JP3014901B2 - Heat treatment equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus and, more particularly, to the structure of a heating element used when heat-treating an object to be processed at a high temperature.

[0002]

2. Description of the Related Art Generally, a heat treatment apparatus such as a CVD apparatus, an epitaxial apparatus, an oxide film forming apparatus or a thermal diffusion apparatus of a doping apparatus is used as various thin film forming apparatuses in a semiconductor wafer manufacturing process.

A general diffusion type heat treatment apparatus used for various kinds of heat treatments of a semiconductor wafer of this kind is provided with a process tube for forming a furnace chamber in which a semiconductor wafer to be processed is placed, and a process tube provided on an outer periphery of the process tube. And a heat insulating material provided so as to surround the heat generating resistor. The heat generating resistor is attached and supported via the heat insulating agent.

As a heating resistor in this case, for example, in the case of a heat treatment apparatus capable of performing batch processing, a heater made of FeCrAl or the like wired in a spiral shape in a horizontal direction is used, and a furnace chamber is used. For example at 1200 ° C
It is designed to be heated to a high temperature to a degree. Further, as an example, a ceramic fiber or the like is used as the heat insulating material, and the amount of heat taken as radiant heat and conductive heat is reduced to enable efficient heating.

[0005] In the above-mentioned batch type heat treatment apparatus, it is necessary to control the temperature of the heating resistor. For this reason, the structure shown in FIG. 7 has been conventionally used as an example. That is, in this structure, the through hole A1 is formed in the wall of the heat insulating material A that forms the furnace wall of the heat treatment furnace. A thermocouple C serving as a temperature detecting member held by the holder B is inserted into the through hole A1. Further, the tip of the thermocouple C is exposed in the vicinity of the heating resistor D that is continuous in a spiral shape in the horizontal direction. In the furnace wall of the heat treatment furnace, a stainless steel outer shell E forming an outer wall of the furnace wall is located outside the above-described heat insulating material A, and a cooling medium such as water is circulated outside the outer shell E. A water-cooling cover G is located across a cooling passage F provided with a pipe (not shown). The base of the thermocouple C is fixed by a holding block H fixed to the water-cooling cover G, and the thermocouple C is supported in a cantilever shape. With such a structure, the temperature at the position of each thermocouple C is monitored by sequentially transmitting the detected voltage signal from the thermocouple C to the temperature management control circuit, and the temperature between the measured temperature and the set temperature is monitored. The power supply to the heating resistor D is controlled so as to eliminate the difference. Therefore, a stable temperature is always maintained in the heat treatment furnace.

[0006]

In the above-described structure, the following problem tends to occur between the thermocouple C and the heating resistor D in which the thermocouple C is disposed.

That is, the thermocouple C is made of molybdenum disilicide, which is a relatively brittle material.
For this reason, the thermocouple C is inserted into a holder made of, for example, an alumina pipe. Then, only the tip is exposed from the holder, and the temperature sensed at the tip is converted into an electric signal and output to the outside as a detected temperature. Therefore, the thermocouple C is protected by a structure that is hardly directly affected by an external load.

By the way, the thermocouple C, in other words, the holder B comes into contact when the heating resistor D which is positioned in a spiral shape in the horizontal direction hangs down because of being located near the heating resistor D. Sometimes.

That is, the tip of the thermocouple C inserted into the holder B is located between the heating resistors D, and receives uniform radiant heat from the heating resistors D located on both sides so that the ambient temperature can be maintained. Is preferable for detecting However, when the holder B is positioned between the heating resistors D in the vertical direction, the heating resistors D come into contact with each other when the fixing conditions change due to aging or thermal expansion or when the heating resistors D hang down due to elongation or the like. . When the heating resistor D hangs down and comes into contact with the holder B, the weight from the heating resistor D is applied to the holder B as a load. For this reason, as shown by a two-dot chain line in FIG. 7, a bending moment may be generated in the holder B to cause bending deformation and come into contact with the thermocouple C. Therefore, when the holder B comes into contact with the thermocouple C, a bending moment is also generated in the thermocouple C, and there is a risk that the thermocouple C is broken.

