JP3187295B2 - Wire saw equipment - Google Patents
Wire saw equipmentInfo
- Publication number
- JP3187295B2 JP3187295B2 JP22396895A JP22396895A JP3187295B2 JP 3187295 B2 JP3187295 B2 JP 3187295B2 JP 22396895 A JP22396895 A JP 22396895A JP 22396895 A JP22396895 A JP 22396895A JP 3187295 B2 JP3187295 B2 JP 3187295B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- inclination
- work
- support member
- saw device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えば半導体材
料、磁性材料、セラミック等の脆性材料をワイヤにより
切断するワイヤソー装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw device for cutting a brittle material such as a semiconductor material, a magnetic material, and a ceramic with a wire.
【０００２】[0002]
【従来の技術】一般に、この種のワイヤソー装置におい
ては、複数の加工用ローラ間にワイヤが所定ピッチで螺
旋状に巻き付けられ、このワイヤが一方向または双方向
に走行されながら、そのワイヤ上に砥粒を含むスラリが
供給される。そして、この状態でワイヤに対してワーク
が押し付けられて、ワークが結晶方位に沿って、あるい
は結晶方位に対して所定角度でスライス状に切断加工さ
れる。2. Description of the Related Art In a wire saw apparatus of this type, generally, a wire is spirally wound at a predetermined pitch between a plurality of processing rollers, and the wire is run on the wire while traveling unidirectionally or bidirectionally. A slurry containing abrasive grains is provided. Then, in this state, the work is pressed against the wire, and the work is cut into slices along the crystal orientation or at a predetermined angle with respect to the crystal orientation.
【０００３】従って、切断加工の開始に際しては、ワイ
ヤの延びる方向とワークの結晶方位とを所定の位置関係
に設定する必要がある。Therefore, at the start of cutting, it is necessary to set the direction in which the wire extends and the crystal orientation of the work in a predetermined positional relationship.
【０００４】[0004]
【発明が解決しようとする課題】ところが、従来は、方
位合わせが手作業のみによって行われているため、その
方位合わせを正確に行うためには、熟練と勘を要するも
のであった。 このため、特開昭６０ー１９７３６１号
公報においては、コリメータによりワークの結晶方位角
を検出するようにした技術が開示されている。しかしな
がら、この公報においては、ワークの端面に方位角検出
用の反射鏡を貼付したり、ワイヤ上にワイヤ走行方向を
探るためのゲージをセットしたりする手間がかかるもの
であった。However, conventionally, since the azimuth alignment is performed only by manual work, skill and intuition are required to accurately perform the azimuth alignment. For this reason, Japanese Patent Application Laid-Open No. 60-197361 discloses a technique in which a crystal azimuth of a work is detected by a collimator. However, in this publication, it has been troublesome to attach a reflecting mirror for detecting an azimuth angle to an end face of a work, or to set a gauge on a wire for searching a wire traveling direction.
【０００５】この発明は、このような従来の技術に存在
する問題点に着目してなされたものである。その目的と
するところは、ワークをワイヤに対して方位合わせする
際、熟練を要することなく短時間に作業することができ
るとともに、方位合わせを正確に行うことができるワイ
ヤソー装置を提供することにある。[0005] The present invention has been made by paying attention to such problems existing in the prior art. An object of the present invention is to provide a wire saw device that can perform work in a short time without skill when aligning a workpiece with a wire, and that can accurately perform orientation adjustment. .
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
めに、請求項１に記載の発明では、ワイヤの走行方向と
ワークの結晶方位との位置関係の調整のために、前記支
持部材に設けた測定面と、ワイヤの延びる方向を１箇所
で非接触にて検出するための第１の検出手段と、ワイヤ
の延びる方向に対する前記支持部材の少なくとも水平面
内における傾きを前記測定面を介して非接触にて検出す
るための第２の検出手段と、支持部材の少なくとも水平
面内における傾き角度を調整するための調整手段とを設
けるとともに、第２の検出手段はワイヤの走行方向に移
動可能であり、支持部材の測定面における水平方向の傾
き測定面上の２箇所に対応するように移動して、測定面
の位置を測定し、支持部材の水平面内におけるワイヤの
延びる方向に対する傾きを検出するように構成したもの
である。In order to achieve the above object, according to the first aspect of the present invention, the support for adjusting the positional relationship between the traveling direction of the wire and the crystal orientation of the work is provided.
The measurement surface provided on the holding member and the direction in which the wire extends
First detecting means for detecting in a non-contact manner at least , and at least a horizontal plane of the supporting member in a direction in which the wire extends.
A second detecting means for detecting the tilt in a non-contact through the measurement surface of the inner, at least the horizontal support member
Adjusting means and the setting <br/> only Rutotomoni for adjusting the inclination angle in the plane, the second detection means moves in the running direction of the wire
Movable and can be tilted horizontally on the measuring surface of the support member.
