JP3143888U - Built-in module - Google Patents

Abstract

Provided is a component built-in module that can be reduced in size and can be easily reduced in manufacturing cost.
A component built-in module 10 includes components 2, 4, 6 and a coating layer 20. Components 2, 4, and 6 have a pair of main surfaces parallel to each other and side surfaces extending between the pair of main surfaces. The covering layer 20 covers at least one main surface and side surfaces of the components 2, 4, and 6. The covering layer 20 has a concavo-convex surface 22 on which a concavo-convex surface is formed on a surface 20 a away from the components 2, 4, 6.
[Selection] Figure 1

Description

  The present invention relates to a component built-in module, and more particularly to a component built-in module in which a component is built in a coating material such as resin.

  2. Description of the Related Art Conventionally, as a method of radiating heat generated from components built in a component built-in module, it is known to provide a heat radiating plate on which heat radiating fins are formed.

For example, in the component built-in module shown in the cross-sectional view of FIG. 7, the component (semiconductor chip) 101 mounted in the concave portion of the ceramic substrate 110 is made of aluminum or the like and a heat radiating plate 120 and a resin 112, 115. The heat sink 120 is bonded to the upper surface of the ceramic substrate 110, the resin 115, and the component 101 via an adhesive 118 (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 5-109952

  However, since the thickness is increased by the heat radiating plate 120, the heat radiating plate 120 prevents the miniaturization (low profile) of the component built-in module. Moreover, since the number of parts increases when the heat sink 120 is provided, it is difficult to reduce the manufacturing cost.

  In view of such circumstances, the present invention is intended to provide a component built-in module that can be reduced in size and that can easily reduce the manufacturing cost.

  In order to solve the above problems, the present invention provides a component built-in module configured as follows.

  The component built-in module includes a component and a coating layer. The component has a pair of main surfaces parallel to each other and a side surface extending between the pair of main surfaces. The covering layer covers at least one main surface of the component and the side surface of the component. The coating layer has a concavo-convex surface in which concavo-convex is formed on a surface away from the component.

  In the above configuration, the coating layer only needs to have an uneven surface on at least a part of the surface away from the component. By increasing the surface area by the uneven surface of the coating layer, the heat generated from the component covered with the coating layer can be efficiently radiated from the uneven surface of the coating layer.

  According to the said structure, a heat sink can be eliminated and a component built-in module can be reduced in size. In addition, the manufacturing cost can be easily reduced.

  Preferably, when viewed from the normal direction of the one main surface of the component, the uneven surface overlaps at least the one main surface of the component.

  In this case, the heat generated from the component can be radiated more efficiently by disposing the uneven surface of the coating layer at a position overlapping the component in plan view.

  Preferably, the uneven surface includes a groove surface formed by a plurality of grooves extending in parallel with each other.

  In this case, a streaky uneven surface can be easily formed. That is, the grooves extending in parallel with each other can be easily formed using a dicer or the like.

  Preferably, the concavo-convex surface is (a) a first groove surface formed by a plurality of grooves of a first group extending in parallel with each other, and (b) intersecting the first group of grooves and parallel to each other. And a second groove surface formed by a plurality of grooves of the second group extending to the surface.

  In this case, a grid-like uneven surface is formed by the first groove surface and the second groove surface, and the case where the streaky uneven surface is formed by only one group of groove surfaces extending in parallel with each other, Heat dissipation can be improved by increasing the surface area of the uneven surface.

  Preferably, the grooves extending in parallel with each other are in contact with the groove surfaces of the adjacent grooves.

  In this case, it is possible to increase the heat dissipation by increasing the surface area of the concavo-convex surface than when adjacent grooves are separated.

  Preferably, a conductive layer containing a conductive material is formed on the uneven surface.

  Since a conductive layer provided as a shield layer or the like easily transmits heat, the heat dissipation can be further improved by adding the conductive layer.

  Preferably, the conductive layer is formed along the uneven surface.

  When the conductive layer is formed along the uneven surface, the surface area is increased as compared with the case where the conductive layer is formed so as to be embedded in the uneven surface, and thus heat dissipation is further improved.

