JP3406845B2 - Surface mount type crystal oscillator - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mobile communication, for example.
Related to surface mount type crystal oscillators used in equipment, etc.
It is. 2. Description of the Related Art Conventionally, a crystal oscillator has a crystal oscillator and a water crystal.
And a control circuit for compensating the temperature frequency characteristics of the crystal oscillator.
It is configured. In recent years, crystal oscillators have been used for other electronic components.
Reflow soldering on the printed wiring board together with the device
To join, form a terminal electrode on the bottom of the container, etc.
It was a surface-mounted crystal oscillator. Conventionally, usually
In a container body having a cavity part on the surface side that can be mounted,
Control circuit including IC chip from bottom of cavity
Place the crystal resonator on top of it and place
By sealing the metal part with a metal lid that can be hermetically sealed.
The crystal unit and the control circuit are housed in the same housing area.
I was [0004] However, the crystal oscillator has impurities on its surface.
Because the frequency characteristics fluctuate due to adhesion, etc.
It is desirable that the vibrator be hermetically sealed in a single region. Ma
Also, an IC that does not add unnecessary heat history to the IC chip
A chip arrangement structure is desirable. [0005] A surface mount type crystal satisfies such requirements.
As a shaker, as shown in JP-A-10-28024
Crystal oscillators have been proposed. JP-A-10-28024
The quartz oscillator on the surface of the single-plate substrate and the water on the bottom
A control circuit connected to the crystal oscillator was mounted. FIGS. 6 to 8 show the conventional surface mount type crystal oscillating device.
It is a figure showing a shaker. [0007] A conventional surface mount type crystal oscillator comprises a container 5.
1. A rectangular crystal oscillator 52 and an oscillation control circuit are configured.
IC chip 53 and metal lid 54
Have been. In this surface mount type crystal oscillator, a single plate
The ceramic substrate 55 having a single plate shape
An opening formed around the bottom surface has a rectangular frame-shaped leg 56.
Was integrally formed. This
The cavity portion 57 is formed on the bottom surface of the container body 51.
You. The surface of the container 51 and the bottom of the cavity 57
A single-plate-shaped ceramic substrate 55 for partitioning
The via-hole conductor 58 that conducts to the cavity portion 57 is shaped
And a metal lid 54 is sealed on the surface thereof.
Conductive pattern 59 is formed. Also,
The bottom surface of the cavity 57 includes an IC electrode pad
A predetermined wiring pattern 60 is formed. In addition, frame
For example, two on each of the pair of long side edges on the bottom surface of the leg portion 56.
External terminal electrodes 61 to 64 are formed, and a pair of short terminals
A plurality of recesses are formed on the end face of the side, and the inner wall surface of the recess is formed.
The temperature compensation data writing terminal electrodes 65 to 68 are formed
Have been. Then, a quartz crystal is placed on the surface side of the container 1.
The strip-shaped crystal oscillator 52 is provided via the rotor supports 69 and 70.
Are conductively bonded by conductive adhesives 71 and 72,
Conductor pattern for hermetically sealing the crystal oscillator 52
The metal lid 54 having a substantially dish-like shape using the
Had joined. The cavity 57 is provided with an IC chip.
Loop 53 is mounted. This IC chip 53 is an IC
Via electrode pads and bumps or bonding wires
It is connected. Further, the inside of the cavity 57 is filled.
The filling resin 73 is filled and cured. Thereby, IC
The tip 53 is completely covered to improve moisture resistance.
You. In the above structure, the surface of the container body 51
The mounted crystal oscillator 52 includes via-hole conductors 58, 58
Connected to the IC chip 53 via the
External terminal electrodes 61 via predetermined wiring patterns 60.
To 64, temperature compensation data writing terminal electrodes 65 to 68
It is connected. The IC chip 53 and the temperature compensation data
The write terminal electrodes 65 to 68 are made of a single plate-shaped ceramic substrate 5.
5 by a wiring pattern 60 extending to the plane on the bottom side.
Also, the IC chip 53 and the external terminal electrodes 61 to 64
Utilizing the inner wall surface of the frame-shaped leg 56,
6 connected by via-hole conductors
You. [0012] However, the above-mentioned quartz crystal
In the vibrator, the crystal oscillator support bases 69 and 7 are provided on the front main surface.
0 is formed, and the IC chip 53 is bonded to the bottom side main surface.
The substrate on which the electrode pads are formed is
It is composed of a plate 55. Accordingly, the thickness of the single-plate ceramic substrate 55
Both ends of the via-hole conductor 58 extending in the direction
Area accommodating 52 and the bottom surface of cavity portion 57
And will be exposed. That is, the ceramic substrate 55 and the via hole
Around the body 58, that is, the through hole of the ceramic substrate 55.
The inner wall and the outer peripheral surface of the via hole conductor 58 are completely adhered.
