JP3218984B2 - Wafer periphery exposure method and apparatus for removing unnecessary resist on semiconductor wafer - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer peripheral exposure method and an exposure apparatus used for removing unnecessary resist on a wafer in a developing step, and more particularly to developing a stepwise unnecessary resist. The present invention relates to a wafer peripheral exposure method and an exposure apparatus applied for removing in a process.

[0002]

2. Description of the Related Art For example, when manufacturing semiconductor devices such as ICs and LSIs, a photoresist (hereinafter referred to as a resist) is applied to the surface of a semiconductor wafer such as a silicon wafer.
Next, a circuit pattern is exposed and developed to form a resist pattern. Using this resist pattern as a mask, ion implantation, etching,
Processing such as lift-off is performed. In applying a resist to a semiconductor wafer (hereinafter, referred to as a wafer), a spin coating method is generally used to make the thickness of a resist film formed by the coating uniform. In this technique, the resist is applied to the entire surface of the wafer by centrifugal force while rotating the wafer while pouring the resist to the center position of the wafer surface, and therefore, the resist is also applied to the peripheral portion of the wafer. .

However, the peripheral portion of the wafer is not often used as a pattern forming area. This is because, when a wafer is subjected to various processing steps, the wafer is often transported and held using its peripheral portion, and pattern distortion is likely to occur in the peripheral portion, resulting in poor yield. Therefore, when the resist is a positive resist, the peripheral portion is not exposed, so that the resist remains in the peripheral portion even after development. The resist remaining in the peripheral portion causes peeling or the like at the time of transporting and holding the wafer, and contaminates peripheral devices, eventually contaminating the wafer surface, leading to a reduction in yield. This has become a serious problem, particularly at present, as integrated circuits become more sophisticated and finer.

Therefore, it has been proposed to remove the unnecessary resist in the peripheral portion by a developing process. In order to realize this, a wafer for exposing the unnecessary resist in the peripheral portion is exposed separately from the step of exposing the circuit pattern in the pattern formation region. A peripheral exposure method is employed. In this peripheral exposure method, light guided by an optical fiber is radiated in a spot-like manner to a peripheral portion while rotating a wafer on which a resist is applied, to thereby perform annular exposure.

On the other hand, in recent years, in the exposure of a circuit pattern, in many cases, a pattern in which a resist is applied to a wafer surface is sequentially exposed in a grid pattern by a sequentially moving reduction projection exposure apparatus (stepper). In this case, the shape of the peripheral portion where the circuit pattern of one chip cannot be correctly exposed, that is, the shape of the unnecessary resist portion has a stepped shape, and the size and shape change variously every time exposure is performed. Such a stair-like unnecessary resist may cause peeling or the like in a manufacturing process of a semiconductor device, which causes a reduction in yield as described above.

In order to remove such a step-like unnecessary resist, light guided by an optical fiber is applied along the step-like pattern of the unnecessary resist using, for example, an apparatus disclosed in JP-A-3-242922. It is realized by irradiating in a spot while moving.

[0007] Using the wafer peripheral exposure apparatus shown in FIG.
A conventional wafer periphery exposure method for exposing a stepwise unnecessary resist at the periphery of a wafer will be described. Circuit pattern C
P is generally formed on the basis of a peripheral shape called an orientation flat (hereinafter referred to as an orientation flat) or a notch, which indicates the direction of the crystal of the wafer W, as shown in FIG. Here, FIG. 10A shows the case of a wafer provided with an orientation flat, and FIG. 10B shows the case of a wafer provided with a notch.

(1) First, the controller 12 shown in FIG.
Next, the coordinate data of the exposure area in the XY coordinates orthogonal to each other shown in FIG. 10 is stored. The X and Y directions of the XY coordinates shown here match the movement directions of the X stage 8 and the Y stage 10 that move in directions orthogonal to each other. The coordinate data here is obtained when the center of the circumferential portion of the wafer W and the center of the rotary stage 1 match. Further, the correlation between the coordinate data and the position information of the X stage 8 and the Y stage 10 detected by the X stage position detecting means 9 and the Y stage position detecting means 11 is also defined. The coordinate data is, for example, a light that guides the exposure light from an exposure light source 4 including a discharge lamp that emits light containing ultraviolet light that is exposure light for exposing the resist, a condenser mirror that collects the emitted ultraviolet light, and the like. The positional relationship between the emission section 6 of the guide fiber 5 and the wafer periphery detection means 13 described later is also taken into consideration.

(2) The X stage 8 and the Y stage 10 are driven to move the wafer periphery detecting means 13 attached to the holding arm 7 to the periphery of the wafer W. The position information of the X stage 8 and the Y stage 10 is detected by the X stage position detecting means 9 and the Y stage position detecting means 11 and sent to the controller 12. That is, the drive control of the X stage 8 and the Y stage 10 is feedback control. The wafer periphery detecting means 13 includes, for example, a light emitting diode 51 that emits non-exposure light that does not expose the resist, a lens 52 that converts the non-exposure light into parallel light, a CCD,
It is composed of an array 53. The non-exposure light that is the parallel light that has passed through the lens 52 is partially shielded by the wafer W and passes outside the edge of the wafer W as shown in FIG. This passing light is detected by the CCD array 53.

(3) By driving the rotation drive mechanism 2, the wafer W
Is rotated by one turn. During the rotation of the wafer W, the position of the edge of the wafer W changes at the orientation flat or the notch. Further, the center of the wafer W when the wafer W is mounted and the rotation stage 1
Also changes according to the amount of deviation from the center of rotation of. Therefore, during the rotation of the rotary stage, the detection position of the non-exposure light of the CCD array 53 changes according to the rotation angle of the rotary stage 1. That is, the rotation angle of the rotation stage 1 is detected by the rotation angle reading mechanism 3, and at each rotation angle, information on which pixel among the pixels of the CCD array 53 has detected the non-exposure light is detected. Position information of the edge portion of the wafer W can be obtained using the rotation angle of the stage 1 as a parameter.

(4) The position information of the edge portion of the wafer W is processed in the controller 12 to obtain the orientation flat position or the notch position, and the deviation amount between the rotation center of the rotary stage 1 and the center of the wafer W is determined. calculate. The calculation of the deviation amount is described in, for example, JP-A-3-10831.
No. 5 (Japanese Patent Application No. 1-243492) is applied. (5) Based on the above calculation data, the orientation flat position is XY
The rotary drive mechanism 2 is driven to rotate the rotary stage 1 until it becomes parallel to the X axis of the coordinate system. In the case of a notch, the rotary drive mechanism 2 is driven to rotate the rotary stage 1 until a straight line connecting the notch and the center of the wafer W is parallel to the Y axis. It should be noted that whether or not the alignment has been properly performed may be confirmed by applying a method disclosed in Japanese Patent Application Laid-Open No. Hei 5-3153. That is, in the case of an orientation flat, the wafer periphery detecting means 13 is moved in the X-axis direction along the orientation flat to detect the orientation flat position, and the angle between the orientation flat and the X axis is obtained. Then, if necessary, make fine adjustments.

