JP3112466B2 - Control device for multiple semiconductor manufacturing equipment - Google Patents
Control device for multiple semiconductor manufacturing equipmentInfo
- Publication number
- JP3112466B2 JP3112466B2 JP02133588A JP13358890A JP3112466B2 JP 3112466 B2 JP3112466 B2 JP 3112466B2 JP 02133588 A JP02133588 A JP 02133588A JP 13358890 A JP13358890 A JP 13358890A JP 3112466 B2 JP3112466 B2 JP 3112466B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- unit
- radio signal
- manufacturing apparatuses
- remote control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Selective Calling Equipment (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、複数台の半導体製造装置の制御装置に関
し、特に遠隔操作が可能な制御装置に関する。Description: Object of the Invention (Field of Industrial Application) The present invention relates to a control device for a plurality of semiconductor manufacturing apparatuses, and more particularly to a control device capable of remote control.
（従来の技術） 従来の半導体製造装置、例えばワイヤボンディング装
置では、ボンディング情報などの動作制御情報を入力す
る操作パネルが装置本体と一体に設けられている。この
ため、ワイヤボンディング装置を複数台同時に動作させ
ようとする場合、装置ごとに作業者が一人付いて装置の
管理を行なうか、あるいは一人の作業者が複数台の装置
を管理するという方法をとっていた。(Prior Art) In a conventional semiconductor manufacturing apparatus, for example, a wire bonding apparatus, an operation panel for inputting operation control information such as bonding information is provided integrally with the apparatus main body. For this reason, when attempting to operate a plurality of wire bonding apparatuses at the same time, a method is employed in which one worker manages the apparatus by each apparatus or one worker manages a plurality of apparatuses. I was
（発明が解決しようとする課題） 前者の場合、装置ごとに作業者が付くために生産性は
よくなるが、製造される半導体装置一つ当たりに対する
人件費の割り合いが高くなる。また後者の場合、製造す
る半導体装置の品種変更により今まで設定されていた動
作制御情報を変更する必要が生じた場合、一人の作業者
が複数台の装置それぞれのところまでいき、それぞれの
装置に対し設定されている情報の変更をしなければなら
ず、対応に長時間を要し非効率的であった。(Problems to be Solved by the Invention) In the former case, the productivity is improved because an operator is assigned to each device, but the ratio of labor cost per semiconductor device to be manufactured increases. In the latter case, if it is necessary to change the operation control information that has been set so far due to a change in the type of semiconductor device to be manufactured, one worker goes to each of the plurality of devices, and On the other hand, it is necessary to change the set information, and it takes a long time to respond, which is inefficient.
本発明は、容易かつ効率的に生産性を向上させること
ができる、複数台の半導体製造装置の制御装置を提供す
ることを目的とする。An object of the present invention is to provide a control device for a plurality of semiconductor manufacturing apparatuses, which can easily and efficiently improve productivity.
［発明の構成］ （課題を解決するための手段） 本発明は、複数台の半導体製造装置と、これらの半導
体製造装置とは別体に形成され、各半導体製造装置の動
作制御情報を設定可能な入力部とこの入力部で設定され
た前記動作制御情報を電波信号に変換して出力する出力
部とを有する遠隔制御部と、前記各半導体製造装置に設
けられ、前記遠隔制御部の出力部からの電波信号を受信
する受信部とこの受信部で受信した電波信号に応じて動
作信号を出力する信号識別部とを有してなる複数台の半
導体製造装置の制御装置において、前記複数台の半導体
製造装置がそれぞれ備える受信部は、前記遠隔制御部の
出力部から出力される前記動作制御情報に関する電波信
号を共通して受信するもので、前記遠隔制御部の出力部
からの電波信号が前記各半導体製造装置の受信部にて共
通して受信されることで前記複数台それぞれの半導体製
造装置にその動作制御情報が同時に設定されることを特
徴とする。[Configuration of the Invention] (Means for Solving the Problems) The present invention is formed separately from a plurality of semiconductor manufacturing apparatuses and these semiconductor manufacturing apparatuses, and can set operation control information of each semiconductor manufacturing apparatus. A remote control unit having an input unit and an output unit for converting the operation control information set by the input unit into a radio signal and outputting the signal, and an output unit of the remote control unit provided in each of the semiconductor manufacturing apparatuses. In a control device for a plurality of semiconductor manufacturing apparatuses, comprising a receiving unit that receives a radio signal from the device and a signal identification unit that outputs an operation signal in accordance with the radio signal received by the receiving unit, The receiving unit provided in each of the semiconductor manufacturing apparatuses commonly receives a radio signal related to the operation control information output from the output unit of the remote control unit, and the radio signal from the output unit of the remote control unit is Each half Characterized in that the operation control information to said plurality each of the semiconductor manufacturing apparatus by being commonly received by the receiving portion of the body manufacturing apparatus is set at the same time.