Move to correspond to two points on the measurement surface
Of the wire in the horizontal plane of the support member
It is configured to detect a tilt with respect to the extending direction .
【０００７】従って、ワークをワイヤに対して方位合わ
せする際には、第１の検出装置により、ワイヤの延びる
方向が検出される。次いで、ワイヤの延びる方向に対し
て、支持部材の傾きが検出される。そして、その検出結
果により必要に応じて支持部材の傾き角度が調節され
る。Therefore, when the work is oriented to the wire, the direction in which the wire extends is detected by the first detection device. Next, the inclination of the support member with respect to the direction in which the wire extends is detected. Then, the tilt angle of the support member is adjusted as necessary based on the detection result.
【０００８】請求項２に記載の発明では、請求項１にお
いて、第１の検出手段の検出結果に基づいて、ワイヤの
延びる方向に対する第２の検出手段の水平面内における
傾きを調節するための調節手段を有し、第２の検出手段
は前記調節手段によって調節された第２の検出手段自身
の傾きに基づいて支持部材の傾きを検出するものであ
る。[0008] According to the second aspect of the present invention, in the first aspect, the inclination of the second detecting means in the horizontal plane with respect to the extending direction of the wire is adjusted based on the detection result of the first detecting means. The second detecting means detects the inclination of the support member based on the inclination of the second detecting means itself adjusted by the adjusting means .
【０００９】従って、第１の検出手段の検出結果に応じ
て第２の検出手段の傾き角度が調節され、その第２の検
出手段の角度を基準にして支持部材の傾き角度が検出さ
れる。Therefore, the inclination angle of the second detection means is adjusted according to the detection result of the first detection means, and the inclination angle of the support member is detected based on the angle of the second detection means.
【００１０】請求項３に記載の発明においては、請求項
１または２において、第１の検出手段は、対物窓と接眼
窓とを備えて対物窓から取り込まれたワイヤの画像が接
眼窓に基準線とともに投影されるように構成したもので
ある。 According to a third aspect of the present invention, in the first or second aspect, the first detecting means includes an objective window and an eyepiece.
The image of the wire captured from the objective window
It is configured to be projected with a reference line on the eye window
is there.
【００１１】従って、ワイヤの延びる方向がワイヤに接
触することなく検出される。請求項４に記載の発明にお
いては、請求項１〜３のいずれかにおいて、第１の検出
手段は、レーザ光を用いて検出するものである。 Therefore, the direction in which the wire extends can be detected without contacting the wire. According to a fourth aspect of the present invention, in the first aspect , the first detection is performed.
The means is for detecting using a laser beam.
【００１２】従って、水平面内においてワークの方位合
わせを行うことができる。請求項５に記載の発明におい
ては、請求項１〜４のいずれかにおいて、調整手段は支
持部材の垂直面内における傾きを調整可能とし、第２の
検出手段は、支持部材の垂直面内における傾きを前記測
定面を介して非接触で検出するものである。Therefore, the orientation of the work can be adjusted in the horizontal plane. According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the adjusting means is a support.
To allow adjusting the inclination in the vertical plane of the support member, the second detecting means, measuring the inclination in the vertical plane of the support member
Non-contact detection is performed via the fixed surface .
【００１３】従って、垂直面内においてワークの方位合
わせを行うことができる。請求項６に記載の発明におい
ては、請求項５において、第２の検出手段は上下方向に
移動可能であり、支持部材の測定面における垂直方向の
傾き測定面上の２箇所に対応するように移動して測定面
の位置を測定し、支持部材の垂直面内における傾きを検
出するものである。Therefore, the orientation of the work can be adjusted in the vertical plane. According to a sixth aspect of the present invention, in the fifth aspect, the second detecting means is provided in a vertical direction.
It is movable and the vertical
Move to correspond to two points on the tilt measurement surface
Position of the support member and check the inclination of the support member in the vertical plane.
It will be issued.
【００１４】従って、支持部材の検出に際して、測定面
に接触する必要がない。Therefore, there is no need to contact the measurement surface when detecting the support member.
【００１５】[0015]
【発明の実施の形態】以下、この発明の一実施形態を、
図面に基づいて詳細に説明する。図１及び図２に示すよ
うに、切断機構１１はフレーム１２上に装設されてい
る。この切断機構１１は所定間隔をおいて平行に延びる
３本の加工用ローラ１３を備え、それらの外周には多数
の環状溝１３ａが所定ピッチで形成されている。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, one embodiment of the present invention will be described.
This will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, the cutting mechanism 11 is mounted on a frame 12. The cutting mechanism 11 includes three processing rollers 13 extending in parallel at a predetermined interval, and a number of annular grooves 13a are formed on the outer periphery thereof at a predetermined pitch.
