JP3692031B2 - IC socket, IC package mounting jig, and IC package mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a ZIF (Zero Insertion Force) type IC socket, an IC package mounting jig for mounting an IC package in the IC socket, and an IC for mounting an IC package in the IC socket using the IC package mounting jig. The present invention relates to a package mounting method.
[0002]
[Prior art]
Conventionally, an IC socket is used to electrically connect the wiring on the substrate and the leads of the IC package. As this IC socket, a ZIF type socket has been proposed in order to facilitate mounting of an IC package.
[0003]
For example, Japanese Utility Model Publication No. 7-49752 discloses a ZIF type IC socket including a housing, a plurality of contacts, and a cover member. In this IC socket, each contact and each lead of the IC package are pressed and contacted by pressing a cover member toward the housing from above the housing on which the IC package is placed. However, since a cover member is required, there is a drawback that the cost of the IC socket is increased.
[0004]
In order to eliminate this drawback, an IC socket that does not require a cover member is proposed in Japanese Patent Laid-Open No. 7-65920. This IC socket is a ZIF type IC socket composed of a housing and a plurality of contacts. By inserting the IC package from above with each contact greatly bent outward by a jig, the IC package Each lead is arranged at a predetermined position, and then the jig is removed, and each contact and each lead are pressed and contacted by the elastic force of each contact. However, the contact may be bent until the elastic limit of each contact is exceeded, and the contact may be plastically deformed and a sufficient contact pressure of the contact with the lead may not be obtained.
[0005]
[Problems to be solved by the invention]
In view of the above circumstances, the present invention provides an IC socket in which the contact contacts the lead with sufficient contact pressure even when the number of parts is reduced, an IC package mounting jig for mounting the IC package in the IC socket, and the IC package mounting An object of the present invention is to provide an IC package mounting method for mounting an IC package to the IC socket using a jig.
[0006]
[Means for Solving the Problems]
An IC socket of the present invention that achieves the above object comprises at least one row of contacts that contact the arranged leads of the IC package, and a housing that supports the contacts,
Each of the contacts is formed in a substantially U shape with the middle part folded back, and has a substrate connection part at one end and a contact part with the lead and a lever part that is elastically pressed at the other end. And
The housing has an IC package mounting surface and a comb-like support portion in which individual support portions that contact the upper surface of the lead are formed on each contact portion corresponding to the contact portion,
The lead is placed between the contact portion and the support portion by placing the IC package on the housing with the lever portion depressed and sliding the IC package along the IC package placement surface. And the lead | read | reed is clamped between the contact part and its support part by releasing the said lever part.
[0007]
In the IC socket of the present invention, each lead of the IC package can be positioned between the contact portion and the support portion by moving the IC package in the lateral direction. The contact may be elastically deformed as much as the contact, and the contact is less likely to be plastically deformed, and the contact can be brought into contact with the lead with sufficient contact pressure. In addition, since the lead is sandwiched between the contact portion of the contact and the support portion of the housing by releasing the pressing of the lever portion of the contact, a cover member is unnecessary even though it is a ZIF type IC socket. Thus, the number of parts can be reduced.
[0008]
In the IC socket of the present invention, it is preferable that the arm for biasing the IC package placed on the IC package placement surface upward is formed integrally with the housing.
[0009]
In this aspect, when the pressing of the lever portion of the contact is released, the IC package can be prevented from being displaced by the arm, and a more reliable contact between the contact and the lead can be obtained.
[0010]
The IC package mounting jig of the present invention that achieves the above object is a frame member having a pressing portion for pressing down the lever portion of the contact of the IC socket of the present invention, and is slidably attached to the frame member. And a drive member that slides the IC package in the arrangement direction of the contacts along the IC package mounting surface of the housing of the IC socket.
[0011]
The IC package mounting jig of the present invention can connect the IC package to the IC socket of the present invention at a low cost by ZIF connection.
