JP3857848B2 - Position adjustment mechanism of solid-state image sensor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to position adjustment of a solid-state image sensor in a camera.
[0002]
[Prior art]
Conventionally, a CCD (Charge Coupled Device) image sensor is used as a solid-state imaging device in a digital camera. A CCD image sensor packaged in an LCC (Leadless Chip Carrier) is used in order to realize a high mounting density in a printed wiring board to be mounted. In general, there is a mismatch between the thermal expansion coefficient of the LCC package and the thermal expansion coefficient of a resin such as epoxy or polyimide used for the substrate of the printed wiring board. Therefore, when mounting an LCC package, a flexible printed wiring board having flexibility is used.
[0003]
On the other hand, in the manufacturing process of the digital camera, the position of the CCD image sensor is adjusted so that the imaging area of the CCD image sensor coincides with the focal plane of the photographing optical system. That is, the imaging area of the CCD image sensor is orthogonal to the optical axis of the photographic optical system, and its center is made coincident with the focal point of the photographic optical system.
[0004]
As described above, the flexible printed wiring board on which the LCC package is mounted has flexibility. Therefore, in order to reliably adjust the position of the CCD image sensor, the LCC package is electrically connected to the flexible printed wiring board by soldering, and then fixed to a plate-like member having a predetermined hardness. The position of the plate member must be adjusted so that the imaging area of the CCD image sensor fixed to the member matches the focal plane of the photographing optical system. That is, in order to make the imaging area of the CCD image sensor of the LCC package mounted on the flexible printed wiring board coincide with the focal plane of the photographing optical system, a member for fixing the LCC package to the plate member and the position of the plate member A member for adjusting is necessary.
[0005]
[Problems to be solved by the invention]
For example, it is known that a coil spring is used as a member for adjusting the position of the plate member, and the relative position of the plate member with respect to the camera body is adjusted by the biasing force. However, a coil spring must be provided for each part for attaching the plate-like member to the camera body. Therefore, there is a problem that the position adjustment mechanism of the CCD image sensor is complicated.
[0006]
The present invention solves the above-described problems, and an object thereof is to provide a position adjusting mechanism for a solid-state imaging device having a simple configuration.
[0007]
[Means for Solving the Problems]
The position adjustment mechanism of the solid-state imaging device according to the present invention includes an adjustment plate that holds the package and a mounting member that attaches the adjustment plate to the main body of the camera in a camera having a photographing optical system and a solid-state imaging device mounted on the package. Package fixing means for fixing the package to the adjustment plate, and adjustment means for adjusting the relative positional relationship between the main body of the camera and the adjustment plate so that the imaging area of the solid-state imaging device coincides with the focal plane of the photographing optical system. The package fixing means and the adjusting means are integrally formed.
[0008]
Preferably, the package fixing means includes a fixing portion fixed to the adjustment plate, and a pressing portion that is formed continuously with the fixing portion and presses the package toward the adjustment plate. The adjustment means is fixed to the fixing portion. And an urging portion that abuts the main body of the camera and urges the adjustment plate in a direction away from the main body of the camera. The pressing portion and the urging portion are, for example, metal plate springs.
[0009]
Preferably, the fixing portion is a thin plate-like member, and the pressing portion and the urging portion are each a thin plate-like shape formed to extend to the same plane side of the fixing portion at a predetermined angle with respect to the fixing portion. It is a member.
[0010]
Preferably, the fixing portion is formed in a rectangular shape, the pressing portion is formed to be continuous with the first end portion of the fixing portion, and the urging portion has a second end portion and a first end portion orthogonal to the first end portion. It consists of a pair of urging | biasing pieces formed so that it might each follow in the 3rd edge part orthogonal to an edge part.
[0011]
Preferably, the pressing portion includes a contact piece that contacts the package, and a connection piece that connects the fixed portion and the contact piece, and the contact piece has a predetermined angle with respect to the connection piece so as to be parallel to the fixed portion. It is bent at.
[0012]
Preferably, the pair of biasing pieces are bent at a predetermined angle, and the package fixing means and the adjusting means are arranged so that the mountain side of each bent portion of the pair of biasing pieces comes into contact with the main body of the camera. The
[0013]
The package fixing means and the adjusting means are provided, for example, at the left and right peripheral edge portions of the package in the normal posture of the camera.
