JP2697987B2 - Electronic component with connection terminal and mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having connection terminals and a method for mounting the electronic component.

[0002]

2. Description of the Related Art A conventional electronic component with connection terminals and a mounting method thereof will be described with reference to FIG. FIG. 6 shows an IC
An electronic component 60 formed by holding a semiconductor element 61 such as a semiconductor device 61 in a multi-pin package 62 having a large number of connection terminals 65... Is mounted on a printed circuit board (mounting board) 70. Pin-shaped connection terminal 65 of electronic component 60
Is inserted into the through hole 71 of the printed circuit board 70 and soldered, whereby the electronic component 60 is mounted.

With the increase in the density of semiconductor elements such as ICs and the density of components mounted on electronic components, the printed circuit board 70 on which the electronic components 60 are mounted has become multi-layered, and the conductor width and conductor spacing of the circuit have been reduced. As described above, in the mounting method in which the connection terminal 65 is inserted into the through hole 71, the diameter of the through hole 71 is reduced, the fine pattern of the circuit 72 is reduced, and the spacing is reduced.

[0004]

However, the above-described mounting method has the following problems. Since the conventional printed circuit 70 has the through holes 71 into which the connection terminals 65 are inserted, corner cracks, parel cracks, land 74 peeling, and inner and outer layer cracks are likely to occur due to heat or physical stress.

In order to increase the mounting density, the through holes 71
And the diameter of the land 74 must be reduced. If the diameter of the through hole 71 is reduced, the plating layer in the hole 71 becomes thinner, and the above-described corner cracks and the like easily occur. Failure is likely to occur. Therefore, large (hole diameter 0.8 mm
As described above, the through hole 71 and the land 74 (1.5 mm or more in diameter) are required, so that the distance between the connection terminals 65 cannot be made very small. Implementation is limited.

In addition, solder is supplied and soldered in a flow soldering process. However, since the condition settings (solder supply amount, temperature, flow rate, substrate moving speed, etc.) are severe,
Defects such as solder repelling, solder wetting failure / disconnection, solder blowing, incomplete frets, and pinholes in through holes are likely to occur. It is difficult for the mounting to be in a proper state.

In view of the above circumstances, it is an object of the present invention to provide an electronic component with connection terminals and a method of mounting the electronic component, which facilitates high-density mounting in an appropriate state.

[0008]

In order to solve the above-mentioned problems, an electronic component with a connecting terminal according to the present invention has a connecting terminal whose one side protrudes from the surface of the component. Terminal is on the other side opposite to the protruding side
It is fixed to the electronic component, has a brim-shaped portion at the tip of the protruding side, and fits the ring-shaped solder material into the connection terminal so as to be sandwiched between the brim-shaped portion and the component surface. The method for mounting an electronic component according to the present invention is a method of mounting the electronic component with connection terminals, wherein the flanges of the connection terminals of the electronic component with connection terminals are aligned with the corresponding connection pads on the surface of the mounting board. (For example,
By performing a reflow soldering process), the brim-shaped portion and the connection pad are soldered.

There is no limitation on the type of electronic component in the present invention. Any electronic component that holds a semiconductor element such as an IC, or an electronic component that holds only a passive element such as a resistor or a capacitor may be used. The mounting substrate according to the present invention may be anything such as a resin-impregnated substrate laminated wiring board, a ceramic wiring board, and a metal base wiring board.

[0010]

According to the electronic component with connecting terminals of the present invention, the connecting portion of the electronic component is heated in a state where the connecting portions of the connecting terminals are in contact with the corresponding connecting pads on the surface of the mounting board. Since the mounting can be performed by soldering the portion and the connection pad, mounting is extremely easy.

Each connection terminal is fitted with a ring-shaped solder material, so that the solder is reliably supplied to the joint. By adjusting the shape of the ring-shaped solder material, the amount of supplied solder can be easily controlled to an appropriate amount. In addition, the portion where the solder material is present becomes a space, and a certain gap is secured between the electronic component and the mounting board, so that insulation is maintained and malfunction due to noise or electromagnetic induction can be prevented. The gap interval can be appropriately controlled by adjusting the thickness of the ring-shaped solder material.

A connection terminal having a brim-shaped portion and a ring-shaped solder material can be easily manufactured by the recent fine processing technology. Attachment of the connection terminal can be performed in the same manner as in the related art, simply by inserting the ring-shaped solder material in advance. Therefore, it is very easy to manufacture the electronic component with connection terminals. In addition, mounting density can be easily increased. This is because no through hole is required on the mounting substrate side. The connection pads on the surface of the mounting substrate can be easily formed at narrow intervals. Further, since the solder material is reliably supplied, there is no need to apply a solder material by printing on the connection pads. At present, when the solder material is to be applied by printing, a pitch interval of about 0.5 mm is the limit, but this is not a limitation.

