JP3898781B2 - Endoscope - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an endoscope that repairs a target site by inserting into a duct or inside the duct.
[0002]
[Prior art]
2. Description of the Related Art Recently, an endoscope capable of observing an organ in a body cavity by inserting an elongated insertion portion into a body cavity or performing various therapeutic treatments using a treatment instrument inserted into a treatment instrument channel as necessary. Widely used.
[0003]
In addition, industrial endoscopes are widely used for observation and inspection of internal flaws and corrosion of boilers, gas turbine engines, chemical plants, etc. and automobile engines.
[0004]
Then, as a method for detecting and repairing defective parts such as scratches and corrosion by inserting the industrial endoscope into the pipe, repairing is performed by gas welding or arc welding by applying a repair member to the defective part from the outside of the pipe. There is a way.
[0005]
Japanese Patent Laid-Open No. 6-63787 has a manipulator capable of bending control at the distal end portion of the endoscope, and uses a welding means disposed at the distal end of the manipulator to identify defective portions inside the pipe. There is shown a welding endoscope apparatus in which a manipulator is arranged at a defect site while being observed by an imaging means and repaired by a welding means.
[0006]
However, in the welding endoscope apparatus disclosed in Japanese Patent Laid-Open No. 6-63787, the bending operation of the bending portion 401 of the endoscope 400 and the bending of the manipulator 403 disposed in the endoscope distal end portion 402 are performed as shown in FIG. The operation is bent by pulling each operation wire 401a, 403a extending through the insertion portion 404 to the hand side. For this reason, when the endoscope distal end portion 402 is inserted into the conduit and inserted into a deep target site to perform repair work, the insertion portion 404 becomes complicated by being inserted into the conduit having a complicated shape. Even if the operation wires 401a and 403a are bent and operated by bending, the operation force is not smoothly transmitted to the bending portion 401 or the manipulator 403, and the distal end portion of the welding means provided at the distal end of the manipulator 403 It was difficult to accurately place 405 at the repair location.
[0007]
Further, since the repairing work is performed with the distal end portion 405 of the welding means being applied to the repaired portion, even if the bending portion 401 of the endoscope 400 is intended to be held, malfunction occurs due to the loosening of the operation wires 401a and 403a. Then, there is a possibility that the welding means abuts on a portion that is not a repaired portion and damages the pipeline.
[0008]
In addition, when repairing a defective part, the repair method is determined depending on the state of the defective part. To perform this work, it is difficult with one endoscope. After measuring the size, another endoscope for repair work was inserted to repair the defective part. However, there is a problem in that it is necessary to position an endoscope for repair work on the measured defect site, and this work cannot be performed efficiently.
[0009]
[Problems to be solved by the invention]
In the conventional endoscope apparatus, when repair work is performed, the endoscope tip often moves up and down, left and right, but even in such a case, maintaining the posture of the endoscope tip is not possible. It was difficult.
The present invention has been made in view of the above circumstances, such as when the repairing portion of the observation target is being repaired by the repairing work means, such as when the rigid head portion is vertically or horizontally with respect to the viewing direction of the observation means. Even if it moves in the direction, the posture detection means can detect the movement and accurately perform the bending operation of the bending part. In addition, the measurement efficiency can be improved because the center of the measurement range and the visual field direction of the observation means can be approximately matched. It is an object to provide an endoscope.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, an endoscope according to one aspect of the present invention includes a rigid head portion provided on a distal end side of a flexible elongated insertion portion, observation means provided on the rigid head portion, In an endoscope comprising a curved portion connected to the rear side of the rigid head portion,
In the hard head part,
Repair work means for repairing the repair site in the observation target;
Measure the size of the repair site The center of the measurement range is substantially coincident with the center of the viewing direction of the observation means. Measuring means;
Posture detecting means for detecting that the rigid head portion provided with the repair work means and the measuring means moves in the vertical direction or the horizontal direction with respect to the visual field direction of the observation means;
With
The detected value detected by the posture detection means is fed back to the bending operation of the bending portion to hold the posture of the rigid head portion.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
1 to 13 relate to an embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of an endoscope, FIG. 2 is a diagram explaining a configuration of a rigid head portion, and FIG. 3 is a schematic configuration of a substrate. FIG. 4 is an explanatory diagram showing a state in which a micro optical scanner and a micro gyro are arranged on a substrate, FIG. 5 is a diagram explaining the configuration of the micro optical scanner, and FIG. 6 is a diagram explaining the configuration of a repair manipulator. 7 is a diagram illustrating the configuration of the micro welding tool, FIG. 8 is an explanatory diagram illustrating the schematic configuration of the bending portion, FIG. 9 is a diagram illustrating the configuration of the bending shape memory alloy, and FIG. 10 is the configuration of each bending portion. FIG. 11 is an explanatory view showing a method of disposing the bending shape memory alloy to the bending portion, FIG. 12 is a view showing an example of use of an endoscope, and FIG. 13 is an operation example of the bending portion. It is explanatory drawing.
[0013]
As shown in FIG. 1, the endoscope 1 has an elongated insertion portion, and this insertion portion is in order from the distal end side, a rigid head portion 2, a bending portion 3 made of a flexible tube member, and a flexible tube portion 4. Concatenated.
[0014]
The bending portion 3 is, for example, a first bending portion 3a provided continuously with the rigid head portion 2 and a second bending portion 3b provided continuously with the first bending portion 3a so as to correspond to a complicated bending operation. The second curved portion 3b is configured with a third curved portion 3c having one end connected to the second curved portion 3b and the other end connected to the flexible tube portion 4.
[0015]
An observation optical system 5 serving as a visual function for observation and an illumination optical system 6 serving as an illumination function for illuminating a repair unit (not shown) are disposed on the distal end surface of the rigid head unit 2. From the surface, there are provided a micro welding tool 7 constituting a repair work means for performing repair work of the repair part, and a repair manipulator 8 having a bending function to be described later for arranging the micro welding tool 7 in the repair part.