（作用） 本発明によれば、遠隔制御部の出力部より、ある動作
制御情報に関する電波信号が出力されると、その電波信
号は各半導体製造装置の受信部にて共通して受信される
こととなり、これにより複数台それぞれの半導体製造装
置を一まとめにした形でその動作制御情報が同時に設定
されることになる。(Operation) According to the present invention, when a radio signal related to certain operation control information is output from the output unit of the remote control unit, the radio signal is received in common by the reception units of the semiconductor manufacturing apparatuses. As a result, the operation control information is simultaneously set in a form in which a plurality of semiconductor manufacturing apparatuses are put together.
つまり、遠隔制御部の出力部から出力される同一信号
によって、複数台の半導体製造装置においては、一斉に
同じものを製造できる状態に設定されることになる。That is, the same signal output from the output unit of the remote control unit sets a plurality of semiconductor manufacturing apparatuses in a state where the same one can be manufactured all at once.
（実施例） 本発明の一実施例について、第１図乃至第２図を用い
て説明する。(Embodiment) An embodiment of the present invention will be described with reference to FIG. 1 and FIG.
第１図は本発明に係わる複数台の半導体製造装置の制
御装置の基本構成の一例を示す構成図、第２図はその使
用状態を示す図である。FIG. 1 is a configuration diagram showing an example of a basic configuration of a control device of a plurality of semiconductor manufacturing apparatuses according to the present invention, and FIG. 2 is a diagram showing a use state thereof.
第１図において、遠隔制御部１には、半導体製造装
置、例えばワイヤボンディング装置Ｍに与えるべき、品
種情報やボンディングスピード情報などの動作制御情報
を入力可能な操作パネル２が設けられている。この操作
パネル２は記憶回路３と接続されており、操作パネル２
により入力された入力情報が蓄積可能とされる。さらに
記憶回路３は、出力部４とも接続されている。In FIG. 1, a remote control unit 1 is provided with an operation panel 2 capable of inputting operation control information such as type information and bonding speed information to be given to a semiconductor manufacturing apparatus, for example, a wire bonding apparatus M. The operation panel 2 is connected to the storage circuit 3, and the operation panel 2
Allows the input information input to be stored. Further, the storage circuit 3 is also connected to the output unit 4.
一方ワイヤボンディング装置Ｍには、出力部４からの
電波信号を受信可能な受信部５が設けられている。この
受信部５は、信号識別部６に接続されている。On the other hand, the wire bonding apparatus M is provided with a receiving unit 5 capable of receiving a radio signal from the output unit 4. The receiving section 5 is connected to the signal identifying section 6.
次に動作について第２図を用いて説明する。 Next, the operation will be described with reference to FIG.
