sequential exposure operation is regularly performed along the scanning direction. Assuming that the distance that the XY stage 18 is relatively moved from one exposure operation to the next exposure operation is A, the distance A is along the X direction of the one-pixel exposure region NP, that is, the exposure spot Y _ij . It is determined to be an integral multiple of the width W.
A = W × m (m is an integer) (1)
[0036]
On the exposure surface SU, while the exposure area EA moves relative to the distance A, the predetermined micromirror X _ij is set to the ON state for the exposure time T corresponding to the distance d, and the exposure area EA is set to the remaining distance ( During the relative movement of Ad), all the micromirrors _Xij are set to the OFF state.
[0037]
In FIG. 6, the exposure times are indicated as T1, T2,... In accordance with the first, second, third,... Exposure operations, and the exposure times T1, T2, T3,. Determined. The exposure times T1, T2, T3,... _{Are set} shorter according to the location of the exposure area EA on the exposure surface SU than the time during which the projection spot Y _ij moves relative to the projection spot Y _ij along the X direction. . While the exposure time T1 elapses, the predetermined micromirror X _ij is set to the ON state based on the data stored in the first memory 34A, and the time T1 ′ for moving the remaining distance (Ad) elapses. Meanwhile, all the micromirrors _Xij are set to the OFF state based on the data stored in the third memory 34C.
[0038]
When the exposure area EA is relatively moved by the distance A, the second exposure operation is executed as in the first time. Further, when the exposure area EA is relatively moved by the distance A, the third exposure operation is executed. Such an exposure operation is sequentially executed for each line along the scanning direction (X direction). As a result, a circuit pattern is formed on the entire exposure surface SU.
[0039]
As described above, according to the present embodiment, the DMD 22 is provided in the drawing apparatus 10 as a light intensity modulation device, and the exposure surface SU is patterned by independently controlling each of the micromirrors X _{ij of the} DMD 22. As the XY stage 18 continuously moves at a constant speed, the exposure area EA relatively moves along the scanning direction (X direction), whereby a circuit pattern is formed on the entire exposure surface SU. The Also, ON / OFF switching time interval of the micro-mirror X _ij is configured so that only the width W min of the one micro-mirror X _ij X-Y stage 18 is shorter than the time it takes for the relative movement, The exposure time T can be set shorter than the time required for relative movement by the width W. An exposure time T is determined according to the relative position between the exposure area EA and the exposure surface SU. Thereby, the width | variety of the conductor pattern along a subscanning direction (Y direction) can be formed accurately.
[0040]
In this embodiment, the DMD 22 is applied as a light modulation element unit, but an SLM (Spatial Light Modulator) device may be applied. Alternatively, an LCD may be used instead of the DMD 22.
[0041]
【The invention's effect】
As described above, according to the present invention, it is not necessary to provide a modulation function on the light source side, and a pattern that is more finely adjusted with respect to the conductor width can be formed.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing a pattern drawing apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram schematically showing an exposure unit provided in the pattern drawing apparatus.
FIG. 3 is a view showing movement of an exposure area accompanying movement of a stage.
FIG. 4 is a block diagram of a drawing control unit in the drawing apparatus.
FIG. 5 is a block diagram illustrating a DMD control unit in detail.
FIG. 6 is a timing chart showing the operation of a DMD control unit.
FIG. 7 is a diagram showing projection spots according to DMD micromirrors.
FIG. 8 is a diagram showing relative movement of a projection spot accompanying relative movement of a micromirror.
FIG. 9 is a view showing an exposure amount distribution with respect to an entire exposure section of the micromirror.
FIG. 10 is a diagram showing a one-pixel exposure region.
FIG. 11 is a diagram showing an exposure operation.
[Explanation of symbols]
10 Pattern drawing device 18 XY stage (stage)
19 XY stage drive mechanism (stage relative movement means)
20 Exposure unit 21 Argon laser (light source)
22 DMD (Light Modulation Unit)
34 DMD control unit 34A First memory (pattern data memory)
34B Second memory (pattern data memory)
34C Third memory (OFF data memory)
36B selection switch (exposure / non-exposure selection switch)
38 Stage control unit 40 Stage position detection unit SW Substrate (patterned body)
SU Exposure surface W Micromirror width EA Exposure area X _{ij Micromirror} (light modulation element)
T1, T2, T3 Exposure time (pattern formation exposure time)
NP 1 pixel exposure area

