JP3116888B2 - Solder ball carrier tape and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball carrier tape used for forming a solder bump on an electrode solder land of an IC chip, a method of manufacturing the same, a manufacturing apparatus therefor, and a method using the solder ball carrier tape. And forming a solder bump on an electrode solder land of an IC chip.

[0002]

2. Description of the Related Art As the number of pins of an IC package has increased significantly with the increase in the degree of integration and miniaturization of semiconductor devices, when mounting an IC package on a mounting board,
It is technically difficult to adopt the pin method.
Therefore, instead of the pin type, a BGA (Ball Grid Array) type IC using solder balls for connection to the mounting substrate
Chips are being heavily used. In the case of the BGA method, the number of electrode terminals is about 2000 to 3000,
The pitch of the electrode terminals is 0.24 to 0.25 mm, and the size of the solder balls provided on the electrode terminals of the IC chip is about 0.15 mm.

Although there are various methods for forming solder bumps on electrodes and the like of a BGA package, generally, a plate-shaped alignment jig provided with a concave portion having a predetermined shape in an arrangement matching the electrode arrangement of an IC chip, A solder ball suction jig having a large number of suction nozzles arranged so as to match the arrangement is used. Then, first, the solder balls are sucked by the suction nozzles, and the sucked solder balls are detached from the respective concave portions of the alignment jig, and one solder ball is accommodated in each concave portion. Next, the electrodes of the IC chip and the solder balls are aligned and brought into contact, and subsequently, the solder balls are melted and transferred to the electrodes to form solder bumps. Alternatively, as an alternative, fill each recess of the alignment jig with solder paste, heat the solder paste,
The paste component is evaporated and the solder component is melted, and spherical solder bumps are formed in each concave portion. Then, the alignment jig on which the solder bumps are formed is opposed to the IC chip, and the electrodes and the solder bumps are aligned and pressed. And
Heating transfers the solder bumps to the electrodes.

[0004]

By the way, a solder bump is to be formed on a recent IC chip having 3000 pins in a 13 mm square IC chip by the above-mentioned conventional solder bump forming method, and the diameter is about 0.12 mm. Of 30
00 solder balls are simultaneously sucked into each suction nozzle,
It is necessary to accommodate one solder ball in each recess of the alignment jig arranged at a pitch of about 0.24 mm. However, there are the following problems in forming a finer solder bump than such a conventional solder bump forming method on such a multi-pin IC chip. That is, the work of simultaneously accommodating a large number of fine solder balls one by one in the concave portions formed at a fine pitch requires abundant experience, skilled skills, and a great deal of labor, and the productivity was extremely low. . For example, when the solder ball is sucked by the suction nozzle, there is a suction leak, or when the suction action of the suction nozzle is stopped and the sucked solder ball is dropped from the suction nozzle to the concave portion of the alignment jig, the solder In many cases, the ball did not fit into the concave portion accurately and rolled into another concave portion or rolled off from the alignment jig. To correct this, it was necessary to manually reposition the solder balls in the predetermined recesses while looking into the microscope, and the correction work required a great deal of labor and time. Also, even with the method of filling the solder paste, it is difficult to accurately fill the solder paste into the fine recesses arranged at a fine pitch without leaking each other. Shortages often occurred.

Accordingly, an object of the present invention is to provide a solder ball carrier tape having a novel structure capable of easily and accurately forming solder bumps, a method of manufacturing the same, a method of forming bumps, and the like, instead of the conventional method of forming bumps. It is to be.

[0006]

In order to achieve the above object, a solder ball carrier tape according to the present invention comprises an electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, etc. A solder ball carrier tape used when forming solder bumps on an electrode solder land of an IC chip), which is formed of a material having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder. The tape is provided on the tape surface in the same arrangement as the electrode arrangement of the IC chip, and the opening diameter increases toward the opening end, and the opening diameter at the opening end is accommodated.
A group of a large number of recesses having a longitudinal sectional shape larger than that of the solder balls to be formed, and a group of recesses provided for each IC chip and spaced apart in the longitudinal direction of the tape, and one for each of the recesses. and a solder ball was, IC switch
Wider than the electrode array area of the tape and from the surrounding tape surface
A plurality of low tape surface areas are provided for each IC chip.
Each recess group is provided on the tape at a distance in the longitudinal direction of the tape.
Are provided in the low tape surface area, respectively.
Features .