[0016]
Further, in the rigid head portion 2, the micro optical scanner 9 which is a measuring means for measuring the size of the repair portion and the movement of the rigid head portion 2 during the repair operation are detected to detect the rigid head portion 2 during the repair operation. And a micro gyro 10 for detecting a rotational angular velocity, which is an attitude detecting means for constantly detecting the attitude of the motor.
[0017]
The configuration of the rigid head unit 2 will be described with reference to FIGS.
As shown in FIG. 2, the image guide 5 a constituting the observation optical system 5 disposed in the rigid head portion 2 and the light guide 6 a constituting the illumination optical system 6 constitute the curved portion 3 side of the rigid head portion 2. The 2nd fixing | fixed part agent 12 to insert is penetrated, and it fixes to the predetermined position of the 1st fixing member 11 which comprises the front end side, respectively. Between the first fixing member 11 and the second fixing member 12, a substrate 13 to which the micro optical scanner 9, the micro gyro 10 and the like are fixed is disposed.
[0018]
Further, the first fixing member 11 is provided with repair manipulators 8 and 8 each provided with a laser welding portion 7a and a filler material supply portion 7b as the micro welding tool 7 at the distal end portions. Yes.
[0019]
A laser fiber for supplying laser light to the laser welded portion 7a inside the rigid head portion 2 by providing a laser welded portion 7a and a filler material supplying portion 7b as the micro welder 7 at the tip of the manipulator 8. 14 and a filler material tube 15 for supplying a filler material and a shielding gas to the filler material supply section 7b and a shield gas tube 16 are inserted therethrough.
[0020]
Further, the repair manipulator 8 is provided with a plurality of shape memory alloys (hereinafter abbreviated as SMA) 17 which will be described later as bending mechanism members for bending the repair manipulator 8 in a desired direction. One end of the SMA 17 is connected to the substrate 13 and is electrically connected to a control device (not shown) for controlling the micro optical scanner 9 and the micro gyro 10.
[0021]
As shown in FIG. 3, the substrate 13 is a composite member of a silicon substrate 18 and a polyimide film 19 provided with wiring and electrodes, and the micro optical scanner 9 and the micro gyro 10 are connected to the polyimide film 19, respectively. The scanner electrode unit 20 and the gyro electrode unit 21, the scanner drive circuit 22 constituting the scanner drive circuit, the gyro drive circuit 23 constituting the gyro drive circuit, and the like are provided.
[0022]
As shown in FIG. 4A, the micro optical scanner 9 and the micro gyro 10 are connected and fixed to the scanner electrode section 20 and the gyro electrode section 21 and the scanner drive circuit 22 and the gyro drive circuit 23 of the substrate 13. The micro optical scanner 9 and the micro gyro 10 are arranged on the substrate 13.
[0023]
As shown in FIG. 4B, by providing the micro gyros 10a and 10b on the substrate 13, the angular velocities in the vertical direction of the substrate 13 indicated by the arrows AA 'in the drawing are detected by the micro gyro 10a. The angular velocity in the horizontal direction of the substrate 13 indicated by the middle arrow BB ′ is detected. As a result, when the rigid head unit 2 moves in the vertical direction or the horizontal direction with respect to the viewing direction of the observation optical system 5, the angular velocity is detected by the micro gyroscope 10, and this detected value is fed back to the bending operation of the bending unit 3. Hold the posture.
[0024]
As shown in FIG. 4C, by providing three additional micro gyros 10c on the substrate 13, in addition to the vertical and horizontal angular velocities of the substrate 13, the substrate 13 has a longitudinal axis. The angular velocity at the time of rotation may be detected. Thus, since the micro gyro 10c detects how much the rigid head portion has rotated from the gravity direction of the image recognized first, the gravity direction of the image imaged by the observation optical system 5 can be easily detected.
[0025]
As shown in FIG. 5, the micro optical scanner 9 includes a piezoelectric vibrating body 92 on a scanner substrate 91, and a movable portion 93 is connected to the piezoelectric vibrating body 92 by an elongated needle-like member 94. The movable portion 93 is moved by the vibration of 92.
[0026]
A surface emitting laser 95, which is a semiconductor laser formed in a thin film shape, is affixed to the surface of the movable portion 93, while a light receiving element 96 that detects the intensity of light and a target object are attached to the surface of the scanner substrate 91. A distance light receiving element 97 for measuring the distance is provided.
[0027]
A cover 98 is disposed on the front surface of the scanner substrate 91, and an opening 98 a formed at a position corresponding to the light receiving element 96 and a position corresponding to the distance light receiving element 97. And a pinhole 98b formed in the above.
[0028]
The distance light receiving element 97 includes a photodiode (hereinafter abbreviated as PD) and a position sensing device (hereinafter abbreviated as PSD). When the distance light receiving element 97 is a PD, it enters the pinhole 98b. Since the intensity of the light entering the distance light receiving element 97 is changed by changing the angle of the light, the distance to the object can be known by the amount of change of the incident light. In other words, by measuring the intensity of light that becomes the standard distance in advance, the positional relationship based on this value can be easily measured, and the distance to the object and the amount of change in the light incident on the PD can be measured. The size of the scratch can be measured.
[0029]
On the other hand, when the distance light receiving element 97 is a PSD, the incident position of the light is known, so the incident angle is measured from the relationship between the pinhole 98b and the incident position of the PSD light. At this time, since the movable portion 93 is operated by controlling the piezoelectric vibrating body 92, the relationship between the frequency of the piezoelectric vibrating body 92 and the swing angle of the movable portion 93 is measured in advance, The distance can be measured, and if the distance is known, the size of the scratch can be measured.
[0030]
The repair work means will be described with reference to FIGS.
As shown in FIG. 6, the repair manipulator 8 is connected to a tubular flexible first tube 81 and a tubular flexible second tube 82 that is externally fitted to the first tube 81. Configured.
[0031]
For example, six wire insertion holes 81a are provided in the meat portion of the first tube 81, and for example, Teflon corresponding to the wire insertion holes 81a provided in the first tube 81 is provided in the second tube 82. In addition, a guide tube 83 formed of a silicon member is provided.
