JP2627738B2 - Optical card manufacturing method - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method for manufacturing an optical card for performing optical recording.

[Conventional technology]

Optical recording that provides a thin film of low melting point metal such as tellurium or bismuth on a substrate, irradiates a laser beam or the like to cause a change in a part of the thin film, performs recording, and optically reproduces the recorded information. There is a playback method. According to such an optical recording / reproducing method, there is an advantage that the information density to be recorded is significantly higher than that of a conventional magnetic method or an IC method which has been studied recently.

However, since the above-mentioned optical recording / reproducing method uses a laser beam, it requires a high level of technology for controlling the laser beam and is not suitable for mass production. Especially when applied to cards with a large number of issued cards (indicating ID cards such as bank cash cards and credit cards)
Materials and systems that are cheaper and suitable for mass production are desired.

Further, in optically reproducing, adhesion and damage of the recording portion is a problem from the viewpoint of high recording density.

[Problems to be solved by the invention]

Therefore, according to the present invention, when an optical card is carried and used, there is no need to use a laser beam at the time of manufacturing an optical card capable of fully exhibiting a feature having a high recording density without being attached or damaged when used. It is an object of the present invention to provide a method for efficiently manufacturing an optical card while maintaining high accuracy.

[Means for solving the problem]

The method for manufacturing an optical card according to the present invention comprises the steps of: a step of forming a surface hardened layer on one surface of a protective film made of a polycarbonate resin film; and a light reflecting layer and a photoresist on the other surface of the protective film made of a polycarbonate resin film. The steps of recording the optical information pattern on the light reflecting layer by photoetching after laminating each layer of the layers in order are performed in random order, and then, the light reflecting layer on which the obtained optical information pattern is recorded is obtained. A protective film made of a polycarbonate resin film having a surface-hardened layer, a light-reflective layer as an adhesive surface, and an adhesive on a card substrate provided with a pattern of characters and designs on at least the inner surface by a printing method. A method for manufacturing an optical card characterized in that the optical card is used for bonding. A second method for manufacturing a protective film comprises: a step of forming a surface hardened layer on the upper surface of a protective film made of a polycarbonate resin film; A step of providing a pattern of characters and patterns by a printing method, and separately from this, photo-etching after sequentially laminating an optical high-reflection layer and a photoresist layer on a card substrate having an optical low-reflection layer on the surface And the step of recording an optical information pattern on the optically high reflection layer in any order, and then, the surface of the optical information pattern thus obtained is recorded on a card substrate having an optically high reflection layer recorded thereon. A protective film made of a polycarbonate resin film having a cured layer is attached using an adhesive with the protective film side made of the polycarbonate resin film as an adhesive surface. And it is characterized in the manufacturing method "of the optical card, characterized in that cause I.

Hereinafter, the present invention will be described in more detail with reference to the drawings.

Optical Card An example of the structure of the optical card according to the present invention is as shown in FIG. 1. In order from the bottom, a card base 1, an adhesive layer 2, a light reflection layer 4 on which an optical information pattern 3 is recorded, and a light reflection. A protective film 5 for protecting the layer and a hardened surface layer 6 are laminated.

(Card base material) The card base material 1 supports the card on the lower side, and is provided with other recording means as necessary. Card base material 1
May be basically the same as a normal magnetic card. Therefore, a hard polyvinyl chloride resin is used, and a white one for coloring or printing is usually used. The use of selecting the polyvinyl chloride resin is not exceptional, and other synthetic resins may be used, and other materials may be used in the sense of a seed shape. Also, if resistance to bending is required,
Reinforcement using a metal plate, a metal net, a woven fabric or a nonwoven fabric may be performed.

Recording means other than the optical recording means applied to the card substrate 1 include holograms, imprints (embossing),
Photographs, sculptures, signatures, IC chips, bar codes, general printing, etc. These may be used in combination of two or more.
Alternatively, considering compatibility with a magnetic card, a magnetic recording layer may be provided.