(6) The coordinate data stored in the procedure (1) is corrected based on the displacement calculated in the procedure (4). For example, in FIG. 12, the coordinate data (X,
Y) is corrected as (X-dx, Y-dy). As described above, the coordinate data also takes into account the amount of deviation between the position of the emission unit 6 and the position of the wafer edge detection unit 13.

(7) Based on the coordinate data corrected in the procedure (6), the X stage 8 and the Y stage 10 are drive-controlled to move the light irradiation position from the emission unit 6 to a predetermined initial position. (8) The shutter drive mechanism 43 is driven to open the shutter 41. Exposure light is emitted from the emission unit 6.

(9) Based on the coordinate data corrected in step (6), the drive of the X stage 8 and the Y stage 10 is controlled to expose a stepwise exposure area. (10) When the stroke length of the movement of the X stage 8 and the Y stage 10 is not so long, the rotatable stage 1 is rotated by 90 ° after the exposure in the exposure range of the exposure area. The exposure area may be exposed each time.

[0015]

As described above, when exposing a staircase-like unnecessary resist, an exposure area defined based on the orientation flat position (or notch position) is stored.
In order to cope with this, exposure is performed by controlling the position of light irradiation from the light emitting unit 6 in the X-Y directions orthogonal to each other.
This is based on the premise that the exposure region of the unnecessary resist is located in a predetermined direction with respect to the orientation flat position (or notch position). That is, in the case of the orientation flat reference, as shown in FIG. 10A, the sides L1 and L3 inside the unnecessary resist area coincide with the orientation of the orientation flat.
It is assumed that the sides are parallel to the axis and the sides L2 and L4 are parallel to the Y axis orthogonal to the X axis. In the case of the notch reference, as shown in FIG. 10B, the sides L6 and L8 inside the unnecessary resist area are parallel to the Y axis which coincides with the direction connecting the vertex of the notch and the center of the wafer. , Side L5, L7
Is parallel to the X axis orthogonal to the Y axis.

However, due to an error such as alignment in a circuit pattern exposure / forming step which is a step before the wafer peripheral exposure step, for example, as shown in FIG.
The position of the circuit pattern CP, that is, the exposed area of the unnecessary resist may not be located in a predetermined direction with respect to the orientation flat position or the notch position. FIG. 13 shows an example in which the circuit pattern CP is inclined by an angle θ with respect to the X axis. Therefore, as described above, the rotating stage 1
Even if the positional deviation between the center of rotation and the center of the wafer W is corrected, it becomes impossible to expose a predetermined area.

Therefore, after exposing and forming the circuit pattern and before performing the wafer periphery exposure, the circuit pattern on the wafer W is separately observed to obtain an angle θ as shown in FIG.
In the procedure (5) described above, when the rotary drive mechanism 2 is driven to rotate the rotary stage 1 until the orientation flat position or the notch position is parallel to the X axis of the XY coordinate system,
It must be corrected by the angle θ. Such a deviation of the exposure region is caused by a process of exposing and forming a circuit pattern.
Since it changes for each wafer or for each manufacturing lot, observation must be performed each time, and a new observation device must be provided.

In addition, it is necessary to correct the shift of the exposure area of the unnecessary resist that occurs when the rotary stage 1 is rotated by the angle θ, and a complicated calculation process is required.

To solve the above-mentioned problems of the prior art, the present inventors, as shown in FIG. 2, arrange an alignment mark W on a wafer W in a predetermined positional relationship with a circuit pattern CP.
The present inventors have found a new method of providing two AMs (WAM1, WAM2), observing the alignment mark WAM, and automatically correcting the displacement based on the observation data.

FIG. 14 shows the configuration of an alignment unit for observing the alignment mark WAM. The alignment unit 20 includes a non-exposure light irradiation device 21, a half mirror 22, a mirror 23, projection lenses 24, 25, C
It comprises an optical sensor 26 such as a CD camera.
Reference numeral 27 denotes a monitor, which receives a signal from the optical sensor 26 and transmits image data (position data of coordinates on the monitor) of the alignment mark WAM to the controller 12.

The correction of the deviation amount is performed as follows. (A) After the above-described procedure (6), as shown in FIG. 14, the alignment unit 20 is inserted into a predetermined position where the alignment mark WAM can be observed. Since there are two alignment marks WAM (WAM1, WAM2), two alignment units 20 are also inserted. (B) Non-exposure light is emitted from the non-exposure light irradiation device 21 to illuminate the alignment mark WAM on the wafer W. The illuminated image of the alignment mark WAM is mirror 23 →
Half mirror 22 → detected by optical sensor 26 via projection lenses 24 and 25, and received by monitor 27.

(C) Two alignment marks WAM
(WAM1, WAM2) image data,
The angle θ, which is the amount of deviation, is calculated. (D) The rotary stage 1 is further rotated by the calculated angle θ, and the circuit pattern CP (that is, the exposure area) is
A predetermined positional relationship with the Y coordinate is set.

(E) Based on the coordinate data corrected in step (9), the position where each alignment mark WAM should be originally received on the monitor 27 is calculated. Here, the image of the alignment mark WAM actually received by the monitor 27 is received at a position deviated from the above-mentioned position to be received due to the effect of further rotating the rotary stage 1 by the angle θ. (F) The difference between the position at which the alignment mark WAM should be originally received on the monitor 27 and the position at which the alignment mark WAM is actually received is calculated and processed, and the coordinate data corrected in step (6) is further corrected. .

(G) After the above correction, the non-exposure light irradiation device 21
The emission of the non-exposure light from is stopped, and the alignment unit 20 is retracted from the predetermined position to the retracted position. Or later,
Follow the procedure from step (7).

In the correction method using the above-mentioned alignment mark, which has been found by the present inventors, the observing means for the wafer W is integrated with the wafer peripheral exposure apparatus, so that it is not necessary to newly install an observing apparatus. Also, the angle θ can be relatively easily determined.
It is possible to realize a correction relating to a shift of the exposure region of the unnecessary resist that occurs when the rotation stage 1 is rotated only by the rotation. However, it has the following problems.

(1) Each time the alignment amount of the circuit pattern CP is corrected, the alignment unit 20 performs insertion into a predetermined position and retreats to a retracted position. As shown in FIG.
If there is an error (the position A and the position B in FIG. 15) at the insertion position at the predetermined position, the image data of the two alignment marks WAM changes. (WAM (A) and WAM
(B)). However, the two alignment units 20
Are independently inserted and retracted, and there is no correlation between the position data obtained therefrom and the position data of the emission end 6 (position data of the X stage 8 and the Y stage 10: XY coordinate system).

(2) Therefore, if the positional accuracy of the two alignment units 20 is not high, the X stage 8, Y
The relative positional relationship with the XY coordinate system, which is the moving coordinate system of the stage 10, is shifted, and the correction of the coordinate data when the rotary stage 1 is further rotated by the angle θ in the above procedures (e) and (f). Error occurs.