In the present invention, the solder refers not only to a solder made of an alloy of tin and lead, but also to a low melting point metal and a low melting point alloy widely used for metal bonding. Solder paste refers to a mixture of a solder component and an evaporable paste component. The material used for the tape in the present invention is, for example, a polyimide resin that can withstand a temperature of about 300 ° C. The size of the recess and the solder ball is determined by the size of the solder bump to be formed. There is no limitation on the method of forming the recess, and any known method can be applied as long as the recess can be formed so that the opening diameter increases toward the opening end.

In a preferred embodiment of the invention, the tape is
It is formed as a laminated film of a plastic film having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder. In a further preferred embodiment of the present invention, the tape is a laminated film of a plastic film with a metal foil interposed in a longitudinal direction in the laminated film, wherein the metal foil is exposed from the bottom of the concave portion, and the exposed metal foil And the solder ball are joined. Thus, even when the solder ball / carrier tape is transferred, the solder balls do not roll out of the recess and move, nor do they roll out of the tape. Sprocket holes are provided along both side edges of the tape. Thereby, the solder ball / carrier tape can be easily run.

In a further preferred embodiment of the present invention, the tape has a plurality of low tape surface areas lower than the surrounding tape surface, each of which is separated in the longitudinal direction of the tape for each IC chip. Groups are each provided in the low tape surface area. This allows the electrodes of the IC chip or the like to approach the solder balls of the concave portion without being disturbed by the tape surface, so that the positioning and mutual contact between the electrodes of the IC chip and the solder balls of the concave portion are facilitated. Become.

According to the method of the present invention, an electrode solder land of an electronic component and an IC chip, a terminal solder land of a mounting board, and the like (hereinafter collectively referred to as an electrode solder land of an IC chip).
Solder balls used to form solder bumps on
A method for manufacturing a carrier tape, comprising: a tape formed of a material having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder, arranged in the same arrangement as the electrode arrangement of the IC chip, and A group of a large number of concave portions having a longitudinal sectional shape whose opening diameter increases toward the opening end is formed by
A step of forming a tape in the longitudinal direction of the tape for each C chip, a step of dropping solder paste one by one from a dispenser into each recess, a step of heating, melting, and then cooling the solder paste in a non-oxidizing atmosphere. And converting the solder balls into solder balls.

In the present invention, since the solder paste is dripped from the dispenser, the amount of the solder paste dripped can be accurately controlled, so that the size of the solder ball does not occur.
Instead of dropping the solder paste from the dispenser, the solder paste may be applied and then squeegeeed with a squeegee as in the related art.

The device according to the present invention includes an electrode solder land of an electronic component and an IC chip, a terminal solder land of a mounting board, and the like (hereinafter collectively referred to as an electrode solder land of an IC chip).
Solder balls used to form solder bumps on
An apparatus for manufacturing a carrier tape, wherein a group of a plurality of concave portions arranged in the same arrangement as the electrode arrangement of an IC chip and each having a longitudinal sectional shape whose opening diameter increases toward an opening end is formed by each IC. A recess forming device that forms a tape at a distance in the longitudinal direction of the tape for each chip, a tape running mechanism that continuously runs a tape having a group of recesses on a tape surface at predetermined intervals, and a running of the tape that runs stepwise A multi-nozzle dispenser for dropping solder paste into each concave portion of the tape during the suspension period, and a reflow furnace for heating and melting the solder paste dropped into the concave portion of the tape in a non-oxidizing atmosphere and converting the solder paste into solder balls. And is characterized by having.

The above-described method for forming solder bumps according to the present invention uses the above-mentioned solder ball carrier tape to form electrode solder lands for electronic components and IC chips, terminal solder lands for mounting boards, etc. (hereinafter collectively referred to as IC chips). (Hereinafter referred to as an electrode solder land) (hereinafter referred to as a first solder bump forming method), in which a solder ball / carrier tape is continuously stepped at a predetermined interval, and the running is temporarily stopped. During the period, holding the IC chip with the electrodes facing down, aligning the electrodes with the recesses, and bringing the electrodes into contact with the solder balls, heating the solder balls in contact with the electrodes in a non-oxidizing atmosphere, Fusing and transferring onto the solder lands of the electrodes to form solder bumps.

