JP3248136B1 - Probe method and probe device - Google Patents

Abstract

An object of the present invention is provided with an electrode for each chip to be inspected and a probe needle of a probe card without being affected by an error during movement of a stage or a positional shift of an electrode of each chip to be inspected. To provide a probe method and a probe device that can accurately perform positioning and probing. SOLUTION: Inspection is performed using a stage movement error correction value acquired and stored in advance for correcting a movement error when the inspection stage 2 is moved, and a pattern image of a plurality of selected chips to be inspected. Inspection chip position deviation correction value for correcting the position deviation of the pad of each inspection chip of inspection object 1 from the reference point obtained by scaling the coordinates of each inspection chip from the reference point on stage 2 Thus, the movement error of the inspection stage 2 and the displacement of each chip to be inspected are corrected. Thereby, at the time of probing, it becomes possible to accurately align and contact the pads of each chip to be inspected of the subject 1 with the probe needles 6 of the probe card 7.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to short-circuiting and opening of a pad pattern formed on a wafer, a glass substrate, a flexible substrate or the like, and a pad pattern of a semiconductor device such as an IC chip, and an input / output characteristic of the IC chip. The present invention relates to a probe method and a probe device for measurement.

[0002]

2. Description of the Related Art FIGS. 14 and 15 show an example of a conventional probe device. This probe device includes an inspection stage 2 on which an object 1 such as the wafer, glass substrate, flexible substrate, or the like is mounted. In the subject 1, a large number of test chips such as semiconductor devices including the pad patterns and IC chips are arranged at predetermined positions of the subject 1 such that, for example, a grid-like arrangement is provided. They are formed at predetermined intervals. In addition, array position data (XY coordinates on the inspection stage 2) indicating an array state of each chip to be inspected of the object 1 to be inspected is registered in advance in a memory (not shown) of the probe device.

[0003] The inspection stage 2 is
Table 3 for moving the object in the Z and θ directions and an XY table 4 for moving the Zθ table 3 in the X and Y directions allow the placed subject 1 to be moved in X, Y, Z,
It is configured to be able to move freely in the θ direction. The Zθ table 3 is configured by a combination of a vertically movable cylinder mechanism, a gear train, a stepping motor, and the like. The XY table 4 includes a ball screw 4a and a drive motor 4b which are orthogonal to each other in a plane as shown in the drawing, or a linear motor which is orthogonal to each other.

The moving position of the inspection stage 2 in each direction (at least the X, Y, and θ directions) is determined by the output pulse amount of the linear scale attached to each of the XY linear motors and the encoder pulse attached to the drive motor. Position data can be managed based on the output pulse amount, the input pulse amount input to the stepping motor, and the like. Further, the moving amount of the inspection stage 2 can be obtained at any time based on the position data.

On the other hand, a support plate 5 is provided above the inspection stage 2. Probing means for probing the chip to be inspected of the subject 1 is provided on the support plate 5. Pads (electrodes) of a chip to be inspected (for example, an IC chip) formed on the subject 1
The probe card 7 having the probe needles 6 arranged so as to correspond to the above arrangement is provided.

In the probe device having such a configuration,
First, the subject 1 is placed on the test stage 2. The subject 1 placed on the inspection stage 2
Is a probing position at which probing of the subject 1 is performed. Based on the array position data of each test chip of the subject 1 registered in the memory in advance, X and X are obtained by the Zθ table 3 and the XY table 4. It is driven in the Y and Z directions. As a result, the pads of each chip to be inspected of the object 1 placed on the inspection stage 2 are sequentially brought into contact with the probe needles 6 of the probe card 7, and the test head 9 passes through the contact ring 8 by the test head 9. Probing (measurement of electrical characteristics and the like) of each chip to be inspected is performed.

Here, in order to accurately probe each of the chips to be inspected of the subject 1, the pads of each of the chips to be inspected and the probe needles 6 of the probe card 7 come into accurate contact. In this case, it is necessary that the arrangement direction of the test chips of the subject 1 placed on the test stage 2 and the moving direction of the test stage 2 by the XY table 4 exactly match. .

Therefore, in this type of probe apparatus, for example, as shown in FIGS. 14 and 15, the support plate 5 is separated from the probing position by a predetermined distance (this position is referred to as an "alignment position"). The position of each of the chips to be inspected of the object 1 placed on the inspection stage 2 is adjusted by the CCD camera 10 as the imaging means provided.

That is, before probing each of the chips to be inspected of the object 1, first, as shown in FIG. 15, the object mounted on the inspection stage 2 at the alignment position by the CCD camera 10 as shown in FIG. A plurality (three in this case) of the chips to be inspected 12, 13, and 14 of the specimen 1 are imaged. Then, the XYθ position data of each of the chips 12, 13, and 14 to be inspected using the pattern images captured by the CCD camera 10, that is, the chips 12, 13, and
The inspection stage 2 is moved in the X, Y, and θ directions so that the arrangement direction of the inspection stage 14 matches the moving direction (X, Y direction) of the inspection stage 2 by the XY table 4, and the subject 1
Is adjusted.

After the position of the subject 1 has been adjusted in this manner, for example, another C provided at the probe position may be used.
Using a CD camera (not shown) or a microscope, a chip to be inspected first (hereinafter, this chip to be inspected is referred to as a “1st die 11”) at the probing position, and a probe of the probe card 7 Positioning with the needle 6 is performed.

Then, probing of the first die 11 of the subject 1 is performed, and based on the index corresponding to the chip size of the chip to be inspected, which is imaged and registered by the CCD camera 10 with reference to the first die 11. Then, the inspection stage 2 is sequentially moved so that the pads of the other chips to be inspected sequentially correspond to the probe needles 6 of the probe card 7, and the probing of the other chips to be inspected is performed. JP-A-7-297241).

[0012]

By the way, in the above-mentioned conventional probe apparatus, the pads of each chip to be inspected of the subject 1 and the probe needles 6 of the probe card 7 are more reliably and accurately aligned. In the calculation of the test stage 2 based on the XY position data from the reference coordinates of each test chip calculated based on the array position data of each test chip of the test subject 1 registered in the memory, It is necessary that the movement amount and the actual movement amount of the inspection stage 2 exactly match.

However, the XY table 4 of general accuracy for moving the inspection stage 2 has a slight error in the amount of movement. For example, the distance L between the alignment position and the probing position is about 200
In the case of the XY table of the probe device set to mm, it has been confirmed that an error of about ± 5 μm occurs in the amount of movement at room temperature.

Therefore, in the above-mentioned conventional probe device, when there is an error in the movement amount of the XY table 4,
As described above, the calculated amount of movement of the inspection stage 2 based on the XY position data of each chip to be inspected of the object 1 obtained using a CCD camera or a microscope, and the actual amount of movement of the inspection stage 2 May have different values. For this reason, in such a probe device, the pads of the chips to be inspected of the subject 1 and the probe needles 6 of the probe card 7 may be displaced, and accurate probing may not be performed.

If an XY table 4 of the probe device is used, which has a very small error and is highly accurate, the actual movement amount of the inspection stage 2 and the calculated XY position data of the inspection stage 2 are used. The movement amount can be made to coincide to some extent. However, when such a highly accurate XY table is used, the cost of the probe device is increased.