Therefore, in order to increase the rigidity of the holder B and avoid contact with the thermocouple C when a bending moment is generated, it is necessary to increase the outer diameter of the holder B. Conventionally, for such a purpose, as the diameter of the holder B,
It was 6 to 8 mm. However, when the size of the holder B is increased as described above, the heat capacity of the holder B is increased by the increase in the sectional area. Therefore, the amount of heat transfer between the thermocouple C and the holder B increases. Accordingly, the temperature sensed at the tip of the thermocouple C decreases due to heat conduction to the holder B, and the detection temperature output as a signal has a large difference from the sensed temperature, thereby lowering the detection accuracy. Will be.

In addition, if the thermal conductivity is increased in this way, when the heating resistor D or the ambient temperature in the furnace changes, the change is lost as conduction heat. The ability to follow a temperature change is also deteriorated. For this reason, it takes time to set the predetermined temperature in the furnace, and the throughput in the heat treatment process is deteriorated. In particular, it is called a high-speed heat treatment furnace and has a conventional temperature change rate of 10 to 20 ° C./min (when the temperature is raised).
In a heat treatment furnace in which the rate of temperature change is set faster than 10 ° C./min (at the time of temperature decrease), the above-mentioned temperature response characteristic has a great effect. Incidentally, the rate of temperature change in the high-speed heat treatment furnace is 10
0 ° C./min (at the time of temperature rise) and about 60 ° C./min (at the time of temperature decrease) are set. Therefore, in order to suppress such heat radiation in the holder B, it is necessary to suppress heat transfer from the holder B to other positions. For this reason, the thickness of the heat insulating material located around the holder B is increased (L2) along the extension direction of the holder B in order to avoid contact between the holder B and the outside air or the cooling passage F. Such a thickness of the heat insulating material tends to delay the temperature change time when the temperature is raised or lowered in the heat treatment furnace. In particular, when the temperature is lowered, the time required for lowering the temperature becomes longer, which also deteriorates the throughput in the heat treatment step.

As described above, the difference between the temperature sensed at the tip of the thermocouple C and the temperature taken out as a signal may be caused by the fact that a part of the holder B
May be exposed. Therefore, the heat transmitted from the thermocouple C to the holder B is released through the holder B at this point, causing a temperature drop.

Accordingly, an object of the present invention is to provide a heat treatment apparatus having a temperature detection structure capable of suppressing a decrease in temperature detection accuracy in a furnace in view of the above-described problems in the conventional heat treatment apparatus. It is in.

Another object of the present invention is to shorten the time required for raising and lowering the temperature and to improve the throughput in the heat treatment step.

[0015]

According to a first aspect of the present invention, there is provided a vertical process tube for batch-processing a plurality of objects to be processed, and a vertical process tube disposed around the vertical process tube. Cylindrical heat insulator, and a heat generating resistor that extends in the vertical direction at intervals in the circumferential direction on the inner wall surface of the heat insulating material, and is continuously formed by the folded portions being alternately formed vertically, A detection unit for detecting the temperature of the heating resistor, wherein the detection unit is disposed between the heating resistors adjacent to each other in the circumferential direction, with a tip portion penetrating through the heat insulating material and protruding into the inside thereof. A cooling section is located around the heat insulating material.
And the detecting unit penetrates the heat insulating material and the cooling unit.
And the area facing the cooling section
It is characterized that you have been surrounded by heat insulating material.

[0016]

According to a second aspect of the present invention, in the first aspect , the detection portion has a fixed end at a base end exposed to the outside of the vertical process tube, and the base end is movable in a circumferential direction. It is characterized by having a simple position adjustment unit.

[0018]

According to the present invention, there is no contact between the heat generating resistor and the detecting portion which have been dropped due to aging or thermal deformation. In other words, the detecting portion has a distal end portion that penetrates the heat insulating material and protrudes inside between the heat generating resistors adjacent in the circumferential direction.
Therefore, even if the heating resistor hangs down due to aging or thermal deformation, there is no detecting portion at the hanging position, so there is no contact, and the weight of the heating resistor is not received as a load. For this reason, the detection unit does not need a shape and size for increasing the strength. by this,
Since it is not necessary to set the shape and size as large as the heat capacity becomes large, the amount of heat transfer is reduced and the difference between the temperature sensed at the tip and the detected temperature taken out as an electric signal is generated. Can be prevented.

