JP2653153B2 - Metallized film capacitors - Google Patents
Metallized film capacitorsInfo
- Publication number
- JP2653153B2 JP2653153B2 JP2550489A JP2550489A JP2653153B2 JP 2653153 B2 JP2653153 B2 JP 2653153B2 JP 2550489 A JP2550489 A JP 2550489A JP 2550489 A JP2550489 A JP 2550489A JP 2653153 B2 JP2653153 B2 JP 2653153B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- layer
- pei
- capacitor
- rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003990 capacitor Substances 0.000 title claims description 40
- 239000011104 metalized film Substances 0.000 title claims description 19
- 239000010408 film Substances 0.000 claims description 54
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 17
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 5
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- LZFNKJKBRGFWDU-UHFFFAOYSA-N 3,6-dioxabicyclo[6.3.1]dodeca-1(12),8,10-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=CC1=C2 LZFNKJKBRGFWDU-UHFFFAOYSA-N 0.000 claims description 4
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 24
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- 230000002950 deficient Effects 0.000 description 7
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- PAALZGOZEUHCET-UHFFFAOYSA-N 1,4-dioxecane-5,10-dione Chemical compound O=C1CCCCC(=O)OCCO1 PAALZGOZEUHCET-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011140 metalized polyester Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/145—Organic dielectrics vapour deposited
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、電子機器、情報機器等に使用する金属化フ
ィルムコンデンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a metallized film capacitor used for electronic equipment, information equipment and the like.
［従来の技術］ 従来、ポリエチレンテレフタレートの二軸配向フィル
ムを誘電体とし、その表面に形成されたアルミニウムを
主成分とする蒸着薄膜を主電極とするコンデンサが、金
属化ポリエステルフィルムコンデンサとして広く用いら
れている。しかしこのタイプのコンデンサには、高温高
湿下で長時間使用した場合、雰囲気中の酸素および水分
によって金属薄膜からなる電極が酸化され導電性を失い
そのためにコンデンサとしての機能を損なう（耐湿性に
劣る）という欠点があった。[Prior Art] Conventionally, capacitors using a biaxially oriented film of polyethylene terephthalate as a dielectric and a main electrode made of a vapor-deposited thin film mainly composed of aluminum formed on the surface thereof have been widely used as metalized polyester film capacitors. ing. However, when this type of capacitor is used for a long time under high temperature and high humidity, oxygen and moisture in the atmosphere oxidize the electrode consisting of the metal thin film, losing its conductivity, thereby impairing the function as a capacitor (moisture resistance). Inferior).
かかる欠点を改良するために、従来、コンデンサ素子
への水分の侵入を防ぐ目的で外装を強化することが特開
昭62−190827号公報などにおいて提案されている。In order to improve such a defect, it has been conventionally proposed in JP-A-62-190827 or the like to enhance the exterior in order to prevent moisture from entering the capacitor element.
［発明が解決しようとする課題］ しかしながら、一方でコンデンサの小型化への要求も
強く、上記の従来技術はこれに逆行し、小型化の要求に
伴う簡易な外装と耐湿性の確保とは、従来相容れないも
のであった。[Problems to be Solved by the Invention] However, on the other hand, there is also a strong demand for miniaturization of capacitors, and the above-mentioned conventional technology goes against this. Conventionally, they were incompatible.
本発明は、かかる問題点を解決し、従来よりも簡易な
外装でも耐湿性に優れた金属化フィルムコンデンサを提
供することを目的とする。An object of the present invention is to solve such a problem and to provide a metallized film capacitor which is excellent in moisture resistance even with a simpler exterior than the conventional one.
［課題を解決するための手段］ 本発明は、上記目的を解決するために、ポリエチレン
テレフタレートの二軸配向フィルムの少なくとも片面
に、エチレンイソフタレート単位を10〜25モル％の範囲
で共重合したエチレンテレフタレート・エチレンイソフ
タレート共重合体からなる層（PEI層）を設けた積層フ
ィルムを主たる誘電体とし、該PEI層上に表面抵抗値が
0.5〜５Ω／□の金属膜層を電極として設けてなること
を特徴とする金属化フィルムコンデンサをその骨子とす
るものである。[Means for Solving the Problems] In order to solve the above-mentioned object, the present invention provides an ethylene copolymer having an ethylene isophthalate unit in the range of 10 to 25 mol% on at least one surface of a biaxially oriented film of polyethylene terephthalate. A laminated film provided with a layer (PEI layer) made of a terephthalate / ethylene isophthalate copolymer is used as a main dielectric, and a surface resistance value is formed on the PEI layer.
