JP3472252B2 - Method for manufacturing expanded graphite heat sink - Google Patents
Method for manufacturing expanded graphite heat sinkInfo
- Publication number
- JP3472252B2 JP3472252B2 JP2000272011A JP2000272011A JP3472252B2 JP 3472252 B2 JP3472252 B2 JP 3472252B2 JP 2000272011 A JP2000272011 A JP 2000272011A JP 2000272011 A JP2000272011 A JP 2000272011A JP 3472252 B2 JP3472252 B2 JP 3472252B2
- Authority
- JP
- Japan
- Prior art keywords
- expanded graphite
- heat sink
- heat
- manufacturing
- graphite heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ＣＰＵ（中央処
理ユニット）やビデオチップ等の半導体部品その他の発
熱物の放熱のために用いられるヒートシンクに関し、特
にはアルミニウムよりも軽量で熱伝導性に優れる膨張黒
鉛製ヒートシンクの製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink used for radiating heat from semiconductor components such as a CPU (central processing unit) and a video chip, and other heat generating materials, and in particular, it is lighter in weight and superior in heat conductivity than aluminum. The present invention relates to a method for manufacturing an expanded graphite heat sink.
【０００２】[0002]
【従来の技術および発明が解決しようとする課題】パー
ソナルコンピュータ等に用いられているＣＰＵやビデオ
チップ等の半導体部品は稼働中に高熱を発する。しかも
これらの半導体部品は、過熱すると動作が不安定になっ
て熱暴走し、甚だしい場合は破壊される可能性もある。
このためＣＰＵ等の半導体部品については、そこで発生
した熱を放熱して冷却する必要がある。この放熱のため
に一般的に使用されているのがヒートシンクであり、従
来のヒートシンクは、アルミニウムブロックを切削加工
して放熱フィンを形成したものが大部分である。2. Description of the Related Art Semiconductor parts such as CPUs and video chips used in personal computers and the like generate high heat during operation. Moreover, when these semiconductor components are overheated, their operation becomes unstable and thermal runaway occurs, and in extreme cases, they may be destroyed.
For this reason, it is necessary to radiate the heat generated there and cool the semiconductor components such as the CPU. A heat sink is generally used for this heat dissipation, and most of the conventional heat sinks are those in which an aluminum block is cut to form a heat dissipation fin.
【０００３】ところで近年、ノート型パーソナルコンピ
ュータその他の携帯型半導体装置あるいは車両用コンピ
ュータその他の移動式半導体装置等に対する軽量化の要
求により、アルミニウムよりも軽量な素材を用いたヒー
トシンクが求められており、またデスクトップ型パーソ
ナルコンピュータその他の一般用半導体装置あるいは車
両用コンピュータその他の移動式半導体装置等に対する
高性能化の要求に伴うそこでの半導体部品の発熱量の増
加により、アルミニウムよりも熱伝導性に優れた素材を
用いたヒートシンクが求められている。そこで、これら
の要求に応えるものとして、膨張黒鉛製ヒートシンクが
提案されている。By the way, in recent years, a heat sink using a material lighter than aluminum has been demanded due to a demand for weight reduction of a notebook type personal computer or other portable semiconductor device or a vehicle computer or other mobile semiconductor device. In addition, due to the increase in heat generation of semiconductor parts in response to the demand for higher performance for desktop personal computers and other general-purpose semiconductor devices or vehicle computers and other mobile semiconductor devices, it has superior thermal conductivity to aluminum. A heat sink using a material is required. Therefore, an expanded graphite heat sink has been proposed to meet these requirements.
【０００４】しかしながら、従来提案されている膨張黒
鉛製ヒートシンクは、膨張黒鉛テープや膨張黒鉛シート
を圧縮成形して形成した膨張黒鉛ブロックをさらに切削
加工して放熱フィンを形成していることから、放熱フィ
ンに充分な強度を持たせることができず、しかも切削に
よる膨張黒鉛の飛散を防止して環境汚染を回避するのが
困難であるという問題がある。そしてこの問題の解決の
ために膨張黒鉛テープや膨張黒鉛シートから圧縮成形で
直接フィン形状を形成しようとすると、複雑な放熱フィ
ン形状の細部まで密度を均一にすることができず、熱伝
導性ひいては放熱特性にムラができてしまうという問題
がある。However, in the conventionally proposed expanded graphite heat sink, the expanded fin block is formed by further cutting the expanded graphite block formed by compression molding of expanded graphite tape or expanded graphite sheet. There is a problem in that the fins cannot have sufficient strength, and it is difficult to prevent the expanded graphite from scattering due to cutting and avoid environmental pollution. If an attempt is made to directly form a fin shape by compression molding from an expanded graphite tape or expanded graphite sheet in order to solve this problem, it is not possible to make the density uniform even in the details of the complicated heat dissipation fin shape, and thus the thermal conductivity and There is a problem that the heat dissipation characteristics become uneven.
