JP2795288B2 - Electronic device shelf structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] A shelf structure for accommodating a large number of printed circuit boards on which electronic components are mounted to constitute an electronic device, particularly a shelf formed of a resin mold and having excellent heat dissipation. With regard to the new structure, with the aim of providing a new shelf structure that can improve manufacturability, reduce manufacturing costs, and achieve miniaturization, the left and right side walls, top wall, and bottom wall manufactured by integral molding of resin The top wall is composed of lattice-shaped ribs and has a number of ventilation holes on the entire surface, and a number of upper guide rails extending in the depth direction are provided at predetermined intervals on the inner surface thereof. A plurality of rib-shaped protrusions extending in the depth direction are provided in parallel at predetermined intervals on the surface side of the bottom wall facing the top wall, and the ridge line portion of the protrusions extending horizontally has a top wall side. A lower guide rail corresponding to the upper guide rail is provided, and the back surface side of the valley between the projections forms a slope having an upwardly tapering rearward.

[Industrial applications]

The present invention relates to a structure of a shelf for accommodating a large number of printed circuit boards on which electronic components are mounted to constitute an electronic device, and particularly to a novel structure formed of a resin mold and having excellent heat dissipation. .

[Conventional technology]

When the electronic device operates, the electronic components mounted thereon generate heat. In recent years, high-density mounting technology has advanced, and a large number of electronic components have been mounted on a printed circuit board. Therefore, measures against this heat generation have become increasingly important.

As shown in FIG. 6, a conventional main body 1 of a shelf is integrally formed as a hollow box composed of a side wall 2, a top wall 3, and a bottom wall 4 by a resin reinforced with glass fiber. I have. The side walls 1 are composed of panels reinforced with grid-like ribs 5, while the top wall 3 and the bottom wall 4 are composed of a transparent lattice 6, and ventilation holes 6a are formed on the entire surface. Guide rails 7 in the depth direction are installed at predetermined intervals on the inner surfaces of the top wall 3 and the bottom wall 4, along which printed circuit boards on which electronic components are mounted are accommodated.

A plurality of the shelf bodies 1 are stacked and mounted on a cabinet or a frame to constitute an electronic device such as a communication device. At the time of stacking, a convection induction plate unit 8 is inserted between the shelf bodies 1. You. This convection induction plate unit 8
Is formed in a box shape surrounded by four sides, provided with a large number of ventilation holes 10 on the front surface thereof, and provided with a guide plate 9 having a rising slope toward the rear.

Explaining the cooling action of the printed circuit board according to the conventional configuration, cooling air is sucked from the ventilation hole 10 of the convection guide plate unit 8 installed at the lower part, and the electronic heat generated between the printed circuit boards accommodated in the shelf is generated. Allow parts to cool. Then, the temperature rises to form a rising airflow,
, And is guided backward along the convection guide plate 9 of the unit 8 installed on the upper part thereof, and is discharged to the outside from the back side.

[Problems to be Solved by the Invention] The conventional shelf has a drawback in that the shelf main body on which the printed circuit board is mounted and the convection induction plate unit which performs the heat-dissipating action are formed as separate members, and thus, there is a drawback that the assembly requires manual operation. . In addition, the shelf body must have a considerable height in the grids that make up the top and bottom walls to prevent warpage after molding and to withstand the weight of the printed circuit board to be mounted. And tends to hinder the downsizing of the entire device.

An object of the present invention is to solve such a problem of the conventional shelf and to provide a novel shelf structure capable of realizing improvement in manufacturability, reduction in manufacturing cost, and downsizing.

[Means for solving the problem]

The object is a shelf comprising left and right side walls, a top wall, and a bottom wall produced by integral molding of a resin, wherein the top wall is constituted by grid-like ribs and has a large number of ventilation holes on the entire surface. At the same time, a number of upper guide rails extending in the depth direction are provided on the inner surface thereof at predetermined intervals, and a number of rib-like projections extending in the depth direction are provided at predetermined intervals on the surface side of the bottom wall facing the top wall. A lower guide rail corresponding to the upper guide rail on the ceiling wall side is provided at a ridge line portion of the protrusion that is provided in parallel and extends horizontally, and a back surface side of a valley between the protrusions faces rearward. This is achieved by a shelf structure of an electronic device characterized by forming an inclined surface having an upward taper.