A metallized film capacitor characterized in that a metal film layer of 0.5 to 5 Ω / □ is provided as an electrode is the gist of the invention.
本発明におけるポリエチレンテレフタレート（以下PE
Tと略称する）とは、エチレンテレフタレート単位が90
モル％以上を占めているものである。言いかえれば、10
モル％を超えない範囲で他の分子単位、例えばエチレン
アジペート、アルキレングリコールなどが共重合されて
いてもよい。このPET中には、公知の添加剤、例えば無
機微粒子、着色防止剤などが添加されていてもよい。本
発明のPETの二軸配向フィルムとは、上記PETを製膜し二
軸方向に延伸して配向せしめたものである。In the present invention, polyethylene terephthalate (hereinafter referred to as PE)
T) is an ethylene terephthalate unit of 90
It accounts for at least mol%. In other words, 10
Other molecular units such as ethylene adipate and alkylene glycol may be copolymerized within a range not exceeding mol%. Known additives such as inorganic fine particles and a coloring inhibitor may be added to the PET. The biaxially oriented film of PET of the present invention is obtained by forming the above-mentioned PET into a film, stretching the film in a biaxial direction, and orienting the film.
本発明のエチレンテレフタレート・エチレンイソフタ
レート共重合体とは、エチレンイソフタレート単位を10
モル％以上、好ましくは12モル％以上からなる共重合体
であり、この値より小さいとコンデンサにした時の耐湿
性能に関する効果が小さい。また、エチレンイソフタレ
ート単位が25モル％以下であることが必要で、この値よ
り大きくなるとコンデンサにした時の絶縁破壊の不良率
が増加する。このエチレンテレフタレート・エチレンイ
ソフタレート共重合体（以下PEIと略称する）中には、
公知の添加剤、例えば無機微粒子、着色防止剤などが添
加されていてもよい。また、二軸方向に配向せしめても
よい。The ethylene terephthalate / ethylene isophthalate copolymer of the present invention refers to an ethylene isophthalate unit of 10
It is a copolymer consisting of at least 12 mol%, preferably at least 12 mol%, and if it is smaller than this value, the effect of the capacitor on moisture resistance is small. Further, the ethylene isophthalate unit needs to be 25 mol% or less, and if it exceeds this value, the failure rate of dielectric breakdown when a capacitor is formed increases. In this ethylene terephthalate / ethylene isophthalate copolymer (hereinafter abbreviated as PEI),
Known additives, for example, inorganic fine particles, coloring inhibitor and the like may be added. In addition, they may be oriented biaxially.
該PEIの融点は、好ましくは190℃以上、より好ましく
は200℃以上である。なお、本発明のPEI層の平均表面粗
さは、好ましくは0.01〜0.10μｍ、より好ましくは0.02
〜0.07μｍである。また、PEI中の前記無機微粒子は、
平均粒径0.1〜0.6μｍの大きさの粒子が0.05〜0.5％含
有されているのが好ましい。The melting point of PEI is preferably 190 ° C. or higher, more preferably 200 ° C. or higher. The average surface roughness of the PEI layer of the present invention is preferably 0.01 to 0.10 μm, more preferably 0.02 μm.
0.00.07 μm. Further, the inorganic fine particles in PEI,
It is preferable that particles having an average particle size of 0.1 to 0.6 μm are contained in an amount of 0.05 to 0.5%.
本発明は、上記PETフィルムの少なくとも片面にPEIフ
ィルムを積層した積層フィルムであり、PET層と片側のP
EI層の厚みの比は、 0.01≦PEI層/PET層≦0.4 であることが好ましい。この範囲より小さいと耐湿効果
が小さく、この範囲より大きいと絶縁破壊電圧が低下す
る。The present invention is a laminated film obtained by laminating a PEI film on at least one side of the PET film, wherein the PET layer and one side of the PEI film are laminated.
The thickness ratio of the EI layer is preferably 0.01 ≦ PEI layer / PET layer ≦ 0.4. If it is smaller than this range, the moisture resistance effect is small, and if it is larger than this range, the dielectric breakdown voltage decreases.
