JP2629299B2 - Male connector - Google Patents

Male connector

Info

Publication number
JP2629299B2
JP2629299B2 JP63229512A JP22951288A JP2629299B2 JP 2629299 B2 JP2629299 B2 JP 2629299B2 JP 63229512 A JP63229512 A JP 63229512A JP 22951288 A JP22951288 A JP 22951288A JP 2629299 B2 JP2629299 B2 JP 2629299B2
Authority
JP
Japan
Prior art keywords
contact
male connector
connector
base
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63229512A
Other languages
Japanese (ja)
Other versions
JPH0278171A (en
Inventor
和之 二木
弘道 小山
学 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63229512A priority Critical patent/JP2629299B2/en
Publication of JPH0278171A publication Critical patent/JPH0278171A/en
Application granted granted Critical
Publication of JP2629299B2 publication Critical patent/JP2629299B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035Plated dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/10Sockets for co-operation with pins or blades
    • H01R13/11Resilient sockets
    • H01R13/112Resilient sockets forked sockets having two legs

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

【発明の詳細な説明】 〔概 要〕 高密度のコネクタに係り、特にコンタクトの配列ピッ
チが小さくかつ低コストで製造が可能な表面実装用の雄
側のコネクタに関し、 絶縁基体上に導電性樹脂のコンタクト領域をダブルモ
ールド成形することにより部品点数を削減し、かつ高密
度・高精度なコンタクト配列を有する表面実装用の雄コ
ネクタを提供することを目的とし、 めっき不能樹脂の成形品よりなる、プリント板に表面
実装される基部及び該基部から上側へ突出して相手側の
雌コネクタに嵌入される挿入部からなる断面が略逆T字
形の絶縁基体と、電気めっき可能樹脂が該絶縁基体の外
周を取り巻くように所定ピッチでダブルモールドされて
なる複数の帯状コンタクト領域とを有し、コンタクト領
域の表面は電気めっきにより金属が被着されている構成
とする。
DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a high-density connector, and more particularly to a male connector for surface mounting which has a small contact pitch and can be manufactured at low cost. The purpose of the present invention is to provide a male connector for surface mounting that reduces the number of parts by double-molding the contact area of the contact area and has a high-density and high-precision contact arrangement. An insulating base having a substantially inverted T-shape in cross section, comprising a base mounted on the surface of the printed board and an insertion portion projecting upward from the base and fitted into the female connector of the mating side; And a plurality of strip-shaped contact areas formed by double molding at a predetermined pitch so as to surround the contact area, and the surface of the contact area is coated with metal by electroplating. And Configurations.

〔産業上の利用分野〕[Industrial applications]

本発明は高密度のコネクタに係り、特にコンタクトの
配列ピッチが小さくかつ低コストで製造が可能な表面実
装用の雄側のコネクタに関する。
The present invention relates to a high-density connector, and more particularly to a male connector for surface mounting that has a small arrangement pitch of contacts and can be manufactured at low cost.

電子装置の高密度化に伴い、プリント板に搭載するコ
ネクタの端子数が増大し高密度化しつつあり、このため
搭載するプリント板に端子挿入用のスルーホールを設け
ずプリント板表面の接続用パッドにコネクタの端子部を
直接半田付けする表面実装が多用されるようになった。
このようなコネクタを安価に提供することが要求されて
いる。
With the increase in the density of electronic devices, the number of terminals of connectors mounted on the printed board has increased and the density has been increasing. For this reason, the printed board to be mounted has no through holes for inserting terminals, and connection pads on the surface of the printed board In recent years, surface mounting for directly soldering terminal portions of connectors has been widely used.
It is required to provide such a connector at low cost.

〔従来の技術〕[Conventional technology]

従来の一般的な高密度表面実装用の雄側のコネクタ
を、第4図に示す。
FIG. 4 shows a conventional general male connector for high-density surface mounting.

