JP3146901U - Flexible thin circuit board for light emitting diode and light emitting diode light bar formed by applying the same - Google Patents

Abstract

The present invention provides a flexible thin circuit board for a light emitting diode, which has high heat dissipation and can be bent and integrally formed with a reflection piece, and a light emitting diode light bar formed by assembling a light emitting diode using the flexible thin circuit board. .
A flexible thin circuit board for a light emitting diode is sandwiched between a bottom copper layer, a top copper layer, a bottom copper layer, and a top copper layer, and the bottom copper layer and the top copper layer are electrically connected. A circuit area that includes an insulating layer 13 that prevents electrical conduction, defines a circuit area on the surface copper layer 11, and is capable of electrically connecting at least one light-emitting diode to the circuit area. Features.
[Selection] Figure 2

Description

  The present invention relates to a circuit board for a light emitting diode, and more particularly to a flexible thin circuit board for a light emitting diode and a light emitting diode light bar formed by applying the flexible thin circuit board.

  Light-emitting diodes have advantages such as power saving, environmental protection, high brightness, and long service life. They are already gradually replacing conventional light sources, and are widely applied in areas such as lighting, notification lights, advertising signs, and liquid crystal displays. .

  Since light emitting diodes are point light sources and increase the range of light emission, lighting devices or electronic devices that generally use light emitting diodes as light sources are arranged in advance by arranging a plurality of light emitting diodes on a printed wiring board. A lamp assembly is formed and the light emitting diode lamp assembly is incorporated into a lighting device or electronic device. However, in general, a printed wiring board does not have an excellent heat conduction effect, and heat energy generated by the light emitting diode cannot be quickly removed, which affects the light emitting efficiency and the service life of the light emitting diode. In addition, light emitting diode light bars and light emitting diode arrays that are currently formed by arranging multiple light emitting diodes on a printed wiring board require separate reflectors to create a light-collecting effect and improve the illumination intensity in the front direction. The process is complicated and time consuming.

  Therefore, an object of the present invention is to provide a flexible thin circuit board for a light-emitting diode that has high heat dissipation and can be bent and integrally formed with a reflecting piece.

  Another object of the present invention is to provide a light emitting diode light bar in which light emitting diodes are assembled and formed using a flexible thin circuit board.

  The flexible thin circuit board for a light emitting diode of the present invention is sandwiched between a bottom copper layer, a surface copper layer, and the bottom copper layer and the surface copper layer so that the bottom copper layer and the surface copper layer are not electrically connected. A circuit area is defined on the surface copper layer, and a circuit pattern capable of electrically connecting at least one light emitting diode is formed in the circuit area.

  The light emitting diode light bar of the present invention includes the above-described circuit board and a plurality of light emitting diodes installed on the circuit board.

  The above-described and other technical contents, features, and effects of the present invention will be described in detail with reference to the drawings and the best embodiments.

  Before describing the present invention in detail, it should be noted that in the following description, similar members are represented by the same numbers.

  1 and 2 show the best embodiment of the flexible thin circuit board for a light emitting diode according to the present invention. This embodiment is a circuit board 1 having an elongated shape, and includes a bottom copper layer 11, a surface copper layer 12, and an insulating layer 13 sandwiched between the bottom copper layer 11 and the surface copper layer 12. 13 is formed of a heat conductive insulating paste, and is used for bonding the bottom copper layer 11 and the surface copper layer 12 and preventing the bottom copper layer 11 and the surface copper layer 12 from being electrically connected. On the surface copper layer 12, there are defined a circuit area 21 and two reflection areas 22 located on opposite sides of the circuit area 21 and arranged near both long sides of the circuit board 1. In the circuit area 21, the circuit 31 is etched on the surface copper layer 12 by an etching method to form the circuit pattern 3, which can be used for installing a plurality of light emitting diodes 4 (see FIG. 8). A gloss layer 14 and a transparent solder resist layer 15 are respectively formed on the surface copper layer 12 of the equireflective area 22. The gloss layer 14 is used to improve the flatness of the surface copper layer 12 surface, and to increase the chance of reflection when the light rays reach the reflection area 22. The transparent solder resist layer 15 is used so that the soldering material does not contaminate the reflection area 22 when the light emitting diode is attached, and the light reflection effect is not lowered. Each reflection area 22 is provided with bending portions 23 and 24 facing the circuit area 21, respectively, and each bending portion 23 and 24 can be between 90 to 180 degrees and is attached to the circuit board 1. When the light emitting diode 4 emits light, the light reflected from the side surface by using the reflection area 22 as a reflection surface is emitted in the front direction, and used to improve the light intensity in the front direction. Further, since the copper foil is a material having excellent thermal conductivity, the heat generated when the light emitting diode 4 emits light passes through the surface copper layer 12, the insulating layer 13 having thermal conductivity and the bottom copper layer 11. The heat is quickly dissipated so that the accumulation of heat energy does not affect the light emitting effect of the light emitting diode 4.