[0012]
An IC package mounting method of the present invention that achieves the above object comprises at least one row of contacts that contact the arranged leads of the IC package, and a housing that supports the contacts, each of the contacts being an intermediate The part is folded back so that the whole is formed in a substantially U shape, and has a substrate connecting part at one end, a contact part with the lead at the other end, and a lever part that is elastically pressed, and the housing An IC package mounting surface and a comb-like support portion formed with individual support portions on each contact portion that contact the upper surface of the lead corresponding to the contact portion, and the lever portion is pushed down In this state, the IC package is placed on the housing, and the IC package is slid along the IC package placement surface to thereby place the IC package between the contact portion and the support portion. An IC socket that holds the lead between the contact portion and the support portion by releasing the lever portion, and a frame member having a pressing portion that pushes down the lever portion, and the frame member The IC package is mounted by using an IC package mounting jig that is slidably mounted and includes a driving member that slides the IC package along the IC package mounting surface in the contact arrangement direction. A method,
The IC package is disposed on the IC package mounting surface of the IC socket housing such that the lead of the IC package is disposed between adjacent support portions of the comb-shaped support portion of the housing of the IC socket;
The IC package mounting jig is placed on the IC socket, and the lever part of the contact of the IC socket is pushed down by the frame member of the IC package mounting jig.
The IC package is slid in the contact direction of the IC socket by the driving member of the IC package mounting jig so that the lead is disposed between the contact portion and the support portion of the contact of the IC socket,
The lever portion is released by removing the IC package mounting jig from the IC socket.
[0013]
In the IC package mounting method of the present invention, the IC package can be easily ZIF-connected to the IC socket of the present invention using the IC package mounting jig without applying excessive stress to the contacts. .
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described.
[0015]
First, an embodiment of an IC socket of the present invention will be described with reference to FIGS.
[0016]
1 is a plan view of the IC socket according to the present embodiment, FIG. 2 is a bottom view of the IC socket according to the present embodiment, FIG. 3 is a cross-sectional view taken along the line AA of the IC socket shown in FIG. It is sectional drawing of the longitudinal direction of the housing which comprises the IC socket of embodiment.
[0017]
The IC socket 1 includes a housing 10 and a plurality of contacts 11 arranged on both sides of the housing 10. The housing 10 supports a plurality of contacts 11, and includes a mounting surface 101 on which an IC package (not shown) is mounted, a comb-like support portion 102, and a reverse insertion prevention portion 103. .
[0018]
The mounting surface 101 is a surface having a shape determined according to the IC package to be mounted, and has a rectangular outer shape in the present embodiment. Here, as will be described later, when the IC package is mounted in the IC socket 1, it is necessary to move the IC package in the direction of the arrow shown in FIG. 1 (the arrangement direction of the contacts 11 on both sides). . That is, the right side of FIG. 1 is the upstream side in the movement direction of the IC package, and the left side is the downstream side. In moving the IC package, the IC package is slid on the mounting surface 101. Therefore, the mounting surface 101 has a dimension longer than that of the IC package by the movement distance of the IC package in the direction of the arrow in FIG. In addition, two arm portions 1011 and 1012 are provided on the mounting surface 101. Each of these arm portions 1011 and 1012 is integrally formed with the housing 10 so as to extend from the center portion of the placement surface 101 toward the end portion of the placement surface 101 along the arrangement of the contacts 11. Thus, the IC package placed on the placement surface 101 is urged upward. Further, a protruding portion 1012a is provided at the tip of the right arm portion 1012 in FIG. 1 that is located upstream of the two arm portions 1011 and 1012 in the moving direction of the IC package. The protruding portion 1012a has a detent function for the IC package moved to a predetermined position. Further, guide walls 1013 are erected on both sides of the mounting surface 101, and the IC package is guided by these guide walls 1013 and moved.
[0019]
The comb-shaped support portions 102 are provided on both sides of the housing 10 and include a plurality of support portions 1021 protruding in a comb shape. That is, the adjacent support portions 1021 are provided along the contact arrangement direction with an interval greater than the width of each lead of the IC package.
[0020]
The reverse insertion preventing portion 103 is two projecting portions provided on the end wall on the downstream side in the moving direction of the IC package. The reverse insertion prevention unit 103 is for preventing the IC package from being placed in the reverse direction when the IC package is placed on the placement surface 101.
[0021]
Next, the contact 11 will be described using FIG. 5 together with FIGS.
[0022]
FIG. 5 is a view showing the contact before being attached to the housing.