【００１６】鋼線よりなる１本の切断用ワイヤ１４は前
記加工用ローラ１３の各環状溝１３ａに連続的に巻回さ
れている。そして、図示しないモータにより、加工用ロ
ーラ１３が回転されて、ワイヤ１４が一方向または双方
向に所定の走行速度で走行される。One cutting wire 14 made of a steel wire is continuously wound around each annular groove 13 a of the processing roller 13. Then, the processing roller 13 is rotated by a motor (not shown), and the wire 14 travels in one direction or both directions at a predetermined traveling speed.
【００１７】ワーク支持機構１６は前記切断機構１１の
上方において、フレーム１２に装設されている。この切
断機構１６のサドル１７はフレーム１２の上部前面にレ
ール１８を介して昇降可能に支持され、その前面には取
付基板１９が突設されている。支持部材としての支持板
２０は取付基板１９の下面に、第１支軸２１を介して水
平面内で回動可能に、かつ第２支軸２２を介して垂直面
内で回動可能に取り付けられている。取付ブロック２３
は取付基板１９の下部に突設され、その下面にはワーク
２４が接着固定される。The work supporting mechanism 16 is mounted on the frame 12 above the cutting mechanism 11. The saddle 17 of the cutting mechanism 16 is supported on the upper front surface of the frame 12 via a rail 18 so as to be able to move up and down, and a mounting board 19 is protruded from the front surface. A support plate 20 as a support member is attached to the lower surface of the mounting board 19 so as to be rotatable in a horizontal plane via a first support shaft 21 and rotatable in a vertical plane via a second support shaft 22. ing. Mounting block 23
Is protruded from the lower portion of the mounting substrate 19, and a work 24 is bonded and fixed to the lower surface thereof.
【００１８】測定面２５は前記支持板２０の端面に形成
され、水平方向の傾き測定面２５ａ（以下、水平測定面
という）と、垂直方向の傾き測定面２５ｂ（以下垂直測
定面という）とを備えている。水平調節ネジ２６は取付
基板１９の後面に螺合され、この水平調節ネジ２６を回
動させることにより、支持板２０を水平面内で回動させ
て、ワーク２４の水平方向の傾きを変更することができ
る。垂直調節ネジ２７は取付基板１９の上面に螺合さ
れ、この垂直調節ネジ２７を回動させることにより、支
持板２０を垂直面内で回動させて、ワーク２４の垂直方
向の傾きを変更することができる。The measuring surface 25 is formed on the end face of the support plate 20, and includes a horizontal tilt measuring surface 25a (hereinafter, referred to as a horizontal measuring surface) and a vertical tilt measuring surface 25b (hereinafter, referred to as a vertical measuring surface). Have. The horizontal adjustment screw 26 is screwed to the rear surface of the mounting board 19. By rotating the horizontal adjustment screw 26, the support plate 20 is rotated in a horizontal plane to change the horizontal inclination of the work 24. Can be. The vertical adjustment screw 27 is screwed onto the upper surface of the mounting board 19. By rotating the vertical adjustment screw 27, the support plate 20 is rotated in the vertical plane, and the inclination of the work 24 in the vertical direction is changed. be able to.
【００１９】そして、このワイヤソー装置の運転時に
は、ワイヤ１４が切断機構１１の加工用ローラ１３間で
一方向または双方向に走行されながら、ワーク支持機構
１６が切断機構１１に向かって下降される。このとき、
スラリ供給装置１５からワイヤ１４とワーク２４との間
に砥粒を含むスラリが供給されるとともに、そのワイヤ
１４に対しワーク２４が押し付けられ、ラッピング作用
によってワーク２４がスライス加工される。During the operation of the wire saw device, the work supporting mechanism 16 is lowered toward the cutting mechanism 11 while the wire 14 travels in one direction or two directions between the processing rollers 13 of the cutting mechanism 11. At this time,
A slurry containing abrasive grains is supplied between the wire 14 and the work 24 from the slurry supply device 15, and the work 24 is pressed against the wire 14, and the work 24 is sliced by a lapping action.
【００２０】図１に示すように、取付台２８は一対のネ
ジ２９により前記フレーム１２に固定され、その上面に
は調節手段としての調節装置３０及び検出装置３１が装
着されている。調節装置３０は、水平面内において回動
可能及びワイヤ１４の走行方向へ移動可能な第１ガイド
板３３と、上下方向へ移動可能な第２ガイド板３４と、
第１ガイド板３３の移動方向と直交する方向へ移動可能
な第３ガイド板３５を有している。第１の検出手段とし
てのツールスコープ３２は第３ガイド板３５上に設置さ
れている。As shown in FIG. 1, the mounting base 28 is fixed to the frame 12 by a pair of screws 29, and an adjusting device 30 and a detecting device 31 as adjusting means are mounted on the upper surface thereof. The adjusting device 30 includes a first guide plate 33 rotatable in a horizontal plane and movable in a traveling direction of the wire 14, a second guide plate 34 movable in a vertical direction,
It has a third guide plate 35 movable in a direction orthogonal to the direction of movement of the first guide plate 33. The tool scope 32 as a first detecting means is installed on the third guide plate 35.
