JP3937679B2 - Manufacturing method of high frequency module - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
  The present invention relates to a method for manufacturing a high-frequency module used in a mobile phone or the like.
[0002]
[Prior art]
  Hereinafter, a manufacturing method of a conventional voltage controlled oscillator (hereinafter referred to as a VCO, which is used as an example of a high-frequency module) is as follows. First, as shown in FIG. A sub-board 2 having the same pattern is connected and provided. A first step of mounting electronic components on the sub-board 2 and, after this first step, as shown in FIG. In the second step of dividing the connected child board 2 into individual pieces, and after this second step, power is applied to each of the divided child boards 2 to check the operation and in a pattern A third step of adjusting the frequency by trimming the inductance of the formed resonator with a laser beam, and a second step of covering the child substrate 2 with the shield case 3 after this third step, as shown in FIG. After step 4 and this fourth step, It had a fifth step of performing a final inspection.
[0003]
  FIG. 20 is an enlarged view of a main part of the parent substrate 1. A plurality of rectangular child substrates 2 are connected to the parent substrate 1, and the ends of the child substrate 2 are formed at both ends of the parent substrate 1. Connected to the connected portion 4. Reference numerals 5, 6, 7, and 8 denote signal terminals, which are provided on the side surface 10 of the daughter board 2. Further, 9 is a ground terminal provided on the lateral side surface 10, and 11 is a ground terminal provided on the longitudinal side surface 12. For example, the signal terminal 5 is connected to the first circuit 13 in a pattern, and the first circuit 13 is connected to the signal terminal 6 via the second circuit 14 in a pattern. The signal terminal 7 is connected to the signal terminal 8 through the third circuit 15 in a pattern. Reference numeral 16 denotes a dummy portion that is punched with a mold, and has been punched with a mold in order to form the lateral side surface 10 of the daughter board 2. The vertical side surface 12 was provided with a V-groove and was split later to separate the daughter board 2.
[0004]
[Problems to be solved by the invention]
  However, in such a method for manufacturing a high-frequency module represented by a conventional VCO, the child substrate 2 is separated from the parent substrate 1 in the second step, and then all the child substrates are again formed in the third step. It was necessary to adjust the frequency by arranging 2 and the production efficiency was low.
[0005]
  SUMMARY OF THE INVENTION The present invention solves this problem and aims to provide a method for manufacturing a high-frequency module with high production efficiency.
[0006]
[Means for Solving the Problems]
  In order to achieve this object, the method of manufacturing a high-frequency module according to the present invention is provided with the same circuit pattern and a substantially quadrangular shape, with a first terminal formed on one lateral side and formed on the other lateral side. A plurality of high-frequency circuits including a first circuit connected to the first signal terminal and a second circuit connected to the second signal terminal. The sub-board includes a sub-board formed by connecting the sub-boards and having a connecting portion at both ends. The sub-board includes a first sub-board and the first sub-board. A second sub-board connected on one of the side surfaces of the first sub-board and a third sub-board connected on the other side surface of the first sub-board, and the first sub-board of the first board Since the terminal and the second terminal on the second substrate are integrally formed, they are adjacent to each other. And the second terminal on the first board and the first terminal on the third board are formed adjacent to each other so that the electronic component is mounted on the child board. After the first step, and after the first step, the integrally formed first signal terminal and second signal terminal are formed with slits leaving the connecting portions provided at both ends of the parent substrate. A second step of electrically separating and after the second step, at least the first and second terminals of the first substrate are inspected in a state where the child substrate is connected to the parent substrate. By contacting the pins of the jig and supplying signals to the first and second signal terminals, the high-frequency circuit is operated independently of the high-frequency circuits on the other sub-boards, and the first A third step of performing the inspection, and after the third step, The longitudinal sides ofBy dicingA fourth step of cutting and separating the child substrate from the parent substrate;While inserting a shield case into the child substrate between the second and fourth steps, in the fourth step, the dicingSide of shield caseCoarseIt is what comes to mind. Thereby, the productivity of the high-frequency module is improved. Moreover, the material removal of the substrate is improved, and the price can be reduced. Furthermore, by roughening the side surface, the surface area of the shield case is increased, and the heat dissipation performance is improved. Furthermore, by roughening the surface, the frictional force increases and the high-frequency module can be easily held.In addition, since the shield case is put on the slave board, the module can be easily handled. Further, it is not affected by noise from the outside and does not emit noise to the outside. Further, it is not necessary to provide another process for roughening the side surface, and productivity is improved.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
