JP2548239Y2 - Automotive audio equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (A) Field of Industrial Application The present invention relates to an in-vehicle audio device such as a car stereo.

(B) Conventional technology Conventionally, in an electric device using a semiconductor element requiring heat radiation such as a power transistor, for example, Japanese Utility Model Publication No.
A plurality of heat radiation fins are provided on one side of the case as disclosed in -55839.

By the way, in recent years, the output of the in-vehicle audio device has been increased, and such a case is dealt with by increasing the size of the fin.

(C) Problems to be Solved by the Invention However, the above-described configuration has a drawback that the on-vehicle audio device is large in size, despite the limited installation space due to the space inside the vehicle. Further, radiant heat from the radiating fins into the case becomes a problem with the increase in output, but the above configuration cannot avoid the effect.

(D) Means for Solving the Problems The vehicle-mounted audio device of the present invention includes a case, a semiconductor element disposed outside the case, and a heat radiation space between the semiconductor element and the semiconductor element. First, second to form
The heat radiating plate includes a heat radiating plate and a heat insulator interposed between the side wall of the case and the second heat radiating plate.

(E) Function Since the present invention is configured as described above, the heat radiation of the semiconductor element can be efficiently performed by the first and second heat radiating plates, and the heat radiating space between the first and second heat radiating plates. Due to the natural convection inside, the heat dissipation effect is further enhanced. Further, the heat radiation can reduce the radiant heat into the case.

(F) Embodiment An embodiment of the present invention will be described with reference to the drawings. 1 to 3, reference numeral (1) denotes a metal case for housing electronic components, and three openings (2), (2), (2) and a connector (3) are provided on the rear surface. Further, an engaging piece (5) having a recess (4) is provided on the rear wall of the case (1).
(5) is provided. (6) is a printed circuit board disposed on the inner bottom surface of the case (1), and the openings (2) and (2)
(7) and (7) projecting outwardly through the projection. (8) and (8) are power ICs connected to the protruding portions (7) and (7) of the printed circuit board (6), and are provided with a predetermined space between the case and the outer surface of the rear wall of the case (1). .
(9) is a heat insulating plate fixed to the inner surface of the rear wall of the case (1) so as to close the openings (2), (2) and (2) of the case (1). (10) is a first radiator plate made of aluminum material, the outer surface of the rear wall of the case (1) and the power IC (8).
It is interposed between (8) via a heat insulating plate (11). The first radiator plate (10) is provided with the protrusions (7) (7) of the substrate (6).
Notches (12) and (12) for the escape and engaging portions (13) engaging with the recesses (4) of the engaging pieces (5) and (5) of the case (1).
(13) is provided on the rear wall of the case (1) in a state as shown in FIG. The heat insulating plate (11) is previously attached to the first heat radiating plate (10).
The thickness when the first heat sink (10) is combined with the first heat sink (10) should be substantially equal to or slightly larger than the distance between the outer surface of the rear wall of the case (1) and the power IC (8) (8). I have to. (1
4) is disposed behind the first heat sink (10), and holds the power ICs (8) and (8) together with the first heat sink (10);
A second radiating plate that forms a radiating space (S) between the first radiating plate (10) and a fixing base (15) ( 15), and a plurality of radiation fins (16) (16)... On the rear surface.

Thus, assembling in the above configuration first involves power
The substrate (6) to which electronic components such as ICs (8) and (8) are connected is fixed to the case (1). At this time, the power IC (8) (8)
Project outward through the openings (2) and (2) of the case (1). Then, the heat insulating plate (9) is attached to the inner surface of the outer wall of the case (1) with a double-sided tape or the like. Next, the first radiator plate (10) to which the heat insulating plate (11) is attached with double-sided tape or the like
Is interposed between the outer surface of the outer wall of the case (1) and the power ICs (8) and (8), and in this state, the fixing bases (15) and (15) of the second heat sink (14) are moved to the first position. The second heat sink (14) is screwed to the first heat sink (10) and the outer wall of the case (1). As a result, the power ICs (8) and (8) are formed by the second heat sink (14) and the first heat sink (10).
, And the heat radiating plate (11), the first radiating plate (10) and the power by the second heat radiating plate (14) and the outer wall of the case (1).
IC (8) and (8) will be sandwiched.

Thus, in the above configuration, the heat radiation space (S) allows the rear surface of the first heat radiation plate (10) and both surfaces of the second heat radiation plate (14) to be used as heat radiation plates, thereby efficiently dissipating heat. Also, due to natural convection in the heat radiation space (S), the power IC (8)
(8) The heat radiation effect can be further enhanced. And
By the heat insulating plates (9) and (11), radiant heat into the case (1) can be reduced. Furthermore, power IC (8)
Replacement and inspection of (8) are performed with the protrusion (7) of the substrate (6).
(7) Since the power ICs (8) and (8) protrude outside the case (1), the second heat sink (14) can be removed without disassembling the case (1) and removing the substrate (6). Easy to remove by removing.

The heat radiating space (S) between the first heat radiating plate (10) and the second heat radiating plate (14) is open on both upper and lower surfaces, and the pattern of the protrusions (7) (7) of the substrate (6) Is exposed, so that the pattern of the projections (7) and (7) is preferably covered with an insulating plate.

(G) Effect of the Invention Since the present invention is configured as described above, the heat radiation of the semiconductor element can be efficiently performed by the first and second heat radiating plates, and between the first and second heat radiating plates. The heat radiation effect can be further enhanced by natural convection in the heat radiation space, and the size of the device can be prevented from increasing due to the increase in output of the device. Further, the heat radiation can reduce the radiant heat into the case. Furthermore, there is an advantage that the semiconductor element can be replaced or inspected simply by removing the second heat sink.

[Brief description of the drawings]

FIG. 1 is a perspective view of a main part of the in-vehicle audio device of the present invention, FIG. 2 is a side sectional view of the main part, FIG. 3 is an exploded view of the main part, and FIG. It is a principal part perspective view when a heat sink is removed. (1) ... case, (8) ... power IC, (10) ... first heat sink, (11) ... heat insulating plate, (14) ... second heat sink.

Claims (1)

(57) [Scope of request for utility model registration] 1. A case, a semiconductor element disposed outside the case, first and second heat radiating plates for sandwiching the semiconductor element and forming a heat radiation space between each of the semiconductor element, An in-vehicle audio device comprising a heat insulator interposed between a side wall and the first heat sink.