JP2843306B2 - Protection device for IC memory card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to a device for protecting an IC in a card or an IC in a device when a card containing a memory IC is inserted and removed from an electronic device, and a device for protecting memory information written in the card.

[0002]

2. Description of the Related Art Recently, I shown in FIG.
The C memory card 1 has a large number of signal pads 2 and 3 on the surface.
Are arranged in parallel in the front and rear stages, and a power supply line 4 is provided between a row of the front signal pads 2 and a row of the rear signal pads 3.
And a ground line 5 extend in parallel in the front and rear stages, and a power pad 6 is provided at both ends of the front power line 4, and the power pads 6 are arranged at the left and right ends of the front signal pad 2. Grounding pads 7 are provided at both ends of the grounding line 5, and the grounding pads 7 are arranged at the left and right ends of the rear-stage signal pad 3.

The pads 2, 3, 6, 7 and the lines 4, 5 are arranged very close to each other because of the relationship with the memory IC, and are separated through thin insulating lines 8. When the card is inserted, the front-stage signal contact 9, the rear-stage signal contact 10, the power source contact 11, and the grounding contact 12, which have a spring property and extend in the card insertion / removal direction on the surfaces of the pads 2, 3, 6, and 7, respectively. The pressure contact starts elastically, and after this pressure contact, the card is further inserted a little more, and each pad slides a little while keeping the above-mentioned press contact of the contact, and the information processing circuit and the power supply circuit in the electronic device It is designed to be connected to a ground circuit.

Similarly, when the card 1 is removed, each pad slides in the opposite direction to that when the card is inserted, while maintaining the pressure contact with the contacts 9 to 12, and separates from the pad and the card.

[0005]

As shown in FIG. 2, in the memory card having the pad arrangement as shown in FIG. 2, when the card 1 is removed, for example, the rear signal contact 10 makes the surface of the rear signal pad 3 relatively move. In the process of sliding, the signal contacts 9 or 10 come off from the preceding or subsequent signal pads 2 and 3 while the power contacts 11 are still in contact with the power pads 6. Of the IC in the electronic device or the IC in the electronic device, and erroneous writing or erasing in the memory IC in the card may occur. That is, while power is supplied, the input level of the control signal pin of the memory becomes indefinite, so that erroneous writing or erroneous writing may occur due to data collision on the bus line or undesired commands being taken in due to noise. Erroneous operation of erroneous erasure may occur.

Further, if an IC memory card is inserted and used, if the card is accidentally removed, there is a problem that the memory information written in the IC in the card is also erased.

The present invention effectively solves the above-mentioned problems in the IC memory card and enables the card to be used properly.

[0008]

According to the present invention, as a means for achieving the above object, in a memory card having the above-described structure, a portion from a contact position of a contact protruding portion of a post signal contact to the post signal pad to a front end of the pad is provided. And the sliding dimension S2 from the contact position of the contact projection disposed behind the contact projections of the front and rear signal contacts of the power contact to the power pad to the front end of the pad. The relationship is set so that S1> S2 so as to effectively prevent the above-described problem of IC destruction and malfunction when a card is inserted or removed.

Similarly, the sliding dimension S2 and the sliding dimension S3 from the contact position of the preceding signal contact to the preceding signal pad to the front end of the pad are set to satisfy the relationship of S2 <S3. The malfunction of the information processing circuit in the electronic device is properly prevented by opening the power contact later than the power contact.

The present invention further provides a memory storage switch which is opened or closed in conjunction with insertion and removal of the card, and opens the memory storage switch prior to releasing the contact between the power supply pad and the power supply contact. Or an arrangement in which the information processing circuit in the electronic device executes the operation of storing the memory information written on the card by using the signal of opening or closing of the memory storage switch as a trigger. This is intended to appropriately prevent erasure of memory information in the card accompanying removal of the card.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 3, an IC memory card has a built-in memory IC in a card 1 similar to that described in FIG.
A front and rear signal pad 2, a post signal pad 3, a power supply line 4, a ground line 5, a power supply pad 6, and a ground pad 7 having the arrangement described with reference to FIG. A thin insulating line 8 separates each line, and the front and rear signal pads 2 and 3 from each line.