本発明は積層フィルムのPEIからなる層上に金属膜層
が設けられていることが必要である。該金属膜層は、耐
湿性、付着力の点でアルミニウムを主成分とするものが
好ましく、アルミニウムの性質を損なわない範囲内で少
量の亜鉛、銅などの金属が付着してもよい。ここで、ア
ルミニウムを主成分とするとはアルミニウムの層が100
Å以上であることをいう。In the present invention, it is necessary that the metal film layer is provided on the PEI layer of the laminated film. The metal film layer is preferably composed mainly of aluminum from the viewpoint of moisture resistance and adhesion, and a small amount of metal such as zinc or copper may be adhered within a range that does not impair the properties of aluminum. Here, “aluminum as a main component” means that the aluminum layer is 100
い う means more than
本発明の金属膜層の表面抵抗値は、0.5〜５Ω／□で
あり、好ましくは１〜４Ω／□である。この範囲より大
きいと、金属膜の膜厚が小さく耐湿効果が出にくく、逆
に、この範囲より小さいと金属膜の膜厚が厚すぎてセル
フヒールが効きにくく好ましくない。The metal film layer of the present invention has a surface resistance of 0.5 to 5 Ω / □, preferably 1 to 4 Ω / □. If the thickness is larger than this range, the thickness of the metal film is small and it is difficult to obtain the moisture resistance effect. Conversely, if the thickness is smaller than this range, the thickness of the metal film is too large and the self-heel does not work effectively.
本発明の金属化フィルムコンデンサとは、上記金属膜
層を電極とし、積層フィルムを主たる誘電体とし、巻回
または積層して、熱プレス、メタリコン、切断、電圧処
理したものである。金属膜層上に別の誘電体、例えばPE
Tフィルムなどを重ね合わせて金属化フィルムコンデン
サをつくってもよいことは勿論である。又、アルミニウ
ム箔をはさみこんで該箔をもう一方の電極とする巻回型
コンデンサをつくってもよい。The metallized film capacitor of the present invention is one in which the above-mentioned metal film layer is used as an electrode, the laminated film is used as a main dielectric, wound or laminated, and subjected to hot pressing, metallikon, cutting, and voltage treatment. Another dielectric, for example PE, on the metal film layer
It goes without saying that a metallized film capacitor may be made by laminating T films and the like. Further, a wound capacitor having an aluminum foil sandwiched between the foil and the other electrode may be manufactured.
次に本発明の金属化フィルムコンデンサの製造方法に
ついて説明する。Next, a method for manufacturing the metallized film capacitor of the present invention will be described.
積層フィルムの製法は、共押出し、押出しラミネー
ト、コーティングなどいずれでもよいが、共押出しが好
ましい。PETおよびPEIのペレットを各々別の押出機に供
給して270〜300℃で溶融押出しし、各々の溶融体をＴ型
口金の中で合流せしめてPET/PEIの２層からなシートを
つくる。このシートを80〜100℃で長手方向に３〜４倍
延伸し、一旦冷却した後、80〜110℃で軸方向に３〜４
倍延伸する。延伸後、フィルムを熱固定することが好ま
しいが、これは通常160℃ないし240℃、好ましくは180
℃ないし230℃の温度下で通常１ないし20秒間行なわれ
る。積層フィルムの厚みは0.5〜25μｍが好ましい。熱
固定した積層フィルムを室温まで冷却しPEI層表面に10
-2〜10-6Torrの圧力で電極となるべき金属をフィルム全
面に、あるいはテープなどでマージンをとりながら0.5
〜５Ω／□の厚みで真空蒸着する。こうしてできた蒸着
フィルムは、全面蒸着されたものはレーザ光線などでマ
ージン部をつくり、マイクロスリットされる。マイクロ
スリットされたフィルムは、巻回あるいは積層され、コ
ンデンサ素子にし、公知の方法で熱プレス、メタリコ
ン、電圧処理され、金属化フィルムコンデンサになる。
この金属化フィルムコンデンサは場合に応じてリード線
付され、熱硬化性樹脂による外装を施されて製品にな
る。The method for producing the laminated film may be any of coextrusion, extrusion lamination, coating and the like, but coextrusion is preferred. The PET and PEI pellets are fed to separate extruders and melt-extruded at 270 to 300 ° C., and the respective melts are combined in a T-type die to form a two-layer sheet of PET / PEI. This sheet is stretched 3 to 4 times in the longitudinal direction at 80 to 100 ° C., cooled once, and then axially 3 to 4 at 80 to 110 ° C.
