JP2022051613A - Elastic wave device - Google Patents

Abstract

To provide an elastic wave device that has a small loss while securing isolation between bands.SOLUTION: An elastic wave device 1 comprises: a substrate 2; a first transmission filter 3 provided on a first principal surface of the substrate 2, using a transmission band for a first band of the frequency division duplex system as a passband; a first reception filter 5 provided on the first principal surface of the substrate 2, using a reception band for the first band of the frequency division duplex system as a passband; a second transmission filter 7 provided on the first principal surface of the substrate 2, using a transmission band for a second band of the frequency division duplex system as a passband; a second reception filter 9 provided on the first principal surface of the substrate 2, using a reception band for the second band of the frequency division duplex system as a passband; and an antenna terminal 11 provided on the second principal surface of the substrate 2. The first transmission filter is arranged at a position closer to the antenna terminal rather than the second transmission filter, and the first reception filter is arranged at a position closer to the antenna terminal rather than the second reception filter.SELECTED DRAWING: Figure 1

Description

The present invention relates to an elastic wave device, for example, a dual duplexer composed of a plurality of elastic wave filters.

Smartphones and the like represented by mobile communication terminals are required to support communication in a plurality of frequency bands. Therefore, a plurality of elastic wave devices such as a duplexer and a quattroplexer using a plurality of elastic wave filters are used.

Further, in elastic wave devices, low loss may be required in consideration of interference between the transmission filter and the reception filter. As described in Patent Document 1, it has been devised to appropriately arrange four filters in consideration of interference of a plurality of filters and the like.

JP-A-2019-54354

The main problem to be solved by the present invention will be described.

When four elastic wave filters are mounted on a substrate to form an elastic wave device having a dual duplexer function, a loss occurs due to interference between the transmission filter and the reception filter. In addition, loss occurs due to insufficient isolation between bands.

The present invention has been made in view of the above problems, and an object of the present invention is to provide an elastic wave device with low loss by ensuring isolation between bands while suppressing interference between a transmission filter and a reception filter. do.

In order to achieve the above problems, in the present invention,
With the board
A first transmission filter provided on the first main surface of the substrate and having the transmission band of the first band of the frequency division duplex system as a pass band,
A first reception filter provided on the first main surface of the substrate and having a reception band of the first band of the frequency division duplex system as a pass band,
A second transmission filter provided on the first main surface of the substrate and having the transmission band of the second band of the frequency division duplex system as a pass band,
A second reception filter provided on the first main surface of the substrate and having the reception band of the second band of the frequency division duplex system as a pass band,
An antenna terminal provided on the second main surface of the substrate and
It is an elastic wave device equipped with
The first transmission filter is arranged at a position closer to the antenna terminal than the second transmission filter, and the first reception filter is arranged at a position closer to the antenna terminal than the second reception filter. It is an elastic wave device characterized by being.

It is one embodiment of the present invention to provide a second antenna terminal on the second main surface of the substrate.

A first wiring that electrically connects the antenna terminal, the first transmission filter, and the first reception filter, and a second wiring that electrically connects the second antenna terminal, the second transmission filter, and the second reception filter. It is one aspect of the present invention that the first wiring and the second wiring do not intersect three-dimensionally with two wirings.

An input terminal of the first transmission filter, an output terminal of the first reception filter, an input terminal of the second transmission filter, an output terminal of the second reception filter, and a ground terminal are provided on the second main surface of the substrate. That is one form of the present invention.

It is one embodiment of the present invention that a metal pattern is provided between the antenna terminal and the second antenna terminal on the second main surface of the substrate.

One aspect of the present invention is that the first transmission filter is arranged adjacent to the second transmission filter, and the first reception filter is arranged adjacent to the second reception filter. Will be done.

It is one embodiment of the present invention that at least one of the first transmission filter, the second transmission filter, the first reception filter, or the second reception filter is a surface acoustic wave filter.

One embodiment of the present invention is that the elastic surface filter has a piezoelectric substrate, and the piezoelectric substrate is bonded to a support substrate made of high-resistance silicon, gallium arsenic, sapphire, spinel, polycrystalline alumina, or glass. It is said that.