As shown in FIG. 7, the IC memory card 1 is directly inserted into a receptacle of an electronic device, and a pre-stage signal contact 9 corresponding to each pad provided in the device is provided.
And a dedicated thin flat case as shown in FIG. 8 which is connected to an information processing circuit in an electronic device via a signal contact 10, a power contact 11 and a ground contact 12 at a subsequent stage, or has a socket for inserting a card. The contacts 9 to 12 are inserted into the (card connector 19) and come into contact with the contacts 9 to 12 provided in the case, and the contacts 9 to 12 are connected to the connector in the device by inserting the case into a socket of the electronic device. Then, it is connected to the information processing circuit in the same device.

In any case, when the card is inserted into the electronic device, the contacts 9 to 12 are brought into pressure contact with the pads 2, 3, 6, and 7 so that the memory IC built in the card is mounted. By connecting to the information processing circuit in the electronic device, the information held in the memory IC in the card is given to the information processing circuit in the electronic device, or the information held in the information processing circuit in the electronic device is recorded in the memory IC in the card. There is a way to be done.

The contacts 9 to 12 are made of a conductive strip stamped and bent from a metal plate, have an elastic strip at one end thereof, and have pads 2, 3, 3 of the card 1 at free ends of the elastic strip. It has a contact protruding portion 13 that resiliently contacts 6 and 7, and further has, on the other end side, a terminal piece that is connected by soldering or the like to a wiring board that forms part or all of the information processing circuit. A large number of the contacts 9 to 12 extend in the reciprocating direction of the card 1 and are arranged side by side in a direction orthogonal to the reciprocating direction.

When the card 1 is inserted into a receptacle in an electronic device as shown in FIGS. 7A, 7B and 7C, the contact projections 13 of the contacts 9, 10, 11, and 12 provided in the receptacle are inserted into the front of the card. At the insertion end, the card comes into pressure contact with the pads 2, 3, 6, 7 while sliding on the card surface from the edge to the pad.

A case where a slider 18 for controlling the opening and closing of a contact as shown in FIG. 8 will be described.
The slider 18 has a large number of contact guide grooves 14 extending in the reciprocating direction on the back surface facing the contact and arranged in parallel in a direction perpendicular to the reciprocating direction. It reciprocates while receiving the protrusion 13 and regulating its position. In the through hole 15 provided near the end of the forward movement, the contact protrusion 13 is released, and the card 1 is restored by the restoring force of the elastic strip of the contact. We hit each pad.

The slider 18 is also used as a card tray for receiving and regulating the position of the card 1.
The card 1 is inserted into the space defined by the side ruler 16 for regulating the side edge of the card 1 and the front end of the card 1, and the card 1 is inserted into the space defined by the side ruler 16 and the front pad 17. Is brought into contact with the front pad 17 to obtain the forward movement of the slider 18 following the card insertion, and conversely, the slider 18
, The card 1 is removed.

The slider 18 is moved back by a spring means, or is moved back by an ejecting operation mechanism to remove the card and release the contact.

As shown in FIG. 8A, when the card 1 is inserted, the front end of the card pushes the front pad 17 and the slider 18
Move together. Due to this forward movement, the contact protrusions 13 of the contacts 9 to 11 slide while resiliently contacting the bottom surface of the contact guide groove 14, and as shown in FIG. 2,3
8C, the card 1 and the slider 18 are moved a little further from the pressure contact start position, and the pads 2, 3, 6, 7 are moved as shown in FIG. 8C. It slides a little while maintaining the pressure contact state.

Similarly, in order to remove the card 1, the slider 1
8, the contact protrusion 13 of the contact follows the reverse course, and each pad slides in the direction opposite to the direction when the card is inserted while maintaining the pressure contact with the contacts 9 to 12. At the sliding end (the starting point of the pressurized contact when the card is inserted), it is controlled to separate from the pad and the card against the resilience and slide again while elastically contacting the bottom surface of the contact guide groove 14. .

