JP3056768U - Modular jack - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a standard shield surface and a format variable (RJ) for a high speed network having a matched ultra-high frequency transmission line modulation function
-45). SOLUTION: It is composed of a rectangular case made of plastic with front and rear openings, and some electric wires of different electric circuits, and these electric wires are inserted in front of the rear end of the case and provided in the case. A contact spring device supported by a vertical plastic block and bent at a right angle at a rear end of the vertical plastic block; and a bottom end of the plastic block used for connection with one printed circuit board main board. And one electronic circuit in the plastic block.

Description

[Detailed description of the invention]

[0001]

[Technical field to which the invention belongs]

 The present invention relates to a standard shield surface for high-speed networks having a kind of matched ultra-high-frequency transmission line modulation function and a modular jack having a format variable (RJ-45).

[0002]

[Prior art]

 In the connection of the network interface, some kind of signal modulation is often made near the RJ-45 type 3 or 5 type modular jack. Its purpose is for various parasitic signals, such as high frequency noise, differential mode direct current (DC), common mode voltage, and the like. HALO Electronics of the United States sells various magnetic material sets, for example, 16 pin SOIC isolation module of ULTRA TM series, and various types in applying the IEEE802.3 standard to 10 / 100B ASE-TX and ATM155. Used to achieve the requirements of U.S. Pat. No. 5,474,474, issued to John Siemon et al. On December 12, 1995, provides a background on modular jacks and their application to networks, as well as a full listing of prior art. Have been.

[0003] Some vendors have already incorporated signal modulation components into the modular jack body. For example, U.S. Pat. No. 5,647,767, issued to Peter Scherer et al. On Jul. 15, 1997, shows a modular jack with a rear fitting, which includes some signal modulating components. I have. However, according to this technique, it was necessary to provide one rather large case extension behind the modular jack to accommodate a piece of printed circuit board. Therefore, in terms of mixability and function, it was impossible to use it instead of the general plugs already used in various network products. Venkat A. on December 24, 1996. U.S. Pat. No. 5,587,884 to Raman shows another type of modular jack, which is provided with a mating body having some signal modulating components therein, a ring modulator and a ring modulator. Other magnetic materials are sealed in the fitting. This technique by Raman also required a fairly large casing to accommodate a piece of small, sideways printed circuit board used for each magnetic body. As a result, it could not directly replace most of the standard connectors currently on the market.

[0004] Gregory Loudermilk et al. Provide a type of filtered modular jack for signal modulation required for high-speed communication systems, which occupies an area occupied by printed circuit motherboards. It is made to correspond to. However, none of the drawings and descriptions depicted in U.S. Pat. No. 5,687,233, which they obtained on Nov. 11, 1997, provided a large extension behind the pin array and a rearward extension of the casing. It is described that it contains the printed circuit board of one signal generator.

[0005] According to US Pat. No. 5,069,641 issued to Yukio Sakamoto et al. On Dec. 3, 1991, a moderate extension is provided behind the RJ-45 modular jack. Several small vertical printed circuit boards are mounted above the pins in rows. One ring modulator is mounted on the printed circuit board. However, Gregory Loudermilk et al. Have sufficient precision that the RJ-45 modular jack presented by Yukio Sakamoto et al. Can adapt to the signal conditioning function in high-speed transmission such as LAN and ATM exchange. Admit it is not.

[0006]

[Problems to be solved by the invention]

 Therefore, an object of the present invention is to provide a kind of modular jack having a matching signal modulation function, and to match the shield surface of the modular jack with a normal modular jack having no signal modulation function.

Another object of the present invention is to provide a kind of modular jack system, in which one single-row multi-port modular jack on a printed circuit board is replaced with a second single-row multi-port. The task is to be able to accommodate port type modular jacks.

Another object of the present invention is to provide a kind of modular jack system, which can ensure reliability after welding work to a main board by combining other parts. .