The actual amount of movement of the inspection stage 2 is delicately changed due to expansion and contraction of the XY table 4 due to a change in the temperature of the use environment and wear of the sliding portion of the XY table 4 over time. Would. For this reason, even when the high-precision XY table as described above is used, the actual movement amount of the inspection stage 2 and the movement amount of the inspection stage 2 based on the calculated XY position data can be determined without error. It is almost impossible to match.

By the way, as a method for solving the above-mentioned problem caused by the error of the movement amount of the XY table 4, the error of the movement amount of the inspection stage 2 is detected in advance.
A method of correcting the actual movement amount of the inspection stage 2 by the detected error is conceivable. However, even if the actual movement amount of the test stage 2 can be corrected by such a method, the pad of each test chip of the test object 1 and the probe needle 6 of the probe card 7 are not necessarily accurate. Is not always possible.

That is, in the probe device having the above-described configuration, the arrangement position of each test chip of the subject 1 based on the arrangement position data registered in advance in the memory is:
It is assumed that the chips to be inspected of the subject 1 are positioned and formed with extremely high precision so that the actual arrangement positions of the chips to be inspected of the subject 1 exactly match.

However, the actual arrangement position of each test chip of the subject 1 is slightly shifted from the arrangement position based on the arrangement position data of each test chip of the test object 1 registered in the memory in advance. May have been formed. As described above, when there is a variation in the formation positions of the respective test chips on the subject 1, as described above, even if the actual movement amount of the test stage 2 is accurately corrected, In some cases, it may not be possible to make accurate contact between the pads of the chip to be inspected whose formation positions are shifted and the probe needles 6 of the probe card 7.

One of the causes of such a variation in the formation positions of the pads of each chip to be inspected on the object 1 is that a device as each chip to be inspected is placed on a wafer or printed circuit board as the object 1. This is probably due to distortion or expansion or contraction of each chip to be inspected or distortion or expansion or contraction of the wafer or the printed circuit board itself during the process of forming. The degree of distortion or expansion and contraction of the subject 1 tends to increase as the diameter of the subject 1 increases.

In the case where the test object 1 is, for example, one in which a wafer is pasted on a film frame (dicing ring) and the wafer is diced and then probing is performed, the position of each chip to be inspected by dicing is determined. Error or displacement is likely to occur in each of the chips to be inspected due to movement of the chip or distortion due to the tension of the film to which the chip to be inspected is attached. For this reason, in such a subject 1, there is a high possibility that the attachment position of each test chip of the subject 1 does not match the sequence position data registered in advance. Therefore, also in this case, the pad of each chip to be inspected of the subject 1 and the probe needle 6 of the probe card 7 cannot be brought into accurate contact only by correcting the actual movement amount of the inspection stage 2. Sometimes.

Further, in order to obtain data on the electrical characteristics of each of the chips under test with respect to changes in the environmental temperature, for example, the environmental temperature of the subject 1 is changed from a low temperature to a high temperature, and the probing of each test chip is performed. Is performed, the position of the pad of each chip to be inspected may be shifted from the position at normal temperature due to expansion and contraction of the subject 1 due to a temperature change. Therefore, also in this case, the pad of each chip to be inspected of the subject 1 and the probe needle 6 of the probe card 7 cannot be brought into accurate contact only by correcting the actual movement amount of the inspection stage 2. Sometimes.

The present invention has been made in view of the above problems, and its object is to be influenced by an error in moving the stage and a positional shift of a pad of each chip to be inspected. It is an object of the present invention to provide a probe method and a probe apparatus which can accurately align a probe of a probe card with a probe needle of a probe card and perform probing without any problem.

[0024]

In order to achieve the above object, according to the first aspect of the present invention, an object on which a large number of chips to be inspected are arrayed is mounted on a stage movable at least in X and Y directions. The test chip is placed at an alignment position separated by a predetermined distance from the probing position for probing each of the test chips of the test object , and the arrangement direction of the test chips is raised.
Position of the subject so as to match the moving direction of the stage.
After settling, by moving the stage to the probing position from the alignment position, the probing portion of the probe card for probing the inspection chip analyte, a subject placed on the stage A reference point serving as a position reference is aligned, and while moving the stage at the probing position based on pre-registered position data of each chip to be inspected from the reference point, the probe is moved to the probing needle of the probe card. In the probe method of sequentially contacting pads of each of the chips to be inspected and probing each of the chips to be inspected of the subject , when the stage is controlled to move at the alignment position,
The stage movement error amount obtained by measuring the difference between the control movement amount of the stage and the actual movement amount , and the stage when the stage is controlled to move at the probing position.
Based on the difference between the control amount of movement and the actual movement amount of the the moving amount of error measured and acquired the stage, on the stage
Movement control at the alignment position and the probing position
When controlling, a stage movement error correction value for correcting the stage movement error is calculated and stored in advance,
At the probing position, the probing needle of the probe card is aligned with a reference point serving as a position reference of the subject placed on the stage, and the reference point of the reference point on the stage at the probing position is set. After obtaining the coordinates and obtaining the reference coordinates of the reference point, the stage is moved to the alignment position, and the plurality of chips to be inspected of the subject are imaged by the imaging means, and the plurality of chips to be inspected are imaged. Using the pattern image of (1), the coordinates of each chip to be inspected from the reference point on the stage are scaled, and the pre-registered position data of each chip to be inspected from the reference point; based on the difference between the coordinates of each of the test chip from the point, path of the object each inspection chip from the reference point in the probing position Calculating a positional deviation amount of de, the calculated Deyui
From the result, a test chip position shift correction value for correcting the position shift of each test chip from the reference point at the time of the probing is obtained, and at the time of the probing, the stage movement error correction value and the test chip The movement amount of the stage is corrected by a position shift correction value.

In this probe method, when the stage is controlled to move at the alignment position, the position of the stage is controlled.
The movement error amount of the stage obtained by measuring the difference between the control movement amount of the stage and the actual movement amount, and the movement amount of the stage when the stage is controlled at the probing position .
Based on the movement error amount of the stage obtained by measuring the difference between the control movement amount and the actual movement amount, the stage
Movement control at alignment position and above probing position
In this case, a stage movement error correction value for correcting a movement error during the movement of the stage is stored in advance.
Then, at the probing position, a reference point serving as a position reference of the subject placed on the stage is aligned with the probing needle of the probe card. Thereby, reference coordinates of the reference point on the stage at the probing position are obtained. Thereafter, the stage is moved to the alignment position, and the plurality of chips to be inspected of the subject are imaged by the imaging means. Then, using the captured pattern images of the plurality of chips to be inspected, the coordinates of each of the chips to be inspected from the reference point on the stage are scaled. Next, based on the difference between the position data of each chip to be inspected from the reference point registered in advance and the coordinates of each chip to be inspected from the reference point by the scaling, the reference point at the probing position is used. The amount of displacement of the pad of each chip to be inspected of the object is calculated. From the calculation result, a test chip position shift correction value for correcting a position shift of each test chip from the reference point during the probing is obtained. Then, during the probing, the stage movement error is corrected by the stage movement error correction value and the chip-to-be-inspected position shift correction value. Therefore, according to this probe method, even when the stage has a movement error, the stage can be very accurately moved to a specified position. Further, at the time of the probing, the movement amount of the stage is corrected by the inspection chip position shift correction value for correcting the position shift of each of the inspection chips. Therefore, according to this probe method, even if the formation positions of the respective test chips of the test object vary, the pads of the respective test chips of the test subject mounted on the stage are replaced with the pads of the probe card. The probe needle can be accurately positioned and contacted.

