JP3978456B2 - LED mounting board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting diode packaging substrate where a bottom substrate and an upper one are insulated electrically, and circuits, or the like having different functions are arranged on each substrate. <P>SOLUTION: The light-emitting diode packaging substrate 1 comprises the bottom substrate 11 having an insulator in which a first through-hole is provided, a support film 4 (copper foil, or the like) for radiation that is laminated on one surface and is 50-500 &mu;m thick, and a conductive layer 5 provided on the other surface; a light-emitting diode element 2 joined to the support film for radiation inside the first through-hole in the insulator; an insulating intermediate layer 12 that is laminated at a part excluding the opening of the first through-hole in the other surfaces of the bottom substrate, and has a second through-hole communicating with the entire surface of the opening surface of the first through-hole; and an upper substrate 13 that is laminated at a part excluding the opening of the second through-hole in the surfaces, and has a third through-hole communicating with the entire surface of the opening surface in the second through-hole. The bottom substrate is electrically insulated from the upper one. <P>COPYRIGHT: (C)2007,JPO&amp;INPIT

Description

  The present invention relates to a light emitting diode mounting substrate. More specifically, the present invention relates to a light emitting diode mounting substrate in which a bottom substrate and an upper substrate are electrically insulated, and a circuit having a different function can be provided on each substrate. Also, the insulating intermediate layer laminated to insulate the bottom substrate from the top substrate can also be a substrate on which circuits having different functions are arranged, and other insulating layers as necessary. It is related with the light emitting diode mounting board | substrate which can laminate | stack.

  Conventionally, lighting and the like in which a light emitting diode element is mounted on a printed circuit board have been developed. In particular, in recent years, illumination with high output and high brightness is required. More light-emitting diode elements are mounted on a printed circuit board, and more current flows when turning on individual light-emitting diode elements. Has been made. Furthermore, by arranging a reflector around the light-emitting diode element and reflecting the output light from the light-emitting diode element in a predetermined direction and condensing it with this reflector, lighting etc. with improved luminous intensity has been proposed. Has been.

  However, when the output is increased and the luminance is increased, the conductive material that electrically connects the light emitting diode element and the electrode provided on the substrate may be thermally deteriorated due to heat generated by the light emitting diode element. In addition, the sealing resin that seals the light emitting diode element may be thermally deteriorated. For this reason, the number of light emitting diode elements that can be mounted on a substrate and the luminance of each element are actually limited. In particular, when a blue light-emitting diode element developed in recent years is used and when white light is emitted using this blue light-emitting diode element, the energy of the output light is higher than that of the conventional red light-emitting diode element, and the sealing resin is used. There exists a problem that it will deteriorate and color in a shorter time. When the sealing resin is colored in this way, there is a problem that the actual output light is reduced although the element itself maintains an output equivalent to the initial value.

  In order to solve the above problems, countermeasures such as using a sealing resin having high heat resistance and a structure capable of dissipating heat have been studied. For example, a light-emitting element in which a light-emitting diode chip is sealed with a sealing resin, and the sealing resin is a fluorine-based resin having visible light transmittance is disclosed (for example, see Patent Document 1). In this light-emitting element, since a fluorine-based resin having excellent weather resistance is used as the sealing resin, the sealing resin can be used even if the energy of light output from the light-emitting diode chip is high, that is, the luminance is increased. Is difficult to be colored, and it is difficult to be colored even by heat generated at the time of lighting, and the life of the light emitting element can be extended.

  In addition, on the surface of the ceramic substrate that has insulating properties and specific heat conductivity, a concave portion whose inner peripheral surface is inclined inward is formed, and a light emitting diode element serving as a light source is mounted on the bottom surface of the concave portion A light emitting diode mounting substrate as shown in FIG. 7 is disclosed (for example, see Patent Document 2). In this light emitting diode mounting substrate, it is not necessary to form the reflection portion using a member other than the ceramic substrate, and the number of components can be reduced and the light emitting diode mounting substrate can be manufactured with less man-hours. Further, it is described that the entire light emitting diode mounting substrate is made of ceramic having insulating properties and good thermal conductivity, so that heat dissipation can be enhanced while ensuring insulating properties.

JP 2003-8073 A JP 2003-347600 A

  As described above, various solutions have been studied and proposed for problems such as reduction of output light due to thermal degradation of sealing resin or the like due to high output and high luminance. However, in a conventional light emitting diode mounting substrate, a plurality of electrically insulated substrates are stacked, and if necessary, a circuit having a different function is disposed on each substrate, and the light emitting diode element is more complicated. The fact is that no study has been made from the viewpoint of enabling control and providing a wider range of applications.

  The present invention has been made in view of the above circumstances, and a bottom substrate and an upper substrate are electrically insulated, and a light emitting diode element (hereinafter also referred to as an “LED element”) is provided on each substrate. A light emitting diode mounting board (hereinafter referred to as an “LED mounting board”) can be provided with circuits having different functions for controlling the light emitting diode, and other boards can be stacked as required. It is an issue to provide.

The present invention is as follows.
(1) It has an insulating layer, a heat-radiating support film having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and a conductor layer provided on the other surface of the insulating layer. A bottom substrate provided with a first through hole penetrating the conductor layer;
A light emitting diode element bonded to the heat-dissipating support film inside the first through-hole, laminated on a portion of the other surface of the bottom substrate excluding the opening of the first through-hole, and the first through-hole; An insulating intermediate layer having a second through hole communicating with the entire opening surface of the hole, and a layer laminated on a portion of the surface of the insulating intermediate layer excluding the opening of the second through hole; An upper substrate having a third through-hole communicating with the entire opening surface of the through-hole,
A light emitting diode mounting substrate, wherein the bottom substrate and the upper substrate are electrically insulated.
(2) The light emitting diode according to (1) above, wherein an insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer and between the insulating intermediate layer and the upper substrate. Mounting board.
(3) The light-emitting diode mounting substrate according to (1) or (2), wherein a circuit for lighting and controlling the light-emitting diode element is disposed on the insulating intermediate layer.
(4) The light emitting diode mounting substrate according to any one of (1) to (3), wherein a circuit for lighting and controlling the light emitting diode element is disposed on the upper substrate.
(5) The second through-hole is larger in diameter than the first through-hole, and the second through-hole and the third through-hole have the same diameter, and the first through-hole and the second through-hole The light emitting diode mounting substrate according to any one of (1) to (4), wherein the through hole and the third through hole have the same axis.
(6) The light emitting diode mounting substrate according to any one of (1) to (5), wherein a reflective layer is provided on the surface of the heat dissipation support film exposed in the first through hole.
(7) The light-emitting diode mounting substrate according to any one of (1) to (6), wherein the heat dissipation support film is made of a copper film.
(8) The light-emitting diode mounting substrate according to any one of (1) to (7), further including a lens provided on the upper substrate and covering at least an opening surface of the third through hole.
(9) The light-emitting diode mounting substrate according to any one of (1) to (8), wherein a plurality of light-emitting diode elements are bonded to the heat dissipation support film inside the first through hole.
(10) The light emitting diode element includes three types, one of which is a red light emitting diode element, the other one is a green light emitting diode element, and the other one is a blue light emitting diode element. The light emitting diode mounting substrate according to any one of (1) to (9) above.
(11) At least one of the inner wall surface of the first through hole and the inner wall surface of the third through hole is an inclined surface from one surface side of the bottom substrate to the surface side of the upper substrate. The light-emitting diode mounting substrate according to any one of 1) to (10).
(12) The light emission according to any one of (1) to (11), wherein a reflective layer is provided on at least one of the inner wall surface of the first through hole and the inner wall surface of the third through hole. Diode mounting board.
(13) The reflective layer is provided only on the inner wall surface of the first through hole among the inner wall surface of the first through hole and the inner wall surface of the third through hole, and the upper substrate has translucency. (1) thru | or the light emitting diode mounting board | substrate as described in (12).
(14) In any one of the above (1) to (13), which includes a filler filled so that the light emitting diode element is embedded in at least the first through hole of each of the through holes. The light emitting diode mounting board of description.
(15) A circuit for lighting and controlling the light emitting diode element is disposed in the insulating intermediate layer,
The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, , The third through hole has the same axis,
A plurality of light emitting diode elements are bonded to the heat dissipation support film inside the first through hole, and the light emitting diode elements are embedded in at least the first through hole of the through holes. With a filling material filled in
The light emitting diode mounting substrate according to (1), further comprising a lens provided on the upper substrate and covering at least an opening surface of the third through hole.
(16) Of the inner wall surface of the first through hole and the inner wall surface of the third through hole, a reflective layer is provided only on the inner wall surface of the first through hole, and the upper substrate has translucency. ,
The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, , The third through hole has the same axis,
A plurality of light emitting diode elements are bonded to the heat dissipation support film inside the first through hole, and the light emitting diode elements are embedded in at least the first through hole of the through holes. With a filling material filled in
The light-emitting diode mounting substrate according to (1), further comprising a lens provided on the upper substrate and covering at least the opening surface of the third through hole.
(17) The filler described above includes (14) to (14) containing a light-transmitting resin that is a matrix in the filler, and light-transmitting particles dispersed in the light-transmitting resin. (16) The light emitting diode mounting substrate according to any one of (16).
(18) The light-emitting diode mounting substrate according to (17), wherein the translucent particles are quartz glass particles containing impurities.
(19) The filler (14) to (18) contains a translucent resin which is a matrix in the filler, and contains a phosphor dispersed in the translucent resin. ) Is a light emitting diode mounting board.
(20) An insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer, and between the insulating intermediate layer and the upper substrate, and the inner wall surface of the first through hole and the above At least one of the inner wall surfaces of the third through hole is an inclined surface from one surface side of the bottom substrate to the surface side of the upper substrate, and the inner wall surface and the third penetration of the first through hole. A reflective layer is provided on at least one of the inner wall surfaces of the hole, the second through hole is larger in diameter than the first through hole, and the second through hole and the third through hole are the same. The light-emitting diode mounting substrate according to (1), which has a diameter and has the same axis as the first through hole, the second through hole, and the third through hole.
(21) As the light emitting diode element, a blue light emitting diode element is provided,
As the phosphor, containing a phosphor having yellow fluorescence ability,
The above (15), further comprising a red filter layer containing a translucent resin and a phosphor having a red fluorescence ability dispersed and contained in the translucent resin on the upper surface of the filler. Or the light emitting diode mounting substrate as described in (16).
(22) A blue light emitting diode element is provided as the light emitting diode element,
As the phosphor, containing a phosphor having yellow fluorescence ability,
The light-emitting diode mounting substrate according to (15) or (16), wherein the upper substrate and / or the lens having the light transmitting property is colored red.