Although it is sufficient that the ceramic substrate 55 is
Due to the difference in heat shrinkage coefficient from the via hole conductor 58,
Cracks have occurred near the surroundings or
It is not always tightly adhered. Temporarily, a crystal oscillator
52, airtight before mounting the IC chip 53
Also, when the crystal oscillator 52 is mounted, the frequency of the crystal oscillator 52
During the stabilization process, when mounting the IC chip 53, the filling resin 73
Because heat application processing is performed multiple times, such as during filling and curing of fat,
The airtight reliability is greatly reduced. For this reason, the crystal oscillator 52 is housed.
The hermetic region is caused by cracks around the via hole conductor 58, etc.
Leaks into the cavity 57 through the
As a result, the environment of the accommodation area surrounding the crystal unit 2 fluctuates
However, there is a problem that the oscillation characteristics change. The present invention has been devised in view of the above problems.
The purpose is to accommodate the crystal resonator.
Airtight area leaks to the cavity side
Surface-mount type crystal that has no oscillation and can maintain stable oscillation characteristics
It is to provide an oscillator. [0017] According to the present invention, there are provided a plurality of devices.
Capacitors are placed on the lower surface of a multilayer substrate consisting of ceramic insulating layers.
A container body on which a frame-like leg portion forming a
The electrode pad for the crystal unit formed on the upper surface of the container
A crystal resonator connected and mounted, and the cavity
The IC chip housed in the
Surface-mount water with a lid that hermetically seals the crystal unit
In the crystal oscillator, the multilayer substrate is provided on an upper surface of the multilayer substrate.
A first electrode connected to the electrode pad for the crystal unit.
A via-hole conductor and a second lead out into the cavity portion;
2 between the via-hole conductor and the ceramic insulating layer
And said first via-hole conductor and second via-hole conductor
And an internal wiring pattern for connecting the
A conductive path bent in the thickness direction of the layer substrate is formed.
The crystal oscillator and the IC by the conductive path.
Surface mount type characterized by being connected to a chip
It is a crystal oscillator. The container of the present invention comprises a quartz oscillator and the quartz oscillator.
Electronic component element that constitutes a circuit that controls the oscillation of
For example, a sera with a laminated structure that separates the IC chip from the front and back.
A multi-layer substrate. And a quartz oscillator on the surface of the multilayer substrate;
IC chip housed in cavity on bottom side of multilayer substrate
Lead only to the surface to connect to the crystal unit
First via hole conductor and the first via hole
The second via hole derived only on the bottom surface different from the conductor
Between the via conductors and the insulating layer.
They are connected by the internal wiring pattern to be connected. Therefore, the ceramic around the via-hole conductor
Cracks or peeling in the crack insulation layer
Even in the area where the internal wiring pattern is formed,
The seal is hermetically sealed, so the area around the via-hole conductor
The airtight area in which the crystal unit is housed
There is no leakage to the bitty part side. For this reason, the oscillation characteristics of the entire crystal oscillator are large.
Water that can be operated stably without any fluctuation
Crystal oscillator. The shape of the internal wiring pattern between the insulating layers
First via-hole conductor led out only to the front side
And a cavity different from the first via-hole conductor.
The formation position of the second via-hole conductor led out to the
Can be set freely. That is, the first derived only on the front side
Crystal unit where the crystal unit is bonded to the via hole conductor
Formed directly under the electrode pad for use, and lead only to the bottom side
The second via-hole conductor to
Can be directly led out to the bottom of the cavity.
Can be simplified. In addition, the water to which the above-described quartz oscillator is joined
Via holes directly under and near the crystal oscillator electrode pad
If a conductor is formed, it can be
Minimize exposed and present conductive material
Can be. As a result, foreign matter generated from the conductive member
Prevent significant fluctuations in the characteristics of the crystal unit
Can also be. Also, by adopting a multilayer substrate, a single-plate
Via hole conductors, various electrode pads, and wiring
Compared to the case of forming a turn, when forming a substrate, especially
Excellent mechanical rigidity during firing, effectively preventing warpage
Thus, the flatness of the substrate surface can be improved. This
This means that the crystal oscillator mounted on the substrate surface is
Can be mounted in a fixed manner,
Problems can be solved and stable operation can be achieved. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a surface mount type crystal source according to the present invention will be described.
The shaker will be described in detail with reference to the drawings. FIG. 1 shows a surface mount type crystal oscillator according to the present invention.
2 is a side view, and FIG. 3 omits a lid.
FIG. 4 is a top view of a state in which the filling resin is omitted.
It is a bottom view of a state. FIG. 5 is a schematic plan view showing a wiring pattern.
FIG. In the drawing, FIG. 1 is a sectional view taken along line XX of FIG.