【００２１】また、このツールスコープ３２は、本体３
２ａと、ワイヤ１４の直下に近接配置される対物窓３２
ｂと、接眼窓３２ｃとを備えている。そして、図３
（ａ）及び図３（ｂ）に示すように、対物窓３２ｂから
取り込まれたワイヤ１４の画像が接眼窓３２ｃに基準線
Ｌ１とともに投影されるようになっている。The tool scope 32 has a main body 3
2a and an objective window 32 disposed immediately below the wire 14
b and an eyepiece window 32c. And FIG.
As shown in (a) and FIG. 3 (b), the image of the wire 14 captured from the objective window 32b is projected onto the eyepiece window 32c together with the reference line L1.
【００２２】第２の検出手段としての非接触センサ３６
は前記支持板２０の測定面２５と対向するように、ブラ
ケット３７を介してツールスコープ３２の本体３２ａに
取り付けられている。そして、図４に示すように、この
非接触センサ３６により、測定面２５上の水平方向及び
垂直方向へ異なった３箇所Ｐ１，Ｐ２，Ｐ３において、
それらの位置が検出される。Non-contact sensor 36 as second detecting means
Is attached to the main body 32a of the tool scope 32 via a bracket 37 so as to face the measurement surface 25 of the support plate 20. Then, as shown in FIG. 4, the non-contact sensor 36 causes three different points P1, P2, and P3 in the horizontal and vertical directions on the measurement surface 25,
Their positions are detected.
【００２３】表示装置３８はコード３９により前記非接
触センサ３６に接続され、その前面にはワーク２４の傾
き量を表示するための表示部３８ａ，３８ｂが配置され
ている。そして、この表示装置３８は、非接触センサ３
６から検出信号を入力したとき、測定面２５ａ上の２箇
所Ｐ１，Ｐ２の検出信号に基づき、ワーク２４の水平方
向の傾き量を算出して、表示部３８ａに表示する。ま
た、表示装置３８は、測定面２５ｂ上の２箇所Ｐ１，Ｐ
３の検出信号に基づき、ワーク２４の垂直方向の傾き量
を算出して、表示部３８ｂに表示する。The display device 38 is connected to the non-contact sensor 36 by a cord 39, and display portions 38a and 38b for displaying the amount of inclination of the work 24 are arranged on the front surface thereof. The display device 38 is provided with the non-contact sensor 3
When a detection signal is input from the position 6, the inclination amount of the work 24 in the horizontal direction is calculated based on the detection signals at the two points P1 and P2 on the measurement surface 25a and displayed on the display unit 38a. In addition, the display device 38 has two positions P1 and P2 on the measurement surface 25b.
The tilt amount of the work 24 in the vertical direction is calculated based on the detection signal of No. 3 and displayed on the display unit 38b.
【００２４】次に、前記のように構成されたワイヤソー
装置について動作を説明する。さて、ワーク２４の外面
には、例えばワーク端面を基準にした結晶方位角を表す
表示が付されている。この表示は、ワーク２４の製造段
階で付される。そして、この表示にあわせて、ワーク２
４が支持板２０に対して所要の位置関係をもってセット
される。従って、支持板２０とワイヤ１４との位置関係
を設定すれば、ワイヤ１４に対するワーク２４の方位合
わせを行うことができる。Next, the operation of the wire saw device configured as described above will be described. On the outer surface of the work 24, for example, a display indicating a crystal azimuth based on the end face of the work is given. This indication is given at the stage of manufacturing the work 24. And, according to this display, work 2
4 is set with a required positional relationship with respect to the support plate 20. Therefore, if the positional relationship between the support plate 20 and the wire 14 is set, the orientation of the work 24 with respect to the wire 14 can be adjusted.
【００２５】そこで、ワーク２４をワーク支持機構１６
の支持板２０に取り付けた状態で、そのワーク２４をワ
イヤ１４に対して方位合わせする際には、まず調節装置
３０により、検出装置３１をワイヤ１４に対して所定位
置に調節設定する。すなわち、ツールスコープ３２の監
視窓３２ｃを覗くと、その監視窓３２ｃには、例えば図
３（ａ）及び図３（ｂ）に示すように、端縁のワイヤ１
４が基準線Ｌ１とともに投影される。この投影されたワ
イヤ１４を基準線Ｌ１と一致させるように、あるいは所
定角度をなすように第１ガイド板３３を回動させ、また
は第３ガイド板３５を移動させると、検出装置３１の非
接触センサ３６がワイヤ１４の延びる方向に対して所定
位置関係に設定される。Therefore, the work 24 is moved to the work support mechanism 16.