[0009]

[Means for Solving the Problems]

 SUMMARY OF THE INVENTION The invention of claim 1 provides a kind of standard shield surface for high-speed networks having a matched ultra-high-frequency transmission line modulation function and a modular jack having a format variable (RJ-45). Wherein the front end of the case is open and accommodates a conforming RJ-45 modular socket, and opposite the front end has an open rear end. Case, one contact spring device, which is composed of several electric wires of different electric circuits, these electric wires being inserted forward from the rear end of the case, and a vertical plastic provided in the case. The contact spring device supported by the block and bent at a right angle at the rear end of the vertical plastic block, a set of pins, and a printed circuit board main body; The pin, which is used for connection with the board and is located at the bottom end of the plastic block, is an electronic circuit. The electronic circuit is provided in the plastic block, and is provided via the pin. The electronic circuit, which is connected to the LAN interface cable of the contact spring device and provides one interface between the physical layer devices (PHYs) of one network interface controller; Jack.

[0010] The invention of claim 2 is characterized in that the electronic circuit includes a common mode ring modulator so as to suppress interference of noise generated when the Ethernet is operated on the LAN interface cable. The modular jack according to claim 1.

[0011] The invention of claim 3 is characterized in that the electronic circuit comprises an isolating transformer to suppress interference of noise generated when the Ethernet is operated on the LAN interface cable. The modular jack according to claim 1.

The invention of claim 4 is characterized in that the electronic circuit comprises a resistor matching transformer and is used for Ethernet signal matching between the pin and a LAN interface cable. Modular jack described.

The invention of claim 5 is directed to a modular jack having a standard shield surface for high-speed network having a kind of matched ultra-high-frequency transmission line modulation function and a format variable (RJ-45), wherein the modular jack has one A plastic rectangular case, each case containing one RJ-45 modular socket, and some first open front end frame facing the first open front end frame; 2 Open rear end frame, the case is combined with a contact spring device, a set of pins, and an electronic circuit. The contact spring device is composed of a few electric wires of different electric circuits, and these electric wires are It is inserted forward of the rear end of the case and is supported by a vertical plastic block provided in the case. The set of pins is located at the bottom end of the plastic block, is used for connection with one printed circuit board main board, and the pins are provided in two rows in front and rear parallel, The distance between the pins is the same, and the electronic circuit is provided in the plastic block, connected to the LAN interface cable of the contact spring device via the pins, and connected to one network interface controller. One interface is provided between the physical layer devices (PHYs) of the present invention, and a modular jack having the above configuration is provided.

[0014] The invention according to claim 6 is that the some first open front end frames and the some second open rear end frames are located in one row connected to the printed circuit board main board after pins are mounted, A modular jack according to claim 5, characterized in that neither the case nor any plastic block substantially extends beyond the rear of the rear row of pins.

[0015] The invention according to claim 7 is characterized in that the first open front end frame and the second open rear end frame are arranged in two rows after pins are mounted, wherein the lower row and the printed circuit board main body are arranged. The boards are articulated, the upper row is adjacent to the first row and extends to the rear of the first row to accommodate a set of spring sets, both the case and the plastic block provided with this spring set are substantially in the rear row of pins. 6. The modular jack according to claim 5, wherein the rear end of the modular jack is not exceeded.

The invention according to claim 8 is characterized in that the electronic circuit includes a common mode ring modulator to suppress interference of noise generated when the Ethernet is operated on the LAN interface cable. It is a modular jack according to claim 5.

[0017] The invention of claim 9 is characterized in that the electronic circuit comprises an isolating transformer to suppress interference of noise generated when the Ethernet is operated on the LAN interface cable. A modular jack according to claim 5.

[0018] The invention of claim 10 is characterized in that the electronic circuit comprises a resistor matching transformer and is used for Ethernet signal matching between the pin and a LAN interface cable. It is a modular jack described in.