(Adhesive Layer) The adhesive layer 2 is for bonding between the card base material 1 and the upper layer. If the light reflecting layer 4 on which the optical information pattern 3 is recorded is smaller in shape than the protective film 5, the protective film 5 and the card substrate 1 may adhere. Therefore, the adhesive of the adhesive layer 2 depends on the material of the card base 1 and the light reflecting layer 4.
The material of the protective film 5 is usually selected in consideration of the material of the protective film 5. The adhesive is specifically an epoxy-based, urethane-based, acrylic-based, or cyanoacrylate-based adhesive.

(Light reflecting layer) The material of the light reflecting layer 4 is Cr, Ti, Fe, Co, Ni, Cu, Ag, A
u, Ge, Al, Mg, Sb, Te, Pb, Pd, Pd, Bi, Sn, Se, I
n, Ga, or Rb, etc., made of an alloy alone or in combination of two or more. Among them, from the viewpoint of light reflectivity and durability, Al, Cr, Ni, Ag, or
Au is the preferred one.

The light reflecting layer 4 made of a metal or alloy thin film
Is 200 の to 10,000Å, more preferably 1,0001,000
Å ～ 5,000Å.

Even if it is not a metal or alloy thin film, a dye or metal particles are dispersed in a resin such as a nitrocellulose resin, a polystyrene resin, or a polyethylene resin, in which a light reflection layer is provided by aggregating a dye such as cyanine. A light-reflective layer can be used as a light-reflective layer, or a material obtained by aggregating dyes or metal particles on a resin surface.

The light information pattern 3 is formed of a set of holes that are recessed in the light reflection layer 4 or penetrate the light reflection layer 4, and the recesses or holes (both are referred to as “pits”) have a circular planar shape. Oval, rectangular, square, etc., the size measured by their diameter or the length of the long side is usually 2-200μm
And the distance between the centers of adjacent pits is usually 5 to 5.
It is about 500 μm.

The optical reflection layer is an optical low reflection layer as shown in FIG.
4a and an optically highly reflective layer 4b thereon. In this case, the adhesive layer 2 is preferably provided between the protective film and the light reflecting layer.

The optically low reflective layer 4a has a lower light reflectance than the optically high reflective layer 4b, and is preferably black. In addition, a material having a rough surface can be used because light has a low reflectance due to irregular reflection of light. Specific optical low reflection layer
4a is formed by printing method or coating method using ink with high optical density, or by vapor-depositing non-reflective chrome,
Alternatively, a method of forming by laminating a colored plastic film can be used. Alternatively, if the surface of the card substrate is optically low-reflective, another optical low-reflection layer may not be provided.

The optically high reflection layer 4b is basically the same as the single-layer light reflection layer 4.

(Protective Film) The protective film 5 directly protects the light reflection layer 4 in a card state. In terms of protecting the light reflecting layer, when the light reflecting layer 4 is smaller than the card base material, the light reflecting layer 4
It is enough if there is a protective film only on the. However, it is desirable that the card surface be flat, and that the portion without the light reflection layer 4 needs to be protected. Therefore, it is desirable that the protective film is the same size as the optical card.

The characteristics required for the protective film 5 are high transparency, smoothness, and no thickness unevenness.

An example of the most preferable protective film is a polycarbonate resin film (refractive index: 1.58), and the thickness in this case is about several μm to 800 μm.

Other examples of preferred protective films include cellulose resins (eg, cellulose triacetate resin), acrylic resins such as polyethylene terephthalate resin and polymethyl methacrylate resin, polysulfone resins such as polyvinyl chloride resin and polyether sulfone resin, and polysulfone resins. There are films such as methylpentene resin.

Other than the above, a vinyl resin / polyimide resin, polyetherimide resin, polyetherketone resin, polyamide resin, or the like can also be used.

Alternatively, any material other than resin can be used as long as it has the required properties, and examples thereof include glass, ceramics, paper, plastic film, woven fabric, and nonwoven fabric. However, a resin film or glass is preferable in that various conditions are satisfied.

On the front surface and the back surface of the protective film 5, or any one surface, a physical treatment such as a corona discharge treatment, a plasma treatment, or an acid is used in order to improve an adhesive strength with another layer laminated on those surfaces. A chemical treatment such as an oxidation treatment or a primer treatment may be performed as necessary.

Further, a printed layer may be provided on the front and / or back surfaces of the protective film, or as long as it does not hinder the reproduction of the lower optical information pattern.