(3) Therefore, the alignment unit 2
A high-precision positioning mechanism of 0 is required, and the cost is increased. (4) Since a plurality of alignment units 20 are required, the size of the apparatus is increased.

A first object of the present invention is to remove a stair-like unnecessary resist in a developing step with high accuracy and in a simple manner even if there is an error in the formation position of a circuit pattern formed in a preceding step. An object of the present invention is to provide a method for realizing wafer peripheral exposure. A second object of the present invention is to provide a small and inexpensive wafer peripheral exposure apparatus capable of performing the above-described wafer peripheral exposure.

[0030]

According to the present invention, there are provided:
In the inventions 3, 4, 5, and 6, the position of a singular point on a shape such as an orientation flat or a notch of a wafer is detected before exposing an unnecessary resist other than the pattern forming area on the wafer, and The wafer is rotated until it is located at the position, and two predetermined points of the pattern or the positions of two alignment marks which have a predetermined relationship with the pattern and are separately provided from the pattern are stored and calculated. Then, an angle between the moving direction of the emission end or the moving direction of the work stage and the pattern is obtained, and the angle is 0 degree or 9 degrees.
It includes a step / function of further rotating the wafer to be at 0 degrees.

That is, instead of exposing an unnecessary resist on the basis of a singular point on the shape of a wafer, it is possible to perform exposure on the basis of a pattern for observing a circuit pattern and positioning a wafer at a predetermined position. Even if there is an error in the formation position of the circuit pattern formed in the previous step, it is possible to realize the peripheral exposure of the wafer for removing the unnecessary resist having the step-like shape in the developing step with high accuracy and simply. .

In particular, if two predetermined points of the above pattern are used, there is no need to separately provide an alignment mark, which is convenient.

The invention according to claims 3 and 4 has the following operations. (1) Since there is a wafer observation means for observing an error in the formation position of the circuit pattern formed in the previous process, it is not necessary to newly install an observation device. (2) The exit end of the light guide fiber and the observation means are integrally held so as to have a predetermined positional relationship,
And it can move in the orthogonal direction. Therefore, the moving coordinate system of the emitting end and the observation means completely match, and the error correction of the circuit pattern formation position can always be performed with high accuracy. Therefore, a highly accurate positioning mechanism of the observation means required when the coordinate systems are independent is unnecessary.

(3) Further, one observation means is driven and controlled, and two predetermined points of the pattern on the wafer, or two which have a predetermined relationship with the pattern and are provided separately from the pattern. Since one alignment mark is individually detected and stored, a plurality of alignment units are not required. Therefore, a small and inexpensive wafer peripheral exposure apparatus can be provided.

The invention according to claims 5 and 6 has the following operations. (1) Since there is a wafer observation means for observing an error in the formation position of the circuit pattern formed in the previous process, it is not necessary to newly install an observation device. (2) The exit end of the light guide fiber and the observation means are integrally fixed so as to have a predetermined positional relationship,
In addition, the rotatable work stage on which the wafer is mounted can move in the orthogonal direction. Therefore, the correlation between the position of the emission end and the observation means fixed integrally and the position of the work stage on which the wafer is placed is always the same, and
The error correction of the formation position of the circuit pattern can always be performed with high accuracy. Therefore, a highly accurate positioning mechanism of the observation means required when the coordinate systems are independent becomes unnecessary.

(3) Further, by controlling the drive of the work stage, two predetermined points of the pattern on the wafer or two alignments which have a predetermined relationship with the pattern and are provided separately from the pattern. Since the marks are individually detected and stored, a plurality of alignment units are not required. Therefore, a small and inexpensive wafer peripheral exposure apparatus can be provided.

[0037]

FIG. 1 shows a wafer peripheral exposure apparatus according to a first embodiment of the present invention. The wafer peripheral exposure apparatus shown in FIG. 1 is different from the conventional wafer peripheral exposure apparatus shown in FIG. 7 in that the alignment marks WAM1 and WAM2 provided on the wafer W are detected and the detected data is processed. And a function of correcting the shift amount.

The configuration will be described below. Note that components having the same reference numerals as those in FIG. 9 indicate similar components. 14 is
This is an alignment mark detection unit that detects the alignment marks WAM1 and WAM2. The alignment mark detection unit 14 includes a CCD camera 81, a half mirror 82, a light source 83 that emits non-exposure light, and a lens 84. The light source 83 may be, for example, a light-emitting diode that emits non-exposure light, or a combination of an incandescent lamp and an optical filter that transmits only non-exposure light. The alignment mark detection unit 14 includes a light source 83
The non-exposure light emitted from the half mirror 82 and the lens 8
4, the alignment mark WAM1 or WAM2
, And the alignment mark is detected by the CCD camera 81 via the lens 84 and the half mirror 82. Since the alignment mark detection unit 14 is held integrally with the emission unit 6 by the holding arm 7, by controlling the X stage 8 and the Y stage 10 by the controller 12, the X and Y directions are integrated with the emission unit 6. Is controlled by a predetermined amount.

The image data of the alignment marks WAM1 and WAM2 detected by the CCD camera 81 is transmitted to the controller 12. Here, the controller 12
Are the rotation function of the rotary stage 2, the shutter drive mechanism 43, the control functions of the X stage 8, the Y stage 10, and the rotation angle information of the rotary stage 1 detected by the rotation angle reading mechanism 3, the X stage position detecting means 9, Y Position information of X stage 8 and Y stage 10 detected by stage position detecting means 11, wafer W detected by wafer peripheral detecting means 13
In addition to the function of storing and calculating the position information of the edge of the mark and the coordinate data of the exposure area of the unnecessary resist, the alignment mark W
It also has a function of storing and calculating image data of AM1 and WAM2.

Next, a description will be given of a wafer periphery exposure method for exposing a stepwise unnecessary resist in the periphery of a wafer by using the wafer periphery exposure apparatus shown in FIG. (1) The controller 12 stores the exposure area and the coordinate data of the alignment marks WAM1 and WAM2 in the XY coordinates orthogonal to each other as shown in FIG. The coordinate data to be stored includes the circuit pattern CP, that is, the unnecessary resist area and the alignment marks WAM1 and WAM1.
This is when AM2 is at a predetermined position on the wafer W. As in the related art, the X and Y directions of the XY coordinates shown here match the movement directions of the X stage 8 and the Y stage 10 that move in directions orthogonal to each other. The coordinate data here is obtained when the center of the circumferential portion of the wafer W coincides with the center of the rotary stage 1, and is detected by the X stage position detecting means 9 and the Y stage position detecting means 11. X stage 8, Y stage 10
Is also determined. The coordinate data also takes into account the positional relationship between the emitting unit 6 and the wafer periphery detecting means 13 and the positional relationship between the emitting unit 6 and the alignment mark detection unit 14.

Incidentally, the alignment marks WAM1, WA
Instead of M2, as shown in FIG. 3, two predetermined points having characteristics such as intersections of scribe lines around each chip in the circuit pattern CP area may be stored in the controller 12 as alignment marks. In this case, there is no need to separately provide the alignment marks WAM1 and WAM2, which is convenient.