According to a second aspect of the present invention, in the probe method of the first aspect, when the image pickup means takes an image of the pattern of the plurality of chips to be inspected and scales the pattern, the plurality of chips to be inspected are scaled. A calculated value calculated in advance based on the chip size of the chip to be inspected,
Or, when there is a chip to be inspected indicating position data different from the predicted position data assumed from the position data of another chip to be inspected, a chip to be inspected indicating this different position data exists. A small area smaller than the area at the time of the immediately preceding imaging by the imaging means is imaged again by the imaging means, and the coordinates of a plurality of chips to be inspected in the small area are scaled again. .

In this probe method, the coordinates of the plurality of chips to be inspected are scaled using the pattern images of the plurality of chips to be inspected imaged by the imaging means. here,
Depending on the object to be inspected, there may be an inspected chip having a relatively large displacement among the plurality of scaled inspected chips. Such a chip having a large displacement is a calculated value calculated in advance based on the chip size of the chip to be inspected or the position of another chip to be inspected when the coordinates of the chip to be inspected are scaled. This shows position data different from the predicted position data assumed from the data. Therefore, if there is a chip to be inspected indicating a position data different from the calculated value or the predicted position data by the scaling, the coordinates of the chip to be inspected indicating the different position data are re-scaled ( Rescale). At the time of this rescaling, the area to be imaged by the imaging means is narrowed down to a small area including the chip to be inspected, which is smaller than the area at the time of the immediately preceding imaging by the imaging means. Then, the plurality of chips to be inspected in the small area are imaged again by the imaging means, and the coordinates of the plurality of chips to be inspected in the small area are rescaled. In this way, by rescaling the coordinates of the plurality of chips to be inspected in the small area, detailed and accurate position data of each of the chips to be inspected can be obtained. In other words, according to this probe method, even when the chip to be inspected of the subject is formed at a position so deviated that probing is impossible, each of the inspected chips in the small area including the displaced chip to be inspected is displaced. The variation state of the chip can be reacquired as detailed and accurate position data. As a result, the allowable range of the arrangement error of the chip to be inspected that can be probed is expanded, and the probing can be performed accurately and quickly. Here, as a result of rescaling the coordinates of the plurality of chips to be inspected in the small area, if there is still a chip to be inspected indicating different position data, it is desirable to repeat the above rescaling. Thereby, more detailed and accurate position data of each of the chips to be inspected can be obtained.

[0028]

[0029]

According to a third aspect of the present invention, in the probe method of the first aspect , the object mounted on the stage is provided with
Probing with probing using a probe card
Divide the area into multiple areas and place them on the stage
The inspected chip of the subject is divided into the plurality of areas by the plurality of areas.
Probing the probe, obtaining the correction value of the position error of the chip to be inspected for each area , and correcting the amount of movement of the stage during the probing.

In this probe method, the above-mentioned stay
Of the subject placed on the
The probing area to be inspected is divided into multiple areas in advance
Is done. As a result, each test chip of the test object is
When roving, place each test chip of the test object on top.
It can be divided into individual areas and probed individually.
I will be able to. Here, for example, the diameter of the subject is
Large, and the entirety of the subject
The displacement of the physical formation position of each chip to be inspected is large.
Even if it is in each of the above divided areas
If the displacement of each chip to be inspected in
Absent. Therefore, in this probe method,
Even if the overall position of the chip to be inspected is large,
The path of each chip under test placed on the stage
Each probe against the probe needle of the probe card.
Contact can be made by accurately positioning each area
Become so. Further, when each test chip of the test object in each area is probed, the test chip position shift correction value for correcting the position shift of each test chip obtained by the method of claim 1 is used for the stage. Is corrected. Therefore, according to this probe method,
Even if there is a variation in the formation position of each test chip in each of the divided areas of the test object, the pad of each test chip of the test object placed on the stage is moved with respect to the probe needle of the probe card. And can be brought into accurate alignment and contact.

According to a fourth aspect of the present invention, there is provided at least X, Y on which a test object formed by arranging a large number of test chips is mounted.
A stage that can move in the direction, and a stage that moves the stage from an alignment position for adjusting the position of the subject mounted on the stage to a probing position for probing the test chip of the subject. A moving means and a probe needle are sequentially contacted with pads of each of the chips to be inspected mounted on the stage, and are arranged at the probing position for probing each of the chips to be inspected of the object. A probe card, positioning means for positioning a probe needle of the probe card with a reference point serving as a position reference of a subject mounted on the stage, and a probe at the probing position. By the pre-registered position data of the inspection chip,
As to sequentially contact the pads of each of the test chip of the subject probing needle of the probe card, the probe device including a stage movement control unit for controlling the movement of the stage, above the alignment position
Control movement of the stage when the movement of the stage is controlled
And movement error of the stage obtained by measuring the difference between the actual moving amount as the amount, the stage above probing position
Control movement amount of the stage when movement control
The stage is calculated based on the amount of movement error of the stage obtained by measuring the difference from the amount of movement of the stage.
When controlling movement at the print position and the probing position
The stage movement error correction value for correcting the movement error of the stage, and storage means for storing in advance, at the probing position, the probe needles of the probe card,
Reference coordinate acquisition means for aligning a reference point serving as a position reference of a subject mounted on the stage and acquiring reference coordinates of the reference point on the stage at the probe bin position; and After obtaining the reference coordinates, the stage is moved to the alignment position, a plurality of chips to be inspected of the subject are imaged by the imaging means, and a pattern image of the plurality of chips to be inspected is taken using Scaling means for scaling the coordinates of each chip to be inspected from the reference point on the stage; pre-registered position data of each chip to be inspected from the reference point; based on the difference between the coordinates of the test chip, to calculate the positional shift amount of the pad of each of the test chip of the subject from the reference point in the probing position And the testing chip misalignment correction value acquisition means for acquiring inspection chip position deviation correction value for the calculated out from the results to correct the positional deviation of each of the test chip from the reference point in time of the probing, during the probing, A stage moving amount correcting means for correcting the moving amount of the stage based on the stage moving error correction value and the inspected chip position shift correcting value.