(Surface Hardened Layer) The surface hardened layer 6 is a light reflecting layer 4 which is a recording portion of an optical card
The height of the uppermost surface is increased to prevent contaminants from being scratched when the card is carried or used, and to prevent contaminants from being scratched due to the damage. , To improve reproduction (reading) accuracy.

As the material of the surface hardened layer 6, a substance used in a method known as a surface hardening method is used as long as the properties of the protective film 5 are not deteriorated.

For example, silicone-based, acrylic-based, melamine-based, polyurethane-based, epoxy-based cured resins, Al ₂ O ₃ and SiO ₂
And the like, or a polymer film formed by plasma polymerization may be mentioned as a specific material of the surface hardened layer 6. In general, the cured film is hard to be damaged, so that the wound is not clogged with dirt, and because it is chemically inert, dirt hardly adheres to the surface, and even if it adheres, it is easy to remove.

As described above, the optical card has an optical recording portion on the card base or under the protective film, which is convenient for manufacturing, but the optical recording portion is provided on another base,
Thereafter, the card base material may be sandwiched between protective films, and the upper and lower sides may be laminated via an adhesive.

1. Method of Manufacturing Optical Card The materials used in the method of manufacturing an optical card of the present invention are the same as those described so far unless otherwise specified.

An optical card manufacturing method 1 includes the above-described steps. In summary, the manufacturing method 1 is to provide an optical information pattern by providing a light reflecting layer on the protective film side, and to bond a card base material to the lower side thereof.

(Formation of Hardened Surface Layer) In order to form the hardened surface layer 6 on one side of the protective film 5, a method suitable for the material of the hardened surface layer 6 is used. In order to form a cured resin layer, a normal coating method is used. In order to form a metal oxide layer, a method of forming a metal oxide layer by sputtering or the like, or a method of forming a metal layer by vapor deposition or the like and then oxidizing is used.

(Formation of Light Reflecting Layer) On the surface of the protective film 5 opposite to the surface on which the surface hardened layer 6 is formed, the light reflecting layer 4 as a recording portion is formed. The formation of the metal or alloy light reflection layer 4 is generally performed by sputtering,
A method such as vacuum evaporation, ion plating, or electroplating is used.

In addition, an appropriate printing may be performed on a portion where the light reflection layer 4 is not provided.

(Formation of Photoresist Layer) On the light reflection layer 4, a photoresist layer 7 for photoetching the light reflection layer 4 is formed. When the light reflecting layer 4 is formed on a part of the protective film 5, it is sufficient if the photoresist layer 7 is provided only on the light reflecting layer 4; A photoresist layer may be formed on the entire surface including the photoresist.

As a material for forming a photoresist layer (this material is referred to as a photoresist), a photo-decomposable photosensitive resin containing a diazonium salt or an azide compound, cinnamoyl-based, diazo-based, azide-based, or acryloyl-based photocrosslinking Type photosensitive resin, acrylic acid ester,
A photopolymerizable photosensitive resin such as acrylamide is used.

Commercially available photoresists that can be specifically used include the following.

KPR, KOR, KAR-3, KMER, KTFR, KMR manufactured by Eastman Kodak, way coat (WAYCOAT) manufactured by Hunt Chemical, FS manufactured by Fuji Pharmaceutical Co., Ltd.
R, FPER, FVR-G, FUR, FR, TPR, EP manufactured by Tokyo Ohka Kogyo
PR, OMR, G-90, OSR, OTER, ONNR, Non-cron (NONC
RON), NRR-29 made by Norland, photo nice made by Toray
VR-3000, COMSIST made by Ueno Chemical, CIR-701, CBR-M made by Nippon Synthetic Rubber, etc.

As a positive photoresist, Shipley's Microposit series, Hoechst Japan's AZ-4000,
Hunt Chemical Waycoat HRP, MPR, LSI-19
5, Tokyo Ohka Kogyo OHPR, OFPR, Eastman Kodak KMPR-809, MPR-820, Fuji Pharmaceutical FPPR-70,
Such.

Drift film, Dupont's Liston, Nitto Denko's Neotrok, Dyna Chemical's laminar,
Dainichi Kako's New Seriton, Diazo Seriton, Epicon Slap Film, Hitachi Chemical's Fetec, Fuji Chemical's Fuji Screen Film, etc.