(2) The X stage 8 and the Y stage 10 are driven to move the wafer periphery detecting means 13 attached to the holding arm 7 to the periphery of the wafer W, and the non-exposure light is emitted from the light emitting diode 51. The position information of the X stage 8 and the Y stage 10 is detected by the X stage position detecting means 9 and the Y stage position detecting means 11,
It is sent to the controller 12. That is, the drive control of the X stage 8 and the Y stage 10 is feedback control. (3) The rotation drive mechanism 2 is driven, and the rotation stage 1 on which the wafer W transferred by the transfer mechanism (not shown) is placed and vacuum-adsorbed is rotated once.

(4) While the rotary stage 1 makes one rotation, the CCD array 53 and the rotation angle reading mechanism 3 use the above-mentioned rotation angle of the rotary stage 1 as a parameter to obtain positional information of the edge portion of the wafer W. Is detected. Thereafter, emission of non-exposure light from the light emitting diode 51 is stopped. (5) The position information of the peripheral portion of the wafer W is processed by the controller 12 to calculate the orientation flat position or the notch position and the amount of deviation between the rotation center of the rotary stage 1 and the center of the wafer W.

(6) Based on the calculated data, the rotary drive mechanism 2 is driven to rotate the rotary stage 1 until the orientation flat position is parallel to the X axis of the XY coordinate system. In the case of a notch, the rotary drive mechanism 2 is driven to rotate the rotary stage 1 until a straight line connecting the notch and the center of the wafer W is parallel to the Y axis. As described above, whether or not the alignment has been properly performed may be confirmed by applying the method disclosed in Japanese Patent Application Laid-Open No. Hei 5-3153. (7) The coordinate data stored in step (1) is corrected based on the amount of deviation between the rotation center of the rotary stage 1 and the center of the wafer W calculated in step (5).

(8) Based on the coordinate data corrected in the step (7), the X stage 8 and the Y stage 10 are drive-controlled, and the alignment detecting unit 14 held integrally with the emission section 6 by the holding arm 7 is moved. The alignment mark WAM1 is moved to a position where it should be. (9) Light source 83 of alignment mark detection unit 14
More non-exposure light is emitted, an image of the alignment mark WAM1 is detected by the CCD camera 81, and image data (position data) is stored. (10) Similarly, the alignment detection unit 14 is moved to a position where the alignment mark WAM2 should be, an image of the alignment mark WAM2 is detected, and image data (position data) is stored.

(11) As shown in FIG. 4, the image data of both alignment marks WAM1 and WAM2 and both alignment marks WA previously stored in step (1).
From the distance D in the X-axis direction of M1 and WAM2, the inclination θ between the X-axis direction and the line connecting the alignment marks WAM1 and WAM2, that is, the amount of deviation θ of the circuit pattern CP is obtained by calculation, and the rotation is performed by that amount The stage 1 is rotated. (12) The steps (8) to (11) are performed again to confirm whether the inclination θ is properly corrected. If this correction has not been performed properly, the above steps (8) to (11) are repeated until the value of the inclination θ becomes equal to or less than a predetermined value. FIG. 5 shows a state in which the value of the inclination θ has become equal to or less than a predetermined value. (13) The data at the position where both alignment marks WAM1 and WAM2 should be and the data at the actual position are calculated, the difference between the two is obtained, and the coordinate data corrected in step (7) is further corrected.

(14) Returning to FIG. 1, emission of non-exposure light from the light emitting diode 83 of the alignment mark detection unit 14 is stopped. (15) Based on the coordinate data corrected in step (13),
The X stage 8 and the Y stage 10 are drive-controlled to move the light irradiation position from the holding arm 7, that is, the emission end 6, to a predetermined initial position. (16) The shutter drive mechanism 43 is driven, and the shutter 41 is driven.
Open. Exposure light is emitted from the emission end 6. (17) Based on the coordinate data corrected in step (13),
The drive of the X stage 8 and the Y stage 10 is controlled to expose a stepwise exposure region. (18) If the stroke length of the movement of the X stage 8 and the Y stage 10 is not so long, the rotatable stage 1 is rotated by 90 ° every time after exposing the exposure range of the exposure area. The exposure area may be exposed each time.

In the wafer peripheral exposure apparatus according to the first embodiment, the holding arm 7 for integrally holding the alignment mark detection unit 14 and the light emitting section 6 includes the X stage 8 and the Y stage 10.
Drive control in the X direction and Y direction by a predetermined amount. However, as in the wafer peripheral exposure apparatus of the second embodiment shown in FIG.
Stage 1 on which the wafer W is mounted
In the X direction and Y by the X stage 8 and the Y stage 10.
Even if the drive is controlled by a predetermined amount in the direction, the same effect as that of the wafer peripheral exposure apparatus of the first embodiment can be obtained.

In FIG. 6, reference numeral 71 denotes a fixing member for integrally fixing the alignment mark detection unit 14 and the emission section 6 at a predetermined position. The rotation drive mechanism 2 and the rotation angle reading mechanism 3 are integrated, and are fixed to the X stage 8 and the Y stage 10. Therefore, the rotary stage 1 rotates by driving the rotary drive mechanism 2, the X stage 8, and the Y stage 10, and can be further moved in the X and Y directions. The rotation angle of the rotary stage 1, the X direction, and the Y direction
The position in the direction is detected by the rotation angle reading mechanism 3, the X stage position detecting means 9, and the Y stage position detecting means 11, and this detection signal is sent to the controller 12.
Note that components having the same reference numerals as those in FIG. 1 indicate similar components.

Next, a wafer periphery exposing method using the wafer periphery exposing apparatus of the second embodiment will be described. (I) As in the procedure (1) of the first embodiment, the XY coordinate data of the exposure area when the center of the circumferential portion of the wafer W coincides with the center of the rotary stage 1 is sent to the controller 12. Remember. The coordinate data takes into account the correlation with the position information of the X stage 8 and the Y stage 10 and the positional relationship with the emission unit 6 and the wafer periphery detecting means 13.

(R) By driving the X stage 8 and the Y stage 10, the edge of the wafer W is
The rotary stage 1 on which the wafer W is placed is moved so that the light-emitting diode 5
1 emits non-exposure light. In addition, X stage 8, Y
The position information of the stage 10 is detected by the X stage position detecting means 9 and the Y stage position detecting means 11, and is sent to the controller 12. That is, X stage 8,
The drive control of the Y stage 10 is feedback control.

(A) Procedures (3) to (7) of the first embodiment
Similarly, the position information of the edge portion of the wafer W is detected by using the rotation angle of the rotary stage 1 as a parameter, and is processed by the controller 12, and the orientation flat position or the notch position, the rotation center of the rotary stage 1 and the wafer W Is calculated based on the calculated data. In the case of a notch, a straight line connecting the notch and the center of the wafer W is used until the orientation flat position becomes parallel to the X axis of the XY coordinate system. The rotary drive mechanism 2 is driven to rotate the rotary stage 1 until it is parallel to the axis. The procedure (1) is performed based on the calculated shift amount between the rotation center of the rotary stage 1 and the center of the wafer W.
The coordinate data stored in is corrected.

