JP3752007B2 - Manufacturing method of wiring pattern layer - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring pattern layer and a manufacturing method thereof, and more particularly to a wiring pattern layer used for a multilayer printed wiring board, an electrostatic actuator, a coil housed in a non-contact IC card, and the manufacturing method thereof.
[0002]
[Prior art]
Due to the dramatic development of semiconductor technology, semiconductor packages have rapidly become smaller, more pins, fine pitch, and miniaturized electronic components, and entered the era of so-called high-density packaging. Accompanying this, for example, printed wiring boards are being made more multilayered and thinner from single-sided wiring to double-sided wiring.
[0003]
Currently, a subtractive method and an additive method are mainly used for forming a copper pattern on a printed wiring board.
[0004]
The subtractive method is a method in which a hole is formed in a copper-clad laminate, copper is plated on the inside and the surface of the hole, and a pattern is formed by photoetching. This subtractive method is technically highly complete and low in cost, but it is difficult to form a fine pattern due to restrictions such as the thickness of the copper foil.
[0005]
On the other hand, in the additive method, a resist is formed on a part other than the circuit pattern forming part on the laminated board containing the electroless plating catalyst, and a circuit pattern is formed on the exposed part of the laminated board by electroless copper plating or the like. It is a method to do. Although this additive method can form a fine pattern, it is difficult in terms of cost and reliability.
[0006]
In the case of a multilayer substrate, a method of laminating a single-sided or double-sided printed wiring board produced by the above method together with a semi-cured prepreg in which a glass cloth is impregnated with an epoxy resin or the like is used. Yes. In this case, the prepreg functions as an adhesive for each layer, and the connection between the layers is performed by creating a through hole and applying electroless plating or the like to the inside.
[0007]
In addition, with the progress of high-density packaging, multilayer boards are required to be thinner and lighter, while high wiring capacity per unit area is required, board thickness per layer, interlayer connection and component mounting methods, etc. Has been devised.
[0008]
However, the production of multi-layer boards using double-sided printed wiring boards produced by the subtractive method described above will increase the density due to the precision of drilling for hole formation in double-sided printed wiring boards and the limit of miniaturization. There was a limit and it was difficult to reduce the manufacturing cost.
[0009]
On the other hand, in recent years, a multilayer wiring board produced by sequentially laminating a conductor pattern layer and an insulating layer on a substrate has been developed to satisfy the above requirements. Since this multilayer wiring board is produced by alternately performing photo-etching of the copper plating layer and patterning of the photosensitive resin, high-definition wiring and interlayer connection at an arbitrary position are possible.
[0010]
However, in this method, copper plating and photoetching are alternately performed a plurality of times, which makes the process complicated. In addition, because of the serial process of stacking one layer on the substrate, it is difficult to regenerate the product if trouble occurs in the intermediate process. This has hindered the reduction of manufacturing costs.
[0011]
In order to cope with such problems, a transfer plate for forming a conductive layer and an insulating layer is individually prepared, and a wiring pattern layer is formed by sequentially laminating a conductive layer and an insulating layer by a method according to a printing method. A method of forming has been proposed.
[0012]
[Problems to be solved by the invention]
However, in the method using the individual transfer plates described above, it is essential to use a so-called plate, and in order to guarantee the quality of the wiring pattern layer, it is necessary to always inspect the deterioration of the plate. Also, with this method, it is normal for the pattern abnormality to be found only by looking at the wiring pattern layer after transfer. In this case as well, if trouble occurs in the intermediate process, it becomes difficult to regenerate the product and reduce manufacturing costs. I can't plan. In addition, since the individual layers are sequentially laminated, there is a disadvantage that the process becomes complicated.
[0013]
The present invention has been devised under such circumstances, and its purpose is to eliminate the need for a special plate for forming the wiring pattern layer, so that the wiring pattern layer can be inspected before transfer, and the product process is improved. An object of the present invention is to provide a wiring pattern layer and a method for manufacturing the same that can improve the yield. It is another object of the present invention to provide a wiring pattern layer and a method for manufacturing the wiring pattern layer that can integrally transfer an adhesive layer, an insulating layer, and a conductive layer and can simplify the process.
[0014]
[Means for Solving the Problems]
  In order to achieve such an object, the wiring pattern layer manufacturing method of the present invention includes a step of forming a conductive layer on a conductive substrate, a step of patterning an insulating layer on the conductive layer, A step of etching the conductive layer along the pattern of the insulating layer, a step of forming an adhesive layer on at least the surface of the insulating layer, and a conductive layer and an insulating layer patterned on the conductive substrate by these steps And a step of transferring the adhesive layer onto the substrate to be integrally wired, and the step of forming the conductive layer on the conductive substrate includes the first and second different in at least two kinds of compositions This includes a stacking operation of sequentially stacking conductive layers, and the second conductive layer located on the insulating layer side is configured to be a Ni layer or a Cr layer.
[0015]
  Moreover, as a preferable aspect of the present invention, the first conductive layer is configured to be a Cu layer.
[0016]
As a more preferred embodiment of the present invention, the step of forming the conductive layer is configured to be performed by electrolytic plating.
[0017]
Further, as a more preferable aspect of the present invention, the step of patterning the insulating layer is performed by applying a photosensitive resin composition, exposing through a mask having a predetermined pattern, and developing. The
[0018]
As a more preferred aspect of the present invention, the step of patterning the insulating layer is performed by applying a photosensitive resin composition, exposing and developing through a mask having a predetermined pattern, and further thermosetting. Configured as follows.
[0019]
Further, as a more preferable aspect of the present invention, the step of patterning the insulating layer includes applying and drying an insulating resin, applying a photosensitive resin composition thereon, and applying the photosensitive resin composition to a predetermined pattern. After the exposure / development through the mask, the insulating resin is etched using the developed photosensitive resin composition as a mask.
[0020]
Further, as a more preferable aspect of the present invention, the step of patterning the insulating layer includes applying and drying an insulating resin, applying a photosensitive resin composition thereon, and applying the photosensitive resin composition to a predetermined pattern. After the exposure / development through the mask, the insulating resin is etched using the developed photosensitive resin composition as a mask, and then thermally cured.