Further, according to the present invention, it is possible to improve the response followability of the detection unit to a temperature change in the furnace. In other words, heat loss between the tip side and the base side of the detection unit located on the furnace side, that is, the so-called temperature drop is suppressed, so that the heat loss is reduced even for a slight temperature change on the furnace side. With this, it is possible to transmit to the base side. In addition, since the temperature difference between the furnace side and the base side of the thermocouple can be reduced in this way, overheating or abnormal lowering when raising or lowering to the set temperature is avoided, and the time required for raising and lowering is reduced. can do. Regarding the elevating time, the elevating time for correcting the temperature difference can be shortened by the small temperature difference. Therefore, the followability of the temperature change on the furnace side by the detection unit is improved, and the throughput in the temperature control in the heat treatment process is improved.

Further, according to the present invention, the position of the base end of the detecting section can be moved in the circumferential direction. In other words, since the position of the member supporting the detection unit can be moved according to the attachment position of the detection unit formed on the heat insulating material, the detection unit can be installed regardless of the error in the attachment position of the detection unit. It becomes possible to support.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to the embodiments shown in FIGS.

FIG. 1 shows a heat treatment apparatus used for oxidative diffusion of a semiconductor wafer.

In this heat treatment apparatus, a process tube 10 made of quartz is vertically supported on a base plate 12 made of, for example, stainless steel, and a furnace chamber 14 is formed inside the process tube 10. Has become. The process tube 10 is housed in a casing 32.

In the furnace room 14 formed by the process tube 10, the boat 2
A number of semiconductor wafers 22 to be processed are horizontally arranged and supported at equal intervals on the boat 20, and a gas is supplied from a processing gas supply source (not shown) to the semiconductor wafer 22. The processing can be executed for this. The heat retaining cylinder 18 is mounted on a flange cap 24. The flange cap 24 is attached to an elevator arm (not shown) and moves up and down.
The boat 20 can be moved up and down, and the boat insertion hole 26 of the process tube 10 can be sealed.

A heating resistor 30 is provided on the outer periphery of the process tube 10, and a heat insulating material 34 for supporting and surrounding the heating resistor 30 is provided outside the heating resistor 30.

The heating resistor 30 divides the inside of the furnace chamber 14 into, for example, three zones of a top, a center, and a bottom, and heats the top, the center, and the bottom of the furnace chamber 14 under suitable temperature conditions. Each heating resistor 3
A three-zone system constituted by 0a, 30b, and 30c is employed. The zone division is not limited to three zones, but may be determined as needed, such as five zones. In addition, the heat insulating material 34 is also used for the top, center and bottom.
Each of the zones is divided into heat insulating members 34a, 34b and 34c on the top side, the center side and the bottom side.

Further, these heat insulating members 34a, 34b,
Numeral 34c denotes a cylindrical member, which is formed by combining two semi-cylindrical members. Correspondingly, the heating resistors 30a, 30b, and 30c also include two semi-cylindrical members. It is designed to be combined individually.

The heating resistors 30a, 30b and 30c are made of molybdenum disilicide (MoSi ₂ ).
Specifically, a heater mainly composed of molybdenum disilicide (MoSi ₂ ) (a Kanthal super heating element manufactured by Kanthal) can be employed. The heating resistors 30a, 30b, 30c made of molybdenum disilicide have a very small resistance at room temperature, and have a large resistance at high temperatures. Molybdenum disilicide has a maximum surface load of a conventionally used FeCrAl heating element of, for example, 2 W / cm at 1200 ° C.
^In contrast to ² , the heating value is 10 times as large as 20 W / cm ² , a strong power increase is obtained, and the temperature rise of the conventional FeCrAl heating element is 10 ° C./min. , 100 ° C./min, and the temperature rise can be made rapid, and it is easy to apply in order to obtain the temperature rise characteristics in the high-speed heat treatment furnace described above.

The heating resistors 30a, 30b, 30c
Extends one wire rod in the vertical direction, as shown in FIG.
A continuous shape that is folded back and forth in a U-shape alternately up and down (hereinafter,
This shape is referred to as a mound shape).

Then, the heating resistors 30a, 30b, 30c formed in the shape of a mound are attached to and held by the staples 36 on the inner surfaces of the heat insulating members 34a, 34b, 34c. The staples 36, as shown in FIGS.
At the upper part of b, 30c, the heating resistors 30a, 30b, 30c are attached to the tops of the respective bent portions to suspend and support the same, and at the lower portions of the heating resistors 30a, 30b, 30c, avoid the respective bent portions. The position is fixed by supporting the linear portion, and thus the heating resistors 30a, 30b, 30
By setting the lower end of c to the released state, a change in the length in the vertical direction due to thermal expansion and contraction of the heating resistors 30a, 30b, and 30c can be tolerated.

