JP3215984B2 - Vacuum apparatus and method of using the same - Google Patents

Vacuum apparatus and method of using the same

Info

Publication number
JP3215984B2
JP3215984B2 JP03144092A JP3144092A JP3215984B2 JP 3215984 B2 JP3215984 B2 JP 3215984B2 JP 03144092 A JP03144092 A JP 03144092A JP 3144092 A JP3144092 A JP 3144092A JP 3215984 B2 JP3215984 B2 JP 3215984B2
Authority
JP
Japan
Prior art keywords
cleaned
vacuum chamber
vacuum
opposing
opposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP03144092A
Other languages
Japanese (ja)
Other versions
JPH05192556A (en
Inventor
昭 岩瀬
拓興 沼賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP03144092A priority Critical patent/JP3215984B2/en
Publication of JPH05192556A publication Critical patent/JPH05192556A/en
Application granted granted Critical
Publication of JP3215984B2 publication Critical patent/JP3215984B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01JCHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006Processes utilising sub-atmospheric pressure; Apparatus therefor

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、電子ビーム描画装置の
描画室のような真空室を有する真空装置に係り、特に被
描画材を取付ける基準面のような真空室内に設けられた
清浄に保つべき所定形状の被クリーニング面を有する真
空装置及びその使用方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum apparatus having a vacuum chamber such as a drawing chamber of an electron beam drawing apparatus, and particularly to a vacuum apparatus provided in a vacuum chamber such as a reference plane on which a material to be drawn is mounted. The present invention relates to a vacuum apparatus having a surface to be cleaned having a predetermined shape to be used and a method of using the same.

【0002】[0002]

【従来の技術】電子ビーム描画装置は、真空の描画室内
に被描画材であるウェハ,マスクブランクス又はそれら
を取付けた固定具を設置して描画するものであるが、こ
れらの被描画材の設置精度が描画精度に大きく影響す
る。このため描画材の被設置面はもちろん、これを設置
する描画室内の設置面(基準面)を清浄に保ち、塵埃等
による設置不良を防止する必要がある。従来、上記基準
面は、3ないし6ケ月毎などに行われる定期点検時に、
描画室を大気に開放し、人手によってクリーニングする
ことにより清浄に保つようにしていた。
2. Description of the Related Art An electron beam lithography apparatus is for lithography by installing a wafer, a mask blank, or a fixture to which the wafer or mask blank is attached in a vacuum lithography chamber. Accuracy greatly affects drawing accuracy. For this reason, it is necessary to keep the surface (reference surface) in the drawing room where the drawing material is to be installed, as well as the surface on which the drawing material is to be installed, clean to prevent installation failure due to dust and the like. Conventionally, the above-mentioned reference plane is used at the time of periodic inspections performed every 3 to 6 months, etc.
The drawing chamber was opened to the atmosphere, and was kept clean by manual cleaning.

【0003】[0003]

【発明が解決しようとする課題】例えば電子ビーム描画
装置の描画精度は、近年ますます高精度化されており、
基準面に1μm程度の塵埃が付着しても描画精度に悪影
響を及ぼす。そこで、従来のように定期点検時のクリー
ニングのみでは必要な清浄状態に保つことが困難になっ
ている。
[Problems to be Solved by the Invention] For example, in recent years, the drawing accuracy of an electron beam drawing apparatus has been getting higher and higher.
Even if dust of about 1 μm adheres to the reference surface, the drawing accuracy is adversely affected. Therefore, it is difficult to maintain a necessary clean state only by cleaning at the time of regular inspection as in the related art.