Is shown. In addition, as the surface mount type crystal oscillator of the embodiment, water
Compensation to flatten the temperature-frequency characteristics of crystal oscillator
A crystal oscillator provided with a control circuit will be described as an example. The temperature-compensated crystal oscillator of the present invention
(Hereinafter referred to as the front surface) is flat and the lower surface (hereinafter referred to as the bottom surface)
Approximately rectangular shape with a concave cavity on the side
A body-shaped container 1, a rectangular crystal oscillator 2, and a control circuit are configured.
IC chip 3 and two electronic components 4, 5 to be formed, metal
It is mainly composed of a lid 6 and a filling resin 7. It should be noted that the control circuit of the present invention can
Electronic components such as capacitors are required.
And reference numerals 4 and 5 for electronic components such as capacitors.
Will be described. The container 1 is made of a plurality of substantially rectangular ceramics.
Insulating layers 1a, 1b, roughly frame-shaped ceramic insulating layers 1c, 1
d are laminated. That is, the container 1 is
A multilayer substrate 8 composed of lamic insulating layers 1a and 1b;
And a frame-like leg 9 composed of the insulating layers 1c and 1d.
Both are integrated. And the bottom of the multilayer substrate 8
Recessed cavity surrounded by the surface and the inner wall of the frame-shaped leg 9
The unit 10 is configured. The outer surface of the container 1 has four external
Terminal electrodes 11 to 14 and a plurality of write control terminal electrodes 1
5 to 18 are formed. The surface of the container 1, that is, the surface of the multilayer substrate 8
The sealing conductor pattern 1 so as to surround the outer periphery thereof.
9, and one end of the container body 1 in the longitudinal direction.
A crystal oscillator for connecting to the crystal oscillator 2
The pole pads 20 and 21 are juxtaposed. In addition, the water
The crystal oscillator 2 is placed on the crystal oscillator electrode pads 20 and 21.
Connection bumps 22 and 23 are formed. Also the container
Near the other end in the longitudinal direction of the body 1, the surface of the
Holding bump for securing a gap with the lower surface of vibrator 2
24 are formed. In addition, for connection from the surface of the container body 1
The height of the bumps 22 and 23 up to the apex is, for example, 20
５０50 μm, and the distance between the top of the holding bumps 24
The height is, for example, 10 to 30 μm higher than that of the connection bumps 24.
It is about a low value. The ceramic insulation on the front side of the container 1
The layer 1a is connected to the crystal oscillator electrode pads 20 and 21.
Two first via-hole conductors 25 and 26 are formed.
ing. The bottom surface of the multilayer substrate 8 constituting the container 1
A control circuit is formed on the bottom surface of the cavity 4.
Electronic components 4 and 5 such as IC chip 3 and capacitor are mounted
And various wiring patterns 31 forming a predetermined circuit network.
Are formed. These various wiring patterns 31
A plurality of electrode pads 32, 32,.
· Electrode pads 33, 33 to which electronic components 4, 5 are joined
.... IC chip 3 and external terminal electrodes 11 to 14 and writing
Control terminal circuit connected to control terminal electrodes 15 to 18
This is a pattern that constitutes a network. The ceramic insulating layer 1b on the bottom surface of the multilayer substrate 8
Are connected to the electrode pads 32 connected to the IC chip 3.
..And two second electrodes connected to monitor electrodes 34 and 35
Via hole conductors 27 and 28 are formed. Further, the ceramic insulating material constituting the multilayer substrate 8 is formed.
A first layer is provided between the edge layer 1a and the ceramic insulating layer 1b.
Connects via-hole conductor 25 and second via-hole conductor 27
Internal wiring pattern 29 and first via-hole conductor 2
Internal wiring pattern for connecting the second via hole conductor 28 to the second via hole conductor 28
Horn 30 is formed. Thus, the multilayer board 8 of the container 1 has
One end leads to the surface and the other end leads to the bottom of the cavity 10.
As shown, the first via-hole conductor 25, the internal wiring
The pattern 29 is composed of the second via-hole conductor 27.
And the first via-hole conductor 26 and the internal wiring pattern
30 and a via formed by the via hole conductor 28
It is formed. The above-mentioned external terminal electrodes 11 to 14 are shown in FIG.
As shown, the bottom surface of the frame-shaped leg 9 and the four
Formed over the inner wall of the 1/4 circular cutout at the outer corner
Has been established. In addition, the external terminal power
The shape of the poles 11 to 14 is
It is a continuous rectangular shape. The write control terminal electrodes 15 to 18
Is a pair of long side surfaces of the container body 1 as shown in FIG.
Is formed. For example, the side that appears in FIG.
Write control terminal electrodes 15 and 16 are formed. this
The write control terminal electrodes 15 to 18 are
Rectangular ceramic insulating layer 1b constituting plate 8 and container
1 of the frame-shaped ceramic insulating layer 1c constituting the frame-shaped leg 9
Inner wall surface of the semi-circular notch formed on the long side
Is formed. Accordingly, the top view of FIG.