  According to the first aspect of the present invention, the same circuit pattern is provided and a substantially rectangular shape is formed. The first terminal formed on one side surface and the second terminal formed on the other side surface A plurality of sub-boards on which a high-frequency circuit including a first circuit connected to the first signal terminal and a second circuit connected to the second signal terminal is formed, and The sub-boards are formed by connecting the sub-boards to each other and having a connecting part at both ends. The sub-board includes a first sub-board and one lateral side surface of the first sub-board. And a second sub-board connected to the other side surface of the first sub-board, the first terminal on the first board and the second sub-board The second terminal on the substrate is integrally formed with the second terminal, and the second terminal A first step of mounting an electronic component on the child board, the second terminal of the second board being disposed adjacent to the first terminal of the third board so as to be integrally formed; After the first step, the second step of electrically separating the integrally formed first signal terminal and second signal terminal with a slit leaving a connecting portion provided at both ends of the parent substrate. After the second step, with the child board connected to the parent board, the pins of the inspection jig are brought into contact with at least the first and second terminals of the first board. A third step of performing a first inspection by supplying a signal to the first and second signal terminals to operate the high-frequency circuit independently of the high-frequency circuit in the other sub-board; After this third step, the vertical side surface of the daughter board isBy dicingA fourth step of cutting and separating the child substrate from the parent substrate;While inserting a shield case into the child substrate between the second and fourth steps, in the fourth step, the dicingSide of shield caseCoarseA method of manufacturing a high-frequency module to be surfaced, wherein a first and a second signal terminal provided integrally on the side surfaces of a connected sub-board are electrically separated from each other by a slit. Since the steps are included, signals can be independently supplied to the first and second signal terminals in a state where the sub-boards are connected, and the respective circuits can be operated independently. Therefore, it becomes possible to carry out in the form of a worksheet until the inspection of the third step. By doing so, the division of the sub-board into individual pieces is after the third step, and the labor of re-arranging and inspecting the divided pieces as in the conventional case is saved, and the productivity is remarkably increased. improves. Furthermore, by roughening the side surface, the surface area of the shield case is increased, and the heat dissipation performance is improved. Furthermore, by roughening the surface, the frictional force increases and the high-frequency module can be easily held.In addition, since the shield case is put on the slave board, the module can be easily handled. Further, it is not affected by noise from the outside and does not emit noise to the outside. Further, it is not necessary to provide another process for roughening the side surface, and productivity is improved.
[0008]
  In addition, the signal terminals provided on the side surfaces are separated from each other.In the second step, with a slitSince they are directly separated, a dummy part that is punched out with a metal mold as in the prior art is not required, the material removal of the substrate is improved, and the cost can be reduced.
[0009]
  Claim2The invention according to claim 1, wherein when the pin is contacted in the third step, the ground pin is contacted first before any pin, and when the pin is detached, the ground pin is detached later than any pin. The manufacturing method of the high frequency module described in the above, and by performing such a power-on shield case, an electrically stable inspection can be realized.
[0010]
  Claim3Invention described inInA 1st test | inspection is a manufacturing method of the high frequency module of Claim 1 which test | inspects several sub-board | substrates simultaneously, and test | inspection efficiency improves.
[0011]
  Claim4In the method for manufacturing a high-frequency module according to claim 1, the fifth step of performing the second inspection after the fourth step and the taping of the high-frequency module after the fifth step are performed. This is a method of manufacturing a high-frequency module having a sixth step of mounting. Since the second inspection is finally performed after making the individual pieces, a high-frequency module with uniform performance can be obtained. In addition, since the high frequency module is taped, the efficiency of incorporation into the apparatus is improved. Furthermore, since taping, management becomes easy.
[0012]
  Claim5The invention described inAt least secondBefore the processAdjacentBetween child boardsThe electrical connection in the lateral directionVertical sidesoElectrically separateIt is a manufacturing method of the high frequency module according to claim 1, By this,The final process3It is possible to carry out the work up to the inspection of the process.
[0013]
  In addition, since the signal terminals provided on the side surfaces are directly electrically separated from each other, the dummy part that is punched out with a mold is not required as in the prior art, and the material removal of the substrate is improved. Low price can be realized.
[0014]
  Invention of Claim 6 is a manufacturing method of the high frequency module of Claim 5 which has a 5th process which taps and mounts a high frequency module after a 4th process, and after making it a piece, a high frequency module Since the tape is taped, the efficiency of incorporation into the apparatus is improved. Furthermore, since taping, management becomes easy.