[0019]

[Embodiment of the invention]

 The two-row, eight-port type modular jack constructed according to the present invention is composed of one lower row, a four-frame insulated case for accommodating four RJ-45 type sockets at the front, and four molded fitting parts combined at the rear. including. The four-frame type insulating case and each molded fitting part are substantially the same as a single-row 4-port modular jack, and this single-row modular jack can be easily converted to a 2-row 8-port modular jack. . This transformation includes a four-body insulated case located in one upper row and containing four RJ-45 sockets in front, and a set of four relatively high molded fittings. The two form-fitting parts comprise a forwardly extending spring connection part, the rear part of which is located rearward, farther than above the lower first row. In addition, a three-piece Faraday shield is provided, one of which is a middle and lower shield part that shields the rear of each of the above-mentioned lower rows of the molded fitting parts, and the other is a middle and lower shielding parts of the above-mentioned upper row It is a rear shield part that shields the rear, and one is a front shield part that shields the front, both sides, and part of the upper part of the above-mentioned two four-machine type insulation cases. After combination, the three-piece Faraday shield is connected to a power source to form a type of continuous shield around the entire two-row, eight-port modular jack. Each of the molded-in components includes one signal modulation circuit to generate a corresponding match between a physical interface unit (PHY) or encoder / decoder and an unshielded two-wire cable connected to a high-speed computer network. The connection of the various circuits of the matching signal modulation of each fitting part is achieved not by soldering, but by welding.

[0020]

【Example】

 Illustrated in FIG. 1 is an embodiment of a single port modular jack 10 mounted on a printed circuit board, constructed in accordance with the present invention. The modular jack 10 has one quick-fit type insert 12 which is inserted into the rear end of a plastic case 14 and welded onto a printed circuit board. After the combination of the fitting part 12 and the case 14 is completed, one metal Faraday shield 16 shields the upper part, both sides, and the rear part to prevent electromagnetic radiation (EMR) for protection. The fastener 17 is welded to the bottom of the printed circuit board. An electrically conductive soft contact pad 18 is wrapped around the front end of the combined case 14 and shield 16 as well as coupled to an already installed socket, thus grounding the RJ-45 socket. Details of this structure are described in U.S. Pat. No. 5,647,765, issued to Haas et al. On July 15, 1997. Based on the above structure, the features of the present invention will be described below.

A set of spring connection parts 20 are passed through holes 21 of the partition wall of the case 14 and connected to an arbitrary RJ-45 device inserted from the front. Such RJ-45 connection systems belong to industry standards and are common in the modem network industry. The above-described spring connection component 20 conforms to eight industry definitions and interfaces with a circuit that extends through a plastic fitting 22.

The connection of a typical RJ-45 to a modem network is part of the physical interface layer and requires signal modulation. In the present invention, this signal modulation is performed completely within the volume range of the fitting 22 and is not performed at an off-connector portion or a dog house portion on the printed circuit board. The pin-out, pin layout, and overall format variables of the modular jack 10 are all very important, so their form, mixability, and functionality are very low on existing printed circuit boards. It must be the same as that used for the traditional modular jacks originally designed, otherwise, additional space must be added to the printed circuit board, or such a function must be added. The Faraday shield 16 cannot be provided, and the excellent effect of preventing electromagnetic radiation cannot be obtained.

In the embodiment of FIG. 1, signal modulation is performed by a pair of ring transformers 24 and 26, for example, manufactured by HALO Electronics of the United States. See US Pat. No. 5,656,985, issued Aug. 12, 1997 to Peter Lu et al.

Other signal modulation embodiments include iron oxide pieces and cores, flake capacitors, and balloon circuits. This signal modulation utilizes the connection of the electric wire welded to the contact 28 to the spring connection part 20. The contact 30 at the upper end of a set of eight printed circuit board connecting columns 32 is welded to the printed circuit board side for performing signal modulation. In the present invention, welding is adopted instead of soldering. This is because the solder melts again during the connection of the signal modulating component, which may cause an unexpected situation in terms of conductivity. Conventional modular jacks that employ soldering in this area had to inspect the fixation status by X-ray photography after soldering work, and then combined with a shield. The present invention eliminates the need for this X-ray inspection, thereby reducing manufacturing costs.

