JP3713088B2 - Display device - Google Patents

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Publication number
JP3713088B2
JP3713088B2 JP03051296A JP3051296A JP3713088B2 JP 3713088 B2 JP3713088 B2 JP 3713088B2 JP 03051296 A JP03051296 A JP 03051296A JP 3051296 A JP3051296 A JP 3051296A JP 3713088 B2 JP3713088 B2 JP 3713088B2
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Japan
Prior art keywords
circuit board
printed circuit
layer
electrically insulating
display device
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JP03051296A
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Japanese (ja)
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JPH09223820A (en
Inventor
孝幸 石原
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Rohm Co Ltd
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Rohm Co Ltd
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Priority to JP03051296A priority Critical patent/JP3713088B2/en
Priority to KR1019970004874A priority patent/KR100462990B1/en
Priority to TW086101932A priority patent/TW357276B/en
Priority to US08/802,264 priority patent/US6249267B1/en
Publication of JPH09223820A publication Critical patent/JPH09223820A/en
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Publication of JP3713088B2 publication Critical patent/JP3713088B2/en
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display

Description

【０００１】
【発明の属する技術分野】
本発明はプリント基板に発光素子がマトリクス状に配列され、それぞれの発光素子のオンオフが制御されることにより文字などを表示する表示装置に関する。さらに詳しくは、プリント基板に実装される発光素子などの電子部品から発生する熱を放散しやすくした表示装置に関する。
【０００２】
【従来の技術】
従来、たとえば駅や公共広場での案内表示板、鉄道車両やバスなどの車内表示器などに発光ダイオード（以下、ＬＥＤという）などの発光素子をマトリクス状に配列し、それぞれのＬＥＤの発光を制御することにより文字や数字などを表示し、電光ニュースや時刻、温度などの表示を行っている。このような表示装置は、たとえば図４に示されるような構造になっている。
【０００３】
図４において、１はガラスエポキシ樹脂などからなり、少なくとも両面に配線パターンがパターニングにより形成されたプリント基板で、その一面側にＬＥＤ２のチップがマトリクス状に配列されている。プリント基板１の他面側には、マトリクス状に並べられたＬＥＤ２のそれぞれを選択的にオンオフさせる制御部品や駆動部品などからなるＩＣ部品（制御部品）３が設けられ、一面側のＬＥＤ２を点滅させ得る構造になっている。４は取付金具で、セットの筐体などに表示装置を取り付ける際に、ＩＣ部品３を逃げて固定できるようにするためのもので、取付孔４ａ部にネジなどを嵌合させることにより、表示装置が筐体などに固定される。
【０００４】