Another method of forming solder bumps according to the present invention is to form solder bumps on electrode solder lands of electronic components and IC chips, terminal solder lands of mounting boards, and the like (hereinafter collectively referred to as electrode solder lands of IC chips). (Hereinafter, referred to as a second solder bump forming method), wherein a tape formed of a material having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder has the same electrode arrangement as that of an IC chip. Arranged in an array, and
Forming a group of a large number of concave portions having a longitudinal cross-sectional shape in which the opening diameter increases toward the opening end, and forming a group of the concave portions in the longitudinal direction of the tape for each IC chip; Continuously stepped at predetermined intervals,
A step of dropping solder paste from the dispenser into each recess during the step suspension of tape running, holding the IC chip with the electrodes facing down, aligning the electrodes with the recesses, and placing the solder paste And a step of heating and melting the solder paste in contact with the electrodes in a non-oxidizing atmosphere to transfer the solder onto the solder lands of the electrodes to form solder bumps.

[0015]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. Embodiment 1 This embodiment is an example of an embodiment of a solder bump carrier tape according to the present invention. FIG. 1 is a plan view of the solder bump carrier tape of the present embodiment, and FIG. 2 is a cross-sectional view of a concave portion of the solder bump carrier tape of the present embodiment taken along line II of FIG. Solder bump carrier tape (hereinafter referred to as carrier tape) 1 of the present embodiment example
Reference numeral 0 denotes a solder ball carrier tape used for forming solder bumps on an electrode solder land of an electronic component and an IC chip, a terminal solder land of a mounting board, and the like (hereinafter, simply referred to as an electrode solder land of an IC chip). It is. The carrier tape 10 includes a tape 12, a concave group 16 composed of a large number of concave parts 14, a solder ball group 20 composed of solder balls 18 contained one by one in each concave part 14, and a film 12. And sprocket holes 22 provided on both side edges of the film 12 sandwiching the concave group 16.

The tape 12 is, for example, a polyimide resin tape made of plastic having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder.
The tape 12 is not limited to this, and may be a laminated film in which a plurality of plastic films are laminated. The recess 14
It is provided on the tape surface at the same arrangement and the same pitch as the electrode arrangement of the C chip, and the number of lines of the electrode arrangement of the IC chip along the longitudinal direction of the tape 12 (11 lines are shown in FIG. 1).
Only the number of rows of the electrode array of the IC chip (9 rows are shown in FIG. 1) is arranged along the width direction of the tape 12.
The concave groups 16 are provided at predetermined intervals along the tape 12 for each IC chip to which solder bumps are transferred. The concave portion 14 is provided at a predetermined position of the tape 12 by etching the tape 12 by a wet etching method described later, and has a vertical cross-sectional shape in which the opening diameter increases toward the opening end as shown in FIG. Have. As shown in FIG. 2 , one solder ball 18 is accommodated in one recess 14.

Next, a method of manufacturing the carrier tape 10 of the embodiment will be described with reference to FIGS.
3A to 3D are cross-sectional views of the tape in each step when forming a concave portion in the tape, and FIG. 4A is a carrier tape manufacturing for manufacturing the carrier tape 10 of the present embodiment. FIG. 4B is a schematic tape sectional view showing the formation of solder balls along line II-II in FIG. 4A. First, a photoresist film 24 is formed on the tape 12 as shown in FIG.
Next, as shown in FIG. 3B, a mask 28 having an opening pattern 26 having a predetermined dimension at a predetermined pitch is formed at a predetermined position by photolithography and etching. Subsequently, as shown in FIG. 3C, the concave portion 14 is formed by etching the tape 12 under the mask 28 by wet etching using a strong alkali as an etchant. Next, the mask 28 is removed to obtain the tape 12 provided with the concave portions 14 as shown in FIG. continue,
Sprocket holes 16 are opened at both side edges of the tape 12 by a mechanical method. Note that the sprocket hole 16 may be opened in the tape 12 before providing the concave portion 14.

