JP3441384B2 - Electronic components - Google Patents

Electronic components

Info

Publication number
JP3441384B2
JP3441384B2 JP30966198A JP30966198A JP3441384B2 JP 3441384 B2 JP3441384 B2 JP 3441384B2 JP 30966198 A JP30966198 A JP 30966198A JP 30966198 A JP30966198 A JP 30966198A JP 3441384 B2 JP3441384 B2 JP 3441384B2
Authority
JP
Japan
Prior art keywords
resin
cavity
container
chip
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP30966198A
Other languages
Japanese (ja)
Other versions
JP2000138324A (en
Inventor
英臣 米村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP30966198A priority Critical patent/JP3441384B2/en
Priority to US09/387,216 priority patent/US6229249B1/en
Publication of JP2000138324A publication Critical patent/JP2000138324A/en
Application granted granted Critical
Publication of JP3441384B2 publication Critical patent/JP3441384B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【発明の属する技術分野】本発明は、キャビティを有す
る容器内にフリップチップＩＣ素子を収容し、複数の樹
脂で被覆した電子部品に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component in which a flip-chip IC element is housed in a container having a cavity and covered with a plurality of resins.

【０００２】[0002]

【従来の技術】容器の底面に形成したキャビティにバン
プを介してフェイスボンディング方式でフリップチップ
ＩＣ素子が実装され、このフリップチップＩＣ素子と容
器の底面との間隙にフリップチップＩＣ素子を被覆する
ように樹脂が充填された構造の電子部品が知られてい
る。例えば、図２に示すように、多層配線基板構造の容
器１３の上面に水晶振動子１５が実装され、下面にキャ
ビティ１９が設けられて、そのキャビティ１９に水晶振
動子１５の温度補償を行うためのフリップチップＩＣ素
子（以下、単に「ＩＣチップ」という）１２が実装され
た温度補償型水晶発振器１１である。2. Description of the Related Art A flip chip IC element is mounted on a cavity formed on the bottom surface of a container by a face bonding method via a bump, and a gap between the flip chip IC element and the bottom surface of the container is covered with the flip chip IC element. An electronic component having a structure in which a resin is filled in is known. For example, as shown in FIG. 2, a crystal oscillator 15 is mounted on the upper surface of a container 13 having a multilayer wiring board structure, and a cavity 19 is provided on the lower surface thereof to perform temperature compensation of the crystal oscillator 15 in the cavity 19. This is a temperature-compensated crystal oscillator 11 on which a flip-chip IC element (hereinafter, simply referred to as “IC chip”) 12 is mounted.

【０００３】従来、このような電子部品では、ＩＣチッ
プ１２と容器１３との間隙にＩＣチップ１２を被覆する
ように樹脂１７を充填するとき、余程注意しなければキ
ャビティ１９の外に樹脂１７がはみ出して、キャビティ
１９の開口端面に樹脂１７が付着しやすかった。特に、
ＩＣチップ１２と容器１３との接合強度を強化するとと
もに、ＩＣチップ１２を湿気や塵から保護するため、一
層目に接着性に優れた樹脂１７ａを充填し、二層目にそ
の上に耐湿性に優れた樹脂１７ｂを充填する場合、二層
目に充填される樹脂１７ｂがキャビティ１９の開口から
はみ出して周囲の表面に付着することが多かった。Conventionally, in such an electronic component, when the resin 17 is filled in the gap between the IC chip 12 and the container 13 so as to cover the IC chip 12, the resin 17 is placed outside the cavity 19 unless great care is taken. It was easy for the resin 17 to stick out and adhere to the open end surface of the cavity 19. In particular,
In order to enhance the bonding strength between the IC chip 12 and the container 13 and protect the IC chip 12 from moisture and dust, the resin 17a having excellent adhesiveness is filled in the first layer and the moisture resistance is formed on the second layer. When the excellent resin 17b is filled, the resin 17b filled in the second layer often protrudes from the opening of the cavity 19 and adheres to the surrounding surface.

【０００４】[0004]

【発明が解決しようとする課題】しかし、上記のように
樹脂１７がキャビティ１９からはみ出して周囲の表面に
付着すると、製品高さの規格外れにより検査で不良とな
る。また、キャビティの周囲にマザーボードと接続され
る入出力端子１３ｆが形成されている製品においてはマ
ザーボードとの導通不良の原因ともなる。However, if the resin 17 sticks out of the cavity 19 and adheres to the surrounding surface as described above, the height of the product is out of the standard, so that the inspection fails. In addition, in a product in which the input / output terminal 13f connected to the mother board is formed around the cavity, it may cause poor conduction with the mother board.

