JP2897537B2 - Substrate cleaning device - Google Patents

Substrate cleaning device

Info

Publication number
JP2897537B2
JP2897537B2 JP18186392A JP18186392A JP2897537B2 JP 2897537 B2 JP2897537 B2 JP 2897537B2 JP 18186392 A JP18186392 A JP 18186392A JP 18186392 A JP18186392 A JP 18186392A JP 2897537 B2 JP2897537 B2 JP 2897537B2
Authority
JP
Japan
Prior art keywords
substrate
cleaning
cleaning liquid
overflow
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP18186392A
Other languages
Japanese (ja)
Other versions
JPH065577A (en
Inventor
和郎 佐伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP18186392A priority Critical patent/JP2897537B2/en
Publication of JPH065577A publication Critical patent/JPH065577A/en
Application granted granted Critical
Publication of JP2897537B2 publication Critical patent/JP2897537B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は基板洗浄装置に関し、特
に枚葉処理方式によるブラシ洗浄装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus, and more particularly to a single-wafer processing brush cleaning apparatus.

【0002】[0002]

【従来の技術】従来の基板洗浄装置は図2に示すよう
に、洗浄液11の受槽13の上開口部に被洗浄物である
基板12の両端を支持する搬送ローラ4が直線上に所定
のピッチで配列され、パスラインを構成している。
2. Description of the Related Art In a conventional substrate cleaning apparatus, as shown in FIG. 2, a conveying roller 4 supporting both ends of a substrate 12 to be cleaned is linearly arranged at a predetermined pitch in an upper opening of a receiving tank 13 for a cleaning liquid 11. And constitute a pass line.

【0003】このパスラインに直交して対向する1組の
回転ブラシ部5が受槽13のほぼ中央部に配設され、さ
らに、受槽13の下部には貯液タンク8を有し、両者
は、互いに配管接続されている。
[0003] A pair of rotating brush parts 5 orthogonal to and opposed to the pass line are disposed substantially at the center of the receiving tank 13, and further, a liquid storage tank 8 is provided below the receiving tank 13. The pipes are connected to each other.

【0004】また、洗浄ブラシ6の先端近傍に洗浄液1
1を供給するためのスプレーノズル14が回転ブラシ部
5と同様にパスラインに対向して配設されている。
Further, the cleaning liquid 1 is placed near the tip of the cleaning brush 6.
A spray nozzle 14 for supplying the nozzle 1 is disposed opposite to the pass line similarly to the rotary brush unit 5.

【0005】なお、スプレーノズル14と貯液タンク8
とは、循環ポンプ9とフィルター10を中継して配管接
続されている。
The spray nozzle 14 and the liquid storage tank 8
Is connected to the piping via the circulation pump 9 and the filter 10.

【0006】次に洗浄動作について説明する。図1に示
すように基板12は、搬送ローラ4によりパスラインに
沿って右方向に搬送されながら、回転ブラシ部5の先端
部に装着された洗浄ブラシ6によって基板12の表・裏
面が同時にスクラブ洗浄される。
Next, the cleaning operation will be described. As shown in FIG. 1, while the substrate 12 is conveyed rightward along the path line by the conveying roller 4, the front and back surfaces of the substrate 12 are simultaneously scrubbed by the cleaning brush 6 attached to the tip of the rotating brush unit 5. Washed.

【0007】このとき、洗浄液11は循環ポンプ9の圧
力によりスプレーノズル14の口より洗浄ブラシ6の先
端近傍に供給される。
At this time, the cleaning liquid 11 is supplied to the vicinity of the tip of the cleaning brush 6 from the mouth of the spray nozzle 14 by the pressure of the circulation pump 9.

【0008】[0008]

【発明が解決しようとする課題】この従来の基板洗浄装
置では、洗浄処理時間の経過に伴って、基板の表面から
除去した粒子等の不純物がブラシの内部に入り込み、徐
々にブラシ自身が汚染されるという現象が発生する。
In this conventional substrate cleaning apparatus, impurities such as particles removed from the surface of the substrate enter the inside of the brush as the cleaning processing time elapses, and the brush itself is gradually contaminated. Phenomenon occurs.

【0009】そのために基板の表面が汚染されたブラシ
により擦られる結果となり、洗浄能力が著しく低下する
という品質面での問題点があった。
As a result, the surface of the substrate is rubbed by a contaminated brush, and there is a problem in terms of quality that the cleaning ability is significantly reduced.