  Preferably, the component built-in module further includes a ceramic substrate. The ceramic substrate is disposed to face the coating layer and the other main surface of the component, and the component is mounted thereon.

  In this case, heat generated from the component mounted on the ceramic substrate can be radiated from the uneven surface of the coating layer.

  According to the present invention, by forming an uneven surface on the covering layer, the component built-in module can be reduced in size while ensuring heat dissipation. In addition, the manufacturing cost of the component built-in module can be easily reduced.

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example 1> The component built-in module 10 of Example 1 is demonstrated, referring sectional drawing of FIG.

  As shown in FIG. 1, in the component built-in module 10, an active component such as a semiconductor chip 2 is flip-chip mounted or bare chip mounted on an external electrode 14 formed on an upper surface 12a of a ceramic substrate 12, and a passive component such as a capacitor is mounted. Chip components 4 and 6 are surface mounted. The components 2, 4, 6 to be mounted have a pair of main surfaces parallel to each other and side surfaces extending between the pair of main surfaces.

  The type of component to be mounted and the component mounting method can be arbitrarily selected. For example, the semiconductor chip 2 may be mounted by wire bonding.

  A resin layer 20 is formed on the upper surface 12a of the ceramic substrate 12 using an insulating resin as a covering layer that covers the mounted semiconductor chip 2 and chip components 4 and 6. The resin layer 20 may cover at least the main surfaces 2a, 4a, and 6a on the side opposite to the ceramic substrate 12 of the components 2, 4, and 6. Moreover, you may form a coating layer using materials other than resin.

  A groove 24 is formed on the upper surface 20 a of the resin layer 20. The grooves 24 are formed in parallel to each other, and a space is provided between adjacent grooves 24. That is, the resin layer 20 has a concavo-convex surface 22 in which concavo-convex portions are formed on a surface away from the semiconductor chip 2 and the chip components 4 and 6.

  Since the uneven surface 22 increases the surface area of the resin layer 20, the heat dissipation function is enhanced. That is, heat generated from the semiconductor chip 2 and the chip components 4 and 6 is transmitted to the resin layer 20 and efficiently radiated from the uneven surface 22 of the coating layer 20. Thereby, the semiconductor chip 2 and the chip components 4 and 6 can be protected from heat, and a long life and high reliability can be realized.

  In addition, since the heat dissipation function improves, it is preferable that the resin layer 20 contains the inorganic filler whose heat conductivity is higher than resin.

  The uneven surface 22 is not necessarily formed on the entire upper surface 20a of the resin layer 20, but at least in plan view so that the heat generated from the components 2, 4 and 6 can be efficiently dissipated. It is preferably formed in a portion overlapping with the parts 2, 4 and 6. That is, when viewed from the normal direction (vertical direction in FIG. 1) of one main surface 2a, 4a, 6a (main surface opposite to the ceramic substrate 12) of the parts 2, 4, 6, the uneven surface 22 is It is preferable that at least one main surface 2a, 4a, 6a of the parts 2, 4, 6 overlaps.

  The ceramic substrate 12 is a ceramic multilayer substrate in which ceramic insulating layers are laminated. The ceramic substrate 12 includes a wiring layer 15 disposed between the insulating layers and a via conductor 16 penetrating the insulating layer. External electrodes 14 and 18 are formed on the upper surface 12 a and the lower surface 12 b of the ceramic substrate 12.

  In place of the ceramic multilayer substrate, a single layer ceramic substrate or an insulating substrate other than the ceramic substrate, for example, a printed wiring board may be used.

  Next, an example of manufacturing the component built-in module 10 will be described. In the manufacturing example, a plurality of parts are manufactured at the same time and then divided into pieces.

First, BaO, SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , and CaO are prepared as starting materials, and a predetermined amount of each starting material is weighed and mixed. The obtained mixture is calcined at 1300 ° C. for 2 hours, and the obtained calcined product is pulverized to obtain a calcined powder. Next, an appropriate amount of a binder, a plasticizer, and a solvent were added to the calcined powder and kneaded to obtain a so-called ceramic slurry in the form of a slurry.

