JP2776269B2 - Printed wiring board design equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board designing apparatus, and more particularly to a printed wiring board designing apparatus suitable for high-density wiring designing.

[0002]

2. Description of the Related Art FIG. 9 shows an example of a processing procedure of a wiring design method for a printed wiring board of this type which has been conventionally used. Note that reference numerals 901 to 912 in FIG.

[0003] Designers are pin type (902), line type (line width) (903), through-hole type (1 piece)
(904), the input point of the line, the end point of the line,
A line is input by specifying the coordinates of the start and end points of the line (905), and it is confirmed whether the layer of the line input continuously is different from the layer of the line input immediately before and a through hole is required. (906).

In step 906, if it is confirmed that the layer of the line continuously inputted is the same as the layer of the line inputted immediately before, the lines are connected (91).
0), and then confirm whether the pattern is completed (91)
1). Step 90 if the pattern is not completed
5, the same operation is repeated, and when the pattern is completed, the process ends (912).

In step 906, if it is confirmed that the through-hole is necessary, unlike the layer of the line input immediately before, the layer of the line which has been continuously input is required. A through hole having a conductive layer is generated (907).

After that, it is confirmed whether the generated through-hole is not suitable for line connection (908). If the generated through-hole is not compatible, the through-hole is deleted and a new through-hole is defined again or the through-hole is corrected (909) and connected to the line (910). If the generated through hole is suitable, the process proceeds to step 910.

FIG. 10 is a view showing an example of wiring using through holes. A wiring pattern 1002a on the front surface and a wiring pattern 100 on the back surface formed with an insulating substrate 1001 interposed therebetween.
2b or a through-hole 100 having a conductive layer 1004 on the inner surface to allow conduction between 1003a and 1003b.
5 is provided, and each wiring pattern 1002a, 1002b, 1
Lands 100 provided at ends of 003a and 1003b
6 and the conductive layer 1004 allow connection of a wiring pattern. In designing a printed wiring board having a plurality of layers as described above, through holes are used as a method of connecting between different circuit layers. Also, the through hole is used for bypassing to another circuit layer even when a wiring path is obstructed by another wiring wired in the same circuit layer at the time of wiring.

[0008]

In the conventional wiring method using through holes, only one wiring pattern can be connected to one through hole as shown in FIG. If you connect
It is necessary to provide a plurality of through-holes, and as the density increases, the occupancy rate of the through-holes and the lands provided around the through-holes increases, and the degree of freedom in wiring pattern design decreases. It is difficult to perform this, and there is a drawback that the density of the printed wiring board is hindered.

An object of the present invention is to provide a printed wiring board designing apparatus capable of overcoming the above-described drawbacks and designing a high-density wiring pattern.

[0010]

According to a printed wiring board designing apparatus of the present invention, a printed wiring board designing apparatus comprising a plurality of layers for connecting lines formed on different circuit layers with through holes is provided. From an input unit that receives necessary design information, a through-hole type storage unit that stores through-hole data including divided through-holes, and a through-hole type storage unit based on line type and position information input to the input unit A through-hole type determination unit that selects and determines the type of through-hole that matches the connection,
Based on the decision made by the through hole type determination unit, if there is no through hole in the place where the through hole is required, a through hole with a conductive layer on the inner surface is generated, and the through hole is created in the place where the through hole is required If there are holes, generate cut lands to divide the inner surface of the existing through hole and the conductive layer of the land in the circumferential direction, and connect the desired line to the formed conductive layer. A generation unit, a through-hole cutland data storage unit for storing data of the through-hole and cutland generated by the through-hole cutland data generation unit, and an input content to the input unit and a through-hole cutland data storage unit. Determine the overall pattern of the printed wiring board from the through hole and cut land data shown in the stored contents. And an outputting unit for outputting to the outside.

