JP3263314B2 - Power supply unit structure for preventing conduction and radiation noise interference of electronic device and electronic device having this power supply unit structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power supply structure of an electronic device, and more particularly to a power supply structure of an electronic device such as a communication device. 2. Description of the Related Art In recent years, the amount of information and the speed of communication systems have been increasing, and accordingly, the amount of radio noise interference generated from communication devices has increased, which has become a problem. Radio noise interference generated from a communication device includes radiated noise interference radiated directly from the communication device to the surroundings, and conducted noise interference leaked to the outside through a power supply line. The present invention relates to measures against conducted and radiated noise interference.

[0002] Countermeasures against conducted noise interference are generally taken in a power supply section of communication equipment. Therefore, the power supply unit of the communication device is required to be hardly generated by conducted noise interference, to have a structure that can be easily manufactured, to have durability, and the like.

[0003]

2. Description of the Related Art FIG. 9 shows an example of a conventional feeder structure 10. FIG. 10 schematically shows the communication device 11 including the power supply unit structure 10. The communication device 11 has a structure in which a plurality of plug-in units 13 are inserted and mounted in a shelf (not shown) having a back panel 12, and the power supply unit structure 10 is provided in the back panel 13.

In the power supply unit structure 10, a terminal block 20 is fixed to a metal cover 21, the feedthrough capacitors C1, C2, and C3 are provided on the metal cover 21 to prevent conducted noise interference, and an external cable is connected to the terminal block 20. 26 is a configuration to be directly connected. Wires 23 and 24 are soldered to terminals 22 of the feedthrough capacitors C1, C2 and C3. Here, since the current capacity is large, the number of the electric wires 23 and 24 is large, for example, six.

[0005]

Although the metal cover 21 is provided, the terminal block 20 is not sufficiently shielded. In addition, feedthrough capacitors C1, C2,
The electric wires 23 and 24 are soldered to the terminal 22 of C3. Considering the work of soldering, the electric wires 23 and 24 need to have a certain length, and the electric wires 23 and 24 have a certain length. Has impaired the filter function. Therefore, the power supply unit structure 10 did not have a sufficient function of suppressing conducted noise interference.

In the power supply unit structure 10, since the lengths of the electric wires 23 and 24 are determined to be short, the work of soldering at the time of assembling is troublesome, and the number of times of soldering is large, so that the assembling workability is improved. It was quite troublesome. SUMMARY OF THE INVENTION It is an object of the present invention to provide a power supply unit structure for preventing conduction and radiation noise interference of an electronic device which has solved the above-mentioned problem, and an electronic device having the power supply unit structure.

[0007]

According to a first aspect of the present invention, there is provided a power supply unit structure of an electronic device having a back panel and a back cover for covering a back surface of the back panel, wherein a power supply portion between the back panel and the back cover is provided. The ground pattern of the back panel and the back cover are provided to be electrically connected,
A frame-shaped shield member that forms a shielded space inside is provided, and a plug-side power supply connector is provided in an area on the back panel and inside the frame-shaped shield member; On the back panel, in a region inside the frame-shaped shield member, a chip type capacitor,
It is configured to be electrically connected and mounted between the plug-in side power connector and the frame ground pattern.

According to a second aspect of the present invention, the back cover has an opening only corresponding to the plug-in side power supply connector. According to a third aspect of the present invention, two chip capacitors are provided in parallel with each plug-in power supply connector.

According to a fourth aspect of the present invention, the frame-shaped shield member has a plurality of spring pieces arranged on a surface side facing the back panel and a surface side facing the back cover. Things. According to a fifth aspect of the present invention, there is provided a power supply unit having a structure for preventing conduction noise interference according to any one of the first to fourth aspects.

According to a sixth aspect of the present invention, there is provided a connector having a power supply unit structure for preventing conduction / radiation noise interference according to any one of the first to fourth aspects provided on a front surface side of a back panel. This is a configuration provided at a position shifted from the position.

