JP3289328B2 - Liquid epoxy resin molding material - Google Patents
Liquid epoxy resin molding materialInfo
- Publication number
- JP3289328B2 JP3289328B2 JP20822592A JP20822592A JP3289328B2 JP 3289328 B2 JP3289328 B2 JP 3289328B2 JP 20822592 A JP20822592 A JP 20822592A JP 20822592 A JP20822592 A JP 20822592A JP 3289328 B2 JP3289328 B2 JP 3289328B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- molding material
- resin molding
- liquid epoxy
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電気部品、電子部品、
半導体チップ等を封止する液状エポキシ樹脂成形材料に
関するものである。The present invention relates to electric parts, electronic parts,
The present invention relates to a liquid epoxy resin molding material for sealing a semiconductor chip or the like.
【０００２】[0002]
【従来の技術】近年のエレクトロニクスノ急発展に伴
い、ＩＣ、ＬＳＩ等の半導体素子は種々の分野で用いら
れ、低コスト、高集積化の流れは新しい様々な実装形態
を生み出し、従来の金型を用いたトランスファー成形に
よるデュアルインラインパッケージに変わり、ハイブリ
ッドＩＣ、チップオンボード、テープキャリアパッケー
ジ、プラスチックピングリッドアレイ等の金型無しで、
ベアーチップのスポット封止によって形成する実装形態
へ移行してきている。しかしながらこれらの封止品は金
型によるものに比較して信頼性が低いといわれている。
この原因の１つは液状材料のため粘度制約があり使用可
能な樹脂、硬化剤、充填剤等が限定される点である。2. Description of the Related Art With the rapid development of electronics in recent years, semiconductor devices such as ICs and LSIs are used in various fields. Instead of a dual in-line package by transfer molding using, there is no mold for hybrid IC, chip on board, tape carrier package, plastic pin grid array, etc.
The mounting mode has been shifted to a mounting mode formed by spot sealing of a bear chip. However, it is said that these sealed products have lower reliability than those using a mold.
One of the causes is that the viscosity of the liquid material is limited and the usable resin, curing agent, filler, and the like are limited.
【０００３】[0003]
【発明が解決しようとする課題】従来の技術で述べたよ
うに、従来の液状エポキシ樹脂成形材料は、一長一短が
あった。本発明は従来の技術における上述の問題点に鑑
みてなされたもので、その目的とするところは、低粘度
化、高接着性の液状エポキシ樹脂成形材料を提供するこ
とにある。As described in the prior art, the conventional liquid epoxy resin molding material has advantages and disadvantages. SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems in the prior art, and an object of the present invention is to provide a liquid epoxy resin molding material having a low viscosity and high adhesiveness.
【０００４】[0004]
【課題を解決するための手段】本発明は平均粒径０.５
〜５０ミクロンの粉末状ノボラック型フェノール樹脂を
含有し、溶媒を含有しないことを特徴とする液状エポキ
シ樹脂成形材料のため、上記目的を達成することができ
たもので、以下本発明を詳細に説明する。According to the present invention, an average particle size of 0.5 is provided.
A liquid epoxy resin molding material containing a powdery novolak type phenolic resin having a size of 50 μm and containing no solvent, thereby achieving the above object. The present invention will be described in detail below. I do.