Further, the heating resistors 30a, 30b,
30c, when heated, silicon dioxide (Si)
O ₂ ) is formed on the surface of the heating resistor 30 on which the heating resistor 30 reacts with oxygen in the atmosphere to oxidize.
Prevents disconnection. The heating resistor 30a,
At least the surface of the staple 36 that is in direct contact with the staples 30b and 30c is formed of a material that is inactive against the silicon dioxide even at a high temperature of, for example, 1200 ° C., and the deposited silicon dioxide is eroded to form the heating resistor 30. The contact portion of the staple 30 does not break.
As a material inert to silicon dioxide, for example,
There are iron (Fe), copper (Cu), nickel (Ni) and the like. The entire staple 36 is made of a material inert to silicon dioxide or the heating resistors 30a, 30b, 30.
You may make it form with the same material as c.

The heating resistors 30a, 30b, 30c
As shown in FIG. 2, the folded portions at each end are alternately long and short at adjacent border portions, and the long and short folded portions are arranged alternately in a meshing state. ing. Therefore, the heating resistors 30a, 30b, 3
0c is disposed without any gap at the adjacent boundary portion, so that uniform heating can be achieved at the boundary portion between the top, center, and bottom zones. In addition,
A plurality of heating resistors may be vertically combined in each of the top, center, and bottom zones. In this case, the zones are alternately combined in each adjacent portion as described above. It can be maintained at a uniform temperature.
Further, the combination state is not limited to the above example, and various combinations that can maintain a uniform temperature are possible.

On the other hand, the heating resistors 30a, 30b, 3
In the vicinity of 0c, a structure for controlling the temperature of each zone in which these heating resistors are arranged is provided.

That is, FIG. 4 shows a case where the temperature control structure, which is a feature of the present embodiment, has a cross section. In this structure, a thermocouple 40 and a protective member 4 are used as a detecting portion.
4 are provided.

The thermocouple 40 is composed of a wire that forms a closed circuit by joining a pair of resistance wires by brazing at their tips.
A structure is provided in which a temperature sensed at the distal end is converted into an electric signal and output in a holder 42 provided on the base end side opposite to the distal end. That is, as an example of such a structure, there is a structure in which a change in the electromotive force due to a change in the resistance value according to a change in the sensed temperature is output based on the detected temperature.

The protection member 44 is formed of a pipe, and has a thermocouple 40 inserted therein. The temperature of the thermocouple 40 can be detected only at the distal end protruding from the heat insulating material 34 located outside the process tube 10. For this reason, the protection member 44 includes the heat insulating material 34 and the outer shell 46 located between the holder 42 and the distal end, and the outer shell 46 and the water-cooling cover 48.
And is fixed to the end of the holder 42, and the tip of the thermocouple 40 protrudes from the tip on the heat insulating material 34 side.

As shown in FIG. 5, the thermocouple 40 has a pair of upper and lower resistance wires 40a and 40b, and the upper side is for temperature detection, and the lower side is for control. Therefore, the outer diameter of the protective member 44 through which the thermocouple 40 is inserted satisfies the following conditions.

That is, firstly, the distance between the arrangement pitches of the heating resistors 30 arranged in the shape of a mender is second.
Another problem is that the wiring pitch between the resistance lines is as small as possible. The first condition is to prevent interference with the heating resistors 30 arranged in a meandering manner, and the second condition depends on the arrangement direction of the resistance wires. That is, in the case of a vertical heat treatment apparatus, the temperature gradient in the vertical direction becomes important.
Therefore, when detecting the temperature at various points in the vertical direction, if the resistance wires are arranged in the horizontal direction, it is possible to detect the temperature in the same location in the vertical direction. , The sensing temperature in the vertical direction is different, and the detection of the temperature gradient in the vertical direction becomes inaccurate. For this reason, if the arrangement in the vertical direction is set, the distance is set as small as possible so that the temperature can be sensed at the same location in the vertical direction. Is set.

