JP3477367B2 - Anisotropic conductive adhesive film - Google Patents
Anisotropic conductive adhesive filmInfo
- Publication number
- JP3477367B2 JP3477367B2 JP12839798A JP12839798A JP3477367B2 JP 3477367 B2 JP3477367 B2 JP 3477367B2 JP 12839798 A JP12839798 A JP 12839798A JP 12839798 A JP12839798 A JP 12839798A JP 3477367 B2 JP3477367 B2 JP 3477367B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- adhesive film
- particles
- conductive adhesive
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、液晶表示
装置（ＬＣＤ）と回路基板との間の電気的な接続に用い
られる異方導電性接着フィルムに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive adhesive film used for electrical connection between a liquid crystal display device (LCD) and a circuit board, for example.
【０００２】[0002]
【従来の技術】従来より、例えば、液晶表示装置と集積
回路基板等を接続する手段として、異方導電性接着フィ
ルムが用いられている。この異方導電性接着フィルム
は、例えば、ＴＣＰ(Tape Carieer Package)やＩＣチッ
プの接続電極と、ＬＣＤパネルのガラス基板上に形成さ
れたＩＴＯ(Indium Tin Oxide)電極とを接続する場合を
始めとして、種々の端子間を接着するとともに電気的に
接続する場合に用いられている。2. Description of the Related Art Conventionally, an anisotropic conductive adhesive film has been used as a means for connecting a liquid crystal display device to an integrated circuit board or the like. This anisotropic conductive adhesive film is used, for example, when connecting a connection electrode of TCP (Tape Carieer Package) or IC chip and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. It is used when various terminals are bonded and electrically connected.
【０００３】従来、異方導電性接着フィルムの絶縁性接
着剤（バインダー）には、例えば、ビスフェノールＡ型
エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、フェ
ノキシ樹脂、ナフタレン型エポキシ樹脂、ノボラック型
エポキシ樹脂等のエポキシ樹脂を、イミダゾール系の硬
化剤で熱硬化させる熱硬化性樹脂が広く用いられてい
る。Conventionally, as the insulating adhesive (binder) of the anisotropic conductive adhesive film, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenoxy resin, naphthalene type epoxy resin, novolac type epoxy resin, etc. are used. A thermosetting resin that heat-cures an epoxy resin with an imidazole-based curing agent is widely used.
【０００４】[0004]
【発明が解決しようとする課題】ところで、上述した従
来のバインダーの場合、高温時における信頼性及び被着
体との間の接着強度を確保するため、ガラス転移温度
(Ｔｇ)が高く、しかも硬化時の弾性率が大きい材料が用
いられている。By the way, in the case of the above-mentioned conventional binder, in order to secure the reliability at high temperature and the adhesive strength between the adherend and the glass transition temperature,
A material having a high (Tg) and a large elastic modulus upon curing is used.
【０００５】しかしながら、このような従来の異方導電
性接着フィルムにおいて外部応力に起因する力がバイン
ダーに加わった場合には、バインダーの被着体との界面
部分に大きな内部応力が発生し、これにより異方導電性
接着フィルムの見かけ上の接着強度（実効接着力）が低
下するという問題があった。However, in such a conventional anisotropically conductive adhesive film, when a force due to external stress is applied to the binder, a large internal stress is generated at the interface between the binder and the adherend, Therefore, there is a problem that the apparent adhesive strength (effective adhesive strength) of the anisotropic conductive adhesive film is reduced.
【０００６】本発明は、このような従来の技術の課題を
解決するためになされたもので、バインダーについてガ
ラス転移温度を低下させることなく接着剤としての実効
接着力を向上しうる異方導電性接着フィルムを提供する
ことを目的とする。The present invention has been made in order to solve the above-mentioned problems of the prior art, and is an anisotropic conductive material which can improve the effective adhesive force as an adhesive without lowering the glass transition temperature of the binder. The purpose is to provide an adhesive film.
【０００７】[0007]
【課題を解決するための手段】本発明者等は、上記目的
を達成するために鋭意研究を重ねた結果、バインダー中
に特定のゴム系の弾性粒子を添加することによって当該
バインダーに生ずる内部応力を低減しうることを見い出
し、本発明を完成するに至った。Means for Solving the Problems As a result of intensive studies to achieve the above object, the present inventors have found that the internal stress generated in the binder by adding specific rubber-based elastic particles to the binder. It has been found that the above can be reduced, and the present invention has been completed.
【０００８】かかる知見に基づいてなされた請求項１記
載の発明は、絶縁性接着剤中に導電粒子を分散してなる
異方導電性接着フィルムであって、上記絶縁性接着剤中
にゴム系の弾性材料からなる応力吸収粒子が分散され、
上記応力吸収粒子の弾性率が、１×１０ 9 〜１×１０ 10 d
yn/cm 2 であり、かつ、上記応力吸収粒子のガラス転移温
度が、８０〜１２０℃であることを特徴とする。The invention according to claim 1 made on the basis of such findings is an anisotropic conductive adhesive film in which conductive particles are dispersed in an insulating adhesive, wherein the insulating adhesive is a rubber-based adhesive film. The stress absorbing particles made of elastic material are dispersed ,
The elastic modulus of the stress absorbing particles is 1 × 10 9 to 1 × 10 10 d
yn / cm 2 and the glass transition temperature of the stress absorbing particles
Degrees, wherein the 80 to 120 ° C. der Rukoto.