Based on the coordinate data corrected in the procedure (a), the X stage 8 and the Y stage 10 are driven and controlled, and the alignment mark WAM1 on the wafer W is fixed integrally with the emission section 6 by the holding member 71. The rotary stage 1 is moved so as to be located at the position where the alignment detection unit 14 is to be detected.

(H) Alignment mark detection unit 1
4 emits non-exposure light from the light source 83, and the CCD camera 81
Then, the image of the alignment mark WAM1 is detected, and the image data (position data) is stored. (F) Similarly, alignment mark W on wafer W
The rotary stage 1 is moved so that AM2 is located at a position to be detected by the alignment detection unit 14,
The image of the alignment mark WAM2 is detected, and the image data (position data) is stored.

(And) Procedures (11) to (1) of the first embodiment
4), the circuit pattern CP as shown in FIG.
Is obtained by calculation, and the rotary stage 1 is rotated by that amount. Hereinafter, the alignment mark WAM1,
After repeating the steps of detecting WAM2, calculating the amount of deviation θ, and rotating the rotary stage 1 until the value of the inclination θ becomes equal to or less than a predetermined value, the alignment marks WAM1 and WAM2
Calculates the data of the position to be detected originally and the data of the position actually detected, finds the difference between the two, and further corrects the coordinate data corrected in the procedure (a). Then, emission of non-exposure light from the light emitting diode 83 of the alignment mark detection unit 14 is stopped.

(C) Based on the coordinate data corrected in the steps (A) and (B), the initial position of the exposure area of the wafer W is located at the light irradiation position from the emission end 6 fixed by the holding member.
The rotation stage 1 is moved by controlling the driving of the X stage 8 and the Y stage 10. (G) The shutter drive mechanism 43 is driven, the shutter 41 is opened, the exposure light is emitted from the emission end 6, and the X stage 8 and the Y stage 10 are driven based on the coordinate data corrected in the procedure (and). Then, the rotation stage 1 is moved and controlled to expose a stepwise exposure region. When the stroke length of the movements of the X stage 8 and the Y stage 10 is not so long, the rotatable stage 1 is rotated by 90 ° after the exposure by exposing the exposure range of the exposure region. May be exposed.

The wafer peripheral exposure apparatus of the second embodiment has the same functions as those of the first embodiment,
Since the rotary stage 1 is set on the stage 8 and the Y stage 10, the floor area occupied by the stage is smaller than that of the first embodiment, the floor area of the entire apparatus can be reduced, and the mechanism is small. Simplified and lower cost.

Further, since the emission end 6 of the fiber 5 can be fixed, the fiber 5 is not consumed by moving the emission end 6. When the emission end 6 moves on the wafer W as in the wafer peripheral exposure apparatus of the first embodiment, in some cases, dust is generated by the movement and the wafer W
Although it may happen that it falls or sticks on
In this embodiment, the emission end 6 is fixed, so that such a problem can be avoided.

FIG. 7 shows a wafer peripheral exposure apparatus according to a third embodiment of the present invention. 7, components having the same reference numerals as those in FIG. 1 indicate similar components.

In this embodiment, the optical filter 42
And an optical filter driving mechanism 44 for inserting or removing the optical filter 42 into or from the optical path between the light source 4 for exposure and one end of the light guide fiber 5. The optical filter 42 selectively transmits non-exposure light, which does not expose the resist applied on the wafer W, from light emitted from the exposure light source 4. Therefore,
When the optical filter 42 is inserted into the optical path, non-exposure light is emitted from the emission unit 6.

The alignment marks WAM1 and WA
A CCD camera 30 for detecting M2 is held integrally with the emission end 6 by a holding arm 7 and is arranged at a position where an image in an irradiation area of the non-exposure light emitted from the emission section 6 can be detected. I have. As will be described later, the alignment marks WAM1 and WAM detected by the CCD camera 30 are used.
The image data of AM2 is transmitted to the controller 12.
Reference numeral 15 denotes a CCD array serving as a wafer position detecting means.

That is, the controller 12 controls the rotation drive mechanism 2 of the rotary stage, the shutter drive mechanism 43, the optical filter drive mechanism 44, the control functions of the X stage 8 and the Y stage 10, and the rotation stage 1 detected by the rotation angle reading mechanism 3. Rotation angle information, X stage position detecting means 9, Y
X stage 8, Y detected by stage position detecting means 11
In addition to the position information of the stage 10, the position information of the edge of the wafer W detected by the CCD array 15, the coordinate data of the exposure area of the unnecessary resist, and the processing function of storing and calculating the image data of the alignment marks WAM 1 and WAM 2. It also has a processing function.

Next, wafer periphery exposure according to the third embodiment will be described. (A) As in the first embodiment, the controller 12 stores the exposure area and the coordinate data of the alignment marks WAM1 and WAM2 in the XY coordinates shown in FIG. The coordinate data includes the circuit pattern CP, that is, the unnecessary resist area and the alignment marks WAM1 and WAM2.
Is at a predetermined position on the wafer W, and X
The X direction and the Y direction of the −Y coordinate coincide with the movement directions of the X stage 8 and the Y stage 10 that move in directions orthogonal to each other. The coordinate data here is obtained when the center of the circumferential portion of the wafer W coincides with the center of the rotary stage 1, and is detected by the X stage position detecting means 9 and the Y stage position detecting means 11. The correlation with the position information of the X stage 8 and the Y stage 10 is also determined.
Note that this coordinate data is stored in the emission section 6 and the CCD array 15.
And the positional relationship between the emission unit 6 and the CCD camera 30 are also taken into consideration.

Note that the alignment marks WAM1, WA
Instead of M2, as shown in FIG. 3, two predetermined intersections of scribe lines around each chip in the circuit pattern CP area may be stored in the controller 12 as alignment marks.

(B) In the optical path between the exposure light source 4 and one end of the light guide fiber 5, the optical filter drive mechanism 44 is driven to select the non-exposure light from the exposure light source 4. Insert (C) The X stage 8 and the Y stage 10 are driven and controlled in the same manner as in the first embodiment, and after the light emitting unit 6 is moved to the peripheral edge of the wafer W, the shutter driving mechanism 43 is driven to open the shutter 41. . The non-exposure light is emitted from the emission unit 6. The non-exposure light emitted from the emission unit 6 through the optical filter 42 is partially shielded by the wafer W, and passes outside the peripheral edge of the wafer W. This passing light is CCD
Detected by array 15.

(D) The rotation drive mechanism 2 is driven, and the wafer W
Is mounted, and the rotary stage 1 that has been vacuum-adsorbed is rotated once. (E) While the rotation stage 1 makes one rotation, the position of the peripheral portion of the wafer W using the rotation angle of the rotation stage 1 as a parameter by the CCD array 15 and the rotation angle reading mechanism 3 as in the first embodiment. Detect information. (F) Thereafter, in the same manner as in the procedures (5) to (7) of the first embodiment, the rotary stage 1 is rotated until the orientation flat position or the notch position reaches a predetermined position, and stored in (1). Correct the set coordinate data.