このようなＬＥＤ２やＩＣ部品３などが実装されるプリント基板１は、従来よりガラスエポキシ樹脂などからなる電気的絶縁性の基板が用いられており、その表面に配線パターンが形成されている。このプリント基板１にＬＥＤ２やＩＣ部品３などを実装する方法としては、プリント基板１のそれぞれの面にこれらの部品を載置してそのリード線または電極端子をプリント基板１の表面の配線パターンに直接ハンダ付けする表面実装の方法が採られている。なお、ＬＥＤ２とＩＣ部品３との接続は、プリント基板１に設けられたスルーホールを介して、またはプリント基板１の側面を介して行われる。
【０００５】
このような電気的絶縁性部材からなるプリント基板１に電子部品を実装することにより電子部品の組立体を形成する方法は種々の電子機器に用いられており、組立工程の容易さからＬＥＤなどの電子部品をプリント基板１の表面で直接ハンダ付けする前述の表面実装の方法が最近では主流になっている。
【０００６】
【発明が解決しようとする課題】
電子部品を電気的絶縁性のプリント基板に実装する場合、通常の小電力の電子部品を実装する場合には問題ないが、たとえば前述の表示装置のＬＥＤや大電力の半導体素子などの発熱する電子部品を多数実装する場合には、電気的絶縁性のプリント基板では熱伝導も悪く、ＬＥＤなどで発熱した熱が外部に放出されず、蓄熱されて電子部品の動作温度が上昇し、電気的特性に悪影響が生じる。そこで、発熱を抑えるため動作電力を低くしなければならず、充分な輝度が得られないという問題がある。
【０００７】
本発明は、このような問題を解決するためになされたもので、プリント基板の表面に装着される電子部品で発生した熱を効率よく外部に放散し、電子部品の動作温度が上昇し過ぎないようにし、表示特性を低下させない表示装置を提供することを目的とする。
【０００８】
【課題を解決するための手段】
本発明の表示装置は、熱伝導性基板の両面に電気的絶縁性部材が設けられることにより形成されたプリント基板と、該プリント基板の一面にマトリクス状に設けられた発光素子と、前記プリント基板の他面に設けられ前記発光素子の点滅を制御する制御部品とを有し、前記プリント基板の筐体への取付側の外周端における少なくとも一部の前記電気的絶縁性部材が除去されて前記熱伝導性基板が露出され、前記プリント基板の筐体への取付側の周囲に取付金具が設けられ、該取付金具は筐体への取付部が突出するように高く形成されると共に前記電気的絶縁性部材が除去された部分に対応する部分に露出した熱伝導性基板と接触するように段差が形成されている。このように露出させることにより、表示装置を筐体などに取り付ける場合に、前記熱伝導性基板と筐体とを直接金属を介して接続することができる。そのため、プリント基板の表面に装着された電子部品からプリント基板の中心部の熱伝導性基板に伝導した熱を効率よく筐体に伝導することができ、熱の放散特性が向上する。また、取付金具が露出した熱伝導性基板に接触するように段差が設けられることにより、取付金具に薄い材料を使用しながらプリント基板の熱を効率よくセットの筐体を介して放散させることができる。
【０００９】
ここに発光素子とは、ＬＥＤのような光を放射する素子をいい、リード線を有する個別の素子に限らず、半導体基板から切断分離したままのベアチップや半導体などの基板上にアレイ状に発光部が形成されたものも含む。
【００１１】
前記発光素子が設けられる側の前記電気的絶縁性部材が少なくとも第１層および第２層の２層からなり、該第１層の表面に配線パターンが形成され、第２層の表面に前記発光素子が設けられ、該第２層に設けられたブラインドスルーホールを介して前記発光素子と配線パターンとが電気的に接続されていることが、発光面側に発光素子を隙間なく配列し、その配線を下側の第１層で行うことができるため、表示特性を向上させることができて好ましい。
【００１３】
【発明の実施の形態】
つぎに、図面を参照しながら本発明の表示装置について説明をする。
【００１４】
図１の（ａ）は本発明の表示装置の斜視説明図で、（ｂ）は（ａ）のＢ−Ｂ線の一部の断面説明図（符号５および６を付した部材は（ａ）には図示されていない）である。図１において、図４と同じ部分には同じ符号が付してあり、プリント基板１の一面側にはＬＥＤ２がマトリクス状に設けられ、他面側には制御部品（コントロールＩＣ）や駆動部品（ドライブＩＣ）などのＬＥＤ２の点滅を制御するＩＣ部品（制御部品）３および取付金具４が設けられていることは図４の例と同じである。本発明は、プリント基板１が金属板１１などの熱伝導性基板の両面にそれぞれガラスエポキシ樹脂からなる基板やポリイミドなどの有機樹脂被膜などからなる電気的絶縁性部材１２、１３が設けられたサンドイッチ構造からなっているところに特徴がある。熱伝導性基板としては、たとえばアルミニウム、銅、ステンレス、シリコン合板などの熱伝導の良い金属板やアルミナなどの熱伝導の良い基板を用いることができる。熱伝導性基板が電気的絶縁性部材からなる場合は前述の電気的絶縁性部材１２、１３を別の材料として設けなくても、熱伝導性基板のままで兼用することができる。なお、図１（ｂ）において６はセットの筐体５に表示装置の取付金具４を固定するネジで、筐体５およびネジ６は、（ａ）には図示されていない。