[0015]
  Claim7The invention described in the3Inspection of individual child boardsFirst inFor signal terminalsSameAn electric signal is conducted by pressing a pin at one place.1The manufacturing method of the high frequency module described in the above, and each child substrate can be inspected under the same conditions.
[0018]
  Claim8In the second aspect of the invention, in the second step, the cut surface of the child substrate separated by the slit is cut so as to protrude from the shield case.1Since the cut surface of the child board protrudes from the shield case, when the child board is divided from the parent board, the cutting case will not scratch the shield case. . Moreover, even if an external force is applied, the external force is not directly transmitted to the soldered portion of the shield case, and the occurrence of cracks can be prevented.
[0019]
  Claim9The invention according to claim 1 is the method of manufacturing a high-frequency module according to claim 1, wherein in the second step, the cut surface of the child substrate separated by the slit and the side surface of the shield case are cut so as to be substantially equal. Since the surface does not protrude from the side surface of the daughter board, the high-frequency module can be reduced in size. Moreover, the material removal of the sub-board is improved.
[0022]
  Claim10In the invention described in claim 4, before the fourth step, the top surface of the shield caseWhatClaims stamped with a laser beam1The manufacturing method of the high frequency module described in 1), can be stamped at substantially the same position of each of the sub-boards. In addition, since it is stamped by a laser beam, it can be easily stamped even in a narrow place. Furthermore, since it is stamped with a laser beam, it will not disappear even if it is rubbed by hand.
[0023]
  Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0024]
  (Embodiment 1)
  Hereinafter, the first embodiment will be described using the VCO as an example of the high-frequency module. FIG. 2 is a plan view of the parent substrate 21, and the parent substrate 21 has four layers. The mother board 21 has an outer dimension of 91 mm × 94 mm, and 168 child boards 22 of 6.5 mm × 5.3 mm are connected to each other. Each of the sub-boards 22 is formed by pattern wiring having the same shape, and electronic components are mounted. Reference numeral 23 denotes a fixing hole, and reference numeral 24 denotes a mark for confirming the position when the electronic component is mounted.
[0025]
  As shown in FIG. 3, the parent substrate 21 formed in this way is provided with slits 25 by dicing along the side surfaces of the connected child substrates 22. At this time, since the connecting portions 26 are formed at both ends of the parent substrate 21, the child substrate 22 does not fall apart and has a worksheet shape. This manufacturing method is described in detail in Japanese Patent Application No. 8-220942. The slit 25 may be a groove because the signal terminal of the daughter board 22 may be electrically separated. In this case, however, it is necessary to mechanically separate the lateral side surfaces of the sub board 22 later.
[0026]
  FIG. 4 is a plan view of the main part of the parent substrate 21. In FIG. 4, a plurality of rectangular child boards 22 are connected in the parent board 21, and the ends of the child boards 22 are connected to connecting portions 26 formed at both ends of the parent board 21.
[0027]
  Reference numerals 27, 28, 29, and 30 are signal terminals, which are provided on the lateral side surface 31 of the daughter board 22. Reference numeral 32 denotes a ground terminal provided on the lateral side surface 31, and reference numeral 33 denotes a ground terminal provided on the longitudinal side surface 34. For example, the signal terminal 27 is connected to the first circuit 35 in a pattern, and the first circuit 35 is connected to the signal terminal 28 via the second circuit 36 in a pattern. The signal terminal 29 is connected to the signal terminal 30 via the third circuit 37 in a pattern.
[0028]
  Reference numeral 25 denotes a slit formed by dicing along the lateral side surface 31 of the sub board 22, and the signal terminals 27 and 28 and the signal terminals 29 and 30 provided on the adjacent sub board 22 are also electrically operated. Are separated. As described above, since the lateral side 31 of the sub board 22 is electrically separated, the sub board 22 is independently connected to the signal terminals 27, 28, 29, 30 in a state where the sub board 22 is connected to the main board 21 by the connecting portion 26. Signals can be connected to operate the VCO. 25 may be a groove instead of a slit. In this case, it is necessary to divide later and separate the sub board 22. FIG. 5 is a partially enlarged view of adjacent child boards 22.