  3 to 5 show the procedure of the circuit board 1 of this embodiment. As shown in FIG. 3, first, two copper foils are prepared to clean the surface, one of which is a bottom copper layer 11, and an insulating paste having thermal conductivity is applied to the surface of the bottom copper layer 11 After the paste is semi-solidified, another copper foil is laminated to form the surface copper layer 12, and when the paste is completely solidified, the insulating layer 13 is formed, and the bottom copper layer 11 and the surface copper layer 12 are formed. Can be pasted together. Further, the etching resist ink 5 is printed on the surface of the surface copper layer 12 to define the position of the etching circuit in the surface copper layer 12. As shown in FIG. 4, the surface copper layer 12 is etched using an etching method to form an etching circuit 31 to form a circuit pattern 3 for use in installing a plurality of light emitting diodes (see FIG. 1), and Is defined as a circuit area 21. As shown in FIG. 5, after the etching is completed, the etching resist ink 5 is removed, a gloss paint is formed on both sides of the circuit area 21 to form a gloss layer 14, and a transparent solder resist ink is further applied on the gloss layer 14. Then, the transparent solder resist layer 15 is formed, and the circuit board 1 of this embodiment is completed. As shown in FIGS. 6 and 7, the circuit board 1 further uses the mold 6 to bend both sides of the circuit area 21 to form curved portions 23 and 24 to form a defined reflection area 22. Can do.

  As shown in FIGS. 8 and 9, the light emitting diode 4 and the surface copper layer 12 are bonded together using a solder paste 41, the light emitting diode 4 is mounted on the circuit board 1, and the light emitting diode light bar 7 is formed. it can. When the light emitting diode 4 is attached, the transparent solder resist layer 15 can prevent the solder paste 41 from adhering to the surface. The procedure for attaching the light emitting diode 4 can be adjusted according to the necessity of the process either after the curved portions 23 and 24 are formed on the circuit board 1 or before the curved portions 23 and 24 are formed.

  As shown in FIGS. 10 and 11, the best method for manufacturing the light-emitting diode light bar 7 is to apply the above-described printing to a set of copper foils (the bottom copper layer 11 and the surface copper layer 12 can be formed). The basic structure of the plurality of light emitting diode light bars 7 is formed at a time by an implementation procedure using etching, etc., and the connected bottom copper layer 11 and insulating layer 13 are separated to form a plurality of light emitting diode light bars 7. It can be formed, process time can be saved and production speed can be increased. As shown in FIG. 12, the individual light-emitting diode light bars 7 can be placed in the mold 6 to form the curved portions 23 and 24. Naturally, in the steps shown in FIGS. 10 and 11, a plurality of circuit boards 1 can be formed at a time without installing the solder paste 41 and the light emitting diodes 4.

  As shown in FIGS. 13 and 14, the light-emitting diode light bar 7 in which the light-emitting diode and the circuit board 1 of the present invention are combined can be applied to backlight panels 81 and 82 of a liquid crystal display, as shown in FIG. Is a direct type backlight panel 81, and a plurality of light emitting diode light bars 7 can be arranged to serve as a light source. FIG. 14 shows a photometric backlight panel 82. The light emitting diode light bar 7 is installed on the side of the light guide plate 821 to serve as a light source of the photometric backlight panel 82, and the circuit board of the light emitting diode light bar 7 is shown. Since the first curved portions 25 and 26 form 90 degrees, they can be directly installed on the side of the light guide plate 821, and it is not necessary to attach a separate reflection cover, so that the assembly process can be simplified. This embodiment can also be applied to an apparatus equipped with a light source such as a lighting fixture or an advertising billboard.

  In summary, the flexible thin circuit board of the present invention can be easily bent to form a reflective surface, increase the light emission brightness in the front direction of the light-emitting diode, and also has high heat dissipation, storing heat energy. Thus, it is possible to prevent the light emitting effect of the light emitting diode from being affected. A light-emitting diode light bar formed by a plurality of coupled light-emitting diodes not only makes the production process simple and quick, but also makes it easy to incorporate the light source into lighting devices and electronic devices that use it as a light source. Yes, the purpose of the present invention can be achieved reliably.