According to the present invention, in the above-described contact structure between the card and the contact, as shown in FIG. 3, the contact position of the contact projection 13 of the post signal contact 10 with respect to the post signal pad 3 is determined. From the sliding dimension S1 to the front edge of the pad and the contact position of the contact protrusion 13 disposed behind the contact protrusions of the front and rear signal contacts 9 and 10 of the power contact 11 with respect to the power pad 6 The sliding dimension S2 up to the front edge of the pad is S
1> A protection device in an IC memory card set so as to satisfy S2. S1> S2
Holds for all the subsequent signal pads 3.

Further, the sliding dimension S2 and the sliding dimension S3 from the contact position of the contact projection 13 of the contact 9 for the preceding signal to the preceding signal pad 2 to the front edge of the pad are defined as follows.
This constitutes a protection device in an IC memory card set so that S2 <S3.

The protection device has a relationship of S1, S3> S2. With the above configuration, even if the power contact 11 is detached from the power pad 16 when the card is removed, the signal contacts 9 and 10 are in contact with the signal pads 2 and 3.
Since the signal contacts 9 and 10 contact the signal pads 2 and 3 before the contact with the power supply pad 6, the control signal input pad 2 or 3 of the memory IC is kept in an inactive state and IC malfunction is prevented, and IC damage is also prevented.

That is, while the power is supplied to the memory, it is guaranteed that the control signal pin is in contact with the memory. Therefore, by keeping this control signal pin inactive, the control signal pin is inactive on the bus line. Can be completely prevented from occurring, such as data collision and unwanted commands being fetched due to noise, so that malfunctions can be effectively eliminated.

The signal contacts 9 and 10 at the front and rear stages are also provided.
Before releasing the contact between the power supply contact 11 and the pad 6 before releasing the contact between the power supply contact 11 and the pad 6, the protection circuit in the device is activated by using this as a trigger, and the IC for the memory with a built-in card and the information It can be a means for protection. Alternatively, a means for appropriately preventing a malfunction of the information processing circuit in the electronic device.

As another example, as shown in FIGS. 5 and 6,
The sliding dimension S1 from the contact position of the contact protrusion 13 of the rear signal contact 10 to the rear signal pad 3 to the front edge of the pad, and the front and rear signals of the power contact 11 to the power pad 6 The sliding dimension S2 from the contact position of the contact protrusion 13 disposed behind the contact protrusion of the contacts 9 and 10 to the front edge of the pad is represented by S
1> S2, or a sliding dimension S3 between the sliding dimension S2 and the contact position of the contact protruding portion 13 of the preceding signal contact 9 with the preceding signal pad 2 to the front edge of the same pad. Is set to satisfy the relationship of S2 <S3, and the relationship of S1, S3> S2 is set, and a memory storage switch 20 which is opened or closed in conjunction with insertion and removal of the card 1 is provided. The storage switch 20 is arranged so as to be opened or closed prior to the release of the contact between the power supply pad 6 and the power supply contact 11, and the card 1 is triggered by an open or closed signal of the memory storage switch 20. A protection device for an IC memory card in which an information processing circuit in an electronic device into which the information is inserted performs a storage operation of memory information written on the card. A.

The opening and closing of the memory storage switch 20 is controlled by contact with the front edge of the card, and when the card is inserted, the card insertion is detected and an internal information processing circuit (CPU) is detected.
It is also used as a switch that forms a state in which access to is possible.

In this example, while the effects shown in FIGS. 3 and 4 are obtained, when the IC memory card 1 is removed during use, the recorded information in the card built-in memory IC is erroneously erased or erroneously written. Can be effectively prevented.

[0029]

According to the present invention, in the case where an IC memory card is inserted into an electronic device to exchange information, a memory IC built in the card when the card is inserted or removed.
Of the IC, erroneous writing or erasing to the IC is reliably prevented, and a malfunction at the time of card insertion / removal can be properly prevented.

Further, the above object can be effectively achieved by a simple configuration for setting the timing for releasing the contact between the signal and power supply pads and each contact, and is extremely useful as a protection device for pads and contacts arranged at high density.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing a contact structure of an IC memory card and a contact to be improved according to the present invention, with a card fully inserted state.

FIG. 2 is a schematic plan view showing the contact structure with a card removal process.