Next, solder bumps are formed on the tape 12 using the carrier tape manufacturing apparatus shown in FIG. As shown in FIG. 4, the carrier tape manufacturing device 30 includes a tape traveling device 32, a dispenser device 34, and a heating device 36.

The tape running device 32 is composed of a driving sprocket 38 for running the tape 12 using the sprocket holes 16 of the tape 12 and a floating sprocket 40 which guides the tape 12 in front of the driving sprocket 38. The tape 12 is continuously run stepwise at predetermined intervals in the direction of the arrow. The dispenser device 34 is a multi-nozzle type dispenser device, and includes downwardly provided syringes (Syringes) 35 arranged at the same pitch and the same number as the recesses 14 arranged in a direction perpendicular to the running direction of the tape 12. A predetermined amount of solder paste is dripped from the syringe 35 into the concave portion 14 under the control of a flow rate adjusting device (not shown) provided in 35. The heating device 36 is a flat resistance heating type electric heater, which melts the solder paste dropped into the concave portion 14 and integrates the solder components while evaporating the paste components and the like other than the solder components to form a solder ball. Invert. A heating device 36 is provided below the tape 12.
Alternatively, as shown in FIG. 5, a reflow furnace 41 may be provided downstream of the dispenser device 34 as seen from the running direction of the tape 12, as shown in FIG.

In order to drop the solder paste into the concave portion 14 of the tape 12 using the above-described carrier tape manufacturing apparatus 30, first, the tape 12 is step-traveled at a predetermined speed by the tape traveling device 34. First, when the first row of the recesses 14 reaches just below the syringe 35 of the dispenser device 34, the tape 12 is temporarily stopped at that position for a predetermined short time, and a predetermined amount of solder paste is dropped from the syringe 35 into the recesses 14. Next, the running of the tape is started again, and when the next row of the concave portion 14 reaches immediately below the syringe 42, the tape 12 is stopped, and a predetermined amount of solder paste is dropped from the syringe 35 into the concave portion 14, and thereafter, Repeat this. That is, every time the concave portion 14 reaches the position immediately below the syringe 35, the tape 12 runs stepwise so as to stop at that position for a short predetermined time. Subsequently, the solder paste in the concave portion 14 is heated and melted by the heating device 36 disposed below the tape 12, and the paste components and the like other than the solder components evaporate and the solder components are integrated into a solder ball. Invert. Through the above steps, the carrier tape 10 of the present embodiment can be manufactured.

Next, the first solder bump forming method is applied, and using the carrier tape 10 of this embodiment, an IC is formed.
The procedure for forming solder bumps on the electrode solder lands of the chip will be described. FIG. 6 is a schematic sectional view illustrating the state of the IC chip and the carrier tape in the reflow furnace, and FIG. 7 is a schematic view of the solder bumps formed on the electrode solder lands of the IC chip. First, in order to improve the solder wettability of the electrode solder land 44, a flux is applied on the electrode solder land 44, and then the IC chip is turned in the reflow furnace 46 with the electrode solder land 44 facing down as shown in FIG. 42 is held. On the other hand, the carrier tape 10 is stepped under the IC chip 42 so that the electrode solder lands 44 are directly above the solder balls 18 formed on the carrier tape 10 during the suspension of the carrier tape 10. Position 42. Then I
The C tip 42 is moved downward to bring the electrode solder land 44 into contact with the solder ball 18. The solder balls 18 are heated and melted by the reflow furnace 46, separated from the carrier tape 10 and adhered to the electrode solder lands 44, and then cooled, as shown in FIG.
Becomes

Embodiment 2 This embodiment is another example of the embodiment of the solder bump carrier tape according to the present invention. FIG. 8 is a sectional view of a concave portion of the solder bump carrier tape of this embodiment. The carrier tape 50 of the embodiment is a tape 52
Is formed as a laminated film including a first layer polyimide resin film 54, a copper foil layer 56, and a second layer polyimide resin film 58, and as shown in FIG.
The copper foil 56 is exposed from the bottom of the concave portion 14 formed in
It has a configuration in which the solder ball 18 and the copper foil 56 are joined. Thus, even if the carrier tape 50 is moved, there is no possibility that the solder balls 18 move out of the recess. The carrier tape 50 is the carrier tape of the first embodiment except that the tape 52 is formed as a laminated film, the copper foil 56 is exposed from the bottom of the concave portion 14, and the solder ball 18 and the copper foil 56 are joined. It is produced in the same manner as the tape 10.