【０００５】[0005]
【課題を解決するための手段およびその作用・効果】こ
の発明は、上記課題を有利に解決した膨張黒鉛製ヒート
シンクの製造方法を提供することを目的とするものであ
り、この発明の膨張黒鉛製ヒートシンクの製造方法は、
膨張黒鉛のチップを、充分に乾燥させた後に金型内に充
填して、所定のヒートシンク形状に圧縮成形し、前記圧
縮成形を、ヒートシンク形状に応じた熱を流す方向と交
差する方向に加圧して行うことを特徴とするものであ
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for manufacturing an expanded graphite heat sink that advantageously solves the above problems. The heat sink manufacturing method is
After the expanded graphite chips are sufficiently dried, they are filled in a mold and compression-molded into a predetermined heat sink shape, and the compression molding is pressed in a direction intersecting with a heat flow direction corresponding to the heat sink shape. It is characterized by carrying out.
【０００６】かかる製造方法で製造した膨張黒鉛製ヒー
トシンクによれば、その素材である膨張黒鉛の軽量性お
よび良好な熱伝導性により、従来のアルミニウム製ヒー
トシンクよりも軽量で放熱性の高いヒートシンクをもた
らすことができ、しかも、膨張黒鉛のチップを金型内に
充填し所定のヒートシンク形状に圧縮成形しているの
で、切削による膨張黒鉛の飛散を防止して環境汚染を回
避し得るとともに、複雑な放熱フィン形状等の細部まで
密度を均一にし得て熱伝導性ひいては放熱特性を均一に
することができ、さらに、充分に乾燥させた膨張黒鉛の
チップを圧縮成形しているので、膨張黒鉛の層間への水
分の介在による層間剥離を防止し得て、放熱フィン等に
充分な強度を持たせることができる。[0006] According to the expanded graphite heat sink manufactured by such a manufacturing method, due to the light weight and good thermal conductivity of the expanded graphite, which is the material thereof, a heat sink having a lighter weight and higher heat dissipation than the conventional aluminum heat sink is provided. In addition, since the expanded graphite chips are filled in the mold and compression-molded into a predetermined heat sink shape, it is possible to prevent the expanded graphite from scattering due to cutting, avoid environmental pollution, and prevent complicated heat dissipation. The density of fins and other details can be made uniform, resulting in uniform heat conductivity and even heat dissipation characteristics. Furthermore, since expanded graphite chips that have been sufficiently dried are compression-molded, there is no need to insert them between layers of expanded graphite. It is possible to prevent delamination due to the inclusion of water, and it is possible to give the radiation fin or the like sufficient strength.
【０００７】さらに、圧縮成形によって形成したヒート
シンクでは膨張黒鉛のチップが加圧方向に潰れて、加圧
方向に膨張黒鉛の層が重なることから、加圧方向と交差
する方向に比べて加圧方向へは熱が若干伝わりにくくな
るという異方性が生じている処、この発明の膨張黒鉛製
ヒートシンクの製造方法によれば、前記圧縮成形を、ヒ
ートシンク形状に応じた熱を流す方向と交差する方向に
加圧して行うことで、ヒートシンク形状に応じた熱を流
す方向（通常はフィンを立設した側と反対の側からその
フィンを立設した側へ向かう方向）と交差する方向（例
えばフィンを立設した側でのフィンの延在方向）をその
加圧方向としているので、ヒートシンクとしての熱伝導
性をより良好にすることができる。Further, in the heat sink formed by compression molding, the expanded graphite chips are crushed in the pressing direction, and the expanded graphite layers are overlapped in the pressing direction. According to the method of manufacturing an expanded graphite heat sink of the present invention, the compression molding is performed in a direction intersecting with the heat flow direction according to the shape of the heat sink. By applying pressure to the heat sink, a direction intersecting with the direction in which heat flows according to the shape of the heat sink (usually, the direction from the side opposite to the side where the fins are erected to the side where the fins are erected) Since the extending direction of the fins on the standing side is the pressing direction, the heat conductivity of the heat sink can be further improved.