[0011]

1 to 5 show a feeder structure 30 according to an embodiment of the present invention. FIGS. 2, 6 and 7 show a communication system for a B-ISDN having the feeder structure 30. FIG. 1 shows a device 31. For convenience of explanation, the communication device 31 will be described first. The communication device 31, as shown in FIGS. 2, 6, and 7,
It is configured by a box-shaped communication device main body 32, a plug-in unit 33 and an electric fan unit 34 mounted inside the main body. The electric fan unit 34 is mounted at a central position in the height direction of the communication device main body 32.
The plug-in unit 33 is divided into a portion above the electric fan unit 34 and a portion below the electric fan unit 34 and mounted in two stages.

The main body 32 of the communication device is a shelf 3 made of sheet metal.
5 and a back cover 36 made of sheet metal. Shelf 35
A shelf body 37, a back panel 38 of a laminated printed board structure covering the back side of the shelf body 37,
Front frame portion 39 attached to the front of shelf body 37
And The shelf body 37 is provided with mesh plates 40 and 41 at its bottom and top, and O
A PT terminal board 42 is provided. The shelf main body 37 has an electric fan unit mounting space 45 in the center,
The upper and lower sides have plug-in unit mounting spaces 46 and 47.

The back cover 36 is provided around a shelf body 37.
And is fixed to the shelf main body 37 in a state of being in spring contact with the back panel 38, and is located slightly away from the back panel 38 in the Y2 direction, and covers the entire back surface of the back panel 38. The back cover 36 mainly suppresses radiated noise interference directly radiated from the pins 52 projecting rearward from the back panel 38 described later so as not to be radiated to the surroundings. 48 is a flat space between the back panel 38 and the back cover 36.

On the back panel 38, a plurality of sheet connectors 50 for signals are arranged on the front surface (the surface on the Y1 side), and a sheet connector 51 for one power supply is provided.
Is provided. The sheet connector 51 for the power supply is provided at a portion closer to the X1 direction side. The pin 52 of the signal sheet connector 50 is long and protrudes rearward from the back panel 38. This is for connecting the different signal sheet connectors 50 on the rear side of the back panel 38 using a cable (not shown).

The plug-in unit 33 is inserted in the Y2 direction, and is mounted in the plug-in unit mounting spaces 46 and 47 with the sheet connector 53 at the end connected to the sheet connector 50 described above. The electric fan unit 34 has a configuration having a plurality of electric fans.
The sheet connector 5 which is inserted in two directions and is located at the rear end
4 is mounted in the electric fan unit mounting space 45 in a state of being connected to the seat connector 51 described above.
The plug-in unit 33 is forcibly air-cooled by wind generated by the electric fan unit 34. Mesh board 40,
The reference numeral 41 suppresses the passage of wind and the radiation noise interference radiated from the plug-in unit 33 from radiating to the surroundings.

Next, the power supply unit structure 30 will be described.
The power supply unit structure 30 is a portion of the back panel 38 corresponding to the electric fan unit mounting space 45,
In addition, it is disposed at a position closer to the X2 direction, that is, at a position apart from the position of the sheet connector 51 for the power supply.
This is to prevent the back panel 38 from being affected by the bending deformation received when the electric fan unit 34 is inserted and mounted, that is, when the seat connector 54 is connected to the seat connector 51.

As shown in FIGS. 1 and 4, the power supply structure 30 includes a predetermined portion 38a of the back panel 38 and a rectangular copper shield block 6 serving as a shield member.
0, eight chip capacitors C11 to C18, a main A power supply connector 61, a main A power supply return ground connector 62, a main B power supply connector 63, a main B power supply return ground connector 64, and a frame ground (FG). ) Consists of a connector 65 and a predetermined portion 36a of the back cover 36.

The power supply unit structure 30 has the following structure.
The rectangular copper shielding block 60 is
Inside, it is fixed to a predetermined portion 38 a of the back panel 38 by a set screw 66 and is fixed to a predetermined portion 36 a of the back cover 36 by another set screw 67. The shield block 60 is sandwiched between the back panel 38 and the back cover 36, and forms a shielded space 68 inside the shield block 60 that is partitioned from the space 48. The structure of the predetermined portion 38a of the back panel 38 will be described later.

In this shielded space 68, FIG.
As shown in (C), the main A power supply connector 61, the return ground connector 62 of the main A power supply, and the frame ground connector 6 are sequentially arranged in the X1 direction from the X2 side.
5. A main B power supply connector 63 and a return ground connector 64 for the main B power supply are mounted side by side by press-fitting.