In this probe device, when the stage is controlled to move at the alignment position, the position of the stage is controlled.
The movement error amount of the stage obtained by measuring the difference between the control movement amount of the stage and the actual movement amount, and the movement amount of the stage when the stage is controlled at the probing position .
It was calculated on the basis of the movement amount of error difference the stage obtained by measuring the control amount of movement and the actual movement amount, the stay
At the alignment position and the probing position
A stage movement error correction value for correcting a movement error of the stage at the time of movement control is stored in the storage means in advance. Then, at the probing position, a reference point serving as a position reference of the subject mounted on the stage is aligned with the probe needle of the probe card. Then, the reference coordinate acquisition means acquires reference coordinates of the reference point on the stage at the probe bin position. After the reference coordinates of the reference point are obtained, the stage is moved to the alignment position. Then, the plurality of chips to be inspected of the subject are imaged by the imaging means. Using the captured pattern images of the plurality of chips to be inspected, the coordinates of each of the chips to be inspected from the reference point on the stage are scaled by the scaling means. Next, the inspected chip position shift correction value acquiring unit obtains the position of each inspected chip from the reference point in advance based on the pre-registered position data and the coordinates of each inspected chip from the reference point by the scaling. Then, the amount of displacement of the pad of each chip to be inspected of the subject from the reference point at the probing position is calculated. From the calculation result, a test chip position shift correction value for correcting a position shift of each test chip from the reference point during the probing is obtained. Then, at the time of the probing, a stage movement error correction value stored in advance by the stage movement amount correction means for correcting a movement error during the movement of the stage,
The movement amount of the stage is corrected by a chip displacement correction value for correcting the displacement of each chip to be inspected from the reference point. Therefore, in this probe device, the probe method of the subject can be probed by the above-described probe method.

According to a fifth aspect of the present invention, in the probe apparatus of the fourth aspect , a first operation program for operating the probe apparatus by the probe method of the first aspect, and
4. A second operation program for operating the probe device by the probe method of claim 3, a third operation program for operating the probe device by the probe method of claim 3, and the first, second, and third operation programs. And a program selecting means for selecting any one of the operation programs.

In this probe device, a first operation program for operating the probe device according to the probe method of claim 1 by the program selecting means,
Any one of a second operation program for operating the probe device by the probe method of claim 2 and a third operation program for operating the probe device by the probe method of claim 3 is selected. You. This makes it possible to probe the subject with the most suitable probe method.

[0036]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to a short circuit or an open circuit of a pad pattern formed on a test object such as a wafer, a glass substrate, a flexible substrate, or a pad pattern of a semiconductor device as a chip to be inspected such as an IC chip. And an embodiment applied to a probe device for measuring input / output characteristics of an IC chip and the like.

FIG. 1 shows a schematic front view of the probe device. The probe apparatus 100 includes a cassette mounting section 10 on which a subject cassette containing the subject 1 is mounted.
1. Take out the subject 1 from the subject cassette, and
Setting section 1 for setting the sample on the examination stage 2
02, an alignment unit 103 for adjusting the position of the subject 1 set on the inspection stage 2, an alignment unit 1
The probing unit 104 for probing each test chip of the subject 1 whose position has been adjusted at 03 with the probe needle 6 of the probe card 7 and the operation of each drive mechanism of the probe device 100 are controlled based on the acquired data, (Personal Computer), MCU (Motion Control Unit), PSM (Power Supply Module), LM
It comprises a storage unit 105 for storing data processing equipment such as D (linear motor driver).

When the position of the subject 1 set on the inspection stage 2 is adjusted at the alignment position, the alignment section 103 controls the first position of the subject 1.
Die 11 and other plurality of chips to be inspected 12, 13, 14
CCD camera 10 as imaging means for imaging
Of the imaging optical system 106 is provided.

When adjusting the position of the subject 1 set on the test stage 2 at the probing position, the probing unit 104 includes the first die 11 of the subject 1 and a plurality of other components. Inspection chip 12, 1
A microscope 107 as a position detecting means for detecting an accurate position such as 3, 14 is provided.

Further, a monitor 108 for displaying a pattern image picked up by the CCD camera 10 is provided in an upper part on the back side of the subject setting section 102. A stage controller 110 provided with a stage control stick 109 for controlling the movement position of the inspection stage 2 is mounted on the upper surface on the front side of the storage section 105.

FIG. 2 shows a schematic configuration of the cassette mounting section 101, the subject setting section 102, the alignment section 103, and the probing section 104. The cassette mounting section 101 is provided with a Z table 112 for mounting the subject cassette 111 thereon. Z table 11
Numeral 2 is configured to move up and down in the Z direction by a drive mechanism (not shown) and stop at a predetermined position specified in advance. The subject cassette 111 has a large number of subject storage shelves 111 a for storing a predetermined number of subjects 1.
Are formed.

The subject setting section 102 is provided with a chuck 113 for grasping and taking out the subject 1 stored in the selected subject storage shelf 111a of the subject cassette 111. The chuck 113 is provided at a predetermined position on the chuck support 114. The chuck support 114 is supported by a plurality of stays 115 arranged along the subject removal path, and is configured to reciprocate along the subject removal path by a drive mechanism (not shown). ing.

In addition, below the subject taking-out path of the chuck 113 of the subject setting section 102, the subject 1 taken out from the selected subject accommodating shelf 111 a of the subject cassette 111 by the chuck 113 is placed. Guide 116 formed with a holding portion 116a for holding the
Are arranged. The holding guide 116 is supported by the stay 115, similarly to the chuck support 114, and is reciprocated between the subject setting unit 102 and the alignment unit 103 by a drive mechanism (not shown). It is configured.

Further, the holding portion 1 of the holding guide 116
A pre-alignment stage 122 is provided directly below 16a. This pre-alignment stage 122
Is configured to move in the Z and θ directions by a Zθ table (not shown).

On the other hand, the inspection stage 2 has a Zθ table 3 for moving the inspection stage 2 in the Z and θ directions.
And the XY table 4 for moving the Zθ table 3 in the X and Y directions.
It is configured to be able to move freely in the Y, Z, and θ directions. Table 3 is configured by a combination of a vertically movable cylinder mechanism, a gear train, a stepping motor, and the like.

The XY table 4 according to this embodiment is the same as that shown in FIG.
As shown in FIG. 3, the test object 1 is composed of an X table 4x and a Y table 4y composed of planar linear motors orthogonal to each other in a plane.
The apparatus is configured to reciprocate between the alignment position and the probing position. The X table 4x and the Y table 4y have linear scales 4a,
4b is provided. These linear scales 4a,
4b is configured such that the movement position of the inspection stage 2 in the XY directions can be stored as XY position data in the scale data memory 117 shown in FIG.

Next, an outline of a general probing operation of the probe device 100 configured as described above will be described. In the initial setting state of the probe device 100,
The inspection stage 2 is waiting at the alignment position described above. Then, as shown in FIGS. 2 and 3, the subject cassette 111 is placed on the Z table 112 such that the opening surface of the subject storage shelf 111 a faces the subject setting section 102. You.

In the subject storage shelf 111a of the subject cassette 111, for example, a subject formed of a wafer having a large number of test chips formed in a predetermined arrangement as shown in FIG. FIG. 4 (c) shows a test object having a configuration in which a large number of pre-diced test chips as shown in b) are attached and arranged on a test object plate having a diameter corresponding to the size of the test stage 2. An object on which a device as each chip to be inspected is arranged is accommodated in such a printed circuit board or the like.

When the probing operation is started in this state, first, the Z table 112
It is moved up and down by a CU (motion control unit) and stopped when it reaches a predetermined position. As a result, the subject storage shelf 111a at the position where the selected subject 1 in the subject cassette 111 is stored.
Opposes the subject extraction path of the chuck 113.

Thereafter, as the chuck 113 is reciprocated, the subject 1 stored in the selected subject storage shelf 111a of the subject cassette 111 is gripped by the chuck 113, and the subject cassette 111
Taken out of The subject 1 removed from the subject cassette 111 is held by the holding section 116 of the holding guide 116.
a.