In the printed wiring board designing apparatus of the present invention,
The cut land is formed by dividing the inner surface of the through hole and the conductive layer of the land in the circumferential direction by forming a columnar non-conductive through hole with a completely divisible land and a small diameter. Alternatively, both the through-hole and the cut land may be generated as data of a cylindrical through-hole, held as a set of data belonging to the through-hole, and output to the outside.

[0012]

In the printed wiring board designing apparatus of the present invention, a desired type of through-hole is selected by the through-hole type determining unit from the through-holes including the divided through-holes registered in advance in the through-hole type storage unit. You. The through hole selected from the storage unit is generated as wiring data in a through hole cut land data generation unit, and necessary wiring is connected to the land. When a divided through hole is selected, a line corresponding to a predetermined position of the divided land is connected.

As another design method, in the first connection at the position, a non-divided through hole is selected by the through hole type determination unit from among the through holes registered in advance in the through hole type storage unit, and the through hole cut is performed. The land data is generated as wiring data by the land data generating unit, and necessary wiring is connected to the land. If a through hole is required at the same position as the existing through hole, the cut land is automatically generated by the through hole cut land data generator, the through hole is divided, and the necessary wiring is connected to the specified position. You.

The information of the through-hole and the cut land generated in the through-hole cut land data generation section is stored in the through-hole cut land data storage section and output from the output section as needed.

As described above, in any of the methods, a plurality of wiring patterns are easily connected at one through-hole position.

When the division information is processed by the through-hole cut land data generation unit as a cylindrical through-hole, it is stored as a set of hole information together with the through-hole information in the through-hole cut land data storage unit. The information is output from the output unit as processing information.

[0017]

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram of a design apparatus according to an embodiment of the present invention. The design device according to the present invention includes an input device 110 such as a keyboard and a mouse, a CPU device 120 that determines and calculates an input and outputs the result to a storage device, and a storage device 1 that stores the input and the calculation result and outputs the result to the CPU device 120.
30, a display device 140 for displaying a document or an image, and an external device 150 for receiving an output.

The CPU device 120 includes an input section 121, a through-hole type determining section 122, a through-hole cut land data generating section 123, and an output section 124. Further, the storage device 130 includes a through hole type storage unit 131 and a through hole cut land data storage unit 1.
32.

The input unit 121 receives an instruction input from the input device 110. The through-hole type determining unit 122 selects and determines a through-hole type suitable for connection from the through-hole type storage unit 131 based on the input line type and position information. The through-hole cut land data generation unit 123 generates a through hole having a conductive layer on the inner surface based on the determination, or generates a cut land that divides the inner layer of the existing through hole and the conductive layer of the land in the circumferential direction. Then, a desired line is connected to the formed conductive portion. The output unit 124 determines the overall pattern of the printed wiring board from the input contents to the input unit and the data of the through holes and the cut lands indicated in the contents stored in the through hole cut land data storage unit, and outputs the information to the outside. Through-hole type storage unit 13
Numeral 1 stores data of through holes including divided through holes, and a through hole cut land data storage unit 132 stores data of generated through holes and cut lands.

FIG. 2 is a flowchart for explaining an interactive processing procedure which is a first embodiment of the design apparatus according to the present invention. Incidentally, reference numerals 201 to 215 in FIG.

When the designer starts work, (20)
1), pin type (202), line type (20
3), through-hole type including split through-hole (2
04) and inputting the line by designating the input point of the line, the end point of the line, the coordinates of the start and end points of the line, etc. (2)
05).

If it is confirmed in step 206 that the layer of the line inputted continuously is the same as the layer of the line inputted immediately before (206N), connection is made (21N).
0), and then confirm whether the pattern is completed (21)
4). If the pattern is not completed (214N), the process returns to step 205, and the same operation is repeated. If the pattern is completed (214Y), the process ends (2).
15).