According to the light emitting diode mounting substrate of the present invention, the bottom substrate and the upper substrate are electrically insulated, and a mounting substrate including a plurality of substrates on which circuits having different functions and the like are disposed can be obtained.
In addition, when an insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer and between the insulating intermediate layer and the upper substrate, the bottom substrate and the upper substrate are electrically insulated. In addition, the insulating intermediate layer can be used as a substrate on which circuits having different functions and the like are provided.
Furthermore, when a circuit for turning on and controlling the LED element is provided on the insulating intermediate layer and / or the upper substrate, complicated control such as turning on and off the LED element becomes possible. It can be set as the LED mounting substrate which can be used in a broader use.

When a reflective layer is provided on the surface of the heat dissipation support film exposed in the first through hole, an LED mounting substrate with better luminous efficiency can be obtained.
Moreover, when the support film for heat dissipation consists of a copper film, since the temperature rise of a board | substrate can fully be suppressed, more LED elements can be mounted and the brightness | luminance of each LED element should be made high. You can also.
Furthermore, when a plurality of LED elements are bonded to the heat dissipation support film inside the first through hole, more output light can be obtained, and an LED mounting board with high brightness can be easily obtained. When obtaining the required output light, the LED mounting board can be easily reduced in size.

The LED element includes three types, one of which is a red LED element, the other one is a green LED element, and the other one is a blue LED element. Thus, an LED mounting substrate having the above-described characteristics can be obtained.
Further, when at least one of the inner wall surface of the first through hole and the inner wall surface of the second through hole is an inclined surface from one surface side of the bottom substrate to the upper surface side of the upper substrate, the output light is collected. Light becomes easy. Particularly, when a reflective layer is provided, the output light can be more easily collected, and an LED mounting substrate with higher luminance can be obtained.
Further, when a reflective layer is provided on at least one of the inner wall surface of the first through-hole and the inner wall surface of the second through-hole, the output light can be condensed, and the LED mounting substrate with higher brightness It can be.
In addition, when the reflective layer is provided only on the inner wall surface of the first through-hole among the inner wall surface of the first through-hole and the inner wall surface of the third through-hole, and the upper substrate has translucency, invalid light is transmitted. The light can be efficiently converted into light emitted from the LED mounting substrate, and in particular, an LED mounting substrate with high efficiency and high luminance can be obtained.

An LED mounting board with excellent reliability that can exhibit long-term stability and performance when it is provided with a filler filled so that the LED element is embedded in at least the first through-hole of each through-hole. It can be.
The insulating intermediate layer is provided with a circuit for lighting and controlling the LED element, the second through hole is larger in diameter than the first through hole, the second through hole, the third through hole, Have the same diameter, and the first through hole, the second through hole, and the third through hole have the same axis, and a plurality of LED elements are disposed on the heat dissipation support film inside the first through hole. A filler that is bonded so that the LED element is embedded in at least the first through-hole of each through-hole, and is further provided on the upper substrate and at least a third through-hole; In the case of providing a lens that covers the aperture surface, an LED mounting substrate that has the above-mentioned characteristics, and that is particularly reliable and highly efficient, has high luminance, and emits light with excellent directivity or wide angle. Can be obtained.

Of the inner wall surface of the first through hole and the inner wall surface of the third through hole, the reflective layer is provided only on the inner wall surface of the first through hole, the upper substrate is translucent, and the second through hole is the first through hole. The second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, and the third through hole have the same axis. A plurality of LED elements are bonded to the heat dissipation support film inside the first through hole, and the filling is performed so that the LED element is embedded in at least the first through hole of each through hole. In the case where a lens is provided, and further provided with a lens that is provided on the upper substrate and covers at least the opening surface of the third through-hole, the above-mentioned characteristics are provided, and particularly high efficiency, high luminance, and excellent directivity are provided. In addition, it is possible to obtain an LED mounting substrate excellent in reliability from which light emission excellent in wide-angle property can be obtained.
In addition, when the filler contains a translucent resin that is a matrix in the filler and contains translucent particles dispersed in the translucent resin, the LED mounting substrate is particularly bright. Can be obtained.

When the translucent particles are quartz glass particles containing impurities, an LED mounting substrate with higher brightness can be obtained.
When the filler contains a translucent resin that is a matrix in the filler and contains a phosphor dispersed in the translucent resin, not only the LED element but also the fluorescence caused by the phosphor It can be set as the LED mounting substrate from which various light emission including light is obtained.
In addition, an insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer, and between the insulating intermediate layer and the upper substrate, and the inner wall surface of the first through hole and the inner wall surface of the second through hole At least one of them is an inclined surface from one surface side of the bottom substrate to the surface side of the upper substrate, and a reflective layer is formed on at least one of the inner wall surface of the first through hole and the inner wall surface of the second through hole. The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, When the third through-hole has the same axis, the effects of the above-described configurations can be obtained, and each of the first through-hole, the second through-hole, and the third through-hole has an arbitrary shape. It can be used as an LED mounting substrate useful as illumination having different appearances.

As a LED element, a blue LED element is provided, a phosphor having a yellow fluorescent ability is contained as a phosphor, and further, a translucent resin and dispersed in the translucent resin are contained on the upper surface of the filler. In the case where the red filter layer containing the phosphor having the red fluorescence ability is provided, it is possible to obtain an LED mounting substrate that emits more natural white light having excellent color rendering properties while having the above-described characteristics.
When the LED element includes a blue LED element, the phosphor contains a phosphor having a yellow fluorescent ability, and the translucent upper substrate and / or lens is colored red, the above-mentioned characteristics It is possible to provide an LED mounting substrate that emits more natural white light with excellent color rendering properties.

Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to 6, FIGS. 8 to 27, FIGS. 29 to 34, and FIGS. 36 to 37.
The LED mounting substrate 1 of the present invention has an insulating layer, a heat-radiating support film 4 having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and a conductor layer 5 provided on the other surface of the insulating layer. A bottom substrate 11 provided with a first through-hole penetrating the insulating layer and the conductor layer 5; a light-emitting diode element 2 joined to the heat dissipation support film 4 inside the first through-hole of the bottom substrate 11; An insulating intermediate layer 12 stacked on the other surface of the bottom substrate 11 and an upper substrate 13 stacked on the surface of the insulating intermediate layer 12 are provided, and the bottom substrate 11 and the upper substrate 13 are electrically insulated. ing.
The bottom substrate 11 and the top substrate 13 are electrically insulated from each other by providing an insulating intermediate layer 12 between the substrates, whereby the bottom substrate 11 and the top substrate 13 are electrically insulated. (See FIGS. 3 to 5, FIGS. 8 to 27, FIGS. 32, 34, 36 and 37). Further, the insulating intermediate layer 12 can be laminated with the bottom substrate 11 and the upper substrate 13 by the insulating adhesive layer 8. (See FIGS. 3 to 5, FIGS. 8 to 27, FIGS. 32, 34, 36 and 37)

The “bottom substrate 11” is provided with metal layers on both sides having an insulating layer, a heat-radiating support film 4 made of copper foil or the like provided on one surface, and a conductor layer 5 laminated on the other surface. It is a laminate. The insulating layer is not particularly limited, and insulating layers made of various insulating materials can be used. Examples of the insulating material include resin and ceramic.
When the resin is used, the type of resin is not particularly limited, and examples thereof include insulating resins such as epoxy resins, bismaleimide resins, phenylene resins, phenylene ether resins, and phenol resins. Among these, an epoxy resin is preferable. It is because it is excellent in insulation, handleability and versatility. An insulating layer using a resin is formed, for example, by impregnating a base material such as a glass cloth with a varnish of an insulating resin such as an epoxy resin, drying it to form a prepreg, heating the prepreg, and curing the resin. (Hereinafter, a substrate in which a glass cloth is impregnated with an epoxy resin and cured is simply referred to as a “glass epoxy substrate”.)

When ceramic is used, the type of ceramic is not particularly limited, and examples include aluminum nitride, silicon carbide, silicon nitride, and alumina. The insulating layer using ceramic is prepared, for example, by mixing a ceramic powder with a solvent, an organic binder, a dispersant and the like to prepare a slurry, and using this slurry, a sheet is prepared, and then degreased, It can be formed by firing at a temperature.
In addition, the insulating layer manufactured using aluminum nitride has translucency, and the reflection efficiency can be easily improved by plating the surface with, for example, silver or the like.
The thickness of the bottom substrate is not particularly limited, and can be 100 to 4000 μm, particularly 300 to 3000 μm, and further 500 to 2500 μm.

  On the one surface of the insulating layer, the “heat dissipation support film 4” for dissipating heat generated from the mounted LED element 2 is provided. The conductor layer 5 provided on the other surface of the insulating layer is for forming a wiring pattern or the like having the electrode 3 or the like to be electrically connected to the LED element.

  Although the method of providing the support film 4 for heat dissipation is not specifically limited, Since considerable thickness is required for heat dissipation, it is normally provided by the method of laminating | stacking metal foil. The material of the heat dissipation support film 4 is not particularly limited, and copper, aluminum, or the like can be used. Among these metals, copper is excellent in thermal conductivity, and copper is preferable from the viewpoint of heat dissipation. Aluminum has lower thermal conductivity than copper, but has a lower specific gravity than copper and many other metals, and can be a lighter LED mounting substrate. The thickness of the support film 4 for heat dissipation is 50 to 500 μm, and preferably 50 to 300 μm. If the thickness of the support film for heat dissipation is 50 to 500 μm, the LED element bonded to the support film for heat dissipation can be supported, and heat dissipation is also sufficiently performed. Furthermore, it can be set as a lightweight LED mounting board.