図において、雄側のコネクタ(プラグコネクタ)1
は、絶縁性樹脂のモールド成形品からなる絶縁基体11
と、複数のコンタクト12からなり、プリント板4の半田
付けパッド41にリフロー半田付けされる。
In the figure, a male connector (plug connector) 1
Is an insulating substrate 11 made of an insulating resin molded product.
And a plurality of contacts 12, which are reflow soldered to the soldering pads 41 of the printed board 4.

絶縁基体11には複数のコンタクト圧入孔が所定のピッ
チで形成されており、銅合金などの金属材料からプレス
加工や連続めっき加工を経て別個に製造された接触部12
aや表面実装用の端子部12cを有するコンタクト12が圧入
植設されている。
A plurality of contact press-fit holes are formed in the insulating base 11 at a predetermined pitch, and the contact portions 12 are separately manufactured from a metal material such as a copper alloy through press working or continuous plating.
a and a contact 12 having a terminal portion 12c for surface mounting are press-fitted and implanted.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

電子装置の高密度化により、コンタクトの配列ピッチ
は従来の標準の2.54mmから、たとえばその半分の1.27mm
(ハーフピッチコネクタ)が標準になりつつあるが、こ
のようにコンタクトピッチが小さくなると、コンタクト
を圧入固定する従来の雄コネクタでは、絶縁体のコンタ
クト圧入孔間の隔壁が薄くなり、コンタクトの植設時に
圧入割れが生じるという問題があった。
Due to the high density of electronic devices, the arrangement pitch of contacts has been reduced from the conventional standard of 2.54 mm to, for example, half that of 1.27 mm.
(Half-pitch connector) is becoming standard. However, when the contact pitch is reduced in this way, in the conventional male connector for press-fitting and fixing the contact, the partition wall between the contact press-fitting holes of the insulator becomes thin, and the contact is planted. There was a problem that press-fit cracking sometimes occurred.

また構成部材として、モールド成形工程により作成さ
れる絶縁基体と、プレス加工や連続めっき加工で作成さ
れる複数のコンタクトとを必要するので部品点数が多
く、コンタクトを絶縁体に植設するための組立工程を必
要とするのでコストアップになるという問題点もあっ
た。
In addition, as a constituent member, an insulating base formed by a molding process and a plurality of contacts formed by press working or continuous plating are required, so that the number of parts is large, and assembly for implanting the contacts on the insulator is required. There is also a problem that the cost is increased because a process is required.

さらに、プリント板への実装の際のリフロー半田付け
が良好になされるためには複数のコンタクトの端子部が
同一面内に高精度で配列されていることが望ましいが、
個別のコンタクトを植設するので精度が悪いという欠点
もあった。
Furthermore, it is desirable that the terminal portions of a plurality of contacts are arranged with high accuracy in the same plane in order to perform reflow soldering at the time of mounting on a printed board well.
There is also a disadvantage that the accuracy is poor because individual contacts are planted.

本発明は上記問題点に鑑み創出されたもので、絶縁基
体上に導電性樹脂によるコンタクトをダブルモールド成
形することにより部品点数を削減し、かつ高密度・高精
度なコンタクト配列を有する表面実装用の雄コネクタを
提供することを目的とする。
The present invention has been made in view of the above problems, and is intended for a surface mount having a high-density and high-precision contact arrangement by double-molding a conductive resin contact on an insulating substrate to reduce the number of components. The purpose of the present invention is to provide a male connector.

〔課題を解決するための手段〕[Means for solving the problem]

上記の目的を達成するために本発明は、第1図に例示
したように、めっき不能樹脂の成形品よりなる、プリン
ト板に表面実装される基部21及び基部21から上側へ突出
して相手側の雌コネクタに嵌入される挿入部22からなる
断面が略逆T字形の絶縁基体24と、電気めっき可能樹脂
が絶縁基体24の外周を取り巻くように所定ピッチでダブ
ルモールドされてなる複数の帯状コンタクト領域23とを
有する。
In order to achieve the above object, as shown in FIG. 1, the present invention provides a base 21 made of a molded product of a non-platable resin, which is surface-mounted on a printed board, and which projects upward from the base 21 to form a mating part. An insulating base 24 having a substantially inverted T-shaped cross section including an insertion portion 22 to be fitted into the female connector, and a plurality of strip-shaped contact areas formed by double-molding an electroplatable resin at a predetermined pitch so as to surround the outer circumference of the insulating base 24. 23.