[0029]
  FIG. 6 shows an inspection apparatus used in the first inspection. In FIG. 6, reference numeral 38 denotes a pressing portion. A pin 39 urged upward by a spring force is implanted in the pressing portion 38, and a signal from the pin 39 is connected to the inspection apparatus main body 40. . Reference numeral 21 denotes a parent substrate, and a child substrate 22 is connected to the parent substrate 21. Then, when the pressing portion 38 rises in the A direction or descends in the B direction, the pin 39 comes into contact with or separates from the signal terminals 27, 28, 29, 30 provided on the child board 22. While the pins 39 are in contact with each other, the VCOs provided in the daughter board 22 are sequentially operated one by one, and the frequency is adjusted by cutting the inductance pattern by laser trimming.
[0030]
  Reference numeral 41 denotes a base placed on the sub board 22, and the surface thereof is linear so that the plurality of pins 39 abut at the same time. In this way, by providing the slit 25 in the parent substrate 21, the connected child substrate 22 is pressed so as not to bend, and the contact between the pin 39 and the signal terminals 27, 28, 29, 30 is ensured. I have to. The base 41 is pressed from above by a plunger, and the pin 39 biased by a spring rises from below, so that the pin 39 reliably contacts the signal terminals 27, 28, 29 and 30. The inspection apparatus may be turned upside down. In this way, when the inspection of the sub-substrates 22 formed in the horizontal row is completed, the sub-substrates in the next row are sequentially inspected. The same applies hereinafter.
[0031]
  Here, the abutment of the pin 39 causes the ground pin to abut on the signal terminal before any pin, and when the pin 39 is detached, the ground pin is detached after any pin, thereby stabilizing the signal supply. We are trying to make it.
[0032]
  Further, although the power supply is turned on for each of the connected child boards 22 to perform the operation test and the laser trimming, a plurality of pins 39 can be performed at a time. In this way, the efficiency is further improved. As described above, in the high-frequency module manufactured using the inspection apparatus used in the present invention, the trace of the pin 39 having the same depth remains at substantially the same position in each corresponding position.
[0033]
  FIG. 7 is a circuit diagram of a VCO as a high frequency module. In FIG. 7, reference numeral 42 denotes a resonance circuit. The resonance circuit 42 varies the resonance frequency by changing the capacitance of the varicap diode 44 by a signal input from the control signal input terminal 43. Reference numeral 45 denotes an inductor formed by a pattern. By trimming the inductor 45 with a laser beam, the inductance value is changed to adjust the resonance frequency. The resonance circuit 42 is connected to the oscillation circuit 46 and is output from the oscillation output terminal 47. A power input terminal 48 supplies power to the VCO circuit. 4, for example, the control signal input terminal 43 corresponds to the signal terminal 27, the oscillation output terminal 47 corresponds to the signal terminal 28, and the power input terminal 48 corresponds to the signal terminal 29. The signal terminal 30 is connected to the ground.
[0034]
  FIG. 8 is a circuit diagram of a VCO / PLL as a high frequency module. In FIG. 8, 50 is a VCO circuit, 51 is a PLL circuit, and 52 is a low-pass filter. In the configuration, the output 53 of the VCO circuit 50 is input to one input 54 of the PLL circuit 51, and the reference frequency of the crystal resonator is input from the signal terminal 56 to the other comparison input 55. This output 56a is connected through a low-pass filter 52 to a varicap diode 57 in which a resonance circuit of the VCO circuit 50 is formed. The output 53 of the VCO circuit 50 is output from a signal terminal 58. Reference numeral 59 denotes an inductance formed by a pattern, which adjusts the inductance of the resonance circuit by trimming with a laser beam.
[0035]
  In the VCO / PLL configured as described above, the oscillation output frequency output from the signal terminal 58 is set by changing the capacitance of the varicap diode 57 in accordance with the data signal input from the signal terminal 60. In this circuit, many signal terminals are led out to the lateral side surface 31 of the daughter board 22 as compared with the VCO of FIG. However, also in this case, it is important to provide all the signal terminals (for example, 80 to 85) on the side surface. Only the ground terminal 86 may be a vertical side surface. In the second embodiment, even signals other than the ground terminal 86 can be provided on the vertical side surface.
