JP3427860B2 - Optical device module and manufacturing method thereof - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical device module used in an optical fiber communication network and a method for manufacturing the same.

[0002]

2. Description of the Related Art An optical device module is an optical device,
Generally, a waveguide substrate with an optical waveguide formed on the surface,
It is composed of fiber connectors joined to both ends of the waveguide substrate, and each optical fiber held by the fiber connector is configured to be optically coupled to a corresponding optical waveguide on the waveguide substrate. Here, the optical device includes the waveguide substrate itself, a device in which various optical components are added to the waveguide substrate, or a device in which the waveguide forming surface of the waveguide substrate is covered with resin or the like.

In such an optical device module, when the joint between the waveguide substrate and the fiber connector is exposed, the adhesive strength of the adhesive at the joint deteriorates due to heat, moisture, etc., and at the optical joint. Light loss and increased light reflection occur. Further, if the joint portion is exposed, it is also weak against impact.

Therefore, conventionally, the waveguide substrate and the fiber connector are housed in a housing, and the housing is filled with a jelly-like resin as a cushioning material. Examples of such a technique include those described in JP-A-5-27139 and JP-A-5-4.
The one described in Japanese Patent No. 5531 is known.

[0005]

However, since the housing in the prior art as described above is a two-piece type consisting of two halves of the same shape, there is a problem in hermeticity, and external heat, moisture, etc. May be affected.

Further, in the case of the two-piece type housing, it was difficult to fill the housing with the jelly-like resin without any gap.

Therefore, an object of the present invention is to provide an optical device module capable of effectively protecting the module body from mechanical shock, heat, moisture and the like, and a method of manufacturing the same.

[0008]

In order to achieve the above object, an optical device module according to the invention as defined in claim 1 comprises an optical device and a first optical fiber which is joined to one end of the optical device. A module main body having a holding first fiber connector and a second fiber connector holding a second optical fiber joined to the other end of the optical device, and the module main body is encapsulated. As described above, the present invention is characterized by including an encapsulant integrally molded from a first resin such as an epoxy resin or a urethane resin.

In such an optical device module, it is preferable to interpose a gel-like second resin such as a silicone resin or a urethane resin between the envelope and the module body.

According to an eighth aspect of the invention, in the method of manufacturing an optical device module having the above structure, the step of disposing the module body in the mold of the molding apparatus and at least the first and second fibers The step of supporting the module body so that the connector and the joint portion of these fiber connector and optical device are separated from the inner wall surface of the die, and the melted first part in the die in which the module body is arranged. The step of injecting and hardening the resin of No. 1 to form an encapsulant.

When the second resin is interposed between the encapsulant and the module body, the gel-like second resin is applied to the module body before the module body is placed in the mold. To do.

[0012]

In the optical device module having the above structure,
Since almost the entire module body is covered with the integrally molded first resin, it can be effectively protected from heat, moisture, and shock from the outside. In particular, by interposing the gel-like second resin between the encapsulant and the module main body, this gel-like resin functions as a cushioning material and heat of the adhesive material between the fiber connector and the optical device is increased. It is possible to allow movement of the fiber connector due to expansion or thermal contraction.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals.

FIG. 1 is a sectional view of an optical device module 100 according to the first embodiment. 2 to 5 are shown in FIG.
2 shows the manufacturing procedure of the optical device module of, and the structure will be clarified by explaining this procedure.
In these figures, reference numeral 10 is a waveguide substrate as an optical device in the optical device module 100, and a 1 × 4 branch type optical waveguide 12 is formed on the surface thereof. Such a waveguide substrate 10 is generally
SiO _{2 on} the surface of the silicon substrate by flame hydrolysis
It is made by using a method of depositing fine particles (FHD: flame deposition method).

The end faces of the waveguide substrate 10 on which the end faces of the optical waveguide 12 are located respectively have a first fiber connector 14 for holding the end of the first optical fiber 16 and an end of the second optical fiber 20. It is formed so as to be bonded to the second fiber connector 18 that holds the portion.

The first optical fiber 16 is a bare fiber 16a whose outer circumference is primarily coated with silicone resin or the like (not shown), and whose outer circumference is secondarily coated with nylon 16b or the like. Moreover, as clearly shown in FIG.
The first fiber connector 14 is composed of a V-groove substrate 22 having one V-groove 24 formed on the surface thereof, and a holding plate 26 adhered to the surface of the V-groove substrate 22. The end portion of the optical fiber 16 in which the bare fiber 16a is exposed is set in the V groove 24 of the V groove substrate 22, and the holding plate 16 is set.
By adhering to the V-groove substrate 22 with the adhesive 28,
The optical fiber 16 is held by the fiber connector 14.