【０００８】なお、この発明の膨張黒鉛製ヒートシンク
の製造方法においては、前記膨張黒鉛のチップは粒度分
布の中心が０．１ｍｍ以上で３ｍｍ以下のものであるこ
とが好ましい。これは、粒度分布の中心が０．１ｍｍ未
満の粉末では、圧縮成形時の潰れ量が多くなることから
ヒートシンクの大きさに比べて大きな金型が必要となっ
てコストが嵩み、また３ｍｍを超えると、金型内で充分
圧縮成形することが困難となって隙間が生ずる可能性が
高くなるからである。In the method for manufacturing an expanded graphite heat sink of the present invention, it is preferable that the expanded graphite chips have a center of particle size distribution of 0.1 mm or more and 3 mm or less. This is because powder having a particle size distribution center of less than 0.1 mm increases the amount of crushing during compression molding, which requires a larger mold than the size of the heat sink, which increases the cost. If it exceeds, it is difficult to perform sufficient compression molding in the mold, and a gap is likely to occur.
【０００９】またこの発明の膨張黒鉛製ヒートシンクの
製造方法においては、前記乾燥は、前記膨張黒鉛のチッ
プを平置きして（平らにならして）１００℃以上の雰囲
気で１時間以上放置することが好ましい。このようにす
ることで、膨張黒鉛のチップを充分乾燥させ得るからで
ある。In the method for manufacturing an expanded graphite heat sink according to the present invention, the drying is performed by placing the expanded graphite chip flat (flattening) and leaving it in an atmosphere of 100 ° C. or higher for 1 hour or more. Is preferred. By doing so, the expanded graphite chips can be sufficiently dried.
【００１０】さらに、この発明の膨張黒鉛製ヒートシン
クの製造方法においては、前記圧縮成形は、３００ｋｇ
ｆ／ｃｍ2 以上で２０００ｋｇｆ／ｃｍ2 以下の面圧で
加圧して行うことが望ましい。これは、３００ｋｇｆ／
ｃｍ2 未満の面圧では膨張黒鉛のチップを充分に圧縮成
形することが困難であり、また２０００ｋｇｆ／ｃｍ2
を超えると、大型のプレス装置が必要となってコストが
嵩むからである。Further, in the method for manufacturing a heat sink made of expanded graphite according to the present invention, the compression molding is 300 kg.
It is desirable to apply pressure at a surface pressure of f / cm 2 or more and 2000 kgf / cm 2 or less. This is 300 kgf /
If the surface pressure is less than cm 2, it is difficult to sufficiently compression-mold expanded graphite chips, and 2000 kgf / cm 2
This is because if the value exceeds, a large press machine is required and the cost increases.
【００１１】そして、この発明の膨張黒鉛製ヒートシン
クにおいては、前記膨張黒鉛製ヒートシンクは、密度が
１．４ｇ／ｃｍ3 以上で１．９ｇ／ｃｍ3 以下のもので
あることが望ましい。密度が１．４ｇ／ｃｍ3 未満では
強度および熱伝導性が充分高くならず、また１．９ｇ／
ｃｍ3 を超えるようにすると、大型のプレス装置が必要
となってコストが嵩むからである。In the expansive graphite heat sink of the present invention, it is desirable that the expansive graphite heat sink has a density of 1.4 g / cm 3 or more and 1.9 g / cm 3 or less. If the density is less than 1.4 g / cm 3 , strength and thermal conductivity are not sufficiently high, and 1.9 g / cm 3
This is because if it exceeds 3 cm, a large press machine is required and the cost increases.