[0036]
  Next, the manufacturing process of these high frequency modules is demonstrated using FIG. First, cream solder is printed 61 on a worksheet-like parent substrate 21 formed by connecting a plurality of child substrates 22. Next, an electronic component is mounted 62, and then reflowed 63 to fix the electronic component to all the sub boards 22. Next, the slit 25 is formed 64 by dicing the lateral side surface 31 of the daughter board 22. As a result, the signal terminals of adjacent child boards 22 can be electrically separated. And the drainer 65 which discharges the water used at the time of dicing is performed. Next, power is supplied to the sub board 22 from the pin 39, and the laser trimming 66 is performed to adjust the frequency while checking the oscillation frequency with the inspection apparatus main body 40. This 66 process is referred to as a first inspection. Next, after cleaning 67, a shield case is put on 68, and a seal 69 is applied to the shield case. Then, the solder paste is transferred 70 and the reflow 71 is used to fix the child board 22 and the shield case together. Thus, the master substrate 21 in the form of a worksheet remains until the step 71. Therefore, the production efficiency is very high.
[0037]
  Then, the sub board 22 is divided 72 from the main board 21 into individual pieces. The divided sub-board 22 is subjected to a performance inspection (second inspection) 73 such as final electrical performance to obtain a completed VCO state. Next, this VCO is taped 74 and stored 75.
[0038]
  (Embodiment 2)
  In the second embodiment, the second inspection centering on the electrical inspection performed after dividing the child substrate 22 in the first embodiment is performed before the child substrate 22 is divided. In order to realize this, first, in the first step, the electrical connections in the lateral direction between adjacent child boards are electrically separated on the vertical side surfaces of the child boards. Then, in the second step, the electrical connections on the lateral sides of the adjacent child boards are separated. Therefore, at this point, each of the sub-boards becomes completely electrically independent. In this way, all inspections of individual high-frequency modules can be completed in the state of the worksheet-like substrate before dividing the child substrate from the parent substrate, and the productivity is greatly improved.
[0039]
  That is, in this production method, as shown in FIG. 9, first, a parent substrate is prepared. This parent substrate is the same as the parent substrate of the first embodiment, and has a substantially rectangular shape. In the parent board, child boards are connected vertically and horizontally. In the first step from the parent substrate, the electrical connections in the lateral direction between adjacent child substrates are separated by trimming 101 (that is, electrical separation on the vertical side surface). This can be disconnected in a pattern in the state of the initial parent substrate. This technique will be described later with reference to FIGS.
[0040]
  In the next step, cream solder 102 is printed on the parent substrate. After the cream solder is printed 102, the electronic component is mounted 103, and then the electronic component is fixed to all the sub boards through a reflow 104 furnace.
[0041]
  Next, a slit 105 is formed by dicing on the side surface of the daughter board. This makes it possible to electrically separate the signal terminals between adjacent child boards on the lateral side. And the drainer 106 which discharges the water used at the time of dicing is performed.
[0042]
  Next, the power is supplied from the pins of the inspection jig to the sub board, and the laser trimming 107 is performed while the oscillation frequency is confirmed by the inspection apparatus to adjust the frequency. This step 107 is referred to as a first inspection.
[0043]
  Next, after performing the cleaning 108, the shield case is covered 109, and the shield case 110 is stamped. Then, the solder paste is transferred 111 and the reflow 112 is used to fix the child board and the shield case together. Next, a second inspection 113 which is a final electrical performance inspection is performed.
[0044]
  Then, the sub board is divided 114 from the parent board. The divided child boards are in a completed VCO state, and then the VCO is taped 115 and stored 116. In this way, the processes up to the second inspection 113 are performed with the worksheet-like parent substrate. Therefore, the production efficiency is very high.
[0045]
  FIG. 10 is a plan view of a main part of parent substrate 121 in the second embodiment. A child board 122 is connected to the parent board 121 as in the first embodiment. Reference numeral 123 denotes a connecting portion, and reference numeral 124 denotes a slit provided by dicing. The slit 124 may be a groove because it is sufficient to electrically separate the signal terminals of the adjacent sub-boards 122. However, in this case, it is necessary to mechanically separate the lateral side surfaces of the sub board 122 later.
[0046]
  In FIG. 10, reference numerals 125 to 132 denote signal terminals, which are provided on the lateral side surface 133 and the longitudinal side surface 136 of the daughter board 122. Reference numeral 134 denotes a ground terminal provided on the lateral side surface 133, and reference numeral 135 denotes a ground terminal provided on the longitudinal side surface 136. For example, the signal terminal 125 is connected to the first circuit 137 in a pattern, and the first circuit 137 is connected to the signal terminal 128 through the second circuit 138 in a pattern. The signal terminal 130 is connected to the signal terminal 131 through the third circuit 139 in a pattern.
[0047]
  Reference numeral 124 denotes a slit formed by dicing along the lateral side surface 133 of the daughter board 122. For example, the signal terminal 125 and the signal terminal 128 are separated electrically and mechanically.