【００１５】
このプリント基板１を製造するには、たとえばつぎのようにする。まず、アルミニウムなどの金属板１１にＬＥＤ側とＩＣ側との電気的接続をするためのスルーホールを設けておき、その表裏および側面の全面にポリイミドなどを塗布して固化させ両面に電気的絶縁性部材１２、１３を形成する。その後、通常のプリント基板の製造と同様に蒸着などにより銅被膜を表裏両面に形成し、それぞれエッチングによりパターニングをすることにより配線パターンを形成する。
【００１６】
プリント基板の他の製法の例として、図２にプリント基板１の分解図が示されるように、金属板１１の両面の電気的絶縁性部材１２、１３として、たとえばガラスエポキシ樹脂板などの電気的絶縁板を用い、金属板１１の両面に張り合わせることにより形成することもできる。図２に示される例では、片面の電気的絶縁性部材がそれぞれ２枚の絶縁板による２層からなっているが、それぞれ１層でもよく、また３層以上でもよい。
【００１７】
図２に示される例では、たとえば０.６〜０.７ｍｍ程度の厚さのアルミニウムなどからなる金属板１１の一面側に、たとえば０.２〜０.３ｍｍ程度のガラスエポキシ樹脂板からなる第１層１２ａと第２層１２ｂとがエポキシ樹脂などの接着剤により貼り合わされている。なお、ＬＥＤ２の配線端子とＩＣ部品３との接続をプリント基板のスルーホールを介して行う場合は、金属板１１に設けられたスルーホールの内周にあらかじめ絶縁被膜を設けておくことが好ましい。絶縁性部材の第１層１２ａの表面には、ＬＥＤ２に電圧を印加するための配線パターン１７が銅被膜などにより形成されており、第２層１２ｂに配列されるＬＥＤ２の各電極端子とは第２層１２ｂの表面に設けられた配線パターン１５およびブラインドスルーホール１６（重ね合わされたプリント基板全体を貫通する孔ではなく、第２層１２ｂのみを貫通する孔）を介して接続される。このように電気的絶縁性部材１２を２層にすることによりＬＥＤ２の配列が配線パターンにより制限を受けることなくＬＥＤ２の間隔を狭くすることができるため、美しい表示をすることができる。また、前述のようなブラインドスルーホールとすることにより、金属板１１に沢山のスルーホールを設ける必要がなく、良好な熱伝導を維持することができる。ＩＣ部品を搭載する側の電気的絶縁性部材１３も同様に第１層１３ａおよび第２層１３ｂにより形成され、第１層１３ａの第２層１３ｂ側の面に配線パターン１８を設けることにより同様の効果が得られる。
【００１８】
本発明によれば、プリント基板１のコア部分は金属板１１などの熱伝導性基板からなっており、電子部品で発生した熱は金属板１１を伝わり、プリント基板１の全体から放熱し、またはセットなどの筐体５と接続される取付金具４を介して筐体５から効率よく放散し、電子部品に熱がこもることがない。すなわち、アルミニウムなどからなる金属板１１は、ガラスエポキシなどからなる従来の電気的絶縁性基板より熱伝導が３〜５倍ぐらい高く、非常に熱伝導が良い。そのため、ＬＥＤ２やＩＣ部品３などの電子部品で発生した熱は薄い電気的絶縁性部材１２、１３を介して金属板１１に伝わった後、金属板１１の全体に素早く伝わって放熱し、または取付金具４を介して筐体５から効率よく放散される。その結果、電子部品の動作温度が上昇し過ぎることがなく、ＬＥＤ２などの電子部品に印加される電力が制限されたり、電子部品の動作温度が上昇し過ぎて動作が不安定になることもない。
【００１９】
一方、プリント基板１の両面は、電気的絶縁性部材１２、１３で覆われているため、従来のプリント基板と同様に銅被膜などを設け、エッチングによりパターニングをすることにより配線パターンが形成され、ＬＥＤ２やＩＣ部品３が回路を構成するように表面実装される。なお、ＬＥＤ２の配線端子は金属板１１を貫通して設けられたスルーホールを経て、またはプリント基板１の端部に導出され、プリント基板１の側面を経て他面側のＩＣ部品３などの駆動回路と接続される。
【００２０】