[0021]
In particular, the wiring pattern layer of the present invention can be produced without making a special plate for forming the wiring pattern layer. In addition, the wiring pattern layer can be inspected before transfer, and the product yield can be improved. In addition, the adhesive layer, the insulating layer, and the conductive layer can be integrally transferred, and the process can be simplified.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0023]
FIG. 1 is a schematic cross-sectional view showing a state in which a wiring pattern layer 4 of the present invention is formed on a substrate 2. In FIG. 1, the wiring pattern layer 4 is formed by sequentially including an adhesive layer 10, an insulating layer 20, and conductive layers 31 and 33. The wiring pattern layer 4 made of these laminates is formed by being integrally transferred as will be described later. Of the conductive layers 31 and 33, the main conductive layer for wiring is the uppermost conductive layer 31, and of course, only one conductive layer may be provided.
[0024]
The substrate 2 itself on which the wiring pattern layer 4 of the present invention is formed is not particularly limited. For example, when the substrate 2 is a substrate constituting a multilayer printed wiring board, a glass epoxy substrate, polyimide substrate, alumina A substrate such as a ceramic substrate or a composite substrate of glass epoxy and polyimide can be used. The thickness of the substrate 2 is usually in the range of about 5 to 1000 μm.
[0025]
The thickness of the wiring pattern layer 4 is set to 1000 μm or less, preferably in the range of 5 to 100 μm, so that the wiring pattern layers 4 can be stacked and climbed over without defects.
[0026]
The conductive layer 31 is usually used as a wiring layer and is made of any conductive material such as copper (Cu), silver (Ag), gold (Au), nickel (Ni), chromium (Cr), Zinc (Zn), tin (Sn), platinum (Pt), etc. can be used, but Cu is particularly preferably used. When Cu is used for wiring, the film thickness must be 1 to 20 μm, preferably 3 to 10 μm. In some cases, the entire wiring pattern layer 4 is simply used as an insulating layer. In this case, since the conductive layer 31 only needs a function as a peeling layer, the film thickness is not so much. About enough.
[0027]
The other conductive layer 33 located below the conductive layer 31 is formed mainly to facilitate pattern development of the insulating layer 20 in a manufacturing process as will be described later. The film thickness of the conductive layer 33 is usually about 0.01 to 1 μm. Examples of the material of the conductive layer 33 to be used include all metals that can be electroplated as described above, but Ni, Cr, or the like is preferably used. Moreover, these laminated bodies may be sufficient. Therefore, the conductive layer is not limited to a two-layered laminate of Cu / Ni and Cu / Cr, and may be a laminate of three or more layers such as Cu / Ni / Cr.
[0028]
Examples of the material used for the insulating layer 20 include polyimide, epoxy resin, butadiene resin, phenol resin, and polyolefin. Among these, in particular, when high voltage resistance is required (for example, when the wiring pattern layer 4 is applied to a strip electrode of an electrostatic actuator), it is preferable to use polyimide. Moreover, if productivity is considered, what has photosensitivity is good. Further, the insulating layer 20 may include a layer made of a non-photosensitive insulating resin and a layer made of a photosensitive resin composition (two-layer configuration). In the case of this two-layer structure, the layer made of non-photosensitive insulating resin may be the above polyimide, epoxy resin, butadiene resin, phenol resin, polyolefin, or the like. In the case of this two-layer configuration, the layer made of the photosensitive resin composition may be removed as necessary after film formation.
[0029]
The thickness of the insulating layer 20 is 1 to 100 μm, preferably about 5 to 20 μm.
[0030]
The adhesive layer 10 is not particularly limited as long as it has adhesiveness and has an adhesive force that can be transferred. Specific examples of the material include an epoxy resin, an acrylic resin, and a urethane resin. The film thickness is not particularly limited as long as the film can exhibit an adhesive force that can be transferred.
[0031]
Next, a method for manufacturing the wiring pattern layer will be described with reference to FIG.
[0032]
First, a conductive substrate 3 is prepared, and a conductive layer 31 made of Cu, for example, and a conductive layer 33 made of Ni, for example, are formed on the substrate 3 (FIG. 2A). The conductive layers 31 and 33 are formed by electrolytic plating, vapor deposition, sputtering, or the like. In this embodiment, the conductive layer is exemplified as a two-layered laminate, but the number of laminated layers is not particularly limited, and can be one layer or three or more.
[0033]
Next, the insulating layer 20 is patterned on the conductive layer 33. That is, for example, photosensitive polyimide 20 ′ is applied on the conductive layer 33, and then pattern exposure is performed using a pattern forming mask 25 and an ultraviolet irradiation device (FIG. 2B). The unexposed portion is removed and developed to pattern the insulating layer 20 (FIG. 2C). At this time, by providing the conductive layer 33 made of, for example, Ni as described above, sufficient development is possible and sufficient resolution is obtained.
[0034]
Furthermore, it is preferable that the photosensitive polyimide as the insulating layer 20 is heat-cured (post-baked) at a processing temperature of about 200 to 350 ° C. (processing time of about 30 minutes to 1 hour) at the time of pattern formation. By doing so, the curing of the polyimide is further accelerated and the voltage resistance is remarkably improved. Therefore, when an insulating layer having high withstand voltage is required, it is one of suitable choices to perform a thermosetting (post-bake) treatment using polyimide as an insulating material. Moreover, even if such high-temperature heat treatment is performed, thermal oxidation of the conductive layer 31 for wiring made of Cu can be prevented, and increase in conductive resistance can be prevented. This is because the surface of the conductive layer 31 is not exposed. In this respect as well, a significant feature of the present invention that cannot be obtained by the prior art is seen. Incidentally, in the conventional technique, the insulating layer (polyimide) must be thermally cured after the pattern wiring, which causes a disadvantage that the Cu for wiring is oxidized to increase the conductive resistance.
[0035]
The insulating layer 20 is not necessarily required to have photosensitivity. In other words, although the manufacturing process may take extra, there is a technique in which a photosensitive resist layer is further placed on the applied insulating layer 20, and after the resist is patterned, the insulating layer 20 is similarly patterned by etching. It should be used. That is, an insulating resin such as polyimide, epoxy resin, butadiene resin, phenol resin, or polyolefin as described above is applied and dried, a photosensitive resin composition is applied thereon, and the photosensitive resin composition is applied in a predetermined pattern. After the exposure / development through the mask, the insulating layer 20 may be formed by etching the insulating resin using the developed photosensitive resin composition as a mask. In addition, you may remove the photosensitive resin composition used as a mask finally as needed. Thereafter, or after pattern formation of insulating layers 31 and 33 described later, the above-described thermosetting treatment (post-bake) is performed as a preferred mode.