[0048]
  FIG. 11 is a partially enlarged view of the vicinity of the vertical side surface 136 of the daughter board 122. At both ends of through holes 140, 141, 142 provided on the vertical side surface 136, the direction of the vertical side surface 136 is cut 143 by an end mill, and the adjacent child boards 122 are electrically separated by the vertical side surface 136. . Reference numerals 144 and 145 denote patterns of the adjacent sub-boards 122. The vertical side surface 136 electrically separates the patterns 144 and 145 without connecting them. As a result, even if the same signal is supplied to the patterns 144 and 145, the same performance is achieved in terms of high frequency. In other words, the performance does not change even when divided.
[0049]
  When the sub-board 122 is divided 114, along the vertical side surface 136,DicingDisconnect with. A V-groove can be formed along the vertical side surface 136 and divided.
[0050]
  In this way, the sub-board 122 is electrically completely separated by the lateral side surface 133 and the longitudinal side surface 136. Accordingly, since the signal terminals 125 to 132 are also electrically separated from the adjacent child boards 122, the signal terminals 125 to 132 are connected in a state (sheet state) where the child board 122 is connected to the parent board 121 by the connecting portion 123. Signals can be connected to operate the VCOs on the substrates connected under the same conditions as when the VCO is a single unit. In addition, description of the same components as those in the first embodiment will be simplified.
[0051]
  Next, a description will be given of the shield case 150 and the marking applied to the sub-board 122. The shield case 150 and the seal are the same in the first embodiment. FIG. 12 is a perspective view of each child board 122 formed on the parent board 121 covered with a shield case 150. Reference numeral 151 denotes a leg soldered to the ground terminal 134 formed on the lateral side surface 133 of the subsidiary board 122 by reflow. FIG. 13 is a sectional view thereof. That is, the leg 151 of the shield case 150 is soldered to the ground terminal 134 formed on the slit 124 side of the parent substrate 121 with the cream solder 160 (reflow soldering) 112. Here, reference numeral 152 denotes an electronic component mounted on the sub board 122.
[0052]
  FIG. 14 is a plan view of the high-frequency module after the child substrate 122 is covered with the shield case 150 and soldered. In FIG. 14, 133 a is a cut surface of the lateral side surface 133 of the daughter board 122, and 136 a is a cut surface of the vertical side surface 136. In the present embodiment, an interval 161 of 0.07 to 0.15 mm is provided between the cut surfaces 133a and 136a and the legs 151 of the shield case 150. That is, the cut surfaces 133 a and 136 a are protruded from the legs 151 provided on the side surface of the shield case 150 by the distance 161. For this reason, when dividing the child substrate 122 from the parent substrate 121, the shield case 150 is not damaged by the blade to be divided. If this protrusion is small, the side surface of the shield case 150 may be damaged when divided. Further, when the protrusion is increased, the shape is increased. Reference numeral 162 denotes a signal terminal.
[0053]
  Further, since the shield case 150 is covered with the worksheet of the parent substrate 121, the cream solder 160 is transferred onto the back surface of the parent substrate 121. Therefore, after the soldering 112, the trace 160a of the solder 160 remains on the bottom surfaces 134a and 135a of the ground terminals 134 and 135.
[0054]
  In this way, the legs 151 of the shield case 150 and the ground terminals 134 and 135 are soldered 115. However, since the cut surfaces 133a and 136a of the sub board 122 protrude from the legs 151, for example, an external force is applied. In addition, no crack is generated in the solder connecting the ground terminals 134 and 135 and the leg 151.
[0055]
  Next, another example of the relationship between the shield case 150 and the sub board 122 will be described. If the surface of the shield case 150 is made rough, the surface area increases, so that even if there is a heat generating component in the child board 122, the heat dissipation performance is improved. To achieve this,Form a rough surface with a dicing blade on the side of the yield case 150The
[0056]
  Accordingly, the surface area of the side surface of the shield case 150 is increased, so that the heat dissipation performance is improved. In this way, the cut surface 133a of the daughter board 122 does not protrude from the side surface of the shield case 150, and the size can be reduced. Furthermore, it is possible to form a rough surface in the same process as the cutting of the child substrate 122 by dicing, and it is not necessary to provide a separate rough surface forming process. The rough surface may be provided on the entire side surface or only one side surface. Moreover, since the rough surface is not formed on the top surface, the aesthetic appearance is not impaired.