Instead of using soldering, it is also possible to connect the signal modulation component to the printed circuit board connecting column 32 of the printed circuit board by welding or conductive epoxy resin.

FIG. 2 shows an embodiment of a single-row four-port modular jack 40 constructed according to the present invention. The modular jack 40 includes a four-machine-type insulating case 42 for accommodating RJ-45 sockets from the front, and a set of four molded fitting parts 44 to 47 in total. The molded fitting parts 44 to 47 are substantially the same as the quick fitting type fitting part 12 in FIG. In addition, a two-part Faraday shield is combined, one rear part 48 shielding the rear of each of the molded fittings 44-47, and one front part of the four-body insulation case 42, And a front part 50 capable of covering the upper part and both sides. Each frame of this four-frame type insulation case 42 is the same as each other, and is combined when a special signal modulation is performed by a series of standardized molded fitting parts 44 to 47.

FIG. 3 shows an embodiment of a two-row, eight-port modular jack 60 of the present invention, which has a lower row, and a four-row rack that accommodates an RJ-45 socket from the front in the lower row. It includes an insulated case 62 and four molded fittings 64-67. The four-machine insulation case 62 and each of the molded fittings 64-67 are substantially the same as the single-row four-port modular jack shown in FIG. For this reason, the single-row type modular jack 40 shown in FIG. 2 can be quickly reassembled into the two-row 8-port modular jack 60 shown in FIG.

This reassembly includes an upper row including four molded fittings 70-73, which form a set with a four-machine insulated case 68 for accommodating RJ-45 sockets from the front. 73 through 73 have forward extensions so that the molded fittings 70 through 73 are located rearward above the first row (lower row).

Three Faraday shields are provided, including a lower middle shield part 74 for rearwardly shielding the lower row of each of the molded inserts 64-67, and a respective lower row of the above described upper row of molded inserts. A rear shield part 76 that shields the rear of 70 to 73 and a front shield part 78 that shields the front and both sides of the above-mentioned four-machine-type insulating cases 62 and 68 and a part of the case 68 are included. After these are combined, each shield component 74, 76, 78 is connected to a power source so that they form one continuous shield around the entire two row, eight port modular jack 60. Each of the molded fitting parts 64-67 and 70-73 includes one signal modulation circuit, and is an unshielded balanced two-wire system connected to a physical interface device (PHY) or an encoder / decoder and a high-speed computer network. Form a kind of proper alignment between the cables. In this application, in order to realize this signal modulation and the electric circuit system under this condition, it is necessary to change the type of the circuit system and the combination part by the difference of the fitting parts. In the present invention, a fastening structure is adopted so that a user can fit a suitable fitting part to a designated position of the machine according to a type of signal modulation.

FIG. 4 is a side view of the double row 8-port modular jack 60 of FIG. Extension A at the end retains compatibility with existing plugs. That is, the maximum dimension of A is 0.1 inch. The first and second rows of pins 80 and 81 inserted into the printed circuit board are actually four pins in these two rows and are combined with each of the molded fittings 64-67. Similarly, pins 82 and 83 inserted into the third and fourth rows of printed circuit boards are actually four pins in these two rows and are combined with each of the molded fittings 70-73. Each of the molded fittings 64-67 and 70-73 has eight pins, referred to as P1 through P8. Pins P1, P3, P5, and P7 are centered in another row, 0.1 inches in the front row, 0.1 inches from each other. The second row of pins encompasses P2, P4, P6 and P8, which are also centered at 0.1 inch, except that pins P1, P3, P5 and P7 intersect 0.05 inch. ing. The connecting posts 84 are used to help secure these two rows of eight port modular jacks 60 as well as to align them with the printed circuit board 86. A pair of holes 87 to 91 (several rows) penetrating the plating film are connected to the connecting columns 84 and the pins 80 to 83 in each row.