【０００５】それ故、本発明の目的は、ＩＣチップを収
容するキャビティから樹脂がはみ出ていない電子部品を
提供することにある。Therefore, an object of the present invention is to provide an electronic component in which the resin does not protrude from the cavity that houses the IC chip.

【０００６】本発明の電子部品は、フリップチップ実装
されるＩＣ素子を収容するためのキャビティを有する容
器に、前記ＩＣ素子をモールドすべく、前記キャビティ
内に、第１の樹脂と、該第１の樹脂を被覆する第２の樹
脂とを充填して成る電子部品において、前記容器は前記
キャビティの開口端面に入出力端子を有し、かつ、前記
キャビティの壁面で、前記第１の樹脂と前記第２の樹脂
との境界部に段部が周設されていることを特徴とするも
のである。また本発明の電子部品は、前記第１の樹脂が
前記ＩＣ素子と前記容器のキャビティ底面との間隙に充
足されているとともに、前記ＩＣ素子の外表面が前記第
２の樹脂によって被覆されていることを特徴とするもの
である。In the electronic component of the present invention, in order to mold the IC element in a container having a cavity for accommodating the IC element to be flip-chip mounted, the first resin and the first resin are provided in the cavity. In the electronic component formed by filling the second resin for covering the resin, the container has an input / output terminal on the opening end face of the cavity, and the wall surface of the cavity is provided with the first resin and the resin. It is characterized in that a step portion is provided around the boundary with the second resin. Further, in the electronic component of the present invention, the first resin is filled in the gap between the IC element and the bottom surface of the cavity of the container, and the outer surface of the IC element is covered with the second resin. It is characterized by that.

【０００７】本発明と異なり、上記従来の電子部品にお
いては、キャビティの壁面は平坦であった。従って、樹
脂を充填すると、容器のキャビティの壁面に対する樹脂
の濡れ性と表面張力との関係で、樹脂がキャビティの端
縁に達してしまう。このため、樹脂の充填条件の誤差に
よって樹脂がキャビティからはみ出して周囲に付着した
のである。特に樹脂を２層に分けて充填する場合、第１
の樹脂の充填時に樹脂がキャビティの端縁に達している
ので、第２の樹脂の充填時には端縁で上塗りされてはみ
出すことが多かったことを本発明者が見出したのであ
る。Unlike the present invention, in the above conventional electronic component, the wall surface of the cavity is flat. Therefore, when the resin is filled, the resin reaches the edge of the cavity due to the relationship between the wettability of the resin with respect to the wall surface of the cavity of the container and the surface tension. Therefore, due to an error in the resin filling condition, the resin sticks out of the cavity and adheres to the surroundings. Especially when the resin is divided into two layers and filled, the first
The present inventor has found that the resin reaches the edge of the cavity at the time of filling with the resin, so that the resin is often overcoated with the edge when the second resin is filled.

【０００８】これに対して、本発明の構成によれば、第
１の樹脂と第２の樹脂との界面を規定する段部を形成し
ている。したがって、キャビティ内に第１の樹脂を充填
しても最初の段部の端縁で樹脂のはい上がりが止まる。
また、最も表面側の第２の樹脂を充填すると、キャビテ
ィー部開口の端縁で樹脂のはい上がりが止まる。即ち、
段部が設けられていない構造に比べてキャビティの端縁
までで樹脂のはい上がりが止まりやすい。On the other hand, according to the structure of the present invention, the step portion which defines the interface between the first resin and the second resin is formed. Therefore, even if the cavity is filled with the first resin, the resin stops rising at the edge of the first step.
Moreover, when the second resin on the outermost surface side is filled, the rising of the resin stops at the edge of the cavity opening. That is,
Compared to the structure without the stepped portion, the rising of the resin is more likely to stop up to the edge of the cavity.

【０００９】以上のように、この段部は、樹脂のはい上
がりを規制することになり、樹脂の充填量の目安とな
り、また、表面側にモールドされる樹脂との界面を規定
することになる。As described above, this stepped portion regulates the rising of the resin, serves as a guide for the filling amount of the resin, and also defines the interface with the resin molded on the surface side. .