例えば、クリーンルーム内に配置された複数台のワイ
ヤボンディング装置M1、M2、M3、…Mnを制御する場合、
まず作業者は、操作パネル２により、製造する半導体装
置に関する必要なボンディング情報、つまり動作制御情
報の入力を行なう。この後、作業者が操作パネル２の始
動スイッチをONにすることによって、記憶回路３に記憶
されたボンディング情報が出力部４に送られ、電波信号
に変換されて出力される。For example, when controlling a plurality of wire bonding apparatuses M1, M2, M3,... Mn arranged in a clean room,
First, an operator inputs necessary bonding information relating to a semiconductor device to be manufactured, that is, operation control information, through the operation panel 2. Thereafter, when the operator turns on the start switch of the operation panel 2, the bonding information stored in the storage circuit 3 is sent to the output unit 4, where it is converted into a radio signal and output.
出力された電波信号は、各ワイヤボンディング装置M
1、M2、M3、…Mnが有するそれぞれの受信部５にて受信
され、受信された電波信号は信号識別部６に送られる。
信号識別部６は、この電波信号を識別し、動作信号に変
換して出力する。そしてワイヤボンディング装置M1、M
2、M3、…Mnは、動作信号、すなわち、記憶回路３に記
憶されたボンディング情報に基づいて作動する。この後
ワイヤボンディング装置M1、M2、M3、…Mnは、新たな指
令、例えば、停止指令が送られるまでボンディング情報
に基づく動作を行なう。The output radio signal is transmitted to each wire bonding device M
, Mn, and the received radio signals are sent to the signal identification unit 6.
The signal identification unit 6 identifies the radio signal, converts the signal into an operation signal, and outputs the operation signal. And wire bonding equipment M1, M
, Mn operate based on the operation signal, that is, the bonding information stored in the storage circuit 3. Thereafter, the wire bonding apparatuses M1, M2, M3,... Mn operate based on the bonding information until a new command, for example, a stop command is sent.
このように上記実施例によれば、一つの遠隔制御部１
による遠隔操作により、複数台のワイヤボンディング装
置M1、M2、M3、…Mnを一まとめにした形でその動作制御
情報を同時に設定することが可能となる。このため、複
数台のワイヤボンディング装置M1、M2、M3、…Mnに対し
て、半導体装置の品種変更等によるボンディング情報な
どの動作制御情報の変更を、一人の作業者が遠隔位置に
おいて容易かつ迅速に行なうことができ、個々の装置の
ところまでいちいち行って１台１台の装置に対し変更情
報を入力していた従来に比べ、時間短縮を行なえ、生産
性が大幅に向上する。Thus, according to the above embodiment, one remote control unit 1
, The operation control information can be simultaneously set in a form in which a plurality of wire bonding apparatuses M1, M2, M3,. Therefore, one worker can easily and quickly change operation control information such as bonding information due to a change in the type of a semiconductor device in a plurality of wire bonding apparatuses M1, M2, M3,. The time can be reduced and the productivity can be greatly improved as compared with the related art in which the change information is input to each of the individual devices one by one.
また遠隔制御部１とワイヤボンディング装置M1、M2、
M3、…Mnとが無線状態であるため、ワイヤボンディング
装置M1、M2、M3、…Mnのレイアウトの変更等も自由に行
うことができる。In addition, the remote control unit 1 and the wire bonding devices M1, M2,
Since M3,... Mn are in the wireless state, the layout of the wire bonding apparatuses M1, M2, M3,.
なお上記一実施例において、ボンディング情報は、遠
隔制御部１の記憶回路３に記憶されていたが、各ワイヤ
ボンディング装置M1、M2、M3、…Mnの本体内に記憶回路
を設け、ボンディング情報を操作パネル２により入力す
るごとにワイヤボンディング装置M1、M2、M3、…Mn内の
記憶回路に記憶されるようにしてもよい。In the above embodiment, the bonding information is stored in the storage circuit 3 of the remote control unit 1. However, a storage circuit is provided in the main body of each of the wire bonding apparatuses M1, M2, M3,. .. Mn may be stored in a memory circuit in each of the wire bonding apparatuses M1, M2, M3,.
また本発明において、制御する装置はワイヤボンディ
ング装置に限らず、ペレットボンディング装置やモール
ド装置等に対しても適用できる。Further, in the present invention, the controlling device is not limited to the wire bonding device, and can be applied to a pellet bonding device, a molding device, and the like.