【００１２】[0012]
【発明の実施の形態】以下に、この発明の実施の形態を
実施例によって、図面に基づき詳細に説明する。ここ
に、図１は、この発明の膨張黒鉛製ヒートシンクの製造
方法の一実施例で製造した膨張黒鉛製ヒートシンクを示
す斜視図であり、図中符号１はその実施例の製造方法で
製造した膨張黒鉛製ヒートシンクを示す。この実施例の
製造方法では、先ず、通常の膨張黒鉛シートを粉砕し
て、粒径０．５ｍｍが粒度分布の中心になる膨張黒鉛チ
ップを作成し、その膨張黒鉛チップを恒温槽内で平置き
して（平らにならして）１００℃の雰囲気で１時間放置
して充分乾燥させた後、吸湿しないようにデシケータ内
に保存し、次いで、その保存しておいた膨張黒鉛チップ
を金型内に充填して面圧８００ｋｇｆ／ｃｍ2 で図１中
矢印Ｐで示す方向に圧縮成形して、互いに平行な三枚の
板状の放熱フィン２を基部３に立設したヒートシンク形
状に形成することで、膨張黒鉛製ヒートシンク１を製造
しており、その密度は１．８ｇ／ｃｍ3 である。なお、
図１中のヒートシンク１の各部寸法の単位はｍｍであ
る。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will now be described in detail with reference to the drawings by way of examples. FIG. 1 is a perspective view showing an expanded graphite heat sink manufactured by an embodiment of the method for manufacturing an expanded graphite heat sink according to the present invention. Reference numeral 1 in the drawing denotes an expansion manufactured by the manufacturing method of the embodiment. 1 shows a graphite heat sink. In the manufacturing method of this example, first, an ordinary expanded graphite sheet was crushed to prepare expanded graphite chips having a particle size of 0.5 mm as the center of the particle size distribution, and the expanded graphite chips were placed flat in a constant temperature bath. Then (flatten) and leave it in an atmosphere of 100 ° C for 1 hour to fully dry it, then store it in a desiccator so as not to absorb moisture, and then store the stored expanded graphite chip in a mold. 1 and then compression-molded in a direction indicated by an arrow P in FIG. 1 at a surface pressure of 800 kgf / cm 2 to form three plate-like heat radiation fins 2 parallel to each other in a heat sink shape standing on a base 3. Then, the expanded graphite heat sink 1 is manufactured, and the density thereof is 1.8 g / cm 3 . In addition,
The unit of the dimensions of each part of the heat sink 1 in FIG. 1 is mm.
【００１３】かかる実施例の製造方法で製造した膨張黒
鉛製ヒートシンク１は、図１では基部３の下向きの面が
ＣＰＵ等の半導体部品その他の発熱部品の表面に密接す
るような配置で用いられて、その下向きの面を介して発
熱部品から熱を伝えられ、その熱を、主として、基部３
に立設した放熱フィン２へ伝導して放熱フィン２から大
気中に放散させる。The expanded graphite heat sink 1 manufactured by the manufacturing method of the embodiment is used in such an arrangement that the downward surface of the base portion 3 is in close contact with the surface of a semiconductor component such as a CPU or other heat generating component in FIG. , The heat is transmitted from the heat-generating component through the downward surface, and the heat is mainly transmitted to the base 3
The heat is dissipated from the heat radiation fins 2 to the atmosphere by being conducted to the heat radiation fins 2 installed upright.
【００１４】表１は、この実施例の製造方法で製造した
膨張黒鉛製ヒートシンク１から採取した試片と、従来の
アルミニウム製ヒートシンクから採取した試片とのそれ
ぞれについて、熱伝導率と密度とを計測した結果を示す
ものであり、各試片の熱伝導方向は、ヒートシンクとし
ての主たる熱伝導方向である図１では下方から上方への
方向とし、熱伝導率の測定は２５℃にて行った。Table 1 shows the thermal conductivity and the density of each of the sample taken from the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment and the sample taken from the conventional aluminum heat sink. The measurement results are shown. The heat conduction direction of each sample is from the lower direction to the upper direction in FIG. 1, which is the main heat conduction direction as a heat sink, and the heat conductivity was measured at 25 ° C. .
【表１】
この表１から明らかなように、この実施例の製造方法で
製造した膨張黒鉛製ヒートシンク１は従来のアルミニウ
ム製ヒートシンクと比較して、製品重量が軽減されると
ともに、熱伝導率が大幅に向上している。[Table 1] As is clear from Table 1, the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment has a reduced product weight and a significantly improved thermal conductivity as compared with the conventional aluminum heat sink. ing.
