JP3024677B2 - Waterproof structure of housing - Google Patents

Waterproof structure of housing

Info

Publication number
JP3024677B2
JP3024677B2 JP9135194A JP13519497A JP3024677B2 JP 3024677 B2 JP3024677 B2 JP 3024677B2 JP 9135194 A JP9135194 A JP 9135194A JP 13519497 A JP13519497 A JP 13519497A JP 3024677 B2 JP3024677 B2 JP 3024677B2
Authority
JP
Japan
Prior art keywords
housing
silicon
waterproof structure
spur
fitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9135194A
Other languages
Japanese (ja)
Other versions
JPH10324360A (en
Inventor
剛 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9135194A priority Critical patent/JP3024677B2/en
Priority to CN98101486A priority patent/CN1100710C/en
Priority to AU68096/98A priority patent/AU741270B2/en
Priority to BR9802132A priority patent/BR9802132A/en
Priority to IDP980772A priority patent/ID20333A/en
Publication of JPH10324360A publication Critical patent/JPH10324360A/en
Application granted granted Critical
Publication of JP3024677B2 publication Critical patent/JP3024677B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Closures For Containers (AREA)
  • Gasket Seals (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、筐体の防水構造に
関し、特に屋外環境において使用され、シュプールを用
いる筐体の防水構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a waterproof structure for a housing, and more particularly to a waterproof structure for a housing which is used in an outdoor environment and uses a spur.

【0002】なお、本書においては、一方の筐体と、こ
れに嵌合する他方の筐体とを、筐体と総称することがあ
る。
[0002] In this document, one housing and the other housing fitted to the housing may be collectively referred to as a housing.

【0003】[0003]

【従来の技術】従来、携帯機器および屋外装置は、例え
ば、パッキングを介して筐体を嵌合させ、防水性を保持
する構造に構成されている。図2は、従来のパッキング
を使用する筐体の防水構造の一例を示す図である。筐体
21と筐体22とを嵌合させる構造において、筐体21
のシール部に設けた溝部23に、パッキング24を挿入
し、筐体22を嵌合することにより防水性を保持する構
造となる。パッキング24は、パッキング本体24Aと
ひれ部24Bから構成され、パッキング24を溝部23
に挿入すると、ひれ部24Bは弾力性によって溝部23
の壁面を押さえつけ、パッキング本体24Aにも溝部2
3の壁面から圧力が加わり、外れ難くなっている。
2. Description of the Related Art Conventionally, portable equipment and outdoor equipment have a structure in which, for example, a casing is fitted through a packing to maintain waterproofness. FIG. 2 is a diagram showing an example of a conventional waterproof structure of a housing using packing. In the structure in which the housing 21 and the housing 22 are fitted, the housing 21
By inserting the packing 24 into the groove 23 provided in the seal portion and fitting the housing 22, the waterproof structure is maintained. The packing 24 includes a packing body 24A and a fin 24B.
When the fin 24B is inserted into the groove 23
Of the packing body 24A and the groove 2 on the packing body 24A.
Pressure is applied from the wall of No. 3 and it is hard to come off.

【0004】しかし、パッキング24は、筐体22の開
閉時に外れることがあり、パッキング24が外れたま
ま、又は誤挿入状態のままであると、防水性を保持でき
ない。前述の防水構造は、パッキング24を溝部23に
圧入する工夫をしているが、必ずしも外れないとは言え
ない。
However, the packing 24 may come off when the housing 22 is opened and closed. If the packing 24 is left off or is incorrectly inserted, waterproofness cannot be maintained. Although the above-described waterproof structure is devised to press-fit the packing 24 into the groove 23, it cannot be said that the packing 24 does not necessarily come off.

【0005】この問題を解決する筐体の防水構造とし
て、筐体のシール部に溝部を設け、その溝部にシリコン
等を塗布するシュプール方法を用いた防水構造が提案さ
れている。図3は、シュプール方法を用いた筐体の防水
構造の一例を示す図である。筐体31と筐体32を嵌合
させる構造において、筐体31のシール部に設けた溝部
33に、シリコンを直に塗布してシュプール部34を成
形し、筐体32と嵌合することにより防水性を保持する
構造となる。シリコンは、筐体31に直に塗布されるた
め、密着性により剥がれ難くなっている。
[0005] As a waterproof structure of a housing that solves this problem, a waterproof structure using a spur method in which a groove is provided in a seal portion of the housing and silicon or the like is applied to the groove has been proposed. FIG. 3 is a diagram illustrating an example of a waterproof structure of a housing using the spur method. In the structure in which the housing 31 and the housing 32 are fitted to each other, silicon is directly applied to the groove 33 provided in the seal portion of the housing 31 to form the spur portion 34, and the housing 31 is fitted with the housing 32. The structure maintains the waterproofness. Since silicon is applied directly to the housing 31, it is difficult for the silicon to be peeled off due to adhesion.