【0010】さらに、頻繁にブラシを交換するための多
大な工数が発生するという問題点があった。
Further, there is a problem that a large number of man-hours for frequently changing the brush are required.

【0011】本発明の目的は、ブラシ自身の汚染による
経時劣化を防止した基板洗浄装置を提供することにあ
る。
An object of the present invention is to provide a substrate cleaning apparatus which prevents deterioration with time due to contamination of the brush itself.

【0012】[0012]

【課題を解決するための手段】前記目的を達成するた
め、本発明に係る基板洗浄装置は、オーバーフロー層槽
と、シャッター部と、搬送部と、超音波発振部と、回転
ブラシ部とを有する基板洗浄装置にあって、前記オーバ
ーフロー槽は、洗浄液を収容し、対向する側面の上縁付
近に基板の搬出入を行うためのスリット形状の開口部を
有するものであり、前記シャッター部は、前記開口部に
隣接して基板の通過に同期して自重にて上下するロール
形状のものとして設けられ、基板の搬出入により開閉す
るものであり、前記搬送部は、前記オーバーフロー槽の
開口部間に基板を洗浄液に浸漬して搬送するものであ
り、前記超音波発振部は、前記オーバーフロー槽の洗浄
液に超音波を作用するものであり、前記回転ブラシ部
は、前記オーバーフロー槽の洗浄液中で基板を洗浄ブラ
シにより洗浄するものである。
In order to achieve the above object, a substrate cleaning apparatus according to the present invention has an overflow layer tank, a shutter, a transport section, an ultrasonic oscillation section, and a rotating brush section. in the substrate cleaning apparatus, the over-<br/> Furo tank, washing liquid were housed, has an opening portion of the slit-shaped for performing loading and unloading of the substrate to near the upper edge of the opposite sides, wherein The shutter is located at the opening
Adjacent roll that moves up and down by its own weight in synchronization with the passage of the substrate
Provided as a shape, which is opened and closed by loading and unloading of the substrate, wherein the transport unit, the substrate between the opening of the overflow vessel is intended to convey immersed in the cleaning liquid, the ultrasonic generator is is intended to act ultrasonic waves in the cleaning liquid said overflow tank, the rotary brush unit is for cleaning a substrate by the cleaning brush in the cleaning liquid of the overflow tank.

【0013】[0013]

【作用】洗浄ブラシを常時洗浄液中に浸漬させ、洗浄ブ
ラシを超音波洗浄することによりブラシ自身による汚染
を防止する。
The cleaning brush is immersed in the cleaning liquid at all times, and the cleaning brush is ultrasonically cleaned to prevent contamination by the brush itself.

【0014】[0014]

【実施例】次に本発明について図面を参照して説明す
る。図1は本発明の一実施例を示す断面図である。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described with reference to the drawings. FIG. 1 is a sectional view showing one embodiment of the present invention.

【0015】図1において、洗浄液11のオーバーフロ
ー槽1は、対向する側面の上部に基板12を搬出入する
ためのスリット形状の開口部2と、開口部2に隣接して
基板12の通過に同期して自重にて上下するロール形状
のシャッター部3と、槽1の底部に配置した超音波発振
器7とを有している。
In FIG. 1, an overflow tank 1 for a cleaning liquid 11 has a slit-shaped opening 2 for carrying a substrate 12 in and out of an opposing side surface, and is synchronized with the passage of the substrate 12 adjacent to the opening 2. And a roll-shaped shutter unit 3 which moves up and down by its own weight, and an ultrasonic oscillator 7 arranged at the bottom of the tank 1.

【0016】基板12の搬送部としては、オーバーフロ
ー槽1の対向する開口部2を結ぶ直線上に基板12の両
端を支持する搬送ローラ4を所定のピッチで配列して、
基板12のパスラインを構成する。
As the transfer section of the substrate 12, transfer rollers 4 supporting both ends of the substrate 12 are arranged at a predetermined pitch on a straight line connecting the opposite openings 2 of the overflow tank 1.
A pass line of the substrate 12 is formed.

【0017】回転ブラシ部5は、先端部に装着した洗浄
ブラシ6を下にして基板12のパスラインに直交してオ
ーバーフロー槽1のほぼ中央部に配設する。
The rotating brush unit 5 is disposed substantially at the center of the overflow tank 1 orthogonally to the pass line of the substrate 12 with the cleaning brush 6 attached to the tip end downward.