[0036]
After the pattern formation of the insulating layer 20, the insulating layer 20 is used as a mask pattern, and the conductive layers 31 and 33 are etched with an etching solution to form a wiring pattern layer having a predetermined pattern (FIG. 2D). ). As an etching solution, for example, when Cu / Ni is an etching target, a ferric chloride solution, 5HNO is used._Three ・ 5CH_Three COOH 2H₂ SO_Four The one diluted with water is used. In the present invention, there is an excellent effect that the wiring pattern layer can be checked at this point. In other words, since the wiring pattern layer can be checked before the wiring pattern layer is transferred, the probability that the pattern formed after the transfer will be defective is extremely low, and the product yield is greatly improved. . By the way, with the conventionally proposed technology, the wiring can be checked only after the wiring pattern layer is transferred to the substrate to be transferred, so that the entire substrate is defective due to one wiring defect.
[0037]
After such an etching process, the adhesive layer 10 is formed on the surface of the insulating layer 20 by means such as coating, and the wiring pattern layer 4 is completed (FIG. 2E). It is sufficient if the adhesive layer 10 is formed on the surface of the insulating layer 20, but considering the simplicity of the adhesive application process, one side of the substrate shown in FIG. It may be applied over the entire surface.
[0038]
The wiring pattern layer 4 thus formed is pressure-bonded onto the substrate 2 together with the conductive substrate 3, and then the wiring pattern layer 4 is transferred onto the substrate 2 by removing only the conductive substrate 3. (FIG. 1). For the pressure bonding, any means such as roller pressure bonding, plate pressure bonding, and vacuum pressure bonding may be used. Further, when the adhesive layer 10 exhibits tackiness or adhesiveness by heating, thermocompression bonding can also be performed.
[0039]
Note that the conductive substrate 3 removed last can be washed and used again.
[0040]
Next, further specific application examples of the wiring pattern layer 4 of the present invention as described above will be described. However, the use of the wiring pattern layer 4 of the present invention is not limited to these specific applications.
[0041]
First, an example in which the wiring pattern layer 4 of the present invention is first applied to the formation of a multilayer printed wiring board is shown in FIG.
[0042]
The multilayer printed wiring board 9 shown in FIG. 3 prepares, for example, three types of conductive substrates 3 having wiring pattern layers 4 as shown in FIG. 3 is transferred onto the substrate 2 of FIG. 3 (FIG. 3). That is, first, the wiring pattern layer 4 as shown in FIG. 2 (e) is transferred onto the substrate 2, and then the wiring pattern layer 5 arranged in a direction orthogonal to this is formed by transfer. The wiring pattern layer 6 arranged in the orthogonal direction is formed on the wiring pattern layer 5 by transfer. Since these wiring pattern layers 4, 5, and 6 are each provided with the insulating layer 20, the mutual insulation is ensured. Moreover, since these wiring pattern layers 4, 5, and 6 are each provided with the conductive layer 30 (31, 33), the conductive layers can be connected to each other at an intersection or proximity of each pattern layer.
[0043]
Next, an example in which the wiring pattern layer 4 of the present invention is applied to an electrode portion formed on a so-called electrostatic actuator stator (may be a moving element) will be described with reference to FIG. FIG. 4 is a perspective view in which three electrode portions 45, 46 and 47 are formed on the insulating substrate 41. The first electrode portion 45 includes an extraction electrode portion 45a and a strip electrode portion 45b, the second electrode portion 46 includes an extraction electrode portion 46a and a strip electrode portion 46b, and the third electrode portion 47 includes: A take-out electrode portion 47a and a strip-like electrode portion 47b are provided, and these have a comb shape as can be seen from the drawings. The positional relationship between the first electrode portion 45 and the second electrode portion 46 is arranged on the insulating substrate 41 without intersecting each other (can be easily understood by looking at FIG. 5). There is no problem with the insulation. However, since the third electrode portion 47 partially overlaps the second electrode portion 46 as shown in FIG. 4, extremely high insulation (voltage resistance) is required between them. It becomes. This is because a high voltage of about 1 kV is applied to each electrode. Therefore, if the third electrode portion 47 is formed using the wiring pattern layer of the present invention, it is not necessary to provide an insulator between the second and third electrode portions in a new process, and extremely It is possible to easily form an electrode portion with guaranteed insulation (voltage resistance). In this case, polyimide (particularly heat-cured) is optimal as the material of the insulating layer 20 of the wiring pattern layer of the present invention. In this application example, the case where an overlapping portion is generated between two patterns has been illustrated. However, it is needless to say that the present invention is not limited to this and can be appropriately applied to a case where an overlapping portion is generated between three or more patterns.
[0044]
Next, an example in which the wiring pattern layer 4 of the present invention is applied to a multilayer coil housed in a so-called non-contact IC card will be described with reference to FIGS.
[0045]
FIG. 6 shows a non-contact IC card to which the wiring pattern layer of the present invention is applied, in particular, a coil portion 8 including coil-shaped wiring pattern layers 4a, 4b, 4c and 4d laminated on the substrate 2 in four layers. It is the figure which showed the cross section typically. FIG. 7 is a plan view of FIG. The coil portion 8 further includes a connection wiring pattern portion (not shown) in addition to the coil-shaped wiring pattern layers 4a, 4b, 4c, and 4d. The connecting wiring pattern portion is formed on the substrate 2 and below the coiled wiring pattern layer 4a. The connecting wiring pattern portion has at least terminals for wiring and / or connecting lines for wiring as will be described in detail later, and each of the coiled wiring pattern layers 4a, 4b, 4c, 4d. It plays the role of connecting continuously in the same winding direction. A specific method for continuously connecting in the same winding direction will be described later. Such a coil portion 8 normally functions by being electromagnetically coupled to an external terminal.
[0046]
Each of the coil-shaped wiring pattern layers 4a, 4b, 4c, and 4d in FIGS. 6 and 7 is simply drawn in a ring shape in order to facilitate understanding of the present invention and avoid the complexity of the line portions in the drawings. However, in practice, it has a coiled form (spiral shape) in which one end is located outside the coil and the other end is located inside the coil.