When the work 24 is oriented with respect to the wire 14 in a state where the work 24 is attached to the support plate 20, first, the detecting device 31 is adjusted and set to a predetermined position with respect to the wire 14 by the adjusting device 30. That is, when looking into the monitoring window 32c of the tool scope 32, the monitoring window 32c has an edge wire 1 as shown in FIGS. 3A and 3B, for example.
4 is projected together with the reference line L1. When the first guide plate 33 is rotated or the third guide plate 35 is moved so that the projected wire 14 matches the reference line L1 or forms a predetermined angle, the non-contact of the detection device 31 is prevented. The sensor 36 is set in a predetermined positional relationship with respect to the direction in which the wire 14 extends.
【００２６】この状態で、図４に示すように、非接触セ
ンサ３６を支持板２０の測定面２５上において、検出箇
所Ｐ１に対応させ、その検出箇所Ｐ１の位置を検出す
る。次に、第１ガイド板３３を移動させて、非接触セン
サ３６を測定面２５上の検出箇所Ｐ２に対応させ、その
検出箇所Ｐ２の位置を検出する。さらに、第１ガイド板
３３及び第２ガイド板３４を移動させて、非接触センサ
３６を測定面２５上の検出箇所Ｐ３に対応させ、その検
出箇所Ｐ３の位置を検出する。In this state, as shown in FIG. 4, the non-contact sensor 36 is made to correspond to the detection point P1 on the measurement surface 25 of the support plate 20, and the position of the detection point P1 is detected. Next, the first guide plate 33 is moved so that the non-contact sensor 36 corresponds to the detection point P2 on the measurement surface 25, and the position of the detection point P2 is detected. Further, the first guide plate 33 and the second guide plate 34 are moved so that the non-contact sensor 36 corresponds to the detection point P3 on the measurement surface 25, and the position of the detection point P3 is detected.
【００２７】すると、表示装置３８では、支持板２０の
水平方向の傾き量が測定面２５ａ上の２箇所Ｐ１，Ｐ２
の検出信号に基づいて算出され、表示部３８ａに表示さ
れる。また、支持板２０の垂直方向の傾き量が測定面２
５ｂ上の２箇所Ｐ１，Ｐ３の検出信号に基づいて算出さ
れ、表示部３８ｂに表示される。Then, in the display device 38, the horizontal inclination amount of the support plate 20 is changed to two positions P1, P2 on the measurement surface 25a.
Is calculated on the basis of the detection signal, and is displayed on the display unit 38a. Further, the amount of tilt of the support plate 20 in the vertical direction is
It is calculated based on the detection signals at two points P1 and P3 on 5b and displayed on the display unit 38b.
【００２８】その後、この表示装置３８の表示部３８ａ
に表示された水平方向の傾き量に応じて、ワーク支持機
構１６の水平調節ネジ２６を回動調節すると、支持板２
０が水平面内で回動されて、ワーク２４の水平方向の傾
きが変更される。また、表示部３８ｂに表示された垂直
方向の傾き量に応じて、垂直調節ネジ２７を回動調節す
ると、支持板２０が垂直面内で回動されて、ワーク２４
の垂直方向の傾きが変更される。そのため、この表示装
置３８の表示部３８ａ，３８ｂを監視しながら、調節つ
まみ２６，２７を回動させ、ワーク２４の結晶方位を水
平方向及び垂直方向において、ワイヤ１４の延びる方向
に対して調整することができる。Thereafter, the display unit 38a of the display device 38
When the horizontal adjustment screw 26 of the work support mechanism 16 is rotationally adjusted in accordance with the horizontal inclination amount displayed on the
0 is rotated in the horizontal plane, and the inclination of the work 24 in the horizontal direction is changed. When the vertical adjustment screw 27 is rotationally adjusted in accordance with the vertical tilt amount displayed on the display section 38b, the support plate 20 is rotated in a vertical plane, and the work 24 is rotated.
Is changed in the vertical direction. Therefore, while monitoring the display portions 38a and 38b of the display device 38, the adjustment knobs 26 and 27 are rotated to adjust the crystal orientation of the work 24 in the horizontal and vertical directions with respect to the extending direction of the wire 14. be able to.