【0004】本発明は、上記基準面のような真空室内に
設けられた清浄に保つべき所定形状の被クリーニング面
を、容易に清浄に保つことのできる真空装置及びその使
用方法を提供することを目的としている。
An object of the present invention is to provide a vacuum apparatus and a method for using the vacuum apparatus, which can easily keep a predetermined surface to be cleaned, such as the reference plane, provided in a vacuum chamber to be kept clean. The purpose is.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
の本発明は、真空室と、この真空室内に設けられた所定
形状の被クリーニング面と、を有する真空装置におい
て、被クリーニング面との相対移動により被クリーニン
グ面にわずかなすき間を置いて対向可能な対向面を有す
る対向板と、前記対向面に設けられた圧縮気体の噴出口
と、からなるクリーニングユニットを、真空室内に設け
たものである。
According to the present invention, there is provided a vacuum apparatus having a vacuum chamber and a surface to be cleaned having a predetermined shape provided in the vacuum chamber. A cleaning unit including a facing plate having a facing surface capable of facing a cleaning target surface with a slight gap therebetween by a relative movement, and a compressed gas ejection port provided on the facing surface, provided in a vacuum chamber. It is.

【0006】また、本発明は、真空室を大気に戻す際、
対向面を被クリーニング面にわずかなすき間を置いて対
向させ、噴出口から圧縮気体を噴出させる上記真空装置
の使用方法及び、対向面を被クリーニング面にわずかな
すき間を置いて対向させ、噴出口から圧縮気体を噴出さ
せると共に真空室を真空引きする上記真空装置の使用方
法にある。
The present invention also provides a method for returning a vacuum chamber to the atmosphere.
The method of using the vacuum device, wherein the opposing surface is opposed to the surface to be cleaned with a small gap therebetween, and the compressed gas is ejected from the ejection port, and the opposing surface is opposed to the surface to be cleaned with a slight gap therebetween, And a method of using the above-described vacuum apparatus for ejecting a compressed gas from a vacuum chamber and evacuating a vacuum chamber.

【0007】[0007]

【作用】通常の運転時には、対向面は被クリーニング面
から離れているが、例えば、真空室を大気に戻す際など
に、対向面と被クリーニング面の相対移動により対向面
を被クリーニング面にわずかなすき間を置いて対向さ
せ、噴出口から圧縮気体を噴出させる。噴出した圧縮気
体は、対向面と被クリーニング面との間のわずかなすき
間を高速で通過し、被クリーニング面に付着している塵
埃を吹き飛ばす。このとき、真空室を真空引きすれば、
塵埃の除去効果を高めることができると共に、塵埃を真
空室外へ排出することができる。
During normal operation, the opposing surface is separated from the surface to be cleaned. For example, when returning the vacuum chamber to the atmosphere, the opposing surface is slightly moved to the surface to be cleaned by relative movement between the opposing surface and the surface to be cleaned. The compressed gas is ejected from the ejection port by facing each other with a gap. The jetted compressed gas passes through a small gap between the opposed surface and the surface to be cleaned at a high speed, and blows off dust adhering to the surface to be cleaned. At this time, if the vacuum chamber is evacuated,
The dust removing effect can be enhanced, and the dust can be discharged out of the vacuum chamber.

【0008】[0008]

【実施例】以下本発明の実施例について図1ないし図2
を参照して説明する。ブロック10の上に防振体11を
介して定盤12が置かれている。定盤12上には、真空
室13を形成するハウジング14とプリチャンバ15が
設置されている。
1 and 2 show an embodiment of the present invention.
This will be described with reference to FIG. A surface plate 12 is placed on the block 10 via a vibration isolator 11. On the surface plate 12, a housing 14 forming a vacuum chamber 13 and a pre-chamber 15 are provided.

【0009】ハウジング14には第1ゲートバルブ16
を介してイオンポンプ17が接続されている。ハウジン
グ14内には、X,Y,θ移動及びZチルト可能なステ
ージ18が設けられ、ハウジング14の上部には描画用
の電子光学系19が取付けられている。ステージ18上
には静電チャック基板20が取付けられ、その上面20
Aにウェハ等の被描画材21を吸着するようになってい
る。上面20Aは、被描画材21を設置する基準面であ
り、被クリーニング面である。
A first gate valve 16 is provided in the housing 14.
The ion pump 17 is connected via the. A stage 18 capable of X, Y, θ movement and Z tilt is provided in the housing 14, and an electron optical system 19 for drawing is mounted on the upper part of the housing 14. An electrostatic chuck substrate 20 is mounted on the stage 18 and its upper surface 20
A is adapted to adsorb a workpiece 21 such as a wafer. The upper surface 20 </ b> A is a reference surface on which the drawing material 21 is placed, and is a cleaning surface.