Since the present embodiment has the above configuration,
Protective member 44 into which thermocouple 40 serving as a detection unit is inserted
Does not receive the weight of the heating resistor 30 as a load even when the heating resistor 30 hangs down. That is, since the tip of the thermocouple 40 is disposed between the heating resistors 30 adjacent to the heating resistor 30 configured in the shape of a mound, there is no contact even if the heating resistor 30 hangs down. Therefore, since the protection member 44 does not need to have higher rigidity than the conventional one, the outer diameter can be made smaller than that of the conventional one. Specifically, the outer diameter of the conventional protection member is 6 to 8 mm, but can be reduced to this value or less. This satisfies the first condition.

On the other hand, the second condition is satisfied by making the arrangement direction of the resistance wires horizontal.

According to this embodiment, the thermal conductivity can be reduced by reducing the outer diameter of the protection member 44. Therefore, since the heat capacity of the protection member 44 is small, the amount of heat absorbed by the protection member 44 itself is reduced, thereby suppressing a decrease in the amount of heat transmitted to the detection unit. For this reason, the temperature detected in the furnace
In this case, since the temperature does not decrease due to heat absorption of the protection member 44, the difference between the sensed temperature and the temperature taken out as the detection signal can be reduced. The fact that such a difference between the sensed temperature and the detected temperature can be reduced means that the accuracy of detecting the in-furnace temperature is not reduced and the followability to a temperature change can be improved.

Further, according to such a configuration, since the amount of heat radiation from the protection member 44 is reduced,
The thickness of the heat insulating material 34 surrounding the outer periphery can be reduced. That is, the conventional heat insulating material 3 shown in FIG.
4, the thickness (L1 <L2) indicated by reference numeral L1 in FIG. For this reason, the change time at the time of temperature rise and fall in the furnace can be shortened, and further,
The temperature change time at the time of temperature decrease can be shortened. Further, by reducing the thickness of the heat insulating material, it is possible to suppress an increase in the size of the entire heat treatment apparatus. In FIG. 4, reference symbol L indicates the length of the thermocouple 40 and the protection member 44 inserted therethrough, and this length is the same as the conventional one shown in FIG.

In this embodiment, not only the thermal conductivity of the protective member 44 is lowered but also the heat radiation is suppressed to prevent the temperature detection accuracy from being lowered. That is, one of the causes of the decrease in the temperature sensed by the thermocouple 40 is that heat is transmitted to the protection member 44 and the transmitted heat is released, thereby causing heat to escape.

Therefore, in the present embodiment, a structure is employed in which the heat radiating portion in the protection member 44 is eliminated. That is,
In FIG. 4, a passage heat insulating member 52 for surrounding the outer periphery of the protection member 44 is provided in a cooling passage 50 of a furnace constituted by an outer shell 46 and a water cooling cover 48. The length of the passage heat insulating member 52 is set so as to cover the range of the protection member 44 up to the end surface facing the holder 42 in addition to the range of the cooling passage 50.
According to such a configuration, the heat radiation phenomenon in the cooling passage and the vicinity thereof is suppressed, so that the thermocouple 4 in the furnace.
The temperature difference between the temperature sensed as 0 and the temperature taken as a signal will be further reduced. Thereby, the detected temperature can be made closer to the actual temperature in the furnace.

On the other hand, in the present embodiment, the mounting position of the bracket can be adjusted in accordance with the insertion position of the detecting portion located between the heating resistors 30 arranged in a magenta shape. I have. That is, the bracket 5 provided for attaching the holder 42 in FIG.
6 is formed with a step-like concave portion for disposing the holder 42 of the thermocouple 40 and the heat insulating material 52 for the passage which is the detecting portion, and each concave portion is circumferentially larger than the holder 42 and the heat insulating material 52 for the passage. It is formed large. Therefore, the bracket 56 can be moved by a distance in the circumferential direction with respect to the holder 42 and the passage heat insulating material 52. In the case of this embodiment, since the terminal 42A (see FIG. 4) for taking out the signal from the holder 42 to the outside is provided, the bottom 5
6A, an insertion hole 56 formed at a position where this terminal protrudes.
B and flange portion 56 attached to water cooling cover 48
The screw insertion hole 56D of C is formed in a long hole along the circumferential direction.

With such a structure, the heat insulating material 34
By moving the bracket 56 in the circumferential direction (the direction indicated by the arrow in FIG. 5) in accordance with the position of the holder 42 regardless of the state in which the protection member 44 is inserted through the hole formed in the holder 42, And the position of the bracket 56 can be adjusted and fixed. The reason why such position adjustment is necessary is as follows.