A solution containing egg white, casein, glue, polyvinyl alcohol, or shellac, which is a dichromate photosensitive solution.

The photoresist layer 7 is formed of a photoresist by a known coating method, for example, a pouring method, a wheeler method, a spinner method, an immersion method, a roller coating method, a spray method, an electrostatic spray method, or the like in the case of dry film. The photoresist layer is formed on the light reflecting layer by a thermocompression bonding method, and usually has a thickness of 0.5 to 5.0 μm.

The photoresist layer 7 is usually subjected to heating called prebaking.

(Photoetching) The light reflecting layer 4 on the protective film 5 is replaced with a photoresist layer 7
Is used to record an optical information pattern on the light reflection layer 4. In more detail, the photo-etching process is performed by exposing the optical information pattern and then developing it to form a resist pattern, and then using an etchant to corrode a portion of the light reflecting layer where the photoresist layer 7 is not present to remove the optical information pattern. The pattern is formed on the light reflection layer.

Exposure of the optical information pattern is easily performed by irradiating ultraviolet rays 9 or the like through a pattern 8 such as a photographic film or a metal mask. In addition, the exposure may be performed by a method of irradiating an electron beam through a metal mask, or may be performed by scanning an electron beam in a pattern without using a pattern.

The development is to dissolve and remove a soluble portion formed by exposure with a solvent, and is performed using a predetermined developing solution. By the development, the photoresist layer on the light reflection layer in the portion to be etched is removed in a pattern to form an exposed portion 10.

After development, the light reflecting layer that is not covered with the photoresist layer is corroded using a corrosive solution, and pits are formed on the light reflecting layer.
An optical information pattern consisting of 11 groups is formed.

After the formation of the optical information pattern, the remaining photoresist layer is removed if necessary.

The step of forming a hardened layer on one side of the protective film and the step of laminating a light reflecting layer and a photoresist layer on the other side of the protective film and recording an optical information pattern by photoetching are mutually related. , These two steps may be performed in any order.

(Lamination) A protective film having a light reflection layer on which an optical information pattern is recorded and a surface cured layer is laminated on a card base material using an adhesive.

At the time of bonding, the surface hardened layer of the protective film is used as the upper surface, and the lower surface of the protective film and the card base are bonded. By doing so, the light reflecting layer on the lower surface side of the protective film is located inside the optical card,
Protected without touching directly with hand or writing or reading equipment.

For bonding, apply the adhesive 2 on one or both sides to be bonded, take an open time if necessary, and then use a pressing means 12 such as laminating, flat press or roll press. Pressure is applied while heating according to the conditions described above, and the adhesive is tightly adhered.

In addition, when making an optical card into a predetermined shape and size,
The shape and size of the protective film or the card base material or the size of the protective film or the card base material may be made larger than a predetermined value, and after bonding, punching or cutting may be performed.

Optical Card Manufacturing Method 2 Optical card manufacturing method 2 includes the above-described steps. In more detail, an optical information pattern is formed by providing a light reflection layer on a base material of an optical card. , And a protective film is stuck thereon.

Except for the step of sequentially providing an optically low-reflection layer and an optically high-reflection layer on a card substrate, the individual steps themselves are the same as in the first manufacturing method.

First, a hardened surface layer 6 is formed on the upper surface of the protective film 5.

Separately, a card substrate 1 is prepared, and an optically low reflection layer 4a is provided thereon. Depending on the material of layer 4a, printing method,
A method such as a coating method, vapor deposition, or lamination is used.

Next, an optical high-reflection layer 4b is provided on the optical low-reflection layer 4a. The optically highly reflective layer can be formed in the same manner as in the above-described manufacturing method 1, and is performed by, for example, a method such as sputtering, vacuum deposition, ion plating, or plating.

A photoresist layer 7 is formed on the optically highly reflective layer 4b, and photo-etched to record an optical information pattern on the optically highly reflective layer 4b. The steps of forming a photoresist layer, photoetching, and forming an optical information pattern are the same as in the first manufacturing method.