It is one embodiment of the present invention that at least one of the first transmission filter, the second transmission filter, the first reception filter, or the second reception filter is a filter using an elastic thin film resonator.

According to the present invention, it is possible to provide an elastic wave device with low loss by ensuring isolation between bands while suppressing interference between a transmission filter and a reception filter.

FIG. 1 is a plan view of the elastic wave device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the elastic wave device 1 according to the present embodiment. FIG. 3 is a diagram showing a first main surface of the substrate 2 and a diagram showing a first metal layer 51. FIG. 4 is a diagram showing the second metal layer 52 through the second metal layer 52 from the first main surface side of the substrate 2. FIG. 5 is a diagram showing the third metal layer 53 through the third metal layer 53 from the first main surface side of the substrate 2. FIG. 6 is a diagram showing the fourth metal layer 54 by seeing through the fourth metal layer 54 from the first main surface side of the substrate 2. FIG. 7 is a diagram showing the fifth metal layer 55 through the fifth metal layer 55 from the first main surface side of the substrate 2. FIG. 8 is a diagram showing the sixth metal layer 56 by seeing through the sixth metal layer 56 from the first main surface side of the substrate 2. FIG. 9 is a diagram showing a configuration example of a SAW filter that can be used for a part or all of each of the filters 3 to 9. FIG. 10 is a plan view showing an example in which the surface acoustic wave element 72 is an elastic surface wave resonator. FIG. 11 is a cross-sectional view showing an example of a piezoelectric thin film resonator in which the elastic wave element 72 is used. FIG. 12 is a diagram for explaining the effect of the embodiment of the present invention.

Hereinafter, the present invention will be clarified by explaining specific embodiments of the present invention with reference to the drawings.

(Example)
FIG. 1 is a plan view of the elastic wave device 1 according to the present embodiment.

As shown in FIG. 1, the elastic wave device 1 according to the present embodiment has a substrate 2 and a first transmission filter 3, a first reception filter 5, a second transmission filter 7, and a second transmission filter mounted on the substrate 2. It includes a reception filter 9, an antenna terminal 11 and a second antenna terminal 13.

The substrate 2 has a first main surface and a second main surface facing each other. As the substrate 2, for example, a multilayer substrate made of a resin, a low temperature co-fired ceramics (LTCC) multilayer substrate made of a plurality of dielectric layers, or the like is used.

A first transmission filter 3, a first reception filter 5, a second transmission filter 7, and a second reception filter 9 are mounted on the first main surface of the substrate 2.

The first transmission filter 3, the first reception filter 5, the second transmission filter 7, and the second reception filter 9 have different pass bands and do not overlap each other. The first transmission filter 3 and the first reception filter 5 are filters that pass signals in the transmission band and the reception band of the first band, respectively.

The first band is, for example, a band of LTE (Long Term Evolution) band (E-UTRA (Evolved Universal Radio Access) Operating Band). The first band is, for example, LTE band 3.

The second transmission filter 7 and the second reception filter 9 are filters that pass signals in the transmission band and the reception band of the second band, respectively.

The second band is, for example, LTE band 1.

The first transmission filter 3 outputs the signal of the transmission band of the first band among the high frequency signals input to the input terminal 19 of the first transmission filter to the antenna terminal 11 and suppresses other signals.

The second transmission filter 7 outputs a signal in the transmission band of the second band among the high frequency signals input to the input terminal 23 of the second transmission filter to the second antenna terminal 13, and suppresses other signals.

The antenna terminal 11 and the second antenna terminal 13 are formed on the second main surface of the substrate 2.

The first reception filter 5 outputs the signal of the reception band of the first band among the high frequency signals input to the antenna terminal 11 to the output terminal 21 of the first reception filter, and suppresses other signals.

The second reception filter 9 outputs a signal in the reception band of the second band among the high frequency signals input to the second antenna terminal 13 to the output terminal 25 of the second reception filter, and suppresses other signals.