  The formation method of the conductor layer 5 for forming a wiring pattern etc. is not specifically limited, Any of the method of laminating | stacking metal foil, the plating method, sputtering method, etc. may be sufficient. The material of the conductor layer 5 is not particularly limited, and copper and silver can be used. For the formation of the conductor layer 5, copper is usually used. That is, so-called double-sided copper-clad lamination can also be used. The thickness of the conductor layer used as this wiring pattern etc. can be 10-150 micrometers, for example.

  The formation method of the wiring pattern or the like is not particularly limited, and can be formed by a usual method usually employed in this technical field. This wiring pattern or the like can be formed by, for example, a subtractive method. That is, an etching resist is applied to the surface of the conductor layer 5 provided on the other surface of the bottom substrate 11, the coating film is exposed using a mask pattern, baked, and then developed, and the exposed conductor layer 5 is exposed. It can be removed by etching.

When the prepreg is used for forming the insulating layer and the metal foil is used for forming the conductor layer 5 for forming a wiring pattern or the like, the bottom substrate 11 can be manufactured as follows, for example.
A thick metal foil to be the support film 4 for heat dissipation, a prepreg to be an insulating layer, and a metal foil to be a conductor layer 5 for forming a wiring pattern and the like are laminated in this order, and then heated and applied at a predetermined temperature and pressure. The bottom substrate 11 can be formed by pressing and curing an insulating resin such as an epoxy resin. Although the temperature and pressure depend on the type of insulating resin, etc., the temperature can be 150 to 180 ° C., and the pressure can be about 3 MPa, which is a normal pressure of a vacuum press. In addition, the time of heating and pressurization is not particularly limited, and this time can be 50 to 80 minutes although it depends on temperature and pressure.

  The “first through hole” is formed in the insulating layer and the conductor layer. The number of the first through holes is not particularly limited. That is, for example, one LED mounting board may have one first through hole as illustrated in FIG. 6, and two or more first through holes in one LED mounting board as illustrated in FIG. 30. May be provided. Further, at least the same number of first through holes as the number of LED elements 2 mounted on the LED mounting substrate 1 may be provided. Further, the number of first through holes can be the same as the number of LED elements to be mounted.

  The first through hole is provided through the insulating layer and the conductor layer 5 for forming a wiring pattern or the like provided on the other surface of the insulating layer. The method for providing the first through hole is not particularly limited, and examples thereof include drilling and counterboring. The shape of the cross section of the first through hole is not particularly limited, and may be a circle, an ellipse, or a polygon such as a triangle, a quadrangle, or a hexagon. In addition, the maximum size of the cross section of the first through hole (the diameter of the portion with the largest diameter when the cross section is circular, the size of the portion with the largest radial dimension when the cross section is other) is particularly limited. However, it can be set according to the size of the LED element to be mounted.

  The inner wall surface of the first through hole may be processed by drilling or the like as shown in FIG. 8, and the conductor layer 5 may be provided on the surface thereof as shown in FIG. As described above, the reflective layer 6 can be provided in addition to the conductor layer 5. The reflection layer can increase the luminance. The material of the reflective layer 6 is not particularly limited, and can be formed of a metal such as silver, copper, gold, nickel, nickel-chromium. Among these metals, silver that can be used as a reflective layer having particularly excellent reflection efficiency is preferable. The method for forming the reflective layer 6 is also not particularly limited, and any of a plating method and a sputtering method may be used. For example, in the case of plating, a conductor layer made of copper or the like is formed on the inner surface of the first through hole by electroless plating, and then a copper or other conductor layer is formed on the surface of the electroless plating layer by electrolytic plating. Then, the reflective layer 6 can be provided by forming a conductive layer of silver or the like on the surface of the electrolytic plating layer by electrolytic plating.

  Furthermore, the surface of the support film 4 for heat radiation exposed in the first through hole provided in the bottom substrate 11 may not include the reflective layer 6, but the reflective layer 6 (hereinafter simply referred to as “bottom reflective layer”). Can also be provided.). In the case where the bottom reflective layer is provided, light emitted from the base of the LED element 2 in the lateral direction (ring emission), invalid light, and the like are efficiently emitted in the radiation direction (from the bottom substrate 11 side to the top substrate 13 side). Can radiate. In particular, when the filler 100 for embedding the LED element 2 contains translucent particles 102 containing impurities as will be described later, the translucent particles on both sides of the LED element 2 as shown in FIG. The light from the LED element 2 hits 102, and this light can be scattered and guided to the radiation direction on the bottom reflective layer 6. Therefore, ring light emission can be suppressed, light can be efficiently emitted outside, and an LED mounting substrate with higher light emission efficiency can be obtained.

  Further, the first through hole may be provided in a direction perpendicular to one surface of the bottom substrate 11 as shown in FIGS. 3 and 4, but the bottom portion as shown in FIGS. 5, 11, and 14. The inclined surface may be inclined from one surface side of the substrate 11 to the upper surface side of the upper substrate 13. By using such an inclined surface, the output light can be more easily condensed in a predetermined direction. Further, the inner wall surface of the first through hole is an inclined surface, and the reflective layer 6 is provided on the inclined surface as shown in FIGS. 5, 11, and 14, whereby the luminance can be further increased. The angle a of the inclined surface with respect to one surface of the bottom substrate 11 can be 80 to 20 °, particularly 70 to 30 °. If it is a drill process etc., the angle of this inclined surface can be set freely, and it is preferable. Further, the dimension of the cross section of the first through hole when it is an inclined surface (the diameter when the cross section is circular, the maximum dimension when it is other shapes) is not particularly limited, and the size of the LED element to be mounted, etc. Can be set.

  The “light emitting diode element 2” is bonded to the heat dissipation support film 4 inside the first through hole. Although the position where this LED element 2 is joined is not particularly limited, it is usually joined to the center of the first through hole. The method for joining the LED elements is not particularly limited, and the LED elements can be joined using an adhesive resin, a silver paste, a solder paste, or the like. Of these, an adhesive resin is often used. Examples of the adhesive resin include an epoxy resin, and an epoxy resin is usually used. Although the thickness of the bonding layer 7 for bonding the LED element 2 is not particularly limited, the bonding layer 7 is generally a thin layer because it has lower thermal conductivity than the heat-dissipating support film 4 when an adhesive resin is used. Preferably there is.

  The LED element 2 may include only one or a plurality. The LED element 2 may be any of a red LED element, a blue LED element, a green LED element, and the like. Further, when a plurality of LED elements are provided, the LED elements include three types, one of which is a red LED element, the other one is a blue LED element, and the other one is green. It can be set as an LED element. The number of LED elements of each color may be any number, the same number may be provided, or a different number may be provided. In the case where a plurality of LED elements are provided, the output light can be any light emission color using the three primary colors of these lights.

  Further, when each of the red LED element, the blue LED element, and the green LED element is provided in one through hole in total, each LED element is placed on the heat dissipation support film in the through hole. It is preferable to be arranged at the position of each vertex of an equilateral triangle (substantially equilateral triangle) (see FIG. 30). Further, a phosphor that emits yellow light may be disposed in the vicinity of the blue LED element, and white output light can be easily obtained by mixing the blue light emitted from the LED element and the yellow light converted by the phosphor. The method of arranging the phosphor is not particularly limited. For example, a method of blending the phosphor 103 into the sealing resin (including translucent resin and non-translucent resin) 101 filled in the first through hole or the like. Etc. Although this sealing resin is not specifically limited, An epoxy resin, a silicon resin, etc. are mentioned.

  The LED element 2 includes a die bond type LED element (having two electrodes on the upper surface of the LED element) and a single bond type (the base of the LED element serves as one electrode and the other is disposed on the upper surface of the LED element). LED element) is known. Any of these LED elements may be used, but it is preferable to use a die bond type LED element. In the single bond type LED element, the heat dissipation support film functions as an electrode. Therefore, in order to arrange a plurality of LED elements in one through hole, the surface of the heat dissipation support film is divided into a number of electrodes corresponding to the number of LED elements to be mounted, and the electrodes are insulated from each other. There is a need to. On the other hand, in the die-bonding type LED element, it is not necessary to use the heat dissipation support film as an electrode, and the entire surface of the heat dissipation support film (if the bottom reflection layer 6 is provided on the heat dissipation support film, This is because the entire surface (except the lower surface of the LED element) can be used as the reflective layer.

  On the other surface of the bottom substrate 11, the “insulating intermediate layer 12” is laminated. The insulating intermediate layer 12 can include an insulating layer and an insulating adhesive layer 8 provided on both surfaces thereof. The insulating layer can be formed of resin, ceramic, or the like, similar to the insulating layer of the bottom substrate 11 described above. In addition, when the insulating layer is formed of a resin, the forming method is not limited. For example, a base material such as a glass cloth is impregnated with an insulating resin varnish such as an epoxy resin and dried to obtain a prepreg. A method of heating the prepreg and curing the resin can be used.

  Further, the method of forming the insulating adhesive layer 8 is not particularly limited, but an insulating adhesive is applied or laminated when it is solid, such as a film, and this uncured adhesive layer, the bottom substrate 11 and the top substrate 13, and then heated to cure the adhesive and integrally bond it. The adhesive is not particularly limited, and an adhesive made of a thermosetting resin such as an epoxy resin, a thermoplastic adhesive resin film, or the like can be used. Moreover, said prepreg can also be used as this adhesive agent. Further, the insulating adhesive layer 8 may be a layer formed by curing a part of the insulating intermediate layer 12.

The insulating intermediate layer 12 has a second through hole. The second through holes communicate with the respective opening surfaces of the first through holes provided in the bottom substrate 11 and the third through holes provided in the upper substrate 13 over the entire surface. Although the number is not particularly limited, it is usually the same number as each of the first through holes and the third through holes. When the second through hole includes the insulating layer and the insulating adhesive layer 8 provided on both surfaces of the insulating layer, the second through hole is provided through the second through hole. The method of providing the second through hole is not particularly limited, and examples thereof include drilling and counterboring. The shape of the cross section of the second through hole is not particularly limited, and may be a circle, an ellipse, or a polygon such as a triangle, a quadrangle, or a hexagon. The cross-sectional shape of the second through-hole is preferably similar to the cross-sectional shape of the first through-hole, and further, the first through-hole and the second through-hole have the same axis. More preferred. Further, the dimension of the cross section of the second through hole (diameter when the cross section is circular, maximum dimension when the cross section is other) is not particularly limited, and is at least equivalent to the cross section of the first through hole.
A reflection layer can be provided on the inner wall surface of the second through hole as necessary, similarly to the case of the first through hole, and can also be an inclined surface. Furthermore, it can also be set as an inclined surface and a reflective layer can be provided in this inclined surface.