(G) Based on the corrected coordinate data, the X stage 8 and the Y stage 10 are drive-controlled to move the light irradiation position from the CCD camera 30 and the light emitting section 6 to the position where the alignment mark WAM1 should be. (8) The alignment mark WAM1 is irradiated with non-exposure light by the emission end 6, and the alignment mark WAM
The image of AM1 is detected, and image data (position data) is stored. (H) Similarly, the light irradiation position from the CCD camera 30 and the emission unit 6 is moved to a position where the alignment mark WAM2 should be located, an image of the alignment mark WAM2 is detected, and image data (position data) is stored.

(I) The procedure of the first embodiment (10)
To (13), the deviation amount θ of the circuit pattern CP.
The rotation stage 1 is rotated by that amount, and the data at the position where the alignment marks WAM1 and WAM2 should be originally and the data at the position where the alignment marks WAM1 and WAM2 are actually located are calculated,
The difference between the two is obtained, and the previously corrected coordinate data is further corrected.

(J) Returning to FIG. 7, the shutter driving mechanism 43
And the shutter 41 is closed. Thereafter, by driving the optical filter driving mechanism 44, the optical filter 4
2 is removed from the optical path between the exposure light source 4 and one end of the light guide fiber 5. (K) The stepwise exposure region is exposed in the same manner as in the procedures (15) to (18) of the first embodiment.

In the third embodiment, the optical filter 4
2, the non-exposure light is emitted from the emission unit 6. Therefore, the peripheral edge detecting means of the wafer W and the alignment mark W
The detection means for AM1 and WAM2 can be configured more simply than in the first embodiment. In particular, since the holding arm 7 merely holds the emission unit 6 and the CCD camera 30, the CCD
An alignment mark detection unit 14 including a camera 81, a half mirror 82, a light emitting diode 83 that emits non-exposure light, and a lens 84;
A lens 52 for converting the non-exposure light into a parallel light, a CCD array 5
3 and a light emitting unit 6
X stage 8 and Y stage
The load applied to the stage 10 is small, and both stages can be miniaturized.

The wafer peripheral exposure apparatus of the third embodiment is also similar to the wafer peripheral exposure apparatus of the fourth embodiment shown in FIG.
The CCD camera 30 and the emission unit 6 are integrally fixed, and the rotary stage 1 on which the wafer W is mounted is driven and controlled by the X stage 8 and the Y stage 10 in the X and Y directions by a predetermined amount. Can be.

In FIG. 8, reference numeral 71 denotes a fixing member for integrally fixing the CCD camera 30 and the emission section 6 at a predetermined position.
The rotation drive mechanism 2 and the rotation angle reading mechanism 3 are integrated, and are fixed to the X stage 8 and the Y stage 10. Therefore, the rotary stage 1 rotates by driving the rotary drive mechanism 2, the X stage 8, and the Y stage 10, and can be further moved in the X and Y directions. The rotation angle, the X direction, and the Y position of the rotary stage 1 are detected by the rotation angle reading mechanism 3, the X stage position detecting means 9, and the Y stage position detecting means 11, and the detection signal is
It is sent to the controller 12. Note that components having the same reference numerals as those in FIG. 7 indicate similar components.

Next, a description will be given of a wafer peripheral exposure method using the wafer peripheral exposure apparatus of the fourth embodiment. (A) As in the procedure (A) of the third embodiment, the controller 12 determines that the center of the circumferential portion of the wafer W coincides with the center of the rotary stage 1 and the alignment marks WAM1 and WAM.
The exposure area and the XY coordinate data of the alignment marks WAM1 and WAM2 when the wafer 2 is at a predetermined position on the wafer W are stored. The coordinate data takes into account the correlation with the positional information of the X stage 8 and the Y stage 10 and the positional relationship with the emission unit 6, the CCD array 15, and the CCD camera 30.

(B) In the optical path between the exposure light source 4 and one end of the light guide fiber 5, the optical filter drive mechanism 44 is driven to select the non-exposure light from the exposure light source 4. Insert (C) drive control of the X stage 8 and the Y stage 10
The edge portion of the wafer W is positioned in a light irradiation area where the non-exposure light is emitted from the emission unit 6 via the filter 42,
After moving the rotary stage 1, the shutter driving mechanism 43
And the shutter 41 is opened. The non-exposure light is partially shielded by the wafer W and passes outside the peripheral edge of the wafer W. This passing light is detected by the CCD array 15.

(D) Procedures (D) to (F) of the third embodiment
Similarly, the position information of the edge portion of the wafer W is detected by using the rotation angle of the rotary stage 1 as a parameter, and is processed by the controller 12, and the orientation flat position or the notch position, the rotation center of the rotary stage 1 and the wafer W Is calculated based on the calculated data. In the case of a notch, a straight line connecting the notch and the center of the wafer W is used until the orientation flat position becomes parallel to the X axis of the XY coordinate system. The rotary drive mechanism 2 is driven to rotate the rotary stage 1 until it is parallel to the axis. The procedure (1) is performed based on the calculated shift amount between the rotation center of the rotary stage 1 and the center of the wafer W.
The coordinate data stored in is corrected.

(E) Based on the coordinate data corrected in (d), the X stage 8 and the Y stage 10 are drive-controlled to
The rotary stage 1 is moved so that the alignment mark WAM1 is located at a predetermined position of the light irradiation position from the CD camera 30 and the light emitting unit 6. (F) Non-exposure light is emitted by the output end 6 to the alignment mark W.
The image is radiated to AM1, and the image of the alignment mark WAM1 is detected by the CCD camera 30, and the image data (position data) is stored. (G) Similarly, the alignment mark WAM2 is set at a predetermined position of the light irradiation position from the CCD camera 30 and the light emitting unit 6.
The rotation stage 1 is moved so that is positioned, an image of the alignment mark WAM2 is detected, and image data (position data) is stored. (H) Hereinafter, as in the procedures (I) to (K) of the third embodiment, the deviation amount θ of the circuit pattern CP is set to be equal to or less than a predetermined value by the arithmetic processing of the image data (position data) or the like. By rotating the rotary stage 1, the alignment mark WAM
1, WAM2 calculates the data of the original position and the data of the actual position, finds the difference between the two, and further corrects the previously corrected coordinate data. Then, the optical filter 4
2 is removed from the optical path between the light source 4 for exposure and one end of the light guide fiber 5, and a stepwise exposure region is exposed.

In the fourth embodiment, as in the third embodiment, the non-exposure light is emitted from the emission section 6 using the optical filter 42, so that the peripheral edge detecting means of the wafer W and the alignment marks WAM1, The detection means of WAM2 can be configured more simply than in the second embodiment.

Also, as in the second embodiment, since the rotary stage 1 is installed on the X stage 8 and the Y stage 10, the floor area occupied by the stage is smaller than that in the first embodiment. In addition, the floor area of the entire apparatus can be reduced, the mechanism is simplified, and the cost is reduced.