【0006】図4は、特開平4−17359号公報に記
載された半導体装置の防水構造を示す。放熱体45は、
冷却用の水路を有し、カバー43内の半導体の熱を、金
属製ベース板44を伝導させて放熱する。またカバー4
3の周囲には枠状のシール部材41が配設され、弾力性
により突子42がカバー43を押さえ、放熱体45に付
着する水滴4Aのカバー43内への浸入を防ぐ。なお、
カバー43と金属製ベース板44は、接着剤46により
接合されている。しかし、この防水構造は、耐久性およ
び外観上の問題から、携帯機器および屋外装置に使用さ
れる可能性が低い。
FIG. 4 shows a waterproof structure of a semiconductor device described in Japanese Patent Application Laid-Open No. 4-17359. The radiator 45 is
It has a cooling water channel, and dissipates heat of the semiconductor in the cover 43 by conduction through the metal base plate 44. Also cover 4
A frame-shaped sealing member 41 is provided around the periphery 3, and the protrusion 42 presses the cover 43 by elasticity, thereby preventing the water droplets 4 </ b> A adhering to the radiator 45 from entering the inside of the cover 43. In addition,
The cover 43 and the metal base plate 44 are joined by an adhesive 46. However, this waterproof structure is less likely to be used for portable equipment and outdoor equipment due to durability and appearance problems.

【0007】[0007]

【発明が解決しようとする課題】図3に示される従来の
シュプール法では、筐体を嵌合させるとき、シリコンの
反発力によりシール部に隙間が発生する。特にプラスチ
ック筐体にシュプール法を用いると、筐体が歪む可能性
が生じる。その理由は、筐体を嵌合させるとき、押し潰
されたシリコンの体積が逃げる場所が無いためである。
In the conventional spur method shown in FIG. 3, when the housing is fitted, a gap is generated in the seal due to the repulsive force of the silicon. In particular, when the spur method is used for a plastic casing, the casing may be distorted. The reason is that when fitting the housing, there is no place where the volume of the crushed silicon escapes.

【0008】前記欠点を改良するために、硬度の低いシ
リコン(又は圧縮性を有する素材)を使用すれば、圧縮
性を有するので反発力を解消できるが、硬度の高いシリ
コンと比較して防水性が悪くなる。その理由は、硬度の
低いシリコンは、硬度の高いシリコンと比較して弾力性
が小さいから防水性が悪くなるためである。
[0008] If silicon having low hardness (or a material having compressibility) is used to improve the above-mentioned disadvantage, the resilience can be eliminated because of the compressibility, but the waterproofness is higher than that of silicon having high hardness. Gets worse. The reason for this is that silicon having a low hardness has lower elasticity than silicone having a high hardness, and thus has poor waterproofness.

【0009】本発明の目的は、筐体の嵌合時に押し潰さ
れたシュプールの体積を逃がす場所を設けて、筐体のシ
ール部の隙間の発生および筐体の歪みを回避することに
ある。
An object of the present invention is to provide a place for releasing the volume of the spur that has been crushed when the housing is fitted, thereby avoiding the generation of a gap in the seal portion of the housing and the distortion of the housing.

【0010】[0010]

【課題を解決するための手段】本発明は、前記課題を解
決するため、次の手段を採用する。
The present invention employs the following means to solve the above-mentioned problems.

【0011】(1)嵌合する一対の筐体のうちの一方の
筐体の溝内に設けられたシール部が、直に塗布された硬
度の低くかつ圧縮性を有する素材と、前記素材の上に直
に塗布された硬度の高くかつ弾力性を有する素材とから
成形され、他方の筐体が前記シール部を押し潰して防水
性を保持する筐体の防水構造。
(1) A seal portion provided in a groove of one of a pair of housings to be fitted is formed by directly applying a material having low hardness and compressibility, A waterproof structure of a housing formed from a material having high hardness and elasticity applied directly on top, and the other housing crushing the seal portion to maintain waterproofness.

【0012】(2)前記両素材がいずれもシリコンであ
る前記(1)記載の筐体の防水構造。
(2) The waterproof structure for a housing according to the above (1), wherein both the materials are silicon.