[0023]
The contact 11 is formed by punching a metal plate having conductivity and elasticity and bending it into a shape shown in FIG. That is, the contact 11 has a tine portion 111 connected to the substrate at one end and a lever portion 112 that is elastically pressed at the other end, and the lever portion 112 is positioned above the tine portion 111 provided at one end. Thus, it has a shape that is bent at an intermediate portion. In addition, a contact portion 113 that contacts the lead of the IC package is provided between the lever portion 112 and the intermediate portion of the contact 11, and a plurality of press-fitting protrusions 114 are provided between the tine portion 111 and the intermediate portion. It has been. Note that the portion of the contact 11 where these press-fitting protrusions 114 are provided is wider than the other portions. Such a contact 11 is attached in the contact accommodating chamber 104 of the housing 10 so that the upper surface of the contact portion 113 contacts the lower surface of the protruding end of the support portion 1021. In this attachment, the lever portion 112 of the contact 11 having the shape shown in FIG. 5 is attached by being pressed and deformed so as to be closer to the tine portion 111. Therefore, as shown in FIG. 3, the contact 11 attached to the housing 10 has a substantially U-shape as a whole, and the contact portion 113 is pressed against the support portion 1021 of the housing 10 to urge upward. Has a load. Further, with respect to the IC package moving direction (the arrow direction in FIG. 1), each support portion 1021 protrudes downstream of the IC package moving direction from each arranged contact 11. As shown in FIG. 2, the contacts 11 are fixed in the contact accommodating chamber 104 by press-fitting a plurality of press fitting protrusions 114 into the inner wall of the contact accommodating chamber 104 of the housing 10.
[0024]
As described above, the IC socket 1 of the present embodiment does not include a cover member that presses and contacts each contact 11 and each lead of the IC package, and thus can achieve a reduction in height and cost. .
[0025]
Subsequently, an embodiment of the IC package mounting jig of the present invention will be described with reference to FIGS.
[0026]
6 is a plan view of the IC package mounting jig of the present embodiment, FIG. 7 is a cross-sectional view of the IC package mounting jig shown in FIG. 6 taken along the line B-B, and FIG. 8 is an IC package mounting jig shown in FIG. It is CC sectional drawing of a tool.
[0027]
The IC package mounting jig 2 according to the present embodiment is used when mounting the IC package on the IC socket 1 described above, and is arranged from above on the IC socket 1 on which the IC package is mounted on the mounting surface 101. Is done. Such an IC package mounting jig 2 includes a driving member 21, a frame member 22, and two connecting pins 23.
[0028]
The drive member 21 is slidably connected to the frame member 22 by two connection pins 23, and has two long holes 211, a grip portion 212, and a contact portion 213 (see FIG. 7). The drive member 21 is slid in the direction of the arrow in FIGS. 6 and 7 when the IC package is mounted on the IC socket 1. The IC package mounting jig 2 shown in each of FIGS. 6 and 7 is in a state where the drive member 21 is slid to the slide end position. The long hole 211 is a hole long in the sliding direction provided at each of the upstream and downstream ends of the driving member in the sliding direction (arrow direction in FIGS. 6 and 7). A connecting pin 23 is inserted into 211. The grip portion 212 is formed by raising the center portion of the drive member 21 in the sliding direction, and is gripped when the drive member 21 is slid. The abutting portion 213 shown in FIG. 7 abuts on the end of the IC package placed on the placing surface 101 of the IC socket 1 on the upstream side in the sliding direction (right side in FIG. 7). By sliding the driving member 21, the IC package is pushed by the contact portion 213 and slides on the mounting surface 101.
[0029]
The frame member 22 surrounds the periphery of the IC socket 1 on which the IC package is placed, and has a pressing portion 221 for pressing the lever portion 112 of the contact 11. The pressing portions 221 are provided on both sides of the frame member 22 and extend in the sliding direction, and are protrusions protruding so as to face each other. Each lever portion 112 of the IC socket 1 in which the IC package mounting jig 2 is disposed from above is pressed down elastically toward the tine portion 111 by the lower surface of the protruding end of the pressing portion 221. Further, the frame member 22 includes two stoppers 222 that stop the driving member 21 from sliding. These stoppers 222 are provided at the end on the downstream side in the sliding direction, and prevent further sliding of the driving member 21 by contacting the sliding driving member 21.
[0030]
Finally, an embodiment of the IC package mounting method of the present invention will be described with reference to FIGS.