【０００９】請求項１記載の発明にあっては、外部応力
に起因する力が絶縁性接着剤に加わった場合に、この応
力吸収粒子が大きく弾性変形することによって、絶縁性
接着剤の被着体との界面部分に生ずる内部応力が吸収さ
れ、絶縁性接着剤全体としての弾性率が低下する。その
結果、本発明によれば、絶縁性接着剤のガラス転移温度
を下げることなく、接着剤としての実効接着力を向上さ
せることが可能になる。特に、本発明においては、応力
吸収粒子の弾性率が、１×１０ 9 〜１×１０ 10 dyn/cm 2 で
あることから、保持力を低下させることなく、絶縁性接
着剤樹脂の内部応力を十分に小さくすることができる。
また、応力吸収粒子のガラス転移温度が、８０〜１２０
℃であることから、耐熱性を低下させることなく絶縁性
接着剤樹脂に生ずる内部応力を十分に小さくすることで
きる。 According to the first aspect of the invention, when a force resulting from external stress is applied to the insulating adhesive, the stress absorbing particles are largely elastically deformed, so that the insulating adhesive is adhered. Internal stress generated at the interface with the body is absorbed, and the elastic modulus of the insulating adhesive as a whole decreases. As a result, according to the present invention, it is possible to improve the effective adhesive force as an adhesive without lowering the glass transition temperature of the insulating adhesive. In particular, in the present invention, stress
Modulus of the absorbent particles, at 1 × 10 9 ~1 × 10 10 dyn / cm 2
Therefore, the insulating contact is maintained without decreasing the holding power.
It is possible to sufficiently reduce the internal stress of the binder resin.
Further, the glass transition temperature of the stress absorbing particles is 80 to 120.
Since it is ℃, it has an insulating property without lowering the heat resistance.
By sufficiently reducing the internal stress generated in the adhesive resin
Wear.
【００１０】一方、請求項２記載の発明は、請求項１記
載の発明において、応力吸収粒子の弾性率が、硬化後の
絶縁性接着剤の弾性率より小さいことを特徴とする。On the other hand, the invention of claim 2 is characterized in that, in the invention of claim 1, the elastic modulus of the stress absorbing particles is smaller than the elastic modulus of the insulating adhesive after curing.
【００１１】また、請求項３記載の発明は、請求項１又
は２のいずれか１項記載の発明において、応力吸収粒子
の平均粒径が、導電粒子の平均粒径より小さいことを特
徴とする。The invention according to claim 3 is characterized in that, in the invention according to any one of claims 1 and 2, the average particle diameter of the stress absorbing particles is smaller than the average particle diameter of the conductive particles. .
【００１２】請求項３記載の発明によれば、異方導電性
接着フィルムを圧着する際に、接続電極に対して導電粒
子をより確実に接続させることが可能になる。According to the third aspect of the present invention, the conductive particles can be more reliably connected to the connection electrode when the anisotropic conductive adhesive film is pressure-bonded.
【００１３】さらに、請求項４記載の発明は、請求項１
乃至３のいずれか１項記載の発明において、絶縁性接着
剤中への応力吸収粒子の添加量が０．５〜３０重量％で
あることを特徴とする。Further, the invention according to claim 4 is the same as claim 1.
The invention according to any one of items 1 to 3, wherein the amount of the stress absorbing particles added to the insulating adhesive is 0.5 to 30% by weight.
【００１４】さらにまた、請求項５記載の発明は、請求
項１乃至４のいずれか１項記載の発明において、応力吸
収粒子が架橋ポリブタジエンを主体とする材料からなる
ものであることを特徴とする。Furthermore, the invention according to claim 5 is characterized in that, in the invention according to any one of claims 1 to 4, the stress absorbing particles are made of a material mainly composed of crosslinked polybutadiene. .
【００１５】加えて、請求項６記載の発明は、請求項１
乃至５のいずれか１項記載の発明において、応力吸収粒
子が、低ガラス転移温度の核材の表面に高ガラス転移温
度の表面層を形成したものであることを特徴とする。In addition, the invention of claim 6 is the same as that of claim 1.
The invention according to any one of items 1 to 5 is characterized in that the stress absorbing particles are obtained by forming a surface layer having a high glass transition temperature on the surface of a core material having a low glass transition temperature.
【００１６】請求項５又は６記載の発明によれば、応力
吸収粒子の弾性率を容易に小さくすることができるた
め、絶縁性接着剤樹脂の内部応力を一層小さくすること
ができ、接着剤としての実効接着力をより向上させるこ
とができる。According to the invention of claim 5 or 6, since the elastic modulus of the stress absorbing particles can be easily reduced, the internal stress of the insulating adhesive resin can be further reduced, and the adhesive can be used as an adhesive. The effective adhesive force of can be further improved.
【００１７】特に、請求項６記載の発明のように、応力
吸収粒子として低ガラス転移温度の核材の表面に高ガラ
ス転移温度の表面層を形成したものを用いれば、表面層
のガラス転移温度が絶縁性接着剤樹脂のガラス転移温度
に近くなり絶縁性接着剤樹脂との密着性が向上する。In particular, as in the invention described in claim 6, when the stress absorbing particles having a surface layer having a high glass transition temperature formed on the surface of the core material having a low glass transition temperature are used, the glass transition temperature of the surface layer is used. Becomes close to the glass transition temperature of the insulating adhesive resin, and the adhesiveness with the insulating adhesive resin is improved.
【００１８】一方、応力吸収粒子の内部は低ガラス転移
温度のもので弾性率がより小さいため、絶縁性接着剤樹
脂の内部応力を確実に吸収してこれを一層小さくするこ
とができる。しかも、本発明によれば、環境変化によっ
て生ずる応力をも吸収することができるため、長期にわ
たって導通信頼性及び接続信頼性を確保することが可能
になる。On the other hand, since the inside of the stress absorbing particles has a low glass transition temperature and a smaller elastic modulus, it is possible to reliably absorb the internal stress of the insulating adhesive resin and further reduce it. Moreover, according to the present invention, the stress caused by the environmental change can be absorbed, so that it becomes possible to secure the conduction reliability and the connection reliability for a long period of time.
【００１９】[0019]
【発明の実施の形態】以下、本発明に係る異方導電性接
着フィルムの実施の形態を図面を参照して詳細に説明す
る。図１（ａ）〜（ｃ）は、本発明に係る異方導電性接
着フィルムの好ましい実施の形態を示すもので、図１
（ａ）は、熱圧着前の状態を示す構成図、図１（ｂ）
は、熱圧着後の状態を示す構成図、図１（ｃ）は、図１
（ｂ）の一点鎖線Ａで示す部分の作用を示す説明図であ
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the anisotropic conductive adhesive film according to the present invention will be described below in detail with reference to the drawings. 1 (a) to 1 (c) show a preferred embodiment of an anisotropic conductive adhesive film according to the present invention.
