JP3185509B2 - Semiconductor device characteristic inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for inspecting the characteristics of an assembled semiconductor device.

[0002]

2. Description of the Related Art Generally, the characteristics of a semiconductor device that has been assembled are measured by an inspection device including a test head unit and a handler unit. Of these, the test head unit actually operates the semiconductor device to measure the characteristics and evaluates the device based on the measurement results.The handler unit sequentially tests the semiconductor device as the device under test. This is the part that supplies to the head unit. As an electrical connection method between the test head unit and the handler unit, there is a so-called socket type contact. As a socket-like component for this purpose, an adapter socket is provided on the test head unit side, and the handler unit side Is provided with a device socket. In addition, on the test head unit side, a test board in which an inspection circuit and the like are incorporated is provided.
It is detachably connected to an upper end of a test head unit having a function of supplying a power supply for a sample and a function of generating a signal for measurement.

In this type of characteristic inspection apparatus, when the type of a semiconductor device to be inspected is changed, the specifications of an inspection circuit and the like change accordingly. Need to be replaced. In that case, first, the adapter socket provided on the test head unit side and the device socket provided on the handler unit side are separated, and then the test head unit or the handler unit is moved on the floor surface, and the test head unit is moved. The upper part is opened and the test board is replaced in this state.

[0004]

However, in the conventional apparatus, if the test head unit or the handler unit is moved on the floor, the positioning accuracy of both is completely impaired. While visually checking the facing state between the adapter socket and the device socket, the test head unit or the handler unit must be moved little by little to fit the adapter socket and the device socket. It was troublesome.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problem, and provides a semiconductor device characteristic inspection apparatus capable of easily performing a positioning operation between a test head unit and a handler unit when replacing a test board. The purpose is to:

[0006]

SUMMARY OF THE INVENTION The present invention has been made to achieve the above object, and has a test head portion to which a test board having an adapter socket is detachably connected, and a gantry for supporting the test head portion. And a test head unit including a caster provided at the bottom of the gantry portion so as to be vertically movable, and a support block extending outward from both sides of the gantry portion, and can be fitted to an adapter socket. A handler unit including a device socket in which the device to be measured is mounted, a reference block for placing and supporting the support block while the casters are raised above the floor, and any one of a test head unit and a handler unit. It comprises a positioning block provided on one side and a butting member provided on the other side so as to be engageable with the positioning block. A positioning mechanism, in which provided with a fixing means for fixing a test head unit to the handler unit in engagement with the positioning block and the abutment member.

[0007]

In the semiconductor device characteristic inspection apparatus of the present invention, the handler unit is provided by engaging the abutting member provided on the other with the positioning block provided on one of the test head unit and the handler unit. The test head unit is positioned horizontally with respect to, and the casters are lifted off the floor,
By mounting the support block on the test head unit side on the reference block on the handler unit side, the test head unit is positioned vertically with respect to the handler unit. Then, the positioning state of the test head unit with respect to the handler unit is securely held by the fixing means.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a schematic diagram for explaining an embodiment of a semiconductor device characteristic measuring apparatus according to the present invention. FIG. 1 (a) is a plan view and FIG. 1 (b) is a front view. The characteristic measuring apparatus of the semiconductor device according to the present embodiment mainly includes a test head unit 1 and a handler unit 2. The test head unit 1 includes a test head unit 3 to which a test board having an adapter socket (not shown) is detachably coupled, a gantry unit 4 for supporting the test head unit 3, and a gantry unit 4
And a caster 5 that is provided at the bottom of the slab so as to be movable up and down. Among them, the above-described test board (not shown) is positioned and fixed at the upper end of the test head unit 3. On the other hand, the handler unit 2 has a device socket (not shown) that can be fitted to the adapter unit. A semiconductor device, which is a device to be measured, is mounted on the device socket. It has a function to classify and store devices.

Here, the configuration of the test head unit 1 will be described in detail with reference to FIG. As shown, the test head unit 3 is fixed on a support plate 6 on the gantry unit 4 side, and a ball caster 7 is attached to a lower surface side of the support plate 6. The ball caster 7 includes a base plate 8 arranged in parallel with the support plate 6.
The base plate 8 is mounted on the support rod 9
Mounted on top. A fastening member 10 fixed to the support plate 6 side is interposed between the support plate 6 and the base plate 8. On the other hand, a clamp member 12 is fitted from below the base plate 8 via a stopper plate 11, and a distal end portion of the clamp member 12 is screwed to the fastening member 10. here,
A grip lever 13 is attached to the clamp member 12, and by operating the grip lever 13 to rotate the clamp member 12, the relative position between the fastening member 10 and the clamp member 12 changes. .