A protective film 5 having a surface hardened layer 6 and a card base having an optically low reflective layer 4a and an optically high reflective layer 4b (with an optical information pattern recorded) are combined with the optically high reflective layer 4b and the protective film 5. And glue them together with an adhesive. The bonding step itself is the same as in the first manufacturing method. As the adhesive, those described above can be used, but it is preferable to use an adhesive having high transmittance of the reproduction light.

This method is suitable for a method of manufacturing an optical card having a structure as shown in FIG. 7, and provides good adhesion between the layers 4a and 4b.

The lower surface of the protective film may be appropriately printed as long as it does not cover the light reflecting layer.

[Functions and effects of the invention]

Since this optical card has a hardened surface layer on the outermost surface, there is very little dirt and damage when it is carried or used, and since there is a protective film, the light focused for writing and reading is reduced. The beam does not need to be focused on the outermost surface, but only on the light reflection layer surface,
Even if the surface is scratched or stained, writing and reading can be performed if a light beam can be incident from around the wound or stain.

In addition, according to the manufacturing method of the present invention, since it is not necessary to use a laser beam for recording, a sophisticated technique relating to the use of a laser beam is not required.
Developing and etching are excellent in mass productivity, and the light-reflective layer that can be photoetched should have excellent light reflectivity and durability compared to the conventional light-reflective layer that can record laser beams. There are also advantages that can be used.

Example 1 An undercoating agent (manufactured by Shin-Etsu Chemical) primer PC-4) was applied to the surface of a polycarbonate film having a thickness of 400 μm by a gravure method, and then a silicone-based surface curing agent (manufactured by Shin-Etsu Chemical, X- 12-2150 (A) and X-12-2150
(B) (10: 1 mixture) was applied by gravure method, and 100
C. for 30 minutes to form a hardened surface layer.

An undercoating agent (Toughcoat No. 150, manufactured by Dainippon Ink and Chemicals) was applied to the back surface of the polycarbonate film by a gravure method, dried at 100 ° C. for 5 minutes, and then 1 × 10 ⁻ was deposited thereon by a vacuum evaporation method. Aluminum deposition was performed under the condition of ⁵ torr. Further, a photoresist (manufactured by Shipley Co., Ltd., Microgit 1300-27) was applied by gravure to the above aluminum vapor-deposited surface, and heated at 90 ° C. for 25 minutes. The thickness of the aluminum was 0.3 μm, and the thickness of the photoresist was 1.0 μm.

Next, the photoresist coated surface thus formed,
One dot of 15 μm wide and 5 μm wide is arranged at a pitch of 15 μm to form a row, and the array is arranged at a pitch of 20 μm to closely contact the mask surface of a photomask with a pattern formed so that the dots transmit light. Then, exposure was performed from the photomask side for 5 seconds with an ultra-high pressure mercury lamp (3 KW, distance 1 m).

The photomask pattern used was obtained by a photoetching method as follows. First, chromium was formed on a glass plate by a sputtering method to form a thin film having a thickness of 3000 mm. A photoresist (Microposit 1300-27, manufactured by Shipley Co., Ltd.) was applied by a spinner and dried. A -Cd laser was irradiated with a beam diameter of 2 μm. As a result, a row in which dots each having a length of 15 μm and a width of 5 μm were arranged at a pitch of 15 μm was formed in an array having a pitch between rows of 20 μm, further processed with a resist developer (manufactured by Shipley), and heated at 130 ° C. for 25 minutes. Then, etching was performed with a ferric chloride solution to obtain a mask pattern in which the dot portions became light-transmissive.

Next, the photoresist layer on the polycarbonate film subjected to the pattern exposure as described above is immersed in a resist developer (manufactured by Shipley) for 60 seconds and washed with water, and then immersed in an aluminum etchant having the following composition for 90 seconds, and then washed with water. After drying, a pattern film having a pattern on the aluminum thin film was obtained.

Aluminum etchant Phosphoric acid grade 1 (85%) 16 parts by volume Acetic acid grade 1 〃 Nitric acid grade 1 〃 Pure water 1 〃 On the other hand, a card base material was prepared as follows. First, a pattern of characters and patterns is provided on both sides of a white rigid polyvinyl chloride film (150 μm thick) by screen printing, and another transparent rigid polyvinyl chloride film (100 μm thick) is formed.
m) A magnetic recording layer is provided with a width of 6.5 mm on a part of the table on one side of
Lay the back surface and the printed white rigid polyvinyl chloride, sandwich it between two stainless steel plates, and press at 140 ° C with a press.
At 30 ° C. for 30 minutes to obtain a card substrate.