[0047]
The four coil-shaped wiring pattern layers 4a, 4b, 4c, and 4d are respectively a combination of an adhesive layer 10, an insulating layer 20, and a conductive layer 30 (31, 33) as shown in FIG. It is made up of. The coil-shaped wiring pattern layers 4a, 4b, 4c, and 4d are laminated by the adhesiveness or adhesiveness of each adhesive layer 10. Lamination is performed by an overprinting method in which sequential transfer lamination is performed as described later. Further, the insulation at the overlapping portion of the two or more coiled wiring pattern portions to be laminated is maintained by the insulating layer 20 constituting the coiled wiring pattern portion located in the upper layer. The lowermost coiled wiring pattern portion 4a is provided on the substrate 2 via the connecting wiring pattern portion (not shown), but the insulation from the connecting wiring pattern portion is as follows. This is realized by the insulating layer 20.
[0048]
The four-layered coil-shaped wiring pattern layers 4a, 4b, 4c, and 4d are all coil-shaped wiring bodies in the same winding direction (for example, all the left-handed if left-handed).
[0049]
Note that the transfer pattern layer for transfer used when the coiled wiring pattern layers 4a, 4b, 4c, and 4d are laminated on the substrate 2 by transfer may be manufactured in accordance with the method shown in FIG.
[0050]
A method of forming the coil portion 8 including the connecting wiring pattern portion on the substrate 2 using such a transfer pattern layer for transfer will be described.
[0051]
First, as shown in the plan view of FIG. 8, a wiring pattern portion 150 for connecting a predetermined pattern is formed on the substrate 2. In the wiring pattern portion 150 in the figure, “◯” indicates terminals A to I for wiring, between terminals BC, between terminals DE, between terminals FG, and between terminals HI. Are connected by connecting lines 151, 152, 153 and 154 for wiring, respectively. The terminals A to I and the connecting lines 151, 152, 153, and 154 may have any conductivity and can be formed as a fine pattern (width of 5 μm or more, thickness of about 5 to 30 μm). ), And there is no particular limitation on the formation method. For example, it can be formed according to various photolithography methods and the transfer method described above. When the transfer method is used, there is an advantage that all the coil portions 8 including the connecting wiring pattern portion 150 can be efficiently formed by the transfer method.
[0052]
On the wiring pattern portion 150 for connection, a first-layer coiled wiring pattern layer 4a of the present invention as shown in FIG. 9 is formed by a transfer method.
[0053]
The coil-like wiring pattern layer 4a in FIG. 9 is simply drawn in a ring shape in order to facilitate understanding of the present invention and to avoid the complexity of the line part of the drawing. On the other hand, it has a coiled form (spiral shape) with the other end inside the coil. Then, one end of the coil located outside the coil has a shape slightly drawn outward as shown in the figure, and a terminal A 'is formed at the tip. This terminal A ′ overlaps or is very adjacent to the terminal A (FIG. 8) of the connecting wiring pattern portion 150 when the first-layer coiled wiring pattern layer 4a is transferred to the substrate 2. The position is set so as to come to the set position. On the other hand, the other end of the coil located inside the coil has a shape slightly drawn inward as shown in the figure, and a terminal B 'is formed at the tip thereof. This terminal B ′ overlaps with the terminal B (FIG. 8) of the above-described connecting wiring pattern portion 150 at the time when the first-layer coiled wiring pattern layer 4a is transferred to the substrate 2 side. The position is set so as to come to the adjacent position. Then, the terminals A and A ', and B and B' are connected by various suitable methods as will be described later. Further, the presence of these terminals is not essential, and the ends of the connecting lines may be simply connected by various methods to be described later.
[0054]
Next, the coil-shaped wiring pattern layer 4b of the second layer is transferred and formed on the coil-shaped wiring pattern layer 4a of the first layer (FIG. 10). The coil-shaped wiring pattern layer 4b in FIG. 10 is also simply drawn in a ring shape as described above. However, in actuality, a coil-shaped configuration (spiral) having one end outside the coil and the other end inside the coil. Shape). Then, one end of the coil located outside the coil has a shape slightly drawn outward as shown in the figure, and a terminal C 'is formed at the tip. This terminal C ′ overlaps with the terminal C (FIG. 8) of the connecting wiring pattern portion 150 at the time when the second-layer coiled wiring pattern layer 4b is transferred to the substrate 2 side, or extremely The position is set so as to come to the adjacent position. On the other hand, the other end of the coil located inside the coil has a shape slightly drawn inward as shown in the figure, and a terminal D 'is formed at the tip thereof. The terminal D ′ overlaps with the terminal D (FIG. 8) of the connecting wiring pattern portion 150 described above at the time when the second-layer coiled wiring pattern layer 4b is transferred to the substrate 2 side or extremely. The position is set so as to come to the adjacent position. Then, the terminals C and C ′ and D and D ′ are connected by various methods to be described later.
[0055]
Next, the coil-shaped wiring pattern layer 4c of the third layer is transferred and formed on the coil-shaped wiring pattern layer 4b of the second layer (FIG. 11).
[0056]
As described above, the coil-shaped wiring pattern layer 4c in FIG. 11 is also drawn in a ring shape. However, in actuality, a coil-shaped configuration (spiral) having one end on the outer side of the coil and the other end on the inner side of the coil. Shape). Then, one end of the coil located outside the coil has a shape drawn slightly outward as shown in the figure, and a terminal E 'is formed at the tip thereof. This terminal E ′ overlaps the terminal E (FIG. 8) of the connecting wiring pattern portion 150 at the time when the third-layer coiled wiring pattern layer 4c is transferred to the substrate 2 side or extremely The position is set so as to come to the adjacent position. On the other hand, the other end of the coil located inside the coil has a shape slightly pulled inward as shown in the figure, and a terminal F 'is formed at the tip thereof. The terminal F ′ overlaps with the terminal F (FIG. 8) of the connecting wiring pattern portion 150 at the time when the third-layer coiled wiring pattern layer 4c is transferred to the substrate 2 side or extremely The position is set so as to come to the adjacent position. The terminals E and E 'and F and F' are connected by various methods to be described later.
[0057]
Next, a fourth-layer coiled wiring pattern layer 4d is transferred and formed on the third-layer coiled wiring pattern layer 4c (FIG. 12).