That is, in the heat treatment apparatus provided with the heating resistors 30 arranged in the shape of a mound, the insertion of the thermocouple 40 before the attachment of the heating resistors 30 is performed by drilling from the inner wall surface of the furnace toward the heat insulating material 34. Will be implemented.
This is because the insertion hole of the thermocouple 40 is processed in an actual matching state with reference to the positions of the heating resistors 30 arranged after the hole processing. At this time, if the mounting position of the bracket 56 is limited, the holder 42, the protection member 44 extended therefrom, and the thermocouple 40 may not be in an appropriate positional relationship with the bracket 56. In an extreme case, the bracket 5
6 may interfere with each other. Therefore, in this embodiment, when the bracket 56 is moved in the direction of the arrow indicated by the solid line in FIG. 6, the position of the bracket 56 can be adjusted to match the position of the holder 42 as indicated by the two-dot chain line. .

According to the embodiment as described above, the thickness of the heat insulating material disposed on the wall of the furnace can be reduced.
For this reason, the transient response at the time of temperature rise and temperature fall in the furnace can be improved, and the time required to reach the predetermined temperature can be shortened. Therefore, the throughput required for the heat treatment can be improved.

The present invention is not limited to the above embodiment, but can be variously modified within the scope of the present invention.

For example, the object to be processed according to the present invention is:
The object to be processed may be at least a planar object, and may be, for example, an LCD substrate or the like other than the semiconductor wafer.
Further, as the heat treatment apparatus to which the present invention is applied, oxidation,
In addition to the diffusion device, for example, a device applied to CVD and annealing can be targeted.

[0051]

As described above, according to the present invention,
By arranging the tip of the detection unit between the adjacent heat generating resistors, even when the low heat generating antibody sags, the weight of the heat generating resistor is not received as a load. Accordingly, since the detecting section can reduce the outer diameter dimension to suppress heat conduction to other positions and reduce heat loss, the detection temperature at the tip of the detecting section and the output detection temperature can be compared. It is possible to reduce the disparity between them so as not to lower the detection accuracy. Further, since the difference between the sensed temperature and the output detected temperature can be reduced in this way, the response follow-up to the temperature change on the furnace side can be improved, and such detection accuracy does not decrease. Thus, it is possible to reduce the detection error at the time of temperature rise and temperature decrease and to shorten the time required to reach the actual predetermined temperature. Therefore, it is possible to improve the throughput in the temperature control of the heat treatment process.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an example of a heat treatment apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a structure of a heating resistor used in the heat treatment apparatus shown in FIG.

FIG. 3 is a partial cross-sectional view showing a fixing structure of the heating resistor shown in FIG. 2;

FIG. 4 is a cross-sectional view illustrating a main structure of a heat treatment apparatus according to an embodiment of the present invention.

FIG. 5 is a perspective view showing a part of a main part shown in FIG. 4 taken out therefrom;

FIG. 6 is a sectional view taken in the direction indicated by the symbol P in FIG.

FIG. 7 is a sectional view showing a conventional example of a temperature management structure in a heat treatment apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Process tube 30 Heating resistor 34 Insulation material 36 Staple 40 Thermocouple forming one part of detection part 42 Holder of detection part 44 Protective member forming other parts of detection part 50 Cooling passage 52 Heat insulation material for passage

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) C23C 16/00-16/56 F27B 17/00 F27D 7/00-15/02 H01L 21/205 H01L 21/22 H01L 21 / 31 H01L 21/324 H05B 3/40-3/82

Claims (2)

(57) [Claims] 1. A vertical process tube for batch-processing a plurality of objects to be processed, a tubular heat insulator disposed around the vertical process tube, and a circumferential direction on an inner wall surface of the heat insulator. A heating resistor that extends in the vertical direction at an interval and is formed by alternately forming folded portions alternately up and down; and a detection unit that detects the temperature of the heating resistor. the tip portion protruding therein through the heat insulating material is disposed between the heating resistor adjacent to each other in the circumferential direction, the cooling unit is disposed on the periphery of the heat insulator, the detecting unit
Is placed through the insulation and the cooling section,
The area located facing the cooling section is surrounded by thermal insulation
Thermal processing apparatus characterized by being. 2. The method according to claim 1, wherein the detecting section is exposed outside the vertical process tube.
The base end is the fixed end, which moves in the circumferential direction.
Heat treatment characterized by having a possible position adjustment
apparatus.