【0013】(3)前記他方の筐体が有する突起部が前
記シール部を押し潰す前記(1)記載の筐体の防水構
造。
(3) The waterproof structure for a housing according to (1), wherein the projections of the other housing crush the seal portion.

【0014】[0014]

【作用】本発明の筐体の防水構造は、筐体をネジで締め
付けて嵌合させ、筐体のシール部の弾性変形可能なシュ
プール部を押さえ付けて防水性を保持する。このシュプ
ール部は、硬度の低くかつ圧縮性を有するシリコン等の
素材を直に塗布し、その上に硬度の高くかつ弾力性を有
するシリコン等の素材を直に塗布して成形され、シュプ
ール部に圧力が加わったときに硬度の低いシリコン等が
圧縮されるため、押し潰されたシュプールの体積を逃が
すことができ、筐体間の隙間の発生および筐体の歪みを
回避する。
According to the waterproof structure of the present invention, the case is fitted by tightening the screw with screws, and the elastically deformable spur portion of the seal portion of the case is pressed to maintain the waterproofness. This spur part is formed by directly applying a material such as silicon having low hardness and compressibility, and directly applying a material such as silicon having high hardness and elasticity on the spur part. When pressure is applied, silicon or the like having a low hardness is compressed, so that the volume of the crushed spur can be released, thereby avoiding generation of a gap between the casings and distortion of the casing.

【0015】シュプール表面に成形された硬度の高いシ
リコン等は、弾力性が大きく、防水性を保持できる。
High hardness silicon or the like formed on the surface of the spur has high elasticity and can maintain waterproofness.

【0016】[0016]

【発明の実施の形態】本発明の一実施の形態例について
図面を参照して詳細に説明する。図1は、本発明の筐体
の防水構造を示す図である。(a)は筐体の分解斜視
図、(b)は(a)における線A−Aによる断面図、
(c)は筐体の嵌合前のシュプール部の断面図、(d)
は筐体の嵌合後のシュプール部の断面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing a waterproof structure of a housing of the present invention. (A) is an exploded perspective view of the housing, (b) is a cross-sectional view taken along line AA in (a),
(C) is a cross-sectional view of the spur portion before the housing is fitted, (d)
FIG. 4 is a cross-sectional view of the spur portion after the housing is fitted.

【0017】図1を参照すると、屋外使用を目的とした
サンプル筐体は、筐体1および筐体2で構成され、筐体
1および筐体2は、ネジ6を締め付けることにより密封
する構造を有している。筐体1のシール部には、全周に
渡り溝部3が設けられており、この溝部3にシリコンを
塗布し、溝部3に密着した弾性変形可能なシュプール部
4を成形する。シュプール部4は、溝部3の底面に硬度
の低いシリコン7、その上に硬度の高いシリコン8を塗
布され、硬度の異なる二種類の素材から成形される。ま
た、筐体2のシール部には、全周に渡り突起部5が設け
られている。
Referring to FIG. 1, a sample housing intended for outdoor use comprises a housing 1 and a housing 2, and the housing 1 and the housing 2 are sealed by tightening a screw 6. Have. The seal portion of the housing 1 is provided with a groove 3 over the entire circumference. Silicon is applied to the groove 3 to form an elastically deformable spur portion 4 which is in close contact with the groove 3. The spur portion 4 is formed by applying low-hardness silicon 7 on the bottom surface of the groove portion 3 and high-hardness silicon 8 thereon, and is formed from two kinds of materials having different hardnesses. Further, a projection 5 is provided over the entire periphery of the seal portion of the housing 2.

【0018】このように構成された筐体において、筐体
1と筐体2とを嵌合し、ネジ6を締め付けると、突起部
5がシュプール部4を押し潰して防水性を保持できる。
このとき、硬度の低いシリコン7は、圧縮性を有してお
り、押し潰されたシリコン体積を逃がす。従って、筐体
1と筐体2の間には隙間が発生することがなく、筐体の
歪みも回避できる。
In the thus configured housing, when the housing 1 and the housing 2 are fitted and the screw 6 is tightened, the protruding portion 5 crushes the spur portion 4 to maintain waterproofness.
At this time, the low-hardness silicon 7 has compressibility, and releases the crushed silicon volume. Therefore, no gap is generated between the housing 1 and the housing 2, and distortion of the housing can be avoided.

【0019】また、硬度の高いシリコン8は、強い弾力
性により防水することができる。
Further, the silicon 8 having high hardness can be waterproofed by strong elasticity.