1A is a configuration diagram showing a state before thermocompression bonding, FIG. 1B.
Is a configuration diagram showing a state after thermocompression bonding, and FIG.
It is explanatory drawing which shows the effect | action of the part shown by the dashed-dotted line A of (b).
【００２０】図１に示すように、本発明の異方導電性接
着フィルム１は、例えばＬＣＤパネル２のＩＴＯ電極３
とＬＳＩチップ４のバンプ５とを接続する際に用いられ
るもので、フィルム状の絶縁性接着剤樹脂（絶縁性接着
剤）６中に導電粒子７が分散されて構成される。As shown in FIG. 1, the anisotropic conductive adhesive film 1 of the present invention is, for example, an ITO electrode 3 of an LCD panel 2.
It is used to connect the bumps 5 of the LSI chip 4 to the bumps 5 of the LSI chip 4. The conductive particles 7 are dispersed in a film-shaped insulating adhesive resin (insulating adhesive) 6.
【００２１】この場合、絶縁性接着剤樹脂６としては、
例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦ型エポキシ樹脂、フェノキシ樹脂、ナフタレン型
エポキシ樹脂、ノボラック型エポキシ樹脂等のエポキシ
樹脂を主成分として、カップリング剤、硬化剤等を含む
ものなどを用いることができる。In this case, as the insulating adhesive resin 6,
For example, it is possible to use, for example, an epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenoxy resin, a naphthalene type epoxy resin, a novolac type epoxy resin as a main component and a coupling agent and a curing agent. it can.
【００２２】ここで、絶縁性接着剤樹脂６の厚さは、Ｌ
ＳＩチップのバンプの高さ及び異方導電性接着フィルム
の充填性の観点から、１０〜６０μｍとすることが好ま
しい。Here, the thickness of the insulating adhesive resin 6 is L
From the viewpoint of the height of the bump of the SI chip and the filling property of the anisotropic conductive adhesive film, it is preferably 10 to 60 μm.
【００２３】また、絶縁性接着剤樹脂６は、硬化後の弾
性率が、後述する応力吸収粒子８の弾性率より大きいも
のを用いるとよい。As the insulating adhesive resin 6, it is preferable to use one whose elastic modulus after curing is higher than that of the stress absorbing particles 8 described later.
【００２４】好ましい絶縁性接着剤樹脂６の弾性率は、
常温時において、１×１０9〜１×１０12dyn/cm2であ
り、さらに好ましくは１×１０10〜１×１０11dyn/cm2
である。The elastic modulus of the preferred insulating adhesive resin 6 is
At room temperature, it is 1 × 10 9 to 1 × 10 12 dyn / cm 2 , and more preferably 1 × 10 10 to 1 × 10 11 dyn / cm 2.
Is.
【００２５】絶縁性接着剤樹脂６の弾性率が１×１０9d
yn/cm2より小さいと、保持力が低下するという不都合が
あり、１×１０12dyn/cm2より大きいと、絶縁性接着剤樹
脂６の内部応力を十分に小さくすることができないとい
う不都合がある。The elastic modulus of the insulating adhesive resin 6 is 1 × 10 9 d
If it is smaller than yn / cm 2 , the holding force is lowered, and if it is larger than 1 × 10 12 dyn / cm 2 , the internal stress of the insulating adhesive resin 6 cannot be sufficiently reduced. is there.
【００２６】また、絶縁性接着剤樹脂６のガラス転移温
度（Ｔｇ）は、８０〜２００℃であることが好ましく、
さらに好ましくは１００〜１５０℃である。The glass transition temperature (Tg) of the insulating adhesive resin 6 is preferably 80 to 200 ° C.,
More preferably, it is 100 to 150 ° C.
【００２７】絶縁性接着剤樹脂６のガラス転移温度が８
０℃より小さいと、異方導電性接着フィルム１の耐熱性
が低下するという不都合があり、２００℃より大きい
と、絶縁性接着剤樹脂６に生ずる内部応力を十分に小さ
くすることが困難になるという不都合がある。The glass transition temperature of the insulating adhesive resin 6 is 8
If it is lower than 0 ° C., the heat resistance of the anisotropic conductive adhesive film 1 is lowered, and if it is higher than 200 ° C., it becomes difficult to sufficiently reduce the internal stress generated in the insulating adhesive resin 6. There is an inconvenience.
【００２８】一方、導電粒子７としては、例えば、ニッ
ケル、金、銅等の金属粒子、樹脂粒子に金めっき等を施
したもの、また、樹脂粒子に金めっきを施した粒子の最
外層に絶縁被覆を施したもの等を用いることができる。On the other hand, the conductive particles 7 are, for example, metal particles of nickel, gold, copper or the like, resin particles plated with gold or the like, and the resin particles plated with gold are insulated on the outermost layer. A coated material or the like can be used.
【００２９】ここで、導電粒子７の平均粒径は、導通信
頼性の観点から、１〜２０μｍとすることが好ましい。Here, the average particle size of the conductive particles 7 is preferably 1 to 20 μm from the viewpoint of conduction reliability.
【００３０】また、絶縁性接着剤樹脂６中への導電粒子
７の分散量は、導通信頼性及び絶縁信頼性の観点から、
２〜５０重量％とすることが好ましい。The amount of the conductive particles 7 dispersed in the insulating adhesive resin 6 is determined from the viewpoint of conduction reliability and insulation reliability.
It is preferably set to 2 to 50% by weight.
【００３１】また、図示はしないが、この異方導電性接
着フィルム１は、剥離用の例えば剥離処理を施したポリ
エチレンテレフタレート（ＰＥＴ）フィルム上に形成さ
れており、また、異方導電性接着フィルム１の表面は必
要に応じてカバーフィルムによって覆われている。Although not shown, the anisotropic conductive adhesive film 1 is formed on a polyethylene terephthalate (PET) film for peeling, for example, which is subjected to a peeling treatment, and the anisotropic conductive adhesive film is also used. The surface of 1 is covered with a cover film as needed.
【００３２】一方、本発明においては、絶縁性接着剤樹
脂６中に、ゴム系の弾性材料からなる応力吸収粒子８が
分散されている。On the other hand, in the present invention, the stress-absorbing particles 8 made of a rubber-based elastic material are dispersed in the insulating adhesive resin 6.