  The insulating intermediate layer 12 can be provided only for the purpose of electrically insulating the bottom substrate 11 and the top substrate 13. Further, a circuit for lighting and controlling the LED element 2 may be disposed on the insulating intermediate layer 12 (FIGS. 12 to 14, FIGS. 18 to 20, FIGS. 24 to 27, FIGS. 31 to 31). 32, FIG. 34, FIG. 36 and FIG. 37). In this circuit, a resistor, a diode, a connector (connector wiring, etc.), and the like can be arranged. The thickness of the insulating intermediate layer 12 is not particularly limited, and can be set to 100 to 200 μm. Furthermore, the thickness of the insulating adhesive layer 8 is not particularly limited, and can be 20 to 50 μm.

  By providing this insulating intermediate layer 12, the bottom substrate 11 and the top substrate 13 are insulated. That is, for example, a reflective layer can be formed on the inner wall surfaces of the first through hole and the third through hole, and as this reflective layer, a multi-layered plating in which nickel, gold, and silver plating having good reflection efficiency are laminated in this order. (For example, the total thickness of 30 to 40 μm) is used particularly effectively.

  Such multilayer plating can be formed as follows. That is, the bottom substrate 11 in which a plating layer (copper or the like) is formed on the inner wall surface of the first through hole, the insulating intermediate layer 12 in which the plating layer is not formed on the inner wall surface of the second through hole, and the third penetration The upper substrate 13 having a plating layer (copper or the like) formed on the inner wall surface of the hole is laminated so that the through holes communicate with each other. Thereafter, a liquid containing desired metal ions such as silver ions is poured into a recess formed by communication from the first through hole to the third through hole, and is applied to each inner wall surface of the first through hole and the third through hole. It can be formed by energizing the formed plating layer.

  However, when this multilayer plating is formed, if there is no insulating intermediate layer 12, as shown in FIG. 28, the multilayer plating formed on the inner wall surface of the first through hole and the inner wall surface of the third through hole are formed. Each grown end of the laminated plating to be formed protrudes, and the ends are brought into close proximity with each other or further brought into contact with each other (for example, the short circuit portion 900 in FIG. 28). That is, the insulation between the conductor layer disposed on the bottom substrate 11 and the conductor layer disposed on the upper substrate 13, and the conductor layer disposed on the bottom substrate 11 and the insulating intermediate layer 12 are disposed. There arises a problem that insulation between each layer such as insulation between the conductor layers cannot be sufficiently achieved. The total amount of protrusions reaches, for example, 60 to 80 μm, and cannot be prevented by making the thickness of the adhesive layer thicker than usual.

  On the other hand, when the insulating intermediate layer 12 is provided, the insulation between the inner wall surface reflecting layer of the first through hole and the inner wall surface reflecting layer of the third through hole can be sufficiently maintained. Therefore, the circuit of the bottom substrate 11, the circuit of the insulating intermediate layer 12, the circuit of the upper substrate 13, and the like can be formed independently (insulated). For this reason, in a small chip area (LED mounting substrate), the wiring can be divided into upper and lower layers (see FIG. 31), while sufficiently ensuring the reliability of the wiring (without excessively reducing the wiring width). A circuit for driving a plurality of LED elements can be formed.

  In particular, when it is necessary to individually control a plurality of LED elements, at least wiring corresponding to the number of LED elements is required in addition to the ground electrode common to each LED element. Even in such a case, by providing the insulating intermediate layer 12, the bonding from the LED element can be distributed to both the bottom substrate 11 and the insulating intermediate layer 12 (see FIG. 32, the insulating intermediate layer 12). Is a structure that protrudes inward from the upper substrate 11).

Further, the wiring can be separated by bonding to the bottom substrate 11 and further drawing a part of the wiring to the upper surface side of the insulating intermediate layer 12 through a through hole formed in the insulating intermediate layer 12 (FIG. 31). In particular, when a die-bonding type LED element is used as described above, the number of lands formed on the bottom substrate 11 and the like is increased because the support film for heat dissipation is not used as an electrode. Even in such a case, it is preferable to provide the insulating intermediate layer 12 because the circuit can be distributed.
In this way, when the insulating intermediate layer 12 is provided with a circuit, and particularly when the circuit is provided on the upper surface side of the insulating intermediate layer 12, a so-called single-sided copper laminated layer can be used as the insulating intermediate layer 12. .

The “upper substrate 13” is laminated on the surface of the insulating intermediate layer 12. The upper substrate 13 has an insulating layer. Moreover, the conductor layer 5 is usually provided on the both surfaces. As the insulating layer, resin, ceramic, or the like can be used. When using resin, the kind of resin is not specifically limited, Resin similar to a bottom board | substrate can be used. The insulating layer using this resin is obtained by, for example, impregnating a base material such as a glass cloth with a varnish of an insulating resin such as an epoxy resin, drying it to obtain a prepreg, heating the prepreg, and curing the resin. Can be formed. In the case of using ceramic, it can be made of the same material as that of the bottom substrate and can be formed by the same method.
The thickness of the upper substrate 13 is not particularly limited, and can be 100 to 4000 μm, particularly 300 to 3000 μm, and further 500 to 2500 μm.

  The formation method of the conductor layer 5 is not specifically limited, Any of the method of laminating | stacking metal foil, the plating method, sputtering method, etc. may be sufficient. The material of the conductor layer 5 is not particularly limited, and copper or the like can be used, and copper is usually used. That is, so-called double-sided copper-clad lamination can also be used. The thickness of the conductor layer 5 can be set to 10 to 150 μm, for example.

  The upper substrate 13 has a third through hole. The third through holes communicate with the first through holes provided in the bottom substrate 11 and the second through holes provided in the insulating intermediate layer 12, and the number of the third through holes is not particularly limited. The number is the same as the number of through holes and second through holes. The third through hole is provided through the insulating layer. Furthermore, when the conductor layer 5 is provided on both surfaces of the insulating layer, the insulating layer and the conductor layer are provided through the insulating layer. The method of providing the third through hole is not particularly limited, and examples thereof include drilling and counterbore processing. The shape of the cross section of the third through hole is not particularly limited, and may be a circle, an ellipse, or a polygon such as a triangle, a rectangle, or a hexagon. The cross-sectional shape of the third through-hole is preferably similar to the cross-sectional shape of each of the first through-hole and the second through-hole, and further, the first through-hole, the second through-hole, More preferably, the third through hole has the same axis. In addition, the dimension of the cross section of the third through hole (diameter when the cross section is circular, maximum dimension when the cross section is other) is not particularly limited, and is at least equal to the cross section of the first through hole.

  The inner wall surface of the third through hole may be processed by drilling or the like as shown in FIG. 8, and the conductor layer 5 may be provided on the surface thereof as shown in FIG. As described above, the reflective layer 6 can be provided in addition to the conductor layer 5. The reflective layer 6 can increase the luminance. The material and formation method of the reflective layer 6 are not particularly limited, and can be the same as in the case of the bottom substrate 11. Further, the third through hole may be provided in a direction perpendicular to one surface of the bottom substrate 11 as shown in FIGS. 3 and 4, but the bottom substrate as shown in FIGS. 5, 11, and 14. 11 can be an inclined surface inclined from one surface side to the upper surface side of the upper substrate 13. By using such an inclined surface, the output light can be more easily condensed in a predetermined direction.

  Further, the inner wall surface of the third through hole is an inclined surface, and the reflective layer 6 is provided on the inclined surface, whereby the luminance can be further increased. The angle of the inclined surface with respect to the one surface of the bottom substrate 11 is not particularly limited, but can be the same as in the case of the first through hole. This angle may be the same as or different from the case where the inner wall surface of the first through hole is an inclined surface. Furthermore, the dimension of the cross section of the third through-hole when it is an inclined surface (the diameter when the cross section is circular, the maximum dimension when it is other shapes) is not particularly limited, and the size of the LED element 2 to be mounted. Etc. can be set.

The upper substrate 13 can be disposed only for the purpose of functioning as the reflective layer 6 that reflects output light. Further, the upper substrate 13 may be provided with a circuit for lighting and controlling the LED element. In this circuit, a resistor, a diode, a connector (connector wiring, etc.), and the like can be arranged.
Further, the upper substrate 13 can have a function as a holding frame for holding the filler 100 so as not to flow out to other portions when filling the filler 100 described later.

  Furthermore, as described above, as shown in FIGS. 8 to 27, 32, 34, 36, and 37, the upper substrate 13 can be configured not to include the reflective layer 6 on the inner wall surface. In this case, when the glass epoxy substrate is used, the upper substrate has translucency. In addition, plates made of polycarbonate resin (polycarbonate, etc.), polyolefin sulfide resin (polyethylene sulfide, etc.), olefin resin (polyethylene, polypropylene, etc.), paste (print paste in sheet form), dry film, etc. By using this, the upper substrate 13 can be provided with translucency. That is, a translucent upper substrate can be obtained.

  When the upper substrate 13 is translucent, it can be an LED mounting substrate with a wider viewing angle than when it is non-translucent (including the reflective layer 6 or the like). That is, the LED mounting substrate (see FIGS. 3 to 5) including the reflective layer 6 on both the inner wall surface of the first through hole and the inner wall surface of the third through hole can emit light emitted from the LED element in a more directional manner. There is a tendency. For example, the viewing angle can be less than 90 degrees (particularly 70 to 80 degrees).