Similarly, in the shielded space 68, two chip capacitors C11 and C12 are adjacent to the main A power supply connector 61, and two chip capacitors C1 and C1 are adjacent to the return ground connector 62 of the main A power supply.
3. C14 is adjacent to the main B power connector 63 and 2
The two chip capacitors C15 and C16 are adjacent to the return ground connector 64 of the main B power supply, and the two chip capacitors C17 and C18 are respectively connected to the back panel 3
8 is surface-mounted. Two chip capacitors corresponding to the connectors are provided one by one near the ends of the connectors in the Z1 and Z2 directions.

Here, the work of surface mounting the chip capacitor is much simpler than the conventional soldering of electric wires. The distance a between each of the chip capacitors C11 to C18 and the corresponding connector 61, 62, 63, 64 is shorter than 10 mm. Chip capacitors C11, C
Reference numeral 12 denotes a parallel connection between the main A power supply connector 61 (the pad 90 for mounting the main A power supply connector in FIG. 5A) and the frame ground 70 (the surface ground layer 83 in FIG. 5A). I have. Two chip capacitors corresponding to other connectors are also connected to each connector and frame ground 7.
0 and connected in parallel.

In the predetermined portion 36a of the back cover 36, five openings 71 to 75 are formed so as to face the connectors 61, 62, 65, 63 and 64, respectively.
2, 65, 63, 64 project from the corresponding openings 71-75. The predetermined portion 36a of the back cover 36 covers the space 68 as much as possible.

Next, a predetermined portion 38a of the back panel 38
Will be described. FIG. 5B shows a pattern 80 of the predetermined portion 38a of the back panel 38 and its peripheral portion as viewed from the back surface 38b side of the back panel 38. FIG. 5A shows a surface pattern 82 which is a pattern before the resist layer 81 is formed. Pattern 80
Has a configuration in which a substantially entire surface pattern 82 is covered with a resist layer 81 as shown in FIG. The copper pattern is indicated by hatching leftward, and the resist layer 81 is indicated by hatching rightward.

The surface pattern 82 has a substantially solid surface ground pattern 83, and has a predetermined pattern in two rectangular windows 84 and 85 which are arranged without forming the surface ground pattern 83. is there. The rectangular window 84 has a pad 90 for mounting a main A power supply connector and a pad 9 for mounting a return ground connector for a main A power supply.
1, eight chip capacitor mounting pads 92 to 99,
Line pattern 10 connecting pad 90 and pads 93 and 94
1, 102, surface ground pattern 83 and pads 92, 9
5 and line patterns 103, 104, etc. Pad 9 to be mounted with return ground connector for main A power supply
Line patterns also extend from pads 96-99 associated with 1 and pad 91. Although not shown, the pads 90 and 93 have small through holes for press-fitting. The same pattern as the pattern in the rectangular window 84 is formed in another rectangular window 85. The description is omitted.

The resist layer 81 has a surface ground pattern 8
3 is formed in a rectangular frame shape and the chip capacitor mounting pads 92 to 99 are exposed. The part where the surface ground pattern 83 is exposed in a rectangular frame shape is
The shield block is to be fixed 110.

Also, the shield block fixed portion 110
In the area surrounded by, in order from the X2 side to the X1 direction, a main A power supply connector mounting portion 111, a main A power supply return ground connector mounting portion 112, a frame ground connector mounting portion 113, and a main B power connector mounting portion The scheduled portion 114 and the scheduled return ground connector mounting portion 115 of the main B power supply are arranged. Also, two chip capacitor mounting scheduled portions 116 to 123 are provided for each of the scheduled mounting portions 111, 112, 114, and 115. is there. Scheduled mounting parts 111, 112, 113, 114, 11
5 has a plurality of small holes for press-fitting.

The shield block fixing portion 110 includes:
The shield block 60 is fixed in close contact. Therefore,
The shield block 60 is electrically connected to the surface ground pattern 83 with reliability. Planned mounting part 11
1, 112, 113, 114, and 115 have press-fit pins penetrated through small holes, and connectors 61, 6
2, 65, 63 and 64 are fixed.