The pattern surface of the pattern film and the card base material prepared as described above were combined with the pattern surface of the pattern film and the printing surface of the white rigid polyvinyl chloride film of the card base material by epoxy resin (10 pairs of Spenox MG150 and Percure HY306 manufactured by Nippon Pernox). 4 mixture) and pressed by a roll or the like. After the press bonding, the substrate was left for 24 hours, punched out by a punching die, and an optical card having no trouble in writing and reading was obtained.

Example 2 A polyethylene terephthalate film kneaded with carbon black having a length of 5 cm and a width of 5 cm and a thickness of 250 μm was used as a base material, and an aluminum layer having a thickness of 0.1 μm was formed thereon by a vacuum evaporation method.

A positive type photoresist (AZ-1350J, manufactured by Shipley Co., Ltd.) was applied on the aluminum layer of the obtained information recording medium by a spinner coating method, and an original having a pattern in which circles having a diameter of 5 μm were arranged vertically and horizontally at intervals of 10 μm was prepared. 1: 1 (actual size)
And developed with a predetermined developing solution to form a resist pattern. Then, a 10% aqueous solution of phosphoric acid (H ₃ PO ₄ ) is etched with an etching solution heated to 60 ° C. The information recording portion was formed by exposing the layer.

 On the other hand, the protective material was produced as follows.

First, a UV-curable surface hardening material (HQ5123U manufactured by Fujikura Kasei) was applied to one surface of a polycarbonate film (500 μm thick) by a roll coating method, and was hardened by UV irradiation to form a hardened surface layer. A pattern of characters and patterns is provided by a screen printing method on a surface except for a portion where an information recording portion is adhered, which is bonded after a back surface of the polycarbonate film, and information is recorded on a printing surface side and the information recording medium. Urethane-based resin (10: 1 mixture of Albon EU4201 and Albon EHZ4201 manufactured by Alps Chemical Industries)
And pressed by a roll press.

After crimping, it was left for 24 axes and a punching die was used to obtain an optical card having no problem in punching writing and reading.

[Brief description of the drawings]

1 and 7 are sectional views showing an optical card, and FIGS.
FIG. 6 is a sectional view showing a method for manufacturing an optical card. DESCRIPTION OF SYMBOLS 1 ... Card base material 2 ... Adhesive layer 3 ... Optical information pattern 4 ... Light reflecting layer 5 ... Protective film 6 ... Surface cured layer

Claims (2)

(57) [Claims] A step of forming a hardened surface layer on one surface of a protective film made of a polycarbonate resin film;
The steps of sequentially laminating each layer of the light reflection layer and the photoresist layer on the other surface of the protective film made of a polycarbonate resin film and then performing photoetching and recording the optical information pattern on the light reflection layer are performed in random order. Thus obtained, a protective film made of a polycarbonate resin film having a light reflective layer and a surface hardened layer on which an optical information pattern is recorded, with the light reflective layer as an adhesive surface, and characters and letters on at least the inner surface. A method for manufacturing an optical card, characterized in that an adhesive pattern is attached on a card substrate provided with a pattern of a design by a printing method. 2. A step of forming a surface hardened layer on an upper surface of a protective film made of a polycarbonate resin film;
A step of providing a pattern of characters and patterns on a surface except for a portion where an information recording portion on the back side of the protective film is in close contact by a printing method, and separately from this, a card substrate having an optically low reflection layer on the surface The steps of laminating an optically high reflection layer and a photoresist layer on top of each other and then performing photoetching to record an optical information pattern on the optically high reflection layer are performed in any order, and then the light thus obtained is obtained. A protective film made of a polycarbonate resin film having a surface cured layer on a card substrate having an optically high reflection layer on which an information pattern is recorded, using a protective film made of a polycarbonate resin film as an adhesive surface with an adhesive. A method for manufacturing an optical card, comprising laminating.