In step 206, when it is confirmed that the layer of the line continuously inputted is different from the layer of the line inputted immediately before and a through hole is necessary (206).
In (Y), the presence or absence of an existing through hole is checked (20).
7). If there is no existing through hole at the line connection part (207N), a through hole of a type considered necessary is generated (208) and the line is connected (210).

If the existing through-hole is at the same coordinates (207Y), it is determined whether or not it can be connected to the existing through-hole (209), and if possible, the line is connected (209Y) (210). If impossible (209N), the existing through-hole is deleted (211), a new through-hole is selected (212) and generated (213), and step 209 is performed.
Return to

After the line connection (210), it is checked whether the pattern is completed (214), and if it is not completed (214N).
Returns to (205), and repeats the same operation. When the pattern is completed (214Y), the input ends (21).
5).

Through-hole cut land data generator 1
23 is stored in the through-hole cutland data storage unit 132,
The output unit 124 determines the overall pattern of the printed wiring board together with the other data generated in the other output unit according to the input data to 1 and stored in the other storage unit, and is output to the outside as information.

By selecting the divided through-holes as described above, a plurality of wirings between multiple layers can be made with the same through-holes.

FIG. 3 is a flow chart for explaining an automatic wiring type processing procedure which is a second embodiment of the design apparatus according to the present invention. Note that 301 to 315 in FIG.

When the designer starts work, (30)
1), pin type (302), line type (30
3), through-hole type including split through-hole (3
04), and inputting a line by specifying the input point of the line, the end point of the line, the coordinates of the start and end points of the line, etc.
05).

If it is confirmed in step 306 that the layer of the line continuously inputted is the same as the layer of the line inputted immediately before (306N), connection is made (31).
3) Then, it is confirmed whether the pattern is completed (31)
4). If the pattern is not completed (314N), the process returns to step 305, and the same operation is repeated. If the pattern is completed (314Y), the process ends (3
15).

In step 306, when it is confirmed that the layer of the line inputted continuously is different from the layer of the line inputted immediately before, the through hole is necessary (306).
In (Y), it is confirmed whether or not there is an existing through hole (30).
7). If there is no existing through hole at the line connection part (307N), a non-divided type through hole is automatically generated (308), the lines are connected (313), and it is confirmed whether the pattern is completed (313). 314). If the pattern is not completed (314N), step 30
5, the same operation is repeated, and when the pattern is completed (314Y), the process ends (315).

If the existing through holes are at the same coordinates (307Y), the land dividing position is automatically determined (309), and a cut land is generated to divide (31).
0), the existing and new lines are corrected and connected to a predetermined portion of the divided land (311). Whether the connection relationship is good or bad is determined (312).
9; if yes, go to step 314.

Through-hole cut land data generator 1
The data of the through hole and the cut land generated at 23 are stored in the through hole cut land data storage unit 132, and other data generated at another output unit according to the input data to the input unit 121 and stored in the other storage unit. At the same time, the overall pattern of the printed wiring board is determined by the output unit 124 and output to the outside as information.

By dividing the non-divided through hole and land as described above, a plurality of wirings between multiple layers can be made with the same through hole.

FIG. 4 is a partial perspective view of the connection between the wiring and the through hole of the printed wiring board formed by the design of the first and second embodiments. As shown in FIG. 4, the printed wiring board formed according to the present embodiment includes a wiring pattern 402a on the front surface and a wiring pattern 402 on the back surface formed with the insulating substrate 401 interposed therebetween.
b, and 403a and 403b are connected, by dividing one through hole 405 in the vertical direction, one through hole can connect two different wiring patterns. Also, by increasing the number of divisions, 3
More than one set of wiring patterns can be connected.

FIG. 5A is a partial plan view showing a through-hole dividing wiring method according to a third embodiment of the present invention. The solid line shows the pattern of the through-hole 505 and the columnar non-conductive through-hole 507 for division. And the dashed lines indicate the lines 502a and 503a and the land 506 connected on the wiring board surface.