Stretch twice. After stretching, it is preferable to heat-set the film, which is usually 160 ° C. to 240 ° C., preferably 180 ° C.
The reaction is usually carried out at a temperature of from 230C to 230C for 1 to 20 seconds. The thickness of the laminated film is preferably 0.5 to 25 μm. The heat-set laminated film is cooled to room temperature and 10
At a pressure of -2 to 10 -6 Torr, place a metal to be an electrode on the entire surface of the film
Vacuum deposited with a thickness of ~ 5Ω / □. The vapor-deposited film thus formed has a margin portion formed by laser beam or the like and is micro-slit. The micro-slit film is wound or laminated to form a capacitor element, which is then subjected to hot pressing, metallikon, and voltage treatment by a known method to form a metallized film capacitor.
This metallized film capacitor is provided with a lead wire as required, and is provided with a sheath made of a thermosetting resin to be a product.
［発明の効果］ 本発明は、PET/PEIの積層フィルムのPEI層上に特定の
表面抵抗値となるように金属蒸着を行ないコンデンサを
作成したため、蒸着膜の付着、蒸着膜の配向、蒸着膜の
成長状態が単にPET層に蒸着する場合とは異なり、緻密
になったものと推定される。このため、蒸着膜の付着力
が向上し、静電容量変化率が減少したものと思われる。
また、コンデンサにした時に問題になる絶縁破壊の不良
率も小さいという利点がある。[Effects of the Invention] The present invention provides a capacitor by performing metal vapor deposition on a PEI layer of a PET / PEI laminated film so as to have a specific surface resistance value. It is presumed that, unlike the case where the growth state is simply deposited on the PET layer, the growth state becomes dense. For this reason, it is considered that the adhesion of the deposited film was improved, and the capacitance change rate was reduced.
In addition, there is an advantage that a failure rate of dielectric breakdown, which is a problem when a capacitor is formed, is small.
［特性の測定方法および効果の評価方法］ （１）蒸着膜の付着力 巻回または積層する前の蒸着フィルムを65℃の恒温槽
に15分間浸漬し、蒸着膜の消失度合を観察した。評価基
準は次の通りである。[Method of Measuring Characteristics and Method of Evaluating Effect] (1) Adhesive force of vapor deposited film The vapor deposited film before winding or laminating was immersed in a thermostat at 65 ° C. for 15 minutes, and the degree of disappearance of the vapor deposited film was observed. The evaluation criteria are as follows.
○：蒸着膜の変化がないもの △：蒸着膜が少し変化したもの ×：蒸着膜がほとんど消失してしまったもの （２）静電容量変化率 金属化フィルムコンデンサ（静電容量Ｃ＝1.5μＦ）
をつくり50℃、95％RHで、35Vの直流を印加する。2000
時間経過したときの静電容量の変化量をΔＣとし、静電
容量変化率（ΔC/C）（％）を測定した。：: No change in the deposited film △: A little change in the deposited film ×: A little disappeared in the deposited film (2) Capacitance change rate Metallized film capacitor (Capacitance C = 1.5 μF) )
And apply 35V DC at 50 ° C and 95% RH. 2000
The change amount of the capacitance after the passage of time was defined as ΔC, and the capacitance change rate (ΔC / C) (%) was measured.
（３）コンデンサの不良率 できあがった金属化フィルムコンデンサ100個につい
て、用いたフィルム厚み１μｍ当りDC120Vを瞬時昇圧法
で印加し、絶縁破壊を起こしたコンデンサの個数をその
まま不良率（％）とした。つまり、100個のコンデンサ
のうち、10個が絶縁破壊を生じた場合の不良率は10％で
ある。なお、この不良率の値は、一般に３％以下、好ま
しくは２％以下でないと実用化がむずかしいと考えられ
る。(3) Defect rate of capacitor For 100 metalized film capacitors thus completed, 120 V DC was applied by an instantaneous step-up method per 1 μm of the film thickness used, and the number of capacitors that caused dielectric breakdown was directly determined as the defect rate (%). In other words, the failure rate when 10 out of 100 capacitors have dielectric breakdown is 10%. In addition, it is considered that practical use is difficult unless the value of the defective rate is generally 3% or less, preferably 2% or less.
