JP3254847B2 - Manufacturing method of inorganic decorative board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an inorganic decorative board, in which an embossed inorganic decorative board substrate used for an exterior material or the like is efficiently provided with a design having a high designability.

[0002]

2. Description of the Related Art Conventionally, various types of inorganic decorative boards have been used for exteriors of houses. In recent years, products having embossed surfaces have been favored along with the trend toward higher quality and higher design. When there is embossing on the surface, there is a simple manufacturing method such as painting with a single color paint or sanding, but there is another transfer method using an elastic body as a method of painting in synchronization with embossing, Transfer of the emboss into the concave portion occurred, and it was difficult to completely adhere the picture layer.

[0003]

DISCLOSURE OF THE INVENTION The present invention has been made in view of such conventional problems, and an object of the present invention is to provide an inorganic decorative board base material having an embossed surface. On the other hand, an object of the present invention is to propose a method of manufacturing an inorganic decorative board, in which a design having a high design quality in harmony with embossing is efficiently provided.

[0004]

In order to solve this problem, the present invention places a transfer sheet on the surface of an inorganic decorative board substrate having an embossed shape on its surface, and performs thermocompression bonding so as to follow the embossed shape. After peeling off the base film of the transfer sheet, the pattern layer of the transfer sheet transferred onto the inorganic decorative board substrate is further thermocompressed so as to follow the embossed shape. Provided is a method for manufacturing an inorganic decorative board, wherein a pattern layer floating on an embossed concave portion without adhering is brought into close contact with an inorganic decorative board base material. Further, the present invention provides a method for producing an inorganic decorative board, wherein the thermocompression bonding is performed using a roll-shaped elastic body or via a flat elastic body.

Hereinafter, the present invention will be described in detail. FIG. 1 shows an example of a cross-sectional configuration of a transfer sheet used in the present invention. The structure is such that a release varnish layer 2, a picture layer 3, and an adhesive layer 4 are sequentially provided on the surface of a base film 1.

As the substrate film, a thermoplastic resin film capable of following the surface embossed shape of the inorganic decorative board substrate by the heat of thermocompression bonding at the time of transfer by an elastic body is used. Specific examples include vinyl chloride, polyretylene, polypropylene, nylon, polyester and the like.

The type, thickness and the like of the substrate film may be selected depending on the degree of embossing on the surface and the transfer temperature. For example, at a transfer temperature of 150 ° C. to 180 ° C., the best result is obtained with a vinyl chloride resin film having a thickness of 100 μm or less.

The release varnish layer may be appropriately selected depending on the type of the base film, but when vinyl chloride is used for the base film, good results were obtained with polyvinyl butyral.

The picture layer can be printed by ordinary gravure printing, screen printing or the like. The binder of the ink is determined in consideration of elongation during heating, durability of the final product, and the like.

As the adhesive layer, polyvinyl alcohol,
Acrylic, hydroxymethylcellulose, polyester, polyamide and the like are used. In addition, when a process of applying an adhesive on a base material in advance is assumed, the adhesive is not necessarily required.

FIG. 2 shows a state in which a picture is being transferred onto the inorganic decorative board base material. The transfer sheet is placed so as to be synchronized with the embossed shape, and thermocompression bonded using the heated roll 5 so as to follow the embossed shape on the surface. Other methods of thermocompression bonding that follow the embossed shape include a method using a flat elastic body, a roll of an elastic body having a relationship between the male and female types with the surface embossed shape, and a flat type. There are methods.

As the inorganic decorative board base material 6, asbestos cement, calcium silicate board, magnesium silicate board, wood chip cement board or the like can be used.

FIG. 3 shows a state in which, after the base film 1 of the transfer sheet is peeled off, the remaining picture layer 7 is further thermocompressed with the heated roll 5. FIG. 4 shows a case where thermocompression bonding is performed via a flat elastic body 8. In addition, thermocompression bonding can be performed by following the method described above. In addition, a clear coating can be applied from above to protect the surface.

[0014]

In the transfer, the cause of the transfer of the fine emboss into the concave portion is caused by the transfer sheet interposed between the elastic body to be thermocompressed and the base material, and the thickness of the transfer sheet and shrinkage due to the application of heat. Due to the influence, it is difficult for the elastic body to completely follow the concave shape.