Furthermore, since the emission end 6 of the fiber 5 can be fixed, the movement of the emission end 6 eliminates the consumption of the fiber 5 and generates dust that may occur when the emission end 6 moves on the wafer W. And the problem of dropping and adhering onto the wafer W due to the occurrence of the problem can be avoided.

[0080]

As described above, according to the first, second, third, fourth, fifth and sixth aspects of the present invention, an unnecessary resist is formed on the basis of a singular point on a shape such as an orientation flat or a notch. Rather than exposing, after adjusting the wafer position based on the singular point on the shape, further observe the circuit pattern and fine-adjust the position of the wafer so that the circuit pattern comes to a predetermined position. Since the exposure is performed based on the pattern, even if there is an error in the formation position of the circuit pattern formed in the previous process, it is possible to easily and accurately remove the unnecessary resist having the step-like shape in the developing process around the wafer. Exposure can be realized.

In the fine adjustment, a predetermined 2
Point or, based on the positional information of two alignment marks which have a predetermined relationship with the pattern and are provided separately from the pattern, the alignment is particularly performed by using the predetermined two points of the pattern. There is no need to separately provide a mark, which is convenient.

The invention according to claims 3 and 4 has the following effects. (1) Since there is a wafer observation means for observing an error in the formation position of the circuit pattern formed in the previous process, it is not necessary to newly install an observation device. (2) The light emitting section of the light guide fiber and the observation means are integrally held so as to have a predetermined positional relationship,
And it can move in the orthogonal direction. Therefore, the moving coordinate system of the emitting end and the observation means completely match, and the error correction of the circuit pattern formation position can always be performed with high accuracy. Therefore, a highly accurate positioning mechanism of the observation means required when the coordinate systems are independent is unnecessary.

(3) Further, one observation means is driven and controlled so that two points of the pattern on the wafer or two points which have a predetermined relationship with the pattern and are provided separately from the pattern. Since one alignment mark is individually detected and stored, a plurality of alignment units are not required. Therefore, a small and inexpensive wafer peripheral exposure apparatus can be provided.

The invention according to claims 5 and 6 has the following effects. (1) Since there is a wafer observation means for observing an error in the formation position of the circuit pattern formed in the previous process, it is not necessary to newly install an observation device. (2) The exit end of the light guide fiber and the observation means are integrally fixed so as to have a predetermined positional relationship,
In addition, the rotatable work stage on which the wafer is mounted can move in the orthogonal direction. Therefore, the correlation between the position of the emission end and the observation means fixed integrally and the position of the work stage on which the wafer is placed is always the same, and
The error correction of the formation position of the circuit pattern can always be performed with high accuracy. Therefore, a highly accurate positioning mechanism of the observation means required when the coordinate systems are independent becomes unnecessary.

(3) Further, by controlling the drive of the work stage, two predetermined points of the pattern on the wafer or two alignments which have a predetermined relationship with the pattern and are provided separately from the pattern. Since the marks are individually detected and stored, a plurality of alignment units are not required. Therefore, a small and inexpensive wafer peripheral exposure apparatus can be provided.

[0086]

[Brief description of the drawings]

FIG. 1 is a view showing a wafer peripheral exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an exposure area and an alignment mark.

FIG. 3 is a diagram illustrating two predetermined intersections of a scribe line.

FIG. 4 is a diagram showing the inclination of an alignment mark.

FIG. 5 is a diagram showing a state in which the inclination of the alignment mark has become a predetermined value or less.

FIG. 6 is a view showing a wafer peripheral exposure apparatus according to a second embodiment of the present invention.

FIG. 7 is a view showing a wafer peripheral exposure apparatus according to a third embodiment of the present invention.

FIG. 8 is a view showing a wafer peripheral exposure apparatus according to a fourth embodiment of the present invention.

FIG. 9 is a diagram showing an example of a conventional wafer peripheral exposure apparatus.

FIG. 10 is a diagram showing an exposure area.

FIG. 11 is a diagram illustrating detection of light passing through the outer periphery of the wafer.

FIG. 12 is a diagram illustrating an example of correcting coordinate data.

FIG. 13 is a diagram showing a state where a circuit pattern is not formed at a predetermined position.

FIG. 14 is a diagram illustrating a configuration of an alignment unit.

FIG. 15 is a diagram illustrating the effect of an error in the insertion position of the alignment unit.

[Explanation of symbols]

 Reference Signs List 1 rotation stage 2 rotation drive mechanism 3 rotation angle reading mechanism 4 exposure light source 5 light guide fiber 6 emission unit 7 holding arm 8 X stage 9 X stage position detection means 10 Y stage 11 Y stage position detection means 12 controller 13 Wafer edge detection Means 14 Alignment mark detection unit 15 CCD array 20 Alignment unit 21 Non-exposure light irradiation device 22 Half mirror 23 Mirror 24 Projection lens 25 Projection lens 26 Optical sensor 27 Monitor 30 CCD camera 41 Shutter 42 Optical filter 43 Shutter drive mechanism 44 Optical filter drive Mechanism 51 Light emitting diode 52 Lens 53 CCD array 71 Fixing member 81 CCD camera 82 Half mirror 83 Light emitting diode 84 Lens W Semiconductor wafer WAM Align Mark put WAM1 alignment mark WAM2 alignment mark CP circuit pattern

Continuation of the front page (56) References JP-A-4-291914 (JP, A) JP-A-4-291938 (JP, A) JP-A-60-60724 (JP, A) JP-A-5-3153 (JP) , A) JP-A-3-242922 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/027

Claims (6)