【0010】ハウジング14とプリチャンバ15は、両
者の間で被描画材21を搬送するための第2ゲートバル
ブ22を介して接続され、プリチャンバ15には第3ゲ
ートバルブ23を介して真空用の粗引きポンプ24が接
続されている。
The housing 14 and the pre-chamber 15 are connected to each other via a second gate valve 22 for transporting the material 21 to be drawn, and the pre-chamber 15 is connected to the pre-chamber 15 via a third gate valve 23 for vacuum roughing. A pull pump 24 is connected.

【0011】真空室13内には、描画を妨げないように
片寄せられてクリーニングユニット30が取付られてい
る。クリーニングユニット30は、図2に拡大して示す
ように、上下に伸びるガイド手段31によって上下に移
動自在な対向板32を有している。対向板32は、被ク
リーニング面である静電チャック基板20の上面20A
と等しいか若干大きく形成されて上面20Aに対向する
対向面32Aを有している。
A cleaning unit 30 is mounted in the vacuum chamber 13 so as to be biased so as not to hinder drawing. The cleaning unit 30 has an opposing plate 32 that can be moved up and down by guide means 31 that extends up and down, as shown in an enlarged manner in FIG. 2. The opposing plate 32 has an upper surface 20A of the electrostatic chuck substrate 20 which is a surface to be cleaned.
And has a facing surface 32A facing the upper surface 20A.

【0012】対向面32Aは、被クリーニング面20A
が平面であるため、同様に平面に形成され、両者が対向
したとき、両者間の全域にほぼ一様な寸法のすき間を形
成するようになっている。
The opposing surface 32A is a surface to be cleaned 20A.
Is a plane, so that it is similarly formed in a plane, and when both are opposed to each other, a gap having substantially uniform dimensions is formed in the entire region between them.

【0013】対向板32には、図1に示すように、ハウ
ジング14の上部に取付けられた駆動装置33によって
上下動される軸34が連結され、駆動装置33によって
対向板32を所望の高さ位置へ移動させるようになって
いる。35はシール用のベローズである。
As shown in FIG. 1, a shaft 34, which is moved up and down by a driving device 33 mounted on the upper portion of the housing 14, is connected to the opposing plate 32, and the opposing plate 32 is moved to a desired height by the driving device 33. Move to the position. 35 is a bellows for sealing.

【0014】対向面32Aには、複数の噴射口36が開
口されている。これらの噴出口36は、対向板32中に
設けた流路37,対向板32とハウジング14との間に
設けたベーローズ38,ハウジング14中に設けた流路
39,ハウジング14に取付けられたバルブ40及び継
手41を介してN2 ガスボンベ等の図示しない圧縮気体
源に接続されている。
A plurality of injection ports 36 are formed in the facing surface 32A. These jet ports 36 are provided with a flow path 37 provided in the opposed plate 32, a bellows 38 provided between the opposed plate 32 and the housing 14, a flow path 39 provided in the housing 14, and a valve attached to the housing 14. It is connected to a compressed gas source (not shown) such as an N 2 gas cylinder via a joint 40 and a joint 41.

【0015】次いで本装置の作用について説明する。プ
リチャンバ15内に収容されている被描画材(図示せ
ず)を、第2ゲートバルブ22を通して図示しない搬送
装置により静電チャック基板20の上面20A上の所定
位置に設置して描画する。なお、静電チャック基板20
の上面20Aに対する被描画材21の搬出入と描画は、
本発明に直接関係がないため、詳しい説明は省略する。
Next, the operation of the present apparatus will be described. A material to be drawn (not shown) accommodated in the pre-chamber 15 is placed at a predetermined position on the upper surface 20 </ b> A of the electrostatic chuck substrate 20 and drawn by a transfer device (not shown) through the second gate valve 22. The electrostatic chuck substrate 20
The loading / unloading and drawing of the drawing material 21 with respect to the upper surface 20A of
The detailed description is omitted because it is not directly related to the present invention.