【００１０】従って、前記段部は、前記樹脂が容器のキ
ャビティの底に充填される第１の樹脂と第１の樹脂に重
ねて充填される第２の樹脂との２層以上からなるとき
は、その層数をｍとするとき、（ｍ−１）段とすること
が重要となる。また、樹脂を２層以上とするときは、前
記第１の樹脂としては充填時に第２の樹脂よりも低い粘
度を有し、第２の樹脂としては充填後に第１の樹脂より
も高い粘度を有するものを用いるのが好ましい。第１の
樹脂として低粘度のものを用いれば、第１の樹脂が充填
もれがなく、ＩＣチップの周囲、特にその底面に回り込
むので、ＩＣチップと容器のキャビティ部底面との接合
強度を増すことができるからである。そして、第２の樹
脂として高粘度のものを用いれば、低い段部でもキャビ
ティからはみ出しがなく充填でき、湿気や塵からＩＣチ
ップを守ることができる。Therefore, when the stepped portion is composed of two or more layers of the first resin with which the resin is filled in the bottom of the cavity of the container and the second resin with which the first resin is overlaid and filled. When the number of layers is m, it is important to have (m-1) stages. When the resin has two or more layers, the first resin has a lower viscosity than the second resin when filled, and the second resin has a higher viscosity than the first resin after filling. It is preferable to use one that has. If a low-viscosity resin is used as the first resin, the first resin does not leak and fills up around the IC chip, especially around the bottom surface thereof, thereby increasing the bonding strength between the IC chip and the bottom surface of the cavity of the container. Because you can. If a high-viscosity resin is used as the second resin, even the low step portion can be filled without protruding from the cavity, and the IC chip can be protected from moisture and dust.

【００１１】各段部からキャビティーの開口までの高さ
は、０．１ｍｍ以上が好ましい。０．１ｍｍに満たない
と、樹脂の塗布量からして段部の作用が乏しくなるから
である。The height from each step to the opening of the cavity is preferably 0.1 mm or more. This is because if the thickness is less than 0.1 mm, the action of the step becomes poor in terms of the amount of resin applied.

【００１２】前記容器は、キャビティの開口端面に入出
力端子が形成されているものであるとき、本発明の作用
が顕著である。本発明によれば、開口端面に樹脂が付着
しにくいので、入出力端子の導通不良が防止されるから
である。The operation of the present invention is remarkable when the container has an input / output terminal formed on the open end surface of the cavity. According to the present invention, the resin is unlikely to adhere to the opening end face, so that the conduction failure of the input / output terminal is prevented.

【００１３】[0013]

【発明の実施の形態】本発明の実施形態を図面とともに
説明する。図１は実施形態の電子部品である水晶発振器
を示す断面図である。水晶発振器１は、フリップチップ
実装されるＩＣ素子（以下、「ＩＣチップ」という）
２、セラミックの多層構造の容器３、コンデンサなどの
２つの回路素子４，４、水晶振動子５、金属製の蓋６及
び樹脂７から主に構成されている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing a crystal oscillator which is an electronic component of the embodiment. The crystal oscillator 1 is an IC element that is flip-chip mounted (hereinafter referred to as “IC chip”).
2, a ceramic multi-layered container 3, two circuit elements 4 and 4 such as capacitors, a crystal oscillator 5, a metallic lid 6 and a resin 7.

【００１４】ＩＣチップ２には、水晶振動子５の温度依
存性を補償する制御回路などが組まれている。容器３
は、板状の２層のセラミック絶縁層３ａ，３ｂと、枠状
の２層のセラミック絶縁層３ｃ，３ｄとが一体的に積層
されたものである。そして、絶縁層３ａの表面に金属製
のシールリング８が接合され、絶縁層３ａとシールリン
グ８とで囲まれる空間に水晶振動子５が搭載されて蓋６
で気密的に閉塞される。The IC chip 2 incorporates a control circuit for compensating the temperature dependence of the crystal unit 5. Container 3
Is a plate-shaped two-layer ceramic insulating layer 3a, 3b and a frame-shaped two-layer ceramic insulating layer 3c, 3d integrally laminated. Then, a metal seal ring 8 is bonded to the surface of the insulating layer 3a, and the crystal resonator 5 is mounted in the space surrounded by the insulating layer 3a and the seal ring 8 to cover the lid 6.
Is airtightly closed.