【００２９】このワイヤソー装置は以上のように構成さ
れているため、以下のような利点を有する。 (1) ツールスコープ３２によりワイヤ２４の延びる方向
を検出するとともに、その検出結果に応じて非接触セン
サ３６により測定面２５ａの傾きが検出されるため、熟
練や勘を要することなく、容易にかつ正確に方位合わせ
することができる。 (2) ワイヤ２４の延びる方向がツールスコープ３２によ
り光学的に検出されるため、その検出を正確かつ簡単に
行うことができるばかりでなく、ワイヤ２４の走行中に
おいても検出が可能になる。 (3) 測定面２５ａの傾きの測定が非接触センサ３６によ
り非接触で行われるため、測定面２５ａに傷がついた
り、支持板２０が不本意に動いたりしない。また、測定
面２５ａ上のゴミの影響も受けにくい。 (4) ワーク２４の傾きの検出が水平方向及び垂直方向の
両方向で行われるため、水平、垂直方向の方位合わせを
行うことができる。 (5) 検出装置３１の検出に先立って、予め調節装置３０
により、検出装置３１をワイヤ１４に対し所定位置に調
節設定できるため、検出装置３１の検出精度を向上させ
ることができる。Since this wire saw device is configured as described above, it has the following advantages. (1) The direction in which the wire 24 extends is detected by the tool scope 32, and the inclination of the measurement surface 25a is detected by the non-contact sensor 36 according to the detection result. The orientation can be accurately adjusted. (2) Since the extending direction of the wire 24 is optically detected by the tool scope 32, the detection can not only be performed accurately and easily, but also can be performed while the wire 24 is running. (3) Since the measurement of the inclination of the measurement surface 25a is performed in a non-contact manner by the non-contact sensor 36, the measurement surface 25a is not damaged and the support plate 20 does not move unintentionally. In addition, it is hardly affected by dust on the measurement surface 25a. (4) Since the detection of the inclination of the work 24 is performed in both the horizontal direction and the vertical direction, the azimuth alignment in the horizontal and vertical directions can be performed. (5) Prior to detection by the detection device 31, the adjusting device 30
Accordingly, the detection device 31 can be adjusted and set to a predetermined position with respect to the wire 14, so that the detection accuracy of the detection device 31 can be improved.
【００３０】なお、この発明は以下のような形態でも実
施できる。 （１）ワイヤ１４の延びる方向の検出をレーザ光を用い
て行うこと。すなわち、ワイヤ１４の延びる方向におけ
る異なる複数位置でワイヤ１４の延びる方向と交差する
ようにレーザ光をスキャンさせ、スキャンされたレーザ
光がワイヤ１４により遮られるタイミングまたは位置の
データに基づいてワイヤ１４の延びる方向を検出するこ
と。 （２）検出装置３１における非接触センサ３６に代えて
接触型センサを使用すること。 （３）ワーク支持機構１６の調節ネジ２６，２７に代え
てサーボモータを設け、そのサーボモータの回転により
支持板２０を水平面内及び垂直面内で回動させて、ワー
ク２４の傾きを測定ダータに基づき自動的に変更するよ
うに構成すること。The present invention can be implemented in the following modes. (1) The direction in which the wire 14 extends is detected using laser light. That is, the laser light is scanned at a plurality of different positions in the extending direction of the wire 14 so as to intersect with the extending direction of the wire 14, and the scanned laser light is interrupted by the wire 14 based on the data of the timing or position. To detect the direction of extension. (2) A contact-type sensor is used instead of the non-contact sensor 36 in the detection device 31. (3) Servo motors are provided in place of the adjusting screws 26 and 27 of the work support mechanism 16, and the support plate 20 is rotated in a horizontal plane and a vertical plane by the rotation of the servo motors to measure the inclination of the work 24. Be configured to change automatically based on
【００３１】[0031]
【発明の効果】この発明は、以上のように構成されてい
るため、次のような効果を奏する。請求項１に記載の発
明によれば、ワークをワイヤに対して方位合わせする
際、熟練や勘を要することなく短時間に作業することが
できるとともに、方位合わせを正確に行うことができ
る。The present invention is configured as described above, and has the following effects. According to the first aspect of the present invention, when the work is oriented with respect to the wire, the work can be performed in a short time without skill or intuition, and the orientation can be accurately adjusted.
【００３２】請求項２に記載の発明では、第１の検出手
段の検出に先立って、予め調節手段により、第１の検出
手段をワイヤに対し所定位置に調節設定できるため、検
出精度向上させることができる。According to the second aspect of the present invention, prior to the detection by the first detecting means, the first detecting means can be adjusted and set to a predetermined position with respect to the wire by the adjusting means in advance, thereby improving the detection accuracy. Can be.
【００３３】請求項３に記載の発明においては、ワイヤ
の延びる方向を光学的に検出するため、その検出を正確
かつ容易に、しかもワイヤの走行中であっても行うこと
ができる。According to the third aspect of the present invention, since the direction in which the wire extends is optically detected, the detection can be performed accurately and easily, and even while the wire is running.
【００３４】請求項４に記載の発明においては、第２の
検出手段は、ワークの水平方向の方位合わせ容易に行う
ことができる。請求項５に記載の発明においては、ワー
クの垂直方向の方位合わせを容易に行うことができる。According to the fourth aspect of the present invention, the second detecting means can easily adjust the horizontal orientation of the work. According to the fifth aspect of the present invention, it is possible to easily align the orientation of the work in the vertical direction.
