JP3262583B2 - Method for manufacturing phosphor substrate - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a phosphor substrate used for a fluorescent display tube, a cathode ray tube, and the like, and particularly to a method for forming a laminated film of a phosphor and a conductor layer on a transparent substrate. Is what you can do.

[0002]

2. Description of the Related Art In a conventional method of manufacturing a phosphor substrate, a phosphor ink layer is first formed on a transparent substrate by screen printing, and then aluminum is directly vapor-deposited on the phosphor ink layer to form a vapor deposition film layer. Finally, heating is performed to convert the organic components other than the phosphor in the phosphor ink layer into a pyrolysis gas, and remove them by passing through the end between the transparent substrate and the aluminum vapor-deposited film layer to remove the phosphor and the conductor layer. Is formed on a transparent substrate.

In another method, a phosphor ink layer is first formed on a transparent substrate by screen printing, and then a filming liquid layer having a smooth surface is coated on the phosphor ink layer. Next, aluminum is deposited to form a deposited film layer. Finally, heat is applied to make the organic components in the phosphor ink layer and the organic components such as the filming liquid layer into a pyrolysis gas, and are removed by passing between the transparent substrate and the aluminum deposited film layer to the end,
A laminated film of a phosphor and a conductor layer is formed on a transparent substrate.

[0004]

In the former method, since the phosphor ink layer contains phosphor particles having a large particle diameter, the phosphor ink layer surface has individual phosphor particles protruding therefrom. State. Therefore, since a vapor deposition film is formed independently on the surface of each phosphor particle, the vapor deposition film is divided between the individual phosphor particles. Therefore, good conductivity as the conductor layer cannot be obtained.

In the latter method, the vapor-deposited film layer is formed smoothly over the phosphor ink layer, so that the phosphor ink layer and the filming liquid layer are pressed down without any gap. For this reason, it becomes difficult for the thermal decomposition gas of the organic component to pass through, and the phenomenon that the remaining decomposition gas partially pushes up the aluminum vapor-deposited film layer causes so-called blistering, and cracks and pinholes penetrate through the aluminum vapor-deposited film layer. appear.

[0006]

Means for Solving the Problems A method of manufacturing a phosphor substrate according to the present invention is constituted as follows in order to solve the above problems. That is, on a substrate film having an uneven surface,
The transfer film on which the release layer, the phosphor ink layer, and the adhesive layer are sequentially formed is superimposed and heated and pressed so that the adhesive layer side is in contact with the transparent substrate surface, and then the base film is peeled off to form a release layer having an uneven surface, A phosphor ink layer and an adhesive layer are formed on a transparent substrate, and then a conductor layer is formed on the unevenness of the release layer by a vapor deposition method, and then the transparent substrate is heated to heat organic components other than the phosphor. After decomposition and removal, a laminated film of the phosphor and the conductor layer is formed on the transparent substrate.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing one embodiment of a phosphor substrate obtained by the phosphor substrate manufacturing method according to the present invention. FIG. 2 is a cross-sectional view showing one embodiment of a transfer film used in the method of manufacturing a phosphor substrate according to the present invention. 3 to 5 are cross-sectional views showing steps of an embodiment of the method for manufacturing a phosphor substrate according to the present invention. FIG. 6 is a cross-sectional view showing one embodiment of the phosphor substrate obtained by the phosphor substrate manufacturing method according to the present invention.

First, the base film 10 having the irregularities 14
Using a transfer film 1 on which a release layer 11, a phosphor ink layer 12, and an adhesive layer 13 are sequentially formed (see FIG. 2),
A release layer 11, a phosphor ink layer 12, and an adhesive layer 13 on the surface of the unevenness 14 are formed on the surface of the transparent substrate 2.

That is, the adhesive layer 13 is adhered to the surface of the transparent substrate 2 by superposing the adhesive layer 13 side of the transfer film 1 so as to be in contact with the transparent substrate 2 and pressing the surface of the transparent substrate 2 with a silicon pad and heating. You. Next, when the base film 10 is peeled, a peeling layer 11, a phosphor ink layer 12, and an adhesive layer 13 on the surface of the irregularities 14 are formed on the surface of the transparent substrate 2.

The base film 10 has an uneven surface 14 on the surface on which the release layer 11 is formed, and is peeled after being transferred to the surface of the transparent substrate 2. The base film 10 may be one used as a base film of a normal transfer film such as polyester.

The unevenness 14 of the base film 10 may be formed directly on the surface of the base film 10 by a hairline process, a sandblast process, a press process or the like. Alternatively, the surface of the base film 10 may be chemically formed with an unevenness using an etching agent. Alternatively, an uneven layer may be formed on the smooth surface of the base film 10 by a printing method or a laminating method.

The release layer 11 is a layer formed by a usual forming means such as a gravure printing method or a screen printing method using an ink composed of a thermoplastic resin, natural rubber, synthetic rubber, or the like.

The phosphor ink layer 12 is made of a phosphor ink composed of a phosphor, a resin and a solvent. Phosphors include ZnO: Zn, ZnS: Cl + In ₂ O ₃ , Zn
S: Cu, Al, ZnS: Ag, Al, Y 2 O 3 S: Eu, Y 2 O 2 S: using powder of the sulfide or oxide-based fluorescent material of Tb such as a gravure printing method or screen printing It is formed by a usual method for forming a phosphor ink layer such as a method.