【0016】静電チャック基板20の上面20Aには被
描画材21の搬出入等によって塵埃が付着することがあ
る。そこで、定期的又は描画精度の低下等により、上面
20Aをクリーニングする。
Dust may adhere to the upper surface 20A of the electrostatic chuck substrate 20 due to the loading / unloading of the workpiece 21 or the like. Therefore, the upper surface 20A is cleaned periodically or due to a decrease in drawing accuracy.

【0017】上面20Aのクリーニングは、まず、ステ
ージ18を対向板32の下方に移動させ、次いで対向板
32を駆動装置33によって図2に示すように下降させ
て行う。
The upper surface 20A is cleaned by first moving the stage 18 below the opposing plate 32 and then lowering the opposing plate 32 by the driving device 33 as shown in FIG.

【0018】対向板32は、対向面32Aが静電チャッ
ク基板20の上面20Aに対し、0.1〜0.5mm程度
のわずかなすき間を有して対向する位置に位置決めされ
る。次いで、バルブ40を開いて噴出口36からクリー
ンなN2 ガス等の圧縮気体を噴出させる。この圧縮気体
の噴出により、上面20Aに付着した塵埃は吹き飛ばさ
れ、上面20Aが清浄になる。
The opposing plate 32 is positioned at a position where the opposing surface 32A faces the upper surface 20A of the electrostatic chuck substrate 20 with a slight gap of about 0.1 to 0.5 mm. Next, the valve 40 is opened and a compressed gas such as clean N 2 gas is ejected from the ejection port 36. Dust adhering to the upper surface 20A is blown off by the ejection of the compressed gas, and the upper surface 20A is cleaned.

【0019】上記上面20Aのクリーニングは、真空室
13内を真空状態にして行えば、圧縮気体の噴出及び両
面20A,32A間からの気体の流出がより高速化でき
るため、効果的であり、さらに第1ゲートバルブ16は
閉じ、第2,第3ゲートバルブ22,23を開いて粗引
きポンプ24により真空引きを行いつつクリーニングす
れば、吹き飛ばされた塵埃をそのまま排出することがで
きる。
The cleaning of the upper surface 20A is effective if the inside of the vacuum chamber 13 is evacuated, since the ejection of the compressed gas and the outflow of the gas from between the two surfaces 20A and 32A can be further accelerated. If the first gate valve 16 is closed, the second and third gate valves 22 and 23 are opened, and cleaning is performed while vacuuming is performed by the roughing pump 24, the blown dust can be discharged as it is.

【0020】なお、前述した噴出口36は、真空室13
を大気に戻すための気体供給用を兼ねるようにしてもよ
く、真空室13を大気に戻す際に、上記のようなクリー
ニングを行うようにしてもよい。
Incidentally, the above-mentioned jet port 36 is provided in the vacuum chamber 13.
May also serve as a gas supply for returning the vacuum chamber to the atmosphere. When the vacuum chamber 13 is returned to the atmosphere, the above-described cleaning may be performed.

【0021】前述した実施例は、本発明を電子ビーム描
画装置に適用した例を示したが、本発明は真空室内に被
クリーニング面を有する種々の真空装置に適用可能であ
る。
Although the above-described embodiment shows an example in which the present invention is applied to an electron beam drawing apparatus, the present invention is applicable to various vacuum apparatuses having a surface to be cleaned in a vacuum chamber.

