JP3312299B2 - Apparatus and method for recovering valuable component of chemical plating solution - Google Patents
Apparatus and method for recovering valuable component of chemical plating solutionInfo
- Publication number
- JP3312299B2 JP3312299B2 JP30080499A JP30080499A JP3312299B2 JP 3312299 B2 JP3312299 B2 JP 3312299B2 JP 30080499 A JP30080499 A JP 30080499A JP 30080499 A JP30080499 A JP 30080499A JP 3312299 B2 JP3312299 B2 JP 3312299B2
- Authority
- JP
- Japan
- Prior art keywords
- chemical
- filter
- plating solution
- recovered
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Manufacture And Refinement Of Metals (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板の
製造プロセス等に用いる化学銅めっき液の老化廃液中の
金属イオン、キレート剤、およびギ酸イオンを回収し、
再資源化する装置に係り、特に、銅イオンを回収した化
学銅めっき液の廃液から、有価成分を回収し再資源化す
る装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention recovers metal ions, chelating agents, and formate ions in an aging waste liquid of a chemical copper plating solution used in a manufacturing process of a printed wiring board, and the like.
The present invention relates to an apparatus for recycling resources, and more particularly to an apparatus for recovering and recycling valuable components from a waste liquid of a chemical copper plating solution from which copper ions have been recovered.
【０００２】[0002]
【従来の技術】コンピューターの部品であるプリント配
線板の製造プロセスを例に挙げれば、スルーホール銅、
導体パターンの形成に化学銅めっき液を用いている。化
学銅めっき液は析出反応により液中の銅イオンを金属銅
として析出すると、析出量に対比してめっき液中の銅イ
オン、還元剤、ｐＨ調整剤が減少するため、減少量に応
じて銅イオン、還元剤、ｐＨ調整剤を補給して、化学銅
めっき液の成分濃度を一定に維持し作業を継続してい
る。一般的に銅イオンの補給源としては硫酸銅溶液を用
いており、また、硫酸銅溶液に替えてギ酸銅溶液を用い
ることも試みられている。還元剤、ｐＨ調整剤としてホ
ルマリン、苛性ソーダ溶液を用いている。しかし、化学
銅めっきの欠点として、前記の析出反応、すなわち、 ＣｕＳＯ4＋４ＮａＯＨ＋２ＨＣＨＯ→ Ｃｕ↓＋Ｈ2↑
＋Ｎａ2ＳＯ4＋２ＮａＣＯＯＨ により化学銅めっき液中にギ酸ソーダ、硫酸ソーダが生
じ蓄積する。これ等の塩が蓄積し高濃度になると、析出
するめっき皮膜は物性が劣る脆いめっき皮膜となる。ま
た、析出するめっき皮膜にはコブ状（ノジュール）の突
起が発生しやすくなる傾向にある。そのため、化学銅め
っき液中に蓄積するギ酸ソーダ、硫酸ソーダ等の塩濃度
を管理し、一定量に達すると廃棄して新しい液に更新す
る必要がある。2. Description of the Related Art For example, a manufacturing process of a printed wiring board, which is a component of a computer, includes a through-hole copper,
A chemical copper plating solution is used for forming the conductor pattern. When the copper ions in the chemical copper plating solution are precipitated as metallic copper by the deposition reaction, the amount of copper ions, the reducing agent, and the pH adjuster in the plating solution are reduced relative to the amount of the deposition. The ion, reducing agent and pH adjuster are replenished to keep the component concentration of the chemical copper plating solution constant, and work is continued. Generally, a copper sulfate solution is used as a supply source of copper ions, and an attempt has been made to use a copper formate solution instead of the copper sulfate solution. Formalin and caustic soda solution are used as a reducing agent and a pH adjuster. However, as a drawback of the chemical copper plating, the above-mentioned precipitation reaction, that is, CuSO 4 + 4NaOH + 2HCHO → Cu ↓ + H 2 ↑
+ Na 2 SO 4 + 2NaCOOH generates and accumulates sodium formate and sodium sulfate in the chemical copper plating solution. When these salts accumulate and become highly concentrated, the deposited plating film becomes a brittle plating film having poor physical properties. In addition, bump-like (nodule) projections tend to be easily generated in the deposited plating film. Therefore, it is necessary to control the salt concentration of sodium formate, sodium sulfate and the like accumulated in the chemical copper plating solution, and when it reaches a certain amount, discard it and replace it with a new solution.