  Next, this ceramic slurry was formed into a sheet having a thickness of 100 μm using a doctor blade method to obtain a ceramic green sheet. This ceramic green sheet was cut into a rectangular shape having a length of 100 mm and a width of 100 mm.

  Next, a via hole (through hole) having a diameter of 200 μm was formed at a predetermined position of the rectangular ceramic green sheet.

  Next, a via conductor paste made of Cu powder, an appropriate amount of binder, filler, dispersant, etc. is prepared, and this via conductor paste is printed on a rectangular ceramic green sheet by screen printing. Filled the via hole.

  Similarly, conductor patterns such as wiring layers and external electrodes were formed on a rectangular ceramic green sheet by screen printing using a conductor paste made of Cu powder, an appropriate amount of binder, filler, dispersant and the like.

At this time, in particular, a paste containing an appropriate amount of glass, Al ₂ O ₃ or the like as a filler was used as the conductor paste for forming the external electrode 14 on the upper surface 12a side of the ceramic substrate 12 on which the resin layer 20 is provided.

  Next, a plurality of rectangular ceramic green sheets were laminated and pressure-bonded to obtain a laminated body having a thickness of 1 mm. The obtained laminate was fired at a temperature of 800 to 1000 ° C. for 5 hours to obtain a ceramic multilayer substrate.

  In addition, about the manufacturing method of a ceramic multilayer substrate, you may use not only the above-mentioned method but another manufacturing method.

Next, passive components such as capacitors and inductors, and active components such as ICs are applied to the surface of the ceramic multilayer substrate using a general-purpose lead-free solder paste (Sn-3Ag-0.5Cu), in an N ₂ atmosphere, at a maximum temperature. Reflow was performed at 240 to 260 ° C. and a holding time of 2 to 5 minutes, and mounting was performed. Thereafter, flux cleaning was performed using a solvent to produce a mounting substrate.

Next, silica as an inorganic filler and liquid epoxy resin as a thermosetting resin are prepared, weighed so that silica is 90% by weight and liquid epoxy resin is 10% by weight, mixed with a dispersant, and pasted. A mixture of was made. The obtained paste-like mixture (hereinafter also referred to as “liquid resin”) is dropped on the upper surface of the ceramic multilayer substrate on which the component is mounted to cover the component, and is placed in a vacuum oven heated to 45 to 100 ° C. Install and place under reduced pressure of 10 ⁻² to 10 ⁻⁷ Pa. This increased the fluidity of the liquid resin, and the gap between the component and the ceramic multilayer substrate was filled with the liquid resin, that is, a paste-like mixture without voids.

  The ceramic multilayer substrate on which the component thus mounted was covered with the liquid resin was heated at 100 ° C. for 1 hour to cure the liquid resin by a crosslinking reaction. Thus, the mounted component is sealed with resin.

  Note that resin sealing may be performed without using a liquid resin. For example, by pressing a prepreg (B-stage resin) to a ceramic multilayer substrate on which components are mounted, it is possible to embed the components in the resin and cure the resin thereon.

  Next, the dividing groove reaching the ceramic substrate was diced into the resin layer along the boundary line for dividing the component built-in module into individual pieces, and the groove for forming the uneven surface on the upper surface of the resin layer was diced. .

  The groove for forming the uneven surface was formed in a straight line by feeding it while cutting at an appropriate depth with respect to the upper surface of the resin layer. The grooves were formed at a pitch larger than the blade width of the blade, and an interval was provided between adjacent grooves. A blade with a blade width of about 0.5 to 2 mm can be used to form the uneven surface, but a blade with a blade width of 1.47 mm was used in the production example. As for the depth of the groove | channel (blade cutting depth) for forming an uneven surface, 10-50 micrometers is preferable. That is, in order to obtain a heat dissipation effect, the thickness is preferably 10 μm or more, and in order to adsorb the uneven surface of the component built-in module without trouble with the pickup, it is preferably 50 μm or less.

  The uneven surface of the resin layer can be formed by another method, but when the groove for forming the uneven surface is processed using a dicer for dividing the component built-in module into individual pieces, the uneven surface is formed. Therefore, it is not necessary to add a special process only for the purpose, so that the manufacturing cost can be reduced.