（４）融点 試料10mgをDSCにセットし、20℃／分の昇温速度で昇
温していき、融解にともなう吸熱ピークの頂上部に相当
する温度を融点とした。(4) Melting point A 10 mg sample was set in DSC, and the temperature was raised at a rate of 20 ° C./min. The temperature corresponding to the top of the endothermic peak accompanying melting was defined as the melting point.
（５）平均表面粗さ JIS−Ｂ−0601に規定された方法にしたがって、触針
式表面粗さ計を用いて測定した。なお、カットオフ0.25
mm、測定長4mmとする。(5) Average surface roughness Measured using a stylus type surface roughness meter according to the method specified in JIS-B-0601. In addition, the cutoff 0.25
mm, measurement length 4 mm.
（６）表面抵抗値 東洋メタライジング（株）製OHM−METERを用いて測定
した。(6) Surface resistance value It was measured using OHM-METER manufactured by Toyo Metallizing Co., Ltd.
［実施例］ 以下、実施例に基づいて本発明をより具体的に説明す
る。もっとも、本発明は下記実施例に限定されるもので
はない。EXAMPLES Hereinafter, the present invention will be described more specifically based on examples. However, the present invention is not limited to the following examples.
実施例１ PETのペレット（融点260℃、平均粒径0.3μｍの乾式
シリカ0.1重量％を含有）、及び酸成分としてテレフタ
ル酸85モル％、イソフタル酸15モル％、ジオール成分と
してエチレングリコール100％で共重合したPEI（融点21
5℃で平均粒径0.2μｍの乾式シリカ0.10％を含有）のペ
レットを各々別の押出機に供給して、290℃で溶融押出
しし、各々の溶融体をＴ型口金の中で合流させて、PET/
PEIの２層からなるシートをつくった。このシートを85
℃で長手方向に3.2倍、95℃で幅方向に3.3倍延伸して20
0℃で５秒間熱処理し、PET層1.6μｍ、PEI層0.4μｍの
積層フィルムを得た。PEI層の平均表面粗さは0.05μｍ
であった。この積層フィルムのPEI層表面にアルミニウ
ムを表面抵抗値で２Ω／□の厚さに蒸着した。この蒸着
フィルムを１ペア巻回し、熱プレス、メタリコン、リー
ド線付、電圧処理、外装して金属化フィルムコンデンサ
にした。この金属化フィルムコンデンサの評価結果を第
１表に示すが、蒸着膜の付着力、静電容量変化率、コン
デンサの不良率は良好な結果を示した。Example 1 PET pellets (containing 0.1% by weight of dry silica having a melting point of 260 ° C. and an average particle size of 0.3 μm), 85% by mole of terephthalic acid, 15% by mole of isophthalic acid, and 100% by weight of ethylene glycol as a diol component Copolymerized PEI (melting point 21
The pellets (containing 0.10% of dry silica having an average particle size of 0.2 μm at 5 ° C.) were supplied to separate extruders, respectively, melt-extruded at 290 ° C., and the respective melts were combined in a T-type die. , PET /
A two-layer sheet of PEI was made. 85 this sheet
Stretch 3.2 times in the longitudinal direction at ℃, and 3.3 times in the width direction at 95 ° C to 20
Heat treatment was performed at 0 ° C. for 5 seconds to obtain a laminated film having a PET layer of 1.6 μm and a PEI layer of 0.4 μm. Average surface roughness of PEI layer is 0.05μm
Met. Aluminum was deposited on the surface of the PEI layer of this laminated film to a thickness of 2 Ω / □ in surface resistance. One pair of this vapor-deposited film was wound, hot-pressed, metallikon, with lead wires, voltage-treated, and packaged to form a metallized film capacitor. Table 1 shows the evaluation results of the metallized film capacitors. The results showed that the adhesion of the deposited film, the capacitance change rate, and the defective rate of the capacitors were good.
比較例１ アルミニウムの表面抵抗値を5.5Ω／□にすることを
除き、実施例１と同様の製造条件で金属化フィルムコン
デンサを製造した。Comparative Example 1 A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1 except that the surface resistance of aluminum was 5.5Ω / □.