【０００３】現在、この化学銅めっきの老化廃液処理と
しては、産業廃棄物処理業者に処理を委託したり、もし
くは、プリント配線板の製造業者自身が有する排水処理
施設において、金属イオンを凝集沈降し固液分離し希釈
放流している。しかし、この化学銅めっき液の成分は、
金属イオン以外にも大量のキレート剤、反応生成物のギ
酸ソーダ等が含まれているため、近年、環境汚染の問題
や廃液中の有価資源の回収、再利用という観点から、化
学銅めっき液の老化廃液中の有価資源である、銅イオン
は金属銅とし、また、キレート剤は晶析分離して回収す
る等の再資源化、再利用化が積極的に行われるようにな
ってきた。だが、反応生成物であるギ酸ソーダ、硫酸ソ
ーダ等は、従来から有価資源として回収、再利用は行な
われていないのが現状である。特に、ギ酸ソーダを未回
収のまま、一般排水として河川に放流するとＣＯＤ（化
学酸素消費量）成分が高くなり水質汚染の原因となる。
そのため、水質基準に定める濃度以下にＣＯＤ成分を処
理して河川に放流する必要がある。従来のＣＯＤ成分の
処理方法は、いくつか有るが一般的には以下の方法で行
われている。東京教育情報センター発行の『水質関係の
基礎知識』第２節の汚水処理の方式〔生物化学的処理〕
に述べられているように、ＣＯＤ成分は生物化学的に処
理する。At present, the treatment of the aging waste liquid of the chemical copper plating is entrusted to an industrial waste disposal company, or the coagulation and sedimentation of metal ions in a wastewater treatment facility owned by the printed wiring board manufacturer itself. The solid-liquid separation is carried out after dilution. However, the components of this chemical copper plating solution are
In addition to metal ions, it contains a large amount of chelating agents and sodium formate as a reaction product.In recent years, from the viewpoint of environmental pollution and the recovery and reuse of valuable resources in waste liquid, the chemical copper plating solution Copper ions, which are valuable resources in aging waste liquids, are metallic copper, and chelating agents are being actively recycled for recycling, such as crystallization and separation. However, at present, the reaction products such as sodium formate and sodium sulfate have not been collected and reused as valuable resources. In particular, if sodium formate is discharged into a river as general wastewater without being recovered, the COD (chemical oxygen consumption) component becomes high, causing water pollution.
Therefore, it is necessary to treat the COD component to a concentration equal to or lower than the water quality standard and discharge it to a river. Although there are several conventional methods for treating COD components, they are generally performed by the following method. Sewage treatment method [Biochemical treatment] in Section 2 of "Basic knowledge on water quality" published by Tokyo Education Information Center
The COD component is biochemically treated as described in US Pat.