[0032]
In the six wire insertion holes 81a of the first tube 81, three first shape memory alloy wires (hereinafter referred to as first SMA wires) 17a whose length expands and contracts according to the heating state are folded back at the distal end surface. As shown in FIG. 2B, three sets of two wire insertion holes 81a, 81a are inserted. The first SMA wire 17a extends through the through hole of the guide tube 83 corresponding to the wire insertion hole 81a to the hand side, and each end portion of the first SMA wire 17a is formed of a stainless steel or brass pipe. It is fixed to the member 84a. The caulking member 84a has an outer dimension that is larger than the inner diameter dimension of the through hole of the guide tube 83.
[0033]
Further, the second tube 82 is provided with a second shape memory alloy wire (hereinafter referred to as second SMA wire) 17b whose length expands and contracts depending on the heating state, as shown in FIG. Three wires 82 are folded back at the distal end side so as to pass through the inner peripheral surface side and the outer peripheral surface side of 82, and each end portion of the second SMA wire 17b is fixed to the caulking member 84b.
[0034]
Lead wires 85 for supplying current to the first SMA wire 17a and the second SMA wire 17b are connected to the caulking members 84a and 84b, respectively.
[0035]
As shown in FIG. 4D, a fixing member 86 is disposed behind the second tube 82. The fixing member 86 is provided with six lead wire insertion holes 86a similarly to the first tube 81, and a lead wire 85 connected to the caulking member 84 at the end of the first SMA wire 17a is disposed. Has been. Further, the second SMA wire 17 b is disposed between the fixing member 86 and the second tube 82, and between the second tube 82 and the heat shrinkable tube 87 covering the second tube 82. Caulking members 84b are respectively arranged.
[0036]
Thus, the first tube 81 forms a manipulator first bending portion, and the second tube 82 forms a manipulator second bending portion. The first tube 81 and the second tube 82 are integrally connected and fixed by tightening a heat-shrinkable tube 87 around the outer periphery of the connection portion between the first tube 81 and the second tube 82. Yes.
[0037]
As shown in FIG. 7, the micro welding tool 7 is attached to the tip of the repair manipulator 8, and a laser welded portion 7 a and a filler material supply portion are attached to the tips of the two repair manipulators 8 of this embodiment. 7b are provided.
[0038]
The laser welded portion 7 a includes a laser fiber 71 that is inserted from the hand side into the repair manipulator 8 and guided to the tip, and an optical portion 72 that is disposed at the tip of the laser fiber 71. .
[0039]
On the other hand, the filler material supply unit 7b is mounted with, for example, a piezoelectric element 74 serving as an actuator for feeding a filler material 73 for welding a repaired portion, and is inserted with a gas supply tube 75 for supplying, for example, argon gas as a shielding gas. is doing.
[0040]
Accordingly, by heating the first SMA wire 17a and the second SMA wire 17b with the lead wire 85, the temperature of the SMA wires 17a and 17b is appropriately changed, and the micro welder 7 provided on the repair manipulator 8 is provided. It is possible to confront the repair department.
[0041]
The configuration of the bending portion 3 will be described with reference to FIGS.
As shown in FIG. 8, the bending portion 3 of the present embodiment connects the first bending portion 3a, the second bending portion 3b, the third bending portion 3c and the respective bending portions with three flexible tubes. It is comprised with the connection member 31. FIG.
[0042]
A plurality of through-holes 32 extending in the longitudinal direction are formed in a tube forming each bending portion constituting the bending portion 3, and the shape memory alloy for the bending portion (hereinafter referred to as a bending SMA) is formed in the through-hole 32. 33 is abbreviated to be provided.
[0043]
As shown in FIG. 9, a heating heater 34 is spirally wound around the outer peripheral surface of the bending SMA 33 disposed in the through hole 32, and the bending SMA 33 is indirectly connected to the heating SMA 33. When heated, the temperature of the bending SMA 33 is changed to expand or contract or bend. Reference numeral 35 denotes wiring for supplying a current to the heater 34.
[0044]
As shown in FIG. 10, the number of through holes 32 respectively formed in the tubes constituting the first bending portion 3a, the second bending portion 3b, and the third bending portion 3c is the first bending portion on the distal end side. Three, six, and nine are provided in order from 3a, and three bending SMAs 33 are disposed in predetermined through holes 32 of the bending portions 3a, 3b, and 3c.
[0045]
Specifically, three through holes 32a, 32b, and 32c are formed in the first bending portion 3a as shown in FIG. 5A, and the bending SMA 33 is formed in each of the through holes 32a, 32b, and 32c. Is inserted. The second bending portion 3b is formed with six through holes 32a to 32f as shown in FIG. 5B, and the bending SMA 33 is inserted into the through holes 32d, 32e and 32f. Furthermore, nine through holes 32a to 32i are formed in the third bending portion 3c as shown in FIG. 5C, and the bending SMA 33 is inserted into the through holes 32g, 32h, and 32i.
[0046]
The first curved portion 3a is provided in the through holes 32a, 32b, 32c formed in the second curved portion 3b and the through holes 32a, 32b, 32c formed in the third curved portion 3c. The wiring 35 of the heater 34 for heating the bending SMA 33 is inserted. Further, the wiring 35 of the heater 34 for heating the bending SMA 33 provided in the second bending portion 3b is inserted into the through holes 32d, 32e, 32f formed in the third bending portion 3c. ing.
[0047]
For this reason, the bending state of each bending part 3a, 3b, 3c and the bending state of the whole bending part 3 are desired by appropriately adjusting the heating state of the bending SMA 33 provided in each bending part 3a, 3b, 3c. It can be in the curved state.
[0048]
Note that the end of the bending SMA 33 is fixedly held by a support member 36 disposed at the end of each of the bending portions 3a, 3b, 3c as shown in FIG.
[0049]
Further, in this embodiment, the bending SMA 33 is indirectly heated by the heating heater 34. However, the bending SMA 33 is heated by Joule heat by passing a current directly through the bending SMA 33 to drive the bending. Also good.
[0050]
The operation of the endoscope 1 configured as described above will be described.