[0058]
The coil-shaped wiring pattern layer 4d in FIG. 12 is also simply drawn in a ring shape as described above, but in actuality, a coil-shaped configuration (spiral) having one end outside the coil and the other end inside the coil. Shape). Then, one end of the coil located outside the coil has a shape slightly drawn outward as shown in the figure, and a terminal G 'is formed at the tip thereof. This terminal G ′ overlaps with the terminal G (FIG. 8) of the connecting wiring pattern portion 150 described above at the time when the fourth coil-shaped wiring pattern layer 4d is transferred to the substrate 2 side or extremely. The position is set so as to come to the adjacent position. On the other hand, the other end of the coil located inside the coil has a shape slightly drawn inward as shown in the figure, and a terminal H 'is formed at the tip thereof. The terminal H ′ overlaps the terminal H (FIG. 8) of the connecting wiring pattern portion 150 described above at the time when the coil-shaped wiring pattern layer 4d of the fourth layer is transferred to the substrate 2 side or extremely. The position is set so as to come to the adjacent position. Then, the terminals G and G ′ and H and H ′ are connected by various methods to be described later.
[0059]
In this way, the coil-like wiring pattern layers 4a, 4b, 4c, and 4d are stacked in four layers and connected to a predetermined position of the connecting wiring pattern portion 150 formed on the substrate 2 first, One continuous coil portion 8 in the same winding direction is completed. A plan view of the coil portion 8 thus completed is shown in FIG. 13, and the flow of signals in the coil portion 8 will be described with reference to FIG.
[0060]
First, an externally input signal passes through point A, and then follows the coil winding direction from the outer side to the inner side of the first-layer coiled wiring pattern layer 4a (in this embodiment, the counterclockwise direction is illustrated). Flow) to the inner exit B point of the coil-shaped wiring pattern layer 4a of the first layer.
[0061]
The signal that has reached the point B is sent to the point C outside the coil by a connecting line 151 indicated by a dotted line. The signal passing through the point C flows from the outside to the inside of the second-layer coiled wiring pattern layer 4b in accordance with the coil winding direction (in this embodiment, counterclockwise is illustrated), and the second layer It reaches the inner exit D point of the coiled wiring pattern layer 4b of the eye.
[0062]
The signal that has reached point D is sent to point E outside the coil via connecting line 152 indicated by a dotted line. The signal passing through the point E flows from the outer side to the inner side of the coil-shaped wiring pattern layer 4c of the third layer according to the coil winding direction (in this embodiment, counterclockwise is illustrated), and the third layer It reaches the inner exit F point of the coiled wiring pattern layer 4c of the eye.
[0063]
The signal that has reached the point F is sent to the point G outside the coil via a connecting line 153 indicated by a dotted line. The signal passing through the point G flows from the outside to the inside of the fourth-layer coiled wiring pattern layer 4d according to the coil winding direction (in this embodiment, counterclockwise is illustrated), and the fourth layer It reaches the inner exit H point of the coiled wiring pattern layer 4d of the eye.
[0064]
The signal that has reached the point H is sent to the point I outside the coil by a connecting line 154 indicated by a dotted line. This point I serves as an output of the signal to the outside of the coil portion.
[0065]
To describe such a signal flow in a more concise and simple manner, point A → (first layer coiled wiring pattern layer 4a) → B point → C point → (second layer coiled wiring pattern) Layer 4b) → D point → E point → (third layer coiled wiring pattern layer 4c) → F point → G point → (fourth layer coiled wiring pattern layer 4d) → H point → I It becomes a point.
[0066]
In addition, although the said Example gave and demonstrated the example which piled up the coil-shaped wiring body in four layers, it is not limited to this, A various number of laminated structure is employable. Further, the winding direction is not limited to left-handed winding, and may be left-handed or right-handed as long as the same winding direction is secured. Of course, if the same winding direction is ensured, the signal flow may be changed from the inside to the outside of the coil.
[0067]
Next, in order to form the coil portions 8 that are continuously connected in the same winding direction, a predetermined portion of the wiring pattern portion 150 (FIG. 8) for connection formed on the substrate 2 and the lamination Means for connecting the inner and outer ends of each of the coiled wiring pattern layers 4a, 4b, 4c, and 4d will be described.
[0068]
As specific connection portions, for example, points A and A ′, points B and B ′, points C and C ′, points D and D ′ in the embodiment shown in FIGS. , Points E and E ′, points F and F ′, points G and G ′, points H and H ′, points I and I ′. Each of these pairs of points is connected after being placed in an overlapping or adjacent state (proximity portion).
[0069]
Specific connection methods include (1) printing method, (2) dispensing method, (3) ultrafine particle spraying method, (4) laser drawing method, (5) selective electroless plating method, and (6) selective vapor deposition method. , (7) Welding method, (8) Wire bonding method, (9) One shot method using wire bonding equipment, (10) Laser plating method, (11) Batch transfer of laminate of conductor and solder plating (12) Metal lump insertion method, (13) Electroless plating method, etc.
[0070]
The connection by the printing method of (1) is performed by fixing a conductive paste or solder so as to straddle between the conductive layers constituting the portion to be connected by printing to form a joint. The printing method to be used is not particularly limited, but screen printing generally suitable for thick film printing and frequently used in the electronics industry is preferable. When screen printing is performed, a screen printing plate having an opening in a portion corresponding to a connecting portion between wirings is prepared in advance, and aligned on a multilayer wiring board, and a conductive paste such as a silver paste. What is necessary is just to print an ink.
[0071]
The connection by the dispensing method in (2) is similar to the above printing method, but is performed by ejecting conductive ink from fine nozzles and directly drawing and forming the joint between the wirings. It is. Specifically, a dispenser having a needle-like spout that is generally used for attaching a small amount of adhesive or the like to a required portion can be used. Moreover, the inkjet system currently used for output devices, such as a computer, can also be used depending on the viscosity of the conductive ink to be used.
[0072]
The ultrafine particle spraying method of (3) above is carried by carrying ultrafine particles in a high-speed air stream, and sprayed from a fine nozzle provided close to the multilayer coil wiring board toward the place to be connected, This is a method for forming a film by mutually sintering by collision energy between ultrafine particles and wiring locations, and a method called a gas deposition method can be used. The apparatus used for this method basically comprises two vacuum chambers of high vacuum and low vacuum, and connection pipes connecting the vacuum chambers. The ultrafine particles are formed by a vacuum evaporation method in a low vacuum chamber into which argon gas or the like is introduced, and the substrate is placed in the high vacuum chamber. The connection pipe has an opening in the vicinity of the generation of ultrafine particles in the low vacuum chamber and in the vicinity of the multilayer coil wiring board in the high vacuum chamber and in a direction perpendicular to the wiring board. Yes. Since each vacuum chamber is maintained at a constant pressure by the vacuum exhaust system, a high-speed air flow (gas flow) from the low vacuum chamber to the high vacuum chamber is generated in the connection pipe due to the pressure difference between the vacuum chambers. The ultrafine particles generated and generated in the low vacuum chamber are carried in this air stream and conveyed to the high vacuum chamber side, collide with the wiring locations and are sintered together to form a film. By using this method using a metal such as gold, silver, copper, or nickel as a base material, a conductor (junction) can be selectively formed at a location that requires connection between wirings.