そして、コンタクト領域23の表面は、電気めっきによ
り金属が被着されている構成とする。
The surface of the contact region 23 has a structure in which a metal is deposited by electroplating.

〔作用〕[Action]

コンタクト領域をめっき可能樹脂により絶縁基体上に
ダブルモールド成形により一体で形成するので、コンタ
クトをプレス加工で絶縁基体と別個に製造したり、コン
タクトを絶縁基体に植設する工程を必要とせず、しかも
高精度,高密度でコンタクトを配列することができる。
このためコネクタの基本構成部材がモールド成形品一個
で済み、部材費の低減や組立工数を必要とせず製造コス
トを大幅に削減できる。またコンタクトの圧入固定を必
要としないのでコンタクト配列の高密度化が達成でき
る。
Since the contact area is formed integrally with the insulating base by plating with a resin that can be plated, there is no need to manufacture the contacts separately from the insulating base by pressing, or to implant the contacts in the insulating base, and Contacts can be arranged with high precision and high density.
For this reason, the basic component of the connector is only one molded product, and the manufacturing cost can be significantly reduced without reducing the cost of the members or the number of assembly steps. In addition, since it is not necessary to press-fit the contacts, it is possible to achieve a high-density contact arrangement.

〔実施例〕〔Example〕

以下添付図により本発明の実施例を説明する。 An embodiment of the present invention will be described below with reference to the accompanying drawings.

第1図は本発明の雄コネクタの外観斜視図、第2図は
コンタクト領域の断面図、第3図は製造方法を示す図で
ある。
FIG. 1 is an external perspective view of a male connector of the present invention, FIG. 2 is a sectional view of a contact region, and FIG. 3 is a view showing a manufacturing method.

第1図において、本発明の雄コネクタ2は下側に断面
が四角の基部21と、該基部21上に突出する挿入部22とを
有する略逆T字形断面を有する棒状のモールド一体成形
品で、基部21の下面21aまたは側面21bはプリント板のパ
ッドにリフロー半田付けされる面となり、また挿入部21
は相手側の雌コネクタに嵌入されるプラグ部分となる。
In FIG. 1, the male connector 2 of the present invention is a rod-shaped molded integral molded product having a substantially inverted T-shaped cross section having a base 21 having a square cross section on the lower side and an insertion portion 22 protruding above the base 21. The lower surface 21a or the side surface 21b of the base 21 is a surface to be reflow soldered to the pad of the printed board, and the insertion portion 21
Is a plug portion to be fitted into the mating female connector.

そして棒状体の表面には、後述するように溝部24aに
導電性樹脂を充填し金属めっきを施した複数の帯状のコ
ンタクト領域23が、外周を取り巻いて、例えば1.27mmの
配列ピッチで形成されている。
Then, on the surface of the rod-shaped body, a plurality of strip-shaped contact regions 23 in which the groove 24a is filled with a conductive resin and plated with metal, as described later, are formed at an arrangement pitch of, for example, 1.27 mm around the outer periphery. I have.

第2図はコンタクト領域の層構成を示すために第1図
におけるA−A断面を相手側の雌コネクタと共に示した
ものである。
FIG. 2 shows an AA cross section in FIG. 1 together with a mating female connector to show the layer configuration of the contact region.

図において3は、本発明の雄コネクタ2に挿着される
相手側の雌コネクタで、U字形ばねの接点部31aを有す
る複数の雌コンタクト31が、前記雄コネクタのコンタク
ト領域の配列ピッチに対応して絶縁体32内に並設されて
いる。
In the figure, reference numeral 3 denotes a mating female connector to be inserted into the male connector 2 of the present invention. A plurality of female contacts 31 having a U-shaped spring contact portion 31a correspond to the arrangement pitch of the contact areas of the male connector. And are juxtaposed in the insulator 32.