Further, a male screw (not shown) is formed on the lower end side of the support rod 9, and this male screw portion is screwed into the nut mechanism 14 on the gantry body side. Supported upright. A pulley 15 is attached to a lower end of the nut mechanism 14, and the pulley 15 is connected to a driving pulley 17 via a belt 16. The drive pulley 17 is mounted on the lower end of a main shaft 19 rotatably supported by a bearing mechanism 18. Here, the main shaft 19 is connected to the handle 20 via a gear train (not shown).
The handle 20 is operated to operate the spindle 1
By rotating the drive pulley 9, the drive pulley 17 rotates. When the driving pulley 17 rotates, the other pulleys 15 also rotate in synchronization with this, whereby the support rod 9 screwed to the nut mechanism 14 moves up and down.

On the other hand, a caster 5 is provided below the gantry 4.
The jack units 21 are provided corresponding to the mounting positions of these jacks, and these jack units 21 are connected to each other via a rotating shaft 22. Here, the rotating shaft 22 is connected to a handle 23 via a gear train (not shown). By operating the handle 23, the rotating shaft 22 rotates, and according to the amount of shaft rotation and the shaft rotating direction at this time. The caster 5 moves up and down.

Further, in this embodiment, as shown in FIGS. 1 and 2, first, the support block 24 is extended toward the test head unit 1 from both sides of the gantry 4 so as to extend outward.
Is provided, whereas the handler unit 2
On the side, a reference block 25 for mounting and supporting the support block 24 is provided. Here, the support block 24 provided on the test head unit 1 side is disposed above the reference block 25 on the handler unit 2 side when the casters 5 are in contact with the floor surface 26,
A slight gap G is secured between these blocks as shown in FIG.

In addition, in this embodiment, FIG.
As shown in the figure, a positioning block 27 is provided on one of the test head unit 1 and the handler unit 2, for example, on the handler unit 2 side.
For example, an abutment member 28 that can be engaged with the positioning block 27 is provided on the test head unit 1 side, and the positioning block 27 and the abutment member 28 are provided.
These form a positioning mechanism. this house,
The positioning block 27 has a V-shaped concave portion, and the abutting member 28 engaging with the concave portion has a spherical or cylindrical convex portion.

A toggle clamp 29 as fixing means is attached to a side surface of the reference block 25 provided on the handler unit 2 side. The toggle clamp 29 presses and holds the abutting member 28 on the positioning block 27 side via the support block 24 provided on the test head unit 1 side, and is disposed on each side of the handler unit 2. (Only one side is shown in the figure).

Next, a description will be given of a procedure for replacing a test board in the characteristic inspection apparatus of the present embodiment having the above configuration. First, the test head unit 1 is pulled out from the handler unit 2 with the adapter socket on the test head unit 1 side and the device socket on the handler unit 2 side separated. As a result, the upper part of the test head unit 3 is opened, so that the test board is replaced according to the change of the type of the semiconductor device as the device under test. Incidentally, since the test board is positioned with high precision by, for example, guide pins or the like with respect to the test head section 3, the mounting position of the test board does not shift due to board replacement.

Next, the test head unit 1 is moved on the floor 26 while rolling the casters 5, and the butting member 28 of the test head unit 1 is abutted against the positioning block 27 of the handler unit 2. This allows
The positioning block 27 and the butting member 28 are engaged,
Since the position of the test head unit 1 in the front-rear and left-right directions is regulated, the test head unit 1 is positioned relative to the handler unit 2 in the horizontal direction.

Subsequently, while operating the handle 23 to rotate the rotary shaft 22, the jack unit 21 connected thereto is driven to move all the casters 5 upward. At this time, the position of the gantry 4 is displaced downward in accordance with the amount of movement of the casters 5, and accordingly, the gap G between the blocks (FIG. 1) also decreases, and finally, as shown in FIG. Then, the casters 5 are completely floated from the floor surface 26. In this state, the test head unit 1 is placed on the reference block 25 on the handler unit 2 side.
The support block 24 on the side is placed and supported, and thereby the vertical position of the test head unit 1 is regulated, so that the test head unit 1 is positioned vertically with respect to the handler unit 2.

Next, the lever of the toggle clamp 29 attached to the reference block 25 is operated to move the support block 24 provided on the test head unit 1 side as shown in FIG.
It is pressed and held in the direction of the arrow shown in FIG. As a result, the test head unit 1 is securely fixed to the handler unit 2 with the abutment member 28 engaged with the positioning block 27. In the configuration of the present embodiment, the test head unit 1 is fixed to the handler unit 2 with the holding force of the toggle clamp 29. However, other than this, for example, the tightening force of a screw pair or the urging force of a pressing spring may be used. Both may be fixed.

Finally, the handle 20 is operated to raise the test head 3 together with the support rod 9, and the adapter socket of the test head unit 1 is fitted to the device socket of the handler unit 2. At this point,
Since the test head unit 1 has already been positioned with high accuracy with respect to the handler unit 2 and the positioning state has been securely held by the toggle clamp 29,
The device socket and the adapter socket can be smoothly fitted.