[0073]
In the laser drawing method of (4) above, the resin binder is decomposed or coated by applying a solution in which conductive fine particles are dispersed to a multilayer coil wiring board and heating the desired portion of the coating film with a laser. It is removed by evaporation, and conductive fine particles are deposited and agglomerated at the heated portion to selectively form a conductor. As the solution, a fine resin of about several tens of μm can be drawn by using a polyester resin, an acrylic resin, or the like in which conductive fine particles such as gold and silver are dispersed and irradiating with an argon laser.
[0074]
As the selective electroless plating method (5), a selective electroless plating technique generally known as a photoforming method can be used. In this technique, a photosensitizer layer containing a metal in an oxidation state that can be reduced and becomes a catalyst for electroless plating is formed on a multilayer coil wiring board, and the photosensitizer layer is selectively exposed, Metal particles that serve as a catalyst for electroless plating are deposited at locations to be connected, and then immersed in an electroless plating solution, thereby selectively plating only the exposed portion.
[0075]
Further, the selective vapor deposition method (6) uses a selective film deposition technique which is one of thin film formation techniques. That is, an organic metal gas containing a conductive element such as metal, carbon or the like, or an organic vapor containing a conductive element is introduced into the vacuum chamber, and the gas or the above gas is applied to the surface of the multilayer coil wiring board installed in the vacuum chamber. Vapor is adsorbed, and then a laser or ion beam is focused or focused to irradiate the substrate, and the gas or vapor adsorbed on that part is decomposed by heat or collision energy, so that metal, carbon, etc. A conductive substance is deposited on the multilayer coil wiring board. Such a selective vapor deposition method has been put into practical use as an LSI wiring correction technique. More specifically, a focused argon laser decomposes organometallic gases containing chromium, cobalt, platinum, tungsten, etc., and deposits these metals on the desired correction site, or pyrene by a gallium ion beam. A technique of depositing a carbon film by decomposing vapor of an organic material such as the above can be used.
[0076]
Further, in the welding joining method of (7), the connection part is selectively heated with a laser, the insulating resin layer is melted and evaporated, and further, the conductive layer itself is also heated to a high temperature. The conductive layers are fused to each other to form and connect a joint.
[0077]
The wire bonding method (8) is, for example, a method in which a non-conductive proximity portion is connected by wire bonding using a wire bonding apparatus.
[0078]
In the one-shot method using the wire bonding apparatus (9) above, for example, a non-conductive proximity part is bonded by one shot (one time) using a wire bonding apparatus and connected without a bridge. It is a method to do.
[0079]
The laser plating method of the above (10) is, for example, a laser in which a predetermined spot diameter, power on the irradiation surface, etc. are adjusted in a state in which a multilayer coil wiring board before connection operation is immersed in a palladium plating solution (for example, , Argon laser) is applied to a proximity part or an overlapping part to be conducted for a predetermined time, and a Pd film, for example, is deposited to a predetermined thickness and connected to the irradiated part. It is preferable to irradiate the laser while circulating the palladium plating solution. The plating solution is removed by washing with water.
[0080]
The batch transfer method for the laminate of the conductor (11) and the solder plating of (11) is as follows. First, a laminate of a conductor layer and a solder plating layer is produced as follows. That is, a conductive layer is formed by performing, for example, electroplating on a transfer substrate on which a desired pattern (conductive pattern) is formed by development using a resist method on a conductive substrate. On the top, solder plating is performed using a predetermined solder plating bath composition to form a solder plating layer. The solder plating layer can be similarly formed by screen printing or dipping of solder paste in addition to solder plating. The laminated body thus laminated is collectively heat-transferred to a non-conducting adjacent portion of the wiring portion to be connected (the same can be dealt with in the overlapping portion) to connect the portions to be connected. At this time, the thermal transfer temperature is performed in a temperature range of about 200 to 300 ° C. that is a temperature at which the solder plating layer can be melted and deformed.
[0081]
In the metal lump insertion method of (12) above, for example, a metal ball having a diameter of about 30 to 100 μm is disposed in the wiring gap in the adjacent portion where the wiring portion to be connected is not conducted. This is a method in which a sheet to which an adhesive is applied is pressure-bonded to connect portions to be connected. The use of metal balls is a more preferable use mode, but it is also possible to use so-called metal pieces (lumps) that are not spherical. Further, such metal balls (lumps) can also be used to improve the reliability of the connection part in the printing method and the dispensing method. That is, after the metal ball is installed, the printing or dispensing is performed.
[0082]
In the above (13) electroless plating method, an electroless plating catalyst is applied to the entire surface of the substrate on which the coil portion before connection is formed to form a catalyst layer, and then a photoresist is applied and formed thereon. Then, the resist layer is closely exposed and developed using a predetermined photomask to expose a portion corresponding to the portion to be connected of the coil portion, and after activating this exposed portion, electroless copper plating is performed to connect the connecting portion. It is a technique to form.
[0083]
【Example】
Next, the wiring pattern layer of the present invention will be described in more detail by showing a specific experimental example.
[0084]
Experimental example 1
(1) Formation of wiring pattern layer 4 for transfer (corresponding to FIG. 2 (e))) and formation of wiring pattern layer 4 on a substrate by transfer (corresponding to FIG. 1)
As a conductive substrate (transfer plate), a 0.15 μm-thick stainless steel plate with a polished surface was prepared, and about 5 μm thick Cu was formed on the stainless steel plate by electrolytic plating. That is, the stainless steel plate and the platinum electrode are opposed to each other and immersed in a copper pyrophosphate plating bath (pH = 8, liquid temperature = 55 ° C.) having the following composition, and the platinum electrode is used as the anode of the DC power source and the cathode is used as the cathode. Connecting transfer substrate, current density 3A / dm² Then, energization was performed for 5 minutes, and a Cu plating film having a thickness of about 5 μm was formed as the conductive layer 31.