【０００４】[0004]
【発明が解決しようとする課題】化学めっきの老化廃液
中のギ酸ソーダの処理は、一般的には上記したような方
法で行われている。しかし、従来の方法である生物処理
は効率が悪いため、処理に時間がかかり施設の規模が大
きくなるという欠点がある。さらに処理施設の運転も専
従員を必要とする等、投資金額、ランニング費が大き
く、また、廃液処理物中から有価成分を回収し、資源の
有効活用、環境対策という点では効果が得られないとい
える。本発明は、上記の課題を解決するものであり、化
学銅めっきの老化廃液中に含まれる金属イオンの回収後
の廃液中から、キレート剤を回収し、キレート剤回収後
の廃液からギ酸ソーダをギ酸として回収することにあ
る。The treatment of sodium formate in the aging waste liquid of chemical plating is generally carried out by the method described above. However, the conventional method of biological treatment is inefficient, and therefore has the disadvantage that the treatment takes time and the size of the facility becomes large. In addition, the operation of the treatment facility requires a full-time staff, and the investment amount and running cost are large. In addition, valuable components are recovered from the waste liquid processing material, and no effective effect is obtained in terms of effective use of resources and environmental measures. It can be said that. The present invention has been made to solve the above problems, and recovers a chelating agent from a waste liquid after recovery of metal ions contained in an aging waste liquid of chemical copper plating, and removes sodium formate from the waste liquid after the recovery of the chelating agent. To recover as formic acid.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、化学めっき液の有価成分回収装置であ
り、化学めっき液から金属イオンが回収された液を収容
する晶析槽と、前記晶析槽内の液に酸を添加する添加機
構と、キレート剤濾過用の濾過器と、前記晶析槽内の液
を前記濾過器に移送する移送機構とを有し、前記液中に
晶析したキレート剤が前記濾過器により濾過されるよう
にしている。To achieve the above object, the present invention is an apparatus for recovering a valuable component of a chemical plating solution, comprising: a crystallization tank containing a solution in which metal ions are recovered from the chemical plating solution; An addition mechanism for adding an acid to the liquid in the crystallization tank, a filter for chelating agent filtration, and a transfer mechanism for transferring the liquid in the crystallization tank to the filter, wherein the The crystallized chelating agent is filtered by the filter.
【０００６】また、前記液中のｐＨが２以下となるまで
前記添加機構により前記酸が添加されるようにしてい
る。Further, the acid is added by the addition mechanism until the pH in the liquid becomes 2 or less.
【０００７】また、前記酸は硫酸であるようにしてい
る。Further, the acid is sulfuric acid.
【０００８】また、化学めっき液の有価成分回収装置で
あり、化学めっきを使用した化学めっき液から金属イオ
ンを回収する回収機構と、前記金属イオンが回収された
液を収容する晶析槽と、前記晶析槽内の液に酸を添加す
る添加機構と、キレート剤濾過用の濾過器と、前記晶析
槽内の液を前記濾過器に移送する移送機構とを有し、前
記液中に晶析したキレート剤が前記濾過器により濾過さ
れるようにしている。[0008] Further, there is provided an apparatus for recovering a valuable component of a chemical plating solution, comprising a recovery mechanism for recovering metal ions from a chemical plating solution using chemical plating, a crystallization tank containing the solution from which the metal ions have been recovered, An addition mechanism for adding an acid to the liquid in the crystallization tank, a filter for chelating agent filtration, and a transfer mechanism for transferring the liquid in the crystallization tank to the filter, wherein the The crystallized chelating agent is filtered by the filter.
【０００９】また、有価成分回収方法であり、化学銅め
っきに使用した化学銅めっき液から有価成分を回収する
方法であって、前記化学銅めっき液中の銅イオンを回収
し、前記銅イオンが回収された液に含まれるキレート剤
を回収し、前記キレート剤が回収された液からギ酸を回
収するようにしている。Also, a method for recovering valuable components is a method for recovering valuable components from a chemical copper plating solution used for chemical copper plating, wherein copper ions in the chemical copper plating solution are recovered, and the copper ions are recovered. The chelating agent contained in the recovered liquid is recovered, and formic acid is recovered from the liquid from which the chelating agent has been recovered.
【００１０】[0010]
【発明の実施の形態】以下に本実施例について図１を用
いて説明する。化学銅めっきの析出反応で生じた、ギ酸
ソーダ、硫酸ソーダ等の塩濃度が、管理限界に達した化
学銅めっき槽１の化学銅めっき液２は、ポンプ３で配管
４を経由して廃液貯槽５に移送される。廃液貯槽５の化
学銅めっき液２は、加温用ヒータ６でめっき反応に最適
な温度まで昇温する。廃液貯槽５には化学銅めっきの析
出反応に必要な十分な量の還元剤（ホルマリン）、ｐＨ
調整剤（苛性ソーダ）を添加する。化学銅めっき液２
は、ポンプ７で配管８を経由し、金属イオンを析出させ
る触媒となる金属を付着させたフィルター９を装填した
濾過器１０を通過し廃液貯槽５に戻る。一定の時間循環
濾過を行うことにより化学銅めっき液中の銅イオンは、
フィルター９に金属銅として析出する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS This embodiment will be described below with reference to FIG. The chemical copper plating solution 2 in the chemical copper plating tank 1 in which the salt concentration of sodium formate, sodium sulfate, etc., generated by the precipitation reaction of the chemical copper plating has reached the control limit, is passed through the pipe 4 by the pump 3 and the waste liquid storage tank. Transferred to 5. The chemical copper plating solution 2 in the waste liquid storage tank 5 is heated by the heater 6 for heating to a temperature optimum for the plating reaction. In the waste liquid storage tank 5, a sufficient amount of reducing agent (formalin) necessary for the precipitation reaction of chemical copper plating, pH
Add modifier (caustic soda). Chemical copper plating solution 2
Passes through a pipe 8 with a pump 7, passes through a filter 10 loaded with a filter 9 to which a metal as a catalyst for precipitating metal ions is attached, and returns to the waste liquid storage tank 5. By performing circulation filtration for a certain period of time, the copper ions in the chemical copper plating solution are
Precipitates as metal copper on the filter 9.