Chip capacitor mounting portions 116 to 12
3, the surface of the chip capacitors C11 to C18 are mounted. Next, characteristics and the like of the power supply unit structure 30 having the above configuration will be described. As shown in FIG.
Insertion side connector 131 at the end of power cable 130
Are inserted into the main A power supply connector 61 through the opening 71. The connectors at the distal ends of the cables are also inserted into the other connectors 62, 65, 63, 64. Here, the connector 131 and the like generally do not have a shield structure.

Although the connector 131 and the like do not have a shield structure, since the space to which the connector 131 and the like are connected is the shield space 68, the communication equipment 31 for the B-ISDN is used.
Does not occur on the power cable 130 in the power supply unit structure 30.

Each connector 61, 62, 63, 64
Since two chip capacitors C11 to C18 are provided for each of them, and furthermore, the chip capacitors C11 to C18 are arranged close to each connector 61, 62, 63, 64 within 10 mm or less. Numeral 30 exhibits a filter function better than before. Therefore, B-ISD
Conducted noise interference generated inside the communication device 31 for N and transmitted through the power supply line and leaked to the outside is suppressed better than in the related art.

FIG. 8 shows another example of the shield block 60. The shield block 140 is a sheet metal member, and a number of leaf spring pieces 141 are densely provided on four sides of a portion facing the back cover 36, and on four sides of a portion facing the back panel 38, Many leaf spring pieces 142
Are arranged closely.

When the shield block 140 is used, a large number of leaf spring pieces 141 are bent and elastically pressed against the back cover 36, so that electrical connection between the shield block 140 and the back cover 36 is ensured. Also,
Since a large number of leaf spring pieces 142 flex and elastically press against the back panel 38, electrical connection between the shield block 140 and the back panel 38 is ensured. Therefore, the space in the shield block 140 is more reliably shielded.

[0033]

As described above, according to the first aspect of the present invention,
Since a frame-shaped shield member is provided between the back panel and the back cover, and a plug-side power connector and a chip-type capacitor are provided in a shielded space inside the frame-shaped shield member, The first is that the plug-in side power connector is located in the shielded space, and the second is that the chip type capacitor is disposed close to the plug-in side power connector, thereby achieving the conventional structure. As a result, it is possible to more effectively suppress the interference of conduction and radiation noise that leaks outside through the power supply line. Further, the present invention is particularly effective when applied to an electronic device having a configuration in which signal pins protrude from the back panel to the back surface side. In addition, the capacitor is not a through type but a chip type, and is surface mounted.
The power supply unit can be manufactured with good workability.

According to the second aspect of the present invention, since the back cover has an opening only corresponding to the plug-in side power supply connector, the entire portion corresponding to the frame-shaped shield member has an opening. In comparison, the shielding property of the space inside the frame-shaped shield member can be improved, and the effect of suppressing the radiation noise interference leaking outside through the power supply line can be improved.

According to the third aspect of the present invention, the chip type capacitor is connected to each of the plug-in side power supply connectors by two.
Since the capacitors are provided in parallel, the effect of suppressing conducted noise interference can be improved as compared with the conventional configuration in which one capacitor is provided. The invention according to claim 4 is a configuration in which the frame-shaped shield member has a plurality of spring pieces arranged side by side on the surface side facing the back panel and on the surface side facing the back cover. In this state, the back panel and the back cover are reliably brought into contact with each other, the electrical connection between the shield member and the back panel and the back cover can be ensured, and the reliability of suppressing radiation noise interference can be improved.

According to the fifth aspect of the present invention, since the power supply unit has the structure for preventing transmission and radiation noise interference according to any one of the first to fourth aspects,
In an apparatus having a configuration in which signal pins protrude from the back panel to the back side, it is possible to realize an electronic apparatus capable of effectively suppressing radiation noise interference leaking to the outside through a power supply line.

According to the sixth aspect of the present invention, since the power supply unit structure for preventing the interference of conducted and radiated noises is provided at a position shifted from the position of the connector provided on the front side of the back panel, the unit is inserted. Even when the connector is pressed when mounted in the case, the back panel of the power supply unit structure does not bend, so that the risk of an accident such as cracking of the chip capacitor mounted on the surface can be avoided, and , Reliability can be improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a power supply unit structure of an electronic device according to an embodiment of the present invention in which conduction and radiation noise interference has been prevented.