[0085]
(Composition of copper pyrophosphate plating bath)
Copper pyrophosphate: 94 g / l
Copper potassium pyrophosphate: 340 g / l
Ammonia water: 3cc / l
Next, Ni having a thickness of about 2000 mm was formed on the Cu plating film by electrolytic plating in the following manner. That is, it was immersed in a plating bath (pH = 4.2 to 4.5, liquid temperature = 50 ° C.) having the following composition, a platinum electrode was connected to the anode of a DC power source, and the above plate was connected to the cathode, and the current density was 0. .05A / dm² The conductive layer 33 was formed by energizing for 3 minutes to form a Ni plating film having a thickness of about 2000 mm.
[0086]
(Plating bath composition)
Nickel sulfamylate: 350 g / l
Boric acid: 40 g / l
Next, a photosensitive polyimide coating solution (manufactured by Toray Industries, Inc., Photo Nice: UR-5100FX 100 cps) as an insulating layer was formed thereon with a film thickness of about 20 μm by spin coating. The spin coating conditions were in two stages of 500 rpm-10 sec and 2000 rpm-30 sec. This coating film was pre-baked in a clean oven at 70 ° C. for 60 minutes.
[0087]
Next, a mask having a predetermined pattern was closely attached to the coating film, and contact exposure was performed using an exposure apparatus P-202-G (manufactured by Dainippon Screen Mfg. Co., Ltd.). The exposure time was 600 counts (about 30 seconds).
[0088]
After such contact exposure, after developing for about 20 minutes using a Photo Nice developer (Toray Industries, Inc .: DV-605), rinsing with isopropyl alcohol was performed for about 1 minute.
[0089]
Subsequently, the developed photosensitive polyimide (insulating layer) was post-baked (cured) to further cure the photosensitive polyimide. The curing treatment was performed in two stages using a clean oven at 180 ° C. for 60 minutes and 300 ° C. for 60 minutes. The film thickness of the polyimide after curing was about 10 μm.
[0090]
Next, using a 10% ferric chloride solution, the Cu plating layer and the Ni plating layer, which are conductive layers, were etched. The etching time was about 5 to 10 minutes.
[0091]
A pressure-sensitive adhesive (adhesive) was applied to the entire concavo-convex surface formed by this etching process. That is, the pressure-sensitive adhesive (Nippon Carbide Industries Co., Ltd .: Nissetsu PE-118) and toluene were mixed at a weight ratio of 1: 1, and the curing agent (Nippon Carbide Industries Co., Ltd .: CK-100) was further added. An adhesive layer (adhesive layer) having a film thickness of about 3 μm is applied as a pressure-sensitive adhesive mixed at a ratio of 100: 1 by weight with respect to the pressure-sensitive adhesive at room temperature for about 1 hour. Got. As spinner conditions, it was set as the 2-step application | coating of 500rpm-5sec and 3000rpm-30sec.
[0092]
Thereafter, the laminated body thus produced was transferred onto the substrate in the following manner. That is, a pressure of 10 kgf / cm is applied to a polyimide film having a thickness of 25 μm at room temperature.² The wiring pattern layer was transferred under the pressure bonding conditions of to form a wiring pattern layer.
[0093]
Experimental example 2
As a conductive substrate (transfer plate), a 0.15 μm-thick stainless steel plate with a polished surface was prepared, and about 5 μm thick Cu was formed on the stainless steel plate by electrolytic plating. That is, the stainless steel plate and the platinum electrode are opposed to each other and immersed in a copper pyrophosphate plating bath (pH = 8, liquid temperature = 55 ° C.) having the following composition, and the platinum electrode is used as the anode of the DC power source and the cathode is used as the cathode. Connecting transfer substrate, current density 3A / dm² Then, energization was performed for 5 minutes, and a Cu plating film having a thickness of about 5 μm was formed as the conductive layer 31.
[0094]
(Composition of copper pyrophosphate plating bath)
Copper pyrophosphate: 94 g / l
Copper potassium pyrophosphate: 340 g / l
Ammonia water: 3cc / l
Next, Ni having a thickness of about 2000 mm was formed on the Cu plating film by electrolytic plating in the following manner. That is, it was immersed in a plating bath (pH = 4.2 to 4.5, liquid temperature = 50 ° C.) having the following composition, a platinum electrode was connected to the anode of a DC power source, and the above plate was connected to the cathode, and the current density was 0. .05A / dm² The conductive layer 33 was formed by energizing for 3 minutes to form a Ni plating film having a thickness of about 2000 mm.
[0095]
(Plating bath composition)
Nickel sulfamylate: 350 g / l
Boric acid: 40 g / l
Next, a polyimide coating solution (Semicofine: SP-341 100 cps, manufactured by Toray Industries, Inc.) as an insulating layer was formed thereon with a film thickness of about 20 μm by spin coating. The spin coating conditions were in two stages of 500 rpm-10 sec and 1500 rpm-30 sec. Then, this coating film was dried on a hot plate at 110 ° C. for 5 minutes. Thereafter, a positive resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., OFPR85 20 cps) was formed by spin coating so as to have a thickness of about 1 μm. The spin coating conditions were two stages of 500 rpm-5 sec and 1500 rpm-40 sec. The coating film was dried in a hot air circulating oven at 85 ° C. for 30 minutes.
[0096]
Next, a mask having a predetermined pattern was closely adhered to the coating film, and contact exposure was performed using an exposure apparatus P-202-G (manufactured by Dainippon Screen Mfg. Co., Ltd.). The exposure time was 30 counts (about 15 seconds).
[0097]
After such close contact exposure, development was performed for about 1 minute using a weak alkaline developer NMD-3 (manufactured by Tokyo Ohka Kogyo Co., Ltd.), followed by washing with pure water to perform predetermined patterning of the resist. The polyimide layer was etched for about 2 minutes using a weak alkaline developer NMD-3 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) in the same manner as described above using the predetermined pattern developed in this manner as a mask, and then acetone. Then, the positive resist was peeled off, and the polyimide was thermally cured at 350 ° C. Next, a copper plating layer (Ni plating layer) as a conductive layer was etched using a 10% ferric chloride solution. For about 5 minutes.