Write control terminal electrodes 15 to 18 do not appear in the plan view.
No. The IC chip 3 and the write control terminal electrodes 15 to 1
8 is connected by the wiring pattern 31 described above.
You. Further, a conductor pattern for sealing on the surface of the container 1 is provided.
The wire 19 comprises the ceramic insulating layers 1a and 1b and the ceramic
The via-hole conductor penetrating through the insulating layers 1c and 1d forms a frame.
The external terminal voltage of the ground potential formed on the bottom of
A pole, for example 13, is connected. FIG. 2 shows an electronic part such as a capacitor.
One of the electrode pads 33 of the products 4 and 5 is a via-hole conductor,
Internal wiring pattern, ceramic insulating layers 1b, 1c, 1d
Is formed on the bottom of the frame-shaped leg 9 by a via-hole conductor
Connected to an external terminal electrode of the generated power supply potential, for example, 11
ing. This capacitor is connected to the external terminal
High-frequency noise components are detected from the current supplied from the pole 11.
It is something to cut. The above-mentioned container body 1 becomes the insulating layers 1a to 1d.
It is formed using a ceramic green sheet. concrete
Has a rectangular ceramic green sheet serving as an insulating layer 1a.
Through holes to be the first via-hole conductors 25 and 26 are formed.
Followed by high melting points such as molybdenum and tungsten
Fill the through holes with metal paste and cover the surface
And the first via-hole conductors 25 and 26
Conductors serving as conductive crystal resonator electrode pads 20 and 21
Film, conductors serving as bumps 22 to 24 and conductor pattern for sealing
Then, a conductor film to be the ground 19 is formed. Further, a rectangular ceramic to be the insulating layer 1b
Second via hole conductors 27 and 28 on green sheet
Through holes and write control terminal electrodes 15 to 18
The notch formed is formed, and the refractory metal paste is
Fill the through hole and form a conductor film on the surface of this cutout
I do. Then, cavity part 4 of this green sheet
, A plurality of electrode pads 32, 32,.
..., 33, 33 ..., monitor electrodes 34, 35, various arrangements
A conductor film to be the line pattern 31 is formed. The ceramic insulating layer 1a or the ceramic
The bonding surface of the green sheet to be the
Of the via-hole conductor 25 and the second via-hole conductor 27
A conductive film serving as an internal wiring pattern 29 to be connected;
Connects the hole conductor 26 and the second via hole conductor 28
The conductive film which becomes the internal wiring pattern 30
Via hole conductor and internal wiring pattern as required
The conductor film is formed by printing a high melting point metal paste. Further, a frame-shaped cell serving as the ceramic insulating layer 1c is provided.
Penetration that becomes via hole conductor in lamic green sheet
Hole, external terminal electrodes 11 to 14 and write control terminal electrode
A notch where 15 to 18 are formed is formed, and a high melting point gold is formed.
Fill this through-hole with metal paste and insert
A conductor film is formed on the surface. Further, a frame-shaped cell serving as the ceramic insulating layer 1d is provided.
Through hole to be via hole conductor in lamic green sheet
And the notch portion where the external terminal electrodes 11 to 14 are formed
Forming and filling the through-hole with a high melting point metal paste,
A conductor film is formed on the surface of the notch. Next, this group
A plurality of external electrode terminals 1 are provided on the surface serving as the bottom surface of the lean sheet.
Conductive films 1 to 14 are formed. In FIG. 1, the external terminal electrode 1 having the GND potential is used.
The connection from 3 to the sealing conductor pattern 19 is made of ceramic.
The via hole conductor and the internal wiring are arranged in the thickness direction of the insulating layers 1a to 1d.
A meandering path is formed by the line pattern. After laminating such green sheets,
Perform crimping. In the pressure bonding step, the surface of the container 1 is flat.
When performing crimping, use this surface as a reference
Press as surface. In the bottom area of the cavity 4
Even in order to perform pressing with uniform pressure, for example, cavity
The filling part 10 is filled with an auxiliary filling member such as filling,
Also, press with a jig whose upper punch is convex,
The ceramic insulating layers 1a and 1b and the ceramic insulating layers 1c and 1d
And press them, and then press-bond both by pressing
I do. Next, the above green sheets are laminated and pressed.
After the attachment, a baking treatment is performed in a predetermined atmosphere. Next, external terminals exposed on the surface of the container 1
Electrodes 11 to 14, writing control terminal electrodes 15 to 18, sealing
Stopping conductor pattern 19, crystal oscillator electrode pad 20,
21, electrode pads 32-33, monitor electrodes 34, 35,
Ni plating on various wiring patterns 31 and bumps 22 to 24
The container body 1 is achieved by applying gold and flash gold plating
Is done. In addition, on the surface of the container 1, a quartz oscillator
Connection bumps 22, 23 on electrode pads 20, 21 for connection.