In this manner, the subject cassette 11
When the subject 1 taken out of the stage 1 is held by the holding portion 116a of the holding guide 116, the pre-alignment stage 122 is moved up in the Z direction. Thus, the subject 1 held by the holding portion 116a of the holding guide 116 is slightly lifted by the upper surface of the pre-alignment stage 122, and the subject 1 is
From the holding section 116a to the pre-alignment stage 122
Moved up.

The subject 1 is provided with an orientation flat 1a (see FIG. 4) and a notch (not shown) indicating the orientation of the subject 1 on the pre-alignment stage 122. The test object 1 is usually positioned in the direction of the orientation flat 1a and the position of the notch, so that the XY of each test chip formed on the test object 1 is determined.
It is formed so that rough position adjustment in the direction can be performed.

However, the subject cassette 111
Is often not accommodated in a predetermined orientation due to the carrying of the subject cassette 111 or the like. For this reason, the holding portion 11 of the holding guide 116
For example, as shown in FIG. 5A, the direction of the orientation flat 1 a of the subject 1 that has been moved from the stage 6 a onto the inspection stage 2 may not match the direction of movement of the XY stage 4. Many.

Therefore, in the probe apparatus 100, the pre-alignment of the subject 1 held by the holding portion 116a of the holding guide 116 is lifted by the upper surface of the pre-alignment stage 122. Is configured to do so. That is, when the subject 1 is moved to the upper surface of the pre-alignment stage 122, the inspection stage 2 is rotated in the θ direction and placed on the inspection stage 2 as shown in FIG. Prealignment of the subject 1 is performed.

This pre-alignment is performed, for example, in FIG.
As shown in (b), the orientation of the orientation flat 1a of the subject 1 coincides with the detection optical path of the photosensor S formed along the Y direction of the peripheral portion of the subject 1, and The determination is performed based on whether a predetermined detection signal is output from the sensor S.

When the pre-alignment of the subject 1 is completed, the pre-alignment stage 1
22 is lowered, and the pre-aligned subject 1 is held again by the holding portion 116a of the holding guide 116. Next, the holding guide 116 holding the subject 1
Is moved toward the alignment unit 103. When the subject 1 held by the holding portion 116a of the holding guide 116 reaches just above the inspection stage 2 waiting at the alignment position, the holding guide 116
Is temporarily stopped.

Then, while the movement of the holding guide 116 is temporarily stopped, the Zθ table 3 is driven, and the inspection stage 2 is raised to a position shown by a two-dot line in FIG. Thereby, the holding portion 1 of the holding guide 116
The subject 1 held by the test guide 16a is lifted by the upper surface of the inspection stage 2, and the subject 1
It is moved onto the inspection stage 2 from the 16 holding units 116a. In this state, the subject 1 is securely sucked and held on the upper surface of the inspection stage 2 by a vacuum chuck (not shown). When the subject 1 is set on the examination stage 2 in this manner, the holding guide 116
Is moved toward the subject setting section 102 at the home position.

Next, the inspection stage 2 is moved to the alignment position. Then, Zθ table 3 and XY
The table 4 is driven, and the position of the subject 1 placed on the inspection stage 2 is adjusted. This subject 1
In the alignment (alignment) of FIG.
In the vicinity of the position 12 shown in (a), the pattern in the chip to be inspected is transferred to the CC through the imaging optical system 106.
An image is taken by the D camera 10.

When two chips 13 and 14 indicated by solid lines in FIG. 6A are selected in addition to the chip 12 to be inspected, the chips 12, 13 and
14 is selected from within an inspection area of about 80% of the diameter of the subject 1 placed on the inspection stage 2, and alignment is automatically performed. In addition, the inspection target chip 1
In the case where four chips 13 ', 13 ", 14', and 14" indicated by broken lines in FIG. 6A are selected in addition to the chip 2, the chips 12, 13 ', and 13 "to be inspected are selected. , 14 ', 14 "
Is selected from the inspection area of about 50% of the diameter of the subject 1 placed on the inspection stage 2, and the alignment is automatically performed.

First, of the chips to be inspected picked up by the CCD camera 10, for example, an image of a characteristic pattern in the chip 12 to be inspected at the center of the object 1 is converted into a video through the image recognition device 118. Register in the memory 119. Then, it is automatically checked whether or not the image has a problem as an alignment pattern. Next, the tilt of each of the chips 13 and 14 in the XY directions is corrected by the same pattern of the other chips 13 and 14 to perform precise alignment (fine alignment) of the subject 1 (FIG. 6). (B)).

The fine alignment of the subject 1 is as follows:
By manually operating the stage control stick 109 to adjust and move the inspection stage 2 in the X, Y, and θ directions so that each image faces a predetermined position registered in advance while monitoring with the monitor 108. The stage controller 110 moves the inspection stage 2 to X, Y, or X based on alignment or position data of each inspection chip from a pre-registered reference point of the inspection object 1 (described in detail later). Any of automatic alignment for adjusting and moving in the θ direction may be used.

In this manner, the inspection stage 2 is moved in the X, Y, and θ directions at the above-described alignment position to adjust the position of the subject 1 placed on the inspection stage 2, and then the alignment is performed. The inspection stage 2 is moved from the position to the probing position. Then, the subject 1 placed on the inspection stage 2 moved to the probing position
The microscope 107 performs alignment between the reference point and the probe card 7 so that the reference point serving as the position reference reaches the correct position during probing.

Here, the reference point is usually a reference mark formed at an appropriate position on the subject 1 or the reference mark on the subject 1.
A chip to be inspected, which serves as a position reference among the chips to be inspected formed in the above, can be used as appropriate. In the probe device 100 according to the present embodiment, for convenience of explanation,
As shown in FIG. 7, the first die 11 to be probed first among the chips to be inspected formed on the subject 1 is set as the reference point.

That is, after the fine alignment, the position of the pad of the first die 11 and the position of the probe needle 6 of the probe card 7 are adjusted by the microscope 107 at the probing position. Then, the coordinates (reference coordinates) of the first die 11 on the inspection stage 2 at the probing position are measured by the linear scales 4a and 4b, and registered in the scale data memory 117 as XY position data.

Thereafter, according to the conventional probe method, the Zθ is calculated by the arithmetic processing unit 120 of the PC via the stage controller 110 based on the XY position data of each chip to be inspected in the scale data memory 117. The table 3 and the XY table 4 are driven. Then, the probe needles 6 of the probe card 7 arranged at the probing position and the pads of the chips to be inspected of the object 1 placed on the inspection stage 2 are sequentially brought into contact with each other. Probing of the test chip is performed.

As described above, in the probe device 100, the inspection stage 2 is controlled by the position data of each chip to be inspected based on the index corresponding to the registered chip size with reference to the XY position data of the first die 11. By moving the probe, the pads of the respective test chips of the subject 1 and the probe needles 6 of the probe card 7 are moved.
Can be adjusted.

However, a general precision XY table 4
As described above, the amount of movement includes some error. For this reason, for example, when probing of an 8-inch wafer is performed with the position of the first die 11 as a base point, for example, the XY table 4 having a movement accuracy of ± 5 μm.
In the inspection stage 2 using the, the positions of the pad of the chip to be inspected and the probe needle 6 of the probe card 7 are
An error of about 5 μm will occur.