Embodiment 3 This embodiment is still another example of the embodiment of the solder bump carrier tape according to the present invention. FIG. 9 is a sectional view of a concave portion of the solder bump carrier tape of this embodiment. Solder bump / carrier tape 6 of this embodiment
0 indicates that the tape 62 is configured as a laminated film tape obtained by laminating a polyimide resin film,
Example 1 except that the shape of
The same configuration as that of the carrier tape 10 is provided. As shown in FIG. 9, the tape 62 is formed as a laminated film of four polyimide resin films 66A to 66D,
Is formed by laminating three layers of films 66B to 66D each having an opening with a different opening diameter on the first layer film 66A such that the openings are substantially concentric and the opening diameters are sequentially enlarged. Is done. One solder ball 18 is accommodated in one recess 64.

Embodiment 4 This embodiment is a modification of Embodiment 3 and is similar to that of FIG.
Reference numeral 0 is a cross-sectional view of the concave portion of the solder bump carrier tape of the embodiment. Carrier tape 70 of this embodiment
As shown in FIG. 10, the first layer film 66 and the second layer
A copper foil layer 72 is interposed between the copper foil 72 and the layer film 66B, the copper foil 72 is exposed from the bottom of the concave portion 64 formed in the tape 62, and the solder ball 18 (not shown) and the copper foil 72 are joined. It has the same configuration as the carrier tape 60 of the third embodiment except that it has the configuration described above.

Embodiment 5 This embodiment is another example of the embodiment of the solder bump carrier tape according to the present invention. FIG. 11A is a perspective view of the solder bump carrier tape of the present embodiment, and FIG. 11B is a cross-sectional view of the concave portion taken along line III-III in FIG. Carrier tape 80 of this embodiment
As shown in FIG. 11 (a), the tape 12 has a low tape surface area 84 lower than the surrounding tape surface 82 in the longitudinal direction of the tape for each IC chip, and accommodates the solder balls 18. Except that a recess group, which is a group of the recesses 14, is provided in the low tape surface area 84, respectively.
It has the same configuration as the carrier tape 10 of the first embodiment. As a result, as shown in FIG.
4 and the IC chip 42 contained in the solder ball 18
Contact with the electrode solder land 44 can be facilitated.

Embodiment 6 This embodiment is an example of an embodiment of the second solder bump forming method, in which a solder bump is formed on an electrode solder land of an IC chip by using a carrier tape on which a solder paste is arranged. Here is an example. In the present embodiment, the tape traveling device 32 and the dispenser device 34 of the carrier tape manufacturing device 30 shown in FIG. 4 and the reflow furnace 46 shown in FIG. 6 are used. First, as shown in FIG. 2, a concave portion 14 is formed in the tape 12 in the same manner as in the manufacture of the carrier tape 10 according to the first embodiment. Next, using the tape running device 32 and the dispenser device 34 of the carrier tape manufacturing device 30, the concave portion 14 of the tape 12 to be step-run is filled with the solder paste in the same manner as in the first embodiment. The electrode solder land 44 is held in the reflow furnace 46 with the electrode solder land 44 facing downward.
When the concave portion 14 reaches below the C chip 42, the running of the tape 12 is temporarily stopped. During the suspension period of the tape 12, the IC chip 42 is positioned so that each of the electrode solder lands 44 is directly above the solder paste filled in the concave portion 14, and then the IC chip 42 is moved downward to make contact with the electrode solder lands 44. The solder paste is brought into contact with the solder paste, and the solder paste is heated and melted by the reflow furnace 46.
As a result, the paste component evaporates, the solder component melts and integrates, separates from the concave portion 14 of the tape 12 and adheres to the electrode solder land 44, and then, when cooled, becomes a solder bump 48 as shown in FIG. . At this time, a flux may be applied on the electrode solder land 44 in order to improve the solder wettability of the electrode solder land 44.