図１に示される表示装置では、プリント基板１のＩＣ部品３が設けられた側の面（他面）の外周端において、ＩＣ部品３の周囲の電気的絶縁性部材１３が周囲全体において除去され、露出した金属板１１に接触すると共にＩＣ部品３の高さより高い取付金具４が設けられている。その結果、セットの筐体５などに取り付けた場合に、図１（ｂ）に熱の伝導方向がＡで示されるように、取付金具４を介して筐体５に熱が伝導し、電子部品（ＬＥＤ２やＩＣ部品３）で発生した熱がセット側から効率よく放散される。このように、取付金具４との接続部の電気的絶縁性部材１３を除去することにより、直接金属同志が接触し、熱の伝導率が低下するところがないため好ましい。しかし、電気的絶縁性部材１３は非常に薄く、電気的絶縁性部材１３が除去されていなくても金属板１１に熱が伝導し、電子部品から取付金具４への熱伝導は相当改善され、またプリント基板１の全体から熱放散をすることができ、熱放散の効果は現れる。
【００２１】
また、図３に取付金具４の他の例が示されているように、取付金具４は数ｍｍの厚さを有するＩＣ部品３の高さより厚い部材を用いなくても、１ｍｍ以下の薄い材料（板状体の加工またはアルミダイカストなどの型成形）で形成することもできるし、また電気的絶縁性部材１３を除去して金属板１１を露出させる部分を周囲全体ではなく部分的にすることもできる。すなわち、図３に示される例では取付金具４が薄い材料でリング状に形成され、筐体との取付部に突状部４ｃが突出するように高く形成され、かつ、金属板１１との接触のため段差４ｂが形成されている。すなわち、ＩＣ部品３を逃げられるように筐体との取付部が高く形成されると共に、絶縁被膜１３が部分的に除去されて露出した金属板１１の部分と接触させるために段差４ｂが形成されている。このようにすることにより取付金具４を薄い板材もしくは少ない材料により形成することができるし、また電気的絶縁性部材１３の除去する部分が部分的であっても、同様の効果が得られる。
【００２２】
【発明の効果】
以上説明したように本発明の表示装置によれば、ＬＥＤなどの電子部品を搭載するプリント基板の少なくともコア部に金属板などの熱伝導性基板を用いているため、プリント基板に搭載する電子部品が発熱しても、その熱を効率よく放散することができ、電子部品の動作温度が必要以上に上昇し過ぎることがなく、輝度を低下させない高性能な表示装置が得られる。
【００２３】
さらに、電子部品の動作温度が上昇し過ぎないため、電子部品の寿命が延び、また故障率が下がり、電子機器の信頼性が大幅に向上する。
【図面の簡単な説明】
【図１】本発明の表示装置の斜視説明図およびその部分断面説明図である。
【図２】本発明の表示装置のプリント基板の他の構成例を示す図である。
【図３】本発明の表示装置の取付金具の他の構成例を示す図である。
【図４】従来のＬＥＤを用いた表示装置の斜視説明図である。
【符号の説明】
１ プリント基板
２ ＬＥＤ
３ ＩＣ部品
４ 取付金具
４ｂ 段差
４ｃ 突状部
５ 筐体
１１ 金属板
１２ 電気的絶縁性部材
１３ 電気的絶縁性部材[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a display device that displays characters and the like by arranging light emitting elements in a matrix on a printed circuit board and controlling on / off of each light emitting element. More particularly, the present invention relates to a display device that can easily dissipate heat generated from electronic components such as light emitting elements mounted on a printed circuit board.
[0002]
[Prior art]
Conventionally, light-emitting elements such as light-emitting diodes (hereinafter referred to as LEDs) are arranged in a matrix on information display boards at stations and public plazas, in-car displays such as railway vehicles and buses, and the light emission of each LED is controlled. By doing so, letters, numbers, etc. are displayed, and lightning news, time, temperature, etc. are displayed. Such a display device has a structure as shown in FIG. 4, for example.