【００３３】ここで、応力吸収粒子８としては、その弾
性率が硬化後の絶縁性接着剤樹脂６の弾性率より小さい
ものを用いるとよい。Here, as the stress absorbing particles 8, those having an elastic modulus smaller than that of the cured insulating adhesive resin 6 may be used.
【００３４】好ましい応力吸収粒子８の弾性率は、１×
１０8〜１×１０10dyn/cm2であり、さらに好ましくは１
×１０9〜１×１０10dyn/cm2である。The elastic modulus of the preferable stress absorbing particles 8 is 1 ×
10 8 to 1 × 10 10 dyn / cm 2 , more preferably 1
× 10 9 to 1 × 10 10 dyn / cm 2 .
【００３５】応力吸収粒子８の弾性率が１×１０8dyn/c
m2より小さいと、保持力が低下するという不都合があ
り、１×１０10dyn/cm2より大きいと、絶縁性接着剤樹脂
６の内部応力を十分に小さくすることができないという
不都合がある。The elastic modulus of the stress absorbing particles 8 is 1 × 10 8 dyn / c.
If it is smaller than m 2 , the holding force is lowered, and if it is larger than 1 × 10 10 dyn / cm 2 , the internal stress of the insulating adhesive resin 6 cannot be sufficiently reduced.
【００３６】また、応力吸収粒子８のガラス転移温度
は、８０〜１２０℃であることが好ましく、さらに好ま
しくは８０〜１００℃である。The glass transition temperature of the stress absorbing particles 8 is preferably 80 to 120 ° C, more preferably 80 to 100 ° C.
【００３７】応力吸収粒子８のガラス転移温度が８０℃
より小さいと、異方導電性接着フィルム１の耐熱性が低
下するという不都合があり、１２０℃より大きいと、絶
縁性接着剤樹脂６に生ずる内部応力を十分に小さくする
ことが困難になるという不都合がある。The glass transition temperature of the stress absorbing particles 8 is 80 ° C.
If it is smaller, the heat resistance of the anisotropic conductive adhesive film 1 is lowered, and if it is higher than 120 ° C., it is difficult to sufficiently reduce the internal stress generated in the insulating adhesive resin 6. There is.
【００３８】さらに、応力吸収粒子８としては、核材に
低ガラス転移温度（−８０〜−３０℃、より好ましくは
−７０〜−４０℃）の材料を用い、この核材の表面を上
記高ガラス転移温度（８０〜１２０℃、より好ましくは
８０〜１００℃）の樹脂で被覆したものがより好まし
い。Further, as the stress absorbing particles 8, a material having a low glass transition temperature (-80 to -30 ° C, more preferably -70 to -40 ° C) is used as the core material, and the surface of the core material is the above-mentioned high temperature. Those coated with a resin having a glass transition temperature (80 to 120 ° C., more preferably 80 to 100 ° C.) are more preferable.
【００３９】この場合、低ガラス転移温度の核材の表面
に高ガラス転移温度の表面層を形成するには、例えば、
核材の表面にエポキシ樹脂等の樹脂をグラフト重合する
とよい。In this case, for forming a surface layer having a high glass transition temperature on the surface of the core material having a low glass transition temperature, for example,
A resin such as an epoxy resin may be graft-polymerized on the surface of the core material.
【００４０】本発明において使用可能な応力吸収粒子８
としては、例えば、架橋アクリロニトリル−ブタジエン
ゴム、架橋アクリルゴム、カルボン酸変性アクリロニト
リル−ブタジエンゴム、シリコーンゴム、架橋ポリブタ
ジエンゴムからなるものがあげられる。Stress absorbing particles 8 usable in the present invention
Examples thereof include those made of crosslinked acrylonitrile-butadiene rubber, crosslinked acrylic rubber, carboxylic acid-modified acrylonitrile-butadiene rubber, silicone rubber, and crosslinked polybutadiene rubber.
【００４１】また、核材としてこれらのゴムを用い、核
材の表面にエポキシ樹脂等の樹脂をグラフト重合して表
面層を形成した応力吸収粒子８は、絶縁性接着剤樹脂６
に生ずる内部応力を一層小さくする観点から、より好ま
しいものである。The stress-absorbing particles 8 formed by using these rubbers as the core material and forming a surface layer by graft-polymerizing a resin such as an epoxy resin on the surface of the core material are insulating adhesive resin 6
It is more preferable from the viewpoint of further reducing the internal stress generated in the.
【００４２】また、導電粒子７と接続電極間の電気的な
接続を十分に確保するためには、応力吸収粒子８の平均
粒径は、導電粒子７の平均粒径より小さいことが好まし
い。In order to sufficiently secure the electrical connection between the conductive particles 7 and the connection electrode, the average particle size of the stress absorbing particles 8 is preferably smaller than the average particle size of the conductive particles 7.
【００４３】好ましい応力吸収粒子８の平均粒径は、１
０ｎｍ〜２μｍであり、さらに好ましくは３０〜１００
０ｎｍである。The average particle size of the stress absorbing particles 8 is preferably 1
0 nm to 2 μm, more preferably 30 to 100
It is 0 nm.
【００４４】絶縁性接着剤樹脂６の内部応力を小さくす
るためには添加する応力吸収粒子８の粒径が小さくその
表面積が大きい方が望ましいが、応力吸収粒子８の平均
粒径が１０ｎｍより小さいと、応力を吸収しきれないと
いう不都合がある。In order to reduce the internal stress of the insulating adhesive resin 6, it is desirable that the stress absorbing particles 8 to be added have a small particle size and a large surface area, but the average particle size of the stress absorbing particles 8 is smaller than 10 nm. Then, there is an inconvenience that the stress cannot be completely absorbed.
【００４５】他方、応力吸収粒子８の平均粒径が２μｍ
より大きいと、導電粒子７と接続電極間の電気的な接続
が低下するおそれがある。On the other hand, the average particle diameter of the stress absorbing particles 8 is 2 μm.
If it is larger, the electrical connection between the conductive particles 7 and the connection electrode may be deteriorated.