[0014]
The attachment member is, for example, an adjustment screw, and the relative positions of the main body and the adjustment plate are adjusted by the biasing portion of the adjustment means and the tightening degree of the adjustment screw.
[0015]
According to the present invention, since the package fixing means and the adjusting means are integrally formed, the number of parts is reduced, so that the cost can be reduced and the mounting of the package on which the solid-state imaging device is mounted is facilitated. Become.
[0016]
The integrated package fixing means and adjusting means are disposed, for example, at the upper and lower peripheral edges of the package on which the solid-state imaging device is mounted, depending on the arrangement relationship between the flexible printed wiring board and other members inside the camera. May be.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is an exploded perspective view showing a digital camera to which an embodiment according to the present invention is applied from the back cover side. In this specification, “left” and “right” refer to the left-right direction when viewed from the back cover side in a normal camera posture.
In the camera body 10 of the digital camera 1, a rectangular position adjustment plate 30 is disposed on the back cover 20 side. The position adjustment plate 30 is attached to the camera body 10 by three adjustment screws 31, 32, 33. The adjusting screws 31 and 32 are inserted through holes 30A and 30B drilled in the vicinity of the upper and lower ends of the right end of the position adjusting plate 30, and are provided at positions corresponding to the holes 30A and 30B in the camera body 10. The receiving parts 11 and 12 are screwed. The adjustment screw 33 is inserted through a hole 30C formed in the left end portion of the position adjusting plate 30 slightly from the center in the vertical direction, and is provided in a position corresponding to the hole 30C in the camera body 10. 13 is screwed.
[0018]
An LCC package 41 on which a CCD image sensor 40 is mounted and a flexible printed wiring board 42 are disposed on the surface of the position adjustment plate 30 on the camera body 10 side. The LCC package 41 is soldered and electrically connected to the flexible printed wiring board 42. The LCC package 41 is fixed to the position adjustment plate 30 by the metal leaf spring 43 and the fixing screws 51 and 52 at the right peripheral edge so that the flexible printed wiring board 42 contacts the position adjustment board 30. It is fixed to the position adjusting plate 30 by a leaf spring 44 and fixing screws 53 and 54.
[0019]
FIG. 2 is a perspective view of the metal leaf spring 43. The fixing piece 60 of the metal leaf spring 43 is a thin plate-like member, and holes 60A and 60B are formed in the vicinity of the upper end portion and the lower end portion, respectively. The fixing screws 51 and 52 described above are inserted into the holes 60A and 60B, respectively. In FIG. 2, a pressing portion 61 is integrally formed on the left end portion (first end portion) of the fixed piece 60, that is, the side end portion on the LCC package 41 (see FIG. 1) side. The pressing portion 61 is a thin plate-like member similar to the fixed piece 60, and has a connecting piece 61 </ b> A extending at a predetermined angle with respect to the fixed piece 60 and a predetermined piece with respect to the connecting piece 61 </ b> A so as to be parallel to the fixed piece 60. The contact piece 61B is bent at an angle.
[0020]
Further, an urging piece 62 is integrally formed at an upper end portion (second end portion) orthogonal to the left end portion of the fixed piece 60. The urging piece 62 is a thin plate-like member similar to the fixed piece 60. The urging piece 62 extends upward at a predetermined angle with respect to the fixed piece 60 and is bent at a predetermined angle at a substantially central portion. Similarly, a biasing piece 63 is integrally formed at a lower end (third end) orthogonal to the left end of the fixed piece 60. The urging piece 63 is a thin plate-like member similar to the fixed piece 60, extends downward at a predetermined angle with respect to the fixed piece 60, and is bent at a predetermined angle at a substantially central portion.
[0021]
As is clear from FIG. 2, the pressing portion 61 and the urging pieces 62 and 63 extend to the same plane side in the fixed piece 60. Further, as shown in FIG. 1, the side where the pressing portion 61 and the urging pieces 62 and 63 extend is arranged so as to face the main body 10 side of the digital camera 1.
