JP3691441B2 - Rack mount cooling device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a rack mount type cooling device accommodated in a rack in which a heat generating load such as an electronic device is accommodated.
[0002]
[Prior art and problems to be solved by the invention]
In a room where multiple racks containing electronic devices such as data centers are installed, a cooling device that cools the heat generated from the electronic devices is installed indoors, so the rack with particularly high heat generation density has insufficient cooling capacity. There is a case.
In addition, since the conventional cooling device is installed in indoor units, it has not been possible to effectively cool electronic devices that generate a large amount of heat in the same rack.
[0003]
The present invention has been made in view of such circumstances, and is a rack mount type capable of individually cooling racks having a high heat generation density and effectively cooling electronic devices having a high heat generation amount. An object is to provide a cooling device.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the invention described in claim 1 is a rack mount type cooling apparatus in which the entire apparatus is accommodated in a rack in which electronic equipment as a heat generating load is accommodated, wherein the cooling apparatus includes: A cooling unit for cooling the intake air, a heat dissipating unit for releasing heat generated when the intake air is cooled in the cooling unit, an external exhaust duct for discharging warm air released from the heat dissipating unit to the outside of the device, and the external And an internal exhaust duct that is formed so as to communicate with the exhaust duct and guides the warm air discharged from the heat radiating portion to the external exhaust duct by a part of the intake air.
[0005]
The invention according to claim 2 is characterized in that, in the rack mount cooling device according to claim 1, the cooling unit and the heat radiating unit are integrated, and the entire device is unitized.
[0006]
According to a third aspect of the present invention, in the rack mount type cooling device according to the first or second aspect, an air flow that adjusts one or both directions of suction air and cooling air to the outside of the device main body. It has a guide.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The structure of the rack mount type cooling device according to the embodiment of the present invention is shown in FIGS. FIG. 1 is a plan view of a rack mount type cooling device according to an embodiment of the present invention, and FIG. 2 is a front view thereof.
[0008]
In these drawings, a rack mount type cooling device (hereinafter simply referred to as a cooling device) 1 according to an embodiment of the present invention includes cooling units 10A and 10B that cool intake air, and suction air in the cooling units 10A and 10B. Are formed so as to communicate with the external exhaust duct 18 and the external exhaust duct 18 for discharging the heat generated from the heat dissipation sections 12A and 12B to the outside of the apparatus. The internal exhaust duct 16 that guides the warm air released from the heat radiating portions 12A and 12B to the external exhaust duct 18 by a part of the intake air and the power supply unit 14 are formed as a unit. . The power source unit 14 is a power source for driving the cooling units 10A and 10B and the heat radiation units 12A and 12B.
[0009]
The cooling device 1 is used by housing the entire device in a rack in which an electronic device as a heat generation load is housed. FIG. 3 shows a state in which the cooling device 1 is accommodated in the rack 20. As shown in the figure, in the rack 20, electronic devices 30A, 30B, and 30C serving as heat generation loads are accommodated, and the cooling device 1 is accommodated below these electronic devices. A plurality of ventilation fans 22, 24, 26, and 28 are attached to the ceiling of the rack 20.
[0010]
In FIG. 1 to FIG. 3, by driving the ventilation fans 22, 24, 26, 28, the air sucked from the lower part of the rack 20 is cooled by the cooling units 10 </ b> A, 10 </ b> B in the cooling device 1. The air cools the heat radiation generated in the electronic devices 30A, 30B, and 30C stored in the rack 20 above the cooling device 1. Then, by cooling this heat radiation, it passes toward the ventilation fans 22, 24, 26 and 28, is discharged by the ventilation fans 22, 24, 26 and 28, and is discharged to the outside of the rack 20.
[0011]
Further, the warm air discharged from the heat radiating units 12A and 12B during the cooling by the cooling units 10A and 10B is guided to the internal exhaust duct 16 by the air flow caused by a part of the air sucked into the cooling device 1 and passes through the external exhaust duct 18. Then, the air is discharged by the ventilation fans 22, 24, 26 and 28 and discharged to the outside of the rack 20.
FIG. 4 shows a configuration in which a plurality of cooling devices 1 are mounted in the rack 20 in order to increase the cooling capacity in the rack 20.
[0012]
In FIG. 4, the cooling device 1 </ b> A is installed below the electronic devices 30 </ b> A and 30 </ b> B that are heat loads in the rack 20, and the cooling device 1 </ b> B is installed below the electronic devices 30 </ b> C and 30 </ b> D that are heat loads. 18A and 18B are external exhaust ducts. The configuration of the cooling device 1A and the cooling device 1B is the same as that of the cooling device 1 shown in FIGS. The same components as those in FIG. 3 are denoted by the same reference numerals.
[0013]
Thus, by increasing the number of unitized cooling devices mounted in the rack 20, it is possible to easily increase the cooling capacity in the rack in which a thermal load such as an electronic device is stored.
In addition, a specific electronic device can be effectively cooled by installing a cooling device directly under the electronic device that generates a large amount of heat.