そして雄コネクタ2のコンタクト領域は、めっき不能
樹脂による第一成形品よりなる絶縁基体24の周囲にめっ
き可能樹脂ダブルモールドで帯状に被着形成した第二成
形部25よりなり、該第二成形部25の表面は、例えば、Cu
およびNi/Auの3層構造の金属めっき層26が導電材料お
よび接点材料として電位めっきにて所望の厚さに被着形
成されている。
The contact area of the male connector 2 is composed of a second molded part 25 formed in a band shape by plating a resin double mold around an insulating base 24 made of a first molded product made of a non-platable resin. 25 surfaces, for example, Cu
A metal plating layer 26 having a three-layer structure of Ni / Au is formed as a conductive material and a contact material to a desired thickness by potential plating.

なお4は本雄コネクタ2が搭載されるプリント板で、
表面の半田付けパッド41と、平面性の優れた基部21の下
面の金属めっき層26aとがリフロー半田42により良好に
半田付けされる。
Reference numeral 4 denotes a printed board on which the male connector 2 is mounted.
The soldering pad 41 on the front surface and the metal plating layer 26a on the lower surface of the base 21 having excellent flatness are satisfactorily soldered by the reflow solder.

そして第1図のコンタクト領域23以外の部分は絶縁物
の第一成形品が表面に露呈したままになっており、金属
めっき層が存在しないので、コンタクト領域は独立して
複数の導電部となる。
In the portion other than the contact region 23 in FIG. 1, the first molded product of the insulator remains exposed on the surface, and since there is no metal plating layer, the contact region is independently a plurality of conductive portions. .

第3図は製造方法の一例を示す。まず絶縁物である非
めっきグレードのPPS(ポリフェニレンサルファイド)
樹脂の射出成形により図の(a)に示す絶縁基体24を成
形する。(第一成形) 絶縁基体24は嵌合する相手側の雌コネクタに対応する
厚さの挿入部22を有し、コンタクト領域に対応する部分
に、所定の配列ピッチで外周を取り巻く複数の帯状の溝
部24aが形成されている。
FIG. 3 shows an example of the manufacturing method. First, non-plating grade PPS (polyphenylene sulfide), which is an insulator
The insulating base 24 shown in FIG. 1A is formed by injection molding of a resin. (First Molding) The insulating base 24 has an insertion portion 22 having a thickness corresponding to the female connector on the mating side, and a plurality of belt-like portions surrounding the outer periphery at a predetermined arrangement pitch at a portion corresponding to the contact region. A groove 24a is formed.

付いで、第二成形用金型に絶縁基体24を装着して、ダ
ブルモールド成形により前記複数の溝部24aに導電性の
あるめっきグレードのPPS樹脂を射出成形して、図の
(b)に示す如く、コンタクト領域に対応する部分に、
帯状に絶縁基体42を取り巻く複数の第二成形部25を形成
する。
Then, the insulating base 24 is attached to the second molding die, and a conductive plating-grade PPS resin is injection-molded into the plurality of grooves 24a by double molding, as shown in FIG. As shown in the part corresponding to the contact area,
A plurality of second molded portions 25 surrounding the insulating base 42 in a belt shape are formed.

このようにコンタクト領域はダブルモールドで形成さ
れるので、その幅や配列ピッチはモールド金型の精度に
支配されるため、極めて高精度に配置することができる
と共に、第一成形樹脂と第二成形樹脂との境界は溶融接
合されるので接合強度が大きく一体成形品とみなすこと
ができる。
Since the contact area is formed by the double mold as described above, the width and the arrangement pitch are governed by the precision of the mold, so that the contact area can be arranged with extremely high precision and the first molding resin and the second molding resin can be used. Since the boundary with the resin is melt-bonded, the bonding strength is large and it can be regarded as an integrally molded product.

