JP3384889B2 - Ultrasonic probe - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe provided with a back load material, a piezoelectric vibrator laminated on the back load material, and a matching layer laminated on the piezoelectric vibrator.

[0002]

2. Description of the Related Art A conventional example will be described with reference to the drawings. FIG. 8 is a perspective view of a main part of a first conventional ultrasonic probe, FIG. 9 is a view for explaining extraction of electrodes in FIG. 8, and FIG. 10 is a second conventional example of the ultrasonic probe. FIG. 11 is a perspective view of the main part, and FIG. 11 is a diagram for explaining the extraction of the electrodes in FIG.

First, a first conventional example will be described with reference to FIGS. 8 and 9. In these figures, 1 is a piezoelectric vibrator (PZ
T). A signal electrode layer 2 is formed on one surface of the piezoelectric vibrator 1, and a ground electrode layer 3 is formed on the other surface side in advance.

On the signal electrode layer 2 side of the piezoelectric vibrator 1,
Back load material 4 that mechanically supports the piezoelectric vibrator 1 and acoustically damps the piezoelectric vibrator 1 to shorten the ultrasonic pulse waveform.
Are stacked. An acoustic matching layer 18 is laminated on the ground electrode layer 3 side of the piezoelectric vibrator 1.

The laminated piezoelectric vibrator 1, back load member 4 and acoustic matching layer 18 are divided into a plurality of linearly arranged elements by dicing cutting.
The acoustic isolation of each element is secured.

Although an acoustic lens is laminated on the acoustic matching layer 18, it is not shown. Here, extraction of the electrodes of the piezoelectric vibrator 1 will be described. 5 is arranged on one side surface of the back load material 4, and a flexible printed circuit board (hereinafter, referred to as a conductive pattern 7 corresponding to the signal electrode layer 2 of each piezoelectric vibrator 1 is formed on a thin insulating substrate 6 such as polyimide) (FPC)
Is. Then, with the signal electrode layer 2 of each piezoelectric vibrator 1,
The conductive patterns 7 of the FPC 5 are connected with a conductive adhesive 8 to take out the signal electrode.

On the other side surface of the back load material 4, a copper foil 10 is connected to the ground electrode layer 3 of the piezoelectric vibrator 1 by using a conductive adhesive 9, and the ground electrode is taken out. Next, a second conventional example will be described with reference to FIGS. In these figures, the same parts as those in FIGS. 8 and 9 are designated by the same reference numerals, and the description thereof will be omitted.

The difference between the second conventional example and the first conventional example is the extraction structure of the signal electrode. A printed circuit board 11 is disposed on one side surface of the back load material 1 and has a conductive pattern 13 corresponding to the signal electrode layer 2 of each piezoelectric vibrator 1 formed on an insulating base material 12 such as an epoxy resin.
The conductive pattern 13 of the printed board 11 and the signal electrode 2 of each piezoelectric vibrator 1 are connected by wire bonding 1
Connected at 4.

In the second conventional example, the printed circuit board 11 is used.
However, in some cases, FPC is used for connection by wire bonding.

[0010]

However, in the ultrasonic probe having the above structure, the signal electrode can be taken out only from one side surface of the back load member 4, and the degree of freedom in the taking-out direction is small. There is.

Further, in the above-mentioned conventional example, a plurality of elements are arranged linearly (one-dimensionally), but in the case of an ultrasonic probe in which the elements are two-dimensionally arranged, the signal electrode is not taken out. There are difficult problems.

The present invention has been made in view of the above problems. A first object of the present invention is to increase the degree of freedom in the extraction direction of the signal electrode, and further, even if the elements are two-dimensionally arranged,
It is to provide an ultrasonic probe in which the signal electrode can be easily taken out.

A second object of the present invention is to provide an ultrasonic probe in which the degree of freedom in taking out the ground electrode is increased. A third object of the present invention is to provide an ultrasonic probe having an improved shield effect against noise.

[0014]

[Means for Solving the Problems] First to solve the above problems
Of the invention, a back load material, laminated on the back load material,
A thin substrate having a conductive pattern formed on a thin insulating substrate;
A piezoelectric vibrator laminated on the thin substrate and having a signal electrode layer connected to a conductive pattern of the thin substrate formed on a surface on the thin substrate side; and a matching layer laminated on the piezoelectric vibrator. An ultrasonic probe having the above, wherein the thin substrate other than the thin substrate is divided into a plurality of elements.

A second invention is a back load material, a piezoelectric vibrator laminated on the back load material and having a ground electrode layer formed on a surface opposite to the back load material side, and the piezoelectric vibration. A thin substrate laminated on the child, on which a conductive pattern connected to the ground electrode layer is formed on a thin insulating substrate,
An ultrasonic probe having a matching layer laminated on the thin substrate, wherein an element other than the thin substrate is divided into a plurality of elements.

According to a third aspect of the invention, a back load material, a piezoelectric vibrator laminated on the back load material, a matching layer laminated on the piezoelectric vibrator, and a thin layer laminated on the matching layer. An ultrasonic probe having a thin substrate having a conductive pattern formed on an insulating base material, wherein the conductive pattern of the thin substrate is used as a frame ground, and a portion other than the thin substrate is divided into a plurality of elements. .