As shown in FIG. 5A, the wiring pattern 5
02a is connected to one through-hole 505
In the case where an attempt is made to connect a wiring pattern 503a different from 02a, a pre-registered divided through-hole is generated, or a non-divided through-hole 505 and land 506 are formed into a columnar non-conductive through-hole 507 for division.
By generating the cut land by dividing the wiring pattern, it is possible to connect two different wiring patterns with one through hole.

In this case, the through-hole 505 is data of a normal through-hole, and non-conductive through-holes (columnar non-conductive through-holes) 507 are added at two places when dividing.
These three hole data are held as data of a set of divided through holes. This data is output to the outside as processing information as needed.

FIG. 5B is a partial plan view showing two sets of connecting portions formed on the surface of the wiring board by the data designed in FIG. 5A.

FIG. 6 is a plan view of an example of divided through-hole data stored in the through-hole type storage section 131 of FIG. In the case of the interactive type, a desired through hole is selected and generated from the storage unit, and a wiring line is manually connected to a predetermined land of the generated through hole, so that a plurality of wiring patterns are formed at the position of one through hole. Can be connected.

Next, referring to FIG. 7, a second embodiment of the present invention will be described.
Automatic generation of divided through holes in the printed wiring board designing apparatus according to the embodiment will be described. The design data of the printed wiring board is composed of pin type data, line type data, and through-hole type data of the mounted component, and the component arrangement has already been completed as shown in FIG. Shall be.

In FIG. 7A, the penetrating component IC1
Pins P1 to P8 and a part of pins Q1 to Q8 of IC2, which is a surface mount component, are each accompanied by circuit connection information called a net name. For example, P4 of IC1
If the net name of both Q4 and IC4 is GND, it means that these two pins should be connected by wiring.

Next, consider wiring connection according to circuit connection information. For example, a designer draws a wiring pattern while viewing the screen from P1 of IC1. In this case, a figure calculation is performed to determine whether or not the wiring pattern is connected to the through-hole, which is the first pin of the IC1. The figure calculation is obtained by calculating the interval between two figures, and if connected, an attribute such as a net name VCC is attached to the wiring pattern.

Next, a through hole 705 for front / back connection is provided. In this way, as shown in FIG. 7B, P1 of IC1 is connected to Q1 of IC2, and the wiring pattern and the through hole are given, for example, the net name VCC.

Next, consider the connection between P2 of IC1 and Q2 of IC2. While looking at the screen from P2 of IC1 to the through hole of FIG. 7B, the designer draws a wiring pattern of the net name NET1, for example. In this case, the net name VCC and the net name NET1 are connected via the through hole as shown in FIG. 7C, resulting in erroneous wiring.

In this case, the direction in which the wiring pattern is drawn from the through hole is calculated, and the net name V
A divided through hole for dividing the CC and the net name NET1 is automatically generated, and two wiring patterns can be connected at one through hole position as shown in FIG.

FIG. 8 is a sectional perspective view of a divided through hole formed between separated layers according to a fourth embodiment of the present invention. In FIG. 8, a line 802a of one layer is a line 802b of three layers, and a line 803a of two layers is a line 80 of four layers.
3b.

[0049]

As described above, the printed wiring board designing apparatus for dividing a through hole according to the present invention connects a plurality of wiring patterns at one through hole position in the electrical connection of the wiring using the through hole. As a result, it is possible to reduce the increase in the number of through holes due to the increase in the number of wirings due to the high density, and to increase the density of the printed wiring board,
High integration can be realized. Further, by connecting a plurality of wiring patterns between arbitrary layers in the multilayer printed wiring board, higher density and higher integration can be achieved.

The information of through-hole division is stored as a plurality of hole information including information of the through-hole and information of a non-conductive cylindrical through-hole which divides the inner surface of the through-hole and the conductive layer of the land. It is easy to use as processing information.

[Brief description of the drawings]

FIG. 1 is a block diagram of a design apparatus according to an embodiment of the present invention.