The second optical fiber 20 is of a tape type or ribbon type. That is, this optical fiber 20 is a plurality of primary coated fibers (4 in this embodiment).
The bare fibers 20a are arranged in parallel with each other, and the bare fibers 20a are secondarily coated with nylon 20b or the like and bundled in a plane. Like the first fiber connector 14, the second fiber connector 18 includes a V-groove substrate 30 and a holding plate 32. Four V-grooves 34 are formed in parallel with each other on the surface of the V-groove substrate 30. In each V groove 34, the bare fiber 2
The corresponding end of the optical fiber 20 where 0a is exposed is set, and the pressing plate 32 is adhered onto the V-groove substrate 30 with the adhesive 36, so that the second optical fiber 20 is moved by the second fiber connector 18. It is pinched.

As shown in FIGS. 2 and 3, before attaching the fiber connectors 14 and 18 to the optical fibers 16 and 20, the rubber protective boot 3 provided in the final product.
It is preferable that 8 and 40 are attached to the optical fibers 16 and 20 in advance. The V-groove substrates 22 and 30 can be formed by, for example, grinding or etching a silicon substrate.

Next, as shown in FIG. 3, the first and second fiber connectors 14 and 18 are attached to the corresponding end faces of the waveguide substrate 10 with an adhesive, preferably an ultraviolet curable adhesive 42.
Are joined by. At this time, the first and second fiber connectors 14 and 18 are connected to the waveguide substrate 10 so that the end faces of the bare fibers 16a and 20a of the optical fibers 16 and 20 are optically coupled to the corresponding end faces of the optical waveguide 12. Be positioned.

When the module body 44 composed of the waveguide substrate 10 and the fiber connectors 14 and 18 is manufactured in this way, as shown in FIG. 4, the first and second optical fibers 16 and 20 are placed at appropriate positions. Is clamped by a pair of clamp members (support members) 46 and 48. Then, from one clamp member 46 or 48 to the other clamp member 48
Or these clamping members 46, 48 so that
By moving one or both of them, a predetermined tension is applied to the optical fibers 16 and 20, and the module main body 44 is suspended in a bridge shape between the clamp members 46 and 48.

After that, a gel-like or jelly-like resin 50 having an appropriate viscosity is applied to the entire module body 44 without any gap. This resin 50 is used for the module body 4
4 must have fluidity so that it can be applied to No. 4 and have appropriate tackiness or adhesion so as not to drip from the module main body 44 after application. Further, the resin 50 preferably has sealing properties, heat resistance and moisture resistance. Examples of the resin 50 include silicone resin (for example, product name Silicone gel manufactured by Shin-Etsu Silicon) and urethane resin (for example, product name manufactured by Nippon Pernox).
(Per urethane) can be used.

Next, as shown in FIG. 5, the module body 44 coated with the resin 50 is attached to the clamp members 46 and 48.
It is placed in the mold 52 of the molding apparatus while being suspended between them. At this time, the module main body 44 is arranged substantially at the center of the space inside the mold 52 while being separated from the inner wall surface of the mold 52. After that, a suitable resin 54 is injected into the mold 52 and cured. The resin 52 must have a fixed shape after being cured, and have heat resistance and moisture resistance. As such a resin 52, a thermosetting epoxy resin (for example, a trade name manufactured by Epoxy Technology) is used.
Epotech) is preferable, and when such a thermosetting resin is used, it is effective to be molded by a transfer molding method. Alternatively, an ultraviolet curable resin (for example,
It is also possible to use Daikin's trade name Optodyne UV), silicone resin (for example, Shin-Etsu Silicon trade name Silicone gel), urethane resin (for example, Nippon Pernox trade name Per-Urethane).

After the resin 54 is cured, the mold 52 is removed and the clamp members 46 and 48 are attached to the optical fibers 16 and 2.
Remove from 0. Cured resin 54, that is, encapsulant 54
Boot mounting portions 56, 58 (FIG. 1) for mounting the above-mentioned protective boots 38, 40 are formed on both end portions of the protective boot 3 and the boot mounting portions 56, 58 (FIG. 1).
By fitting 8 and 40, the optical device module 100 as shown in FIG. 1 is completed.

In the optical device module 100 manufactured in this way, since the encapsulating body 54 surrounding the module body 44 is molded from epoxy resin or the like, its outer shape is always constant. Further, since the module main body 44 is surrounded by the molding resin 54, it is completely shielded from the external environment. Therefore, the module main body 44 is effectively protected from external heat, moisture, shock and the like. Furthermore,
Since the gel resin 50 is interposed between the module body 44 and the envelope 54, the resin body 50 also protects the module body 44 from the external environment.