そして、この第二成形は、それぞれの第二成形部24に
ゲート25aが形成される多点ゲート方式の金型により成
形するので、複数のコンタクト領域はゲート25aおよび
ランナ部25bによって電気的に接続された状態の成形品
が得られる。
Since the second molding is performed by a multipoint gate type mold in which the gate 25a is formed in each second molding portion 24, a plurality of contact regions are electrically connected by the gate 25a and the runner portion 25b. Thus, a molded article in a sunk state is obtained.

次に、このランナ部25bをめっき電極として用いて、
導電性のめっき可能樹脂が表面に露呈している第二成形
部25のみに電気めっきを行ってコンタクト領域を形成す
る。ランナ部24aにめっき電圧を印加することにより、
複数のコンタクト領域へのめっき電流の供給が簡単にで
き、CuおよびNi/Auの電気めっきを所定の厚さに容易に
できる。
Next, using this runner part 25b as a plating electrode,
Electroplating is performed only on the second molded portion 25 where the surface of the conductive plating resin is exposed to form a contact region. By applying a plating voltage to the runner portion 24a,
Plating current can be easily supplied to a plurality of contact regions, and Cu and Ni / Au electroplating can be easily performed to a predetermined thickness.

そしてめっき工程後に、ゲート25aを切断することに
より、複数のコンタクト領域を容易に分離することがで
き、互いに絶縁された複数のコンタクトが得られる。
By cutting the gate 25a after the plating step, a plurality of contact regions can be easily separated, and a plurality of contacts insulated from each other can be obtained.

〔発明の効果〕〔The invention's effect〕

以上説明した如く、本発明によれば雄コネクタ部品点
数を一点にすることが可能となり、且つコンタクトを絶
縁体に植設する組立工程が不要になるため、高密度のコ
ネクタを低コストで製造することが可能となる。
As described above, according to the present invention, it is possible to reduce the number of male connector parts to one, and it is not necessary to perform an assembling step of implanting contacts on an insulator, so that a high-density connector can be manufactured at low cost. It becomes possible.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の雄コネクタの外観斜視図、 第2図はコンタクト領域の断面図、 第3図は本発明の雄コネクタの製造方法を示す図、 第4図は従来の表面実装用の雄コネクタを示す図、 である。 図において、 2……雄コネクタ、21……基部、 22……挿入部、23……コンタクト領域、 24……絶縁基体、24a……溝部、 25……第二成形部、26……金属めっき層、 である。 1 is an external perspective view of a male connector of the present invention, FIG. 2 is a cross-sectional view of a contact area, FIG. 3 is a view showing a method of manufacturing a male connector of the present invention, and FIG. FIG. In the drawing, 2 ... male connector, 21 ... base, 22 ... insertion, 23 ... contact area, 24 ... insulating base, 24a ... groove, 25 ... second molded part, 26 ... metal plating Layers.

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭51−142689(JP,A) 特開 昭52−50587(JP,A) 実開 昭61−141787(JP,U) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-51-142689 (JP, A) JP-A-52-50587 (JP, A) Real opening Sho-61-141787 (JP, U)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】金属めっき不能樹脂の成形品よりなる、プ
リント板に表面実装される基部(21)及び該基部(21)
から上側へ突出して相手側の雌コネクタに嵌入される挿
入部(22)からなる断面が略逆T字形の絶縁基体(24)
と、 電気めっき可能樹脂が該絶縁基体(24)の外周を取り巻
くように所定ピッチでダブルモールドされてなる複数の
帯状コンタクト領域(23)とを有し、 該コンタクト領域(23)の表面は、電気めっきにより金
属が被着されていることを特徴とする雄コネクタ。
1. A base (21), which is made of a molded product of a non-metallic resin and is surface-mounted on a printed board, and the base (21).
An insulating base (24) having a substantially inverted T-shaped cross section, comprising an insertion portion (22) projecting upward from the connector and fitted into a mating female connector.
And a plurality of strip-shaped contact regions (23) formed by double-molding an electroplatable resin at a predetermined pitch so as to surround the outer periphery of the insulating base (24). The surface of the contact region (23) A male connector, wherein a metal is applied by electroplating.
JP63229512A 1988-09-13 1988-09-13 Male connector Expired - Fee Related JP2629299B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63229512A JP2629299B2 (en) 1988-09-13 1988-09-13 Male connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63229512A JP2629299B2 (en) 1988-09-13 1988-09-13 Male connector