FIG. 4 shows another critical layout of a signal modulation circuit system provided above pins mounted on a printed circuit board. Other electrical circuit systems can be installed in the free space above the molded fittings 64-67 and 70-73. This space is close to the top row of connector circuits 70-73. The signal modulation circuit system is preferably provided at the upper ends of the molded fittings 64-67 and 70-73, which can improve insulation and noise rejection performance.

FIG. 5 is a side view of the three-row modular jack 100, which begins with the two-row modular jack shown in FIGS. The rearmost extension B in FIG. 5 has a dimension of less than 0.1 inch to maintain compatibility with existing plugs. Due to the limitation on dimension A shown in FIG. 4, the third row 102 can be added relatively easily and does not pose the problem of increased cost due to the additional space on printed circuit board 104. The third set of molded fittings 106 to 109 are added behind the second set of fittings 70 to 73. The signal modulation circuit system of the third set of molded fittings 106-109 is also located above two rows of pins 110 and 112 which are mounted on the printed circuit board in a critical manner.

FIG. 6 shows a kind of DC isolation and filter capacitor circuit 120 which is applied to a 100BASE-T network and has pins P1 to P6 of a printed circuit board and contacts JI to J8 of an RJ-45 socket. , One physical interface device is connected to one cable interface. The DC isolation and filter capacitor circuit 120 is implemented in the matched signal modulation portion of any one of the molded-in components 64-67, 70-73 and 106-109.

FIG. 7 shows a kind of DC isolation and serial ring modulation circuit 130 which is applied to a 100BASE-T network and which has pins P1 to P6 of a printed circuit board and contacts JI to JR of an RJ-45 socket. One physical interface device is connected to one cable interface via J8. The DC isolation and serial ring modulation circuit 130 is implemented in a matched signal modulation section of any one of the molded-in components 64-67, 70-73 and 106-109.

FIG. 8 shows a kind of common mode ring modulation circuit 140 which is applied to a 100 BASE-T network and connects pins P1 to P6 of a printed circuit board and contacts JI to J8 of an RJ-45 socket. For example, one physical interface device is connected to one cable interface. The common mode ring modulation circuit 140 is implemented in a matched signal modulation section of any one of the molded-in components 64-67, 70-73 and 106-109.

[0036]

[Effects of the Invention] An advantage of the present invention is that a kind of multi-port modular jack provided by the present invention can exhibit a matching signal modulation function without having to extend the rear of the main case, and therefore a general modular jack can be provided. To be used to improve

Another advantage of the present invention is that the provided multi-port modular jack has a matching signal modulation function and is not interrupted during the welding operation on the main board.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an embodiment of a single-port modular jack of the present invention.

FIG. 2 is an exploded perspective view of the embodiment of the four-port single-row modular jack of the present invention.

FIG. 3 is an exploded perspective view of an embodiment of the 8-port double-row modular jack of the present invention.

FIG. 4 is a side view after the combination of FIG. 3;

FIG. 5 is a side view of a three-row modular jack to which the two-row modular jack of FIGS. 3 and 4 is applied.

FIG. 6 is a block diagram showing a DC isolation and a filter capacitor circuit in a matching signal modulation part in a molded fitting part of the embodiment of FIG. 5 in order to couple a physical interface device to a cable interface when the present invention is applied to a 100BASE-T network; It is an electric circuit diagram of the Example provided with.

FIG. 7 is a block diagram showing an embodiment of the present invention applied to a 100 BASE-T network; It is an electric circuit diagram of the Example provided with the circuit.