[0031]
FIG. 9 is a diagram showing a state in which the IC package is mounted on the IC socket using the IC package mounting jig, and FIG. 10 is a process diagram showing the IC package mounting method of the present embodiment.
[0032]
The present embodiment is an IC package mounting method for mounting an IC package to the above-described IC socket 1 using the above-described IC package mounting jig 2. FIG. 9 shows an IC package 90 having a plurality of leads 91.
[0033]
First, the IC package 90 is mounted on the mounting surface 101 of the IC socket 1 so that the leads 91 of the IC package 90 are positioned between the adjacent support portions 1021 (step (a) in FIG. 10). Subsequently, the IC package mounting jig 2 is disposed from above on the IC socket 1 on which the IC package 90 is placed (step (b) in FIG. 10). The IC socket 1 in which the IC package mounting jig 2 is arranged is surrounded by a frame member 22, and the lever portion 112 of each contact 11 is elastically pressed toward the tine portion 111 by the pressing portion 221. At this time, the operator may press down the frame member 22 in order to press down the lever portion 112 with certainty. Then, the contact portion 113 (see FIG. 3) of each contact 11 that has been in press contact with each support portion 1021 is displaced downward, and each contact portion 113 is separated from each support portion 1021. In the state where the IC package mounting jig 2 is arranged, the arms 1011 and 1012 are once lowered downward. Subsequently, the driving member 21 is slid in the arrangement direction of the contacts 11 (step (c) in FIG. 10). Then, the IC package 90 placed on the placement surface 101 of the IC socket 1 is pushed by the contact portion 213 and slides on the placement surface 101 while being guided by the guide wall 1013. The drive member 21 is slid until the connecting pin 23 contacts the upstream end of the long hole 211 in the sliding direction and contacts the stopper 222 of the frame member 22. Then, each lead 91 of the IC package 90 is positioned between each contact portion 113 and each support portion 1021, and each contact 11 and each lead 91 can be ZIF-connected. FIG. 9 is a diagram showing this state. Finally, the IC package mounting jig 2 is removed from the IC socket 1 (step (d) in FIG. 10). Then, the lever portion 112 of each contact 11 that has been pressed by the pressing portion 221 of the IC package mounting jig 2 rises upward by the elastic force of the contact 11 itself, and each contact 11 has a shape before being pressed by the pressing portion 221. Return to. As a result, the upper surface of each lead 91 of the IC package 90 is pressed against each support portion 1021 by each contact portion 113, and each contact portion 113 presses and contacts the lower surface of each lead 91. The lead of the IC package is usually only plated with tin or nickel, and an oxide is likely to be generated on the surface during long-term use. This oxide causes poor contact between the lead 91 and the contact 11. Prone to problems. However, in the present embodiment, the contact 11 having a shape as shown in FIG. 5 is pressed and attached to the contact accommodating chamber 104 of the housing 10, that is, the contact 11 is accommodated in a preloaded state. Since the contact 11 is accommodated in the chamber 104, the contact 11 comes into contact with the lead 91 with a sufficient contact pressure, and the problem of poor contact due to oxide generated in the lead does not occur. Further, the arms 1011 and 1012 which have been lowered when the IC package mounting jig 2 is arranged in the IC socket 1 are arranged so that the IC package 90 is moved upward when the IC package mounting jig 2 is removed from the IC socket 1. These arms 1011 and 1012 prevent the IC package from being displaced.
[0034]
As described above, the IC socket 1 according to the present embodiment moves the IC package 90 in the arrangement direction of the contacts 11, so that each lead 91 of the IC package 90 is connected to each contact portion 113 and each support portion 1021. Since the contact 11 can be positioned between them, the contact 11 only needs to be elastically deformed by the thickness of the lead 91. The contact 11 is less likely to be plastically deformed, and the contact reliability can be improved and the IC package 90 can be improved. Can withstand multiple installations. Further, the IC package mounting jig 2 of the present embodiment does not apply excessive stress to the contact 11 when mounting the IC package 90 on the IC socket 1, and the contact 11 and the lead 91 can be connected with a simple structure. ZIF connection is possible. Furthermore, the IC package mounting method of the present embodiment does not apply excessive stress to the contact 11 and can make the ZIF connection between the contact 11 and the lead 91 at a low cost.