【００１１】次に、銅イオンが除去された廃液貯槽５の
液を、ポンプ１１で配管１２を経由して晶析槽１４に移
送する。硫酸タンク１７の硫酸１８をポンプ１５で配管
１６を経由し添加し撹拌機１３で撹拌しながら、ｐＨを
２以下に下げて銅イオンを除去した化学銅めっき液２に
含まれているキレート剤を晶析させる。その後、ポンプ
１９で配管２０を経由しフィルター２１を装着した濾過
器２２に送液し固液分離する。ろ液は配管２０から減圧
蒸留器２４に送くられ、沸点７０〜８０℃になるように
圧力を減じた、減圧蒸留器２４で蒸留する。気化したギ
酸は冷却器２３で液化し、ギ酸受槽２５に回収する。回
収したギ酸は、酸化銅を添加し撹拌することにより、酸
化銅がギ酸に溶解してギ酸銅なる。このギ酸銅は化学銅
めっきに使用することができる。Next, the liquid in the waste liquid storage tank 5 from which the copper ions have been removed is transferred to the crystallization tank 14 via the pipe 12 by the pump 11. The chelating agent contained in the chemical copper plating solution 2 from which the pH was lowered to 2 or less and copper ions were removed by adding sulfuric acid 18 from the sulfuric acid tank 17 via the pipe 16 with the pump 15 and stirring with the stirrer 13 Let it crystallize. Thereafter, the liquid is sent to a filter 22 equipped with a filter 21 via a pipe 20 by a pump 19 to be separated into a solid and a liquid. The filtrate is sent from the pipe 20 to the vacuum evaporator 24, and is distilled by the vacuum evaporator 24 whose pressure has been reduced to a boiling point of 70 to 80 ° C. The vaporized formic acid is liquefied in the cooler 23 and collected in the formic acid receiving tank 25. By adding copper oxide and stirring the recovered formic acid, the copper oxide dissolves in formic acid to form copper formate. This copper formate can be used for chemical copper plating.
【００１２】具体的な処理条件を示すと、廃液貯槽５の
化学銅めっき液量は、約５０００ｌで廃液中の銅濃度は
２．６ｇ／ｌ、キレート剤であるエチレンジアミンテト
ラアセテートは３１ｇ／ｌ、反応生成物であるギ酸ソー
ダは５１ｇ／ｌである。廃液の液温は６５〜７５℃に昇
温し、ポンプ７で１分間当り５００〜６００ｌを濾過器
１０に送液した。フィルター９は市販の２０インチのカ
ートリッジタイプで、フィルターのメッシュは１０ミク
ロンメータを用いた。フィルターは、あらかじめ市販の
パラジウム触媒に２〜３分間浸漬したのち、２〜３分間
流水中で水洗し、水洗中から取り出し３〜４分間液きり
を行ったのち、洗浄水を循環できる濾過器に装填し１０
〜１５分間水洗したのち、濾過器１０に２０本装填し
た。化学銅めっき液２の循環は１２０分間行なった。銅
イオン除去後の廃液貯槽５の液中の銅イオン濃度は１ｐ
ｐｍ以下となり、約１３ｋｇの銅が回収できた。The specific treatment conditions are as follows: the amount of the chemical copper plating solution in the waste liquid storage tank 5 is about 5000 l, the copper concentration in the waste liquid is 2.6 g / l, and the ethylenediaminetetraacetate as a chelating agent is 31 g / l. The reaction product, sodium formate, is 51 g / l. The liquid temperature of the waste liquid was raised to 65 to 75 ° C., and 500 to 600 l per minute was sent to the filter 10 by the pump 7. The filter 9 was a commercially available 20-inch cartridge type, and the filter mesh used was a 10-micron meter. The filter is pre-soaked in a commercially available palladium catalyst for 2 to 3 minutes, washed in running water for 2 to 3 minutes, removed from the water, drained for 3 to 4 minutes, and then filtered with a filter that can circulate the washing water. Loading 10
After washing with water for １５15 minutes, 20 filters were loaded into the filter 10. The circulation of the chemical copper plating solution 2 was performed for 120 minutes. After removing copper ions, the concentration of copper ions in the liquid in the waste liquid storage tank 5 is 1 p.