[0057]
  Further, as shown in FIG. 15, the shield case 150 is formed by placing a metal plate (tin plate) 154 on a mold base 153 and lowering a punching punch 155 to punch out. At this time, burrs 156 are generated in the punched portion of the metal plate 154.
[0058]
  Next, as shown in FIG. 16, a bent portion 158 is formed by bending in the punching direction 157, and a leg 151 is formed at the tip of the bent portion 158 to complete the shield case 150. This shield case 150 is inserted into the ground terminal 134 of the daughter board 122. Then, a gap 159 is formed between the wall surface 134 a of the ground terminal 134 and the leg 151 due to the burr 156. Due to the gap 159, the solder is melted by reflow heat, and the solder is uniformly soldered by capillary action. Further, since the burr 156 does not protrude toward the adjacent child substrate 122, the distance between the adjacent child substrates 122 can be reduced. It is also safe to touch the outside of the high frequency module.
[0059]
  Next, the top surface of the shield case 150 is marked. Since it is stamped in the form of a worksheet, it can be stamped at a time and work efficiency is improved. Further, a laser beam is used for this marking. Therefore, the marking position does not vary depending on the product, and the appearance is excellent. Further, by using laser light, it is possible to easily mark even a small module, and the printing speed is fast. Moreover, since it is a laser beam, it will not disappear even if it is rubbed by hand.
[0060]
【The invention's effect】
  As described above, according to the present invention, the same circuit pattern is provided and substantially rectangular, and the first terminal formed on one side surface and the second terminal formed on the other side surface are provided. A plurality of sub-boards on which a high-frequency circuit including a first circuit connected to the first signal terminal and a second circuit connected to the second signal terminal is formed; The board is formed by connecting the boards to each other and has a parent board having a connecting portion at both ends. The slave board is connected to the first slave board and one lateral side surface of the first slave board. A second sub-board, and a third sub-board connected to the other side surface of the first sub-board, and the first terminal and the second board on the first board And the second terminal is formed adjacent to each other so as to be integrally formed, and the first terminal A first step in which the second terminal on the plate and the first terminal on the third substrate are integrally formed so as to be integrally formed, and an electronic component is mounted on the child substrate; After the step, the second step of electrically separating the integrally formed first signal terminal and the second signal terminal with a slit leaving a connecting portion provided at both ends of the parent substrate; After the second step, with the child substrate connected to the parent substrate, at least the first and second terminals of the first substrate are brought into contact with the pins of the inspection jig, A third step of performing a first inspection by supplying a signal to the first and second signal terminals to operate the high-frequency circuit independently of the high-frequency circuit on the other sub-board; and After the third step, the vertical side surface of the daughter board isBy dicingA fourth step of cutting and separating the child substrate from the parent substrate;While inserting a shield case into the child substrate between the second and fourth steps, in the fourth step, the dicingSide of shield caseCoarseA method of manufacturing a high-frequency module to be surfaced, wherein a first and a second signal terminal provided integrally on the side surfaces of a connected sub-board are electrically separated from each other by a slit. Since it has a process, it can supply a signal to the 1st and 2nd signal terminal independently in the state where a sub-board was connected, and can operate each high frequency module independently. Therefore, it becomes possible to carry out in the form of a worksheet until the inspection of the third step. By doing so, the division of the sub-board into individual pieces is after the third step, and the labor of re-arranging and inspecting the divided pieces as in the conventional case is saved, and the productivity is remarkably increased. improves.
[0061]
  In addition, since the signal terminals provided on the side surfaces are directly separated by the slits in the second step, the sub-boards are separated from each other by the slits in the second step, so that a dummy part that is punched with a metal mold as in the prior art is not required. Can be improved and the price can be reduced.
  Furthermore, by roughening the side surface, the surface area of the shield case is increased, and the heat dissipation performance is improved. Furthermore, by roughening the surface, the frictional force increases and the high-frequency module can be easily held.In addition, it is not necessary to provide another process for roughening the side surface, and productivity is improved.
[Brief description of the drawings]
FIG. 1 is a process chart of a method for manufacturing a high-frequency module according to Embodiment 1 of the present invention.
FIG. 2 is a plan view of the parent substrate forming the high-frequency module.
FIG. 3 is a plan view of the parent substrate in the middle of the process.
FIG. 4 is a plan view of the main part of the parent board.
FIG. 5 is a partially enlarged view of a child board in the parent board.
FIG. 6 is an explanatory diagram of the inspection apparatus.
FIG. 7 is a circuit diagram of a VCO as a high-frequency module.