In addition, the above-mentioned error is added to the above-described alignment accuracy, a composite error such as a temperature expansion coefficient of the subject 1, and the like. Therefore, in the test stage 2 using the XY table 4 having an error in the amount of movement as described above, the pads of each test chip of the test subject 1 and the probe needles 6 of the probe card 7 are accurately aligned. It becomes difficult to do.

Therefore, the probe device 1 according to the present embodiment
In 00, in order to reflect the scaling result using the pattern in the chip to be inspected at the alignment position to the probing position, the movement error amount of the XY table 4 is acquired in advance, and only the acquired error is calculated. The actual movement amount of the inspection stage 2 can be corrected.

First, a method of obtaining the movement error amount of the XY table 4 will be described. When detecting the movement error amount of the XY table 4, as shown in FIG. 8, a very accurate interval (for example, 5 mm interval) is placed on a glass plate having a size corresponding to the probing range of the subject 1. so,
The scale substrate 200 on which a number of orthogonal reference lines 201 are formed is accurately aligned and set on the table 2 at the alignment position (see FIG. 9). For example, the cross point 200a at the upper left end of the reference line 201 of the scale substrate 200 in FIG. 8 is located at the position of the chip to be inspected (1st die) to be probed first of the subject 1. Scale substrate 200 on table 2 at the alignment position
Is set correctly.

In this state, all the cross points (each cross point indicated by a circle in FIG. 8) of each reference line 201 of the scale substrate 200 mounted on the inspection stage 2 are aligned with the alignment position. The above CCD camera 10
To capture an image. Then, a point image of each cross point of the scale substrate 200 captured by the CCD camera 10 is recognized by the image recognition device 118.
The scale substrate 20 at the alignment position
0 The XY position data of each cross point is obtained by the linear scales 4a and 4b.

Next, the scale substrate 200 placed on the inspection stage 2 is moved from the alignment position to the probing position. At this probing position, the other CCs located at the probing position
Each cross point of the scale substrate 200 placed on the inspection stage 2 at the probing position is imaged by a D camera (not shown). Then, a point image of each cross point of the scale substrate 200 at the probing position is recognized by the image recognition device 118. Then, the XY position data of each cross point of the scale substrate 200 at the probing position is obtained by the linear scales 4a and 4b.

The XY position data of each cross point of the scale substrate 200 at the alignment position and the XY position data of each cross point of the scale substrate 200 at the probing position are stored and stored in the XY position data memory 121 shown in FIG. Keep it. Note that this X
The XY position data of each cross point of the scale substrate 200 at the alignment position and the XY position data of each cross point of the scale substrate 200 at the probing position stored in the Y position data memory 121 are unique to the probe device 100 used. Data.

Next, the XY position data of each cross point of the scale substrate 200 at the alignment position and the scale substrate 200 at the probing position
Based on the XY position data of each cross point, the displacement amount of each cross point of the scale substrate 200 when the inspection stage 2 moves from the alignment position to the probing position is calculated, and the movement of the inspection stage 2 Get the error amount. When moving the inspection stage 2 from the alignment position to the probing position, the movement error amount (deviation amount) of the inspection stage 2 is determined based on the movement error amount of the inspection stage 2 acquired as described above. Is corrected.

As described above, the movement error amount of the XY table 4 is acquired, and when the inspection stage 2 moves from the alignment position to the probing position, the inspection stage 2 is moved based on the acquired movement error amount. By correcting the movement error, the inspection stage 2 can be very accurately moved to a predetermined position.

Here, an example has been shown in which the scale substrate 200 is used by using the movement error amount of the XY table 4 as a method. For example, a reflecting mirror is set on the inspection table 2 and the reflecting mirror is set. A laser length measuring device that converts the amount of change in the reflection position of the laser light applied to the inspection table into the amount of movement of the inspection table 2 and measures the length may be used.

However, even if the actual movement amount of the test stage 2 can be corrected by the above-described correction method, the pad of each test chip of the test object 1 and the probe needle 6 of the probe card 7 can be corrected. May not always be accurately aligned.

That is, in the above-described correction method, as described above, the pads of each of the chips to be inspected of the subject 1 are formed with extremely high precision so as to be arranged in a predetermined manner. Is assumed. However, the actual pad of each test chip of the test object 1 is formed at a position slightly deviated from the design position of each test chip as shown in FIG. Sometimes. As described above, when there is a variation in the formation positions of the pads of each of the chips to be inspected of the object 1, even if the actual movement amount of the inspection stage 2 is accurately corrected, the positional displacement of the object 1 The pad of the chip to be inspected and the probe needle 6 of the probe card 7 cannot be accurately positioned.

Therefore, the probe device 1 according to the present embodiment
In 00, for example, the shift amount of each chip to be inspected of the subject 1 is acquired by a process as shown in FIG.
The moving amount of the test stage 2 at the time of probing is corrected based on the obtained shift amount of each test chip of the test subject 1.

That is, for example, as shown in FIG.
The inspection stage 2 facing the alignment position
The subject 1 pre-aligned as described above is set above. Then, as shown in FIG. 6, for example, an alignment pattern is registered at the position of the chip 11 to be inspected at the center of the object 1, and the position of each of the chips 12, 13 and 14 to be inspected is registered. The alignment of the sample 1 is performed.

Next, the XY table 4 is driven to
The subject 1 set on the test stage 2 is moved to the probing position. Then, at this probing position, the pad of the first die 11 and the probe needle 6 of the probe card 7 are aligned.

The method of positioning the first die 11 and the probe needle 6 is as follows: (1) The probe needle 6 serving as a reference
The pads of the first die 11 corresponding to the reference probe needle 6 are visually observed by the microscope 107 (see FIG. 7) arranged so that the optical axis coincides with the pad of each chip to be inspected. A method for performing positioning with the probe needle 6. (2) A second CCD camera is attached to the inspection stage 2, the probe needle 6 is viewed by the second CCD camera, and a pad of each inspection chip of the subject 1 at the probing position and the probe card 7. A method for automatically aligning the probe needle 6 with the probe needle 6.
and so on.

The above-described positioning operation of the first die 11 and the probe needle 6 of the probe card 7 is performed only for the first one subject 1 stored in the subject cassette 111. This is not performed for the second and subsequent subjects.

After the above positioning operation is completed, the above X
The Y table 4 is driven to move the subject 1 set on the inspection stage 2 to the alignment position.
Then, at this alignment position, the inspection stage 2 is moved while correcting the movement error of the inspection stage 2, and a plurality of chips to be inspected on the object 1 (here, hatched lines in FIG. 9 chips to be tested)
Is imaged by the CCD camera 10. The selected chips to be inspected are hereinafter referred to as “selected chips”.
The number of the selected chips is set to an appropriate number according to the type and size of the subject 1.

Next, using the image of the pattern of each selected chip captured by the CCD camera 10, the coordinates of each selected chip from the first die 11 on the inspection stage 2 are scaled, and The XY position data (scaling value) of each selected chip on the subject 1 is acquired.