(57) [Claims] 1. A semiconductor wafer having a singular point on the periphery such as an orientation flat or a notch and having a photoresist coated on its surface and having a pattern formed thereon, in two directions perpendicular to each other. A wafer peripheral exposure method for irradiating exposure light while controlling the position of a movable emission portion to expose unnecessary resist other than the pattern forming region on the wafer, wherein the unnecessary resist other than the pattern forming region is exposed. Before, the position of the singular point is detected, and the wafer is rotated until the singular point is located at a predetermined position. The predetermined two points of the pattern, or the pattern has a predetermined relationship with the pattern. 2 provided separately
Detecting and storing the positions of the two alignment marks, calculating the angle between the moving direction of the emission section and the pattern, and further rotating the wafer so that the angle becomes 0 or 90 degrees. A wafer peripheral exposure method, comprising: 2. A semiconductor wafer having a singular point on the periphery such as an orientation flat or a notch and having a surface coated with a photoresist and having a pattern formed thereon is moved in two directions orthogonal to each other. Possible, and placed on a rotatable work stage, irradiating exposure light while controlling the position of the work stage,
A wafer peripheral exposure method for exposing an unnecessary resist other than a pattern formation region on the wafer, wherein the position of the singular point is detected before exposing the unnecessary resist other than the pattern formation region, and The wafer is rotated until it is located at a predetermined position, and two predetermined points of the pattern or two provided separately from the pattern having a predetermined relationship with the pattern.
Detecting and storing the positions of the two alignment marks, calculating the angle between the moving direction of the work stage and the pattern, and further rotating the wafer so that the angle becomes 0 or 90 degrees. A wafer peripheral exposure method, comprising: 3. A rotary stage having a singular point on the periphery such as an orientation flat or a notch, and holding a wafer having a surface coated with a photoresist and having a pattern formed thereon, and the rotary stage. Rotating stage driving means for rotating the rotating stage; rotating angle reading means for detecting a rotating angle of the rotating stage; a light source for emitting exposure light; and a light for irradiating the wafer with exposure light from the light source from an emitting unit. A guide fiber, an observation means for observing the wafer surface, a periphery detection means for detecting information on a periphery of the wafer, and a light emitting section of the light guide fiber and the observation means being in a predetermined positional relationship. Holding means for integrally holding the holding means; driving means for driving the holding means in two directions orthogonal to each other; A control unit for irradiating the exposure light from the emission unit while exposing the unnecessary resist on the wafer other than the pattern formation region while driving in the two directions. The control unit further includes an unnecessary resist other than the pattern formation region. Before the exposure, the peripheral edge detecting means detects the singular point on the shape, and the rotating stage driving means controls the rotating stage to rotate the wafer until the singular point on the shape is located at a predetermined position. The observation means detects and stores two predetermined points of the pattern on the wafer or one position of two alignment marks having a predetermined relationship with the pattern and provided separately from the pattern. Then, the observation means is moved by the driving means to a predetermined point of the other pattern or the position of the alignment mark, and the other point is reached. Detects and stores the alignment mark, calculates the position data of both, and obtains the angle between the moving direction of the emission end and the pattern, and further sets the rotation stage so that the angle becomes 0 or 90 degrees. A wafer peripheral exposure apparatus having a function of rotating a wafer by controlling a rotation stage by driving means. 4. A rotary stage having a singular point on the periphery such as an orientation flat or a notch, and holding a wafer having a surface coated with a photoresist and having a pattern formed thereon, and the rotary stage. Rotating stage driving means for rotating the rotating stage, rotating angle reading means for detecting a rotating angle of the rotating stage, a light source section for emitting exposure light or non-exposure light, and exposure light or non-exposure from the light source section from an emission section. A light guide fiber for irradiating the wafer with light; an observation means for observing the wafer surface; and non-exposure light emitted from the light guide fiber to the periphery of the wafer to detect information on the periphery of the wafer. Edge detecting means for obtaining the light guide fiber, and the emitting section of the light guide fiber and the observation means are integrally formed so as to have a predetermined positional relationship. Holding means for holding; driving means for driving the holding means in two directions orthogonal to each other; and pattern formation on the wafer by irradiating exposure light from an emission part while driving the holding means in two directions orthogonal to each other. A control unit for exposing an unnecessary resist other than the region; the control unit further detects a singular point on the shape by the peripheral edge detection unit before exposing the unnecessary resist other than the pattern formation region; The rotary stage is controlled by the rotary stage driving means to rotate the wafer until a singular point on the shape is located at a predetermined position, and has a predetermined relationship with the predetermined two points of the pattern on the wafer or the pattern. Then, one position of two alignment marks provided separately from the pattern is detected and stored by the above-mentioned observation means, and then the position of the other pattern is detected. The observation means is moved by the driving means to a fixed point or the position of the alignment mark, the other point or the alignment mark is detected and stored, and the position data of both is calculated to determine the moving direction of the emission end and A wafer peripheral exposure apparatus having a function of determining an angle formed with the pattern and rotating the wafer by controlling the rotary stage by the rotary stage driving means so that the angle becomes 0 or 90 degrees. . 5. A work stage having a singular point on the periphery such as an orientation flat or a notch, and holding a wafer having a surface coated with a photoresist and having a pattern formed thereon; A work stage rotation driving means for rotating the work stage; a rotation angle reading means for detecting a rotation angle of the work stage; a work stage orthogonal direction driving means for driving the work stage in two directions orthogonal to each other; Orthogonal position detecting means for detecting a position in the direction; a light source unit for emitting exposure light; a light guide fiber for irradiating the wafer with exposure light from the light source unit from an emission unit; and an observation means for observing the wafer surface. A peripheral portion detecting means for detecting information on a peripheral portion of the wafer; Fixing means for integrally fixing the light emitting section and the observation means so as to have a predetermined positional relationship, and exposing light from the light emitting section fixed by the fixing means while driving the work stage in two directions orthogonal to each other. A control unit for irradiating and exposing an unnecessary resist other than the pattern formation region on the wafer, wherein the control unit further comprises: The work stage rotation drive means controls the work stage to rotate the wafer until the singular point on the shape is located at a predetermined position, and the predetermined two points of the pattern on the wafer are detected. Alternatively, one position of two alignment marks, which have a predetermined relationship with the pattern and are provided separately from the pattern, is used as the observation means. Then, the wafer is moved by the work stage orthogonal direction driving means to a predetermined point of the other pattern or the position of the alignment mark, and the other point or the alignment mark is detected and stored. Calculating the angle between the moving direction of the work stage and the pattern by calculating the position data of both, and further controlling the rotating stage by the rotating stage driving means so that the angle becomes 0 or 90 degrees. A wafer peripheral exposure apparatus having a function of rotating a wafer. 6. A work stage having a singular point on the periphery such as an orientation flat or a notch, and holding a wafer having a surface coated with a photoresist and having a pattern formed thereon; A work stage rotation driving means for rotating the work stage; a rotation angle reading means for detecting a rotation angle of the work stage; a work stage orthogonal direction driving means for driving the work stage in two directions orthogonal to each other; Orthogonal position detecting means for detecting the position in the direction, a light source unit for emitting exposure light or non-exposure light, a light guide fiber for irradiating the wafer with exposure light or non-exposure light from the light source unit from an emission unit, Observation means for observing the wafer surface; and a periphery of the wafer from the light guide fiber. Edge detecting means for detecting the non-exposure light applied to the wafer to obtain information on the edge of the wafer; and integrally fixing the light emitting section of the light guide fiber and the observing means so as to have a predetermined positional relationship. And a control unit for irradiating exposure light from an emission unit fixed by the fixing unit while exposing the unnecessary resist other than the pattern formation area on the wafer while driving the work stage in two directions orthogonal to each other. The control unit further includes detecting the singular point on the shape by the peripheral edge detecting unit before exposing the unnecessary resist other than the pattern forming area, and locating the singular point on the shape at a predetermined position. The work stage is controlled by the work stage rotation driving means until the wafer is rotated, and the wafer is rotated. One position of two alignment marks having a predetermined relationship and provided separately from the pattern is detected and stored by the above-mentioned observation means, and then the position of the other pattern is determined to a predetermined point or the position of the alignment mark. The wafer is moved by the work stage orthogonal direction driving means, the other point or the alignment mark is detected and stored, and the position data of both is calculated to calculate the angle between the movement direction of the work stage and the pattern. A wafer peripheral exposure apparatus having a function of rotating the wafer by controlling the rotating stage by the rotating stage driving means so that the angle becomes 0 degree or 90 degrees.