  On the other hand, the LED mounting substrate that includes the reflective layer 6 on the inner wall surface of the first through hole and does not include the reflective layer 6 on the inner wall surface of the third through hole (that is, the inner wall surface of the first through hole and the third through hole). In the LED mounting substrate in which the reflective layer is provided only on the inner wall surface of the first through hole in the inner wall surface of the hole) (see FIGS. 9 to 27, FIG. 32, FIG. 34, FIG. 36 and FIG. 37), the LED The light emitted from the element 2 tends to be emitted at a wider angle. For example, the viewing angle can be 90 degrees or more (particularly 100 to 120 degrees, and further 110 to 115 degrees). Such an LED mounting substrate can be used particularly for wide-angle illumination in a room, a car, a ship, an airplane, and the like. Furthermore, it can be used as internal lighting of a translucent signboard or the like.

  As described above, the upper substrate 13 has translucency, and the reflection layer 6 is not provided on the inner wall surface of the third through hole, so that the light emitted from the LED element 2 can pass through the upper substrate 13. You can In this case, a reflective layer for confining light on the through hole side can be formed on the outer surface of the upper substrate 13, but this reflective layer may or may not be formed. This is because a difference in refractive index is generated between the upper substrate 13 and air, and this refractive index difference serves as a reflection layer, so that light can be confined. However, in order to obtain high luminance, a reflective layer (a reflective layer that reflects toward the third through hole side) can be provided on the outer surface 131 (see FIG. 26) of the translucent upper substrate.

  The translucency in the upper substrate 13 refers to translucency for visible light, particularly 70% or more (more preferably 70 to 95%, still more preferably 75 to 95%, particularly about light having a wavelength of 400 to 800 nm. The light transmittance is preferably 80 to 90%. Examples of such a material include various optical resins. That is, for example, acrylic resin, polycarbonate resin, polyphenylene sulfide resin, polyester resin, cycloolefin resin, alicyclic polyolefin resin, and cyclic polyolefin resin can be used. These may use only 1 type and may use 2 or more types together. In addition, when providing the filter function for improving a color rendering property so that it may mention later, the transmittance | permeability in a predetermined wavelength (or wavelength range) may be reduced specifically.

  Further, the upper substrate 13 disperses the light from the LED element 2 by dispersing and containing metal particles and ceramic particles (such as crystalline quartz particles) regardless of the above-described translucency. The brightness of the LED mounting substrate can also be improved. When these light-dispersing particles are contained, the upper substrate 13 is preferably translucent rather than non-translucent.

  The first through hole of the bottom substrate 11, the second through hole of the insulating intermediate layer 12, and the third through hole of the upper substrate 13 are communicated with each other (first through hole). The second through hole is larger than the hole, and the third through hole is larger than the second through hole). Each central axis may be shifted or coincident with each other, but it is preferable that the axes are the same. Further, as described above, the size of each through hole is not particularly limited, but the second through hole has a larger diameter than the first through hole (the inner wall surface of the bottom substrate 11 is inclined) as shown in FIGS. When it is a surface, the second through hole is larger in diameter than the large diameter side of the first through hole.) The third through hole is the same diameter as the second through hole (the inner wall surface of the upper substrate 13 is In the case of an inclined surface, the second through hole and the small diameter side of the third through hole have the same diameter.), And the first through hole, the second through hole, and the third through hole have axes. It is preferable that they are the same.

  In addition, the hole formed by communicating the through holes may not be filled at all, but may be filled with a filler 100 (for example, the sealing resin). The filler 100 may be filled in the through-holes in any way, but the above-described through-holes (that is, the first through-hole, the second through-hole, and the It is preferable to fill at least the first through hole (out of the third through holes) (see FIGS. 15 to 27, 32, 34, 36 and 37). Thereby, deterioration of the LED element 2 can be prevented and the LED mounting substrate 1 with high reliability over a long period of time can be obtained.

The LED element 2 is usually connected with a bonding wire 9 for supplying electric power for driving the LED element 2, and the filler 100 is provided so that the body bonding wire 9 is also embedded in the filler. Filling is preferred. By embedding the entire body of the boding wire 9, the deterioration can be prevented, and the LED mounting substrate 1 having high reliability over a long period of time can be obtained. Moreover, the disconnection by the shrinkage | contraction in the case of drying or hardening of the filler 100 can also be prevented.
In order to embed the bonding wire 9 in the filler, depending on the thickness of the insulating intermediate layer, the filler is usually filled in the second through hole as well as in the first through hole. Become.

Although the structure of this filler 100 is not specifically limited, Usually, as shown in FIGS. 15-27, FIG.32, FIG.34, FIG.36 and FIG.37, at least translucent resin 101 is contained.
The “translucent resin” is a resin having translucency. The translucency is a translucency for visible light, particularly 60% or more (more preferably 70 to 95%, still more preferably 75 to 95%, particularly preferably 75 to 90%) for light having a wavelength of 300 to 950 nm. ) Is preferable.
The resin constituting the translucent resin 101 is not particularly limited. Examples of the translucent resin 101 include an epoxy resin and a silicon resin. These may use only 1 type and may use 2 or more types together. The content of the translucent resin 101 contained in the filler 100 is not particularly limited, but is 10 to 100% by volume (further 13 to 100% by volume, more preferably 20 to 20%) when the entire filler 100 is 100% by volume. 100 volume%, especially 30 to 100 volume%). In addition, although the said translucent resin is normally used, it can replace with translucent resin and can also use liquid glass.

In addition, the filler 100 can contain components other than the translucent resin 101. As other components, as shown in FIGS. 16, 17, 19, 20, 22, 23, 25 to 27, 29, 32, 34, 36 and 37, For example.
The “translucent particles” are particles having translucency. By containing the translucent particles 102, the light emitted from the LED element 2 can be radiated from the bottom substrate 11 to the upper substrate 13 more efficiently. The translucency is a translucency with respect to visible light, and in particular, the translucency is 5% or more (more preferably 10 to 50%, still more preferably 20 to 60%) for light having a wavelength of 300 to 950 nm. Is preferred. The translucent particles 102 may be particles made of an inorganic material or particles made of an organic material, but are preferably particles made of an inorganic material. This is because usually higher translucency can be obtained.

  When the translucent particles 102 are made of the above inorganic material, examples of the inorganic material include quartz, aluminosilicate, aluminoborosilicate, borosilicate, and silicate. These may use only 1 type and may use 2 or more types together. These may be crystalline, but are preferably amorphous. That is, quartz glass, aluminosilicate glass, aluminoborosilicate glass, borosilicate glass, silicate glass and the like are preferable. These may use only 1 type and may use 2 or more types together.

  Of these inorganic materials, quartz glass is particularly preferable. This is because quartz glass is excellent in translucency (usually a transmittance of 20% or more is better than other glass materials). In addition, quartz glass has a large specific heat capacity, and the temperature of the entire filler, and further the entire LED mounting substrate can be kept low. When the translucent particles 102 are made of an organic material, various resins that can be used as the translucent resin 101 can be applied as they are.

In addition to the above materials, the light-transmitting particles 102 made of an inorganic material may contain other components. Examples of the other component include a compound containing at least one metal element selected from Al, Ti, Fe, and Nb {which becomes an impurity with respect to translucent particles (such as quartz glass)}. Of these, metal element oxides and / or double oxides are preferred. That is, for example, Al ₂ O ₃ , TiO ₂ , Fe ₂ O _3, Nb ₂ O _{5 and the} like can be mentioned.

By containing these components, the translucent particles 102 can have translucency and light dispersibility. For this reason, the light emitted from the LED element 2 can be transmitted while being dispersed, and light can be emitted very efficiently. Further, as will be described later, when the phosphor 103 is contained in the filler 100, it is preferable that quartz glass particles containing the metal oxide or the like are contained. When the phosphor 103 is contained in the filler 100, the transmittance of the filler 100 as a whole decreases. However, since the light-transmitting particles (particularly quartz glass particles) 102 containing impurities are contained, sufficient light dispersibility can be ensured, so that sufficient fluorescence can be obtained. Furthermore, the translucency can be improved as compared with the case where only the phosphor 103 is contained (that is, the translucent particles 102 are not contained). That is, a high luminance can be obtained by a synergistic effect of improving the light dispersibility and improving the light transmittance.
The content ratio of impurities such as this metal oxide is not particularly limited, but is usually 0.01 to 0.2% by mass (preferably 0.05 to 0. 0%) when the entire translucent particle 102 is 100% by mass. 2 mass%, more preferably 0.1 to 0.15 mass%).

The size and shape of the translucent particles 102 are not particularly limited, but the average particle size (maximum length) is 1 to 30 μm (more preferably 1 to 15 μm, still more preferably 2 to 10 μm, and still more preferably 3 to 3). 7 μm, particularly preferably 4 to 6 μm, particularly preferably 4 to 5 μm). In this range, sufficient light dispersibility can be obtained while ensuring sufficient light transmission. Although the shape of the translucent particle | grains 102 is not specifically limited, Usually, it is spherical and / or indefinite particle shape.
Further, the content of the translucent particles 102 is not particularly limited, but usually 0.01 to 50% by mass (more preferably 1 to 45% by mass, still more preferably) when the entire filler 100 is 100% by mass. 10 to 45% by mass, still more preferably 20 to 43% by mass, particularly preferably 25 to 42% by mass, and particularly preferably 30 to 40% by mass).

Furthermore, as shown in FIGS. 17, 20, 23, 26, 27, 29, 32, 34, 36, and 37, the filler 100 includes a phosphor 103 as necessary. Can be contained.
When the phosphor 103 is contained, a light color other than the color directly emitted from the LED element 2 can be obtained. That is, for example, when a blue LED element is provided, yellow light is obtained by using the phosphor 103 having yellow fluorescence ability, and light that is visually recognized as white is obtained by mixing with blue.

  The phosphor 103 may be a phosphor 103 that fluoresces in any color. That is, for example, a phosphor having yellow fluorescence ability (yellow phosphor), a phosphor having red fluorescence ability (red phosphor), a phosphor having blue fluorescence ability (blue phosphor), and a phosphor having green fluorescence ability (Green phosphor), phosphor having orange fluorescence ability, and the like. These may use only 1 type and may use 2 or more types together.