As shown in FIG. 1, the first transmission filter 3 is arranged at a position closer to the antenna terminal 11 than the second transmission filter 7. Further, the first reception filter is arranged at a position closer to the antenna terminal 11 than the second reception filter 9.

The antenna terminals of the first band and the second band may be shared antennas, but in this embodiment, the antenna terminal 11 is used as the antenna terminal for the first band, and the antenna terminal for the second band is the second. 2 The antenna terminal 13 is used.

FIG. 2 is a cross-sectional view of the elastic wave device 1 according to the present embodiment.

As shown in FIG. 2, a second transmission filter 7 and a second reception filter 9 are flip-chip mounted on the substrate 2 via bumps 31.

The substrate 2 is a multilayer wiring board, and has a first metal layer 51, a second metal layer 52, a third metal layer 53, a fourth metal layer 54, a fifth metal layer 55, and a sixth metal layer 56.

The metal layers 51 to 56 are alternately laminated with the plurality of insulating layers 60. The metal layers 51 to 56 are partially electrically connected via vias 33 formed on the insulating layers 60a to 60e.

The filters 3 to 9 are mounted facing the substrate 2 so as to form a gap by flip-chip bonding via the bump 31.

The bump 31 is, for example, a gold bump. The height of the bump 31 is, for example, 20 μm to 50 μm.

The sealing portion 35 is formed so as to cover the filters 3 to 9. The sealing portion 35 may be formed of, for example, an insulator such as a synthetic resin, or a metal may be used. As the synthetic resin, for example, epoxy resin, polyimide and the like can be used, but the synthetic resin is not limited thereto. Preferably, an epoxy resin is used and a low temperature curing process is used to form the sealing portion 35.

FIG. 3 is a diagram showing a first main surface of the substrate 2 and a diagram showing a first metal layer 51. The first metal layer 51 is a layer on which filters 3 to 9 are mounted.

As shown in FIG. 3, the first metal layer 51 is formed on the insulating layer 60a. A plurality of vias 33 are formed on the insulating layer 60a and are electrically connected to the first metal layer 51.

As shown in FIG. 3, the first metal layer 51 has a metal pattern 1151 electrically connected to the antenna terminal 11, a metal pattern 1351 electrically connected to the second antenna terminal 13, and a first transmission filter. A metal pattern 1951 electrically connected to the input terminal 19 of the third, a metal pattern 2151 electrically connected to the output terminal 21 of the first reception filter 5, and a metal pattern 2151 electrically connected to the input terminal 23 of the second transmission filter 7. It has a metal pattern 2351 connected to the output terminal 25 of the second reception filter 9, and a metal pattern GND51 to which the ground potentials of the filters 3 to 9 are electrically connected.

As shown in FIG. 3, the metal pattern 1151 electrically connected to the antenna terminal 11 includes the metal pattern 1151Out to which the output portion of the first transmission filter 3 is electrically connected and the input portion of the first reception filter 5. Is formed by a metal pattern 1151In that is electrically connected.

By separating the metal pattern 1151 of the first metal layer 51 by transmission and reception as in this embodiment, interference between transmission and reception can be suppressed.

As shown in FIG. 3, the metal pattern 1351 electrically connected to the second antenna terminal 13 includes the metal pattern 1351Out to which the output portion of the second transmission filter 7 is electrically connected, and the second receive filter 9. The input portion is formed by a metal pattern 1351In which is electrically connected.

By separating the metal pattern 1351 of the first metal layer 51 by transmission and reception as in this embodiment, interference between transmission and reception can be suppressed.

FIG. 4 is a diagram showing the second metal layer 52 through the second metal layer 52 from the first main surface side of the substrate 2. The second metal layer 52 is partially electrically connected to the first metal layer 51 via a plurality of vias 33 formed on the insulating layer 60a.

As shown in FIG. 4, the second metal layer 52 is formed on the insulating layer 60b.

As shown in FIG. 4, the second metal layer 52 has a metal pattern 1152 electrically connected to the antenna terminal 11, a metal pattern 1352 electrically connected to the second antenna terminal 13, and a first transmission filter. A metal pattern 1952 electrically connected to the input terminal 19 of the third, a metal pattern 2152 electrically connected to the output terminal 21 of the first reception filter 5, and a metal pattern 2152 electrically connected to the input terminal 23 of the second transmission filter 7. It has a metal pattern 2352, a metal pattern 2552 connected to the output terminal 25 of the second reception filter 9, and a metal pattern GND 52 to which the ground potentials of the filters 3 to 9 are electrically connected.

FIG. 5 is a diagram showing the third metal layer 53 through the third metal layer 53 from the first main surface side of the substrate 2. The third metal layer 53 is partially electrically connected to the second metal layer 52 via a plurality of vias 33 formed on the insulating layer 60b.

As shown in FIG. 5, the third metal layer 53 is formed on the insulating layer 60c.

As shown in FIG. 5, the third metal layer 53 includes a metal pattern 1153 electrically connected to the antenna terminal 11, a metal pattern 1353 electrically connected to the second antenna terminal 13, and a first transmission filter. A metal pattern 1953 electrically connected to the input terminal 19 of the third, a metal pattern 2153 electrically connected to the output terminal 21 of the first reception filter 5, and a metal pattern 2153 connected to the input terminal 23 of the second transmission filter 7. It has a metal pattern 2353 connected to the output terminal 25 of the second reception filter 9, and a metal pattern GND53 to which the ground potentials of the filters 3 to 9 are electrically connected.

FIG. 6 is a diagram showing the fourth metal layer 54 by seeing through the fourth metal layer 54 from the first main surface side of the substrate 2. The fourth metal layer 54 is partially electrically connected to the third metal layer 53 via a plurality of vias 33 formed in the insulating layer 60c.

As shown in FIG. 6, the fourth metal layer 54 is formed on the insulating layer 60d.

As shown in FIG. 6, the fourth metal layer 54 has a metal pattern 1154 electrically connected to the antenna terminal 11, a metal pattern 1354 electrically connected to the second antenna terminal 13, and a first transmission filter. A metal pattern 1954 electrically connected to the input terminal 19 of the third, a metal pattern 2154 electrically connected to the output terminal 21 of the first reception filter 5, and a metal pattern 2154 electrically connected to the input terminal 23 of the second transmission filter 7. It has a metal pattern 2354, a metal pattern 2554 connected to the output terminal 25 of the second reception filter 9, and a metal pattern GND54 to which the ground potentials of the filters 3 to 9 are electrically connected.

FIG. 7 is a diagram showing the fifth metal layer 55 through the fifth metal layer 55 from the first main surface side of the substrate 2. The fifth metal layer 55 is partially electrically connected to the fourth metal layer 54 via a plurality of vias 33 formed on the insulating layer 60d.

As shown in FIG. 7, the fifth metal layer 55 is formed on the insulating layer 60e.

As shown in FIG. 7, the fifth metal layer 55 has a metal pattern 1155 electrically connected to the antenna terminal 11, a metal pattern 1355 electrically connected to the second antenna terminal 13, and a first transmission filter. The metal pattern 1955 electrically connected to the input terminal 19 of 3, the metal pattern 2155 electrically connected to the output terminal 21 of the first reception filter 5, and the input terminal 23 of the second transmission filter 7 are connected. It has a metal pattern 2355, a metal pattern 2555 connected to the output terminal 25 of the second reception filter 9, and a metal pattern GND55 to which the ground potentials of the filters 3 to 9 are electrically connected.

FIG. 8 is a diagram showing the sixth metal layer 56 by seeing through the sixth metal layer 56 from the first main surface side of the substrate 2. The sixth metal layer 56 is partially electrically connected to the fifth metal layer 55 via a plurality of vias 33 formed on the insulating layer 60e.

As shown in FIG. 8, the sixth metal layer 56 includes an antenna terminal 11, a second antenna terminal 13, an input terminal 19 of the first transmission filter 3, an output terminal 21 of the first reception filter 5, and a second. It has an input terminal 23 of the transmission filter 7, an output terminal 25 of the second reception filter 9, and a ground terminal 27.

Further, as shown in FIG. 8, the sixth metal layer 56 may have a metal pattern 29. Thereby, the isolation between the antenna terminal 11 and the second antenna terminal 13 can be further improved.

Here, the metal pattern 1151Out in which the output portion of the first transmission filter 3 of the first metal layer 51 shown in FIG. 3 is electrically connected and the metal pattern 1151In in which the input portion of the first reception filter 5 is electrically connected. The metal pattern 1151 composed of the metal pattern 1151, the metal pattern 1152 of the second metal layer 52 shown in FIG. 4, the metal pattern 1153 of the third metal layer 53 shown in FIG. 5, and the metal pattern 1153 of the third metal layer 53 shown in FIG. The wiring including the metal pattern 1154 of the fourth metal layer 54 shown in FIG. 7 and the antenna terminal 11 of the fifth metal layer 55 shown in FIG. 8 is defined as the first wiring.

Further, from the metal pattern 1351Out to which the output portion of the second transmission filter 7 of the first metal layer 51 shown in FIG. 3 is electrically connected and the metal pattern 1351In to which the input portion of the second reception filter 9 is electrically connected. 1351, the metal pattern 1352 of the second metal layer 52 shown in FIG. 4, the metal pattern 1353 of the third metal layer 53 shown in FIG. 5, and the metal pattern 1353 of the third metal layer 53 shown in FIG. The wiring composed of the metal pattern 1354 of the fourth metal layer 54 shown in FIG. 7 and the second antenna terminal 13 of the fifth metal layer 55 shown in FIG. 8 is defined as the second wiring.

From the above description of FIGS. 3 to 8, the first wiring and the second wiring do not intersect three-dimensionally. Since the first wiring and the second wiring do not intersect three-dimensionally, it is possible to avoid the generation of parasitic capacitance via the insulating layer between the wirings, so that the isolation between the first band and the second band can be avoided. The ration is improved.

Next, a configuration example of each of the filters 3 to 9 will be described.

FIG. 9 is a diagram showing a configuration example of a SAW filter that can be used for a part or all of each of the filters 3 to 9.

As shown in FIG. 9, the elastic wave element 72 and the wiring pattern 74 are formed on the piezoelectric substrate 70.

As the piezoelectric substrate 70, for example, a piezoelectric single crystal such as lithium tantalate, lithium niobate, or quartz, or piezoelectric ceramics can be used. Further, the piezoelectric substrate 70 may be joined to the support substrate. The support substrate can be, for example, a substrate made of high resistance silicon, gallium arsenide, sapphire, spinel, polycrystalline alumina or glass.

FIG. 10 is a plan view showing an example in which the surface acoustic wave element 72 is an elastic surface wave resonator.

As shown in FIG. 10, an IDT (Interdigital Transducer) 72a and a reflector 72b that excite surface acoustic waves are formed on the piezoelectric substrate 70. The IDT72a has a pair of comb-shaped electrodes 72c facing each other. The comb-shaped electrode 72c has a bus bar 72e that connects a plurality of electrode fingers 72d and a plurality of electrode fingers 72d. Reflectors 72b are provided on both sides of the IDT72a.

The IDT72a and the reflector 72b are made of, for example, an alloy of aluminum and copper. The IDT72a and the reflector 72b are thin films having a thickness of, for example, 150 nm to 400 nm. The IDT72a and the reflector 72b may contain other metals, such as any suitable metal such as titanium, palladium, silver or alloys thereof, or may be formed of these alloys. Further, the IDT72a and the reflector 72b may be formed of a laminated metal film formed by laminating a plurality of metal layers.

The elastic wave element 72 can appropriately adopt a DMS design or a ladder design so as to obtain the desired characteristics as a bandpass filter.

The wiring pattern 74 includes wiring constituting the input pad In, the output pad Out, and the ground pad GND. Further, the wiring pattern 74 is electrically connected to the elastic wave element 72.

An insulator 76 is formed on the wiring pattern 74. As the insulator 76, for example, polyimide can be used. The insulator 76 is formed, for example, with a film thickness of 1000 nm.

A second wiring pattern 78 is formed on the insulator 76. The second wiring pattern 78 is formed so as to three-dimensionally intersect the wiring pattern 74 via the insulator 76.

The elastic wave element 72, the wiring pattern 74, and the second wiring pattern 78 are made of an appropriate metal or alloy such as silver, aluminum, copper, titanium, and palladium. Further, these metal patterns may be formed by a laminated metal film formed by laminating a plurality of metal layers. The thickness of the elastic wave element 72, the wiring pattern 74, and the second wiring pattern 78 can be, for example, 150 nm to 400 nm.

FIG. 11 is a cross-sectional view showing an example of a piezoelectric thin film resonator in which the elastic wave element 72 is used.

As shown in FIG. 11, the piezoelectric film 82 is provided on the chip substrate 80. The lower electrode 84 and the upper electrode 86 are provided so as to sandwich the piezoelectric film 82. A gap 88 is formed between the lower electrode 84 and the chip substrate 80. The lower electrode 84 and the upper electrode 86 excite elastic waves in the thickness longitudinal vibration mode in the piezoelectric film 82.

As the chip substrate 80, for example, a semiconductor substrate such as silicon or an insulating substrate such as sapphire, alumina, spinel or glass can be used. For the piezoelectric film 82, for example, aluminum nitride can be used. For the lower electrode 84 and the upper electrode 86, for example, a metal such as ruthenium can be used.

FIG. 12 is a diagram for explaining the effect of the embodiment of the present invention.

As shown in FIG. 12, the waveform shown by the solid line is the damping characteristic according to the embodiment of the present invention. The waveform shown by the broken line is the damping characteristic of the comparative example.

Here, as a comparative example, the first transmission filter is arranged at a position closer to the antenna terminal than the second transmission filter, but the first reception filter is arranged at a position farther from the antenna terminal than the second reception filter. A first wiring that electrically connects an antenna terminal, a first transmission filter, and a first reception filter, and a second wiring device that electrically connects a second antenna terminal, a second transmission filter, and a second reception filter. An elastic wave device in which two wirings intersect in three dimensions was used.

As shown in FIG. 12, it is clear that the damping characteristics according to the embodiment of the present invention are significantly improved as compared with the comparative example.

According to the configuration of the present invention described above, it is possible to provide an elastic wave device with low loss by ensuring isolation between bands while suppressing interference between a transmission filter and a reception filter.

As a matter of course, the present invention is not limited to the embodiments described above, but includes all embodiments that can achieve the object of the present invention.

Also, although some aspects of at least one embodiment have been described above, it should be appreciated that various modifications, modifications and improvements are readily recalled to those of skill in the art. Such modifications, modifications and improvements are intended to be part of this disclosure and are intended to be within the scope of the present invention. It should be understood that the methods and embodiments of the apparatus described herein are not limited to application to the details of the structure and arrangement of the components described above or exemplified in the accompanying drawings. Methods and devices can be implemented in other embodiments and implemented or implemented in various embodiments. Specific implementation examples are given herein for illustrative purposes only and are not intended to be limited. Also, the expressions and terms used herein are for explanatory purposes only and should not be considered limiting. The use of "include", "provide", "have", "include" and variations thereof herein means inclusion of the items listed below and their equivalents and additional items. References to "or (or)" shall be construed so that any term described using "or (or)" refers to one, more than, and all of the terms in the description. Can be done. References to front-back, left-right, top-bottom top-bottom, and horizontal-vertical are intended for convenience of description, and the components of the present invention are not limited to any one of the positional or spatial orientations. Therefore, the above description and drawings are merely examples.

1 Elastic wave device 2 Board 3 1st transmission filter 5 1st reception filter 7 2nd transmission filter 9 2nd reception filter 11 Antenna terminal 11
13 2nd antenna terminal 19 1st transmission filter input terminal 21 1st reception filter output terminal 23 2nd transmission filter input terminal 25 2nd reception filter output terminal 27 Ground terminal 29 Metal pattern 31 Bump 33 Via 51 to 56 1st metal layer to 6th metal layer

Japanese Unexamined Patent Publication No. 2019-54354

In order to achieve the above problems, in the present invention,
With the board
A first transmission filter provided on the first main surface of the substrate by flip-chip bonding and having the transmission band of the first band of the frequency division duplex system as a pass band,
A first reception filter provided on the first main surface of the substrate by flip-chip bonding and having the reception band of the first band of the frequency division duplex system as a pass band,
A second transmission filter provided on the first main surface of the substrate by flip-chip bonding and having the transmission band of the second band of the frequency division duplex system as a pass band,
A second reception filter provided on the first main surface of the substrate by flip-chip bonding and having the reception band of the second band of the frequency division duplex system as a pass band,
An antenna terminal provided on the second main surface of the substrate and corresponding to the first transmission filter and the first reception filter ,
A second antenna terminal provided on the second main surface of the substrate and corresponding to the second transmission filter and the second reception filter,
A first wiring formed from the first main surface to the second main surface of the substrate and electrically connecting the antenna terminal, the first transmission filter, and the first reception filter.
A second wiring formed from the first main surface to the second main surface of the substrate and electrically connecting the second antenna terminal, the second transmission filter, and the second reception filter.
It is an elastic wave device equipped with
The first transmission filter is arranged at a position closer to the antenna terminal than the second transmission filter, and the first reception filter is arranged at a position closer to the second antenna terminal than the second reception filter. Be done ,
The first wiring and the second wiring are elastic wave devices characterized in that they do not intersect three-dimensionally .

One of the present invention is that the elastic surface wave filter has a piezoelectric substrate, and the piezoelectric substrate is bonded to a support substrate made of high-resistance silicon, gallium arsenic, sapphire, spinel, polycrystalline alumina, or glass. It is considered to be a form.

In order to achieve the above problems, in the present invention,
A substantially rectangular parallelepiped substrate having a first main surface and a second main surface ,
A first transmission filter provided on the first main surface by flip-chip bonding and having the transmission band of the first band of the frequency division duplex system as a pass band,
A first reception filter provided on the first main surface by flip-chip bonding and having the reception band of the first band of the frequency division duplex system as a pass band,
A second transmission filter provided on the first main surface by flip-chip bonding and having the transmission band of the second band of the frequency division duplex system as a pass band,
A second reception filter provided on the first main surface by flip-chip bonding and having the reception band of the second band of the frequency division duplex system as a pass band,
An antenna terminal provided on the second main surface and corresponding to the first transmission filter and the first reception filter,
A second antenna terminal provided on the second main surface and corresponding to the second transmission filter and the second reception filter, and
A first wiring formed inside the substrate from the first main surface to the second main surface and electrically connecting the antenna terminal, the first transmission filter, and the first reception filter.
A second wiring formed inside the substrate from the first main surface to the second main surface and electrically connecting the second antenna terminal, the second transmission filter, and the second reception filter.
It is an elastic wave device equipped with
The second main surface is provided with an input terminal of the first transmission filter, an output terminal of the first reception filter, an input terminal of the second transmission filter, and an output terminal of the second reception filter.
In the layout on the first main surface, the arrangement direction of the first transmission filter and the first reception filter is the same as the arrangement direction of the second transmission filter and the second reception filter.
The first transmission filter is arranged adjacent to the second transmission filter, and the first reception filter is arranged adjacent to the second reception filter.
The first transmission filter is arranged at a position closer to the antenna terminal than the second transmission filter, and the first reception filter is arranged at a position closer to the second antenna terminal than the second reception filter. Be done,
The first wiring and the second wiring do not overlap when viewed from the main surface of the substrate and do not intersect three-dimensionally.
The antenna terminal and the second antenna terminal are arranged on the side opposite to the side of the second transmission filter and the second reception filter with respect to the first transmission filter and the first reception filter.
The antenna terminal is arranged on the side of the first reception filter with respect to the first transmission filter.
The second antenna terminal is arranged on the side opposite to the side of the first receiving filter with respect to the first transmitting filter.
The input terminal of the first transmission filter and the input terminal of the second transmission filter are opposite to the side of the first reception filter and the second reception filter with respect to the first transmission filter and the second transmission filter. Placed in
The input terminal of the first transmission filter is arranged at a position closer to the first transmission filter than the input terminal of the second transmission filter.
The output terminal of the first reception filter and the output terminal of the second reception filter are opposite to the side of the first transmission filter and the second transmission filter with respect to the first reception filter and the second reception filter. Placed in
The output terminal of the first reception filter is arranged at a position away from the first reception filter than the output terminal of the second reception filter.
The second wiring is electrically connected to a second reception wiring that electrically connects the second reception filter and the output terminal of the second reception filter via the second reception filter, and is of the substrate. A connection portion and the first unit that electrically connect the output portion of the second transmission filter and the input portion of the second reception filter in close proximity to the second transmission filter and the second reception filter when viewed from the main surface. It is formed linearly between the two antenna terminals, the transmission signal from the second transmission filter is passed through the second antenna terminal, and the reception signal from the second antenna terminal is passed through the second reception filter.
When the first wiring is seen through from the main surface of the substrate, the first wiring wraps around the second receiving wiring from toward the center of the substrate and does not sterically intersect with the second receiving wiring. 1 The first reception wiring that electrically connects the reception filter and the output terminal of the first reception filter and sends the reception signal from the first reception filter to the output terminal of the first reception filter, and the first reception. It was an elastic wave device electrically connected via a filter .

Claims (9)

With the board
A first transmission filter provided on the first main surface of the substrate and having the transmission band of the first band of the frequency division duplex system as a pass band,
A first reception filter provided on the first main surface of the substrate and having a reception band of the first band of the frequency division duplex system as a pass band,
A second transmission filter provided on the first main surface of the substrate and having the transmission band of the second band of the frequency division duplex system as a pass band,
A second reception filter provided on the first main surface of the substrate and having a reception band of the second band of the frequency division duplex system as a pass band,
An antenna terminal provided on the second main surface of the substrate and
It is an elastic wave device equipped with
The first transmission filter is arranged at a position closer to the antenna terminal than the second transmission filter, and the first reception filter is arranged at a position closer to the antenna terminal than the second reception filter. There is an elastic wave device. The elastic wave device according to claim 1, wherein the second antenna terminal is provided on the second main surface of the substrate. A first wiring that electrically connects the antenna terminal, the first transmission filter, and the first reception filter, and a second wiring that electrically connects the second antenna terminal, the second transmission filter, and the second reception filter. The elastic wave device according to claim 2, which has two wirings, and the first wiring and the second wiring do not intersect three-dimensionally. An input terminal of the first transmission filter, an output terminal of the first reception filter, an input terminal of the second transmission filter, an output terminal of the second reception filter, and a ground terminal are provided on the second main surface of the substrate. , The elastic wave device according to claim 1. The elastic wave device according to claim 2, wherein a metal pattern is provided between the antenna terminal and the second antenna terminal on the second main surface of the substrate. The elastic wave according to claim 1, wherein the first transmission filter is arranged adjacent to the second transmission filter, and the first reception filter is arranged adjacent to the second reception filter. device. The elastic wave device according to claim 1, wherein at least one of the first transmission filter, the second transmission filter, the first reception filter, or the second reception filter is a surface acoustic wave filter. The elastic wave according to claim 7, wherein the elastic surface filter has a piezoelectric substrate, and the piezoelectric substrate is bonded to a support substrate made of high-resistance silicon, gallium arsenic, sapphire, spinel, polycrystalline alumina, or glass. device. The elastic wave device according to claim 1, wherein at least one of the first transmission filter, the second transmission filter, the first reception filter, or the second reception filter is a filter using an elastic thin film resonator.

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