On the other end side, the holding bumps 24 are
It is formed by printing, but in addition to silver conductive paper
Printing and baking of strike, application of resin paste containing Ag powder
-It may be formed by curing or the like. Also, connection bumps
Printing multiple times to make the height of 22, 23 more than the specified
・ Applying may be performed. Preferably, from the surface of the container 1
The height of the connection bumps 22 and 23 up to the apex is, for example,
Apex portion of the holding bump 24
The height of the connecting bumps 22 and 23 is, for example, 5
It is about 10 μm lower. Further, on the sealing conductor pattern 19,
The seal ring 36, which is a substantially rectangular metal frame, is joined.
You. Seal ring 36 is 42 alloy, Kovar, phosphor blue
It is made of copper or the like and conforms to the shape of the sealing conductor pattern 19.
Structure. This seal ring 35 is used for sealing.
It is joined to the body pattern 19 by brazing. On the surface of the container 1 as described above, a quartz crystal
The moving element 2 is arranged. The crystal unit 2
For example, both main sides of an AT-cut rectangular quartz plate 2a
The vibrating electrodes 2b, 2c formed on the surface, the vibrating electrodes 2b,
Island-shaped extraction electrode portion 2 extending from one end 2c to the other end
d, 2e. In addition, in FIG.
The vibrating electrode 2c and the extraction electrode 2e on the side are indicated by dotted lines. this
The extraction electrodes 2d and 2e are electrode pads 20 for the crystal unit,
21 and conductive adhesives 2f and 2g.
is there. The vibrating electrodes 2a and 2b and the extraction electrodes 2d and 2d
e is a thin film technology of Ag or Au on an underlayer of Cr, Ni, etc.
It is formed by the method. A quartz oscillator mounted on the front side of the container 1
2 is hermetically sealed by a metal lid 6. Money
The metal cover 6 is made of a metal material such as Kovar or 42 alloy.
And has a thickness of, for example, 0.1 mm.
Frame-shaped brazing to the surface sealing conductor pattern 19
It is welded and joined in close contact with the arm ring 36. In addition, gold
Ni, aluminum, etc. are applied to the outer surface side main surface of the metal cover 6.
To adhere. This is because the brazing material melts during welding and
Stable and strong welding is formed by preventing sneaking around
This is to make it possible. On the bottom of the cavity 10 of the container 1,
Means that the IC chip 3 constituting the control circuit is mounted
You. The IC chip 3 has a unique characteristic represented by, for example, a cubic curve.
Frequency fluctuations of the crystal unit 2 due to temperature-frequency characteristics
Controls flattening over a wide temperature range including temperature
is there. Specifically, a well-known PN-doped silicon chip is used.
Oscillating inverter and load capacity
In addition to the component and feedback resistance, the natural temperature frequency of the crystal unit 2
Holds temperature compensation data required for flattening characteristics
Memory, temperature sensor for detecting ambient temperature,
Cap diode, specified based on specified temperature compensation data
DA converted to voltage and supplied to varicap diode
Conversion means, externally written signals stored in memory
-Converting A / D conversion means and processor for controlling these operations
It is composed of various parts. Such an IC chip 3 has, for example,
VCC terminal to which source voltage is supplied, G to be ground potential
ND terminal, crystal connection terminal connected to crystal oscillator 2,
OUT terminal for vibration output, frequency can be adjusted externally
VCON terminal used for writing compensation data
For example, four data write control terminals.
You. The VCC terminal (power supply) of the IC chip 3
Via the constant electrode pad 32 and the predetermined wiring pattern 31
It is led to the terminal electrode 11. The OUT terminal is
Via a predetermined IC electrode pad 32 and a predetermined wiring pattern 31
It is led to the external terminal electrode 12. Further, the GND terminal (a kind of power supply unit) is
External ends via the electrode pads 32 and the predetermined wiring patterns 31
It is led to the child electrode 13. VCON terminal is a predetermined electrode
External terminal power is supplied through the pad 32 and the predetermined wiring pattern 31.
Leaded to pole 14. Also, two crystal connection terminals
Are the predetermined electrode pad 32, the predetermined wiring pattern 31, and the monitor.
The electrode 34 (35) is connected to the surface of the container 1 via a conductive path.
Lead out to the crystal oscillator electrode pads 20, 21 respectively.
You. Further, four data write control terminals are
IC via the pole pad 32 and the predetermined wiring pattern 31
It is led to the control terminal electrodes 15 to 18. Each of these terminals is, for example, an actual IC chip 3.
It is formed as an aluminum electrode on the mounting surface. In addition, each Al
Form bumps such as gold or solder on the
Ultrasonic bonding and conductivity on the electrode pads 32 ...
Bonding and bonding by filler bonding etc.
Continued. In addition, each aluminum electrode is placed on the upper surface side of the IC chip 3.