According to the present invention, the pattern layer floating on the embossed concave portion without contact is thermocompressed by further thermocompression bonding after the base film of the transfer sheet is peeled off. After the base film of the transfer sheet is peeled off, it is further thermocompression-bonded, so that the pattern layer is brought into close contact with the embossed concave portion of the shape that could not be brought into close contact with the conventional transfer without interposing the base film of the transfer sheet. I can do it.

[0016]

【Example】

Example 1 A base film of a transfer sheet having a thickness of 75
After applying a polyvinyl butyral resin as a release varnish layer to this surface using a μm semi-rigid vinyl chloride sheet,
By using gravure printing with an ink that uses polyvinyl chloride resin as a binder, a pattern that matches the embossed shape of the inorganic decorative board substrate described below is printed to provide a pattern layer, and a polyester resin is applied as an adhesive layer Thus, a transfer sheet was prepared.

On the other hand, a calcium silicate plate having a brick-like embossed surface on the surface was prepared as an inorganic decorative plate substrate, dust was removed, and a sealer treatment was performed. After the adhesive was applied and dried, it was transferred using a roll formed of silicon having a surface hardness of 40 ° and heated to 150 ° C. After the transfer, the base film of the transfer sheet was peeled off, and further subjected to thermocompression bonding with a roll heated to 150 ° C. and having a surface hardness of 40 °.

<Example 2> Using the same transfer sheet as in Example 1, a calcium silicate plate having a brick shape on its surface was prepared as an inorganic decorative plate substrate, dust was removed, and a sealer treatment was performed. After applying and drying the adhesive, a transfer sheet similar to that used in Example 1 was thermocompression-bonded using a roll formed of silicon having a surface hardness of 40 ° C. heated to 150 ° C. Was transcribed. After the transfer, the base film of the transfer sheet was peeled off, and further heated to 150 ° C. to a thickness of 20 m.
Thermocompression bonding was performed using flat silicon having an m surface hardness of 40 °.

On the surfaces of the decorative boards obtained in Examples 1 and 2,
An acrylic urethane top coat was applied as a surface protective layer. The decorative plate obtained in this way followed a minute embossed shape and had a highly designed design with a synchronized pattern.

[0020]

As described above, according to the present invention, by applying heat and pressure on a transfer sheet after transfer and peeling and further applying heat and pressure on a transfer sheet as in the prior art, the present invention is more than simply designed. It has become possible to obtain an inorganic decorative board with high emboss and embossed harmony. The pattern layer was also pressed to the concave portion of the base material, and an inorganic decorative plate having high design and harmonizing the emboss and the pattern was obtained.

[0021]

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a cross-sectional configuration of a transfer sheet used in the present invention.

FIG. 2 is a schematic diagram showing a state in which a transfer sheet is thermocompression-bonded by a roll.

FIG. 3 is a schematic diagram showing a state in which a pattern layer is thermocompression-bonded after a base film of a transfer sheet is peeled off by a roll-shaped elastic body.

FIG. 4 is a schematic diagram showing a state in which a pattern layer is thermocompression-bonded after a base film of a transfer sheet is peeled off by a flat elastic body.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base film 2 ... Release layer 3 ... Picture layer 4
... adhesive layer 5 ... roll-shaped elastic body 6 ... inorganic decorative board base material 7
… Picture layer 8… Flat elastic body

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-227699 (JP, A) JP-A-2-180670 (JP, A) JP-A-6-99550 (JP, A) JP-A 5- 139097 (JP, A) Japanese Patent Publication No. 55-2353 (JP, B1) Japanese Utility Model Publication No. 59-14216 (JP, Y2) (58) Field surveyed (Int. Cl. ⁷ , DB name) B44C 1/165-1 / 17

Claims (3)

(57) [Claims] 1. A transfer sheet is placed on the surface of an inorganic decorative board base material having an embossed shape on its surface, thermocompression-bonded so as to follow said embossed shape, and after peeling off a base film of the transfer sheet, the transfer sheet is further removed. By hot-pressing the pattern layer of the transfer sheet transferred onto the decorative board substrate so as to follow the embossed shape, the pattern layer floating on the embossed concave portion without being adhered when the base film is peeled off. A method for producing an inorganic decorative board, which is closely adhered to an inorganic decorative board substrate. 2. The method for producing an inorganic decorative plate according to claim 1, wherein the thermocompression bonding is performed by a roll-shaped elastic body. 3. The method for producing an inorganic decorative board according to claim 1, wherein the thermocompression bonding is performed via a flat elastic body.