FIG. 3 is a schematic plan view showing a contact structure between an IC memory card and contacts, illustrating the present invention, with a card fully inserted;

FIG. 4 is a schematic plan view showing the contact structure with a card removal process.

FIG. 5 is a schematic plan view showing a contact structure between an IC memory card and contacts according to another embodiment of the present invention, with the card fully inserted.

FIG. 6 is a schematic plan view showing the contact structure with a card removal process.

FIGS. 7A, 7B, and 7C are cross-sectional views illustrating a contact operation between an IC memory card and a contact as the card is inserted.

FIGS. 8A, 8B, and 8C are cross-sectional views illustrating an example in which an IC memory card and a contact are opened and closed using a slider as the card insertion operation proceeds.

[Explanation of symbols]

 Reference Signs List 1 IC memory card 2 Pre-stage signal pad 3 Post-stage signal pad 4 Power supply line 5 Ground line 6 Power supply pad 7 Grounding pad 8 Insulation line 9 Pre-stage signal contact 10 Post-stage signal contact 11 Power contact 12 Grounding contact 20 Memory storage switch S1, S2, S3 Dimensions indicating opening / closing timing

Continued on the front page. (51) Int.Cl. ⁶ Identification symbol FI G06K 17/00 G06K 17/00 E 19/07 H01R 23/68 L H01R 23/68 G06K 19/00 M (72) Inventor Takeshi Nishimura Tokyo 3-28-7 Nakamagome, Ota-ku Yamaichi Electric Co., Ltd. (56) References JP-A-8-90969 (JP, A) JP-A-52-61761 (JP, A) JP-A-4-58480 ( JP, A) (58) Fields investigated (Int. Cl. ⁶ , DB name) G06K 19/00-19/077 G06F 3/00 G06F 12/16 G06F 17/00 H01R 23/68

Claims (3)

(57) [Claims] 1. A large number of signal pads are arranged on the surface of an IC memory card in parallel in front and rear stages, and a power supply line and a ground line are arranged between a row of front stage signal pads and a row of rear stage signal pads. A power supply pad is provided at the end of the preceding power supply line, and is arranged in parallel with the column end of the preceding signal pad, and a grounding pad is provided at the end of the subsequent ground line for the subsequent signal line. An IC memory card which is arranged in parallel with a row of pads and which is connected to an electronic device by contacting a contact protrusion of a contact with each pad when the IC memory card is inserted. And a sliding dimension S1 from the contact position of the contact projection to the front edge of the pad, and rearward from the contact projections of the front and rear signal contacts of the power contact to the power pad. From the contact position of the contact protrusion arranged sliding dimension S2 of to the same pad front edge, the protection device in the IC memory card, characterized in that set so as to be in the relationship of S1> S2. 2. The sliding dimension S2 and the sliding dimension S3 from the contact position of the contact protruding portion of the preceding signal contact to the preceding signal pad to the front edge of the pad have a relationship of S2 <S3. The protection device according to claim 1, wherein the protection device is set. 3. A large number of signal pads are arranged in parallel on the surface of an IC memory card in front and rear rows, and a power supply line and a ground line are provided between front and rear row of signal pads and front and rear row of signal pads. A power supply pad is provided at the end of the preceding power supply line, and is arranged in parallel with the column end of the preceding signal pad, and a grounding pad is provided at the end of the subsequent ground line for the subsequent signal line. An IC memory card which is arranged side by side with a row of pads and is connected to an electronic device by contacting a contact protrusion of a contact with each pad when the card is inserted.
The sliding dimension S1 from the contact position of the contact protrusion of the post signal contact to the post signal pad to the front edge of the pad and the contact protrusion of the front and rear signal contacts of the power supply contact to the power supply pad. The sliding dimension S2 from the contact position of the rear contact projection to the front edge of the pad is set so as to satisfy the relationship of S1> S2,
Further, a memory storage switch which is opened or closed in conjunction with insertion and removal of the card is provided, and the memory storage switch is opened or closed prior to the release of the contact between the power pad and the power contact. The information processing circuit in the electronic device in which the card is inserted is configured to execute an operation of storing the memory information written in the card by using the signal of opening or closing the memory storage switch as a trigger. Protection device in an IC memory card.