[0003]
In FIG. 4, reference numeral 1 denotes a printed circuit board having a wiring pattern formed on at least both surfaces by patterning, and the LEDs 2 are arranged in a matrix on one side. On the other surface side of the printed circuit board 1, an IC component (control component) 3 including a control component and a drive component for selectively turning on / off each of the LEDs 2 arranged in a matrix is provided, and the LED 2 on the one surface side blinks. The structure can be made to. Reference numeral 4 denotes a mounting bracket for allowing the IC component 3 to escape and be fixed when the display device is mounted on a set housing or the like. By attaching a screw or the like to the mounting hole 4a, the display can be displayed. The device is fixed to a housing or the like.
[0004]
Conventionally, an electrically insulating substrate made of glass epoxy resin or the like is used for the printed board 1 on which such LEDs 2 and IC components 3 are mounted, and a wiring pattern is formed on the surface thereof. As a method for mounting the LED 2 or the IC component 3 on the printed circuit board 1, these components are mounted on the respective surfaces of the printed circuit board 1, and the lead wires or electrode terminals thereof are used as the wiring pattern on the surface of the printed circuit board 1. The method of surface mounting which is directly soldered is adopted. The LED 2 and the IC component 3 are connected through a through hole provided in the printed board 1 or through a side surface of the printed board 1.
[0005]
A method of forming an assembly of electronic components by mounting the electronic components on the printed board 1 made of such an electrically insulating member is used in various electronic devices. The above-described surface mounting method in which electronic components are directly soldered on the surface of the printed circuit board 1 has recently become mainstream.
[0006]
[Problems to be solved by the invention]
When electronic components are mounted on an electrically insulating printed circuit board, there is no problem when mounting ordinary low-power electronic components, but for example, the above-mentioned display devices such as LEDs and high-power semiconductor elements generate heat. When mounting a large number of components, the heat insulation of an electrically insulating printed circuit board is poor, and the heat generated by the LED is not released to the outside, but is stored and the operating temperature of the electronic components rises, resulting in electrical characteristics. Adversely affected. Therefore, there is a problem that the operating power must be lowered to suppress heat generation, and sufficient luminance cannot be obtained.
[0007]
The present invention has been made to solve such a problem, and efficiently dissipates heat generated in an electronic component mounted on the surface of a printed circuit board to the outside so that the operating temperature of the electronic component does not increase excessively. Thus, an object of the present invention is to provide a display device that does not deteriorate display characteristics.
[0008]
[Means for Solving the Problems]
The display device of the present invention includes a printed circuit board formed by providing electrically insulating members on both sides of a thermally conductive substrate, light emitting elements provided in a matrix on one surface of the printed circuit board , and the printed circuit board. And a control component for controlling blinking of the light emitting element provided on the other surface , and at least a part of the electrically insulative member at the outer peripheral end of the printed circuit board attached to the housing is removed, and The heat conductive substrate is exposed , and a mounting bracket is provided around the side of the printed circuit board attached to the housing. The mounting bracket is formed high so that the mounting portion to the housing protrudes, and the electrical A step is formed so as to be in contact with the thermally conductive substrate exposed at a portion corresponding to the portion from which the insulating member has been removed . By exposing in this way, when the display device is attached to a housing or the like, the thermally conductive substrate and the housing can be directly connected via a metal. Therefore, it is possible to conduct heat conducted to the thermally conductive substrate of the central portion of the printed circuit board from the mounting electronic components on the surface of the printed circuit board to efficiently housing, improve dissipation characteristics of heat. In addition, by providing a step so that the mounting bracket is in contact with the exposed thermally conductive substrate, heat from the printed circuit board can be efficiently dissipated through the housing of the set while using a thin material for the mounting bracket. it can.
[0009]
Here, the light emitting element refers to an element that emits light such as an LED, and is not limited to an individual element having a lead wire, but emits light in an array on a substrate such as a bare chip or a semiconductor that is cut and separated from a semiconductor substrate. Including those formed with parts.