【００４６】一方、絶縁性接着剤中への応力吸収粒子８
の添加量は、０．５〜３０重量％であることが好まし
く、さらに好ましくは１．０〜２０重量％である。On the other hand, the stress absorbing particles 8 in the insulating adhesive
The addition amount of is preferably 0.5 to 30% by weight, and more preferably 1.0 to 20% by weight.
【００４７】絶縁性接着剤中への応力吸収粒子８の添加
量が０．５重量％より小さいと、絶縁性接着剤樹脂６に
生ずる内部応力を十分に小さくすることができず、３０
重量％より大きいと、フィルムになりにくく、また耐熱
性が低下するという不都合がある。If the amount of the stress absorbing particles 8 added to the insulating adhesive is less than 0.5% by weight, the internal stress generated in the insulating adhesive resin 6 cannot be sufficiently reduced,
If it is more than 10% by weight, it is difficult to form a film and heat resistance is lowered.
【００４８】本発明の異方導電性接着フィルム１を作成
するには、まず、所定のエポキシ樹脂を溶解させた溶液
に、ゴム系の弾性材料からなる応力吸収粒子８と硬化剤
等を所定量加えて混合し、溶剤に分散させた導電粒子７
をこの溶液に加えて混合してバインダーを調製する。To prepare the anisotropic conductive adhesive film 1 of the present invention, first, a predetermined amount of stress absorbing particles 8 made of a rubber-based elastic material and a curing agent are added to a solution prepared by dissolving a predetermined epoxy resin. Conductive particles 7 mixed and dispersed in a solvent
Is added to this solution and mixed to prepare a binder.
【００４９】このバインダーを例えばポリエステルフィ
ルム等の剥離フィルム上にコーティングし、乾燥後、カ
バーフィルムをラミネートして異方導電性接着フィルム
１を得る。This binder is coated on a release film such as a polyester film, dried and then laminated with a cover film to obtain an anisotropic conductive adhesive film 1.
【００５０】本発明の異方導電性接着フィルム１を用い
て電極間の接続を行う場合には、図１（ａ）（ｂ）に示
すように、例えばＬＣＤパネル２側に異方導電性接着フ
ィルム１を貼付し、ＬＳＩチップ４の位置合わせ（仮接
続）を行った後に、所定の温度及び圧力で熱圧着を行う
ことにより、ＬＳＩチップ４の電極５とＬＣＤパネル２
の電極３とを電気的に接続させた状態で絶縁性接着剤樹
脂６を硬化させる。When the electrodes are connected using the anisotropic conductive adhesive film 1 of the present invention, as shown in FIGS. 1A and 1B, for example, the anisotropic conductive adhesive is applied to the LCD panel 2 side. After the film 1 is attached and the LSI chip 4 is aligned (temporarily connected), thermocompression bonding is performed at a predetermined temperature and pressure, whereby the electrode 5 of the LSI chip 4 and the LCD panel 2 are
The insulating adhesive resin 6 is cured while being electrically connected to the electrode 3.
【００５１】ところで、一般に、異方導電性接着フィル
ムの接着界面に発生する内部応力σは、次の式(１)によ
って算出しうることが知られている。By the way, it is generally known that the internal stress σ generated at the bonding interface of the anisotropic conductive adhesive film can be calculated by the following equation (1).
【００５２】[0052]
【数１】 [Equation 1]
【００５３】本発明の異方導電性接着フィルム１におい
て、異方導電性接着フィルム１に対して外部応力に起因
する力Ｆが加わった場合には、例えば、図１（ｃ）に示
すように、絶縁性接着剤樹脂６より弾性率の小さい各応
力吸収粒子８が絶縁性接着剤樹脂６の各部分より大きく
変形することによってこれらの部分においていわば応力
が吸収された状態となるため、異方導電性接着フィルム
１全体としての弾性率は絶縁性接着剤樹脂６のみの場合
に比べて小さくなる。In the anisotropic conductive adhesive film 1 of the present invention, when a force F due to external stress is applied to the anisotropic conductive adhesive film 1, as shown in FIG. Since the stress absorbing particles 8 having a smaller elastic modulus than the insulating adhesive resin 6 are deformed more than the respective portions of the insulating adhesive resin 6, the stress is absorbed in these portions, so to speak, it is anisotropic. The elastic modulus of the entire conductive adhesive film 1 is smaller than that of the insulating adhesive resin 6 alone.
【００５４】その結果、本発明によれば、式(１)から明
らかなように、従来技術に比べて異方導電性接着フィル
ム１の絶縁性接着剤樹脂６中に生ずる内部応力σを小さ
くすることができる。その一方、絶縁性接着剤樹脂６は
従来と同様のものを用いることができることから、本発
明によれば、ガラス転移温度を低下させることなく接着
剤としての実効接着力を向上させることが可能になる。As a result, according to the present invention, as is apparent from the equation (1), the internal stress σ generated in the insulating adhesive resin 6 of the anisotropic conductive adhesive film 1 is made smaller than that in the prior art. be able to. On the other hand, since the insulating adhesive resin 6 can be the same as the conventional one, according to the present invention, it is possible to improve the effective adhesive force as an adhesive without lowering the glass transition temperature. Become.
【００５５】この場合、応力吸収粒子８としてより弾性
率の小さいものを用いれば、絶縁性接着剤樹脂６の内部
応力を一層小さくすることができ、接着剤としての実効
接着力をより向上させることができる。In this case, if the stress absorbing particles 8 having a smaller elastic modulus are used, the internal stress of the insulating adhesive resin 6 can be further reduced, and the effective adhesive force of the adhesive can be further improved. You can
【００５６】特に、応力吸収粒子８として低ガラス転移
温度の核材の表面に高ガラス転移温度の表面層を形成し
たものを用いれば、表面層のガラス転移温度が絶縁性接
着剤樹脂のガラス転移温度に近くなり絶縁性接着剤樹脂
との密着性が向上する。In particular, when the stress absorbing particles 8 are those in which a surface layer having a high glass transition temperature is formed on the surface of a core material having a low glass transition temperature, the glass transition temperature of the surface layer is the glass transition of the insulating adhesive resin. The temperature is close to the temperature and the adhesion with the insulating adhesive resin is improved.