【００１５】かくして、この実施例の製造方法で製造し
た膨張黒鉛製ヒートシンク１によれば、その素材である
膨張黒鉛の軽量性および良好な熱伝導性により、従来の
アルミニウム製ヒートシンクよりも軽量で放熱性の高い
ヒートシンクをもたらすことができ、しかも膨張黒鉛チ
ップを金型内に充填し所定のヒートシンク形状に圧縮成
形しているので、切削による膨張黒鉛の飛散を防止して
環境汚染を回避し得るとともに、複雑な放熱フィン２の
形状の細部まで密度を均一にし得て熱伝導性ひいては放
熱特性を均一にすることができ、さらに、充分に乾燥さ
せた膨張黒鉛チップを圧縮成形しているので、膨張黒鉛
の層間への水分の介在による層間剥離を防止し得て、放
熱フィン２および基部３に充分な強度を持たせることが
できる。Thus, according to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, due to the lightness and good thermal conductivity of the expanded graphite which is the material thereof, it is lighter and heat radiating than the conventional aluminum heat sink. A heat sink with high performance can be provided, and since expanded graphite chips are filled in a mold and compression-molded into a predetermined heat sink shape, scattering of expanded graphite due to cutting can be prevented and environmental pollution can be avoided. The density of the complicated heat dissipating fins 2 can be made uniform and the heat conductivity and hence the heat dissipation characteristics can be made uniform. Furthermore, since the fully dried expanded graphite chips are compression molded, It is possible to prevent delamination due to the inclusion of moisture between the layers of graphite, and to give the radiation fins 2 and the base 3 sufficient strength.
【００１６】また、この実施例の製造方法で製造した膨
張黒鉛製ヒートシンク１によれば、圧縮成形時の加圧方
向Ｐが、ヒートシンク形状に応じた熱を流す方向である
図１では下方から上方へ向かう方向と略直交する方向と
なっているので、圧縮成形によって生じた熱異方性に対
し、ヒートシンクとして、より良好な熱伝導性を得るこ
とができる。Further, according to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, the pressurizing direction P at the time of compression molding is a direction in which heat corresponding to the shape of the heat sink flows, and in FIG. Since it is a direction substantially orthogonal to the direction toward, it is possible to obtain better heat conductivity as a heat sink against the thermal anisotropy caused by compression molding.
【００１７】さらにこの実施例の製造方法で製造した膨
張黒鉛製ヒートシンク１によれば、膨張黒鉛チップの粒
径が０．５ｍｍ〜１．０ｍｍであるので、圧縮成形時の
潰れ量が多くなって大きな金型が必要となりコストが嵩
むということがなく、しかも、金型内で充分に圧縮成形
することが困難となって隙間が生ずるということもな
い。Further, according to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, since the expanded graphite chips have a particle size of 0.5 mm to 1.0 mm, the amount of crushing during compression molding increases. A large mold is not required and the cost is not increased, and furthermore, it is difficult to sufficiently perform compression molding in the mold and a gap is not generated.
【００１８】さらにこの実施例の製造方法で製造した膨
張黒鉛製ヒートシンク１によれば、膨張黒鉛チップの乾
燥を、その膨張黒鉛のチップを平置きして１００℃の雰
囲気で１時間放置することで行って、充分乾燥させた膨
張黒鉛チップを用いているので、層間剥離を有効に防止
し得て、放熱フィン２および基部３に充分な強度を持た
せることができる。Further, according to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, the expanded graphite chip is dried by leaving the expanded graphite chip flat and left in an atmosphere of 100 ° C. for 1 hour. Since the expanded graphite chips that have been sufficiently dried are used, delamination can be effectively prevented, and the radiation fins 2 and the base 3 can have sufficient strength.
【００１９】さらにこの実施例の製造方法で製造した膨
張黒鉛製ヒートシンク１によれば、圧縮成形を８００ｋ
ｇｆ／ｃｍ2 の面圧で加圧して行っているので、膨張黒
鉛チップを充分に圧縮成形し得る一方、大型のプレス装
置が必要となってコストが嵩むことがない。Further, according to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, compression molding is performed at 800 k.
Since the pressure is applied with a surface pressure of gf / cm 2 , the expanded graphite chips can be sufficiently compression-molded, but a large press machine is not required and the cost does not increase.
【００２０】そしてこの実施例の製造方法で製造した膨
張黒鉛製ヒートシンク１によれば、密度が１．８ｇ／ｃ
ｍ3 であるので、強度および熱伝導性を充分高くし得る
一方、大型のプレス装置が必要となってコストが嵩むこ
とがない。According to the expanded graphite heat sink 1 manufactured by the manufacturing method of this embodiment, the density is 1.8 g / c.
Since it is m 3 , the strength and the thermal conductivity can be sufficiently increased, but a large press machine is required and the cost does not increase.