FIG. 2 is a flowchart illustrating a processing procedure according to the first embodiment of the present invention.

FIG. 3 is a flowchart illustrating a processing procedure according to a second embodiment of the present invention.

FIG. 4 is a partial perspective view of a connection portion between a wiring and a through hole of a printed wiring board formed by the design of Examples 1 and 2.

FIG. 5A is a partial plan view showing a wiring method according to a third embodiment of the present invention. (B) is a partial plan view showing a connecting portion formed in the third embodiment of the present invention.

FIG. 6 is a plan view of an example of data of divided through holes.

FIG. 7A is a plan view showing pin positions of arranged components. FIG. 4B is a plan view of a connection showing connection between pins. (C) is a plan view showing erroneous wiring to a through hole. (D) is a plan view of connection by divided through holes.

FIG. 8 is a sectional perspective view of a divided through hole according to a fourth embodiment of the present invention.

FIG. 9 is a flowchart for explaining a processing procedure of a conventional example.

FIG. 10 is a partial perspective view of a connection portion between a wiring and a through hole of a conventional printed wiring board.

[Explanation of symbols]

Reference Signs List 110 input device 120 CPU device 130 storage device 140 display device 150 external device 121 to 124 constituent block of CPU device 131 to 132 constituent block of storage device 201 to 215 steps of processing procedure 301 to 315 steps of processing procedure 401 printed wiring board 402a , 402b, 403a, 403b Wiring pattern 404 Conductive layer 405 Through hole 406 Land 407 Cut land 502a, 503a, Wiring pattern 505 Through hole 506 Land 507 Cut land formed by columnar non-conductive through holes (non-conductive through holes) 605 through hole 606 land 607 cut land 702a, 702b, 703a, 703b formed of columnar non-conductive through holes (non-conductive through holes) Wiring pattern 705 through 801 Printed wiring board 802a, 802b, 803a, 803b Wiring pattern 804 Conductive layer 805 Through hole 806 Land 807 Cut land formed by cylindrical non-conductive through holes (non-conductive through holes) 901-912 Steps of processing procedure 1002a, 1002b, 1003a, 1003b
Wiring pattern 1004 Conductive layer 1005 Through hole 1006 Land

Claims (3)

(57) [Claims] 1. A printed wiring board designing apparatus for connecting lines formed on different layers of a multilayer board by through holes, an input unit for receiving design information required for printed wiring board design, and a through hole including a divided through hole. A through-hole type storage unit for storing data of a hole; and a type of a through-hole suitable for connection is selected and determined from the through-hole type storage unit based on a line type and position information input to the input unit. Through-hole type determination unit, based on the determination in the through-hole type determination unit, if there is no through-hole in the place where a through-hole is required, generate a through-hole having a conductive layer on the inner surface,
If there is a through hole at a place where a through hole is required, a cut land is created to divide the inner surface of the existing through hole and the conductive layer of the land in the circumferential direction, and the desired conductive layer is formed on the formed conductive layer. A through-hole cut land data generating unit for connecting the lines of: a through-hole cut land data storage unit for storing data of through holes and cut lands generated by the through-hole cut land data generating unit; And an output unit for determining a total pattern of the printed wiring board from the through hole and cut land data indicated in the input content of the through hole cut land data storage unit and outputting the same to the outside. Printed wiring board design equipment. 2. The printed wiring board designing apparatus according to claim 1, wherein the cut land for dividing the inner surface of the through hole and the conductive layer of the land in the circumferential direction can be completely divided. A printed wiring board designing apparatus, which is executed by forming a cylindrical non-conductive through hole having a small diameter. 3. The printed wiring board designing apparatus according to claim 2, wherein the through-hole and the cut land are both generated as data of a cylindrical through-hole, held as a set of data belonging to the through-hole, and externally. A printed wiring board designing apparatus characterized by outputting.