【0018】オーバーフロー槽1の下部には貯液タンク
8を配置し、オーバーフロー槽1と貯液タンク8とは、
洗浄液11の回収系の配管系及び循環ポンプ9やフィル
ター10等を有する供給系の配管にて連結され循環シス
テムを構成している。
A liquid storage tank 8 is disposed below the overflow tank 1, and the overflow tank 1 and the liquid storage tank 8 are
A circulation system is configured by being connected by a piping system of a recovery system of the cleaning liquid 11 and a piping system of a supply system including the circulation pump 9 and the filter 10.

【0019】次に洗浄動作について説明すると、基板1
2は、搬送ローラ4によりパスラインに沿って右方向に
搬送され、シャッター部3及び開口部2を経由してオー
バーフロー槽1の液中に搬送されて回転ブラシ部5の洗
浄ブラシ6によって基板12の表面がスクラブ洗浄され
る。
Next, the cleaning operation will be described.
The substrate 2 is conveyed rightward along the pass line by the conveying roller 4, is conveyed into the liquid in the overflow tank 1 via the shutter 3 and the opening 2, and is cleaned by the cleaning brush 6 of the rotating brush 5. Is scrubbed.

【0020】また基板12の裏面及び洗浄ブラシ6は、
超音波発振器7による超音波作用(即ち、発振周波数が
20〜40KHZ帯の場合にはキャビテーション作用,
1MHZ帯近傍では振動加速度作用)によって洗浄され
る。
The back surface of the substrate 12 and the cleaning brush 6
The ultrasonic action by the ultrasonic oscillator 7 (that is, the cavitation action when the oscillation frequency is in the 20 to 40 KHZ band,
In the vicinity of the 1 MHZ band, cleaning is performed by the action of vibration acceleration.

【0021】尚、オーバーフロー槽1からオーバーフロ
ーした洗浄液は、貯液タンク8内に回収される。貯液タ
ンク8内の洗浄液は、循環ポンプ9にて供給され、フィ
ルター10を通過して濾過されオーバーフロー槽1内に
補給される。
The cleaning liquid overflowing from the overflow tank 1 is collected in a liquid storage tank 8. The cleaning liquid in the liquid storage tank 8 is supplied by a circulation pump 9, is filtered through a filter 10, and is supplied into the overflow tank 1.

【0022】[0022]

【発明の効果】以上説明したように本発明は、洗浄ブラ
シを常時オーバーフローしている洗浄液の中に浸漬した
状態で超音波発振器の超音波作用により洗浄する構成と
したので、洗浄処理時間の経過に伴う洗浄ブラシ自身の
汚染による洗浄能力の低下を防止することができ、従来
に比べて品質面での向上を図ることができる。
As described above, according to the present invention, the cleaning brush is immersed in the overflowing cleaning liquid and is cleaned by the ultrasonic action of the ultrasonic oscillator. As a result, it is possible to prevent a reduction in cleaning ability due to contamination of the cleaning brush itself, and to improve the quality as compared with the related art.

【0023】さらに、洗浄ブラシの交換頻度が少なくな
り、工数の削減を図ることができる。さらに、シャッタ
ー部は、オーバーフロー槽の開口部に隣接して基板の通
過に同期して自重にて上下するロール形状のものとして
設けられ、基板の搬出入により開閉するものであるた
め、基板の搬出入の開閉動作する機構は、強制的な開閉
動作機構と電気的な制御が不要であり、構造の簡素化を
図ることができ、且つロール状シャッターにより基板と
密着状態での開閉であるため、洗浄液の漏出度合いを少
なくすることができる。
[0023] In addition, the frequency of replacement of the cleaning brush is reduced, Ru it is possible to reduce the man-hours. In addition, shutter
The opening is adjacent to the opening of the overflow tank, and
As a roll shape that moves up and down under its own weight in synchronization with excess
Provided to open and close by loading and unloading substrates.
The mechanism that opens and closes the loading and unloading of substrates is forcibly opened and closed.
No need for an operating mechanism and electrical control, simplifying the structure
It can be aimed at, and with the substrate by the roll shutter
Opening and closing in close contact, reducing the degree of leakage of cleaning solution
Can be eliminated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.

【図2】従来の基板洗浄装置を示す断面図である。FIG. 2 is a sectional view showing a conventional substrate cleaning apparatus.