Then, for example, via a bonding wire,
May be connected to the cavity 32, but the cavity
Care must be taken that the shape of 10 is not large. The electronic components 4 and 5 are, for example, chip-shaped
It is a message. For example, the electronic components 4 and 5 include a pair of electrode pads.
Conductive resin adhesive containing Ag powder between pads 33, 33
Are joined through. The capacitor as the electronic component 4 is an IC chip.
One of the grounds is connected between the loop 3 and the OUT external terminal electrode 12.
Are connected to each other. This is because the output signal
This is to remove a DC component that becomes noise. The capacitor which is the electronic component 5 has I
Connected between the C chip 3 and the VCC external terminal electrode 11
Power supply voltage supplied to the VCC external terminal electrode 11.
This is to remove high-frequency noise to be folded. Then, in the cavity portion 10,
The IC chip 3 and the two electronic components 4, 5 are in the cavity
Minimize mounting space according to 10 shapes
They are juxtaposed. The cavity 10 has the above-mentioned I
The C chip 3, the electronic components 4, 5 are firmly joined,
Filling resin 7 is formed to improve the moisture resistance reliability.
ing. The filling resin 7 is, for example, at least two kinds of filling resins.
Resin, for example, on the bottom side of the cavity 10
Resin layer 7a that is filled and cured into
The resin layer 7b is filled and cured. Specifically, Cavite
The shrinkage rate of filling and hardening on the bottom side of the
It is composed of a large resin material. Generally an underfill tree
A material with many resin components such as epoxy resin called fat
is there. This resin layer 7a is at least on the IC chip 3.
Filled and cured to cover the surface completely. Immediately
The IC chip 3, the electronic components 4, 5 and the cavity 1
Due to the shrinkage of the resin layer 7a filled in between
Due to the generated stress, the bonding strength between the two is improved. I
The resin formed so as to completely cover the IC chip 3
The stress generated by the contraction of the layer 7a is applied to the IC chip 3.
It occurs toward. Thereby, the stress of the IC chip 3
Press from the top side to the bottom side of the cavity 10
IC chip joined to the bottom of the cavity 10
The bonding strength of the tip 3 is improved. The resin layer 7b is made of a resin having a large shrinkage stress.
The IC chip 3 and the electronic components 4, 5 are covered by the resin layer 7a.
The thickness of the resin layer 7a to be covered becomes thin,
To solve the problem that sufficient moisture resistance cannot be obtained.
It is filled and cured for This allows key
IC chip 3 and electronic components mounted in the cavity 10
4,5 joint strength is improved, and moisture resistance reliability is improved.
I do. Note that the filling resin 7 is
Do not protrude from the opening surface. This is because the surface mount type crystal oscillator can be stably
This is for disposing on a printed wiring board. Next, manufacture of the above-mentioned surface mount type crystal oscillator
The method will be described. First, the above-mentioned container body 1, quartz oscillator 2,
Electronic components 4, 5 such as IC chip 3, capacitor, and gold
A metal cover 6 is prepared. The surface of the container 1 is
The mulling 36 is provided around by brazing, etc.
In addition, a gold bump is formed on the aluminum electrode on the mounting surface of the IC chip 3.
Is formed. Next, the crystal resonator 2 is mounted. concrete
Electrode pads 20 and 2 for the quartz oscillator on the surface of the container 1
1. Connection bumps 22 and 23 formed on 1 and crystal oscillator
2 so that the island-shaped extraction electrode portions 2d and 2e coincide with each other.
Place and place the extraction electrode sections 2d and 2e and the electrode pads 2
0 and 21 using conductive adhesives 2f and 2g such as Ag.
Join the two. The lower surface of the other end of the crystal unit 2 is
It is placed on the holding bump 24. In addition, conductive contact such as Ag
By curing (thermal curing or ultraviolet curing) of the adhesive materials 2f and 2g
Due to the contraction that occurs, the tip of the other end of the crystal unit 2 is held.
Rise, at least the surface of the crystal unit 2 and the container 1
Between the connection bumps 22 and 23
A gap will be formed. Thus, the vibrating electrode 2 of the crystal unit 2
b, 2c are the electrode pads 22, 23, the first via hole
Conductors 25 and 26, internal wiring patterns 29 and 30, and second
Via the via-hole conductors 27 and 28, the cavity 1
Connected to the crystal connection terminal of IC chip 3 formed on the bottom of 0
Connected to the two monitor electrodes 34 and 35. Next, the frequency of the crystal unit 2 is adjusted.
Specifically, an IC chip is attached to the bottom of the cavity 10.
Two monitor electrodes 34 connected to the crystal connection terminals of
Contact the measuring terminal (probe) of the frequency measuring device to 35
Then, the crystal oscillator 2 is caused to oscillate in a predetermined manner, and its frequency is
Measure. Based on the result, it was joined to the container 1
On the vibrating electrode 2b on the upper surface side of the crystal unit 2,
The metal is vapor-deposited, and the vibration electrode 2b is substantially weighted.