[0022]
The metal leaf spring 44 disposed on the left peripheral edge side of the LCC package 41 has the same configuration as the metal leaf spring 43. That is, a thin plate-shaped fixing portion, a pressing portion formed continuously with the fixing portion, and a pair of urging portions are provided. As shown in FIG. 1, the metal leaf spring 44 is disposed on the left side of the LCC package 41 so that the pressing portion is positioned on the LCC package 41 side, and the urging portions provided at the upper and lower ends of the fixed portion and The side where the pressing part extends is arranged so as to face the main body 10 side of the digital camera 1.
[0023]
FIG. 3 shows a state in which the position adjustment plate 30 to which the LCC package 41 and the flexible printed wiring board 42 are fixed is attached to the camera body 10, cut in the left-right direction at the approximate center of the CCD image sensor 40 from the upper end side. FIG. The CCD image sensor 40, the LCC package 41, and the flexible printed wiring board 42 are simplified in order to clearly show the configuration in the vicinity of the position adjustment plate 30. In FIG. 3, an alternate long and short dash line indicates an optical axis OP of a photographing optical system (not shown) provided in the main body 10.
[0024]
As described above, the fixing portion 60 of the metal leaf spring 43 is fixed to the position adjusting plate 30 by the fixing screws 51 (see FIG. 1) and 52, and the fixing portion 70 of the metal leaf spring 44 is fixed to the fixing screw 53 (see FIG. 1). , 54 are fixed to the position adjusting plate 30. The contact piece 61B of the pressing portion 61 of the metal leaf spring 43 contacts the right peripheral portion of the LCC package 41, and the contact piece 71B of the pressing portion 71 of the pressing portion 71 of the plate spring 44 contacts the left peripheral portion. ing.
[0025]
The thickness in the direction along the optical axis OP of the gap formed between the contact piece 61B and the contact piece 71B and the position adjusting plate 30 is the same as that of the LCC package 41 and the flexible printed wiring board 42 bonded together by soldering. The length of the connecting piece 61A of the pressing portion 61 and the angle with respect to the fixed piece 60, and the length of the connecting piece 71A of the pressing portion 71 and the angle with respect to the fixed piece 70 are slightly smaller than the thickness in the direction along the optical axis OP. It has been established. Therefore, the LCC package 41 is always urged toward the position adjustment plate 30 by the pressing portion 61 of the metal plate spring 43 and the pressing portion 71 of the metal plate spring 44 at the left and right peripheral edges, and is fixed to the position adjustment plate 30. Yes.
[0026]
FIG. 4 is a side view showing a state in which the position adjustment plate 30 to which the LCC package 41 and the flexible printed wiring board 42 are fixed is attached to the camera body 10 from the left end portion side of the LCC package 41. In addition, in order to clarify the structure near the metal leaf spring 44, some members are omitted in FIG.
[0027]
The ridges 72A and 73A of the bent portions of the urging portions 72 and 73 of the metal leaf spring 44 abut against the wall surface of the main body 10 of the digital camera 1, and the urging pieces 62 and 63 of the metal leaf spring 43 (see FIG. 2). The position adjusting plate 30 is attached to the main body 10 by adjusting screws 31, 32, 33 (see FIG. 1) so that the ridge sides 62A, 63A of the bent portions abut against the wall surface of the main body 10 of the digital camera 1. That is, the position adjusting plate 30 is always urged away from the main body 10 by the urging pieces 62, 63, 72, 73 of the metal plate springs 43 and 44.
[0028]
Therefore, if the tightening of the adjusting screws 31 to 33 is increased to the same extent, the position adjusting plate 30 is brought closer to the main body 10 against the biasing force of the biasing pieces 62, 63, 72 and 73, and the tightening of the adjusting screws 31 to 33 is performed. Is loosened to the same extent, the position adjusting plate 30 is separated from the main body 10 by the urging force of the urging pieces 62, 63, 72, 73. Furthermore, the inclination of the position adjustment plate 30 with respect to the optical axis OP can be adjusted by changing the degree of tightening of each adjustment screw.
[0029]
As described above, the relative position of the position adjusting plate 30 with respect to the main body 10 is adjusted by appropriately adjusting the tightening degree of the adjusting screws 31 to 33. In accordance with the position adjustment of the position adjustment plate 30, the relative position of the imaging region of the CCD image sensor 40 of the LCC package 41 fixed to the position adjustment plate 30 with respect to the photographing optical system is adjusted. That is, in order to adjust the imaging optical system so that the focal point of the imaging optical system is positioned on the imaging area of the CCD image sensor 40 and the imaging area is perpendicular to the optical axis OP, the tightening degree of the adjusting screws 31 to 33 is adjusted. do it.