【００２１】以上、図示例に基づき説明したが、この発
明は上述の例に限定されるものでなく、例えば、この発
明の膨張黒鉛製ヒートシンクの製造方法で製造する膨張
黒鉛製ヒートシンクの形状は、板状の放熱フィンを放射
状に立設したものや、棒状の放熱部を林立させたもの等
でも良く、あるいはその高い熱伝導率を利用して、他の
ヒートシンクや冷却ファン、ヒートパイプや水冷装置等
に熱を逃がす形状としても良い。Although the present invention is not limited to the above-mentioned examples, for example, the shape of the expanded graphite heat sink manufactured by the method for manufacturing an expanded graphite heat sink of the present invention is as follows. It may be one in which plate-shaped heat radiating fins are erected in a radial manner or one in which rod-shaped heat radiating parts are erected, or by utilizing its high thermal conductivity, other heat sinks, cooling fans, heat pipes, water cooling devices, etc. It may have a shape that allows heat to escape.
【００２２】またこの発明の膨張黒鉛製ヒートシンクの
製造方法では、膨張黒鉛チップを圧縮成形することを利
用して、ヒートシンクに取付金具等の部品をインサート
成形するようにしても良い。Further, in the method of manufacturing the expanded graphite heat sink of the present invention, compression molding of the expanded graphite chip may be utilized to insert-mold components such as mounting brackets into the heat sink.
【図１】 この発明の膨張黒鉛製ヒートシンクの製造方
法の一実施例で製造した膨張黒鉛製ヒートシンクを圧縮
成形時の加圧方向とともに示す斜視図である。FIG. 1 is a perspective view showing an expanded graphite heat sink manufactured by an embodiment of a method for manufacturing an expanded graphite heat sink of the present invention, together with a pressing direction during compression molding.
１ 膨張黒鉛製ヒートシンク ２ 放熱フィン ３ 基部 1 Expanded graphite heat sink 2 radiating fins 3 base
───────────────────────────────────────────────────── フロントページの続き (72)発明者 小島 秀一 東京都中央区日本橋３−９−２ 巴工業 株式会社内 (72)発明者 小笠原 勲 東京都中央区日本橋３−９−２ 巴工業 株式会社内 (56)参考文献 特開 平６−183836（ＪＰ，Ａ) 特開 平２−153810（ＪＰ，Ａ) 実開 昭62−188151（ＪＰ，Ｕ) 国際公開99／019908（ＷＯ，Ａ１) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/373 H01L 23/36 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Shuichi Kojima 3-9-2 Nihombashi, Chuo-ku, Tokyo Tomoe Kogyo Co., Ltd. (72) Inventor Isao Ogasawara 3-9-2 Nihombashi, Chuo-ku, Tokyo Tomoe Kogyo Co., Ltd. (56) References Japanese Unexamined Patent Publication No. 6-183836 (JP, A) Japanese Unexamined Patent Publication No. 2-153810 (JP, A) Actual Development Sho 62-188151 (JP, U) International Publication 99/019908 (WO, A1) ( 58) Fields investigated (Int.Cl. 7 , DB name) H01L 23/373 H01L 23/36
Claims (5)
後に金型内に充填して、所定のヒートシンク形状に圧縮
成形し、前記圧縮成形を、ヒートシンク形状に応じた熱を流す方
向と交差する方向に加圧して行うことを特徴とする、 膨
張黒鉛製ヒートシンクの製造方法。1. A method in which expanded graphite chips are sufficiently dried and then filled in a mold to be compression molded into a predetermined heat sink shape, and the compression molding is performed by applying heat corresponding to the heat sink shape.
A method for manufacturing a heat sink made of expanded graphite , which is performed by applying pressure in a direction intersecting with the direction .
心が０．１ｍｍ以上で３ｍｍ以下のものである、請求項
１記載の膨張黒鉛製ヒートシンクの製造方法。2. The method of manufacturing an expanded graphite heat sink according to claim 1, wherein the expanded graphite chip has a particle size distribution center of 0.1 mm or more and 3 mm or less.
置きして１００℃以上の雰囲気で１時間以上大気中に放
置するものである、請求項１または２記載の膨張黒鉛製
ヒートシンクの製造方法。3. The production of an expanded graphite heat sink according to claim 1, wherein the drying is performed by placing the expanded graphite chip flat and leaving the chip in the atmosphere at 100 ° C. or higher for 1 hour or longer. Way .