For example, the endoscope 1 is inserted into the power generation facility shown in FIG. 12 or the turbine portion 41 of the aircraft engine to perform repair work.
[0051]
First, the endoscope 1 is pushed in while observing a duct (not shown) illuminated by the illumination optical system 6 with the observation optical system 5. On the way, if there is a stepped portion 42 as shown in FIG. 13A inside the pipe, the bending SMA 33 disposed in the second and third bending portions 3b and 3c is appropriately heated to move upward. In the bent state, as shown in FIG. Then, the bending SMA 33 is adjusted so that the second bending portion 3b is bent downward, and the rigid head portion 2 of the endoscope 1 gets over the stepped portion 42 as shown in FIG. Thereafter, the endoscope 1 is pushed in and inserted through the turbine portion 41.
[0052]
Next, the rigid head portion 2 of the endoscope 1 is disposed between the turbines 41 a and 41 b, and the state of the turbine 41 b is observed with the observation optical system 5. At this time, if a micro scratch is found in the turbine 41b, the piezoelectric vibrating body 92 of the micro optical scanner 9 is operated. Then, the movable part 93 connected via the needle-like member 94 operates two-dimensionally, the laser light is emitted from the surface emitting laser 95, and planar scanning is performed.
[0053]
When the laser light emitted from the surface emitting laser 95 hits the target site, the reflected light enters the light receiving element 96 and the intensity of the light is detected. Since the intensity of the reflected light differs between when the turbine 41 is flawed and when it is not flawed, the position of the flaw is known from this, and the reflected light passes through the pinhole 98b and enters the distance light receiving element 97. I know the distance.
[0054]
Next, a repair work method corresponding to the size of the wound is selected from the measured result.
When it is necessary to perform a welding operation for repair, first, positioning is performed by appropriately controlling the bending state of the bending portion 3 of the endoscope 1. Next, the attitude of the rigid head unit 2 is detected by the micro gyroscope 10. At this time, according to the detection result of the micro gyro 10, the bending SMA 33 disposed in the bending portions 3a, 3b, and 3c is controlled to hold the posture, and the repair manipulator 9 is bent to perform repair. A welding operation is performed while the tip of the micro welding tool 7 is accurately placed at a location and the filler material 73 is supplied.
[0055]
In the case of a slight scratch, the micro welder 7 repairs the micro scratch by melting the peripheral portion of the turbine 41 without using the filler material 73. In some cases, repair work is not performed depending on the location of the scratch and the size of the scratch.
[0056]
Thus, by providing the measuring means and the posture detecting means on the rigid head portion of the endoscope, it is possible to perform the repair work accurately and reliably while confirming the position of the rigid head portion and the size of the scratch. . As a result, the repair work can be reliably performed by the micro welding tool disposed at the tip of the manipulator, so that workability is greatly improved.
[0057]
Further, when repair work is performed, the measurement of the size of the scratch and the repair work can be performed without removing and inserting the endoscope. This greatly reduces the working time.
[0058]
Furthermore, when the endoscope is inserted into a complex-shaped pipe line and the micro welding tool disposed at the distal end of the repair manipulator is disposed at the repair location, the curved section and the repair manipulator are disposed. The bending state can be directly controlled by the bending SMA and the first and second SMA wires. As a result, the hard head portion and the micro welding tool can be accurately guided to the repaired portion. Further, since the posture of the rigid head during the repair work is stably maintained, the repair work can be performed accurately and accurate measurement can be performed.
[0059]
In addition, the size of the scratch can be measured by the measuring means while observing with the observation optical system. This greatly improves the reliability of the repair work.
[0060]
Further, even if the observation optical system fails to function due to an accident or the like, the object can be recognized by the measuring means.
[0061]
In addition, even if the operation is mistaken during repair work and the repaired part is out of the field of view and the position of the rigid head is unknown, it can be quickly returned to the original position by the angular velocity detected by the posture detection means. . This prevents losing sight of the repair location.
[0062]
In addition, since the gyro is provided as a posture detecting means on the rigid head, the gravitational direction of the image can be easily understood when an image taken as an observation optical system is displayed on the monitor.
[0063]
In the present embodiment, the bending operation of the bending portion and the repair manipulator is performed by the bending SMA and the first and second SMA wires arranged at three places. There may be five places.
[0064]
Further, the configuration of the rigid head portion, the configuration of the micro optical scanner or the configuration of the manipulator, the configuration of the micro welding apparatus, and the configuration of the bending portion are not limited to the above-described embodiments, and are configured as follows. Also good. Hereinafter, the same members as those of the above embodiment are denoted by the same reference numerals, and the description thereof is omitted.
[0065]
With reference to FIG. 14, another configuration of the rigid head portion will be described.
As shown in the figure, the hard head portion 2A is composed of a head portion main body 101 having a notch portion 101a connected to the bending portion 3, a repair manipulator 8 provided with a micro welding tool 7, a micro optical scanner 9, and a micro head. The substrate 13 to which the gyro 10 is fixed is configured to include a fixing member main body 102 that is detachable and a head portion cover 103 that is disposed in the notch 101a.
[0066]
After the substrate 13 on which the micro optical scanner 9 and the micro gyro 10 are fixed and the repair manipulator 8 provided with the micro welding tool 7 are disposed on the fixing member main body 102, the laser fiber 14, the filler material tube 15 and the shield are arranged. The gas tube 16 and the like are accommodated in the head unit main body 101, and the head unit cover 103 is attached to the notch 101a of the head unit main body 101. Are integrally configured to form the rigid head portion 2A. Other configurations are the same as those of the first embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted. This improves the assemblability of the rigid head.
[0067]
Note that the micro optical scanner 9 and the micro gyro 10 are arranged in the rigid head portion 2 in such a positional relationship that the micro optical scanner 9 is provided in the direction of the distal end of the endoscope 1 and the micro optical scanner 9 is positioned behind the micro optical scanner 9. The gyro 10 is provided. As a result, either the measurement on the side surface near the tip side of the rigid head portion 2 shown in FIG. 1 or the measurement on the front side of the tip surface of the rigid head portion 2A as shown in FIG. It corresponds also to.
[0068]
Another configuration of the arrangement position of the micro optical scanner will be described with reference to FIG.
As shown in FIG. 6A, the micro optical scanner 9 is disposed obliquely, for example, and the center of the scanning range and the approximate center of the field of view of the observation optical system 5 are made to coincide in the direction of the field of view of the observation optical system 5. Scanning by the micro optical scanner 9 can be performed. This can improve the work efficiency of measurement.
[0069]
Further, as shown in FIG. 4B, the light receiving element 96 of the micro optical scanner 9 is separated into a scanner part 96a and a light receiving element part 96b. This makes it possible to reduce the size and the diameter by using a configuration that matches the surrounding shape.
[0070]
Another configuration of the measuring means will be described with reference to FIG.
As shown in the figure, instead of the micro optical scanner 9 in the embodiment, the measuring means is a fiber 110 provided on the hand side from the distal end of the endoscope 1, a light receiving element 111, a laser device 112 provided on the hand side, The lens 113 that condenses the laser light emitted from the laser device 112 and the scanning unit 114 that scans the laser device 112 in parallel and two-dimensionally with respect to the end face of the fiber 110 are configured.
[0071]
According to this measuring means, the laser beam is emitted to the lens 113 while the hand side laser device 112 is operated two-dimensionally by the driving device 114 which is a scanning means. Then, the laser beam condensed by the lens 113 enters from the end face of the fiber 110 and exits from the tip side toward the object. Then, the reflected light of the laser beam is detected by the light receiving element 111, and scratches can be measured.
[0072]
As a result, the measuring means is configured simply by inserting a slender fiber into the insertion portion of the endoscope, so that the diameter of the insertion portion can be reduced. Even if a semiconductor laser is provided instead of the fiber, the same operation and effect can be obtained.
[0073]
As shown in FIG. 17, an opening 121 is provided on the side of the endoscope 120, and a fiber 122, a micro light scanner 123, and a lens 124 are provided inside the endoscope. The micro optical scanner 123 is configured such that the surface emitting laser 95 is removed in the configuration of FIG. 5 and the movable portion 93 is a mirror surface, and the light emitted from the fiber 122 is emitted to the end surface and reflected. The light thus collected may be collected by the side lens 124 so that scratches and the like can be measured.
[0074]
Another configuration of the repair manipulator will be described with reference to FIGS. 18 and 19. As shown in FIG. 18, in the repair manipulator 8A, a shape memory alloy plate plate (hereinafter abbreviated as SMA plate) 133 that changes the bending shape according to the temperature change is arranged between the tubes 131 and 132 that are arranged twice. The provided tubular member 134 is connected by a connecting member 135 to constitute a repair manipulator 8A having two curved portions.
[0075]
As shown in FIG. 19, a thin film heater 136 for heating the SMA plate 134 is affixed to the SMA plate 134. By controlling the heating temperature with a control device on the hand side (not shown), As shown by arrows F and G, a bending operation can be performed.
[0076]
Another configuration of the micro welding apparatus will be described with reference to FIG.
As shown in the figure, the micro welding apparatus 140 is a TIG welding apparatus, which is configured by mechanically connecting a tungsten electrode 142 to the tip of an electric cable 141 by a caulking member 143, and passing a current through the tungsten electrode 142. 142 can be repaired by heating.
[0077]
Another configuration of the micro welding apparatus will be described with reference to FIG.
As shown in the figure, a shielding gas is ejected from the tip of the filler material supply section 7b attached to one repair manipulator 8 side. On the other hand, a suction hole 145 for sucking shield gas is provided in the laser welding portion 7a attached to the other repair manipulator 8 side.
[0078]
As a result, the shield gas ejected from the filler supply part can be exhausted during repair work, so that when working in a sealed space, the internal pressure is prevented from increasing and safe work can be performed. .
[0079]
Another configuration of the micro welding apparatus will be described with reference to FIG.
As shown in the figure, a torch 150 is provided at the tip of the repair manipulator 8, and two conduits 151 and 152 are joined and connected to the torch 150.
[0080]
A dissolved acetylene container 152 is connected to the conduit 151 via an acetylene backfire preventer 152a and an acetylene adjuster 152b. An oxygen container 154 is connected to the conduit 153 with an oxygen backfire preventer 154a, oxygen It is connected via a pressure regulator 154b.
[0081]
The dissolved acetylene container 152 and the oxygen container 154 are filled in a high-pressure gas container, and are decompressed by the pressure regulators 152 b and 154 b and guided to the torch 150.
[0082]
In this way, the micro welding apparatus can be adjusted by adjusting the amount of acetylene and oxygen, and by adjusting the ratio of acetylene and oxygen, reducing flame, neutral flame and oxidization flame can be selected. Welding can be performed.
[0083]
Still another configuration of the micro welding apparatus will be described with reference to FIGS.
As shown in FIG. 23, an electrode portion 155 is provided at one tip of the repair manipulator 8, and a grip portion 156 also serving as an electrode portion is provided at the tip of the other repair manipulator 8. The electrode electrode 155 and the gripping portion 156 (not shown) are connected to a power source.
[0084]
When performing the welding operation, as shown in FIG. 23, the metal foil 157 is held by the holding portion 156, and the metal foil 157 is arranged at the repair position. Then, as shown in FIG. 24, the metal foil 157 is sandwiched between the electrode 155 and the repair member 158.
[0085]
In this state, as shown in FIG. 24, the grip portion 156 is brought into contact with the vicinity of the repair position to turn on the power. Then, an electric current flows as shown by a broken line in the figure, the metal foil 157 is melted, and the welding is finished.
[0086]
As a result, since welding can be performed in a narrow range, it is possible to easily repair small scratches. Moreover, the influence by heat can be made into a narrow range.
[0087]
Still another configuration of the micro welding apparatus will be described with reference to FIGS. 25 and 26.
As shown in FIG. 25, the micro welding apparatus 160 includes a single repair manipulator 8 protruding from the distal end portion of the endoscope 1, an electron gun 161 provided at the distal end thereof, and a distal end portion of the endoscope 1. The pipe 162 is led to the hand side, and the vacuum pump 163 is connected to the pipe 162.