【0022】[0022]

【発明の効果】以上述べたように本発明によれば、真空
室内の被クリーニング面を、真空室を開くことなく、簡
単にクリーニングすることができるため、被クリーニン
グ面を容易に清浄に保つことができる効果が得られる。
As described above, according to the present invention, the surface to be cleaned in the vacuum chamber can be easily cleaned without opening the vacuum chamber, so that the surface to be cleaned can be easily kept clean. The effect that can be obtained is obtained.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を適用した真空装置の一例を示す概要断
面図である。
FIG. 1 is a schematic sectional view showing an example of a vacuum apparatus to which the present invention is applied.

【図2】図1に示した装置のクリーニング状態を示す要
部拡大断面図である。
FIG. 2 is an enlarged sectional view of a main part showing a cleaning state of the apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

13 真空室 18 ステージ 20 静電チャック基板 20A 被クリーニング面 21 被描画材 30 クリーニングユニット 32 対向板 32A 対向面 33 駆動装置 35,38 ベローズ 36 噴出口 40 バルブ Reference Signs List 13 vacuum chamber 18 stage 20 electrostatic chuck substrate 20A cleaning target surface 21 drawing target material 30 cleaning unit 32 opposing plate 32A opposing surface 33 driving device 35, 38 bellows 36 ejection port 40 valve

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 真空室と、同真空室内に設けられた所定
形状の被クリーニング面と、を有する真空装置におい
て、前記被クリーニング面との相対移動により該被クリ
ーニング面にわずかなすき間を置いて対向可能な対向面
を有する対向板と、前記対向面に設けられた圧縮気体の
噴出口と、からなるクリーニングユニットを、前記真空
室内に設けたことを特徴とする真空装置。
In a vacuum apparatus having a vacuum chamber and a surface to be cleaned having a predetermined shape provided in the vacuum chamber, a slight gap is provided on the surface to be cleaned by relative movement with respect to the surface to be cleaned. A vacuum apparatus, comprising: a cleaning unit including an opposing plate having an opposing surface capable of opposing, and a compressed gas ejection port provided on the opposing surface, provided in the vacuum chamber.
【請求項2】 真空室を大気に戻す際、前記対向面を被
クリーニング面にわずかなすき間を置いて対向させ、前
記噴出口から圧縮気体を噴出させることを特徴とする請
求項1の真空装置の使用方法。
2. The vacuum apparatus according to claim 1, wherein when returning the vacuum chamber to the atmosphere, the opposed surface is opposed to the surface to be cleaned with a slight gap therebetween, and compressed gas is ejected from the ejection port. How to use
【請求項3】 前記対向面を前記被クリーニング面にわ
ずかなすき間を置いて対向させ、前記噴出口から圧縮気
体を噴出させると共に前記真空室を真空引きすることを
特徴とする請求項1の真空装置の使用方法。
3. The vacuum according to claim 1, wherein the opposed surface is opposed to the surface to be cleaned with a slight gap, and a compressed gas is ejected from the ejection port and the vacuum chamber is evacuated. How to use the device.
JP03144092A 1992-01-22 1992-01-22 Vacuum apparatus and method of using the same Expired - Fee Related JP3215984B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP03144092A JP3215984B2 (en) 1992-01-22 1992-01-22 Vacuum apparatus and method of using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP03144092A JP3215984B2 (en) 1992-01-22 1992-01-22 Vacuum apparatus and method of using the same

Publications (2)

Publication Number Publication Date
JPH05192556A JPH05192556A (en) 1993-08-03
JP3215984B2 true JP3215984B2 (en) 2001-10-09

Family

ID=12331305

Family Applications (1)

Application Number Title Priority Date Filing Date
JP03144092A Expired - Fee Related JP3215984B2 (en) 1992-01-22 1992-01-22 Vacuum apparatus and method of using the same

Country Status (1)

Country Link
JP (1) JP3215984B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010038780A1 (en) * 2008-09-30 2010-04-08 株式会社 ニコン Exposure apparatus, supporting apparatus, and device manufacturing method

Also Published As

Publication number Publication date
JPH05192556A (en) 1993-08-03

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