[0011]
The electrically insulating member on the side where the light emitting element is provided is composed of at least two layers of a first layer and a second layer, a wiring pattern is formed on the surface of the first layer, and the light emission is formed on the surface of the second layer. An element is provided, and the light emitting element and the wiring pattern are electrically connected through the blind through hole provided in the second layer. Since wiring can be performed in the lower first layer, display characteristics can be improved, which is preferable.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Next, the display device of the present invention will be described with reference to the drawings.
[0014]
1A is a perspective explanatory view of the display device of the present invention, and FIG. 1B is a partial cross-sectional explanatory view of the line BB of FIG. 1A (members denoted by reference numerals 5 and 6 are (a). (Not shown). In FIG. 1, the same parts as those in FIG. 4 are denoted by the same reference numerals, LEDs 2 are provided in a matrix on one side of the printed circuit board 1, and control components (control ICs) and drive components (control components) are provided on the other side. An IC component (control component) 3 for controlling the blinking of the LED 2 such as a drive IC) and a mounting bracket 4 are provided as in the example of FIG. The present invention is a sandwich in which a printed board 1 is provided with electrically insulating members 12 and 13 each made of a glass epoxy resin or an organic resin film such as polyimide on both sides of a heat conductive substrate such as a metal plate 11. It is characterized by its structure. As the thermally conductive substrate, for example, a metal plate with good heat conductivity such as aluminum, copper, stainless steel, silicon plywood, or a substrate with good heat conductivity such as alumina can be used. In the case where the thermally conductive substrate is made of an electrically insulating member, it is possible to use the thermally conductive substrate as it is without providing the aforementioned electrically insulating members 12 and 13 as separate materials. In FIG. 1B, reference numeral 6 denotes a screw for fixing the mounting bracket 4 of the display device to the set housing 5, and the housing 5 and the screw 6 are not shown in FIG.
[0015]
For example, the printed board 1 is manufactured as follows. First, through holes for electrical connection between the LED side and the IC side are provided in a metal plate 11 such as aluminum, and polyimide or the like is applied to the entire surface of the front and back sides and solidified to be electrically insulated on both sides. The sex members 12 and 13 are formed. Thereafter, a copper film is formed on both the front and back surfaces by vapor deposition or the like in the same manner as in the production of a normal printed circuit board, and a wiring pattern is formed by patterning each by etching.
[0016]
As an example of another manufacturing method of the printed circuit board, as shown in an exploded view of the printed circuit board 1 in FIG. 2, as the electrically insulating members 12 and 13 on both sides of the metal plate 11, for example, an electrical material such as a glass epoxy resin plate It can also be formed by attaching an insulating plate to both surfaces of the metal plate 11. In the example shown in FIG. 2, the electrically insulating member on one side is composed of two layers each composed of two insulating plates, but may be one layer each, or three or more layers.
[0017]
In the example shown in FIG. 2, for example, on the one surface side of a metal plate 11 made of aluminum having a thickness of about 0.6 to 0.7 mm, a glass epoxy resin plate having a thickness of about 0.2 to 0.3 mm is used. The first layer 12a and the second layer 12b are bonded together with an adhesive such as an epoxy resin. In addition, when connecting the wiring terminal of LED2 and the IC component 3 through the through hole of a printed circuit board, it is preferable to provide an insulating film in advance on the inner periphery of the through hole provided in the metal plate 11. On the surface of the first layer 12a of the insulating member, a wiring pattern 17 for applying a voltage to the LED 2 is formed by a copper film or the like, and each electrode terminal of the LED 2 arranged in the second layer 12b is a first one. The wiring patterns 15 and the blind through holes 16 provided on the surface of the second layer 12b are connected via a through-hole 16 (a hole penetrating only the second layer 12b, not a hole penetrating the entire printed board). Since the electrically insulating member 12 has two layers as described above, the distance between the LEDs 2 can be reduced without restricting the arrangement of the LEDs 2 due to the wiring pattern, so that a beautiful display can be achieved. Further, by using the blind through hole as described above, it is not necessary to provide many through holes in the metal plate 11, and good heat conduction can be maintained. Similarly, the electrically insulating member 13 on the IC component mounting side is also formed by the first layer 13a and the second layer 13b, and the wiring pattern 18 is provided on the surface of the first layer 13a on the second layer 13b side. The effect is obtained.