【００３５】請求項６に記載の発明においては、測定面
の傾きを非接触で検出できるため、測定面に傷が付いた
りするのを防止でき、また測定器に機械的構造をもたな
いため誤差の発生が少ない。According to the sixth aspect of the present invention, since the inclination of the measurement surface can be detected in a non-contact manner, the measurement surface can be prevented from being damaged, and the measuring device has no mechanical structure. There are few errors.
【図１】 この発明のワイヤソー装置の一実施形態を示
す要部斜視図。FIG. 1 is an essential part perspective view showing one embodiment of a wire saw device of the present invention.
【図２】 そのワイヤソー装置の全体を示す斜視図。FIG. 2 is a perspective view showing the entire wire saw device.
【図３】 設定装置によりワイヤの相対位置を測定する
状態を示す説明図。FIG. 3 is an explanatory diagram showing a state in which a relative position of a wire is measured by a setting device.
【図４】 検出装置により支持部材の端面を検出する状
態を示す説明図。FIG. 4 is an explanatory diagram showing a state where an end surface of a support member is detected by a detection device.
１１…切断機構、１２…フレーム、１３…加工用ロー
ラ、１４…ワイヤ、１５…スラリ供給パイプ、１６…ワ
ーク支持機構、１９…取付基板、２０…支持部材として
の支持板、２４…ワーク、２５…測定面、２５ａ…水平
方向の傾き測定面、２５ｂ…垂直方向の傾き測定面、２
６…水平調節ネジ、２７…垂直調節ネジ、３０…設定装
置、３１…検出装置、３２…ツールスコープ、３６…非
接触センサ、３８…表示装置、Ｐ１，Ｐ２，Ｐ３…検出
位置。DESCRIPTION OF SYMBOLS 11 ... Cutting mechanism, 12 ... Frame, 13 ... Processing roller, 14 ... Wire, 15 ... Slurry supply pipe, 16 ... Work support mechanism, 19 ... Mounting board, 20 ... Support plate as a support member, 24 ... Work, 25 ... Measurement surface, 25a ... Horizontal tilt measurement surface, 25b ... Vertical tilt measurement surface, 2
6 horizontal adjustment screw, 27 vertical adjustment screw, 30 setting device, 31 detection device, 32 tool scope, 36 non-contact sensor, 38 display device, P1, P2, P3 detection position.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭63−312057（ＪＰ，Ａ) 特開 平３−161264（ＪＰ，Ａ) 特開 平３−10760（ＪＰ，Ａ) 特開 昭60−197361（ＪＰ，Ａ) 実開 平４−68523（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) B28D 5/04 B24B 27/06 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-312057 (JP, A) JP-A-3-161264 (JP, A) JP-A-3-10760 (JP, A) JP-A-60-1985 197361 (JP, A) Japanese Utility Model Hei 4-68523 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) B28D 5/04 B24B 27/06
Claims (6)
用ローラ間に螺旋状に巻き付けられたワイヤを一方向ま
たは双方向に走行させ、前記支持部材とワイヤとの相対
移動によりワークをワイヤに押し付けるとともに、ワー
クとワイヤとの間に砥粒を含むスラリーを供給して、そ
のワークを切断するようにしたワイヤソー装置におい
て、 前記ワイヤの走行方向とワークの結晶方位との位置関係
の調整のために、前記支持部材に設けた測定面と、ワイ
ヤの延びる方向を１箇所で非接触にて検出するための第
１の検出手段と、ワイヤの延びる方向に対する前記支持
部材の少なくとも水平面内における傾きを前記測定面を
介して非接触にて検出するための第２の検出手段と、支
持部材の少なくとも水平面内における傾き角度を調整す
るための調整手段とを設けるとともに、第２の検出手段
はワイヤの走行方向に移動可能であり、支持部材の測定
面における水平方向の傾き測定面上の２箇所に対応する
ように移動して、測定面の位置を測定し、支持部材の水
平面内におけるワイヤの延びる方向に対する傾きを検出
するように構成したワイヤソー装置。A work is supported on a support member, and a wire spirally wound between a plurality of processing rollers is moved in one direction or two directions, and the work is moved by relative movement between the support member and the wire. In a wire saw device configured to supply a slurry containing abrasive grains between a work and a wire and cut the work, the adjustment of the positional relationship between the traveling direction of the wire and the crystal orientation of the work is performed. A measuring surface provided on the supporting member, first detecting means for detecting the direction in which the wire extends in one place in a non-contact manner, and an inclination of the supporting member in at least a horizontal plane with respect to the extending direction of the wire. The measurement surface
A second detecting means for detecting in a non-contact via, Rutotomoni provided an adjusting means for adjusting the inclination angle in at least the horizontal plane of the support member, second detecting means
Is movable in the running direction of the wire,
Corresponding to two points on the measurement plane in the horizontal direction
To measure the position of the measurement surface, and
Detects the inclination of the wire in the plane in the extending direction
A wire saw device configured to do so .