【００５７】特に、グラフト重合によって核材の表面に
エポキシ樹脂による表面層を形成すれば、絶縁性接着剤
樹脂６と同種の材質となるため、絶縁性接着剤樹脂６と
の密着性がより向上し、熱圧着の際に絶縁性接着剤樹脂
６と応力吸収粒子８との界面において剥離することがな
く、エージングの際において内部応力が吸収されること
によって高い接続信頼性が得られるようになる。In particular, if a surface layer made of epoxy resin is formed on the surface of the core material by graft polymerization, the same material as the insulating adhesive resin 6 is used, so that the adhesiveness with the insulating adhesive resin 6 is further improved. However, during the thermocompression bonding, there is no peeling at the interface between the insulating adhesive resin 6 and the stress absorbing particles 8, and internal stress is absorbed during aging, so that high connection reliability can be obtained. .
【００５８】一方、応力吸収粒子の内部は低ガラス転移
温度のもので弾性率がより小さいため、絶縁性接着剤樹
脂の内部応力を確実に吸収してこれを一層小さくするこ
とができる。しかも、本発明によれば、高い初期接着力
が得られることに加え、環境変化によって生ずる応力を
も吸収することができるため、長期にわたって導通信頼
性及び接続信頼性を確保することが可能になる。On the other hand, since the inside of the stress absorbing particles has a low glass transition temperature and a smaller elastic modulus, the internal stress of the insulating adhesive resin can be reliably absorbed and further reduced. Moreover, according to the present invention, in addition to obtaining a high initial adhesive force, it is possible to absorb stress caused by environmental changes, so that it is possible to secure continuity reliability and connection reliability for a long period of time. .
【００５９】[0059]
【実施例】以下、本発明に係る異方導電性接着フィルム
の実施例を比較例とともに詳細に説明する。
〔実施例１〕まず、フェノキシ樹脂（東都化成社製 Ｙ
Ｐ５０）５０重量部、エポキシ樹脂（油化シェル社製
８２８）、イミダゾール系硬化剤（旭化成社製 ＨＸ３
９４１ＨＰ）１００重量部、シランカップリング剤（日
本ユニカー社製 Ａ１８７）３．２重量部、平均粒径１
００ｎｍの架橋ポリブタジエン粒子０．５重量部を、溶
剤トルエンに溶解して絶縁性接着剤樹脂、すなわち、バ
インダー溶液を調製する。EXAMPLES Examples of the anisotropic conductive adhesive film according to the present invention will be described in detail below together with comparative examples. [Example 1] First, phenoxy resin (Y, manufactured by Tohto Kasei Co., Ltd.)
P50) 50 parts by weight, epoxy resin (made by Yuka Shell Co., Ltd.
828), an imidazole-based curing agent (HX3 manufactured by Asahi Kasei Corporation)
941 HP) 100 parts by weight, silane coupling agent (A187, manufactured by Nippon Unicar Co., Ltd.) 3.2 parts by weight, average particle size 1
0.5 parts by weight of crosslinked polybutadiene particles of 00 nm are dissolved in a solvent toluene to prepare an insulating adhesive resin, that is, a binder solution.
【００６０】そして、このバインダー溶液１００重量部
に、導電粒子として、平均粒径５μｍのベンゾグアナミ
ン粒子にニッケル−金めっきを施したものを３．５重量
部加えてバインダーとする。Then, to 100 parts by weight of this binder solution, 3.5 parts by weight of benzoguanamine particles having an average particle diameter of 5 μm plated with nickel-gold as conductive particles are added to form a binder.
【００６１】さらに、このバインダーを剥離用のＰＥＴ
フィルム上に乾燥後の厚みが２５μｍになるようにコー
ティングし、異方導電性接着フィルムを得る。この異方
導電性接着フィルムを幅２ｍｍのスリット状に切断し、
実施例１のサンプルとした。Further, this binder is used for peeling PET.
The film is coated so that the thickness after drying is 25 μm to obtain an anisotropic conductive adhesive film. Cut this anisotropic conductive adhesive film into slits with a width of 2 mm,
The sample of Example 1 was used.
【００６２】〔実施例２〕架橋ポリブタジエン粒子の添
加量を１重量部とした以外は実施例１と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 2 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 1 part by weight.
【００６３】〔実施例３〕架橋ポリブタジエン粒子の添
加量を５重量部とした以外は実施例１と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 3 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 5 parts by weight.
【００６４】〔実施例４〕架橋ポリブタジエン粒子の添
加量を１０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Example 4 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 10 parts by weight.
【００６５】〔実施例５〕架橋ポリブタジエン粒子の添
加量を３０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Example 5 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 30 parts by weight.
【００６６】〔比較例１〕架橋ポリブタジエン粒子を添
加せずにバインダー溶液を調製した以外は実施例１と同
様の方法によって異方導電性接着フィルムのサンプルを
作成した。Comparative Example 1 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the binder solution was prepared without adding the crosslinked polybutadiene particles.
【００６７】〔比較例２〕架橋ポリブタジエン粒子の添
加量を３５重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Comparative Example 2 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 35 parts by weight.
【００６８】〔比較例３〕架橋ポリブタジエン粒子の添
加量を４０重量部とした以外は実施例１と同様の方法に
よって異方導電性接着フィルムのサンプルを作成した。Comparative Example 3 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that the amount of crosslinked polybutadiene particles added was 40 parts by weight.
【００６９】〔実施例６〕平均粒径１０ｎｍの架橋ポリ
ブタジエン粒子を５重量部添加した以外は実施例１と同
様の方法によって異方導電性接着フィルムのサンプルを
作成した。Example 6 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 1 except that 5 parts by weight of crosslinked polybutadiene particles having an average particle size of 10 nm were added.
【００７０】〔実施例７〕架橋ポリブタジエン粒子の平
均粒径を１μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 7 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 6 except that the average particle size of the crosslinked polybutadiene particles was 1 μm.
【００７１】〔実施例８〕架橋ポリブタジエン粒子の平
均粒径を２μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Example 8 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 6 except that the average particle size of the crosslinked polybutadiene particles was 2 μm.