[0088]
As shown in FIG. 26, the electron gun 161 is configured by providing a cathode portion 164, an anode portion 165, and an electromagnetic coil 166 inside a tip portion 161a. The electron gun 161 is emitted by overheating the cathode portion 164 in a high vacuum, accelerated by a high voltage, and focused by an electromagnetic coil 166 to emit energy.
[0089]
The endoscope 1 is guided to a repair position in a sealed space, and the repair manipulator 8 is operated and placed in the repair portion. In this state, the vacuum pump 163 is operated to make a high vacuum in the space, and an electron beam is generated from the electron gun 161.
[0090]
Thereby, since high energy can be concentrated and welded to a repair part, a welding width can be made narrow and deep.
[0091]
Repair work means other than welding will be described with reference to FIGS. As shown in FIG. 27, a micro grinding device 170 having a grindstone 171 as a repairing means and a motor 172 as a drive unit for rotating the grindstone 171 is disposed at the tip of the repair manipulator 8. A DC motor is used as the motor.
[0092]
Further, as shown in FIG. 28, the grindstone 171 may be rotated by rotating the air turbine 173 by injection of shield gas.
[0093]
Accordingly, when there is a crack cut at an acute angle as shown in FIG. 27, the micro-grinding device 170 can be cut into a round shape so that stress concentration does not occur. Repair work can be done.
[0094]
Further, as shown in FIG. 29, a flexible and flexible shaft 175 is connected to a grindstone 171 provided at the tip of the repair manipulator 8, while the proximal side of the shaft 175 is connected to a motor 176. A coil sheath 177 is provided on the outer peripheral portion of the shaft 175, and the coil sheath 177 is disposed through the repair manipulator 8 and the endoscope 1 to the hand side.
[0095]
Thus, by driving the motor, the rotational force of the motor is transmitted to the grindstone via the shaft, so that it is possible to repair minute scratches such as cracks.
[0096]
As described above, since the motor, which is the drive unit, is provided on the proximal side of the endoscope, the motor can be enlarged, the grinding force by the grindstone is increased, and the diameter of the endoscope can be reduced. become.
[0097]
With reference to FIGS. 30 to 32, another configuration of the bending portion will be described. ◎)
As shown in FIG. 30, the first bending portion 3d, the second bending portion 3e, and the third bending portion 3f constituting the bending portion 3A are connected by a connecting member 181. The tubes forming the first curved portion 3d, the second curved portion 3e, and the third curved portion 3f are provided with through holes 182a, 182b, and 183c that are elongated and extend in the longitudinal direction, respectively.
[0098]
For example, water and air are allowed to flow as fluids in the through holes 182a, 182b, and 183c provided in the tube, and the fluid is appropriately flowed into the through holes 182a, 182b, and 183c, respectively. The bending portion 3 is driven to bend in a desired direction by expanding the holes 182a, 182b, and 183c in the longitudinal direction.
[0099]
The bending drive of the bending portions 3d, 3e, and 3f is connected to a fluid supply source 183 provided on the proximal side, and is independently driven by a fluid supply tube (described later) extending into the through holes 182a, 182b, and 183c. It has come to be.
[0100]
The configuration of the bending portion will be specifically described with reference to FIG.
As shown in FIG. 6A, the first curved portion is formed in the opposing through holes 182a, 182b, 183c formed in the first curved portion 3d and the second curved portion 3e constituting the curved portion 3. A tube connection member 185 having a connection hole 185a for disposing a fluid supply tube 184a guided to the portion 3d is disposed, and the first bending portion 3d is driven to bend in the connection hole 185a of the tube connection member 185. A fluid supply tube 184a is provided for each of them.
[0101]
Further, as shown in FIG. 5B, the second through holes 182a, 182b, and 183c formed in the second bending portion 3e and the third bending portion 3f that constitute the bending portion 3 are provided in the second bending portion 3e and the third bending portion 3f. A tube connecting member 186 having a connection hole 186a for arranging the fluid tube 184b led to the bending portion 3e and a guide hole 186b for arranging the fluid supply tube 184a reaching the first bending portion 3d is arranged. The fluid supply tubes 184b for driving the second bending portion 3e to be bent are disposed in the connection holes 186a of the tube connecting member 186, respectively, while the first bending portion 3d is driven to bend. A fluid supply tube 184a is inserted through the guide hole 186b and guided to the first curved portion 3d.
[0102]
As shown in FIGS. 32 (a) and 32 (b), the tube connecting members 185 and 186 are formed in the same shape as the through holes 182a, 182b and 183c, and the connection holes 185a and 186a are guided. It is composed of a solid lid portion side having a hole 186b and a thin and substantially tubular concave portion side.
[0103]
The fluid supply tubes 184a and 184b disposed in the connection holes 185a and 186a and the guide hole 186b are, for example, a seal member such as silicon so that water or air as a supply fluid does not leak from the gap between the holes. Is filled in the gap.
[0104]
Note that a connection member provided on the proximal side of the third bending portion 3f is inserted through a connection hole for connecting a fluid supply tube for the third bending portion and a tube 184a reaching the first bending portion 3d. A first guide hole and a second guide hole through which the tube 184b reaching the second bending portion 3e is inserted are formed. For this reason, the two fluid supply tubes 184a and 184b are inserted into the through holes 182a, 182b and 183c of the third bending portion 3f.
[0105]
Here, a method for suppressing the heat generation of the circuit device in the hard head portion will be described with reference to FIGS.
First, the circuit device cooling mechanism shown in FIG. 33 will be described. The substrate 13 is covered with a box 191 formed as shown in the figure, and a shield gas is jetted into the box 191 to suppress heat generation.
[0106]
The box 191 is provided with a gas supply hole 192 and a tube insertion hole 193, a tube for supplying a shield gas from the gas supply hole 192 to the inside of the repair manipulator 8 is attached, and the shield gas is inserted into the tube insertion hole 193. The tube 16 is attached. Therefore, the shield gas ejected from the tip of the shield gas tube 16 is filled in the box 191 and supplied to the repair manipulator 8.