  By forming an uneven surface on the resin layer as described above, the surface area is increased while reducing the amount of material used in the resin layer, so that heat generated from the parts covered with the resin layer can be effectively generated from the uneven surface side of the resin layer. Can dissipate heat. Therefore, the heat sink can be eliminated, the component built-in module can be downsized, and the manufacturing cost can be easily reduced.

  In addition, by changing the depth and width of the groove for forming the uneven surface according to the arrangement of the built-in parts that will be the heat source, the volume of the resin itself with poor thermal conductivity can be reduced, so heat dissipation Increase.

  Furthermore, considering the state and shape after the component built-in module is mounted on a substrate, etc., the groove shape for forming the uneven surface of the resin layer and the extending direction are designed, so that the unevenness of the resin layer The groove for forming the surface can function as a flow path for air from a fan, a blower or the like. As a result, heat dissipation can be positively supported.

  <Example 2> The component built-in module 10a of Example 2 is demonstrated referring FIG.

  The component built-in module 10a according to the second embodiment is configured in substantially the same manner as the component built-in module according to the first embodiment. Below, the same code | symbol is used for the component similar to Example 1, and it demonstrates centering around difference.

  As shown in the cross-sectional view of FIG. 2, the component built-in module 10a according to the second embodiment has a conductive layer 28 that functions as a shield layer for countermeasures against electromagnetic noise added to the component built-in module 10 according to the first embodiment. . The conductive layer 28 is formed along the uneven surface 22 and the side surface 26 of the resin layer 20.

  In this case, the conductive layer 28 is preferably connected to a ground electrode provided on the ceramic substrate 12 in order to enhance the shielding property. It is more preferable that the ground electrode is connected to the ground electrode of the mother board because the shielding property can be further enhanced.

  The conductive layer 28 was diced into the resin layer 20 in the same manner as in Example 1, that is, the divided groove for dividing into individual pieces and the groove for forming the uneven surface 22 were diced into the resin layer 20. Thereafter, a conductive resin is applied onto the resin layer 20 by spin coating and cured.

  The conductive layer 28 can be formed so as to be embedded in the uneven surface 22, but it is preferable to form the conductive layer 28 along the uneven surface 22 as shown in FIG. 2 so as to increase the surface area and improve heat dissipation. . If the conductive layer 28 has an uneven surface, electromagnetic wave noise is easily absorbed and diffused, and the shielding property is improved.

  Since the conductive layer 28 easily transmits heat, the heat dissipation can be further improved by adding the conductive layer 28.

  <Example 3> The component built-in module 11a of Example 3 is demonstrated referring FIG.3 and FIG.4.

  As shown in the perspective view of FIG. 3, in the component built-in module 11 a, the streaky uneven surface 22 a is diced on the upper surface of the resin layer 20 as in the first embodiment. Unlike the first embodiment, the uneven surface 22a is formed with grooves 24a at a pitch equal to or less than the width of the blade, and the groove surfaces of adjacent grooves 24a are in contact with each other to form a boundary line 24s. Thus, when the groove surfaces of the adjacent grooves 24a are in contact with each other, the surface area can be increased as compared with the case where the groove surfaces are separated from each other.

  The groove 24a has a curved groove surface. The curved groove surface can be formed by cutting the blade 8 having a round blade edge 8a into the upper surface 20a of the resin layer 20 as shown by an arrow 8s, as shown in the explanatory view of FIG. .

  The cutting edge of the blade is usually replaced when it wears with processing and becomes rounded. Thus, the groove | channel 24a which forms the uneven | corrugated surface 22a can be formed using the braid | blade with which the blade edge | round was rounded. Therefore, the manufacturing cost can be reduced.

  For example, with a new blade, first, the dividing groove reaching the ceramic substrate is diced. When the cutting edge of the blade is rounded, the groove 24a for forming the uneven surface 22a is diced. As a result, the blade can be used without waste.

  <Example 4> The component built-in module 11b of Example 4 is demonstrated referring FIG.5 and FIG.6.