[0018]
According to the present invention, the core portion of the printed circuit board 1 is made of a heat conductive substrate such as the metal plate 11, and the heat generated in the electronic component is transmitted through the metal plate 11 and dissipated from the entire printed circuit board 1, or It efficiently dissipates from the housing 5 via the mounting bracket 4 connected to the housing 5 such as a set, and heat is not trapped in the electronic components. That is, the metal plate 11 made of aluminum or the like has a heat conductivity that is about 3 to 5 times higher than that of a conventional electrically insulating substrate made of glass epoxy or the like, and has a very good heat conductivity. Therefore, the heat generated in the electronic components such as the LED 2 and the IC component 3 is transmitted to the metal plate 11 through the thin electrical insulating members 12 and 13, and then quickly transmitted to the entire metal plate 11 to dissipate heat or be attached. It is efficiently dissipated from the housing 5 via the metal fitting 4. As a result, the operating temperature of the electronic component does not increase excessively, the power applied to the electronic component such as the LED 2 is not limited, and the operating temperature of the electronic component does not increase excessively and the operation does not become unstable. .
[0019]
On the other hand, since both surfaces of the printed circuit board 1 are covered with the electrically insulating members 12 and 13, a wiring pattern is formed by providing a copper film or the like as in the conventional printed circuit board and patterning by etching. The LED 2 and the IC component 3 are surface-mounted so as to constitute a circuit. The wiring terminal of the LED 2 is led out through a through hole provided through the metal plate 11 or led to the end of the printed circuit board 1, and drives the IC component 3 on the other surface side through the side surface of the printed circuit board 1. Connected with the circuit.
[0020]
In the display device shown in FIG. 1, the electrically insulating member 13 around the IC component 3 is removed from the entire periphery at the outer peripheral end of the surface (other surface) of the printed circuit board 1 on which the IC component 3 is provided. A mounting bracket 4 that is in contact with the exposed metal plate 11 and that is higher than the height of the IC component 3 is provided. As a result, when attached to the casing 5 or the like of the set, heat is conducted to the casing 5 via the mounting bracket 4 so that the heat conduction direction is indicated by A in FIG. The heat generated in (LED2 and IC component 3) is efficiently dissipated from the set side. Thus, it is preferable to remove the electrically insulating member 13 at the connecting portion with the mounting bracket 4 because the metals are in direct contact with each other and the thermal conductivity is not lowered. However, the electrically insulating member 13 is very thin and heat is conducted to the metal plate 11 even if the electrically insulating member 13 is not removed, and the heat conduction from the electronic component to the mounting bracket 4 is considerably improved. Also, heat can be dissipated from the entire printed circuit board 1, and the effect of heat dissipation appears.
[0021]
Further, as shown in FIG. 3 as another example of the mounting bracket 4, the mounting bracket 4 is a thin material of 1 mm or less without using a member thicker than the IC component 3 having a thickness of several mm. (It can be formed by processing of a plate-like body or mold forming such as aluminum die casting), and the portion where the electrically insulating member 13 is removed and the metal plate 11 is exposed is made partial rather than the entire periphery. You can also. That is, in the example shown in FIG. 3, the mounting bracket 4 is formed in a ring shape with a thin material, is formed high so that the protruding portion 4 c protrudes from the mounting portion with the housing, and is in contact with the metal plate 11. Therefore, a step 4b is formed. That is, the mounting portion with the housing is formed high so that the IC component 3 can escape, and the step 4b is formed to contact the exposed portion of the metal plate 11 with the insulating coating 13 partially removed. ing. By doing so, the mounting bracket 4 can be formed of a thin plate material or a small material, and the same effect can be obtained even if the portion to be removed of the electrically insulating member 13 is partial.