Publications (2)

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JPH0278171A JPH0278171A (en) 1990-03-19
JP2629299B2 true JP2629299B2 (en) 1997-07-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110932054A (en) * 2019-12-14 2020-03-27 山东光韵智能科技有限公司 Method for manufacturing temperature rise-resistant fretting abrasion electromagnetic conductive contact

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094134A (en) * 1990-06-08 1992-03-10 Roland Dg Corporation Cutting pen
EP0545289B1 (en) * 1991-11-30 1997-03-05 Murata Manufacturing Co., Ltd. Coaxial microstrip line transducer
JPH0652941A (en) * 1992-07-31 1994-02-25 Pfu Ltd Connector
JPH08148240A (en) * 1994-09-20 1996-06-07 Whitaker Corp:The Connector
US5795171A (en) * 1996-07-16 1998-08-18 Litton Systems, Inc. All plastic zero insertion force electrical connector
TWI457307B (en) 2005-12-01 2014-10-21 Mitsuboshi Diamond Ind Co Ltd Scribe method
JP4632978B2 (en) * 2006-03-15 2011-02-16 モレックス インコーポレイテド Waterproof plug and manufacturing method thereof
JP4548442B2 (en) * 2007-04-24 2010-09-22 パナソニック電工株式会社 connector
DE202007006357U1 (en) * 2007-05-03 2007-07-12 Harting Mitronics Ag Plug connection for injection molded circuit board has molded part with holding and plug regions, conducting track(s) extending into plug region, matching contours of molded part to contact yoke-shaped plug contact(s) in plug connector
US8886849B2 (en) 2012-05-11 2014-11-11 Apple Inc. Multi-mode adapter
BR112012030285B1 (en) 2010-05-28 2020-01-21 Apple Inc plug connector and dual-orientation plug connector
CN103081252B (en) 2010-05-28 2016-04-13 苹果公司 D shape connector
US9124048B2 (en) 2010-06-09 2015-09-01 Apple Inc. Flexible TRS connector
CN103081253B (en) * 2010-06-21 2015-10-21 苹果公司 Plug-in connector and socket connector
US8708745B2 (en) * 2011-11-07 2014-04-29 Apple Inc. Dual orientation electronic connector
US9112327B2 (en) 2011-11-30 2015-08-18 Apple Inc. Audio/video connector for an electronic device
US8762605B2 (en) 2011-11-30 2014-06-24 Apple Inc. Adapter for electronic devices
US8478913B2 (en) * 2011-11-30 2013-07-02 Apple Inc. Adapter for electronic devices
US9459670B2 (en) 2012-09-07 2016-10-04 Apple Inc. Adapter for use with a portable electronic device
US9021159B2 (en) 2012-09-07 2015-04-28 Apple Inc. Connector adapter
US9093803B2 (en) 2012-09-07 2015-07-28 Apple Inc. Plug connector
US9160129B2 (en) 2012-09-11 2015-10-13 Apple Inc. Connectors and methods for manufacturing connectors

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2604787A1 (en) * 1975-02-13 1976-08-26 Itt Ind Gmbh Deutsche Connecting element for two circuit boards - has conducting traces on lower surface of first board and conducting traces on top surface of second board
JPS5846836B2 (en) * 1975-10-20 1983-10-19 日本電気株式会社 connector
JPS61141787U (en) * 1985-02-25 1986-09-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110932054A (en) * 2019-12-14 2020-03-27 山东光韵智能科技有限公司 Method for manufacturing temperature rise-resistant fretting abrasion electromagnetic conductive contact

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