Examples of the yellow phosphor include a YAG phosphor, a TAG phosphor, a sulfide phosphor, and a nitride phosphor. These phosphors 103 may be used alone or in combination of two or more. As red phosphors, rare earth borate phosphors {(Y, Gd) BO ₃ : Eu etc.}, yttrium oxide phosphors (Y ₂ O ₂ S: Eu, Y ₂ O ₃ : Eu etc.), etc. Is mentioned. These may use only 1 type and may use 2 or more types together. Further, as the blue phosphor, zinc sulfide phosphor (ZnS: Ag, Al, etc.), alkaline earth phosphate phosphor {(SrCaBaMg) ₅ (PO ₄ ) ₃ Cl: Eu etc., alkali aluminate Examples thereof include earth salt phosphors (BaMgAl ₁₀ O ₁₇ : Eu and the like), tungstic acid phosphors (CaWO _{4 and the} like) and the like. These may use only 1 type and may use 2 or more types together. Further, as the green phosphor, zinc sulfide phosphor (ZnS: Cu, Al, etc.), rare earth phosphate phosphor (LaPO ₄ : Ce, Tb), zinc silicate phosphor (Zn ₂ SiO ₄₎ : Mn, etc.), gadolinium oxysulfide phosphors (Gd ₂ O ₂ S: Tb, etc.) and the like. These may use only 1 type and may use 2 or more types together.

  Among these, when the blue LED element 2 is used as the LED element 2, it is particularly preferable to use the phosphor 103 having yellow fluorescence ability. Examples of the phosphor having the yellow fluorescence ability include a YAG phosphor, a TAG phosphor, a sulfide phosphor and a nitride phosphor. These phosphors 103 may be used alone or in combination of two or more.

When the phosphor 103 is contained, 10 to 40% by mass (more preferably 15 to 35% by mass, still more preferably 20 to 30% by mass, and particularly preferably 21) when the entire filler 100 is 100% by mass. ˜25% by mass).
In addition, although the magnitude | size, shape, etc. of the fluorescent substance 103 are not specifically limited, Usually, it is preferable that it is an average particle diameter of 30-200 micrometers (more preferably 40-150 micrometers, especially preferably 45-147 micrometers). Moreover, the shape is usually spherical and / or irregularly shaped particles.

The LED mounting substrate 1 of the present invention can further include a lens 200 as shown in FIGS. 21 to 27, 32, 34, 36, and 37. By providing the lens 200, the luminance can be improved as compared with the case where the lens 200 is not provided (ineffective light can be collected). Moreover, it can be set as the LED mounting board | substrate 1 of the viewing angle of a wider angle or a narrower angle (directivity) with a lens shape compared with the case where it does not provide.
The lens 200 can include, for example, a separate lens 200 that is provided on the upper substrate 11 and covers at least the opening surface of the third through hole (FIGS. 21 to 27, FIGS. 32, 34, 36, and 36). (See FIG. 37). Further, a lens integral with the filler 100 can be provided by forming the upper end of the filler 100 into a lens shape. Among these, it is preferable to use a separate lens 200. This is because the lens shape can be freely selected with high accuracy.

Further, for example, when the upper substrate 11 is translucent as described above and the wide-angle lens 200 is provided on the upper substrate 11 so as to cover the opening surface of the third through hole, the viewing angle is particularly wide (for example, The LED mounting substrate 1 can be obtained (see FIGS. 21 to 26, FIGS. 32, 34, 36, and 37). .
On the other hand, by providing the lens 200 with a narrower angle, an LED mounting substrate having a narrow viewing angle and excellent directivity (for example, a viewing angle of less than 90 degrees, particularly 70 to 80 degrees) can be obtained (see FIG. 27). .

  The shape of the lens 200 used for the LED mounting substrate 1 is not particularly limited, but it is usually preferable that the lens 200 has a lens shape at least on the outer surface side of the LED mounting substrate 1. This lens shape may be a convex lens shape or a concave lens shape. In addition, the shape of the inside of the lens 200 (inside the LED mounting substrate) is not particularly limited, and may be a flat surface, a concave surface, or a convex surface. Or it is preferable that it is a concave surface.

When the separate lens 200 is provided, the rib 200 is press-fitted into the third through hole as shown in FIGS. 21 to 27, 32, 34, 36 and 37. It may be disposed, may be disposed on the upper substrate 11 by bonding with an adhesive or the like, or may be disposed by other methods. Of these, the rib portion 201 is preferably used. This is because the number of interfaces where the refractive index changes can be reduced as compared with the case where an adhesive is used, and the LED mounting substrate 1 with higher luminance can be obtained.
Regardless of the arrangement method of the lens 200, the provision of the lens 200 makes it possible to obtain dust-proofing and waterproofing effects in the through hole, and to obtain the LED mounting substrate 1 having excellent long-term reliability. In addition, as a material constituting the lens 200, a conventionally known optical lens can be used, which may be a resin lens or a glass lens.

  Further, when the lens 200 is provided, the lens 200 is colored, and when the upper substrate 13 has translucency, the upper substrate 13 is colored (at least one of them) to filter the lens 200 and the upper substrate 13. Can have a function. This coloring may be performed by mixing a coloring agent in the material constituting the lens 200 and / or the upper substrate 13, or may be performed by staining the surface of the lens 200 and / or the upper substrate 13.

  That is, for example, in the LED mounting substrate 1 using the filler 100 that includes the blue LED element 2 and contains the phosphor 103 having yellow fluorescent ability, the lens 200 and / or the upper substrate 13 is colored pink. With this, color rendering can be improved. Therefore, a light source that can be visually recognized as more natural white light is obtained.

Further, for example, in the LED mounting substrate 1 using the filler 100 that includes the blue LED element 2 and contains the phosphor 103 having yellow fluorescent ability, the lens 200 and / or the upper substrate 13 is colored red. An LED mounting substrate that emits light in pink to purple (especially pink to reddish purple) is obtained.
In addition, as shown in FIG. 36, in the LED mounting substrate 1 using the filler 100 that includes the blue LED element 2 and contains the phosphor 103 having yellow fluorescent ability, the upper surface of the filler 100 has a transparent surface. By including a red filter layer 150 containing a light-sensitive resin 151 and a phosphor (red phosphor) 152 having a red fluorescence ability dispersed and contained in the light-transmitting resin, pink to purple ( In particular, an LED mounting substrate that emits light in pink to reddish purple) is obtained. The red phosphor described above can be applied as it is.

  Further, as shown in FIG. 37, a filler 100 including the blue LED element 2 and containing translucent particles 102 (the filler 100 may not contain the phosphor 103 having yellow fluorescence ability). In the LED mounting substrate 1 using the above, on the upper surface of the filler 100, a translucent resin 161 and a phosphor having a yellow fluorescent ability dispersed and contained in the translucent resin 161 (yellow phosphor) 162, and a yellow fluorescent layer 160 containing the same. Further, the red filter layer 150 may be provided on the upper surface of the yellow fluorescent layer 160. When the yellow fluorescent layer 160 and the red filter layer 150 are provided, an LED mounting substrate that emits light in pink to purple (especially pink to red purple) is obtained in the same manner as the LED mounting substrate shown in FIG.

Many of the red colorants (dyes, etc.) and red phosphors are deteriorated in performance due to heating, and are particularly severely deteriorated in a situation where a temperature of 80 ° C. or even 100 ° C. or higher is applied. However, the LED mounting substrate of the present invention is excellent in heat dissipation, and the red colorant and the red phosphor are unlikely to deteriorate and can maintain red for a long period of time. This effect is particularly high when the filler 100 is contained and the quartz glass particles are contained as the translucent particles 102. That is, quartz glass particles have a large specific heat capacity and can suppress the temperature rise of the filler 100.
Therefore, the LED mounting substrate of the present invention can be an LED mounting substrate that emits light with a high durability from pink to purple (especially pink to reddish purple).

When the red filter layer 150 is used, when the distance from the LED element 2 to the red filter layer 150 is close to 1.5 to 6 mm (further 2 to 4 mm, particularly 2 to 3 mm), the red phosphor 152 is used. It is preferable to use rare earth borate phosphor {(Y, Gd) BO ₃ : Eu etc.}. Further, in the case of using this phosphor, it is preferable to contain the translucent particles in addition to the translucent resin 151 and the red phosphor 152 in the red filter layer 150. In this case, it is preferable to mix | blend so that translucent resin: red fluorescent substance: translucent particle may be 35-55 mass%: 40-55 mass%: 5-15 mass% in the mass ratio, for example.
On the other hand, when the distance from the LED element 2 to the red filter layer 150 is as long as 3 to 8 mm (further 5 to 8 mm), the red phosphor 152 may be an yttrium oxide phosphor (Y ₂ O ₂ S: Eu, Y ₂ O ₃ : Eu or the like) is preferably used.

  The pink color referred to above is a color of light in which white light and red light are mixed. Although this mixing ratio is not specifically limited, Usually, white light: red light is 20-80%: 80-20% (preferably 30-70%: 70-30%). On the other hand, purple is a color of light in which blue light and red light are mixed. The mixing ratio is not particularly limited, but usually blue light: red light is 1 to 99%: 99 to 1%. Of these, the light purple color is a light color with a mixing ratio exceeding 50%. However, the mixing ratio corresponds to the ratio of the light emission time, and is usually controlled in a duty circuit.

  Furthermore, each of the red filter layer 150 and the yellow fluorescent layer 160 has a mixed resin containing a phosphor in a fluid translucent resin (uncured material) in a predetermined position (such as a first through hole). It may be formed by being cured after being poured into the interior. Further, a sheet-like material that has been formed into a thin film (thickness of about 0.15 to 0.8 mm) in advance is laminated on the upper surface of the filler 100 (and further the upper surface of the yellow fluorescent layer 160) (lamination pressure bonding). Or may be cured and formed.

  The LED mounting substrate 1 of the present invention includes a bottom substrate 11, an LED element 2, an insulating intermediate layer 12, and an upper substrate 13. The bottom substrate 11, the insulating intermediate layer 12, and the upper substrate 13 may be a single layer or multiple layers. That is, it may consist of only one resin layer or ceramic layer, or may consist of two or more resin layers or ceramic layers. In addition to the resin layer and the ceramic layer, a conductor layer can be provided as described above. The conductor layer may be formed inside each of the bottom substrate 11, the insulating intermediate layer 12, and the upper substrate 13, or may be formed outside (upper surface and / or lower surface). That is, the bottom substrate 11, the insulating intermediate layer 12, and the upper substrate 13 may be a laminated body in which an insulating layer and a conductor layer are laminated.