The position data based on the index according to the chip size of the chip to be inspected from the first die 11 and the first die 11
From the first die 11 at the probing position based on the coordinates of each selected chip from
Is calculated by the arithmetic processing unit 120 using a well-known complementing method.
Then, based on the calculation result, an inspected chip positional deviation correction value for correcting the positional deviation of each inspected chip from the first die 11 during the probing is acquired.

Next, a stage movement error correction value, which is obtained by using the glass substrate 200 and is stored in advance in the scale data memory 117 for correcting a movement error when the inspection stage 2 is moved, and With the above-mentioned chip displacement correction value for correcting the displacement of each chip to be inspected from the first die 11, a combined correction value for correcting the movement error of the inspection stage 2 is calculated by the arithmetic processing unit 120. calculate.

Then, the inspection stage 2 is corrected while correcting the amount of movement of the inspection stage 2 by the combined correction value of the amount of movement of the inspection stage 2 calculated by the arithmetic processing unit 120.
To perform probing. As a result, FIG.
As shown in FIG. 0, even if there is variation in the formation positions of the respective chips to be inspected on the subject 1, the moving amount of the inspection stage 2 is corrected at the probing position to determine the positions of the respective chips to be inspected. By correcting the variation, the pads of each of the test chips of the test subject 1 placed on the test stage 2 can be accurately positioned and contacted with the probe needles 6 of the probe card 7. Become like

By the way, in the method shown in FIG.
When the coordinates of the selected chip are scaled using the image of the pattern of the selected chip, the calculated value is calculated in advance based on the chip size of the selected chip, or In some cases, there is a selected chip that shows position data different from predicted position data assumed from the position data of the chip to be inspected.
There is a high possibility that the selection chip indicating such different position data is formed at a position outside the predetermined formation position of the subject 1.

Therefore, if there is a selected chip indicating position data different from the calculated value or the predicted position data due to the scaling, the coordinates of the selected chip indicating the different position data are rescaled. (Rescaling). Here, when performing the re-scaling, the area to be imaged by the CCD camera 10 includes a selection chip indicating the above-described different position data, for example, an area surrounded by a dashed line in FIG. Then, the area is narrowed down to an area A smaller than the area at the time of imaging immediately before the CCD camera 10. And this area A
Then, the plurality of selected chips are imaged again by the CCD camera 10, and the coordinates of each selected chip in the area are rescaled.

As described above, the coordinates of the selected chip indicating different position data are narrowed down to the area A and rescaled, whereby the variation state of each chip to be inspected in the area A can be determined in a detailed and accurate position. It will be possible to re-acquire as data. FIG. 12 shows an example of a process according to this probing method.

Here, as a result of re-scaling the coordinates of each selected chip in the area A, if there is still a selected chip indicating different position data, it is desirable to repeat the above-described re-scaling. Thereby, more detailed and accurate position data of each chip to be inspected of the subject 1 can be obtained.

Next, another probe method of the probe device 100 will be described. In this probe method, for example, as shown by broken lines in FIGS. 15 (a), (b) and (c), a probing area for testing the subject 1 placed on the test stage 2 with the probe card 7 Is divided into a plurality of areas in advance. Then, for example, when the position of the subject 1 placed on the inspection stage 2 is adjusted at the alignment position by the probe method as shown in FIG. An image of each 1st die 11 serving as a position reference of the area is taken.

Next, the inspection stage 2 is moved in the X, Y, and θ directions based on the XYθ position data of each first die 11 in each area imaged by the CCD camera 10,
The position of the subject 1 on the test stage 2 is adjusted for each area of the subject 1 placed on the test stage 2. Thereby, when measuring the electrical characteristics of the chip under test of the subject 1, the chip under test of the subject 1 can be divided for each of the areas and individually measured.
Here, for example, even when the diameter of the subject 1 is large and the positional deviation of the entire formation position of the test chip is large due to distortion or expansion and contraction of the subject 1, each divided area The displacement of the chip to be inspected in the inside does not become so large.

Therefore, in this probe method, even when the overall displacement of the chip to be inspected of the object 1 is large, the pad of each chip to be inspected of the object 1 placed on the inspection stage 2 can be used. In addition, the probe needle 6 of the probe card 7 can be accurately positioned and contacted.

As shown in FIG. 13D, for example, CSP (chip size packaging), BGA
In the case of the subject 1 on which a plurality of devices 15, 16 and 17 composed of (ball grid assembly) and the like are arranged, a probing area to be inspected by the probe card 7 is divided for each of the plurality of devices. This enables accurate positioning of each of the devices 15, 16, and 17, and enables probing of a flip chip or the like.

On the other hand, the probe device 10 according to the present embodiment
0, a first operation program for executing probing by the probe method shown in FIG. 11 and a second operation program for executing probing by the probe method shown in FIG.
, And any one of the third operation programs for performing probing by the probe method shown in FIG. 13 may be selected. Thereby, the probing of the subject 1 can be performed by the most suitable probe method.

[0098]

According to the first and second aspects of the present invention, even when the positions of the respective chips to be inspected are varied, the pads of the respective chips to be inspected mounted on the XYθ stage are provided. Has an excellent effect that the probe can be accurately positioned and probed with respect to the probe needle of the probe card.

In particular, according to the invention of claim 2, according to claim 1
A detailed and accurate XY
There is an excellent effect that it can be obtained as position data.

According to the third aspect of the present invention, when probing a chip to be inspected, the chip to be inspected can be divided and measured separately for each area. Even when the displacement of the chip to be inspected is large, the probe of the chip to be inspected placed on the stage and the probe needle of the probe card can be accurately aligned and probed. And
Formation of each chip to be inspected in each divided area of the subject
Even if the position varies,
The pads of each chip to be inspected of the inspected
Accurate alignment and contact with card probe needle
There is an excellent effect of being able to make it .

According to the invention of claim 4 , there is an excellent effect that the probe method of claim 1 can probe a chip to be inspected of a subject.

According to a fifth aspect of the present invention, there is provided a first operation program for operating a probe device by the probe method of the first aspect, a second operation program for operating the probe device by the probe method of the second aspect, Since any one of the third operation program for operating the probe device can be selected by the probe method of the third aspect, the subject can be probed by the most suitable probe method. There is an excellent effect.

[Brief description of the drawings]

FIG. 1 is a schematic front view of a probe device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of a cassette mounting section, a subject setting section, an alignment section, and a probing section of the probe device.

FIG. 3 is a schematic configuration diagram of the probe device for describing an outline of a general probing operation.

FIGS. 4A, 4B, and 4C are schematic plan views of a subject to be probed by the probe device.

FIGS. 5A and 5B are schematic plan views illustrating an example of pre-alignment of the subject.

FIGS. 6A and 6B are schematic plan views for explaining an example of position adjustment at the alignment position of the subject.

FIG. 7 is a schematic plan view for explaining a method of acquiring the XY position data of the reference chip of the subject.

FIG. 8 is a schematic plan view showing a scale substrate used for a method of detecting a movement error amount of the XY table of the probe device and correcting the movement error amount of the stage.

FIG. 9 is a process diagram showing a method of detecting the amount of movement error of the XY table and correcting the amount of movement error of the stage.

FIG. 10 is a schematic plan view showing a state where there is variation in the formation positions of the pads of each of the chips to be inspected of the subject.