While performing, the oscillation frequency is adjusted to a predetermined value. Next, the frequency of the crystal unit 2 is stabilized.
You. More specifically, the entire container 1 to which the quartz oscillator 2 is bonded
Is heat-treated at 150 to 250 ° C. This heat treatment
Generally referred to as heat aging. Due to this heat aging, vibration
Stabilize the frequency-adjusted deposit deposited on the moving electrode 2b
Bonded and included in conductive adhesives 2f, 2g, etc.
To evaporate impurities such as organic solvents. Next, the metal lid 6 is sealed. Ingredient
Physically, the metal lid 6 is placed on the seam ring 36.
Roller electrode for seam welding around the metal lid 6
(Not shown) to move the contact while applying the welding current.
And weld them together. Next, the IC chip 3 and the electronic components 4 and 5 are keyed.
The mounting is performed in the cavity section 10. Specifically, IC chip
The chip 3 is mounted on the Au chip formed on the mounting surface of the IC chip 3.
The bumps match the predetermined electrode pads 32, 32,...
And then place the ultrasonic wave on the IC chip 3
Are applied to fuse them together. The electronic parts 4 and 5 are joined by electrode pads.
, 33, 33 ... containing Ag powder etc.
Apply a fat paste, place electronic components 4 and 5, and cure
And perform the processing. Note that the IC chip 3 and the electronic components 4 and 5
In the order of joining, the electronic components 4 and 5 are mounted first, and then
The C chip 3 may be mounted. Also, the electronic components 4, 5
This can be omitted for control circuits that are not needed.
it can. As for the mounting method of the IC chip 3,
In addition to the face bonding method described above, conventionally well-known
The connection may be made by an ear bonding wire.
In this case, the area required for wire bonding increases.
Therefore, when designing the internal wiring pattern 31, etc., it is compact.
We have to try to make it. Next, the IC chip 3 and the electronic components 4 and 5 are charged.
Cover with filling resin 7. Specifically, the cavity 10
IC chips 3 and electronic components 4 and 5 placed inside
Filled to cover with resin called underfill
・ Curing to form the resin layer 7a, and further on the resin layer 7a
The resin layer 7b is formed of a highly moisture-resistant resin. Next, the characteristic temperature-frequency characteristic of the crystal unit 2
Frequency fluctuation due to wide temperature range including normal temperature
Temperature compensation data for writing to the write control terminal electrode 1.
Connect output terminals such as rom writer to 5-18
Write constant data. Specifically, the frequency adjustment step
Temperature frequency characteristic of crystal unit 2 obtained by
Based on the characteristics, the tertiary temperature is stored in the memory section of the IC chip 3.
To flatten frequency characteristics over a wide temperature range including room temperature
Enter the temperature compensation data. If necessary, write
Desired temperature characteristics can be obtained by incorporating the compensation data
May be checked, and correction data for correction may be written again.
Absent. This temperature compensating operation is performed at a predetermined temperature.
The oscillation frequency of the crystal oscillator
Correction by controlling the capacity of the recap diode
The temperature compensation data is
Data to optimize the voltage that controls the capacitance of
You. As a result, the unique characteristic of the crystal unit 2
Temperature frequency characteristics are flattened over a wide temperature range including room temperature.
Can be In the above-mentioned surface mount type crystal oscillator, the crystal oscillator
The IC chip 3 and electronic components that constitute the moving element 2 and the control circuit
4 and 5 are separated by ceramic insulating layers 1a, 1
b. Then, a crystal oscillator 2 and a control circuit are formed.
Electrical connection between the IC chip 3 and the electronic components 4 and 5
The conductive path is directly below the crystal resonator electrode pads 20 and 21.
First via-hole conductors 25 and 26 formed in
Line patterns 29, 30 and second via-hole conductors 27, 2
8 has been achieved. Moreover, it penetrates the insulating layer 1a.
The first via-hole conductors 25 and 26 and the second
The two via-hole conductors 27 and 28 are mutually displaced in a plane.
And never overlap each other. And this mutual
The parts that are displaced by the internal wiring patterns 29 and 30
Connected by Therefore, the ceramic insulating layer 1a and the first via
Near the interface with the hole conductors 25 and 26 or ceramic insulation
Near the interface between the layer 1b and the second via-hole conductors 27 and 28
Cracks or peeling of both
The thickness of the multilayer substrate 8 is also the thickness of the ceramic insulating layers 1a and 1b.
Are adhered to each other in the directions. For this reason, via hole conduction
Regardless of cracks or peeling around the body 25-28
And the housing area where the crystal unit 2 is housed,
Leakage with the tee 10 does not occur. For this reason, the frequency compensation data
Flattening by compensating for inherent frequency temperature characteristics according to ambient temperature
However, due to factors other than this natural frequency temperature characteristic, water
The oscillation frequency of the crystal oscillator 2 never fluctuates at all.