【０００５】本発明に用いるエポキシ樹脂としては、１
分子中に２個以上のエポキシ基を有する硬化可能なエポ
キシ樹脂であるならば、ビスフエノール型エポキシ樹
脂、環状脂環式エポキシ樹脂、ノボラック型エポキシ樹
脂、クレゾールノボラック型エポキシ樹脂、ナフタレン
型エポキシ樹脂、可撓性エポキシ樹脂、ハロゲン化エポ
キシ樹脂、グリシジルエステル型エポキシ樹脂、高分子
型エポキシ樹脂等の何れでもよく、特に限定するもので
はない。硬化剤、架橋剤としてはメチルテトラヒドロ無
水フタル酸、メチルヘキサヒドロ無水フタル酸等の酸無
水物、アミン、フェノール樹脂等を用いることができる
が、すくなくとも粉末状ノボラック型フエノール樹脂を
含有させることが必要である。粉末状ノボラック型フエ
ノール樹脂の粒径は平均粒径で０．５〜５０ミクロンで
あることが好ましい。即ち０．５ミクロン未満では粘度
が増加する傾向にあり、５０ミクロンをこえるとＴｇ値
がバラツク傾向にあるからである。硬化促進剤としては
イミダゾール系、リン系、３級アミン系等の硬化促進剤
全般を用いることができ、特に限定するものではない。
エポキシ樹脂、硬化剤、硬化促進剤、改質剤については
各々液状、固型でもよいが、これらを混合したものは液
状であることが必要である。又必要に応じてタルク、ク
レー、シリカ、マイカ、炭酸カルシュウム、水酸化アル
ミニゥム等の無機質粉末充填剤、ブロム化合物、クロル
化合物、燐化合物等の難燃剤、シリコン系化合物等の消
泡剤、カーボンブラック、酸化チタン等の着色剤、シラ
ンカップリング剤、チタネート系カップリング剤等のカ
ップリング剤等を添加することができるものである。な
お必要に応じて充填剤表面をカップリング剤で表面処理
することも出来る。かくして上記材料を混合、混練し、
更に真空脱泡して液状エポキシ樹脂成形材料を得るもの
である。該成形材料の成形については、注型、注入、デ
イッピング、ドリップコーティング、塗布等が用いられ
る。[0005] The epoxy resin used in the present invention includes 1
If it is a curable epoxy resin having two or more epoxy groups in the molecule, bisphenol type epoxy resin, cyclic alicyclic epoxy resin, novolak type epoxy resin, cresol novolak type epoxy resin, naphthalene type epoxy resin, Any of a flexible epoxy resin, a halogenated epoxy resin, a glycidyl ester type epoxy resin, a polymer type epoxy resin and the like may be used, and there is no particular limitation. As a curing agent and a cross-linking agent, acid anhydrides such as methyltetrahydrophthalic anhydride and methylhexahydrophthalic anhydride, amines, phenol resins, and the like can be used, but it is necessary to include at least a powdery novolak phenol resin. It is. The average particle size of the powdery novolak phenolic resin is preferably 0.5 to 50 microns. That is, if the thickness is less than 0.5 μm, the viscosity tends to increase, and if it exceeds 50 μm, the Tg value tends to vary. As the curing accelerator, imidazole-based, phosphorus-based, and tertiary amine-based curing accelerators can be used in general, and are not particularly limited.
The epoxy resin, the curing agent, the curing accelerator, and the modifier may be liquid or solid, respectively, but a mixture of these must be liquid. If necessary, fillers of inorganic powders such as talc, clay, silica, mica, calcium carbonate, and aluminum hydroxide, flame retardants such as bromo compounds, chlor compounds, phosphorus compounds, defoamers such as silicon compounds, and carbon black And a coloring agent such as titanium oxide, a silane coupling agent, a coupling agent such as a titanate coupling agent, and the like. If necessary, the surface of the filler may be surface-treated with a coupling agent. Thus, the above materials are mixed and kneaded,
It is further subjected to vacuum degassing to obtain a liquid epoxy resin molding material. For molding of the molding material, casting, pouring, dipping, drip coating, coating and the like are used.
【０００６】以下本発明を実施例に基づいて説明する。Hereinafter, the present invention will be described based on embodiments.