FIG. 8 is a block diagram showing a common mode ring modulation circuit in a matching signal modulation part in a molded fitting part of the embodiment of FIG. It is an electric circuit diagram of the example provided.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Modular jack 12 Fitting part 14 Case 16 Faraday shield 17 Fastening piece 20 Spring connecting part 22 Fitting body 28 Contact 30 Contact 32 Connecting column 40 Modular jack 42 Four-frame insulating case 44-47 Mold fitting part 48 Rear seed part 50 Front Part shield parts 60 Modular jack 62 Four-machine type insulating case 64-67 Molded fitting part 68 Four-machine type insulating case 70-73 Molded fitting part 74 Middle lower shield part 76 Rear shield part 78 Front shield part 84 Connecting column 86 Main board 102 Third row 104 Printed circuit board 106-109 Mold fitting part 110, 112 pin

[Procedure amendment]

[Submission date] September 10, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 1

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] Claim 5

[Correction method] Change

[Correction contents]

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H04M 1/00 H04L 11/02 Z

Claims (10)

[Utility model registration claims] A standard shield surface for a high-speed network having a kind of matched ultra-high-frequency transmission line modulation function and a modular jack having a format variable (RJ-45), comprising: a plastic rectangular case; Wherein the front end of the case accommodates an RJ-45 type modular socket which is adapted to be open and has a rear end which is open on the side opposite to the front end; The device is composed of several wires of different electric circuits, these wires being inserted forward from the rear end of the case and supported by a vertical plastic block provided in the case. The contact spring device, which is bent at a right angle at the rear end of the plastic block, is a set of pins, one printed circuit board main board and The pin, which is used for connection of the plastic block and is located at the bottom end of the plastic block, is an electronic circuit, and the electronic circuit is provided in the plastic block, and the contact spring device is provided via the pin. To provide one interface between physical layer devices (PHYs) of one network interface controller.
A modular jack comprising the above electronic circuit and the above. 2. The method according to claim 1, wherein said electronic circuit includes a common mode ring modulator to suppress noise interference generated when the Ethernet is operated on the LAN interface cable. Modular jack described. 3. The method according to claim 1, wherein the electronic circuit includes an isolation transformer to suppress noise interference generated when the Ethernet is operated on the LAN interface cable. Modular jack. 4. The modular jack of claim 1, wherein said electronic circuit includes a resistor matching transformer for use in Ethernet signal matching between said pins and a LAN interface cable. 5. A modular jack having a standard shield surface for a high-speed network having a kind of matched ultra-high-frequency transmission line modulation function and a format variable (RJ-45), wherein the modular jack comprises one plastic rectangular case. The case includes a first open front end frame in which one RJ-45 modular socket is accommodated, and a second open rear end frame opposed to the first open front end frame. The case is combined with a contact spring device, a set of pins, and an electronic circuit, the contact spring device is composed of a few electric wires of different electric circuits, and these electric wires are inserted forward from a rear end of the case. And supported by a vertical plastic block provided in the case, bent at a rear end of the vertical plastic block at a right angle, and One set of pins is located at the bottom end of the plastic block and is used for connection with one printed circuit board main board. The electronic circuit is provided in the plastic block, is connected to the LAN interface cable of the contact spring device via the pin, and is provided between the physical layer devices (PHY) of one network interface controller. A modular jack that provides one interface and has the above configuration. 6. The first open front end frame and the second open rear end frame are located in one row connected to the main board of the printed circuit board after the pins are mounted, and a case or any plastic is provided. 6. The modular jack of claim 5, wherein none of the blocks extend substantially beyond the rear of the rear row of pins. 7. The first open front end frame and the second open rear end frame are arranged in two rows after the pins are mounted, wherein the lower row and the printed circuit board main board are connected, The upper row is adjacent to the first row and extends to the rear of the first row to receive a set of spring sets, so that neither the case nor the plastic block provided with the spring sets substantially exceed the rear of the pins in the rear row. The modular jack according to claim 5, wherein: 8. The method according to claim 5, wherein the electronic circuit includes a common mode ring modulator to suppress interference of noise generated when the Ethernet is operated on the LAN interface cable. Modular jack described. 9. The method of claim 5, wherein the electronic circuit includes an isolation transformer to reduce noise interference generated when the Ethernet is operated on the LAN interface cable. Modular jack. 10. The modular jack according to claim 5, wherein said electronic circuit includes a resistor matching transformer to be used for Ethernet signal matching between said pin and a LAN interface cable.