[0014]
FIG. 5 shows an example in which an airflow guide is provided in the cooling device 1 installed between the heat generating load 30A and the heat generating load 30B in the rack. As shown in the figure, the suction body introduced into the cooling device 1 by providing the air flow guides 100A and 100B composed of a plurality of guide plates 100 provided on the upper surface and the bottom surface of the cooling device 1 so that the angle can be adjusted respectively. The direction of the air and the cooling air discharged from the cooling device 1 can be adjusted, and specific portions of the heat generating load 30A and the heat generating load 30B can be effectively cooled.
[0015]
FIG. 6 shows a state in which the cooling device is attached to the rack. As shown in FIG. 6, the cooling device 1 is attached to rack mounting brackets 200A, 200B, 200C, and 200D that are attached to a rack by screws 202, and is attached to frames 300A, 300B, 300C, and 300D that are attached to the rack. It is attached by a screw 302. 6A is a front view, and FIG. 6B is a plan view.
[0016]
As described above, according to the rack mount type cooling device according to the present embodiment, the cooling device itself is cooled by the air sucked in the rack. Can be stored in a rack.
In addition, since the entire apparatus can be stored in the rack, it is possible to individually cool a rack having a high heat generation density, in which the existing air conditioning equipment has insufficient cooling capacity.
[0017]
Further, the cooling capacity can be easily improved by increasing the number of cooling devices mounted in the rack.
In addition, by installing a cooling device directly under a device (heat load) that generates a large amount of heat in the rack, the device can be effectively cooled.
[0018]
【The invention's effect】
The invention according to claim 1 is a rack mount type cooling device in which the entire apparatus is accommodated in a rack in which an electronic device as a heat generating load is accommodated, and the cooling device includes a cooling unit that cools intake air; A heat dissipating part for releasing heat generated when cooling the intake air in the cooling part, an external exhaust duct for discharging warm air discharged from the heat dissipating part to the outside of the apparatus, and a communication with the external exhaust duct. And an internal exhaust duct that guides the warm air discharged from the heat radiating portion to the external exhaust duct by a part of the intake air.
[0019]
The invention according to claim 2 is characterized in that, in the rack mount type cooling device according to claim 1, the cooling unit and the heat radiating unit are integrated, and the entire device is unitized.
Therefore, it is possible to individually cool a rack with a high heat generation density that the existing air conditioning equipment has insufficient cooling capacity.
[0020]
Further, the cooling capacity can be easily improved by increasing the number of cooling devices mounted in the rack.
In addition, by installing a cooling device directly under a device (heat load) that generates a large amount of heat in the rack, the device can be effectively cooled.
[0021]
According to a third aspect of the present invention, in the rack mount type cooling device according to the first or second aspect, an air flow that adjusts the direction of one or both of the intake air and the cooling air to the outside of the device main body. Since it has a guide, the specific site | part of a heat load can be cooled effectively.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a rack mount type cooling apparatus according to an embodiment of the present invention.
FIG. 2 is a front view showing a configuration of a rack mount type cooling apparatus according to an embodiment of the present invention.
FIG. 3 is an explanatory view showing a state in which the rack mount type cooling device according to the embodiment of the present invention is housed in the rack.
FIG. 4 is an explanatory view showing a state in which a plurality of rack mount cooling devices according to the embodiment of the present invention are housed in a rack.
FIG. 5 is an explanatory diagram showing a configuration example in which an airflow guide is provided in the cooling device main body of the rack mount cooling device according to the embodiment of the present invention.
FIGS. 6A and 6B are a front view and a plan view showing a state in which the rack mount type cooling device according to the embodiment of the present invention is mounted in the rack. FIGS.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 1A, 1B ... Rack mount type cooling device 10A, 10B ... Cooling part 12A, 12B ... Radiating part 14 ... Power supply part 16 ... Internal exhaust duct 18 ... External exhaust duct 20 ... Racks 22-28 ... Ventilation fans 30A-30D ... Electronic equipment (heating load)

Claims (3)

A rack mount type cooling device in which the entire apparatus is housed in a rack in which electronic equipment as a heat generation load is housed,
The cooling device includes a cooling unit that cools the intake air, a heat radiating unit that releases heat generated when the suction air is cooled in the cooling unit, and an external exhaust that discharges warm air discharged from the heat radiating unit to the outside of the device. A rack mount comprising: a duct; and an internal exhaust duct that is formed so as to communicate with the external exhaust duct and that guides warm air discharged from the heat radiating portion to the external exhaust duct by a part of the intake air. Cooling device. The rack mount type cooling device according to claim 1, wherein the cooling unit and the heat radiating unit are integrated, and the entire device is unitized. 3. The rack mount type cooling apparatus according to claim 1, further comprising an airflow guide that adjusts one or both directions of suction air and cooling air outside the apparatus main body.

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