[0035]
【The invention's effect】
As described above, according to the present invention, even if the number of parts is reduced, an IC socket in which the contact contacts the lead with sufficient contact pressure, an IC package mounting jig for mounting the IC package in the IC socket, and An IC package mounting method for mounting an IC package in the IC socket using the IC package mounting jig can be provided.
[Brief description of the drawings]
FIG. 1 is a plan view of an IC socket according to an embodiment.
FIG. 2 is a bottom view of the IC socket of the present embodiment.
FIG. 3 is a cross-sectional view of the IC socket shown in FIG. 1 taken along line AA.
FIG. 4 is a longitudinal sectional view of a housing constituting the IC socket of the present embodiment.
FIG. 5 is a view showing a contact before being attached to a housing.
FIG. 6 is a plan view of an IC package mounting jig according to the present embodiment.
7 is a BB cross-sectional view of the IC package mounting jig shown in FIG. 6;
8 is a cross-sectional view of the IC package mounting jig shown in FIG. 6 taken along the line CC.
FIG. 9 is a diagram showing a state where an IC package is mounted on an IC socket using an IC package mounting jig.
FIG. 10 is a process chart showing the IC package mounting method of the present embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 IC socket 10 Housing 101 Mounting surface 1011 and 1012 Arm part 1012a Projection part 1013 Guide wall 102 Comb-like support part 1021 Support part 103 Reverse insertion prevention part 11 Contact 111 Tine part 112 Lever part 113 Contact part 114 Press-fit protrusion 2 IC package mounting jig 21 Driving member 211 Long hole 212 Holding part 213 Abutting part 22 Frame member 221 Pressing part 222 Stopper 23 Connecting pin 90 IC package 91 Lead

Claims (4)

Comprising at least one row of contacts in contact with the arranged leads of the IC package, and a housing supporting the contacts;
Each of the contacts is formed in a substantially U shape with the intermediate part folded back, and has a substrate connection part at one end and a contact part with the lead and a lever part that is elastically pressed at the other end. And
The housing includes an IC package mounting surface, and comb-shaped support portions each having an individual support portion that contacts the upper surface of the lead on each contact portion corresponding to the contact portion;
The lead is placed between the contact portion and the support portion by placing the IC package on the housing with the lever portion depressed and sliding the IC package along the IC package placement surface. And an IC socket for holding the lead between the contact portion and the support portion by releasing the lever portion. 2. The IC socket according to claim 1, wherein an arm for urging upward the IC package placed on the IC package placement surface is formed integrally with the housing. A frame member having a pressing portion for pressing down the lever portion of the contact of the IC socket according to claim 1, and a slidably attached to the frame member, wherein the IC package is disposed along the IC package mounting surface of the housing of the IC socket. And an IC package mounting jig comprising a drive member that slides in the contact arrangement direction. And at least one row of contacts in contact with the arranged leads of the IC package, and a housing for supporting the contacts. Each of the contacts is formed in a substantially U shape by folding an intermediate portion. The other end has a contact portion with the lead and a lever portion that is elastically pressed, and the housing has an IC package mounting surface and each contact corresponding to the contact portion. A comb-like support portion formed with individual support portions on which the upper surfaces of the leads come into contact, and the IC package is placed on the housing in a state where the lever portion is pushed down. The lead is disposed between the contact portion and the support portion by sliding along the IC package mounting surface, and the contact portion and the support portion are released by releasing the lever portion. A frame member having a pressing portion for pressing down the lever portion, and a slidable attachment to the frame member, and the IC package along the IC package mounting surface. An IC package mounting method for mounting an IC package using an IC package mounting jig comprising a driving member that slides in the contact arrangement direction,
The IC package is disposed on the IC package mounting surface of the IC socket housing such that the lead of the IC package is disposed between adjacent support portions of the comb-shaped support portion of the housing of the IC socket;
The IC package mounting jig is disposed on the IC socket, and the lever part of the contact of the IC socket is pushed down by the frame member of the IC package mounting jig,
The IC package is slid in the arrangement direction of the contact of the IC socket by the driving member of the IC package mounting jig so that the lead is disposed between the contact portion and the support portion of the contact of the IC socket,
An IC package mounting method for releasing the lever portion by removing the IC package mounting jig from the IC socket.

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