The thin substrate in the first to third inventions is preferably a flexible printed circuit board.

[0018]

In the ultrasonic probe of the first invention, since the piezoelectric vibrator is laminated on the thin substrate and the signal electrodes of the piezoelectric vibrator divided into a plurality of elements are connected to the conductive pattern of the thin substrate, The degree of freedom in the extraction direction of the signal electrode is increased, and even if the elements are two-dimensionally arranged, the extraction of the signal electrode becomes easy.

In the ultrasonic probe of the second invention, the thin substrate is laminated on the piezoelectric vibrator, and the ground electrode of the piezoelectric vibrator divided into a plurality of elements is connected to the conductive pattern on the thin substrate. Therefore, the degree of freedom in the extraction direction of the ground electrode is increased.

In the ultrasonic probe of the third invention, by laminating a thin substrate on the acoustic matching layer so that the conductive pattern functions as a frame ground, the conductive pattern covers the piezoelectric vibrator without any gaps and noise. The shield effect against is improved.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described with reference to the drawings. 1 is a perspective view of the first embodiment of the present invention, and FIG.
3 is a plan view of the FPC in FIG. 1.

In FIG. 1, reference numeral 31 is a back load material.
An FPC as a thin substrate in which a conductive pattern 33 is formed on a thin base material 32 of polyimide on the back load material 31.
34 are stacked.

On the FPC 34, a signal electrode layer is laminated on the lower surface, a ground electrode layer is laminated on the upper surface, and a piezoelectric vibrator 35 formed in advance is laminated. Piezoelectric vibrator 3
A first acoustic matching layer 36 and a second acoustic matching layer 37 for acoustic matching with the subject are laminated on the surface 5. Furthermore, on the second acoustic matching layer 37, an acoustic lens 38 that focuses the ultrasonic beam is laminated.

Then, as shown in FIG. 2, except for the FPC 34, it is divided into a plurality of linearly arranged elements by a dicing cut, and the acoustic isolation of each element is secured.

The FPC 34 extends from both sides of the back load material 31, and as shown in FIG. 3, the conductive pattern 33 is connected to the signal electrode of each piezoelectric vibrator 35 divided into elements, and alternately alternates in both side directions. It is extended.

Reference numeral 39 is a copper foil which is connected to the ground electrode of the piezoelectric vibrator 35 and functions as a ground electrode lead-out. The manufacturing method of the above structure includes the following methods.

(1) Pitch the back load material 31 in advance
Cut the groove with P, and on top of that, FPC 34, piezoelectric vibrator 3
A method in which 5, the first acoustic matching layer 36, the second acoustic matching layer 37, and the acoustic lens 38 are collectively or sequentially laminated, and the FPC 34 is passed over and dicing cut.

(2) Piezoelectric vibrator 35, first acoustic matching layer 36,
After laminating the second acoustic matching layer 37, the second acoustic matching layer 3
With the surface of 7 temporarily fixed to a table with good flatness, dicing-cut from the piezoelectric vibrator 35 side.
FPC 34 and piezoelectric vibrator 3 according to the conductive pattern 33 of
A method of laminating 5 and finally laminating on the back load material 31 which is grooved in advance with the pitch P.

Next, the operation of the above configuration will be described. The FPC 34, which is the signal-side electrode, and the copper foil 39, which is the ground-side electrode, are connected to the transmission / reception circuit of the ultrasonic diagnostic apparatus via a coaxial cable or the like. The transmitted voltage from the main unit is
It is applied to each element of the piezoelectric vibrator 35 via the FPC 34, converted into a sound wave, and emitted from the acoustic lens 38 into the subject.

The reflected sound wave from the inside of the subject is detected by the piezoelectric vibrator 3.
The signal is converted into an electric signal at 5 and is sent to the ultrasonic diagnostic apparatus through a system path opposite to that at the time of wave transmission. According to the above configuration, the piezoelectric vibrator 3
5 is laminated on the FPC 34, and the signal electrode of the piezoelectric vibrator 35, which is divided into a plurality of elements, is connected to the conductive pattern 33 of the FPC 34. The direction can be set freely.

Next, the second embodiment of the present invention will be described with reference to FIGS.
An example will be described. FIG. 4 is a perspective view of an essential part of the second embodiment, and FIG. 5 is a plan view of the FPC in FIG. In the present embodiment, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals, and the description thereof will be omitted.

The difference between this embodiment and the first embodiment is that FP
The point is that the divided elements other than C40 are arranged two-dimensionally. The FPC 40 extends from one side surface of the back load material 31, and as shown in FIG. 5, the conductive pattern 41 is connected to the signal electrode of each piezoelectric vibrator 35 divided into elements.

According to the above configuration, the piezoelectric vibrator 35 is the FPC.
Since the signal electrode of the piezoelectric vibrator 35 which is laminated on 40 and divided into a plurality of elements is connected to the conductive pattern 41 of the FPC 40, even if the elements are two-dimensionally arranged,
The signal electrode can be easily taken out.