[0098]
A pressure-sensitive adhesive (adhesive) was applied to the entire concavo-convex surface formed by this etching process. That is, the pressure-sensitive adhesive (Nippon Carbide Industries Co., Ltd .: Nissetsu PE-118) and toluene were mixed at a weight ratio of 1: 1, and the curing agent (Nippon Carbide Industries Co., Ltd .: CK-100) was further added. An adhesive layer (adhesive layer) having a film thickness of about 3 μm is applied as a pressure-sensitive adhesive mixed at a ratio of 100: 1 by weight with respect to the pressure-sensitive adhesive at room temperature for about 1 hour. Got. As spinner conditions, it was set as the 2-step application | coating of 500rpm-5sec and 3000rpm-30sec.
[0099]
Thereafter, the laminated body thus produced was transferred onto the substrate in the following manner. That is, a pressure of 10 kgf / cm is applied to a polyimide film having a thickness of 25 μm at room temperature.² The wiring pattern layer was transferred under the pressure bonding conditions of to form a wiring pattern layer.
[0100]
Experimental example 3
In Experimental Example 2, the polyimide thermosetting treatment was performed after the copper plating layer (Ni plating layer) etching treatment. That is, the operation of peeling the positive resist with acetone and thermally curing the polyimide at 350 ° C. was performed after etching the copper plating layer (Ni plating layer) as the conductive layer. Other than that was carried out similarly to the said experimental example 2, and formed the wiring pattern layer of the experimental example 3. FIG.
[0101]
As a result of conducting experiments (Experimental Examples 1 to 3) for concrete production of the wiring pattern layer of the present invention as described above, the present invention does not require a special plate for forming the wiring pattern layer. Inspection was possible before transfer, and it was confirmed that the product yield was improved. It was also confirmed that the adhesive layer, the insulating layer, and the conductive layer can be integrally transferred, and the process can be simplified.
[0102]
Further, using the wiring pattern layer of the present invention, a multilayer printed wiring board as shown in FIG. 3, an electrode of an electrostatic actuator as shown in FIG. 4, and a non-contact IC card as shown in FIG. When multilayer coils were produced for each, it was experimentally confirmed that each of them achieved a good function.
[0103]
【The invention's effect】
As described above in detail, according to the present invention, a wiring pattern layer is formed on a substrate, and the wiring pattern layer is integrally provided with an adhesive layer, an insulating layer, and a conductive layer sequentially. And the manufacturing method thereof includes a step of forming a conductive layer on a conductive substrate, a step of patterning an insulating layer on the conductive layer, and the insulating layer. Etching the conductive layer along the pattern of the layer, forming an adhesive layer on at least the surface of the insulating layer, a conductive layer patterned on the conductive substrate by these steps, an insulating layer, and And the step of transferring the adhesive layer onto the substrate to be integrally wired, and in particular, can be produced without making a special plate for forming the wiring pattern layer. Can be inspected before transfer Since an effect of improving the product yield is achieved. Further, the adhesive layer, the insulating layer, and the conductive layer can be integrally transferred, and the process can be simplified.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing a state in which a wiring pattern layer of the present invention is formed on a substrate.
FIG. 2 is a schematic cross-sectional view showing a method for manufacturing a wiring pattern layer of the present invention over time.
FIG. 3 is a schematic cross-sectional view when the wiring pattern layer of the present invention is applied to a multilayer printed wiring board.
FIG. 4 is a schematic perspective view when the wiring pattern layer of the present invention is applied to an electrode of an electrostatic actuator.
5 is a schematic perspective view of electrode formation of the electrostatic actuator before reaching FIG. 4. FIG.
FIG. 6 shows a specific application example of the wiring pattern layer of the present invention, and is a non-contact IC card, in particular, a coil portion including a coil-shaped wiring pattern layer laminated in four layers on a substrate. It is the figure which showed the cross section typically.
7 is a plan view of FIG. 6. FIG.
FIG. 8 is a plan view in which wiring pattern portions for connection are arranged on a substrate.
FIG. 9 is a plan view of a first-layer coiled wiring pattern layer.
FIG. 10 is a plan view of a second-layer coiled wiring pattern layer.
FIG. 11 is a plan view of a third-layer coiled wiring pattern layer.
FIG. 12 is a plan view of a fourth coil-shaped wiring pattern layer.
FIG. 13 is a plan view of a coil portion laminated and completed by a transfer method.
[Explanation of symbols]
2 ... Board
3 ... conductive substrate
4, 5, 6 ... wiring pattern layer
10: Adhesive layer
20 ... Insulating layer
30 (31, 33) ... conductive layer

Claims (7)

Forming a conductive layer on the conductive substrate, patterning an insulating layer on the conductive layer, etching the conductive layer along the pattern of the insulating layer, and at least a surface of the insulating layer Forming an adhesive layer on the substrate, and transferring the conductive layer, the insulating layer and the adhesive layer patterned on the conductive substrate by these steps onto the substrate to be integrally wired , A method of manufacturing a wiring pattern layer,
The step of forming a conductive layer on the conductive substrate includes a stacking operation of sequentially stacking at least two kinds of first and second conductive layers having different compositions, and includes a second operation located on the insulating layer side. A method for producing a wiring pattern layer, wherein the conductive layer is a Ni layer or a Cr layer. The method for manufacturing a wiring pattern layer according to claim 1, wherein the first conductive layer is a Cu layer. The method for manufacturing a wiring pattern layer according to claim 1, wherein the step of forming the conductive layer is performed by electrolytic plating. The step of the insulating layer pattern formation, a photosensitive resin composition was applied, after exposure through a mask having a predetermined pattern, according to any one of claims 1 to 3 comprising been made by developing Manufacturing method of the wiring pattern layer. The process of forming the pattern of the insulating layer is performed by applying a photosensitive resin composition, exposing and developing through a mask having a predetermined pattern, and further thermosetting . The manufacturing method of the wiring pattern layer in any one . The step of patterning the insulating layer is performed by applying and drying an insulating resin, applying a photosensitive resin composition thereon, and exposing and developing the photosensitive resin composition through a mask having a predetermined pattern. The method for producing a wiring pattern layer according to any one of claims 1 to 3, further comprising etching the insulating resin using the developed photosensitive resin composition as a mask. The step of patterning the insulating layer is performed by applying and drying an insulating resin, applying a photosensitive resin composition thereon, and exposing and developing the photosensitive resin composition through a mask having a predetermined pattern. 4. The process for producing a wiring pattern layer according to claim 1, wherein the insulating resin is etched using the developed photosensitive resin composition as a mask and then thermally cured. Method.

Images