The adhesive layer 13 is a layer formed by a general forming means such as a gravure printing method or a screen printing method using a heat-sensitive and pressure-sensitive resin such as polyamide and acrylic.

The transparent substrate 2 is made of a material that can withstand heating when the organic components other than the phosphor are thermally decomposed and removed, and examples thereof include a glass material such as soda-lime glass.

Next, the transfer film 1 is superposed and heated and pressed so that the adhesive layer 13 is in contact with the surface of the transparent substrate 2, and the base film 10 is peeled off (see FIG. 3). At least a phosphor ink layer is formed between the two (see FIG. 3).

For heating and pressurizing, a heated silicon pad is preferably used. Heating temperature is 130 ~ 230 ℃, pressure is 3 ~ 200Kg
Depending on the degree, it may be adjusted appropriately.

Next, the surface is made uneven by vapor deposition.
The conductor layer 3 is formed on the release layer 11 of FIG. The conductor layer 3 becomes uneven due to the unevenness 14 of the release layer 11 (see FIG. 4).

Next, the transparent substrate 2 is heated to thermally decompose and remove organic components other than the phosphor, thereby forming a laminated film 5 of the phosphor 4 and the conductor layer 3 on the transparent substrate 2. 6).

The organic components of the layers such as the release layer 11, the phosphor ink layer 12, and the adhesive layer 13 sandwiched between the conductor layer 3 and the transparent substrate 2 are thermally decomposed by heating and are decomposed by an organic gas. Becomes However, since the conductor layer 3 has the irregularities 14, a slight gap or groove is generated under the conductor layer 3 in the thermally decomposed organic gas. The pyrolysis gas reaches the ends through the gaps and grooves. The organic gas thus thermally decomposed is removed to the outside (see FIG. 5).

The organic components other than the phosphor include resin binders and solvents for each layer between the conductive layer 3 and the transparent substrate 2.

First, a transfer film 1 in which a release layer 11, a phosphor ink layer 12, and an adhesive layer 13 are sequentially formed on a base film 10 made of polyethylene terephthalate having irregularities 14 having a depth of 0.5 μm to 1.0 μm. Adhesive layer 13 and transparent substrate 2
And overlap. Next, the base film 10 is peeled off by applying heat and pressure using a silicon pad. Next, a conductive layer 3 is formed to a thickness of 600 ° on the release layer 11 on the uneven surface by vapor deposition. Next, the transparent substrate 2 is heated at 450 to 500 ° C. for 30 minutes to thermally decompose and remove organic components other than the phosphor, thereby forming a laminated film 5 of the phosphor 4 and the conductor layer 3 on the transparent substrate 2. The resulting phosphor substrate had the conductor layer 3 formed neatly.

[0023]

According to the method for producing a phosphor substrate of the present invention, a release layer having an uneven surface is provided on the phosphor ink layer.
A conductor layer is formed thereon. For this reason, fine gaps and grooves are formed below the conductor layer, and the pyrolysis gas of the organic component passes through the gaps and grooves, so that it becomes easier to pass between the transparent substrate and the aluminum deposited film layer. Therefore, a laminated film of the phosphor and the conductor layer without blisters, cracks or pinholes can be formed on the transparent substrate.

In the method of manufacturing a phosphor substrate according to the present invention, since the conductor layer is formed on the resin layer, the conductor layer is not divided. Therefore, good conductivity as a conductor layer is obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a phosphor substrate obtained by a method of manufacturing a phosphor substrate according to the present invention.

FIG. 2 is a cross-sectional view showing one embodiment of a transfer film used in the method of manufacturing a phosphor substrate according to the present invention.

FIG. 3 is a cross-sectional view showing each step of an embodiment of the method for manufacturing a phosphor substrate according to the present invention.

FIG. 4 is a cross-sectional view showing each step of an embodiment of the method for manufacturing a phosphor substrate according to the present invention.

FIG. 5 is a sectional view showing each step of an embodiment of the method for manufacturing a phosphor substrate according to the present invention.

FIG. 6 is a cross-sectional view showing one embodiment of a phosphor substrate obtained by the phosphor substrate manufacturing method according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Transfer film 10 Base film 11 Release layer 12 Phosphor ink layer 13 Adhesive layer 14 Unevenness 2 Transparent substrate 4 Phosphor 5 Laminated film

Claims (1)

(57) [Claims] 1. A transfer film in which a release layer, a phosphor ink layer, and an adhesive layer are sequentially formed on a substrate film having an uneven surface, and heating and pressing are performed so that the adhesive layer side is in contact with the transparent substrate surface. The base film is peeled off to form a release layer having an uneven surface, a phosphor ink layer and an adhesive layer on a transparent substrate, and then a conductor layer is formed on the unevenness of the release layer by a vapor deposition method, and then the transparent layer is formed. A method of manufacturing a phosphor substrate, comprising: heating a substrate to thermally decompose and removing an organic component other than the phosphor to form a laminated film of the phosphor and a conductive layer on a transparent substrate.