Next, a third embodiment of the present invention will be described with reference to FIG. In the present embodiment, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals, and the description thereof will be omitted.
The difference between this embodiment and the first embodiment is that the FPC 45 is laminated on the piezoelectric vibrator 35 and the ground electrode of the piezoelectric vibrator 35 is connected to the conductive pattern of the FPC 45.

According to the above configuration, the FPC 45 that is not divided
Is laminated on the piezoelectric vibrator 35, and the ground electrode of the piezoelectric vibrator 35 divided into a plurality of elements is connected to the conductive pattern on the FPC 45, so that the extraction direction of the ground electrode can be freely set.

The laminated first and second acoustic matching layers 3 are also provided.
When the 6, 37 and the acoustic lens 38 are laminated on the FPC 45 using an adhesive, the presence of the FPC 45 can prevent the adhesive from entering the grooves formed between the piezoelectric vibrators 35.

Next, a fourth embodiment of the present invention will be described with reference to FIG. In the present embodiment, the same parts as those in FIGS. 1 to 3 are designated by the same reference numerals, and the description thereof will be omitted.
The difference between this embodiment and the first embodiment is that the FPC 50 is
The piezoelectric vibrator 35 of the FPC 50 is laminated on the acoustic matching layer 36.
The point is that the conductive pattern that covers without gaps is the frame ground.

According to the above configuration, the conductive pattern of the FPC 50 functioning as the frame ground covers the piezoelectric vibrator 35 without any gap, so that the noise shielding effect can be enhanced.

[0039]

As described above, according to the ultrasonic probe of the first invention, the piezoelectric vibrator is laminated on the thin substrate, and the signal electrode of the piezoelectric vibrator divided into a plurality of elements is the thin substrate. Since it is connected to the conductive pattern, the degree of freedom in the extraction direction of the signal electrode is increased, and even if the elements are two-dimensionally arranged, the extraction of the signal electrode is facilitated.

According to the ultrasonic probe of the second invention, the thin substrate is laminated on the piezoelectric vibrator, and the ground electrode of the piezoelectric vibrator divided into a plurality of elements is connected to the conductive pattern on the thin substrate. Therefore, the degree of freedom in the extraction direction of the ground electrode can be increased.

According to the ultrasonic probe of the third invention, since the thin substrate is laminated on the acoustic matching layer so that the conductive pattern functions as a frame ground, the piezoelectric pattern is covered with the conductive pattern without any space. It is possible to improve the shielding effect against noise.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line AA in FIG.

FIG. 3 is a plan view of the FPC in FIG.

FIG. 4 is a perspective view of a main part of a second embodiment of the present invention.

5 is a plan view of the FPC in FIG.

FIG. 6 is a sectional configuration diagram illustrating a third embodiment of the present invention.

FIG. 7 is a sectional configuration diagram illustrating a fourth embodiment of the present invention.

FIG. 8 is a perspective view of a main part of a first conventional example of an ultrasonic probe.

9A and 9B are diagrams illustrating extraction of electrodes in FIG.

FIG. 10 is a perspective view of a main part of a second conventional example of an ultrasonic probe.

FIG. 11 is a diagram illustrating extraction of electrodes in FIG.

[Explanation of symbols]

31 Back load material 32 base material 33 Conductive pattern 34 FPC (thin substrate) 35 Piezoelectric vibrator 36 First Acoustic Matching Layer 37 Second Acoustic Matching Layer 38 acoustic lens

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A 64-29100 (JP, A) JP-A 1-236900 (JP, A) (58) Fields investigated (Int.Cl. ⁷ , DB name) G01N 29/00-29/28 A61B 8/00-8/15 H04R 17/00 330-332

Claims (4)

(57) [Claims] 1. A back load material, a thin substrate laminated on the back load material and having a conductive pattern formed on a thin insulating base material, laminated on the thin substrate, and on a surface of the thin substrate side. An ultrasonic probe having a piezoelectric vibrator on which a signal electrode layer connected to a conductive pattern of the thin substrate is formed, and a matching layer laminated on the piezoelectric vibrator, wherein the ultrasonic probe is other than the thin substrate. An ultrasonic probe characterized by being divided into a plurality of elements. 2. A back load material, a piezoelectric vibrator laminated on the back load material, and having a ground electrode layer formed on a surface opposite to the back load material side, and a piezoelectric vibrator laminated on the piezoelectric vibrator. An ultrasonic probe having a thin substrate on which a conductive pattern connected to the ground electrode layer is formed on a thin insulating base material, and a matching layer laminated on the thin substrate. An ultrasonic probe characterized in that parts other than the substrate are divided into a plurality of elements. 3. A back load material, a piezoelectric vibrator laminated on the back load material, a matching layer laminated on the piezoelectric vibrator, and a thin insulating substrate laminated on the matching layer. An ultrasonic probe having a thin substrate on which a conductive pattern is formed, wherein the conductive pattern of the thin substrate is used as a frame ground, and an element other than the thin substrate is divided into a plurality of elements. Probe. 4. The ultrasonic probe according to claim 1, wherein the thin substrate is a flexible printed circuit board.