【０００７】[0007]
【実施例及び比較例】表１の配合表に基づいて材料を配
合、混合、混練、脱泡して液状エポキシ樹脂成形材料を
得た。エポキシ樹脂としてはエポキシ当量１７５、粘度
１００ＰＳのビスフェノールＡ型エポキシ樹脂、酸無水
物としては水酸基当量１６８のメチルヘキサヒドロ無水
フタル酸、ノボラック型フエノール樹脂としては水酸基
当量１１８、融点９５℃、平均粒径１０ミクロンの粉末
状ノボラック型フエノール樹脂、オルガノシロキサンと
してはエポキシ当量６００、分子量３０００、粘度１９
０ＣＰＳのエポキシ基及びフエニル基含有オルガノポリ
シロキサンを用いた。EXAMPLES AND COMPARATIVE EXAMPLES Based on the composition table in Table 1, the materials were blended, mixed, kneaded, and defoamed to obtain a liquid epoxy resin molding material. Bisphenol A type epoxy resin having an epoxy equivalent of 175 and a viscosity of 100 PS as an epoxy resin, methylhexahydrophthalic anhydride having a hydroxyl equivalent of 168 as an acid anhydride, hydroxyl equivalent of 118 as a novolak type phenol resin, melting point of 95 ° C., average particle diameter 10 micron powdered novolak type phenol resin, epoxy siloxane 600, molecular weight 3000, viscosity 19 as organosiloxane
An organopolysiloxane containing 0 CPS epoxy and phenyl groups was used.
【０００８】[0008]
【表１】 重量部 実施例及び比較例の液状エポキシ樹脂成形材料の性能
は、表２のようである。粘度は２５℃でのＰＳで示し、
ピール強度は２０ｍｍ幅のポリイミド樹脂フイルム２枚
間に液状エポキシ樹脂成形材料を塗布、硬化後のピール
接着強度をｇ／２０ｍｍで示し、レベリング性は使用時
の流れ易さ、ヒートサイクルはチップサイズ４×４ｍ
ｍ、リード数６１本のＴＣＰ素子でチップ上に５ミクロ
ン２本、１０ミクロン２本のアルミニゥムパターン抵抗
体を描きパッシベーション無しチップ搭載素子を−６５
〜１５０℃各３０分間処理し不良発生迄のサイクル数
を、ＰＣＴ試験は上記チップ搭載素子を１２１℃、２気
圧で処理し不良発生迄の時間でみた。[Table 1] Parts by weight Table 2 shows the performance of the liquid epoxy resin molding materials of the examples and the comparative examples. The viscosity is indicated by PS at 25 ° C.,
The peel strength is indicated by g / 20 mm of the peel adhesive strength after applying and curing the liquid epoxy resin molding material between two polyimide resin films having a width of 20 mm. × 4m
m, two 5 micron and 10 micron aluminum pattern resistors are drawn on the chip with a TCP element of 61 leads and the chip mounted element without passivation is -65.
In the PCT test, the above-mentioned chip mounted device was processed at 121 ° C. and 2 atmospheres at a pressure of 2 atm.
【０００９】[0009]
【表２】 [Table 2]
【００１０】[0010]
【発明の効果】本発明は上述した如く構成されている。
特許請求の範囲に記載した構成を有する液状エポキシ樹
脂成形材料においては、接着性、高接着性で本発明の優
れていることを確認した。The present invention is configured as described above.
It was confirmed that the liquid epoxy resin molding material having the constitution described in the claims had excellent adhesiveness and high adhesiveness and was excellent in the present invention.
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C08G 59/62 H01L 23/29 ──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. 7 , DB name) C08G 59/62 H01L 23/29
Claims (1)
ボラック型フェノール樹脂を含有し、溶媒を含有しない
ことを特徴とする液状エポキシ樹脂成形材料。A liquid epoxy resin molding material comprising a powdery novolak type phenol resin having an average particle size of 0.5 to 50 microns and containing no solvent .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20822592A JP3289328B2 (en) | 1992-08-04 | 1992-08-04 | Liquid epoxy resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20822592A JP3289328B2 (en) | 1992-08-04 | 1992-08-04 | Liquid epoxy resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0649329A JPH0649329A (en) | 1994-02-22 |
| JP3289328B2 true JP3289328B2 (en) | 2002-06-04 |
Family
ID=16552740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20822592A Expired - Lifetime JP3289328B2 (en) | 1992-08-04 | 1992-08-04 | Liquid epoxy resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3289328B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112443A (en) * | 1997-06-25 | 1999-01-19 | Matsushita Electric Works Ltd | Liquid epoxy resin composition and semiconductor apparatus |
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
-
1992
- 1992-08-04 JP JP20822592A patent/JP3289328B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0649329A (en) | 1994-02-22 |
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