［発明の効果］ 本発明によれば、複数台の半導体製造装置に対する動
作制御情報の設定を、遠隔制御部からの同一信号によっ
て同時に、しかも無線状態で行なえるため、容易かつ効
率的に生産性を向上させることが可能となる。[Effects of the Invention] According to the present invention, operation control information for a plurality of semiconductor manufacturing apparatuses can be set simultaneously and wirelessly by the same signal from a remote control unit, so that productivity can be easily and efficiently increased. Can be improved.
第１図は本発明に係わる複数台の半導体製造装置の制御
装置の基本構成の一例を示す構成図、第２図はその使用
状態を示す図である。 １……遠隔制御部 ２……操作パネル ３……記憶回路 ４……出力部 ５……受信部 ６……信号識別部 Ｍ……ワイヤボンディング装置FIG. 1 is a configuration diagram showing an example of a basic configuration of a control device of a plurality of semiconductor manufacturing apparatuses according to the present invention, and FIG. 2 is a diagram showing a use state thereof. DESCRIPTION OF SYMBOLS 1 ... Remote control part 2 ... Operation panel 3 ... Memory circuit 4 ... Output part 5 ... Receiving part 6 ... Signal identification part M ... Wire bonding apparatus
Claims (1)
製造装置の動作制御情報を設定可能な入力部とこの入力
部で設定された前記動作制御情報を電波信号に変換して
出力する出力部とを有する遠隔制御部と、 前記各半導体製造装置に設けられ、前記遠隔制御部の出
力部からの電波信号を受信する受信部とこの受信部で受
信した電波信号に応じて動作信号を出力する信号識別部
とを有してなる複数台の半導体製造装置の制御装置にお
いて、 前記複数台の半導体製造装置がそれぞれ備える受信部
は、前記遠隔制御部の出力部から出力される前記動作制
御情報に関する電波信号を共通して受信するもので、前
記遠隔制御部の出力部からの電波信号が前記各半導体製
造装置の受信部にて共通して受信されることで前記複数
台それぞれの半導体製造装置にその動作制御情報が同時
に設定されることを特徴とする複数台の半導体製造装置
の制御装置。A plurality of semiconductor manufacturing apparatuses, an input unit formed separately from the semiconductor manufacturing apparatuses, and capable of setting operation control information of each of the semiconductor manufacturing apparatuses, and the operation set by the input units. A remote control unit having an output unit for converting control information into a radio signal and outputting the radio signal; a reception unit provided in each of the semiconductor manufacturing apparatuses and receiving a radio signal from the output unit of the remote control unit; And a signal identification unit that outputs an operation signal in response to the radio signal received in the control unit for a plurality of semiconductor manufacturing apparatuses, wherein the reception units provided in the plurality of semiconductor manufacturing apparatuses respectively include the remote control A radio signal related to the operation control information output from the output unit of the remote control unit is received in common, and a radio signal from the output unit of the remote control unit is commonly received by the reception unit of each of the semiconductor manufacturing apparatuses. Is Control device for a plurality of semiconductor manufacturing apparatus and wherein said that the operation control information to a plurality each of the semiconductor manufacturing device is set at the same time by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02133588A JP3112466B2 (en) | 1990-05-23 | 1990-05-23 | Control device for multiple semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP02133588A JP3112466B2 (en) | 1990-05-23 | 1990-05-23 | Control device for multiple semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0428238A JPH0428238A (en) | 1992-01-30 |
| JP3112466B2 true JP3112466B2 (en) | 2000-11-27 |
Family
ID=15108319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP02133588A Expired - Lifetime JP3112466B2 (en) | 1990-05-23 | 1990-05-23 | Control device for multiple semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3112466B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI249760B (en) | 1996-07-31 | 2006-02-21 | Canon Kk | Remote maintenance system |
-
1990
- 1990-05-23 JP JP02133588A patent/JP3112466B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0428238A (en) | 1992-01-30 |
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