[0107]
Thus, when the shielding gas is supplied during the welding operation, the shielding gas is filled in the box and the circuit of the substrate is cooled.
[0108]
Next, the circuit device cooling mechanism shown in FIG. 34 will be described. As shown in the figure, a cooling tube 195 for supplying a cooling fluid is provided on the substrate 13, and a cooling fluid is supplied from a cooling fluid source 196 provided on the hand side by a pump 197 to suppress heat generation.
[0109]
Thus, when the endoscope is used, the pump 197 is driven according to the use, and the cooling fluid is supplied to the liquid supply source 196 or the cooling tube 195 of the substrate 13 to prevent the temperature of the substrate 13 from rising.
35 and 36, a flow path 198 may be provided inside the substrate 13, and a shield gas supply tube 16 for supplying a shield gas may be connected thereto. This effectively cools the substrate when performing the welding operation. Reference numeral 199 denotes a connecting tube serving as a flow path for supplying the shield gas that has passed through the flow path 198 to the repair manipulator 8.
[0110]
Next, the circuit device cooling mechanism shown in FIG. 37 will be described. As shown in the figure, a fin structure 200 is provided on the outer peripheral portion of the rigid head portion 2 of the endoscope 1 to easily dissipate heat generated in the circuit device mounted in the rigid head portion.
[0111]
Another configuration of the endoscope will be described with reference to FIG.
An endoscope 201 shown in the figure is configured by a probe 206 as repair work means, and this probe 206 is configured to be detachable from the endoscope 201.
[0112]
That is, the endoscope 201 has an elongated insertion portion 202, and has a first bending portion 203a, a second bending portion 203b, and a third bending portion 203c as the bending portion 203 on the distal end side.
[0113]
The rigid head portion 204 provided at the tip of the first curved portion 203a includes an observation optical system 5, an irradiation optical system 6, a micro optical scanner (not shown) for measuring the size of the object, and a rigid head portion. A micro gyro (not shown) for detecting the posture of 204 and a treatment hole 205a from which the probe 206 protrudes are provided.
[0114]
In the endoscope 201, a tube 205 communicating with the treatment hole 205a is disposed up to the hand side. A plurality of curved portions 206a and 206b are provided at the distal end portion of the probe 206. Other configurations are the same as those of the above-described embodiment, and the same members are denoted by the same reference numerals and description thereof is omitted.
[0115]
As a result, the probe can be sent from the proximal side of the endoscope to the distal end side, and the probe can be protruded from the treatment hole on the distal end surface of the rigid head portion so that the repair work can be performed. Various operations can be performed by changing various probes without removing and inserting the mirror.
[0116]
[Appendix]
(1) In an endoscope having a flexible insertion portion provided with a rigid head portion provided on the distal end side and a bending portion provided continuously to the rigid head portion,
An endoscope provided with repair work means in the rigid head part, and provided with measurement means for measuring the size of the repair part and posture detection means for detecting the posture of the hard head part.
[0117]
(2) The endoscope according to appendix 1, wherein the repair work means includes a manipulator whose tip portion can be curved and welding means provided at the tip of the manipulator.
[0118]
(3) The endoscope according to appendix 2, wherein the welding means includes a welding part that generates heat, a filler material supply part that supplies a filler material, and a shield gas supply part that injects a shield gas to the repair part. .
[0119]
(4) The endoscope according to appendix 2, wherein the manipulator is operated by bending the shape memory alloy.
[0120]
(5) The endoscope according to appendix 3, wherein the welding means has a heat source as a laser beam.
[0121]
(6) The endoscope according to appendix 3, wherein the welding means is a gas combustion flame.
[0122]
(7) The endoscope according to appendix 3, wherein the welding means uses a heat source as an arc.
[0123]
(8) The endoscope according to appendix 3, wherein the welding means is spot welding using a heat source as Joule heat.
[0124]
(9) The endoscope according to appendix 3, wherein the welding means is electron beam welding using a heat source as an electron gun.
[0125]
(10) The endoscope according to appendix 1, wherein the repair work means is a grinding means provided at a tip of the manipulator.
[0126]
(11) The endoscope according to appendix 10, wherein the grinding means includes a grindstone and a driving means for rotating the grindstone.
[0127]
(12) The endoscope according to appendix 11, wherein the driving means for rotating the grindstone is a DC motor.
[0128]
(13) The endoscope according to appendix 11, wherein the driving means for rotating the grindstone includes a turbine having rotating blades and a fluid source supplied to the turbine.
[0129]
(14) The endoscope according to appendix 1, wherein the measuring unit includes a light emitting unit, a driving unit that scans the emitting unit in a wide range, and a measuring unit that measures the intensity of reflected light.
[0130]
(15) The endoscope according to appendix 1, wherein the posture detecting means for detecting the posture of the rigid head portion is a gyro for detecting an angular velocity.
[0131]
(16) The endoscope according to appendix 1, wherein the measurement unit, a drive control circuit for the posture detection unit, and a substrate are provided in the rigid head unit.
[0132]
(17) The endoscope according to appendix 1, wherein drive control circuits for the measurement unit and the posture detection unit are provided on one substrate.
[0133]
(18) The endoscope according to appendix 17 or appendix 18, wherein the substrate on which the drive control circuit for the measurement unit and the posture detection unit is provided is a silicon substrate.
[0134]
(19) Additional notes provided with a box that covers the substrate, the measurement means and the attitude detection means arranged on the substrate, and the respective drive control circuits, and a flow path through which a shield gas passes is provided inside the box. 3 or the endoscope according to appendix 17.
[0135]
(20) The endoscope according to appendix 17, wherein a flow path for passing a shielding gas is provided on the substrate or inside the substrate.
[0136]
(21) The endoscope according to appendix 17, wherein a cooling supply path for cooling the measurement unit, the posture detection unit, and their drive control circuit is provided on the substrate.
[0137]
(22) The endoscope according to appendix 1, wherein the repair work means, the measurement means, and the posture detection means are detachably attached to the rigid head portion.