[0030]
When the imaging area of the CCD image sensor 40 coincides with the focal plane of the photographing optical system, the adjusting screws 31 to 33 are fixed to the main body 10 with a screw lock agent (adhesive) or the like. Accordingly, it is possible to prevent the imaging area of the CCD image sensor 40 from being deviated from the focal plane of the photographing optical system due to external impact or long-term use.
[0031]
【The invention's effect】
As described above, according to the present invention, a position adjustment mechanism for a solid-state imaging device with a simple configuration can be obtained.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view of a position adjustment mechanism of a CCD image sensor to which an embodiment according to the present invention is applied.
FIG. 2 is a perspective view of a leaf spring of a position adjustment mechanism of a CCD image sensor.
FIG. 3 is a cross-sectional view of a position adjustment mechanism of a CCD image sensor.
FIG. 4 is a side view of a position adjustment mechanism of a CCD image sensor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Digital camera 10 Camera body 20 Back cover 30 Position adjustment board 31,32,33 Adjustment screw 40 CCD image sensor 41 LCC package 42 Flexible printed wiring board 43,44 Metal plate spring 60,70 Fixing piece 61,71 Pressing part 62, 63, 72, 73 Biasing piece

Claims (10)

In a camera equipped with a solid-state image sensor mounted on a package,
An adjustment plate for holding the package;
An attachment member for attaching the adjustment plate to the body of the camera;
Package fixing means for fixing the package to the adjustment plate ;
The package fixing means connects the fixing portion fixed to the adjustment plate, the contact piece that contacts the package and presses the package toward the adjustment plate, and the fixing portion and the contact piece. A position adjusting mechanism for a solid-state imaging device , comprising: a connecting piece, wherein the contact piece is bent with respect to the connecting piece so as to be parallel to the fixed portion . The adjusting unit further includes an adjusting unit for adjusting a relative positional relationship between the main body and the adjusting plate so that an imaging region of the solid-state imaging element coincides with a focal plane of a photographing optical system provided in the main body. 2. The apparatus according to claim 1, comprising: the fixing portion; and an urging portion that is formed continuously with the fixing portion and urges the adjustment plate in a direction away from the main body. The position adjustment mechanism of the solid-state image sensor as described.   The fixing portion is a thin plate-like member, and the pressing portion and the urging portion are thin plates formed to extend to the same plane side of the fixing portion at a predetermined angle with respect to the fixing portion, respectively. The position adjusting mechanism of the solid-state imaging device according to claim 2, wherein the position adjusting mechanism is a solid member.   The fixing portion is molded into a rectangle, the pressing portion is formed to be continuous with the first end portion of the fixing portion, and the biasing portion is a second end portion orthogonal to the first end portion and the 4. The position adjusting mechanism for a solid-state imaging device according to claim 3, comprising a pair of urging pieces formed so as to be continuous with a third end portion orthogonal to the first end portion. 3. The position adjusting mechanism for a solid-state imaging device according to claim 2, wherein the package fixing means and the adjusting means are integrally formed.   The pair of urging pieces are bent at a predetermined angle, and the package fixing means and the adjusting means are arranged so that the mountain side of each bent portion of the pair of urging pieces comes into contact with the main body. The position adjusting mechanism of the solid-state imaging device according to claim 4.   The solid-state image sensor position adjusting mechanism according to claim 2, wherein the package fixing unit and the adjusting unit are provided at left and right peripheral edges of the package in a normal posture of the camera.   The position adjusting mechanism for a solid-state imaging device according to claim 2, wherein the pressing portion and the urging portion are metal plate springs.   3. The solid-state imaging device according to claim 2, wherein the attachment member is an adjustment screw, and a relative position between the main body and the adjustment plate is adjusted by the biasing portion and a tightening degree of the adjustment screw. Position adjustment mechanism. The connecting piece is in contact with the fixed portion so that the gap between the contact piece and the adjustment plate is slightly smaller than the thickness of the pressed member including the package pressed by the contact piece. The position adjusting mechanism of the solid-state imaging device according to claim 1, wherein the pieces are connected to each other.

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