The module body 44 is made of gel resin 5
It is immersed in 0 and is floated and supported inside the envelope 54. Since the resin 50 has an appropriate viscosity, even if an external impact is applied to the optical device module 100, the impact is absorbed by the gel resin 50. Therefore, this gel-like resin 50 functions as a cushioning material. Further, even if heat is applied to the optical device module 100 and the adhesive 42 at the joint portion of the module body 44 causes thermal expansion or thermal contraction, the gel resin 50 can allow the movement of the fiber connectors 14 and 18. ..

FIG. 6 shows an optical device module 200 manufactured according to the second embodiment of the present invention.
The optical device module 200 of the second embodiment is different from that of the first embodiment in that the gel resin 50 is not applied to the entire module body 44. In this case, the gel-like resin 50 is used for the entire first and second fiber connectors 14 and 18, and these fiber connectors 1
It is applied to a part of the waveguide substrate 10 adjacent to 4, 4. The joints between the fiber connectors 14 and 18 and the waveguide substrate 10 and the fiber connectors 14 and 18 are affected by external mechanical shock, heat and moisture.
Since it is 18, if at least these are protected by the gel-like resin 50, an effect substantially similar to that of the first embodiment can be obtained.

When a urethane resin is used as the gel resin 50, the gel resin can be used as it is, but since the urethane resin has excellent elasticity even after being cured, the module body 44 is protected. It can be used as a cushioning material. Therefore, as in the optical device module 300 shown in FIG. 7, the envelope 60 made of urethane resin may be directly formed on the outer periphery of the module body 44.

FIG. 8 shows an optical device module 400 manufactured according to the fourth embodiment of the present invention. When the optical device module 100 of the first embodiment is manufactured, the clamp members 44 and 46 are used to suspend and support the module body 44. However, in the case of the optical device module 400 of the fourth embodiment, the lower surface of the waveguide substrate 10 of the module body 44 is supported by at least one supporting rod without using the clamp member.

More specifically, after the first and second fiber connectors 14 and 18 are adhered to the waveguide substrate 10, the module main body 44 is provided with a gel-like shape while leaving the central portion of the lower surface of the waveguide substrate 10. Resin 50 is applied. After that, as shown in FIG. 9, the central portion of the waveguide substrate 10 is placed on the upper end surface of the support rod 62 protruding from the bottom surface of the mold 52 of the molding apparatus. Then, a molten resin 54 such as an epoxy resin is injected into the mold 52 and cured. The optical device module 400 shown in FIG. 8 is created in this way. In FIG. 8, the hole indicated by reference numeral 64 is the support rod 6
The hole 64 is formed by removing 2, and various measurements can be performed using the hole 64, for example, the temperature inside the optical device module 400 can be measured.
The portion 66 of the envelope 54 surrounding the upper end of the hole 64 is
Since it is closely attached to the lower surface of the waveguide substrate 10, water or the like does not enter the fiber connectors 14 and 18 through the hole 64.

The preferred embodiments of the present invention have been described above in detail, but it goes without saying that the present invention is not limited to the above embodiments. For example, the resin or gel-like resin that constitutes the envelope of the optical device module according to the present invention is not limited to the above-mentioned ones, and other suitable resins can be used. Further, the optical device may be one in which an optical component is added to the optical waveguide formation surface of the waveguide substrate.

[0031]

As described above, according to the present invention, almost the entire module main body is covered with the integrally molded resin such as epoxy resin, so that heat, moisture, mechanical shock from the outside can be applied. Effectively protected from.

Particularly, when a gel-like resin such as a silicone resin is interposed between the encapsulant and the module body, the gel-like resin functions as a cushioning material, absorbs mechanical shock, and protects the module body. can do. Further, even if the adhesive material between the fiber connector and the optical device thermally expands or contracts, the gel-like resin allows the movement of the fiber connector, so that an unreasonable force may act on the module body. Absent.

Furthermore, according to the method of the present invention, the gel-like resin is applied to the module main body, and then the encapsulant is produced by transfer molding or the like. Therefore, the module main body can be immersed in the gel-like resin without any gap. Easy to do.

[Brief description of drawings]

FIG. 1 is a sectional view showing an optical device module according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a manufacturing procedure of the optical device module of FIG. 1, and is an exploded perspective view of a module main body.

FIG. 3 is a diagram showing a manufacturing procedure of the optical device module of FIG. 1, and is a perspective view showing a completed module main body.

FIG. 4 is a diagram showing a manufacturing procedure of the optical device module of FIG. 1, showing a state where the module main body is suspended in a bridge shape.

5 is a diagram showing a manufacturing procedure of the optical device module of FIG. 1, showing that the module main body is arranged in a mold of a molding apparatus.

FIG. 6 is a sectional view showing an optical device module according to a second embodiment of the present invention.

FIG. 7 is a sectional view showing an optical device module according to a third embodiment of the present invention.

FIG. 8 is a sectional view showing an optical device module according to a fourth embodiment of the present invention.