It is preferable that a plurality of shelf bodies are stacked vertically and / or side by side and integrated to form a shelf structure of one electronic device.

Shelf top wall, both side walls, rear opening,
It is desirable that a cover be provided in the front opening.

Further, the material forming the shelf is desirably glass fiber reinforced resin.

[Action]

The printed circuit board on which the electronic components are mounted is housed inside from the front opening of the shelf along the upper and lower guide rails,
The connector is connected to the backboard installed on the back of the shelf. In this manner, a plurality of shelves containing printed circuit boards are vertically stacked and mounted on a frame or the like to constitute an electronic device such as a communication device.

When the electronic device operates, the electronic components on the printed circuit board generate heat and generate an upward airflow in the shelf. Thereby, external cold air is introduced into the shelf through the gap between the shelves, rises while cooling it through the gap between the adjacent printed circuit boards, and exits through the ventilation holes in the top wall of the shelf. In this area, the back surface of the bottom wall of the shelf stacked on top is located, so that the warmed air is guided rearward along the slope, and is exhausted as it is into the outside air.

In this way, the warm air used for cooling is immediately discharged out of the shelf, so that a good cooling effect can be maintained.

Hereinafter, the present invention will be described in more detail based on preferred embodiments shown in the drawings.

〔Example〕

FIG. 1 is a perspective view showing an example of a shelf structure according to the present invention.

The shelf body 1 is made of, for example, AB reinforced with glass fiber.
It comprises a left and right side wall 2, a top wall 3 and a bottom wall 4 integrally formed of S resin, and has a box-shaped structure with front and rear surfaces opened. The side wall 2 is formed of a flat plate, and a grid-like rib 5 protrudes from the outer surface thereof for reinforcement. The top wall 3 is formed by a grid-like rib 6 having a predetermined height, and has a large number of ventilation holes 6a formed on the entire surface. A plurality of guide rails (not shown) extending in the depth direction are provided on the inner surface of the top wall 3 at predetermined intervals. These configurations are substantially the same as the conventional shelf structure described above.

The feature of the present invention lies in particular in the configuration of the bottom wall 4.
As shown in FIGS. 2 (a) and 2 (b), the bottom wall 4 has a plurality of rib-like projections 11 extending in the depth direction and arranged in parallel at a predetermined interval. The ridges forming the tops of the rib-like projections 11 are located parallel to each other on a horizontal plane, and guide rails 7 corresponding to the guide rails on the top wall side are provided along the ridges. A valley 12 having a taper that gradually becomes shallower from the front side toward the depth direction is formed between the adjacent rib-shaped protrusions 11, and correspondingly, the back surface of the valley 12 has an inclined surface 12 a rising rearward. No. A backboard 13 is installed vertically on the shelf body 1 so as to cross the opening on the rear surface. The printed circuit board 14 is inserted into the shelf from the front opening of the shelf body 1 by engaging the upper and lower sides with the guide rails, and is connected to the connector 15 on the back board 13.

As shown in FIG. 3, the shelf main body 1 is provided with a side panel 16 and a back panel 17 for reinforcement, and a connecting bracket fixed across the front and rear regions of the top wall 3 and the bottom wall 4.
A plurality of layers (two levels in this example) are stacked vertically on the table 19 and mounted on the table 19 to constitute an electronic device such as a communication device.
In the figure, reference numeral 20 denotes a top cover that covers the top wall of the uppermost shelf. Further, a front cover, a back cover, and a side cover may be further provided as needed.

The operation of the shelf of the present invention thus configured,
In particular, regarding the cooling effect of heat generated from printed circuit boards,
Description will be made based on the drawings.