[0013]

Embodiments of the present invention will be described below. It goes without saying that the present invention is not limited to the following embodiments.
As shown in FIGS. 2 and 3, the electronic component 1 with connection terminals according to the embodiment is provided with connection terminals (pin electrodes) 2 so that one side 2 a protrudes from the surface of the component, and the tip of the protruding side is a ring. The ring-shaped solder material 3 is fitted between the flange-shaped portion 2c and the electronic component surface 1a.

On the other hand, the other side 2b of the connection terminal 2 is pressed into the through hole 11 in the package portion of the electronic component 1 and fixed with a material different from the ring-shaped solder material 3, for example, a conductive paste (conductive resin). At the same time, electrical contacts are ensured. However, if the connection terminal 2 and the inner wall of the through hole 11 are sufficiently pressed against each other when pressed, the fixing with the conductive paste may be omitted. No land is required on the surface of the through hole 11 on the mounting substrate side.

Although there are many connection terminals 2 in which the ring-shaped solder material 3 is fitted in the electronic component 1, if all the ring-shaped solder materials 3 are the same, the amount of supplied solder is constant, and the electronic components after mounting are mounted. The gap between the component and the mounting board is also constant. In mounting, as shown in FIG. 1, the brim-shaped portion 2 c of each connection terminal 2 of the electronic component 1 is aligned so as to abut on the corresponding connection pad (electrode pad) 21 on the surface of the mounting substrate 20. It is only necessary to solder the brim portion 2c and the connection pad 21 by reflow soldering. At the time of reflow soldering, the solder starts to melt from the brim-shaped portion 2c, spreads on the connection pad 21, and wets so that the center of the connection terminal 2 is located at the center of the solder. Thereafter, if cooled, the brim portion 2c and the connection pad 21 are fixed.

Even if the positions of the connection terminals 2 and the connection pads 21 are slightly shifted, there is no problem because the connection terminals 2 are located at the center due to the self-alignment effect of the solder. The present invention is not limited to the above embodiment. For example, as shown in FIG. 4 and FIG.
May be provided. Also, the ring-shaped solder material may be one in which a part of the ring is cut while the ring is completely connected.

[0017]

As described above, in the case of the electronic component with the connecting terminal according to the first aspect of the present invention, the brim-shaped portion of the connecting terminal of the electronic component is formed on the surface of the mounting board as in the second aspect of the present invention. It can be mounted simply by soldering the brim-shaped part and the connection pad in a state where it is aligned so as to hit the corresponding connection pad in. The solder ensures that the solder is supplied in the proper amount to the joints, and the portion where the solder material is present forms a gap between the electronic component and the mounting board. It is easy to manufacture and attach connection terminals and ring-shaped solder materials with connection terminals, so that it is easy to manufacture the electronic component with connection terminals of the present invention itself. In addition, through holes are required on the mounting board side. Not, since in time the connection pad that it can easily be formed at narrow intervals, now attained to facilitate high density mounting, therefore, the present invention is very useful.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram illustrating a mounting state of an electronic component with connection terminals according to an embodiment.

FIG. 2 is a partial cross-sectional view illustrating a main configuration of an electronic component with connection terminals according to an embodiment.

FIG. 3 is a perspective view showing connection terminals and a ring-shaped solder material of the electronic component with connection terminals according to the embodiment.

FIG. 4 is a partial cross-sectional view illustrating a main part configuration of another example of an electronic component with connection terminals according to the present invention.

5 is a perspective view showing connection terminals and a ring-shaped solder material of the electronic component with connection terminals of FIG. 4;

FIG. 6 is an explanatory view showing a mounting state of a conventional electronic component with connection terminals.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component with connection terminal 2 connection terminal 2 c brim portion 3 ring-shaped solder material 20 mounting board 21 connection pad

Claims (2)

(57) [Claims] An electronic component comprising a connection terminal such that one side protrudes from a surface of the component , wherein the connection terminal is provided.
Is fixed to the electronic component on the other side opposite to the protruding side.
The connection terminal has a brim-shaped portion at the tip of the protruding side, and a ring-shaped solder material is fitted into the connection terminal so as to be sandwiched between the brim-shaped portion and the component surface. An electronic component with a connection terminal. 2. The heating of the electronic component with connection terminal according to claim 1, wherein the connection terminal is heated in a state in which the connection portion of the connection terminal is positioned so as to hit a corresponding connection pad on the surface of the mounting substrate. A method of mounting an electronic component in which an electronic component is mounted on a mounting board by soldering a shape portion and a connection pad.