【００１５】一方、これと反対側の絶縁層３ｂと絶縁層
３ｃ，３ｄとで囲まれる空間は、ＩＣチップ２を搭載す
るキャビティ９となる。絶縁層３ｃと絶縁層３ｄとは平
面視において互いに相似形であるが、絶縁層３ｄの厚さ
が０．１ｍｍであって絶縁層３ｃがそれよりも十分厚い
点で異なるほか、絶縁層３ｄでキャビティ９を形成すべ
く開口した面積は、絶縁層３ｃの開口面積より大きい。
このため、両絶縁層の内壁は、その面積差だけ絶縁層３
ｃが内側に突き出ており、絶縁層３ｄの厚さ分に相当す
る高さの段部３ｅが存在する。尚、このキャビティ９の
底面には、ＩＣチップ２の他に回路素子４も搭載されて
いる。そして、これらＩＣチップ２及び回路素子４と水
晶振動子とは容器３の内部に形成された配線パターンや
ビアホール導体によって電気的に接続され、更に絶縁層
３ｄの表面に形成された入出力端子３ｆによって外部回
路と接続可能にされている。On the other hand, the space surrounded by the insulating layer 3b and the insulating layers 3c and 3d on the opposite side becomes a cavity 9 for mounting the IC chip 2. Although the insulating layer 3c and the insulating layer 3d are similar to each other in a plan view, they differ in that the thickness of the insulating layer 3d is 0.1 mm and the insulating layer 3c is sufficiently thicker than the insulating layer 3d. The area opened to form the cavity 9 is larger than the opening area of the insulating layer 3c.
Therefore, the inner walls of both insulating layers have the same area difference as the insulating layer 3.
c projects inward, and there is a step 3e having a height corresponding to the thickness of the insulating layer 3d. In addition to the IC chip 2, the circuit element 4 is mounted on the bottom surface of the cavity 9. Then, the IC chip 2 and the circuit element 4 are electrically connected to the crystal unit by a wiring pattern or a via hole conductor formed inside the container 3, and further, an input / output terminal 3f formed on the surface of the insulating layer 3d. It can be connected to external circuits by.

【００１６】本実施例の水晶発振器１では、容器３の表
面に水晶振動子５を実装し、これを蓋６で閉塞し、次い
でＩＣチップ２を容器３の底面側キャビティ９内に実装
した後に、更にキャビティ９内に樹脂７が充填される。
樹脂７は、キャビティ９の底に充填される第１の樹脂７
ａと、その上に充填される第２の樹脂７ｂとからなる。In the crystal oscillator 1 of this embodiment, the crystal resonator 5 is mounted on the surface of the container 3, the cover 6 is closed by the lid 6, and then the IC chip 2 is mounted in the bottom side cavity 9 of the container 3. Further, the resin 7 is filled in the cavity 9.
The resin 7 is the first resin 7 filled in the bottom of the cavity 9.
It is composed of a and the second resin 7b filled on it.

【００１７】第１の樹脂７ａは、充填時の粘度が３００
０ｃｐｓ、収縮率が１．７％、エポキシ系硬化樹脂であ
って、ＩＣチップ２と容器３との接合を強化するための
ものである。従って、充填量は、ＩＣチップ２と容器３
のキャビティ９の底面との間隙を充足し、且つＩＣチッ
プ２の側面にまで回り込む程度とされる。樹脂７ａは、
このように低粘度であるために、上述の間隙に回り込み
やすいが、キャビティ９の壁面に濡れやすい。しかし、
段部３ｅが存在するので、キャビティ９の底面から段部
３ｅまでの壁面までしか濡れない。The first resin 7a has a viscosity of 300 when filled.
It is 0 cps, the shrinkage rate is 1.7%, and is an epoxy-based curable resin for strengthening the bonding between the IC chip 2 and the container 3. Therefore, the filling amount is the IC chip 2 and the container 3.
The gap between the bottom surface of the cavity 9 and the side surface of the IC chip 2 is filled. Resin 7a is
Since it has such a low viscosity, it easily wraps around the above-mentioned gap, but easily wets the wall surface of the cavity 9. But,
Since the step portion 3e exists, only the wall surface from the bottom surface of the cavity 9 to the step portion 3e is wet.

【００１８】第２の樹脂７ｂは、充填時の粘度が１２Ｐ
ａ・ｓ、収縮率が１．０％のエポキシ系硬化樹脂であっ
て、外部からの湿気及び塵の侵入を防ぐためのものであ
る。The second resin 7b has a viscosity of 12 P when filled.
It is an epoxy-based curable resin having an a · s and a shrinkage of 1.0%, and is for preventing intrusion of moisture and dust from the outside.

【００１９】従って、充填量は平均的な厚さが０．１ｍ
ｍ以下になる程度である。前記絶縁層２ｄの厚さは、こ
の樹脂７ｂの厚さとの関係で定められた。樹脂７ｂは、
このように樹脂７ａの上に重ねて充填されるが、粘度が
高くてキャビティ９の壁面に濡れにくい上に、段部３ｅ
が存在するので、キャビティ９からはみ出ることはな
い。よって、水晶発振器１全体の高さが規格から外れる
ことはないし、入出力端子３ｆが絶縁被覆されてしまう
こともない。Therefore, the filling amount has an average thickness of 0.1 m.
It is about m or less. The thickness of the insulating layer 2d was determined in relation to the thickness of the resin 7b. Resin 7b is
Thus, the resin 7a is overlaid and filled, but the viscosity is high and the wall surface of the cavity 9 is hard to wet, and the step portion 3e is formed.
Exists, so that it does not protrude from the cavity 9. Therefore, the height of the crystal oscillator 1 as a whole does not deviate from the standard, and the input / output terminal 3f is not insulated.