The heat generated from the electronic components mounted on the printed circuit board 14 in the lower shelf (hereinafter, referred to as the first shelf) generates an upward airflow in the first shelf. Due to this, low-temperature outside air is sucked into the first shelf through the ventilation holes 21a at the lower part of the front cover 21, and the heat-generating components are cooled through the gaps between the adjacent printed circuit boards 14, and the heat is exchanged. It is heated and becomes an updraft, and the top wall 3
Escapes upward through the ventilation hole 6a. The high-temperature air is supplied to the inclined surface of the bottom wall 4 of the upper shelf (second shelf).
It is guided to the rear of the shelf along 12a, and is exhausted outside through an opening provided in that area. That is, the air heated by cooling the heat-generating components through the inside of one shelf is immediately discharged out of the shelf without being introduced into the upper shelf. The temperature is always kept low, and the cooling efficiency is improved.

As shown in FIG. 5, this shelf is connected to the above-mentioned connecting bracket.
By using 18, it is possible to install in parallel in the left and right direction.

〔The invention's effect〕

As described above in detail, according to the present invention, since the main body portion for housing the printed circuit board and the portion for performing the convection induction action are integrally formed, the number of parts as the whole apparatus is greatly reduced, and the manufacturing process is streamlined. Becomes possible. Further, the structure in which the convection guide plate unit is also used for the bottom wall can be smaller in height than when a separate part is stacked as in the conventional case, and the size of the entire apparatus can be reduced. Further, this configuration strengthens the bottom wall and increases rigidity.

[Brief description of the drawings]

FIG. 1 is a perspective view showing the basic configuration of the shelf structure of the present invention, FIG. 2 (a) is a partial perspective view showing the shape of a bottom wall, FIG. 2 (b) is a sectional view taken along line AA of FIG. FIG. 3 is an exploded perspective view showing the shelves of the present invention stacked in a plurality of stages, FIG. 4 is a schematic diagram showing the flow of cooling air in the shelves of the present invention, and FIG. 5 shows another mode of use of the present invention. FIG. 6 is an exploded perspective view showing an example of a conventional shelf structure. DESCRIPTION OF SYMBOLS 1 ... Shelf main body, 2 ... Side wall, 3 ... Top wall, 4 ... Bottom wall, 6 ... Ventilation hole, 7 ... Guide rail, 11 ... Rib-shaped protrusion, 12 ... Valley, 12a ... Inclined surface, 13 Backboard, 14 Printed circuit board.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-1-245595 (JP, A) Japanese Utility Model Showa 59-101490 (JP, U) Japanese Utility Model Showa 63-50193 (JP, U) Japanese Utility Model Showa 63- 200393 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 7/14, 7/18, 7/20

Claims (4)

(57) [Claims] 1. A shelf body (1) comprising left and right side walls (2), a top wall (3) and a bottom wall (4) produced by integral molding of a resin, wherein said top wall (3) is a lattice. A plurality of ventilation holes (6a) are formed on the entire surface and are formed on the entire surface, and a number of upper guide rails extending in the depth direction are provided on the inner surface thereof at predetermined intervals to face the top wall (3). A large number of rib-like projections (11) extending in the depth direction are provided in parallel at a predetermined interval on the surface side of the bottom wall (4), and the ridge of the projection (11) extending horizontally has a ceiling. A lower guide rail (7) corresponding to the upper guide rail on the wall side is provided, and a back surface of a valley (12) between the protrusions (11) has a slope (12a) having an upwardly tapered rearward. A shelf structure of an electronic device characterized by being formed. 2. A shelf structure of an electronic device in which a plurality of shelf bodies (1) according to claim 1 are vertically stacked and / or integrated side by side. 3. The shelf structure according to claim 1, wherein a cover is provided on a top wall (3), both side walls (2), a rear opening, and a front opening of the shelf exposed to the outside. 4. The shelf structure according to claim 1, wherein the material constituting the shelf body (1) is a glass fiber reinforced resin.