FIG. 11 shows a probe method for acquiring a displacement amount of each chip to be inspected of the subject and correcting a moving amount of the stage at the time of probing based on the acquired displacement amount of each chip to be inspected. Process chart.

FIG. 12 is a process diagram showing a probe method in the case where the scaled XY position data of the chip to be inspected is out of the range that can be probed when the pattern image of the chip to be inspected is scaled.

FIGS. 13 (a), (b), (c) and (d) are views for explaining a method of dividing a probing area to be inspected by the probe card into a plurality of areas in advance and performing probing. The schematic plan view of a sample.

FIG. 14 is a schematic front view showing a configuration of a conventional probe device.

FIG. 15 is a schematic plan view for explaining an outline of a method of adjusting a position of a subject in the conventional probe device.

[Explanation of symbols]

 Reference Signs List 1 subject 2 stage 3 Zθ table 4 XY table 4a, 4b linear scale 6 probe needle 7 probe card 10 CCD camera 11 1st die 12, 13, 14 chip under test 15, 16, 17 device 100 probe device 101 cassette mounting unit 102 Subject setting unit 103 Alignment unit 104 Probing unit 105 Storage unit 106 Imaging optical system 107 Microscope 108 Monitor 109 Stage control stick 110 Stage controller 111 Subject cassette 112 Z table 113 Chuck 114 Chuck support 115 Stay 116 Holding guide 117 Scale data Memory 118 Image recognition device 119 Video memory 120 Processing unit 121 XY position data memory 122 Pre-alignment Cement stage 200 scale substrate A re-scaling to area

Claims (5)

(57) [Claims] An object on which a number of chips to be inspected are arrayed is mounted on a stage movable at least in X and Y directions, and a probing position for probing each of the chips to be inspected of the object is set. At an alignment position separated by a predetermined distance, the arrangement direction of the chip
After positional adjustment of the analyte to match the moving direction of, by moving the stage to the probing position from the alignment position, probing portion of the probe card for probing the inspection chip analyte To
While aligning the reference point serving as the position reference of the subject mounted on the stage, while moving the stage at the probing position by the previously registered position data of each test chip from the reference point, In a probe method of probing each of the chips to be inspected of the subject by sequentially contacting the pads of each of the chips to be inspected with the probing needle of the probe card, the movement of the stage is controlled at the alignment position.
The movement error amount of the stage obtained by measuring the difference between the control movement amount of the stage and the actual movement amount, and the movement amount of the stage when the movement of the stage is controlled at the probing position.
On the basis of the movement error amount of the stage obtained difference measured by the control amount of movement and the actual movement amount of the stage, the stearate
The alignment position and the probing position
A stage movement error correction value for correcting a movement error of the stage at the time of movement control is calculated and stored in advance, and the probe card is mounted on the probing needle of the probe card at the probing position. After aligning a reference point serving as a position reference of the placed subject, acquiring reference coordinates of the reference point on the stage at the probing position, and acquiring reference coordinates of the reference point, the stage Is moved to the alignment position, the plurality of chips to be inspected of the subject are imaged by the imaging means, and the pattern images of the plurality of chips to be inspected are used to capture each chip from the reference point on the stage. The coordinates of the chip under test are scaled, and the pre-registered position data of each chip under test from the reference point, Based on the difference between the coordinates of the test chip, the calculated amount of positional displacement pads each of the test chip of the subject from the reference point in probing position, the reference point in time of the probing results out the calculated A chip displacement correction value for correcting a displacement of each chip to be inspected from the target chip, and a stage movement error correction value and a chip displacement correction value for the chip to be inspected at the time of probing. A probe method comprising correcting a moving amount of a probe. 2. The probe method according to claim 1, wherein when the coordinates of the plurality of chips to be inspected are scaled using a pattern image of the plurality of chips to be inspected imaged by the imaging means, the plurality of scaled chips are scaled. Of the chips to be inspected, calculated values calculated in advance based on the chip size of the chip to be inspected, or chips to be inspected showing position data different from predicted position data assumed from position data of other chips to be inspected, If there is, a small area smaller than the area at the time of the previous imaging by the imaging unit where the chip to be inspected indicating the different position data is present is imaged again by the imaging unit, and A probe method characterized by re-scaling coordinates of a plurality of chips to be inspected in a small area. 3. The probe method according to claim 1, wherein the probe car of the subject mounted on the stage is provided.
Multiple probing areas for probing
Of the subject placed on the stage
Probes of the chip to be inspected of the subject for each of the plurality of areas
And obtains the correction value of the position error of the chip to be inspected for each area.
To compensate for the movement of the stage during probing.
A probe method characterized by correcting. 4. A plurality of chips to be inspected are arranged and formed.
A switch on which the subject is mounted is movable in at least the X and Y directions.
For adjusting the position of the stage and the subject placed on the stage.
From the alignment position, the professional
To the probing position where the
Stage moving means for moving the test object, and each test chip of the test object placed on the stage
The probe needle is sequentially contacted with the pad to
The above probing position for probing the test chip
A probe card disposed, the probe needles of the probe card, on the stage
Align the reference point which is the position reference of the placed subject
Positioning means, and each probe to be inspected from the reference point at the probing position.
The above-mentioned probe is
Each probe to be inspected of the above-mentioned specimen is placed on the probing needle of the card.
Move the stage so that the pads in
Device having stage movement control means for controlling
And the stage is controlled to move at the alignment position.
The difference between the control movement amount of the stage and the actual movement amount
The movement error amount of the stage obtained by measurement and
The movement of the stage at the
Measure the difference between the control movement amount of the stage and the actual movement amount
Calculated based on the acquired movement error amount of the stage.
In addition, the stage is moved to the alignment position and the probe.
Movement error of the stage when movement control is performed at the bing position
The stage movement error correction value for correcting
Storage means for storing the probe card at the probing position.
Position reference of the object placed on the stage
The reference point to be
A base for obtaining reference coordinates of the reference point on the stage;
After acquiring the reference coordinates of the reference point and the reference coordinates obtaining means,
To the inspection position, and
The imaging device is imaged by the imaging means, and the plurality of
Using the chip pattern image, place it on the stage
Scale the coordinates of each chip to be inspected from the above reference points.
Scaling means to be programmed, and a previously registered position of each chip to be inspected from the reference point.
The data and each object from the reference point by the above scaling
Based on the difference between the coordinates of the test chip, the pro Bingu
Each test chip of the subject from the reference point at the position.
The pad displacement of the pad is calculated, and from the calculation result,
Each chip to be inspected from the above reference point during probing
Inspection chip position deviation compensation for correcting the position deviation of the chip
Inspection chip position shift correction value acquisition means for acquiring a positive value
And the stage movement error correction value during the probing.
And the above-mentioned chip displacement correction value for inspection,
Stage moving amount correcting means for correcting the moving amount of the stage.
A probe device, comprising: 5. The probe device according to claim 4, wherein the probe device is operated by the probe method according to claim 1.
A first operation program to be executed, and the probe method according to claim 2.
Operating procedure for operating the probe device by the
And the probe according to the probe method of claim 3.
A third operation program for operating the device ;
Any one of the second and third operation programs
Program selection means for selecting a program.
Characteristic probe device.