pm or less, and about 13 kg of copper could be recovered.
【００１３】銅イオンを除去した廃液貯槽５の液を晶析
槽１４に移し、２５℃以下に冷却し、７５％の硫酸を添
加し撹拌しながらｐＨ１．５に調整し、エチレンジアミ
ンテトラアセテートを晶析させ濾過器で固液分離した。
フィルターは市販の２０インチのカートリッジタイプ
で、フィルターメッシュは５ミクロンメータを用いた。
ろ液中のエチレンジアミンテトラアセテート濃度は０．
３ｇ／ｌ以下となり、約１５０ｋｇ回収できた。ろ液を
減圧蒸留器２４で沸点７０〜８０℃で蒸留し、ギ酸受槽
２５に回収した。この時、化学銅めっきの老化廃液５０
００ｌから、ギ酸が約１００ｋｇ回収出来た。従来、５
０００ｌ（約５６００ｋｇ）の産業廃棄物量を５００ｋ
ｇに減量出来た。The liquid in the waste liquid storage tank 5 from which the copper ions have been removed is transferred to the crystallization tank 14, cooled to 25 ° C. or lower, added with 75% sulfuric acid, adjusted to pH 1.5 with stirring, and ethylenediamine tetraacetate is crystallized. The solid was separated by a filter.
The filter was a commercially available 20-inch cartridge type, and the filter mesh used was a 5-micron meter.
The concentration of ethylenediaminetetraacetate in the filtrate was 0.1.
It became 3 g / l or less, and about 150 kg could be collected. The filtrate was distilled with a vacuum evaporator 24 at a boiling point of 70 to 80 ° C. and collected in a formic acid receiving tank 25. At this time, aging waste liquid 50 of chemical copper plating
From 100 l, about 100 kg of formic acid could be recovered. Conventionally, 5
000 l (about 5600 kg) of industrial waste 500 k
g.
【００１４】[0014]
【発明の効果】以上説明したように本発明によれば、化
学めっきの老化廃液からの有価成分のキレート剤、ギ酸
の回収を、低コストの設備投資、ランニング費で可能と
する。また、回収したギ酸に銅を溶解することにより、
化学銅めっきの銅イオンの補給に再利用することが可能
である。As described above, according to the present invention, it is possible to recover a valuable component chelating agent and formic acid from an aging waste solution of chemical plating with low-cost equipment investment and running costs. Also, by dissolving copper in the recovered formic acid,
It can be reused to supply copper ions for chemical copper plating.
【図１】化学銅めっき液から有価成分の銅、キレート
剤、ギ酸を回収する回収装置の構成を示す。FIG. 1 shows a configuration of a recovery apparatus for recovering valuable components of copper, a chelating agent, and formic acid from a chemical copper plating solution.