[0027]

According to the present invention, each recess in a group of a large number of recesses provided on the tape surface so as to have the same arrangement as the electrode arrangement of the IC chip and to have the opening diameter enlarged toward the opening end. By forming the solder ball carrier tape so as to accommodate the solder balls, respectively, a solder ball carrier tape which is easy to manufacture and can reliably transfer the solder ball to the electrode solder land to form a solder bump is provided. Has been realized. According to the method of manufacturing a solder ball carrier tape, the solder ball carrier tape according to the present invention can be easily manufactured. According to the solder bump forming method according to the present invention, the solder ball is securely transferred to the electrode solder land using the solder ball carrier tape according to the present invention without causing a work error such as a solder bump formation omission. Since solder bumps can be formed by soldering, almost no rework is required when forming solder bumps. Therefore, according to the solder bump forming method of the present invention, a solder bump can be formed on an electrode of an IC chip or the like with high productivity.

[Brief description of the drawings]

FIG. 1 is a plan view of a solder bump carrier tape of a first embodiment.

FIG. 2 is a sectional view of a concave portion of the solder bump carrier tape taken along a line II in FIG. 1;

FIGS. 3A to 3D are cross-sectional views of the tape in respective steps when forming a concave portion in the tape.

FIG. 4A is a schematic perspective view showing a configuration of a main part of a carrier tape manufacturing apparatus for manufacturing the carrier tape according to the first embodiment, and FIG. 4B is a line of FIG. 4A; It is a typical tape sectional view showing formation of a solder ball in II-II.

FIG. 5 is a diagram showing a configuration in a case where a reflow furnace is provided behind a dispenser device.

FIG. 6 is a schematic sectional view illustrating a state of an IC chip and a carrier tape in a reflow furnace.

FIG. 7 is a schematic view of a solder bump formed on an electrode solder land of an IC chip.

FIG. 8 is a sectional view of a concave portion of the solder bump carrier tape according to the second embodiment.

FIG. 9 is a sectional view of a concave portion of the solder bump carrier tape according to the third embodiment.

FIG. 10 is a sectional view of a concave portion of the solder bump carrier tape of the fourth embodiment.

11 (a) is a perspective view of a solder bump carrier tape according to Embodiment 5, and FIG. 11 (b) is FIG.
FIG. 3A is a cross-sectional view of the concave portion along line III-III in FIG.

[Explanation of symbols]

 Reference Signs List 10 solder bump carrier tape of embodiment 1 12 tape 14 recess 16 recess group 18 solder ball 20 solder ball group 22 sprocket hole 24 photoresist film 26 opening pattern 28 mask 30 carrier tape manufacturing device 32 tape traveling device 34 dispenser device 35 syringe 36 Heating device 38 Drive sprocket 40 Floating sprocket 41 Reflow furnace 42 IC chip 44 Electrode solder land 46 Reflow furnace 48 Solder bump 50 Solder ball carrier tape 52 of Embodiment 2 52 Tape 54 First layer film 56 Copper foil layer 58 Second layer Film 60 Solder bump / carrier tape of Embodiment 3 62 Tape 64 Recess 66 Film 70 Solder ball / carrier tape of Embodiment 4 72 Copper foil layer 80 Embodiment Solder ball / carrier tape of Embodiment 5 82 Peripheral tape surface 84 Low tape surface area

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-2-30140 (JP, A) JP-A-60-182797 (JP, A) JP-A-7-307561 (JP, A) JP-A-10- 93230 (JP, A) JP-A-5-251512 (JP, A) JP-A-4-78145 (JP, A) JP-A-2-295186 (JP, A) (58) Fields investigated (Int. ⁷ , DB name) H01L 21/60 H05K 3/34 505

Claims (8)