  Further, the LED mounting substrate 1 further includes one or two or more (usually six or less) insulating layers in addition to the insulating intermediate layer 12 between the bottom substrate 11 and the upper substrate 13. May be. In this case, an insulating adhesive layer similar to the insulating adhesive layer 8 included in the insulating intermediate layer 12 is interposed between the insulating layers. In addition, when another insulating layer is further provided in this way, a circuit for lighting and controlling the LED element can be provided in this insulating layer, similarly to the insulating intermediate layer 12 and the like. More complex control of the LED elements can also be possible.

The LED mounting substrate 1 of the present invention can be manufactured as follows, for example.
The bottom substrate 11 and the top substrate 13 are produced as described above. Thereafter, an uncured adhesive layer that becomes the insulating adhesive layer 8 is formed on both surfaces of the insulating layer of the insulating intermediate layer 1 as described above. Next, the bottom substrate 11 and the uncured adhesive layer on one surface of the insulating intermediate layer are brought into contact with each other, and the upper substrate 11 and the uncured adhesive layer on the other surface of the insulating layer in the insulating intermediate layer are brought into contact with each other. And laminate. Then, for example, it heats and pressurizes at the temperature of 150-180 and the pressure of about 3 MPa which is the normal pressure of a vacuum press, and it is set as an integrated laminated body. The time for heating and pressurization is not particularly limited, and may be 50 to 80 minutes, although it depends on temperature and pressure.

Next, the LED element 2 is joined to the heat dissipation support film 4 which is inside the first through hole provided in the bottom substrate 11 and is laminated on one surface of the insulating layer of the bottom substrate, and then the LED element The electrode terminal and the electrode 3 provided on the bottom substrate can be connected by a bonding wire 9 to obtain the LED mounting substrate 1. Further, when the reflective layer 6 is provided on the inner wall surfaces of the first through hole and the second through hole, and when the inner wall surfaces of the first through hole and the second through hole are inclined surfaces, the bottom substrate is used. 11 and an uncured adhesive layer on both surfaces of the insulating layer, and it is necessary to process in advance before laminating the laminated body to be the insulating intermediate layer 12 and the upper substrate 13. The material of the bonding wire 9 is not specifically limited, A gold wire, an aluminum wire, etc. can be used.
Each of the bottom substrate, the insulating intermediate layer, and the upper substrate is formed to be larger than a predetermined dimension of the LED mounting substrate, and then is diced into a plurality of laminated bodies, and then the LED elements are mounted and bonded. By arranging the wires, it is possible to efficiently manufacture a plurality of LED mounting boards.

  The first through hole, the second through hole, and the third through hole are usually filled with a sealing resin (100). As a result, the LED element 2 and the bonding wire 9 are protected from external impacts and the like, and the LED element 2 is prevented from falling off, and the bonding wire 9 is prevented from falling off or breaking. Although this sealing resin (100) is not specifically limited, It is preferable that it is resin with high transparency. As this sealing resin, an epoxy resin or the like can be used. The surface of the sealing portion formed by this sealing resin may be flat or lens-shaped, but is preferably a convex lens shape.

  Further, in FIGS. 3 to 5 and FIGS. 8 to 27, one LED element 2 is bonded to the heat dissipation support film 4 inside the first through hole. However, as shown in FIGS. The LED elements 2 can be arranged and bonded. When a plurality of LED elements 2 are arranged in this way, in a conventional LED mounting substrate, a circuit is arranged around the LED elements and a resistor or the like is arranged. Can not. On the other hand, in the LED mounting substrate 1 of the present invention, since it is not necessary to arrange a circuit around the LED element 2, the LED elements can be densely arranged as shown in FIG. Therefore, when the light emitting area of the LED mounting substrate is the same, more output light can be obtained compared to the conventional LED mounting substrate, and the LED mounting substrate with high brightness can be easily obtained. Further, when obtaining required output light, the LED mounting substrate can be easily reduced in size.

  The LED mounting substrate 1 of the present invention includes a substrate (a bottom substrate 11, an insulating intermediate layer 12, an upper substrate 13 and various circuits 111 and 121), an LED element 2, and a filler 100 (a translucent resin 101, a translucent resin). In addition to the particles 102 and the phosphors 103 and the lens 200, other parts can be provided. An example of the other part is a connector 500 as shown in FIG. That is, a connector 500 for connecting the LED mounting substrate 1 and the LED mounting substrate 1, a connector for connecting the LED mounting substrate 1 and various external circuits other than the LED mounting substrate, and the like can be given. When the connector 500 that can connect the LED mounting boards 1 is provided, the LED mounting boards can be extended (added) as necessary.

Although the circuit configuration (and its peripheral circuit configuration) in the LED mounting substrate 1 of the present invention is not particularly limited, for example, it can be configured as shown in FIG. Only part of the circuit shown in FIG. 33 is mounted on the LED mounting substrate of the present invention.
In the circuit shown in FIG. 33, three types (for example, three colors of RGB) of LED elements housed in the first through hole (three LED elements in a range surrounded by a dotted line are arranged in one first through hole. Provided). Each LED element is connected in series for each type (emission color, control, shape, size, etc.). These may be formed by connecting LED elements mounted on individual chips, or a substrate having all LED elements in one LED mounting substrate may be used.

  In addition, this circuit can include a duty control circuit unit 401. The duty circuit 401 is a circuit that controls the blinking cycle (that is, luminance) of the LED element 2. As shown in FIG. 33, the duty control circuit unit 401 may include one for each series of LED elements, or may include one for controlling all the LED elements in an integrated manner. The duty control circuit unit 401 may be mounted on the LED mounting board of the present invention, or may be mounted on a motherboard on which the LED mounting board is mounted.

  Further, this circuit can include a drive circuit unit 402. The drive circuit unit 402 is a driver for driving the LED element 2 using a signal obtained from the duty control circuit unit 401. As shown in FIG. 33, the drive circuit unit 402 may include one for each series of LED elements, or may include one for driving all LED elements in an integrated manner. The drive circuit unit 402 may be mounted on the LED mounting board of the present invention, or may be mounted on a motherboard on which the LED mounting board is mounted. Various transistors can be used as the drive circuit unit 402, and a CMOS is particularly preferable.

  In addition, this circuit can include a current control circuit unit 403. The current control circuit unit 403 is a circuit that controls the amount of current flowing through the LED element. Specific examples include a resistance circuit and a resistance element. As shown in FIG. 33, the current control circuit unit 403 may include one for each series of LED elements, or may include one for controlling all LED elements in an integrated manner. The current control circuit unit 403 may be mounted on the LED mounting board of the present invention, or may be mounted on a motherboard on which the LED mounting board is mounted.

  Further, the circuit can include a protection circuit unit 404. The protection circuit unit 404 is a circuit that protects against overvoltage. The protection circuit unit 404 may be mounted on the LED mounting board of the present invention, or may be mounted on a motherboard on which the LED mounting board of the present invention is mounted. Further, it is used by being connected to a power source 405.

  Furthermore, the LED mounting board of the present invention is usually used by being mounted on a mother board. The mounting form is not particularly limited. For example, as shown in FIG. 34, a part of the support film for heat dissipation can be used as a terminal electrode, and can be connected to a motherboard-side circuit 301 included in the motherboard 300. For connection, a conductive bonding material 302 (that is, solder, brazing material, etc.) can be used. Further, in connection with the conductive bonding material 302, it is preferable to connect with a fillet as shown in FIG. As a result, a reliable electrical connection with the conductor layer 5 disposed on the side surface of the bottom substrate 11 is obtained, and an excellent bonding strength is obtained. Therefore, the reliability in the mother board provided with the LED mounting substrate can be improved.

Hereinafter, the present invention will be described specifically by way of examples.
Example 1
(1) Bottom substrate A square of the required dimensions is obtained from a commercially available double-sided copper-clad laminate in which a glass cloth with a thickness of 50 μm is laminated on both sides of an 800 μm-thick insulating layer impregnated with epoxy resin in a glass cloth and cured. The laminate was cut out. Thereafter, a plurality of first through holes were formed at equal intervals in the laminate by drilling. The first through hole was a cylindrical through hole having a diameter of 1540 μm. Subsequently, the wiring pattern which has the electrode 3 was formed in the conductor layer 5 (copper foil) by the subtractive method. Thereafter, a prepreg having a thickness of 40 μm in which a glass cloth was impregnated with an epoxy resin was produced, and this prepreg was laminated on a portion excluding the opening of the first through hole on one surface side of the laminate. Next, a 105-μm thick copper foil serving as the heat-dissipating support film 4 was laminated on one surface of the laminate through the prepreg. Thereafter, a copper plating layer having a thickness of 18 μm is formed on the inner wall surface of the first through hole and the portion of the surface of the support film for heat radiation 4 where the first through hole is opened, and the copper plating layer is thick on the surface of the copper plating layer. An electrolytic silver plating layer having a thickness of 2 μm was formed to produce a reflective layer 6.
In addition, the conductor layer 5 (copper foil) laminated | stacked on one surface of the laminated body was removed previously before lamination | stacking of a prepreg.

(2) Laminate serving as an insulating intermediate layer A square laminate having the same dimensions as the bottom substrate of (1) was cut out from a 200 μm thick insulator obtained by impregnating and curing a glass cloth with an epoxy resin. Thereafter, a cylindrical second through-hole having a diameter of 3010 μm was formed in the laminate by drilling at a position corresponding to the first through-hole in (1) above. Next, a prepreg having a thickness of 40 μm in which a glass cloth was impregnated with an epoxy resin was produced, and this prepreg was laminated on a portion excluding the openings of the second through holes on both sides of the laminate.

(3) Upper substrate From a commercially available double-sided copper clad laminate in which a 50 μm thick copper foil is laminated on both sides of a 600 μm thick insulating layer impregnated with epoxy resin in a glass cloth and cured, the above (1) A square laminate having the same dimensions as the laminate as the bottom substrate and the laminate as the insulating intermediate layer (2) was cut out. Then, the cylindrical 3rd through-hole of the same diameter as a 2nd through-hole was formed in this laminated board by the drill process in the position corresponding to the 2nd through-hole in said (2). Next, a copper plating layer having a thickness of 18 μm was formed on the inner wall surface of the third through hole, and an electrolytic silver plating layer having a thickness of 2 μm was formed on the surface of the copper plating layer, whereby a reflective layer 6 was produced.