１ 化学銅めっき槽 ２ 化学銅めっき液 ３ ポンプ ４ 配管 ５ 廃液貯槽 ６ 加温用ヒータ ７ ポンプ ８ 配管 ９ フィルター １０ 濾過器 １１ ポンプ １２ 配管 １３ 撹拌機 １４ 晶析槽 １５ ポンプ １６ 配管 １７ 硫酸タンク １８ 硫酸 １９ ポンプ ２０ 配管 ２１ フィルター ２２ 濾過器 ２３ 冷却器 ２４ 減圧蒸留器 ２５ ギ酸受槽 ２６ ギ酸 DESCRIPTION OF SYMBOLS 1 Chemical copper plating tank 2 Chemical copper plating solution 3 Pump 4 Pipe 5 Waste liquid storage tank 6 Heating heater 7 Pump 8 Pipe 9 Filter 10 Filter 11 Pump 12 Pipe 13 Stirrer 14 Crystallization tank 15 Pump 16 Pipe 17 Sulfuric acid tank 18 Sulfuric acid 19 Pump 20 Piping 21 Filter 22 Filter 23 Cooler 24 Vacuum evaporator 25 Formic acid receiving tank 26 Formic acid
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−39167（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 18/16 C22B 3/04 C22B 15/00 H05K 3/18 ────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-60-39167 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) C23C 18/16 C22B 3/04 C22B 15 / 00 H05K 3/18
Claims (4)
た濾材により、化学めっきに使用した化学めっき液から
金属イオンを回収する回収機構と、 前記回収機構により 金属イオンが回収された液を収容す
る晶析槽と、 前記晶析槽内の液に酸を添加する添加機構と、 キレ−ト剤濾過用の濾過器と、 前記晶析槽内の液を前記濾過器に移送する移送機構と、 を有し、前記液中に晶析したキレ−ト剤が前記濾過器に
より濾過されることを特徴とする化学めっき液の有価成
分回収装置。1. A catalyst for precipitating metal ions is attached.
Filter media to remove the chemical plating solution used for chemical plating.
A recovery mechanism for recovering metal ions, and crystallization tank for containing a liquid metal ion is recovered by the recovery mechanism, and adding mechanism adding an acid to the liquid within the crystallization vessel, chelating - DOO agent for filtration and wherein the bets agent is filtered by the filter - and filter, wherein a transfer mechanism for the liquid in the crystallizer is transferred to the filter has, crystallization was sharp that the liquid Equipment for recovering valuable components from chemical plating solutions.
添加機構により前記酸が添加されることを特徴とする請
求項１記載の化学めっき液の有価成分回収装置。2. The apparatus according to claim 1, wherein the acid is added by the addition mechanism until the pH of the solution becomes 2 or less.
求項１または請求項２記載の化学めっき液の有価成分回
収装置。3. The apparatus according to claim 1, wherein the acid is sulfuric acid.
から有価成分を回収する方法であって、前記化学銅めっ
き液中の銅イオンを回収し、前記銅イオンが回収された
液に含まれるキレート剤を回収し、前記キレート剤が回
収された液からギ酸を回収することを特徴とする有価成
分回収方法。4. A method for recovering valuable components from a chemical copper plating solution used for chemical copper plating, wherein copper ions in the chemical copper plating solution are recovered, and the copper ions are contained in the recovered solution. A method for recovering valuable components, comprising recovering a chelating agent and recovering formic acid from a liquid in which the chelating agent has been recovered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30080499A JP3312299B2 (en) | 1995-03-13 | 1999-10-22 | Apparatus and method for recovering valuable component of chemical plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30080499A JP3312299B2 (en) | 1995-03-13 | 1999-10-22 | Apparatus and method for recovering valuable component of chemical plating solution |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7080810A Division JP3020137B2 (en) | 1995-03-13 | 1995-03-13 | Equipment for recovering valuable components of chemical plating solutions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000160346A JP2000160346A (en) | 2000-06-13 |
| JP3312299B2 true JP3312299B2 (en) | 2002-08-05 |
Family
ID=17889311
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30080499A Expired - Fee Related JP3312299B2 (en) | 1995-03-13 | 1999-10-22 | Apparatus and method for recovering valuable component of chemical plating solution |
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| Country | Link |
|---|---|
| JP (1) | JP3312299B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114436382A (en) * | 2021-12-31 | 2022-05-06 | 无锡星亿智能环保装备股份有限公司 | A processing apparatus for electroplating effluent |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2000160346A (en) | 2000-06-13 |
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