[0138]
(23) The endoscope according to appendix 1, wherein the rigid head portion is provided with a fin structure.
[0139]
(24) The plurality of bending portions include a flexible tube, a shape memory member provided in the tube, a heating unit that heats the shape memory member, and a control device that controls the heating unit. The endoscope according to appendix 1, which is configured.
[0140]
(25) The bending portion includes a tube having a plurality of through holes in a longitudinal direction and a radial direction, fluid supply means for supplying fluid to the through holes, and fluid control means for controlling the fluid supply means. The endoscope according to appendix 1, which is configured.
[0141]
【The invention's effect】
As described above, according to the present invention, the hard head portion moves in the vertical direction or the horizontal direction with respect to the visual field direction of the observation means, such as when repairing the repair site in the observation target by the repair work means. The posture detection means can detect the movement and accurately perform the bending operation of the bending portion. In addition, the measurement efficiency can be improved because the center of the measurement range and the visual field direction of the observation means can be approximately matched. It has an effect.
[Brief description of the drawings]
FIG. 1 to FIG. 13 relate to an embodiment of the present invention, and FIG. 1 is an explanatory view showing a schematic configuration of an endoscope.
FIG. 2 is a diagram illustrating the configuration of a rigid head unit
FIG. 3 is a diagram showing a schematic configuration of a substrate.
FIG. 4 is an explanatory view showing a state in which a micro optical scanner and a micro gyro are arranged on a substrate.
FIG. 5 is a diagram illustrating the configuration of a micro optical scanner
FIG. 6 is a diagram illustrating the configuration of a repair manipulator
FIG. 7 is a diagram illustrating the configuration of a micro welding tool
FIG. 8 is an explanatory diagram showing a schematic configuration of a bending portion.
FIG. 9 is a diagram illustrating the configuration of a bending shape memory alloy
FIG. 10 is a cross-sectional view illustrating the configuration of each bending portion
FIG. 11 is an explanatory view showing a method of arranging the bending shape memory alloy on the bending portion.
FIG. 12 is a diagram showing an example of using an endoscope
FIG. 13 is an explanatory view showing an example of the action of a bending portion.
FIG. 14 is an explanatory diagram showing another configuration of the rigid head portion.
FIG. 15 is an explanatory view showing another configuration of the arrangement position of the micro optical scanner.
FIG. 16 is an explanatory view showing another configuration of the measuring means.
FIG. 17 is an explanatory diagram showing another configuration of the measuring means.
FIG. 18 is an explanatory view showing another configuration of the repair manipulator.
FIG. 19 is a diagram showing the relationship between a shape memory alloy plate and a thin film heater.
FIG. 20 is a view showing another configuration of the micro welding apparatus.
FIG. 21 is a diagram showing another configuration of the micro welding apparatus.
FIG. 22 is a diagram showing another configuration of the micro welding apparatus.
FIG. 23 is a view showing still another configuration of the micro welding apparatus.
FIG. 24 is a diagram showing the operation of the micro welding apparatus.
FIG. 25 is a view showing still another configuration of the micro welding apparatus.
FIG. 26 is an explanatory diagram showing a schematic configuration of an electron gun.
FIG. 27 shows an example of repair work means other than welding.
FIG. 28 is a diagram illustrating a drive unit and an air turbine that are driven to rotate.
FIG. 29 is an explanatory diagram showing another configuration of a drive unit that drives the grindstone to rotate.
FIG. 30 is an explanatory diagram showing another configuration of the bending portion.
FIG. 31 is an explanatory diagram specifically showing the configuration of a bending portion.
FIG. 32 is a diagram for explaining a schematic configuration of a tube connecting member.
FIG. 33 is an explanatory view showing an example of a circuit device cooling mechanism in the hard head portion.
FIG. 34 is an explanatory view showing another example of the circuit device cooling mechanism in the hard head portion.
FIG. 35 is an explanatory diagram showing an application example of the circuit device cooling mechanism in the hard head portion.
36 is a view showing a state in which the circuit device cooling mechanism of FIG. 35 is disposed in the hard head portion.
FIG. 37 is an explanatory view showing another example of the circuit device cooling mechanism in the hard head portion.
FIG. 38 is an explanatory diagram showing a configuration of an endoscope in which repair work means is detachable.
FIG. 39 is a diagram illustrating a schematic configuration of a bending portion of a conventional endoscope.
[Explanation of symbols]
1 ... Endoscope
2 ... Hard head
3. Curved part
7 ... Micro welding tool
8 ... Manipulator for repair
9 ... Micro optical scanner
10 ... Micro Gyro

Claims (4)

An endoscope comprising a rigid head portion provided on the distal end side of a flexible elongated insertion portion, observation means provided on the rigid head portion, and a curved portion connected to the rear side of the rigid head portion. In
In the hard head part,
Repair work means for repairing the repair site in the observation target;
Measuring the size of the repair site , measuring means that the center of the measurement range substantially coincides with the center of the visual field direction of the observation means ,
Posture detecting means for detecting that the rigid head portion provided with the repair work means and the measuring means moves in the vertical direction or the horizontal direction with respect to the visual field direction of the observation means;
With
An endoscope, wherein the detected value detected by the posture detecting means is fed back to the bending operation of the bending portion to hold the posture of the rigid head portion.   The posture control means detects the movement of the rigid head part in the vertical direction with respect to the visual field direction of the observation means, and detects the movement of the rigid head part in the horizontal direction with respect to the visual field direction of the observation means. The endoscope according to claim 1, further comprising a micro gyro.   The measurement means and the posture detection means are provided on one substrate, and the micro that detects the vertical direction so that it can detect that the rigid head portion has moved in the vertical direction or the horizontal direction with respect to the visual field direction of the observation means. The endoscope according to claim 1, wherein the substrate provided with a gyro and a micro gyro for detecting a left-right direction is arranged in the rigid head portion.   The endoscope according to claim 3, wherein a gyro electrode and a gyro drive circuit connected to the micro gyro are provided on the substrate.

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