(4) Manufacture of LED mounting substrate One surface side of the laminate of (2) is arranged so that the first through hole and the second through hole are concentrically formed on the other surface of the bottom substrate 11 of (1). The other side of the laminate is laminated with one side of the upper substrate 13 of (3) so that the second through hole and the third through hole are concentric, and then the temperature is 120 ° C. The laminated body that becomes the bottom substrate 11, the laminated body that becomes the insulating intermediate layer, and the upper substrate 13 were integrally bonded by heating and pressurizing at a pressure of 3 MPa for 60 minutes. Next, the blue light-emitting LED element 2 is bonded to the surface of the heat dissipation support film 4 (copper foil) with an epoxy resin at the center in the radial direction inside the first through-hole, and then bonded with a bonding wire 9 made of a gold wire. The electrode terminal of the LED element and the electrode 3 formed on the bottom substrate 11 were connected. Next, the first through hole, the second through hole, and the third through hole are filled with an epoxy resin (not shown) as a sealing resin, and a convex lens made of the sealing resin is formed on each LED element 2. A plurality of LED mounting substrates 1 having the cross-sectional shape shown in FIG. 4 were manufactured.

In addition, in this invention, it can restrict to what is shown to said specific Example, It can be set as the Example variously changed within the range of this invention according to the objective and the use.
In addition, although the wavelengths of light of red, blue, and green described in the present specification are not strictly defined, in this specification, normally, red is 620 to 650 nm, and blue is 460 to 470 nm. , Green is 520-560 nm.
Furthermore, although not included in the present invention, as shown in FIG. 35, an LED that does not include an insulating intermediate layer, the upper substrate 13 is translucent, and includes the filler 100 and the lens 200 according to the present invention. Needless to say, the mounting substrate is useful.

It is a top view which shows an example of the light emitting diode mounting substrate of this invention. It is a top view which expands and shows a part of light emitting diode mounting substrate of FIG. It is a schematic diagram which shows the cross section in A-A 'of FIG. It is a schematic diagram which shows the aspect by which the reflection layer was provided in the inner wall face of the through-hole in which the light emitting diode element was mounted in the light emitting diode mounting board | substrate of FIG. FIG. 5 is a schematic diagram showing an aspect in which an inner wall surface of a through hole provided with a reflective layer is an inclined surface in the light emitting diode mounting substrate of FIG. 4. It is a top view which shows the aspect by which the several light emitting diode element is joined to the support film for thermal radiation inside the 1st through-hole. It is a schematic diagram which shows the cross section of the conventional light emitting diode mounting board | substrate which is not divided | segmented but is integrally formed. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram explaining the malfunction by not providing an insulating intermediate | middle layer. It is a schematic diagram explaining the radiation | emission principle of light in the case of providing a filler in the light emitting diode mounting substrate of this invention. It is a top view which shows an example of the light emitting diode mounting substrate of this invention. It is a typical permeation | transmission perspective view explaining an internal structure in case an insulating intermediate | middle layer is provided with a circuit in the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows an example of the circuit in the light emitting diode mounting board | substrate of this invention. It is a cross-sectional schematic diagram which shows the example which mounted the light emitting diode mounting board | substrate of this invention on the motherboard. It is a cross-sectional schematic diagram which shows an example of the light emitting diode mounting substrate which is not provided with an insulating intermediate | middle layer. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention. It is a schematic diagram which shows the cross section of an example of the light emitting diode mounting substrate of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1; Light emitting diode mounting substrate, 11; Bottom substrate, 111; Bottom substrate circuit, 12; Insulating intermediate layer, 121; Insulating intermediate layer circuit, 122; Through hole, 13; ; Electrode, 4; support film for heat dissipation (copper foil), 5; conductor layer (copper foil layer), 6; reflective layer (silver plating layer), 7; bonding layer, 8; insulating adhesive layer, 9; , 100; filler, 101; translucent resin, 102; translucent particles, 103; phosphor, 150; red filter layer, 151; translucent resin, 152; red phosphor, 160; yellow filter layer, 161; Translucent resin; 162; Yellow phosphor; 200; Lens; 201; Rib part; 300; Motherboard; 301; Motherboard side circuit; 302; Conductive bonding material; 401; Duty control circuit part; Road section, 403; current control circuit section, 404; protection circuit portion, 405; power, 500; connector, 900; short circuit portion.

Claims (22)

An insulating layer, a heat-radiating support film having a thickness of 50 to 500 μm laminated on one surface of the insulating layer, and a conductor layer provided on the other surface of the insulating layer, the insulating layer and the conductor layer A bottom substrate provided with a first through-hole penetrating through
A light emitting diode element bonded to the heat-dissipating support film inside the first through-hole, laminated on a portion of the other surface of the bottom substrate excluding the opening of the first through-hole, and the first through-hole; An insulating intermediate layer having a second through hole communicating with the entire opening surface of the hole, and a layer laminated on a portion of the surface of the insulating intermediate layer excluding the opening of the second through hole; An upper substrate having a third through-hole communicating with the entire opening surface of the through-hole,
A light emitting diode mounting substrate, wherein the bottom substrate and the upper substrate are electrically insulated.   The light emitting diode mounting substrate according to claim 1, wherein an insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer and between the insulating intermediate layer and the upper substrate.   The light emitting diode mounting substrate according to claim 1, wherein a circuit for lighting and controlling the light emitting diode element is disposed in the insulating intermediate layer.   4. The light emitting diode mounting substrate according to claim 1, wherein a circuit for lighting and controlling the light emitting diode element is disposed on the upper substrate.   The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, The light emitting diode mounting substrate according to claim 1, wherein the third through hole has the same axis.   The light emitting diode mounting substrate according to claim 1, further comprising a reflective layer on a surface of the heat dissipation support film exposed in the first through hole.   The light-emitting diode mounting substrate according to claim 1, wherein the heat dissipation support film is made of a copper film.   The light emitting diode mounting substrate according to claim 1, further comprising a lens provided on the upper substrate and covering at least an opening surface of the third through hole.   The light emitting diode mounting substrate according to any one of claims 1 to 8, wherein a plurality of light emitting diode elements are bonded to the heat dissipation support film inside the first through hole.   2. The light emitting diode element includes three types, one of which is a red light emitting diode element, the other one is a green light emitting diode element, and the other one is a blue light emitting diode element. The light emitting diode mounting substrate in any one of thru | or 9.   The at least one of an inner wall surface of the first through hole and an inner wall surface of the third through hole is an inclined surface from one surface side of the bottom substrate to the surface side of the upper substrate. The light-emitting diode mounting substrate according to any one of the above.   The light emitting diode mounting substrate according to claim 1, wherein a reflective layer is provided on at least one of an inner wall surface of the first through hole and an inner wall surface of the third through hole.   The reflective layer is provided only on the inner wall surface of the first through hole among the inner wall surface of the first through hole and the inner wall surface of the third through hole, and the upper substrate has translucency. 12. The light-emitting diode mounting substrate according to 12.   The light emitting diode mounting substrate according to any one of claims 1 to 13, further comprising a filler filled so that the light emitting diode element is embedded in at least the first through hole of each of the through holes. . A circuit for lighting and controlling the light emitting diode element is disposed in the insulating intermediate layer,
The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, , The third through hole has the same axis,
A plurality of light emitting diode elements are bonded to the heat dissipation support film inside the first through hole, and the light emitting diode elements are embedded in at least the first through hole of the through holes. With a filling material filled in
The light emitting diode mounting substrate according to claim 1, further comprising a lens provided on the upper substrate and covering at least an opening surface of the third through hole. Of the inner wall surface of the first through hole and the inner wall surface of the third through hole, a reflective layer is provided only on the inner wall surface of the first through hole, and the upper substrate has translucency,
The second through hole has a larger diameter than the first through hole, the second through hole and the third through hole have the same diameter, and the first through hole, the second through hole, , The third through hole has the same axis,
A plurality of light emitting diode elements are bonded to the heat dissipation support film inside the first through hole, and the light emitting diode elements are embedded in at least the first through hole of the through holes. With a filling material filled in
The light-emitting diode mounting substrate according to claim 1, further comprising a lens provided on the upper substrate and covering at least an opening surface of the third through hole.   The said filler contains the translucent resin used as the matrix in this filler, and contains the translucent particle disperse | distributed in this translucent resin. The light emitting diode mounting board in any one.   The light-emitting diode mounting substrate according to claim 17, wherein the light-transmitting particles are quartz glass particles containing impurities.   The said filler contains the translucent resin used as the matrix in this filler, and contains the fluorescent substance disperse | distributed in this translucent resin. The light-emitting diode mounting board as described in 1.   An insulating adhesive layer is interposed between the bottom substrate and the insulating intermediate layer, and between the insulating intermediate layer and the upper substrate, and the inner wall surface of the first through hole and the third through hole At least one of the inner wall surfaces of the holes is inclined from one surface side of the bottom substrate to the surface side of the upper substrate, and the inner wall surfaces of the first through holes and the third through holes are A reflective layer is provided on at least one of the inner wall surfaces, the second through hole has a larger diameter than the first through hole, and the second through hole and the third through hole have the same diameter. The light emitting diode mounting substrate according to claim 1, wherein the first through hole, the second through hole, and the third through hole have the same axis. As the light emitting diode element, a blue light emitting diode element is provided,
As the phosphor, containing a phosphor having yellow fluorescence ability,
Furthermore, the upper surface of the said filler is equipped with the red filter layer containing the translucent resin and the fluorescent substance which has a red fluorescence ability dispersed and contained in this translucent resin. 16. A light-emitting diode mounting substrate according to 16. As the light emitting diode element, a blue light emitting diode element is provided,
As the phosphor, containing a phosphor having yellow fluorescence ability,
The light emitting diode mounting substrate according to claim 15 or 16, wherein the translucent upper substrate and / or the lens is colored red.

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