【0020】[0020]

【発明の効果】以上の説明から明らかなように、本発明
によれば、シュプール方法を用いた防水構造を有する筐
体を嵌合させるとき、シール部の隙間および筐体の歪み
の発生を回避することができる。
As is apparent from the above description, according to the present invention, when fitting a casing having a waterproof structure using the spur method, it is possible to avoid the occurrence of gaps in the seal portion and distortion of the casing. can do.

【0021】その理由は、シュプール部が、硬度の低く
かつ圧縮性を有するシリコン等の素材と、その上に硬度
の高くかつ弾力性を有するシリコン等の素材を直に塗布
されて成形されており、シュプール部に圧力が加わった
ときに硬度の低いシリコン等が圧縮され、押し潰された
シュプールの体積を逃がすことができるからである。
The reason is that the spur portion is formed by directly applying a material such as silicon having a low hardness and compressibility and a material such as a silicon having a high hardness and elasticity thereon. This is because, when pressure is applied to the spur portion, silicon having a low hardness is compressed, and the volume of the crushed spur can be released.

【0022】また、本発明によれば、シュプール部は、
圧縮性を有し、かつ、防水可能な弾力性を有する。
According to the present invention, the spur portion is
It has compressibility and has waterproof elasticity.

【0023】その理由は、シュプール部が、硬度の低く
かつ圧縮性を有するシリコン等の素材と、その上に硬度
の高くかつ弾力性を有するシリコン等の素材を直に塗布
されて成形されており、硬度の高いシリコン等は弾力性
が強く、押し潰されたときに反発力が生じるからであ
る。
The reason is that the spur portion is formed by directly applying a material such as silicon having low hardness and compressibility and a material such as silicon having high hardness and elasticity to the spur portion. Silicon and the like having high hardness have high elasticity, and when crushed, repulsive force is generated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態例の筐体の防水構造の諸
図を示し、(a)は筐体の分解斜視図、(b)は(a)
における線A−Aによる断面図、(c)は筐体の嵌合前
のシュプール部の断面図、(d)は筐体の嵌合後のシュ
プール部の断面図である。
FIG. 1 shows various views of a waterproof structure of a housing according to an embodiment of the present invention, (a) is an exploded perspective view of the housing, and (b) is (a).
3C is a cross-sectional view taken along line AA, (c) is a cross-sectional view of the spur portion before the housing is fitted, and (d) is a cross-sectional view of the spur portion after the housing is fitted.

【図2】従来のパッキングを用いた筐体の防水構造の諸
図を示し、(a)は筐体の分解斜視図、(b)は筐体の
嵌合前のパッキング部の断面図、(c)はパッキングの
断面図である。
FIGS. 2A and 2B show various views of a waterproof structure of a housing using a conventional packing; FIG. 2A is an exploded perspective view of the housing; FIG. 2B is a cross-sectional view of a packing portion before the housing is fitted; c) is a sectional view of the packing.

【図3】従来のシュプール方法を用いた筐体の防水構造
の諸図を示し、(a)は筐体の分解斜視図、(b)は
(a)における線B−Bによる断面図である。
FIGS. 3A and 3B show various views of a waterproof structure of a housing using a conventional spur method, wherein FIG. 3A is an exploded perspective view of the housing and FIG. 3B is a cross-sectional view taken along line BB in FIG. .

【図4】従来の半導体装置の防水構造の諸図を示し、
(a)は平面図、(b)は断面図、(c)は放熱体の表
面に水滴が生じた状態を示す拡大断面図である。
FIG. 4 shows various views of a conventional waterproof structure of a semiconductor device;
(A) is a plan view, (b) is a cross-sectional view, and (c) is an enlarged cross-sectional view showing a state in which water droplets are generated on the surface of a heat radiator.

【符号の説明】[Explanation of symbols]

1 筐体(一方の筐体) 2 筐体(他方の筐体) 3 溝部 4 シュプール部 5 突起部 6 ネジ 7 硬度の低いシリコン 8 硬度の高いシリコン DESCRIPTION OF SYMBOLS 1 Housing (one housing) 2 Housing (the other housing) 3 Groove part 4 Spur part 5 Projection part 6 Screw 7 Silicon with low hardness 8 Silicon with high hardness

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7,DB名) B65D 53/00 H05K 5/06 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) B65D 53/00 H05K 5/06