蒸着膜の付着力、静電容量変化率、コンデンサの不良
率を第１表に示した。第１表から明らかなように、蒸着
膜付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion of the deposited film, the rate of change in capacitance, and the rate of defective capacitors. As is clear from Table 1, the adhesion of the deposited film and the rate of change of the capacitance are poor.
比較例２ イソフタル酸６モル％で共重合したPEI（融点247℃）
を用いることを除き、実施例１と同様の製造条件により
金属化フィルムコンデンサを製造した。Comparative Example 2 PEI copolymerized with 6 mol% of isophthalic acid (melting point: 247 ° C.)
A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1, except that
蒸着膜の付着力、静電容量変化率、コンデンサの不良
率を第１表に示した。第１表から明らかなように、蒸着
膜付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion of the deposited film, the rate of change in capacitance, and the rate of defective capacitors. As is clear from Table 1, the adhesion of the deposited film and the rate of change of the capacitance are poor.
比較例３ イソフタル酸30モル％で共重合したPEI（融点185℃）
を用いることを除き、実施例１と同様の製造条件により
金属化フィルムコンデンサを製造した。Comparative Example 3 PEI copolymerized with 30% by mole of isophthalic acid (melting point: 185 ° C)
A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1, except that
蒸着膜の付着力、静電容量変化率、コンデンサの不良
率を第１表に示した。第１表から明らかなように、蒸着
膜付着力、静電容量変化率は優れているが、コンデンサ
不良率が異常に高くなり使用に耐えない。Table 1 shows the adhesion of the deposited film, the rate of change in capacitance, and the rate of defective capacitors. As is evident from Table 1, the adhesion of the deposited film and the rate of change in capacitance are excellent, but the defective rate of the capacitor becomes abnormally high, and it cannot be used.
比較例４ 実施例１のPETペレットのみを280℃で溶融押出しし、
単層シートをつくった。このシートを実施例１と同様に
処理して３μｍのフィルムを得て、金属化フィルムコン
デンサを製造した。Comparative Example 4 Only the PET pellets of Example 1 were melt extruded at 280 ° C.
I made a single layer sheet. This sheet was treated in the same manner as in Example 1 to obtain a 3 μm film, and a metallized film capacitor was manufactured.
蒸着膜の付着力、静電容量変化率、コンデンサの不良
率を第１表に示した。第１表から明らかなように、蒸着
膜付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion of the deposited film, the rate of change in capacitance, and the rate of defective capacitors. As is clear from Table 1, the adhesion of the deposited film and the rate of change of the capacitance are poor.
Claims (2)
ィルムの少なくとも片面に、エチレンイソフタレート単
位を10〜25モル％の範囲で共重合したエチレンテレフタ
レート・エチレンイソフタレート共重合体からなる層
（PEI層）を設けた積層フィルムを主たる誘電体とし、
該PEI層上に表面抵抗値が0.5〜５Ω／□の金属膜層を電
極として設けてなることを特徴とする金属化フィルムコ
ンデンサ。1. A layer (PEI layer) comprising an ethylene terephthalate / ethylene isophthalate copolymer obtained by copolymerizing ethylene isophthalate units in a range of 10 to 25 mol% on at least one surface of a biaxially oriented film of polyethylene terephthalate. The laminated film provided as the main dielectric,
A metallized film capacitor, comprising a metal film layer having a surface resistance of 0.5 to 5 Ω / □ as an electrode on the PEI layer.
ことを特徴とする請求項（１）に記載の金属化フィルム
コンデンサ。2. The metallized film capacitor according to claim 1, wherein said metal film layer contains aluminum as a main component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2550489A JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2550489A JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02205006A JPH02205006A (en) | 1990-08-14 |
| JP2653153B2 true JP2653153B2 (en) | 1997-09-10 |
Family
ID=12167898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2550489A Expired - Lifetime JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2653153B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152159A (en) * | 1991-11-29 | 1993-06-18 | Diafoil Co Ltd | Metallized polyester film capacitor |
| US6426861B1 (en) * | 1999-06-22 | 2002-07-30 | Lithium Power Technologies, Inc. | High energy density metallized film capacitors and methods of manufacture thereof |
-
1989
- 1989-02-02 JP JP2550489A patent/JP2653153B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02205006A (en) | 1990-08-14 |
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