【符号の説明】[Explanation of symbols]

1 オーバーフロー槽 2 開口部 3 シャッター部 4 搬送ローラ 5 回転ブラシ部 6 洗浄ブラシ 7 超音波発振器 8 貯液タンク 9 循環ポンプ 10 フィルター 11 洗浄液 12 基板 13 受槽 14 スプレーノズル DESCRIPTION OF SYMBOLS 1 Overflow tank 2 Opening 3 Shutter part 4 Conveyance roller 5 Rotating brush part 6 Cleaning brush 7 Ultrasonic oscillator 8 Liquid storage tank 9 Circulation pump 10 Filter 11 Cleaning liquid 12 Substrate 13 Receiving tank 14 Spray nozzle

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 オーバーフロー層槽と、シャッター部
と、搬送部と、超音波発振部と、回転ブラシ部とを有す
る基板洗浄装置にあって、前記 オーバーフロー槽は、洗浄液を収容し、対向する側
面の上縁付近に基板の搬出入を行うためのスリット形状
の開口部を有するものであり、前記 シャッター部は、前記開口部に隣接して基板の通過
に同期して自重にて上下するロール形状のものとして設
けられ、基板の搬出入により開閉するものであり、前記 搬送部は、前記オーバーフロー槽の開口部間に基板
を洗浄液に浸漬して搬送するものであり、前記 超音波発振部は、前記オーバーフロー槽の洗浄液に
超音波を作用するものであり、前記 回転ブラシ部は、前記オーバーフロー槽の洗浄液中
で基板を洗浄ブラシにより洗浄するものであることを特
徴とする基板洗浄装置。
1. A substrate cleaning apparatus having an overflow layer tank, a shutter section, a transport section, an ultrasonic oscillating section, and a rotating brush section, wherein the overflow tank stores a cleaning liquid and faces side surfaces facing each other. A slit-shaped opening for carrying in / out the substrate near the upper edge of the substrate, wherein the shutter portion passes through the substrate adjacent to the opening.
As a roll that moves up and down under its own weight in synchronization with
Vignetting, which opened and closed by the loading and unloading of the substrate, wherein the transport unit is intended to convey the substrate was immersed in the cleaning liquid between the opening of the overflow vessel, the ultrasonic generator, the overflow tank the cleaning liquid is intended to act ultrasound, the rotary brush unit, a substrate cleaning apparatus, characterized in that in the cleaning liquid of the overflow tank by washing the substrate by washing brushes.
JP18186392A 1992-06-16 1992-06-16 Substrate cleaning device Expired - Lifetime JP2897537B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18186392A JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18186392A JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Publications (2)

Publication Number Publication Date
JPH065577A JPH065577A (en) 1994-01-14
JP2897537B2 true JP2897537B2 (en) 1999-05-31

Family

ID=16108161

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18186392A Expired - Lifetime JP2897537B2 (en) 1992-06-16 1992-06-16 Substrate cleaning device

Country Status (1)

Country Link
JP (1) JP2897537B2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3331168B2 (en) 1997-12-09 2002-10-07 ティーディーケイ株式会社 Cleaning method and apparatus
DE19934300C2 (en) * 1999-07-21 2002-02-07 Steag Micro Tech Gmbh Device for treating substrates
TW553780B (en) * 1999-12-17 2003-09-21 Sharp Kk Ultrasonic processing device and electronic parts fabrication method using the same
JP2001246331A (en) 2000-03-08 2001-09-11 Sharp Corp Cleaning device
JP4129484B2 (en) * 2002-10-07 2008-08-06 株式会社スター・クラスター Ultrasonic cleaning apparatus and ultrasonic cleaning method
JP2009070932A (en) * 2007-09-12 2009-04-02 Sumitomo Metal Mining Co Ltd Wafer-cleaning apparatus and wafer-cleaning method
JP5437757B2 (en) * 2009-09-30 2014-03-12 Necエンベデッドプロダクツ株式会社 Medium cleaning device
JP2013101790A (en) * 2011-11-08 2013-05-23 Nippon Electric Glass Co Ltd Manufacturing method of a substrate with a transparent conductive oxide film
CN104971921A (en) * 2014-04-08 2015-10-14 麒麟电子(深圳)有限公司 Glass substrate cleaning device
JP2017000317A (en) * 2015-06-08 2017-01-05 サマンサジャパン株式会社 Tile carpet cleaning apparatus
CN105032835B (en) * 2015-08-19 2017-12-19 京东方科技集团股份有限公司 Ultrasonic cleaning equipment
JP6892176B1 (en) * 2020-11-19 2021-06-23 不二越機械工業株式会社 Work cleaning device

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Publication number Publication date
JPH065577A (en) 1994-01-14

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