以上で２０００ｋｇｆ／ｃｍ2 以下の面圧で加圧して行
うものである、請求項１から３までの何れか記載の膨張
黒鉛製ヒートシンクの製造方法。4. The compression molding is 300 kgf / cm 2
The method for producing an expanded graphite heat sink according to any one of claims 1 to 3, which is performed by applying a surface pressure of 2000 kgf / cm 2 or less.
１．４ｇ／ｃｍ3 以上で１．９ｇ／ｃｍ3 以下のもので
ある、請求項１から４までの何れか記載の膨張黒鉛製ヒ
ートシンクの製造方法。Wherein said expanded graphite heat sink has a density is of 1.9 g / cm 3 or less at 1.4 g / cm 3 or more, the expanded graphite heat sink set forth in any one of claims 1 to 4 Manufacturing method .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000272011A JP3472252B2 (en) | 2000-09-07 | 2000-09-07 | Method for manufacturing expanded graphite heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000272011A JP3472252B2 (en) | 2000-09-07 | 2000-09-07 | Method for manufacturing expanded graphite heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002083913A JP2002083913A (en) | 2002-03-22 |
| JP3472252B2 true JP3472252B2 (en) | 2003-12-02 |
Family
ID=18758214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000272011A Expired - Fee Related JP3472252B2 (en) | 2000-09-07 | 2000-09-07 | Method for manufacturing expanded graphite heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3472252B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6749010B2 (en) * | 2002-06-28 | 2004-06-15 | Advanced Energy Technology Inc. | Composite heat sink with metal base and graphite fins |
| US20040118553A1 (en) * | 2002-12-23 | 2004-06-24 | Graftech, Inc. | Flexible graphite thermal management devices |
| KR101210090B1 (en) | 2006-03-03 | 2012-12-07 | 엘지이노텍 주식회사 | Metal core printed circuit board and light-emitting diode packaging method thereof |
| JP2017132650A (en) * | 2016-01-27 | 2017-08-03 | 明智セラミックス株式会社 | Highly heat-conductive anisotropic graphite material and production method thereof |
-
2000
- 2000-09-07 JP JP2000272011A patent/JP3472252B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002083913A (en) | 2002-03-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7200006B2 (en) | Compliant thermal interface for electronic equipment | |
| US6883592B2 (en) | Heatsink for electronic component | |
| JP4045241B2 (en) | Heat sink with improved cooling capacity and semiconductor device including the heat sink | |
| US20070279866A1 (en) | Heat dissipation assembly | |
| EP1135978B1 (en) | Heatsink for electronic component, and apparatus and method for manufacturing the same | |
| US20070261242A1 (en) | Method for manufacturing phase change type heat sink | |
| JP2001085877A (en) | Heat sink with heat receiving surface provided with protrusions | |
| JP3472252B2 (en) | Method for manufacturing expanded graphite heat sink | |
| JP3434711B2 (en) | Heat dissipation sheet | |
| US7491421B2 (en) | Graphite base for heat sink, method of making graphite base and heat sink | |
| US20050133199A1 (en) | Heat sink with heat pipes | |
| JP3792180B2 (en) | Manufacturing method of heat dissipation parts | |
| JP2003037227A (en) | Heat sink made of expansible graphite | |
| JP3213581U (en) | Multi-directional heat dissipation structure for interface cards | |
| JP2003060140A (en) | Heat sink and heat radiation device | |
| KR20070051308A (en) | Semiconductor cooling system and process for manufacturing the same | |
| JPH0722540A (en) | Heat sink for semiconductor package | |
| US20040261979A1 (en) | [heat sink structure] | |
| JP2000294700A (en) | Resin molding and method of manufacturing the same and application field | |
| TWI234863B (en) | Chip package structure and thermal dissipating element thereof | |
| CN1979826A (en) | Radiating apparatus and high-heat-conductive composite material used therefor | |
| JP2008135542A (en) | Thermal conductive sheet, its manufacturing method and electronic device | |
| TWI449497B (en) | Method of manufacturing fin | |
| JPH1065072A (en) | Heat radiating electrode structure | |
| WO2010098028A1 (en) | Heat generation element cooling structure, heat generation element cooling device, electronic device provided with cooling device, and cooling device producing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080912 Year of fee payment: 5 |
|
| S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090912 Year of fee payment: 6 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100912 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |