JP2523606Y2 - Chip type capacitors - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to an improvement in a capacitor, and particularly relates to a chip type capacitor suitable for surface mounting on a printed circuit board.

[Prior art] Conventional chip-type capacitors have been subjected to resin molding of a capacitor element, and terminals for external connection led out from a resin end face are bent along the resin end face to face wiring on a printed circuit board. .

Alternatively, for example, as in the invention described in Japanese Utility Model Publication No. 59-3557, a capacitor in which a conventional capacitor is housed in an exterior frame and terminals are arranged on the same plane as the bottom surface of the exterior frame has been proposed. Such a conventional chip-type capacitor enables surface mounting without changing the structure of a normal capacitor.

[Problems to be solved by the invention]

In a normal soldering process, after soldering is performed by a reflow method or the like, an appropriateness of connection between a terminal and a wiring of a printed circuit board is inspected.

However, in the conventional chip type capacitor, as shown in FIG. 2, the contact portion between the terminal 3 and the wiring 6 of the printed board is extremely small, and most of the connection portion is formed by the corner of the outer frame 5. Even if interrupted and soldered,
It was difficult to visually check the soldering state. In particular, in the recent high-density mounting, the visibility is also obstructed by other adjacent electronic components, and the work of checking the state of soldering, that is, the appropriateness of the connection is complicated.

In addition, due to the demand for miniaturization of electronic parts in general, the chip type capacitor is also required to have a smaller volume. However, when the chip type capacitor is miniaturized, the size of the terminal is also reduced accordingly, and the contact area with the wiring of the printed circuit board tends to be reduced. Therefore, there is a possibility that sufficient soldering may not be performed, and it is more difficult to confirm the soldering.

An object of the present invention is to provide a chip-type capacitor which improves a soldering state and makes it easy to visually observe the state.

[Means for solving the problem]

This invention relates to a chip-type capacitor in which a capacitor is housed in an exterior frame having a housing space adapted to the external shape of the capacitor, and in a side portion in contact with a side surface from which a terminal for external connection is led, an angle facing a printed circuit board. An arc-shaped or inclined cutout portion is provided in all or a part of the portion, and the terminal is bent along a bottom surface from an opening side surface of an exterior frame excluding an end surface of the cutout portion.

[Action]

As shown in FIG. 1, the notch 4 provided at the corner of the chip type capacitor allows the
It becomes easy to visually observe the vicinity of the contact portion between the wiring and the printed circuit board 6.

The terminal 3 is formed substantially parallel to the opening side surface of the exterior frame 2, is bent at a right angle on the same plane as the bottom surface of the exterior frame 2, and makes contact with the bottom surface of the exterior frame 2. That is, the terminal 3 is bent along the bottom surface from the opening side surface excluding the end surface of the cutout portion 4 among the end surfaces of the exterior frame 2. Therefore, the terminal 3 is separated from the outer frame 2 at a portion where the terminal 3 comes into contact with the wiring 6 of the printed circuit board, so that in the soldering, the molten solder can easily flow around the outer periphery of the terminal 3.

〔Example〕

 Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a first embodiment according to the present invention, and FIGS. 3 and 4 are front views showing the embodiment.

In the chip-type capacitor according to the first embodiment, a capacitor 1 having a normal structure is housed in an exterior frame 2 having a cylindrical storage space inside, and a terminal 3 is placed substantially flush with the bottom surface of the exterior frame 2. It consists of an arrangement. The outer frame 3 for housing the capacitor 1 is desirably a high heat-resistant resin such as a heat-resistant resin such as phenol, epoxy, or polyimide.
Alternatively, a ceramic material or the like is appropriate.

An inclined cutout 4 is provided at a corner of the side of the exterior frame 2 from which the terminal 3 is led out and in contact with the wiring 6 of the printed circuit board. In this embodiment, the notch 4 is formed over the entire corner.

As shown in FIG. 3 (a), the terminal 3 led out from the opening side surface of the exterior frame 2 is bent substantially in parallel along the opening side surface to reach the same plane as the bottom surface of the exterior frame 2, Furthermore, it is bent at a right angle and is in contact with the bottom surface of the exterior frame 2.

In the embodiment shown in FIG. 3 (a), the contact surface between the tip of the terminal 3 and the wiring 6 of the printed circuit board is almost the same as before, but a part of the tip of the terminal 3 is Because it is not in contact with and is away from the outer frame 2,
A solder layer is formed so as to surround the tip of the terminal 3;
The contact situation becomes better.

FIG. 4 (a) is a front view showing a second embodiment of the present invention. Of the side portions of the exterior frame 2 that are in contact with the side surfaces from which the terminals 3 are led out, the wiring portions 6 of the printed circuit board are connected. An arc-shaped notch 7 is provided at the facing corner. In this embodiment, the notch 7 is formed over the entire corner.

Then, as in the first embodiment, the terminal 3 led out of the capacitor is bent substantially parallel to the opening end face, and is bent at a right angle on the same plane as the bottom surface of the exterior frame 2. Therefore, the terminal 3 is separated from the exterior frame 2 at the arc-shaped end face forming the cutout 7.

In this embodiment, the terminal has been described as an example in which the terminal is led out from one end surface of the outer frame. However, the present invention can be applied to a chip type capacitor in which the terminal is led out from the opposite direction of the outer frame.

[Effect of the invention]

As described above, the present invention is directed to a chip type capacitor in which a capacitor is housed in an exterior frame having a housing space adapted to the external shape of the capacitor, of a side portion in contact with a side surface from which a terminal for external connection is led out, facing a printed circuit board. Since all or part of the corners are provided with arc-shaped or inclined notches, and the terminals are bent along the bottom surface from the opening side surfaces of the exterior frame excluding the end surfaces of the notch portions, The contact surface between the terminal and the wiring portion of the printed circuit board can be visually observed without being interrupted by the corners of the chip-type capacitor body or other electronic components.
Therefore, the inspection process after the soldering process becomes easy.

In the case of mounting and soldering on a printed circuit board, the molten solder easily goes around the outer periphery of the terminal, and the contact area between the terminal and the solder is increased, so that a better connection state than before can be obtained.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of the present invention, and FIG.
FIG. 1 is a perspective view showing a conventional chip type capacitor, and FIGS. 3 and 4 are front views showing an embodiment of the present invention. 1 ... Capacitor, 2,5 ... Outer frame, 3 ... Terminal, 4,7 ...
... Notch, 6 ... Wiring.

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-62-86812 (JP, A) JP-A-60-83232 (JP, U) JP-A 62-114401 (JP, U) JP-A 60-83401 181022 (JP, U) Japanese Utility Model Showa 57-97935 (JP, U)

Claims (1)

(57) [Scope of request for utility model registration] In a chip type capacitor in which a capacitor is housed in an exterior frame having a housing space adapted to the external shape of the capacitor, of a side portion which is in contact with a side surface from which a terminal for external connection is led out, faces a printed circuit board. A chip type wherein an arc-shaped or inclined notch is provided in all or a part of the corner, and the terminal is bent along a bottom surface from an opening side surface of an exterior frame excluding an end surface of the notch portion. Capacitors.