And a stable temperature compensation operation can be maintained. For example, conventional
A housing area in which the crystal unit 52 is housed,
If the cavity 57 leaks, naturally
The environment of the accommodation area of the crystal oscillator 52 fluctuates,
As a result, even if the above temperature compensation is performed,
Does not provide an oscillation output of a desired frequency. Further, the distance between the ceramic insulating layers 1a and 1b
The first via depends on the pattern of the external wiring patterns 29 and 30.
Hole conductors 25 and 26 and second via-hole conductor 2
The formation positions of 7, 28 can be arbitrarily set. Immediately
In other words, as shown in FIG.
6 is formed directly below the crystal oscillator electrode pads 20 and 21
In addition, the second via-hole conductors 27 and 28 are
Positions of poles 34 and 35 and crystal connection terminals of IC chip 3
Formed directly on the electrode pad 32 or in the vicinity thereof
Various wiring patterns 3 of the cavity 10
1 can be simplified and downsized. A container on which the crystal unit 2 is mounted
On the surface of the body 1, the crystal oscillator electrode pads 20 and 21 and the first
Wiring conductors connecting the via-hole conductors 25 and 26
No turns or minimal distance. As a result,
The container area is designed to alter the atmosphere
Since the cause of the foreign matter can be minimized, the crystal unit 2
Can prevent significant deterioration of characteristics for a long time.
You. Further, by employing the multilayer substrate 8 for the container 1,
In comparison with conventional single-plate ceramic substrates,
High mechanical rigidity, effectively suppressing warpage,
The flatness of the surface of the container 1 on which the crystal oscillator 2 is placed is improved.
To avoid collisions when the crystal unit 2 vibrates.
You. In the above embodiment, the multilayer substrate 8 has two layers.
Although the structure has been described, at least two or more layers may be used.
For example, in the case of a three-layer structure, via-hole conductors are
Formed at different positions and the displacement is formed inside each layer
The connection may be made by a wiring pattern. Also, for example, the first layer
Via hole conductor at the same position on the second ceramic insulating layer
To form via hole conductors at different positions on the third layer
The internal displacement formed between the second and third layers is affected by this displacement.
You may connect by a line pattern. According to the present invention, a table on which a quartz oscillator is mounted is provided.
The housing area on the front side and the electronic component elements that constitute the control circuit
The mounted cavity on the bottom side is
The crystal oscillator and the electronic component element
Connected conductive paths are located at different positions on each ceramic insulating layer
Via hole conductors formed in
This is done by a line pattern. Thus, cracks are formed around the via-hole conductor.
Does not affect the entire conductive path.
And the electronic components that constitute the control circuit
No leakage from the cavity on the bottom side where the element is mounted
Never do. As a result, due to changes over time,
The environment of the housing area where the crystal unit is housed fluctuates
Surface mount type that can maintain stable oscillation characteristics
It becomes a crystal oscillator.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view of a surface mount type crystal oscillator according to the present invention. FIG. 2 is a side view of a surface mount type crystal oscillator according to the present invention. FIG. 3 is a top view of the surface-mounted crystal oscillator in a state where a lid is omitted. FIG. 4 is a bottom view of the surface-mount type crystal oscillator in which a filling resin is omitted. FIG. 5 is a schematic plan view showing an internal wiring pattern of the present invention. FIG. 6 is a cross-sectional view of a conventional surface mount type crystal oscillator. FIG. 7 is a top view of a conventional surface-mount type crystal oscillator without a cover. FIG. 8 is a bottom view of a conventional surface mount type crystal oscillator. [Description of Signs] 1. Container 2 Crystal oscillator 3 IC chip 4, 5 Electronic component 6 Metal lid 7 Filled resin 8 ..Frame-shaped legs 10 Cavities 25, 26 First via hole conductors 27, 28 Second via hole conductors 29, 30 Internal wiring patterns 11 to 14 External terminal electrodes 15-18: Write control terminal electrodes

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H03B 5/32 H03H 9/02 H03H 9/10

Claims (1)

(57) Claims: 1. A container in which a frame-like leg for forming a cavity is disposed on a lower surface of a multilayer substrate formed by laminating a plurality of ceramic insulating layers; Electrode pad for crystal unit formed on top surface
A crystal resonator mounted and connected to the
In a surface-mounted crystal oscillator including an IC chip and a lid that hermetically seals the crystal resonator, the multilayer substrate includes:
An electrode pad for the crystal unit which is led out to the upper surface of the multilayer substrate.
A first via-hole conductor connected to the cavity, and the cavity
A second via-hole conductor leading out of the
The first via-hole conductor formed between
From the internal wiring pattern connecting the via hole conductor
And a conductive path bent in a thickness direction of the multi-layer substrate is formed, and the crystal resonator and the IC chip are connected by the conductive path. Type crystal oscillator.