FIG. 2 shows a communication device to which the power supply unit structure of FIG. 1 is applied;
It is the perspective view seen from the back side in the state where a back cover was removed.

FIG. 3 is a sectional view of the power supply unit structure of FIG. 1;

FIG. 4 is a circuit diagram of a power supply unit structure of FIG. 1;

FIG. 5 is a diagram showing a back panel and a power supply unit structure of the power supply unit structure of FIG. 1;

FIG. 6 is a schematic diagram of a communication device to which the power supply unit structure of FIG. 1 is applied.

7 is a perspective view of a communication device to which the power supply unit structure of FIG. 1 is applied, viewed from the back side.

FIG. 8 is a view showing a modified example of the shield member in FIG.

FIG. 9 is a diagram showing a conventional power supply unit structure.

FIG. 10 is a circuit diagram of the power supply unit structure of FIG. 9;

[Explanation of symbols]

Reference Signs List 30 power supply unit structure 31 communication equipment for B-ISDN 32 box-shaped communication equipment main body 33 plug-in unit 34 electric fan unit 35 sheet metal shelf 36 back cover 37 shelf main body 38 back panel 48 between back panel and back cover 52 A pin projecting backward from the back panel 60 Rectangular copper shield block 61 Main A power connector 62 Return ground connector for main A power 63 Main B power connector 64 Return ground connector for main B power 65 Frame ground Connector 66, 67 Screw 68 Shielded space C11-C18 Chip type capacitor 83 Solid surface ground pattern 84, 85 Rectangular window 90 Main A power supply connector mounting pad 91 Return of main A power supply Planned mounting pad 92-99 Chip capacitor mounting pad 101-104 Line pattern 111 Main A power supply planned mounting part 112 Main A power supply planned return ground connector planned mounting 113 Frame ground connector planned planned mounting 114 Main B power supply mounting Planned part 115 Planned part for mounting return ground connector of main B power supply 116-122 Planned part for chip capacitor mounting 140 Shield block 141, 142 made of sheet metal member Many leaf spring pieces

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-124196 (JP, A) JP-A-7-326880 (JP, A) JP-A-7-45983 (JP, A) 326883 (JP, A) JP-A-64-69099 (JP, A) JP-A-5-95196 (JP, A) JP-A-8-250884 (JP, A) JP-A-6-132690 (JP, A) JP-A-1-289200 (JP, A) JP-A-63-304584 (JP, A) JP-A-58-127699 (JP, U) JP-A-61-106098 (JP, U) JP-A-2-27797 (JP, U) (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 9/00

Claims (6)

(57) [Claims] 1. A power supply structure for an electronic device having a back panel and a back cover that covers a back surface of the back panel, wherein a ground pattern of the back panel and the back cover are provided between the back panel and the back cover. And a frame-shaped shield member that forms a shielded space inside is provided, and on the back panel, in an area inside the frame-shaped shield member, A plug-side power connector is provided, and a chip-type capacitor is provided between the plug-side power connector and the frame ground pattern in an area on the back panel and inside the frame-shaped shield member. A power supply unit structure for preventing conduction and radiation noise interference of an electronic device, wherein the power supply unit is configured so as to be connected and mounted. 2. The feeder structure according to claim 1, wherein the back cover has an opening only corresponding to the plug-in side power connector. . 3. The electronic device according to claim 1, wherein said chip type capacitors are provided in parallel with each of said plug-in side power supply connectors. Power supply structure. 4. The frame-shaped shield member has a configuration in which a plurality of spring pieces are arranged on a surface side facing the back panel and on a surface side facing the back cover. A power supply unit structure for preventing conduction and radiation noise interference of the electronic device according to claim 1. 5. An electronic device, comprising: a power supply unit structure for preventing conduction and radiation noise interference according to claim 1. 6. A position of the power supply unit having been provided with measures for preventing conduction and radiation noise interference according to claim 1 deviated from a position of a connector provided on a front side of a back panel. An electronic device, wherein the electronic device is provided in the electronic device.