  The above description is based on the best embodiment of the present invention, and does not limit the scope of implementation of the present invention. The simple equivalent effect based on the claims of the utility model registration of the present invention and the contents of the description. All changes and modifications are intended to be included within the scope of the present invention.

It is a three-dimensional view showing the best embodiment of the flexible thin circuit board of the present invention. It is sectional drawing in the II-II line of FIG. It is a side view 1 explaining the implementation procedure of the best example of the flexible thin circuit board of this invention. It is a side view 2 explaining the implementation procedure of the best example of the flexible thin circuit board of this invention. It is a side view 3 explaining the implementation procedure of the best example of the flexible thin circuit board of this invention. FIG. 5 is a side view for explaining an implementation procedure of the best embodiment of the flexible thin circuit board of the present invention. It is a side view 1 explaining the implementation procedure of the best example of the flexible thin circuit board of this invention. FIG. 3 is a three-dimensional view illustrating the best embodiment of the light-emitting diode light bar of the present invention. It is sectional drawing in the IX-IX line of FIG. It is a side view 1 which shows the procedure which forms a several light emitting diode light bar at once. It is a side view 2 which shows the procedure which forms a several light emitting diode light bar at once. It is a side view which shows the procedure which forms a curved part in a light emitting diode light bar. It is a three-dimensional view showing an example in which the light-emitting diode light bar of the present invention is applied to a direct type backlight panel. It is a three-dimensional view showing an example in which the light-emitting diode light bar of the present invention is applied to a photometric backlight panel.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 11 Bottom copper layer 12 Surface copper layer 13 Insulating layer 14 Glossy layer 15 Transparent solder resist layer 21 Circuit area 22 Reflection area 23 Curved part 24 Curved part 3 Circuit pattern 31 Circuit 4 Light emitting diode 41 Solder paste 5 Etching resist ink 51 Circuit etching position 6 Mold 7 Light emitting diode light bar 81 Backlight panel 82 Backlight panel 821 Light guide plate

Claims (12)

Including a bottom copper layer, a surface copper layer, an insulating layer sandwiched between the bottom copper layer and the surface copper layer, and preventing the bottom copper layer and the surface copper layer from electrically conducting; A flexible thin circuit board for a light-emitting diode, wherein a circuit area is defined above, and a circuit pattern capable of electrically connecting at least one light-emitting diode is formed in the circuit area.
The surface copper layer has a pair of long sides, a reflection area is defined near the two long sides on the surface copper layer, and the circuit area is located between the two reflection areas. The flexible thin circuit board for a light-emitting diode according to claim 1, wherein the circuit board is a flexible thin circuit board. The flexible thin circuit board for a light emitting diode according to claim 2, wherein a gloss layer is provided on the reflective area.
The flexible thin circuit board for a light emitting diode according to claim 3, wherein a transparent solder resist layer is provided on the gloss layer. The flexible thin film for a light-emitting diode according to any one of claims 2 to 4, wherein each of the reflection areas includes a curved portion facing the circuit area, and an angle of the curved portion is smaller than 180 degrees. Circuit board. The flexible thin circuit board for a light emitting diode according to claim 5, wherein an angle of the curved portion is 90 degrees or more. Including a bottom copper layer, a surface copper layer, an insulating layer sandwiched between the bottom copper layer and the surface copper layer, and preventing the bottom copper layer and the surface copper layer from electrically conducting; An elongated circuit board having a circuit area defined on the circuit area and a circuit pattern formed on the circuit area, and a plurality of light-emitting elements installed in the circuit area on the surface copper layer and electrically connected to the circuit pattern A light-emitting diode light bar comprising a diode.
The surface copper layer has a pair of long sides, a reflection area is defined near the two long sides on the surface copper layer, and the circuit area is located between the two reflection areas. 8. A light emitting diode light bar according to claim 7, characterized in that The light emitting diode light bar according to claim 8, wherein a gloss layer is provided on the reflective area.
The light emitting diode light bar according to claim 9, wherein a transparent solder resist layer is provided on the gloss layer. 11. The light-emitting diode light bar according to claim 8, wherein each of the reflection areas includes a curved portion facing the circuit area, and an angle of each curved portion is smaller than 180 degrees. The light emitting diode light bar according to claim 11, wherein an angle of the curved portion is 90 degrees or more.

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