  As shown in the perspective view of FIG. 5, the component built-in module 11 b of Example 4 has a lattice-shaped uneven surface 22 b formed on the resin layer 20. The uneven surface 22b can be formed by dicing the groove 24b in two directions 8x and 8y intersecting as shown in the explanatory view of FIG.

  That is, first, as in Example 3, the grooves are diced into the upper surface 20a of the resin layer 20 at a pitch equal to or less than the blade width of the blade in parallel with the first direction 8x, and the groove surfaces of adjacent grooves are A first group of grooves in contact is formed. Next, the grooves are diced at a pitch equal to or less than the blade width of the blade in parallel with the second direction 8y (for example, the direction perpendicular to the first direction 8x), intersecting with and adjacent to the first group of grooves. Forming a second group of grooves in contact with each other. As a result, the vicinity of the intersection 24t between the boundary line between the first groove surfaces of the first group of grooves and the boundary line between the second groove surfaces of the second group of grooves projects on the upper surface 20a of the resin layer 20. A grid-like concavo-convex surface 22b protruding in a shape is formed.

  The lattice-shaped uneven surface 22b can increase the surface area more than the streaky uneven surface.

  <Summary> As described above, the component built-in module in which the uneven surface is formed on the resin layer can be reduced in size, and the manufacturing cost can be easily reduced.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, a conductive layer may be formed on the curved irregular surface of Example 3 or Example 4 as in Example 2. Moreover, in the component built-in module in which components are mounted on both sides of the substrate, an uneven surface may be formed on one or both of the covering layers that respectively cover the components on both sides of the substrate.

  Furthermore, the present invention for forming a concavo-convex surface on a coating layer can be applied to a component built-in module that does not include a substrate and exposes a terminal portion of a component embedded in the coating layer. Such a component built-in module can be manufactured by, for example, disposing a component on a base plate instead of a substrate and forming a coating layer with a resin or the like and then removing it from the base plate.

It is sectional drawing of a component built-in module. Example 1 It is sectional drawing of a component built-in module. (Example 2) It is a perspective view of a component built-in module. (Example 3) It is explanatory drawing which shows the formation method of an uneven surface. (Example 3) It is a perspective view of a component built-in module. Example 4 It is explanatory drawing which shows the formation method of an uneven surface. Example 4 It is sectional drawing of a component built-in module. (Conventional example)

Explanation of symbols

2 Semiconductor chip (component)
2a, 4a, 6a Main surface 4, 6 Chip components (components)
10, 10a, 11a, 11b Built-in component module 12 Ceramic substrate 20 Resin layer (coating layer)
20a Upper surface 22, 22a, 22b Uneven surface 24, 24a, 24b Groove 28 Conductive layer

Claims (8)

A component having a pair of main surfaces parallel to each other and a side surface extending between the pair of main surfaces;
A coating layer covering at least one of the main surface of the component and the side surface of the component;
With
The component built-in module, wherein the coating layer has a concavo-convex surface in which a concavo-convex surface is formed on a surface away from the component.   2. The component built-in module according to claim 1, wherein the concave-convex surface overlaps at least the one main surface of the component when seen through from a normal direction of the one main surface of the component. The uneven surface is
3. The component built-in module according to claim 1, comprising a groove surface formed by a plurality of grooves extending in parallel with each other in at least one group. 4. The uneven surface is
A first groove surface formed by a plurality of grooves of a first group extending in parallel with each other;
The second groove surface formed by a plurality of grooves in a second group that intersects the first group of grooves and extends in parallel with each other. Module with built-in parts.   5. The component built-in module according to claim 3, wherein the grooves extending in parallel with each other are in contact with the groove surfaces of the adjacent grooves. 6.   The component built-in module according to claim 1, wherein a conductive layer containing a conductive material is formed on the uneven surface.   The component built-in module according to claim 6, wherein the conductive layer is formed along the uneven surface.   8. The ceramic substrate according to claim 1, further comprising a ceramic substrate that is disposed to face the covering layer and the other main surface of the component and on which the component is mounted. The module with a built-in component described in 1.

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