[0022]
【The invention's effect】
As described above, according to the display device of the present invention, since a heat conductive substrate such as a metal plate is used at least in the core portion of the printed circuit board on which electronic components such as LEDs are mounted, the electronic component mounted on the printed circuit board. Even if heat is generated, the heat can be efficiently dissipated, the operating temperature of the electronic component does not rise more than necessary, and a high-performance display device that does not lower the luminance is obtained.
[0023]
Furthermore, since the operating temperature of the electronic component does not increase excessively, the lifetime of the electronic component is extended, the failure rate is reduced, and the reliability of the electronic device is greatly improved.
[Brief description of the drawings]
FIG. 1 is a perspective explanatory view and a partial cross-sectional explanatory view of a display device of the present invention.
FIG. 2 is a diagram showing another configuration example of the printed circuit board of the display device of the present invention.
FIG. 3 is a view showing another configuration example of the mounting bracket of the display device of the present invention.
FIG. 4 is a perspective explanatory view of a display device using a conventional LED.
[Explanation of symbols]
1 Printed circuit board 2 LED
3 IC Component 4 Mounting Bracket 4b Step 4c Projection 5 Case 11 Metal Plate 12 Electrical Insulating Member 13 Electrical Insulating Member

Claims (2)

熱伝導性基板の両面に電気的絶縁性部材が設けられることにより形成されたプリント基板と、該プリント基板の一面にマトリクス状に設けられた発光素子と、前記プリント基板の他面に設けられ前記発光素子の点滅を制御する制御部品とを有し、前記プリント基板の筐体への取付側の外周端における少なくとも一部の前記電気的絶縁性部材が除去されて前記熱伝導性基板が露出され、前記プリント基板の筐体への取付側の周囲に取付金具が設けられ、該取付金具は筐体への取付部が突出するように高く形成されると共に前記電気的絶縁性部材が除去された部分に対応する部分に露出した熱伝導性基板と接触するように段差が形成されてなる表示装置。A printed circuit board formed by providing electrically insulating members on both sides of the thermally conductive substrate, a light emitting element provided in a matrix on one surface of the printed circuit board, and the other surface provided on the other surface of the printed circuit board and a control part for controlling the blinking of the light emitting element, said print at least a portion of said electrically insulating member and the thermally conductive substrate is removed at the outer peripheral edge of the mounting side of the substrate to the housing is exposed A mounting bracket is provided around the side of the printed circuit board attached to the housing, and the mounting bracket is formed high so that a mounting portion to the housing protrudes, and the electrically insulating member is removed. A display device in which a step is formed so as to be in contact with a thermally conductive substrate exposed at a portion corresponding to the portion . 前記発光素子が設けられる側の前記電気的絶縁性部材が少なくとも第１層および第２層の２層からなり、該第１層の表面に配線パターンが形成され、第２層の表面に前記発光素子が設けられ、該第２層に設けられたブラインドスルーホールを介して前記発光素子の電極端子と配線パターンとが電気的に接続されてなる請求項１記載の表示装置。  The electrically insulating member on the side where the light emitting element is provided comprises at least two layers of a first layer and a second layer, a wiring pattern is formed on the surface of the first layer, and the light emission is formed on the surface of the second layer. The display device according to claim 1, wherein an element is provided, and an electrode terminal of the light emitting element and a wiring pattern are electrically connected through a blind through hole provided in the second layer.
JP03051296A 1996-02-19 1996-02-19 Display device Expired - Fee Related JP3713088B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP03051296A JP3713088B2 (en) 1996-02-19 1996-02-19 Display device
KR1019970004874A KR100462990B1 (en) 1996-02-19 1997-02-18 Display
TW086101932A TW357276B (en) 1996-02-19 1997-02-19 Display device
US08/802,264 US6249267B1 (en) 1996-02-19 1997-02-19 Display apparatus having heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (2)

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JPH09223820A JPH09223820A (en) 1997-08-26
JP3713088B2 true JP3713088B2 (en) 2005-11-02

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KR100462990B1 (en) 2005-06-16
US6249267B1 (en) 2001-06-19
TW357276B (en) 1999-05-01
JPH09223820A (en) 1997-08-26

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