FIG. 8 is a circuit diagram of a VCO / PLL as a high frequency module
FIG. 9 is a process diagram of a method for manufacturing a high-frequency module according to Embodiment 2 of the present invention.
FIG. 10 is a plan view of the main part of the parent board.
FIG. 11 is a partially enlarged view of a child board in the parent board.
FIG. 12 is a perspective view of the parent substrate covered with a shield case.
FIG. 13 is a sectional view of the main part of the same.
FIG. 14 is a plan view of a high-frequency module covered with a shield case.
FIG. 15 is a sectional view of the main part of the shield case mold.
FIG. 16 is a cross-sectional view of the main part of the high-frequency module covered with a shield case.
FIG. 17 is a plan view of a parent substrate forming a conventional high-frequency module.
FIG. 18 is a plan view of the child board.
FIG. 19 is a perspective view of the high-frequency module.
FIG. 20 is a plan view of the main part of the parent board.
[Explanation of symbols]
  21 Parent board
  22 Sub-board
  25 slits
  26 Connecting part
  27 Signal terminal
  28 Signal terminals
  29 Signal terminal
  30 signal terminals
  31 lateral side
  34 Longitudinal side
  39 pins
  40 Inspection device body
  62 Electronic component mounting process
  64 Process of providing a slit in the parent substrate
  66 First inspection step for laser trimming
  72 Division process

Claims (10)

The same circuit pattern is provided and has a substantially square shape, and has a first terminal formed on one lateral surface and a second terminal formed on the other lateral surface, and is connected to the first signal terminal. A plurality of sub-boards on which a high-frequency circuit including the first circuit and the second circuit to which the second signal terminal is connected are formed, and the sub-boards are connected to each other. It consists of a mother board having connecting portions at both ends, and the child board includes a first child board, a second child board connected on one lateral surface of the first child board, A third sub board connected on the other side surface of the first sub board, wherein the first terminal on the first board and the second terminal on the second board are integrated. To be formed adjacent to each other, and the second terminal on the first substrate and the The first terminals of the three substrates are arranged adjacent to each other so as to be integrally formed, and after the first step, the integral molding is performed after the first step of mounting the electronic component on the child substrate. In addition, after the second step, the first signal terminal and the second signal terminal are electrically separated by a slit leaving a connecting portion provided at both ends of the parent substrate, and after the second step, In a state where the child board is connected to the parent board, pins of an inspection jig are brought into contact with at least the first and second terminals of the first board, and the first and second signal terminals are brought into contact with each other. A third step of performing a first inspection by operating the high-frequency circuit independently of the high-frequency circuits in the other sub-boards by supplying a signal to the sub-board, and after the third step, wherein either parent substrate said element substrate longitudinal side of the substrate is cut by dicing And a fourth step of separating, with inserting the shield case on the child substrate between said second and fourth steps, said in the fourth step, the side surface of the shield case in the dicing A method of manufacturing a high-frequency module for roughening .   2. The high frequency module according to claim 1, wherein when the pin is abutted in the third step, the ground pin is abutted before any pin, and when the pin is detached, the ground pin is separated after any pin. Production method.   The method for manufacturing a high-frequency module according to claim 1, wherein the first inspection is to inspect a plurality of sub-substrates simultaneously.   5. The method of manufacturing a high frequency module according to claim 1, wherein a fifth step of performing a second inspection after the fourth step and a sixth step of taping and mounting the high frequency module after the fifth step. A method for manufacturing a high-frequency module.   The method for manufacturing a high-frequency module according to claim 1, wherein, prior to at least the second step, a lateral electrical connection between adjacent child boards is electrically separated on a vertical side surface of the child boards.   The manufacturing method of the high frequency module of Claim 5 which has a 5th process of carrying out taping mounting of a high frequency module after a 4th process.   The method of manufacturing a high-frequency module according to claim 1, wherein the inspection in the third step conducts an electrical signal by pressing a pin at the same place with respect to the first signal terminal in each sub-board.   The manufacturing method of the high frequency module of Claim 1 cut | disconnected so that the cut surface of the sub-board | substrate isolate | separated by a slit might protrude rather than a shield case in a 2nd process.   The method for manufacturing a high-frequency module according to claim 1, wherein in the second step, the cut surface of the child substrate separated by the slit and the side surface of the shield case are cut to be equal. The method of manufacturing a high-frequency module according to claim 1 , wherein the top surface of the shield case is stamped with a laser beam before the fourth step.

Images