【００７２】〔比較例４〕架橋ポリブタジエン粒子の平
均粒径を５μｍとした以外は実施例６と同様の方法によ
って異方導電性接着フィルムのサンプルを作成した。Comparative Example 4 An anisotropic conductive adhesive film sample was prepared in the same manner as in Example 6 except that the average particle size of the crosslinked polybutadiene particles was 5 μm.
【００７３】〔比較例５〕架橋ポリブタジエン粒子を添
加せずに液状ゴム（日本ゼオン社製 ＤＮ−６０１）を
５重量部添加した以外は実施例１と同様の方法によって
異方導電性接着フィルムのサンプルを作成した。Comparative Example 5 An anisotropic conductive adhesive film was prepared in the same manner as in Example 1 except that 5 parts by weight of liquid rubber (DN-601 manufactured by Nippon Zeon Co., Ltd.) was added without adding crosslinked polybutadiene particles. I made a sample.
【００７４】〔比較例６〕液状ゴムの添加量を１０重量
部とした以外は比較例５と同様の方法によって異方導電
性接着フィルムのサンプルを作成した。Comparative Example 6 An anisotropic conductive adhesive film sample was prepared in the same manner as in Comparative Example 5 except that the amount of liquid rubber added was 10 parts by weight.
【００７５】〔比較例７〕液状ゴムの添加量を３０重量
部とした以外は比較例５と同様の方法によって異方導電
性接着フィルムのサンプルを作成した。Comparative Example 7 An anisotropic conductive adhesive film sample was prepared in the same manner as in Comparative Example 5 except that the amount of liquid rubber added was 30 parts by weight.
【００７６】＜評価結果＞次に、上述のサンプルを用
い、プリント基板とガラス基板との圧着を行った。この
場合、プリント基板としては、厚みが７５μｍのポリイ
ミドからなる基材上に、厚み３５μｍの銅箔にすずめっ
きを施したパターンを２００μｍのピッチで形成したも
のを用いた。一方、ガラス基板としては、全面にＩＴＯ
による電極が形成されたもので、その表面抵抗が１０Ω
／□となるものを用いた。そして、このようにして作成
した各サンプルについて、導通抵抗値、接着強度、フィ
ルム性の測定を行った。その結果を表１に示す。<Evaluation Results> Next, using the above-mentioned sample, the printed circuit board and the glass substrate were pressure bonded. In this case, as the printed circuit board, a substrate having a thickness of 75 μm and made of tin on a copper foil having a thickness of 35 μm formed on a substrate made of polyimide at a pitch of 200 μm was used. On the other hand, as the glass substrate, ITO is used on the entire surface.
The electrode has been formed, and its surface resistance is 10Ω.
/ □ was used. Then, with respect to each of the samples thus prepared, the conduction resistance value, the adhesive strength, and the film property were measured. The results are shown in Table 1.
【００７７】[0077]
【表１】 [Table 1]
【００７８】この場合、導通抵抗の判定は、３Ω以下の
ものを良好（○）、３〜２０Ωのものをやや不良
（△）、２０Ωより大きくなったものを不良（×）とし
た。In this case, the conduction resistance was judged to be good (∘) when the resistance was 3Ω or less, slightly bad (Δ) when the resistance was 3 to 20Ω, and bad (×) when the resistance was more than 20Ω.
【００７９】一方、接着強度については、温度８５℃、
相対湿度８５％〜温度４５℃、相対湿度９０％の条件下
で１０００時間エージング後において、引張り速度が５
０ｍｍ／分で、ガラス基板からプリント基板を９０°方
向に引き剥がすときの接着力を測定した。On the other hand, regarding the adhesive strength, the temperature was 85 ° C.
After aging for 1000 hours under the conditions of relative humidity of 85% to temperature of 45 ° C. and relative humidity of 90%, the pulling rate is 5
At 0 mm / min, the adhesive force was measured when the printed board was peeled from the glass board in the 90 ° direction.
【００８０】そして、接着強度が６００ｇ／ｃｍ以上の
ものをきわめて良好（◎）、３００ｇ／ｃｍより大きく
６００ｇ／ｃｍ未満のものを良好（○）、３００ｇ／ｃ
ｍ以下のものを不良（×）とした。Those having an adhesive strength of 600 g / cm or more are very good (⊚), those having an adhesive strength of more than 300 g / cm and less than 600 g / cm are good (∘), 300 g / c.
Those with m or less were regarded as defective (x).
【００８１】さらに、フィルム性については、容易にフ
ィルム化したものを良好（○）、フィルムになりにくい
ものをやや不良（△）、フィルムにならなかったものを
不良（×）とした。Further, regarding the film properties, those easily formed into a film were evaluated as good (∘), those that were difficult to form into a film were evaluated as slightly defective (Δ), and those that did not form a film were evaluated as defective (x).
【００８２】表１に示すように、ゴム系の弾性材料から
なる応力吸収粒子を添加した実施例１〜５は、応力吸収
粒子を添加しない比較例１に比べて接着強度が向上し
た。この場合、応力吸収粒子の添加量が多いほど接着強
度が向上したが、３５重量％以上添加すると、フィルム
になりにくく（比較例２）、４０重量％以上添加した場
合にはフィルム化することができなかった（比較例
３）。As shown in Table 1, in Examples 1 to 5 in which the stress absorbing particles made of a rubber-based elastic material were added, the adhesive strength was improved as compared with Comparative Example 1 in which the stress absorbing particles were not added. In this case, the larger the amount of the stress absorbing particles added, the more the adhesive strength was improved. However, if it is added in an amount of 35% by weight or more, it becomes difficult to form a film (Comparative Example 2). It was not possible (Comparative Example 3).
【００８３】以上の結果から、応力吸収粒子の添加量
は、０．５〜３０重量％が効果的であると考えられる。From the above results, it is considered that the addition amount of the stress absorbing particles is effectively 0.5 to 30% by weight.