Claims (6)

A light source for forming a pattern on the exposed surface of the object to be patterned;
A plurality of regularly arranged light modulation elements, each of which is defined as one of a first state for guiding light from the light source to the exposure surface and a second state for guiding light to other than the exposure surface. A light modulation unit having a light modulation element of
Stage relative movement means for two-dimensionally moving the stage on which the pattern forming body is mounted in a scanning direction and a sub-scanning direction with respect to the light modulation element;
Position detecting means for detecting a relative position of the stage with respect to an exposure area by the light modulation unit;
Pattern forming control means for independently controlling each of the plurality of light modulation elements according to pattern data in order to form a predetermined pattern on the exposure surface;
The stage relative movement means moves the stage continuously at a constant speed along the scanning direction,
The pattern formation control unit is configured so that each of the plurality of light modulation elements has a shorter time interval than a time in which the stage relatively moves a distance along the scanning direction of the projection spot corresponding to one light modulation element. The state can be switched, and each of the plurality of light modulation elements is controlled according to a pattern formation exposure time determined in accordance with the movement of the stage and the detected relative position ,
The pattern formation control means
A pattern data memory for sequentially storing pattern data generated by raster conversion;
An OFF data memory for storing OFF data for determining all of the plurality of light modulation elements in the second state;
The pattern formation control means sends the pattern data in the pattern data memory to the light modulation unit during the pattern formation exposure time, and after the pattern formation exposure time has elapsed until the next exposure operation, A pattern drawing apparatus which switches from a pattern data memory to the OFF data memory and sends the OFF data to the light modulation unit .   The pattern writing apparatus according to claim 1, wherein the light modulation unit is a DMD (digital micromirror device) configured by a micromirror as the light modulation element. The pattern data memory is composed of first and second memories,
The pattern formation control unit alternately writes pattern data to the first memory and the second memory in accordance with an exposure timing signal, and while writing the pattern data to one memory, the pattern data is written to the other memory. 2. The drawing apparatus according to claim 1, wherein the pattern data is sent to the light modulation unit . The pattern formation control means includes an exposure / non-exposure selection switch that is connected to the light modulation unit and selectively connected to either the pattern data memory or the OFF data memory ,
The pattern formation control means switches the exposure / non-exposure selection switch from the pattern data memory to the OFF data memory when the pattern formation exposure time elapses, and the exposure / non-exposure when the exposure area reaches the next projection spot. The pattern drawing apparatus according to claim 1 , wherein an exposure selection switch is switched from the OFF data memory to the pattern data memory.   The pattern drawing apparatus according to claim 1, wherein the pattern formation exposure time is set according to a position of the exposure area with respect to the exposure surface. Emits light to form a pattern on the exposed surface of the object to be patterned,
A plurality of regularly arranged light modulation elements, each of which is defined as one of a first state for guiding light from the light source to the exposure surface and a second state for guiding light to other than the exposure surface. The light modulation unit having the light modulation element is irradiated with light emitted for pattern formation,
The stage on which the pattern forming body is mounted is relatively moved two-dimensionally in the scanning direction and the sub-scanning direction with respect to the light modulation element,
Detecting the relative position of the stage with respect to an exposure area by the light modulation unit;
A pattern drawing method for independently controlling each of the plurality of light modulation elements according to pattern data in order to form a predetermined pattern on the exposure surface,
Moving the stage continuously at a constant speed along the scanning direction;
The state of each of the plurality of light modulation elements is switched by a shorter time interval than the time during which the stage relatively moves the distance along the scanning direction of the projection spot corresponding to one light modulation element,
Controlling each of the plurality of light modulation elements according to a pattern formation exposure time determined in accordance with the movement of the stage and the detected relative position ;
The pattern formation control means sends pattern data in a pattern data memory in which pattern data generated by raster conversion is sequentially stored during the pattern formation exposure time to the light modulation unit, and the pattern formation exposure time has elapsed. Until the exposure area reaches the next projection spot, the pattern data memory is switched from the pattern data memory to an OFF data memory for storing OFF data defining the second state. A pattern drawing method , wherein OFF data is sent to the light modulation unit .

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