【００２０】尚、上述の実施例はキャビティに２種類の
樹脂を充填している例であり、キャビティ壁面に１つの
段部が形成されている。しかし、３種類以上の樹脂を充
填する場合、キャビティ壁面に形成する段部の数を２以
上とし、キャビティ壁面に階段状の段部を形成すればよ
い。The above embodiment is an example in which the cavity is filled with two kinds of resin, and one step is formed on the wall surface of the cavity. However, in the case of filling three or more kinds of resins, the number of steps formed on the wall surface of the cavity may be two or more, and the stepped steps may be formed on the wall surface of the cavity.

【００２１】[0021]

【発明の効果】以上のように、本発明によれば、簡単な
構成で電子部品の歩留まりを向上させることができる。
また、プリント配線基板に安定した実装が可能な電子部
品となる。As described above, according to the present invention, the yield of electronic components can be improved with a simple structure.
Further, the electronic component can be stably mounted on the printed wiring board.

【図面の簡単な説明】[Brief description of drawings]

【図１】実施形態の電子部品を示す断面図である。FIG. 1 is a cross-sectional view showing an electronic component of an embodiment.

【図２】従来の電子部品を示す断面図である。FIG. 2 is a sectional view showing a conventional electronic component.

【符号の説明】[Explanation of symbols]

１，１１ 水晶発振器（電子部品） ２，１２ ＩＣチップ ３，１３ 容器 ４，１４ 回路素子 ５，１５ 水晶振動子 ６，１６ 蓋 ７，１７ 樹脂 ９，１９ キャビティ 1,11 Crystal oscillator (electronic parts) 2,12 IC chip 3,13 containers 4,14 circuit elements 5,15 Crystal oscillator 6,16 lid 7,17 resin 9,19 cavities

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】フリップチップ実装されるＩＣ素子を収容
するためのキャビティを有する容器に、前記ＩＣ素子を
モールドすべく、前記キャビティ内に、第１の樹脂と、
該第１の樹脂を被覆する第２の樹脂とを充填して成る電
子部品において、前記容器は前記キャビティの開口端面に入出力端子を有
し、かつ、 前記キャビティの壁面で、前記第１の樹脂と
前記第２の樹脂との境界部に段部が周設されていること
を特徴とする電子部品。1. An IC element for flip-chip mounting is accommodated.
A first resin in the cavity for molding the IC element in a container having a cavity for
In the electronic component formed by filling the first resin with the second resin, the container has an input / output terminal on the opening end face of the cavity.
And, and, on the wall surface of the cavity, said first resin
Electronic components, wherein a stepped portion is circumferentially provided at the boundary between the second resin. 【請求項２】前記第１の樹脂が前記ＩＣ素子と前記容器
のキャビティ底面との間隙に充足されているとともに、
前記ＩＣ素子の外表面が前記第２の樹脂によって被覆さ
れていることを特徴とする請求項１に記載の電子部品。 2. The first resin is the IC element and the container.
Is filled in the gap between the bottom of the cavity and
The outer surface of the IC element is covered with the second resin.
The electronic component according to claim 1, wherein the electronic component is provided.
JP30966198A 1998-08-31 1998-10-30 Electronic components Expired - Fee Related JP3441384B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP30966198A JP3441384B2 (en) 1998-10-30 1998-10-30 Electronic components
US09/387,216 US6229249B1 (en) 1998-08-31 1999-08-31 Surface-mount type crystal oscillator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30966198A JP3441384B2 (en) 1998-10-30 1998-10-30 Electronic components

Publications (2)

Publication Number Publication Date
JP2000138324A JP2000138324A (en) 2000-05-16
JP3441384B2 true JP3441384B2 (en) 2003-09-02

Family

ID=17995750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30966198A Expired - Fee Related JP3441384B2 (en) 1998-08-31 1998-10-30 Electronic components

Country Status (1)

Country Link
JP (1) JP3441384B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003046337A (en) * 2001-07-31 2003-02-14 Kinseki Ltd Piezoelectric oscillator

Also Published As

Publication number Publication date
JP2000138324A (en) 2000-05-16

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