Thereafter, if the test board needs to be replaced due to a change in the type of the semiconductor device, first,
Operate the handle 20 to lower the test head unit 3,
The adapter socket on the test head unit 1 side is separated from the device socket on the handler unit 2 side. Next, the lever of the torque clamp 29 is operated to release the fixed state of the test head unit 1 with respect to the handler unit 2. Subsequently, the casters 5 are advanced downward by operating the handle 23, and the casters 5 are brought into contact with the floor surface 26, and the support block 24 and the reference block 25.
And a slight gap G is secured between them. Thereafter, the test head unit 1 is pulled out from the handler unit 2 to open the upper part of the test head unit 3, and thereafter, the replacement work of the test board is performed in the same procedure as described above.

As described above, in the characteristic inspection apparatus of this embodiment, the positioning block 2 provided in the handler unit 2
7, an abutment member 28 provided on the test head unit 1
, The horizontal positioning of the test head unit 1 with respect to the handler unit 2 is performed, and further, the casters 5 are floated from the floor surface 26, and the tester unit 2 is positioned on the reference block 25 of the handler unit 2. By placing the support block 24, the test head unit 1 is positioned vertically with respect to the handler unit 2. The positioning state of the test head unit 1 with respect to the handler unit 2 is as follows.
It is securely held by a toggle clamp 29 which is a fixing means. This makes it possible to easily perform the positioning work between the test head unit 1 and the handler unit 2 even when the test board is replaced with a change in the type of the semiconductor device.

In this embodiment, the test head 3 is attached to the gantry 4 via the ball casters 7, and the grip lever 13 is operated to rotate the clamp member 12 in one direction. Thus, the ball caster 7 is pressed against the base plate 8 together with the fastening member 10 screwed thereto, and the test head 3 is fixed to the gantry 4. Therefore, when adjusting the mounting position of the test head unit 3 with respect to the gantry unit 4, first,
By operating the grip lever 13, the clamp member 12 is rotated in the direction opposite to the previous direction. As a result, the fastening member 10 slightly floats from the base plate 8,
The test head 3 is placed on the base plate 8 via only the ball casters 7, and at this time, the fixed state of the test head 3 to the gantry 4 is released. As a result, the test head unit 3 can be smoothly moved on the base plate 8 by the rolling operation of the ball caster 7, so that the operator side can check the socket position while keeping the device socket on the handler unit 2 side. The adapter socket on the test head unit 1 side can be easily fitted.

Further, when the adapter socket and the device socket are fitted, the clamp member 12 is rotated by operating the grip lever 13 in the fitted state as it is, and the test head 3 is again mounted on the gantry via the fastening member 10. Fix to 4. When the test head unit 3 is fixed to the gantry unit 4 in a state where the sockets are fitted to each other, when the type of the semiconductor device is subsequently changed, only the test board needs to be replaced. Since it is not performed, once the test head unit 3 is positioned on the gantry unit 4 and fixed, the work of positioning the test head unit 3 with respect to the gantry unit 3 becomes unnecessary thereafter.
Further, even if the positioning accuracy of the test head unit 3 with respect to the gantry unit 4 is impaired due to a sudden accident or the like, in the case of the present embodiment, the position of the test head unit 3 can be easily shifted by the same procedure as described above. Can be modified.

[0024]

As described above, according to the present invention,
The test head unit is positioned on the handler unit with high precision by engaging the abutment member with the positioning block, lifting the caster from the floor surface, and placing the support block on the reference block. Since the state is reliably held by the fixing means, the work of positioning the test head unit and the handler unit when the test board is replaced can be easily performed. As a result, as before, while visually checking the socket position every time the test board is replaced,
Since there is no need to move the test head unit or the handler unit on the floor surface and perform a troublesome positioning operation such as fitting the sockets, the setup time for changing the type of the semiconductor device is greatly reduced.

[Brief description of the drawings]

FIG. 1 is a schematic diagram illustrating an embodiment of a semiconductor device characteristic measuring apparatus according to the present invention.

FIG. 2 is a detailed view showing a configuration of a test head unit in the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Test head unit 2 Handler unit 3 Test head part 4 Stand part 5 Caster 24 Support block 25 Reference block 26 Floor surface 27 Positioning block 28 Abutment member 29 Toggle clamp (fixing means)

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G01R 31/26 H01L 21/66

Claims (1)

(57) [Claims] 1. A test head unit to which a test board having an adapter socket is removably coupled, a gantry for supporting the test head unit, and a caster provided on a bottom of the gantry so as to be vertically movable; A test head unit including a support block extending outward from both sides of the gantry, a device socket that can be fitted to the adapter socket, and a device to be measured is mounted, and the caster is mounted on a floor. A handler unit including a reference block for placing and supporting the support block in a state of being lifted from a surface; a positioning block provided in one of the test head unit and the handler unit; A positioning mechanism comprising an abutment member provided to be engageable with the positioning block; And a fixing means for fixing the test head unit to the handler unit in a state where the block and the abutting member are engaged with each other.