【００８４】実施例６〜８及び比較例４において応力吸
収粒子の粒径を変えて評価を行ったが、応力吸収粒子の
粒径が２μｍを超えると導通抵抗値がやや大きくなり
（実施例８、実用可能なレベルである）、応力吸収粒子
の粒径が導電粒子の粒径より大きい５μｍの場合には、
接続電極間の導通がとれなくなった（比較例４）。一
方、接着強度については、応力吸収粒子の粒径による差
はみられなかった。The evaluation was carried out in Examples 6 to 8 and Comparative Example 4 by changing the particle size of the stress absorbing particles. When the particle size of the stress absorbing particles exceeds 2 μm, the conduction resistance value becomes slightly large (Example 8 When the particle size of the stress absorbing particles is 5 μm larger than the particle size of the conductive particles,
The electrical connection between the connection electrodes was lost (Comparative Example 4). On the other hand, regarding the adhesive strength, no difference was observed depending on the particle size of the stress absorbing particles.
【００８５】さらに、応力吸収粒子の代わりに液状ゴム
評価を添加した比較例５〜７は、応力吸収粒子を添加し
ない比較例１に比べて接着強度の向上はみられなかっ
た。Further, in Comparative Examples 5 to 7 in which the liquid rubber evaluation was added instead of the stress absorbing particles, the improvement of the adhesive strength was not seen as compared with Comparative Example 1 in which the stress absorbing particles were not added.
【００８６】[0086]
【発明の効果】以上述べたように本発明によれば、異方
導電性接着フィルムにおいて、バインダーのガラス転移
温度を低下させることなく接着剤としての実効接着力を
向上させることができる。As described above, according to the present invention, in the anisotropic conductive adhesive film, the effective adhesive force as an adhesive can be improved without lowering the glass transition temperature of the binder.
【図１】図１（ａ）〜（ｃ）は、本発明に係る異方導電
性接着フィルムの好ましい実施の形態を示すもので、図
１（ａ）は、熱圧着前の状態を示す構成図、図１（ｂ）
は、熱圧着後の状態を示す構成図、図１（ｃ）は、図１
（ｂ）の一点鎖線Ａで示す部分の作用を示す説明図であ
る。1 (a) to 1 (c) show a preferred embodiment of an anisotropic conductive adhesive film according to the present invention, and FIG. 1 (a) shows a state before thermocompression bonding. Figure, Figure 1 (b)
Is a configuration diagram showing a state after thermocompression bonding, and FIG.
It is explanatory drawing which shows the effect | action of the part shown by the dashed-dotted line A of (b).
１ 異方導電性接着フィルム ２ ＬＣＤパネル ３ ＩＴＯ電極 ４ ＬＳＩチップ ５ バンプ ６ 絶縁性接着剤樹脂（絶縁性接着剤） ７ 導電粒子 ８ 応力吸収粒子 1 Anisotropically conductive adhesive film 2 LCD panel 3 ITO electrode 4 LSI chips 5 bumps 6 Insulating adhesive resin (insulating adhesive) 7 Conductive particles 8 Stress absorbing particles
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平11−50032（ＪＰ，Ａ) 特開 平11−185526（ＪＰ，Ａ) 特開 平４−323290（ＪＰ，Ａ) 特開 昭60−115678（ＪＰ，Ａ) 特開 平８−127707（ＪＰ，Ａ) 特開 平８−258055（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01B 5/16 H01R 11/01 H01B 1/20 C09J 7/02 C09J 9/02 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-11-50032 (JP, A) JP-A-11-185526 (JP, A) JP-A-4-323290 (JP, A) JP-A-60- 115678 (JP, A) JP-A-8-127707 (JP, A) JP-A-8-258055 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01B 5/16 H01R 11 / 01 H01B 1/20 C09J 7/02 C09J 9/02
Claims (6)
異方導電性接着フィルムであって、 上記絶縁性接着剤中にゴム系の弾性材料からなる応力吸
収粒子が分散され、上記応力吸収粒子の弾性率が、１×
１０ 9 〜１×１０ 10 dyn/cm 2 であり、かつ、上記応力吸収
粒子のガラス転移温度が、８０〜１２０℃であることを
特徴とする異方導電性接着フィルム。1. A anisotropic conductive adhesive film obtained by dispersing conductive particles in an insulating adhesive, the made of an elastic rubber material in an insulating adhesive stress-absorbing particles are dispersed, the Elastic modulus of stress absorbing particles is 1 ×
10 9 to 1 × 10 10 dyn / cm 2 and the above stress absorption
The glass transition temperature of the particles, anisotropic conductive adhesive film, wherein 80 to 120 ° C. der Rukoto.
接着剤の弾性率より小さいことを特徴とする請求項１記
載の異方導電性接着フィルム。2. The anisotropic conductive adhesive film according to claim 1, wherein the elastic modulus of the stress absorbing particles is smaller than the elastic modulus of the insulating adhesive after curing.
均粒径より小さいことを特徴とする請求項１又は２のい
ずれか１項記載の異方導電性接着フィルム。3. The anisotropic conductive adhesive film according to claim 1, wherein the stress-absorbing particles have an average particle diameter smaller than that of the conductive particles.
が０．５〜３０重量％であることを特徴とする請求項１
乃至３のいずれか１項記載の異方導電性接着フィルム。4. The amount of stress absorbing particles added to the insulating adhesive is 0.5 to 30% by weight.
4. The anisotropic conductive adhesive film according to any one of 1 to 3.
体とする材料からなることを特徴とする請求項１乃至４
のいずれか１項記載の異方導電性接着フィルム。5. The stress absorbing particles are made of a material mainly composed of crosslinked polybutadiene.
The anisotropic conductive adhesive film according to any one of 1.
の表面に高ガラス転移温度の表面層を形成したものであ
ることを特徴とする請求項１乃至５のいずれか１項記載
の異方導電性接着フィルム。6. The stress absorbing particle is formed by forming a surface layer having a high glass transition temperature on a surface of a core material having a low glass transition temperature, according to any one of claims 1 to 5. Anisotropic conductive adhesive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839798A JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12839798A JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11329069A JPH11329069A (en) | 1999-11-30 |
| JP3477367B2 true JP3477367B2 (en) | 2003-12-10 |
Family
ID=14983801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12839798A Expired - Lifetime JP3477367B2 (en) | 1998-05-12 | 1998-05-12 | Anisotropic conductive adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3477367B2 (en) |
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