(57) [Claims] 1. An electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, etc.
This is a solder ball carrier tape used when forming solder bumps on C-chip electrode solder lands). It is formed of a material having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder. The tape is provided on the tape surface in the same arrangement as the electrode arrangement of the IC chip, and the opening diameter increases toward the opening end.
A group of a plurality of recesses having a longitudinal cross-sectional shape larger than the solder ball accommodating the opening diameter at each of the recesses, and a recess group provided for each IC chip and separated in the longitudinal direction of the tape; Solder balls contained one by one
Provided, wider than the electrode array area of the IC chip and surrounding tape
A plurality of low tape surface areas lower than the surface
The tape is provided on the tape at a distance in the longitudinal direction of the tape, and each recess group is provided in the low tape surface area.
A solder ball carrier tape , characterized in that: 2. The solder ball according to claim 1, wherein the tape is formed as a laminated film of a plastic film having low solder wettability and having heat resistance at a temperature equal to or higher than the melting point of the solder. Carrier tape. 3. The tape is a laminated film of a plastic film in which a metal foil is interposed in a longitudinal direction in the laminated film,
3. The solder ball carrier tape according to claim 2, wherein the metal foil is exposed from the bottom of the recess, and the exposed metal foil and the solder ball are joined. 4. The solder ball carrier tape according to claim 1, wherein sprocket holes are provided along both side edges of the tape. 5. An electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, etc.
A method for producing a solder ball / carrier tape, which is used when forming solder bumps on an electrode solder land of a C chip, which has low solder wettability and has heat resistance at a temperature equal to or higher than the melting point of solder. A group of a large number of concave portions each having a vertical cross-sectional shape that is arranged in the same arrangement as the electrode arrangement of the IC chips and has an opening diameter that increases toward the opening end on the tape formed by Forming the solder paste in the longitudinal direction of the tape, dropping the solder paste from the dispenser into each recess, heating and melting the solder paste in a non-oxidizing atmosphere, then cooling and converting to solder balls A method of manufacturing a solder ball carrier tape. 6. An electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, etc.
A solder ball / carrier tape manufacturing apparatus used when forming solder bumps on an electrode solder land of a C chip), which is arranged in the same arrangement as the electrode arrangement of the IC chip, and has an opening diameter respectively. A recess forming apparatus for forming a group of a large number of recesses having a longitudinal cross-sectional shape that expands toward an opening end on a tape at a distance in the longitudinal direction of the tape for each IC chip; A tape running mechanism for continuously running the tape having a predetermined interval at a predetermined interval; a multi-nozzle dispenser for dropping solder paste into each recess of the tape during a suspension of the running of the tape during the step running; and a drop for the tape recess. And a reflow furnace for heating and melting the solder paste in a non-oxidizing atmosphere to convert the solder paste into solder balls. Equipment for manufacturing solder ball and carrier tape. 7. An electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, and the like (hereinafter, referred to as a terminal solder land) using the solder ball carrier tape according to any one of claims 1 to 4 . This is a method of forming solder bumps on an electrode solder land of an IC chip collectively, in which a solder ball / carrier tape is continuously stepped at a predetermined interval, and the electrodes are turned downward during a running suspension period. Holding the IC chip, aligning the electrodes with the recesses, and bringing the electrodes into contact with the solder balls; heating and melting the solder balls in contact with the electrodes in a non-oxidizing atmosphere to form the solder balls on the electrode solder lands Transferring and forming a solder bump. 8. An electrode solder land for an electronic component and an IC chip, a terminal solder land for a mounting board, and the like.
A method of forming solder bumps on an electrode solder land of a C chip), comprising: a tape formed of a material having low solder wettability and heat resistance at a temperature equal to or higher than the melting point of solder; Forming a group of a large number of concave portions having a vertical cross-sectional shape in which the opening diameter is increased toward the opening end and arranged in the same direction as that of the tape in the tape in the longitudinal direction of each IC chip. A step in which a tape having a group of concave portions on the tape surface is continuously stepped at a predetermined interval, and a step of dropping solder paste from the dispenser into each concave portion during the step suspension of the tape traveling stepwise; Holding the IC chip, aligning the electrode with the concave portion, and bringing the electrode into contact with the solder paste; and solder paste contacting the electrode. Is heated and melted in a non-oxidizing atmosphere, and the solder is transferred onto the solder land of the electrode.
Forming a solder bump.