9 is a diagram showing a manufacturing procedure of the optical device module of FIG. 8, showing that the module body is supported by a supporting rod in a mold of a molding apparatus.

[Explanation of symbols]

100, 200, 300, 400 ... Optical device module, 10 ... Waveguide substrate (optical device), 12 ... Optical waveguide, 14 ... First fiber connector, 16 ... First optical fiber, 18 ... Second fiber connector , 20 ... Second optical fiber, 38, 40 ... Protective boot, 42 ... Adhesive,
44 ... Module main body, 46, 48 ... Clamping member (supporting member), 50 ... Gel-like resin (second resin), 52 ... Mold, 54 ... Encapsulation body (first resin), 60 ... Encapsulation body , 62
… Support rods, 64… holes.

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Shigeru Hirai 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa Sumitomo Electric Industries, Ltd. Yokohama Works (72) Shinji Ishikawa 1 Taya-cho, Sakae-ku, Yokohama-shi, Kanagawa Sumitomo Electric Kogyo Co., Ltd. (56) Reference JP 5-27139 (JP, A) JP 5-45531 (JP, A) JP 61-280909 (JP, A) JP 63-246705 (JP, A) (58) Fields surveyed (Int.Cl. ⁷ , DB name) G02B 6/30 G02B 6/12

Claims (15)

(57) [Claims] 1. A light device and, a first fiber connector holding a first optical fiber is bonded to one end of said optical device, wherein is joined to the other end of the optical device second A main body having a second fiber connector holding the optical fiber, an encapsulant integrally molded from a first resin so as to encapsulate the module main body , and the encapsulant and the module The interposition between the body and
An optical device module comprising a second resin in the shape of a ring . Wherein said second resin comprises at least a first and second fiber connectors, these claim 1 which is disposed around the optical fiber connector and the junction of said optical device Optical device module. 3. The contract in which the first resin is an epoxy resin.
The optical device module according to claim 1 or 2 . Wherein said first resin is a urethane resin 請
The optical device module according to claim 1 or 2 . Wherein said optical device is an optical device module according to any one of claims 1 to 4 is a waveguide substrate having an optical waveguide formed on the surface. Wherein said first and second fiber connectors claims are joined by adhesive to said optical device 1
The optical device module according to any one of items 1 to 5 . 7. An optical device, a first fiber connector which is joined to one end of the optical device and holds a first optical fiber, and a second fiber connector which is joined to the other end of the optical device. And a second fiber connector holding the optical fiber, and a method for manufacturing an optical device module including a module body integrally molded from a first resin so as to encapsulate the module body. In the step of disposing the module main body in a mold of a molding apparatus, at least the first and second fiber connectors,
A step of supporting the module main body so that the fiber connector and the joint portion of the optical device are separated from the inner wall surface of the mold; and melting in the mold in which the module main body is arranged. A step of injecting and curing the first resin to form the encapsulant, and supporting the first and second optical fibers, respectively.
The module body is grasped by a member, and the module main body is supported by the supporting member.
It is supposed to be supported in the state of being suspended like a bridge between
Optical device module manufacturing method. 8. An optical device and one of the optical devices
A first splicing end holding a first optical fiber
Connect the fiber connector to the other end of the optical device.
A second fiber which holds the second optical fiber combined
A module body having a connector, and the module
Is integrally molded from the first resin to enclose the package body.
In a method of manufacturing an optical device module including a sealed body,
And Disposing the module body in a mold of a molding apparatus
When, At least the first and second fiber connectors,
Joint of these fiber connectors and the optical device
So that the and are separated from the inner wall surface of the mold.
Supporting the main unit In the mold where the module body is placed, melted
The first resin is injected and cured to shape the envelope.
Process of Of the support rod protruding upward from the bottom surface of the mold.
Place the optical device of the module body on the upper end surface
To support the module body.
Optical device module manufacturing method. 9. The method of manufacturing an optical device module according to claim 7, further comprising a step of applying a gel-like second resin to the module body before disposing the module body in the mold. . The method according to claim 10, wherein the second resin, at least, the first and second fiber connector, light according to claim 9 wherein the attached coating around these optical fiber connectors and junction of said optical device Device module manufacturing method. 11. The method for manufacturing an optical device module according to claim 7 , wherein the first resin is an epoxy resin. Wherein said first resin is an optical device module fabrication method according to any one of claims 7 to 10 is a urethane resin. 13. The method of manufacturing an optical device module according to claim 11 , wherein the encapsulant is made of a first resin by a transfer molding method. 14. The method of manufacturing an optical device module according to claim 7 , wherein the optical device is a waveguide substrate having an optical waveguide formed on a surface thereof. 15. The first and second fiber connectors are bonded to the optical device with an adhesive.
The optical device module manufacturing method according to any one of 7 to 15 .