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 嵌合する一対の筐体のうちの一方の筐体
の溝内に設けられたシール部が、直に塗布された硬度の
低くかつ圧縮性を有する素材と、前記素材の上に直に塗
布された硬度の高くかつ弾力性を有する素材とから成形
され、他方の筐体が前記シール部を押し潰して防水性を
保持することを特徴とする筐体の防水構造。
A sealing member provided in a groove of one of a pair of housings to be fitted, wherein the sealing member is formed of a low-hardness and compressible material directly applied; A waterproof structure for a casing, characterized in that the casing is formed from a material having high hardness and elasticity that is applied directly to the seal, and the other casing crushes the seal portion to maintain waterproofness.
【請求項2】 前記両素材がいずれもシリコンであるこ
とを特徴とする請求項1記載の筐体の防水構造。
2. The waterproof structure for a housing according to claim 1, wherein both the materials are silicon.
【請求項3】 前記他方の筐体が有する突起部が前記シ
ール部を押し潰すことを特徴とする請求項1記載の筐体
の防水構造。
3. The waterproof structure for a housing according to claim 1, wherein a projection of the other housing crushes the seal portion.
JP9135194A 1997-05-26 1997-05-26 Waterproof structure of housing Expired - Fee Related JP3024677B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP9135194A JP3024677B2 (en) 1997-05-26 1997-05-26 Waterproof structure of housing
CN98101486A CN1100710C (en) 1997-05-26 1998-05-21 Waterproof structure of cases
AU68096/98A AU741270B2 (en) 1997-05-26 1998-05-25 Waterproof structure of cases
BR9802132A BR9802132A (en) 1997-05-26 1998-05-26 Waterproof box structure
IDP980772A ID20333A (en) 1997-05-26 1998-05-26 STRUCTURE OF WATER-RESISTANT BOXES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9135194A JP3024677B2 (en) 1997-05-26 1997-05-26 Waterproof structure of housing

Publications (2)

Publication Number Publication Date
JPH10324360A JPH10324360A (en) 1998-12-08
JP3024677B2 true JP3024677B2 (en) 2000-03-21

Family

ID=15146051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9135194A Expired - Fee Related JP3024677B2 (en) 1997-05-26 1997-05-26 Waterproof structure of housing

Country Status (5)

Country Link
JP (1) JP3024677B2 (en)
CN (1) CN1100710C (en)
AU (1) AU741270B2 (en)
BR (1) BR9802132A (en)
ID (1) ID20333A (en)

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JP5158035B2 (en) * 2009-08-24 2013-03-06 富士通株式会社 Waterproof electronic equipment
JP5413976B2 (en) * 2010-04-19 2014-02-12 Necカシオモバイルコミュニケーションズ株式会社 Portable device
CN102458076A (en) * 2010-10-26 2012-05-16 亚旭电脑股份有限公司 Waterproof method and structure thereof
JP5712352B2 (en) 2011-02-28 2015-05-07 パナソニックIpマネジメント株式会社 LED unit and lighting apparatus using the same
CN103204296A (en) * 2012-04-02 2013-07-17 摩尔动力(北京)技术股份有限公司 Sealed container
DK177806B1 (en) 2012-12-03 2014-07-21 Airmaster As Airtight enclosure for accommodating a ventilation system
JP6471361B2 (en) * 2014-03-31 2019-02-20 日東工業株式会社 Packing for electrical equipment storage box
CN105704274B (en) * 2016-04-16 2024-04-05 深圳市宝尔爱迪科技有限公司 Waterproof structure of electronic product and mobile phone using same
CN108231948B (en) * 2018-02-11 2024-03-01 安徽问天量子科技股份有限公司 Pumped gas sealing system of avalanche photodiode and operation method thereof
CN112797109A (en) * 2020-12-30 2021-05-14 哈尔滨科锐同创机模制造有限公司 Sealing structure

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126591A (en) * 1964-03-31 Hamilton
DE3443220C1 (en) * 1984-11-27 1988-08-18 Walter 8700 Würzburg Hunger Sealing unit and method of manufacturing the same
CN87212130U (en) * 1987-08-22 1988-04-27 孙渭滨 Durable sealing strengthening ring for pressure cooker
CN2178224Y (en) * 1993-10-14 1994-09-28 李承龙 Sealing plastic fresh-keeping container
CN2185248Y (en) * 1994-03-12 1994-12-14 陈家松 High-vacuum preserving container and manual pump thereof
US5536018A (en) * 1994-11-14 1996-07-16 Fel-Pro Incorporated Flexible spaghetti gasket seal with stiffening member

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ID20333A (en) 1998-11-26
CN1200346A (en) 1998-12-02
AU741270B2 (en) 2001-11-29
JPH10324360A (en) 1998-12-08
AU6809698A (en) 1998-11-26
BR9802132A (en) 1999-06-08
CN1100710C (en) 2003-02-05

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