ワイヤの延びる方向に対する第２の検出手段の水平面内
における傾きを調節するための調節手段を有し、第２の
検出手段は前記調節手段によって調節された第２の検出
手段自身の傾きに基づいて支持部材の傾きを検出する請
求項１に記載のワイヤソー装置。2. Based on a detection result of the first detecting means,
In the horizontal plane of the second detection means with respect to the direction in which the wire extends
Comprises an adjustment means for adjusting the inclination of the second detection the second detection means which is adjusted by said adjusting means
The wire saw device according to claim 1, wherein the inclination of the support member is detected based on the inclination of the means itself.
備えて対物窓から取り込まれたワイヤの画像が接眼窓に
基準線とともに投影されるように構成した請求項１また
は２に記載のワイヤソー装置。3. The first detecting means includes an object window and an eyepiece window.
Image of the wire captured from the objective window
The wire saw device according to claim 1, wherein the wire saw device is configured to be projected together with a reference line .
出するものである請求項１〜３のいずれかに記載のワイ
ヤソー装置。4. The first detecting means detects by using a laser beam.
The wire saw device according to any one of claims 1 to 3 is intended to appear.
傾きを調整可能とし、第２の検出手段は、支持部材の垂
直面内における傾きを前記測定面を介して非接触で検出
する請求項１〜４のいずれかに記載のワイヤソー装置。5. The adjusting means is provided in a vertical plane of the support member.
The wire saw device according to any one of claims 1 to 4, wherein the inclination is adjustable, and the second detection means detects the inclination of the support member in a vertical plane in a non-contact manner through the measurement surface .
あり、支持部材の測定面における垂直方向の傾き測定面
上の２箇所に対応するように移動して測定面 の位置を測
定し、支持部材の垂直面内における傾きを検出する請求
項５に記載のワイヤソー装置。6. The second detecting means is vertically movable.
Yes, the vertical tilt measurement surface on the measurement surface of the support member
Move to correspond to the above two points and measure the position of the measurement surface.
To detect the inclination of the support member in the vertical plane
Item 6. The wire saw device according to item 5 .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22396895A JP3187295B2 (en) | 1995-08-31 | 1995-08-31 | Wire saw equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22396895A JP3187295B2 (en) | 1995-08-31 | 1995-08-31 | Wire saw equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0966520A JPH0966520A (en) | 1997-03-11 |
| JP3187295B2 true JP3187295B2 (en) | 2001-07-11 |
Family
ID=16806511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22396895A Expired - Fee Related JP3187295B2 (en) | 1995-08-31 | 1995-08-31 | Wire saw equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3187295B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| CN1296896C (en) * | 1998-11-11 | 2007-01-24 | Tdk株式会社 | Magnetic head device |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH690907A5 (en) * | 1996-05-23 | 2001-02-28 | Hct Shaping Systems Sa | Wire sawing device |
| JP4658863B2 (en) * | 2006-06-01 | 2011-03-23 | シャープ株式会社 | Work slice processing method and wire saw |
| JP5179320B2 (en) * | 2008-11-06 | 2013-04-10 | 株式会社小野測器 | Vehicle fixing device |
| JP2010207978A (en) * | 2009-03-11 | 2010-09-24 | Sumitomo Metal Mining Co Ltd | Method of positioning cutting wire and workpiece, and wire saw with positioning angle detection device using the method |
| JP5016122B1 (en) * | 2011-03-07 | 2012-09-05 | コマツＮｔｃ株式会社 | Measuring jig, wire saw, and workpiece mounting method |
| CN103448155B (en) * | 2013-08-21 | 2015-04-08 | 常州贝斯塔德机械科技有限公司 | Angle regulation system used for slicer |
| CN104786379B (en) * | 2015-04-09 | 2017-07-25 | 中国电子科技集团公司第四十五研究所 | Multi-wire saw component erecting bed angle regulator |
| CN111844494A (en) * | 2020-07-16 | 2020-10-30 | 广东先导先进材料股份有限公司 | Crystal bar position calibration device and use method thereof |
-
1995
- 1995-08-31 JP JP22396895A patent/JP3187295B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6437944B2 (en) | 1997-10-20 | 2002-08-20 | Fujitsu Limited | Head slider supporting device, disk device and suspension |
| US6583962B2 (en) | 1997-10-20 | 2003-06-24 | Fujitsu Limited | Head slider supporting device, disk device and suspension having thermal protection for head IC chip |
| US6266213B1 (en) | 1998-03-20 | 2001-07-24 | Fujitsu Limited | Suspension having an IC chip and a head slider on opposite surfaces |
| CN1296896C (en) * | 1998-11-11 | 2007-01-24 | Tdk株式会社 | Magnetic head device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0966520A (en) | 1997-03-11 |
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